JPH09286483A - Carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape which holds electronic parts, such as semiconductor packages, in an appropriate attitude and can be manufactured at a low cost. SOLUTION: In a carrier tape 1 a multiplicity of cavities 10, each being a hollow with a rectangular opening, are formed at regular intervals longitudinally. Inside each of these cavities 10 a semiconductor package P comprising leads Pb and a molded part Pa is held. In this instance at the bottom of the cavity 10 a mount 11 with ribs 13 projecting upward from the periphery is formed in a manner of distention. The upper side of the mount 11 is an inclined surface 11a which slopes downward with approach to the peripheral ribs 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for supplying or transporting electronic parts to a mounting device, and more particularly,
QFP (Quad Flat Packag)
e) Carrier tape suitable for semiconductor devices such as

[0002]

2. Description of the Related Art As a conventional carrier tape, for example, Japanese Patent Publication No. 4-42260 or Japanese Patent Publication No. 7-2
The one described in Japanese Patent No. 3172 is known. In the former Japanese Patent Publication No. 4-42260, as shown in FIG. 6, a strip-shaped elongated body in which a plurality of concave engaging portions 2 are formed,
The engaging portion 2 is described as a carrier tape 1 formed so as to be based on a convex portion 4 having a plurality of protruding portions 3 formed on the upper peripheral edge thereof, and the mold portion Pa and the lead Pb are provided in the engaging portion 2. A semiconductor package (electronic component) P having

The latter Japanese Patent Publication No. 7-23172 discloses a carrier tape in which a large number of cavities are provided at regular intervals, and the cavities consist of a pedestal and a groove-shaped lead accommodating portion, and the upper side edge of the pedestal A carrier tape having a ridge and a groove formed between the ridge and the side edge of the base is described.

[0004]

However, in the carrier tape described in Japanese Patent Publication No. 4-42260, the former, the base end (the rising portion) of the protrusion 3 and the protrusion 4 are provided.
Of the upper surface of the semiconductor package P is continuous in an arc surface, that is, the protrusion 3 rises in a gentle arc surface, so that when the semiconductor package P is mounted on the convex portion 4, the edge of the bottom surface of the mold portion Pa of the semiconductor package P is There is a problem that the semiconductor package P rises up on the arc surface and is lifted up to be accommodated obliquely (see FIG. 6). That is, in general, the carrier tape 1 is formed by pressing, compressed air, or vacuum forming, but it is difficult to make the corner portion, which is the boundary portion between the upper surface of the convex portion 4 and the base end of the protruding portion 3, a complete edge, and it is an arc. Inevitably, the semiconductor package P becomes a surface, and there arises a problem that the edge of the mold portion Pa rides on the arc surface and is housed in an inclined state. In particular, the edge of the mold portion Pa of the semiconductor package P has various shapes depending on each manufacturing company, and the corner portions of the carrier tape 1 also have various shapes, so it is difficult to unify them, and the above-mentioned problems are also remarkable. .

Further, in the latter carrier tape disclosed in Japanese Patent Laid-Open No. 7-23172, a groove portion is formed on the inner side of the carrier tape so as to be adjacent to the protruding portion.
Although it is possible to solve the problem of Japanese Patent Laid-Open No. 60, the microfabrication of protrusions for groove formation is indispensable in the mold for molding the carrier tape, which increases the manufacturing cost of the mold, and in molding the carrier tape. There was a problem that the durability of the mold was also reduced. The present invention has been made in view of the above problems, and an object of the present invention is to provide a carrier tape that can store and hold electronic components such as a semiconductor package in an appropriate posture and can be manufactured at low cost.

[0006]

To achieve the above object, the present invention provides a carrier tape in which a plurality of concave cavities capable of accommodating leaded electronic components are formed at predetermined intervals. The pedestal was bulged to form a rib on the peripheral edge of the pedestal, and at least the peripheral portion of the upper surface of the pedestal was an inclined surface that inclines downward toward the peripheral edge.

In the carrier tape according to the present invention, the pedestal has a flat surface in the central portion of the upper surface (Claim 2), and the rib is continuous with the peripheral edge of the pedestal over the entire range (Claim 2). Item 3) can be configured.

