JP2013039946A - Carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape which can avoid collision between a wall of a recess and a lead of an electronic component to control damage of the lead by positioning and storing the electronic component with high precision in the recess.SOLUTION: In the carrier tape, two or more of pocket holes 20, in which a semiconductor package 10 of surface mount type with lead groups 12 projected each from the perimeter of the package body 11 is stored, are arranged and formed on a tape material 2, wherein each of the pocket holes 20 includes an encirclement wall 21 encircling the semiconductor package 10 and a bottom plate 25 covering the opened bottom of the encirclement wall 21 and a position control part 30, which is inserted in a space 16 formed with predetermined ones of the lead groups 12 of the semiconductor package 10, is provided projectingly on the encirclement wall 21 and also the position control part 30 can be in contact with the package body 11 of the semiconductor package 10 and a pedestal 26, on which the package body 11 is placed, is provided on the bottom plate 25 and the lead groups 12 and the bottom plate 25 are separated with the pedestal 26.

Description

  The present invention relates to a carrier tape used for storing and transporting an electronic component made of a surface mount type semiconductor package, in particular, a QFP (Quad Flat Package) type semiconductor package.

  Although not shown, a conventional carrier tape for housing a surface-mount type semiconductor package includes a long tape material made of synthetic resin and a plurality of pocket holes arrayed at predetermined intervals in the longitudinal direction of the tape material. Are embossed, and each pocket hole is formed in a substantially rectangular plane to accommodate a QFP type semiconductor package (see Patent Documents 1, 2, and 3).

  Each pocket hole is formed to have a substantially dish-shaped cross section, and at least the center portion of the bottom plate is formed on the raised bottom shelf, and a semiconductor package is mounted on or supported by the raised bottom shelf. In some cases, a positioning rib for a semiconductor package protrudes from the bottom plate or near the boundary between the bottom plate and the raised bottom shelf from the viewpoint of preventing rattling of the semiconductor package. In addition, in order to prevent rattling of the semiconductor package, a positioning fitting hole that fits into the semiconductor package may be formed through the raised bottom shelf.

  The semiconductor package includes a substantially rectangular package body that protects the LSI, and lead groups that are electrodes protrude from the front, rear, left, and right peripheral surfaces of the package body, and a plurality of leads forming each lead group are respectively provided. Bent and formed for surface mounting. The package body is, for example, transfer molded with an epoxy resin or the like, and a heat sink for heat dissipation is attached to the bottom surface, and an engagement piece is formed on the peripheral edge of the heat sink.

  Among the plurality of lead groups, a predetermined lead group has a gap formed by omitting the leads, and the engagement piece of the heat sink is fixed to the package body through the gap. Each lead group is formed by arranging a plurality of leads at a predetermined pitch. In response to the recent demand for high-density mounting, the number of leads is increased at a low pitch, and one lead per one. The width of the plate is narrowed, leading to a decrease in strength.

Each lead has been formed of a material such as aluminum, but has recently been formed of soft copper or copper alloy as the density of semiconductor packages increases. Due to such a material change, recent leads can be expected to have low resistance, but have characteristics that they lack strength and are brittle to impact.
In addition, in view of the limitation