The electronic component has leads extending from the mold portion, and is represented by the semiconductor device such as QFP described above. In the carrier tape, a large number of cavities are formed at regular intervals and, if necessary, a large number of feed holes are formed at one side or both sides at regular intervals. This carrier tape is made of polystyrene, polyvinyl chloride resin,
It is manufactured by molding a thermoplastic resin sheet such as polyethylene terephthalate or polypropylene by the above-mentioned vacuum forming or the like. The cavity is composed of a recessed part corresponding to an electronic component, such as a rectangular parallelepiped or a cube-shaped recessed opening on one surface (front surface). The mold part is placed on the pedestal and the leads are housed in the space around the pedestal. To do.

The pedestal has a planar shape corresponding to the molded portion of the electronic component, and ribs are integrally formed on the upper peripheral edge so as to project. The ribs are continuous (Claim 3) or intermittently intermittently or dotted around the upper periphery of the pedestal,
The distance between the facing ribs corresponds to the size of the mold part. The upper surface of this pedestal has an inclined surface that inclines downward (toward the rear surface side) from the central portion toward the peripheral edge, and preferably, a flat surface is formed in the central portion.

[0010]

The carrier tape according to the present invention accommodates electronic components in each cavity. The electronic part in the cavity has the mold part placed on the pedestal with lateral movement restricted by the ribs, and the leads are located in the space around the pedestal. Here, at least a peripheral portion of the upper surface of the pedestal is formed as an inclined surface that is inclined downward toward the peripheral edge, and a gap is formed between the upper surface of the pedestal and the peripheral edge portion of the bottom surface of the mold portion. For this reason, even if the base end portion of the rib, that is, the rising portion of the rib from the upper surface of the pedestal is arcuate, it is possible to prevent inconvenience such as the electronic components being obliquely accommodated. In particular, the carrier tape of the present invention can store electronic components more stably by forming a flat surface in the central portion of the upper surface of the pedestal (claim 2).

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a carrier tape according to an embodiment of the present invention, FIG. 1 is a plan view, and FIG. 2 is a sectional view taken along the line AA of FIG. The same parts as those in FIG. 5 described above are designated by the same reference numerals, and a part of the description will be omitted.

In the figure, reference numeral 1 denotes a carrier tape, in which a plurality of cavities 10 are formed in the carrier tape 1 at regular intervals in the longitudinal direction, and a plurality of feed holes 20 are provided on one side in the width direction.
Are formed at regular intervals in the longitudinal direction. Although illustration and detailed description are omitted, the carrier tape 1 has a well-known cover tape attached to one surface (front surface) thereof, and
Is closed.

The cavity 10 is formed by a concave portion opening in a square shape on the surface, and a pedestal 11 having a square shape in a plan view, which protrudes from a peripheral side surface at a predetermined interval, is swell-molded at the bottom portion.
A lead accommodating groove 12 is formed around the pedestal 11. The lead accommodating groove 12 has a substantially square frame shape in plan view, and accommodates the lead Pb of the semiconductor package P whose mold part is placed on the pedestal 11.

The pedestal 11 has a trapezoidal cross section in which the side walls are inclined in a direction in which the side walls approach each other, and the upper surface has a plan view shape which is substantially the same as the mold portion Pa. The pedestal 11 is integrally provided with a rib 13 continuous around the entire periphery of the upper surface, and a detection hole 19 for detecting an electronic component is formed in the center of the upper surface so that the upper surface extends from the opening edge of the detection hole 19. Rib 13
The taper inclined surface 11a is formed so as to gently incline downward toward the base end. The rib 13 has a predetermined height,
The interval between the facing portions has a value substantially equal to the dimension of the mold portion Pa. The rib 13 is formed so as to restrict the lateral movement of the mold portion Pa on the pedestal 11.

Carrier tape 1 according to this embodiment
In this case, the semiconductor package P is housed in each cavity 10 and a cover tape for closing the opening of each cavity 10 is attached to the surface. Then, in the semiconductor package P housed in the cavity 10, the mold portion Pa is placed on the pedestal 11, and the lead Pb is located in the lead housing groove 12. Here, in the semiconductor package P, no matter what shape the mold portion Pa has, the upper surface of the pedestal 11 is an inclined surface that inclines downward toward the peripheral side, and the inner surface of the rib 13 is Since the side surface of the mold portion Pa is supported by the line contact and the mold portion Pa is supported by the upper surface of the pedestal 11, even if the rib 13 and the upper surface of the pedestal 11 are continuous in any shape, they interfere with the corners of the mold portion Pa. Therefore, there is no inconvenience such as inclination due to the lifting of the semiconductor package P.

Further, the carrier tape 1 according to this embodiment is formed by press forming as described above, but it is not necessary to form fine grooves or the like on the pedestal 11. Therefore, the mold for molding the carrier tape 1 does not require ultrafine processing, and the manufacturing cost of the mold can be reduced.
When molding the carrier tape 1, the durability of the mold is also improved.

3 and 4 show a carrier tape according to another embodiment of the present invention, FIG. 3 is a partially enlarged plan view, and FIG. 4 is a sectional view taken along the line BB. In this embodiment, the same parts as those in the above-mentioned embodiment are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, a flat surface 11b having a rectangular shape in plan view is formed in the center of the upper surface of the pedestal 11, and the inclined surface 11a is continuous from the entire circumference of the edge of the flat surface 11b toward the rib 13. To do. The flat surface 11b has a shape similar to the shape of the mold portion Pa in plan view and having a small size. Although the flat surface 11b can be formed in a plan view shape such as a circle as shown in FIG. 5 regardless of the plan view shape of the mold portion Pa, its dimension is the dimension of the plan view shape of the mold portion Pa. Smaller than.

Also in this embodiment, even if the base end portion of the rib 13 is an arcuate surface and is continuous with the upper surface of the pedestal 11, it does not interfere with the corner portion of the mold portion Pa, and the semiconductor package P
Can be prevented from being tilted, and since the pedestal 11 does not need to be finely molded, the manufacturing cost of the mold can be reduced and the durability of the mold can be improved. In particular, in this embodiment, since the flat surface 11b is provided at the center of the upper surface of the pedestal 11, the mold portion Pa of the semiconductor package P is mounted on the pedestal 1.
It can be stably placed on 1.

In the above-described embodiment, the flat surface 11b is formed at the center of the upper surface of the pedestal 11. However, the diameter of the detection hole 19 is increased so that the opening edge of the detection hole 19 is flat.
Instead of 1b, that is, the opening edge of the detection hole 19 can be used as the flat surface 11b.

[0021]

As described above, according to the carrier tape of the present invention, the pedestal is bulged on the bottom surface of the cavity for accommodating the electronic component, and the rib is provided on the peripheral edge of the pedestal. Since the upper surface of the pedestal is an inclined surface that inclines downward from the center toward the periphery, it is possible to prevent the electronic parts from being housed at an angle due to lifting of the electronic parts, etc. Cheap to manufacture,
Further, there is an effect that the durability of the mold can be improved.

In particular, since the carrier tape according to the second aspect of the present invention forms the flat surface in the center of the upper surface of the pedestal, the electronic parts can be more stably accommodated, and the carrier tape according to the third aspect of the invention is Since the ribs are continuously formed over the entire circumference of the upper surface of the pedestal, lateral movement of the electronic component can be prevented more effectively.

[Brief description of drawings]

FIG. 1 is a partially enlarged plan view of a carrier tape according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA of FIG.

FIG. 3 is a partially enlarged plan view of a carrier tape according to another embodiment of the present invention.

FIG. 4 is a sectional view taken along the line BB of FIG. 3;

FIG. 5 is a partially enlarged plan view showing another aspect of the carrier tape.

FIG. 6 is a cross-sectional view of a conventional carrier tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 carrier tape 10 cavity 11 pedestal 11a inclined surface 11b flat surface 12 lead accommodating groove 13 rib P semiconductor package (electronic component) Pa mold part Pb lead

Claims (3)

[Claims] 1. A carrier tape in which a plurality of concave cavities capable of accommodating leaded electronic components are formed at predetermined intervals, and a pedestal is bulged on the bottom surface of the cavities and ribs are formed on the periphery of the pedestal. A carrier tape which is projectingly provided and at least a peripheral portion of an upper surface of the pedestal is an inclined surface which is inclined downward toward the periphery. 2. The carrier tape according to claim 1, wherein the pedestal has a flat surface in a central portion of an upper surface. 3. The carrier tape according to claim 1, wherein the rib is continuous with the peripheral edge of the pedestal over the entire range.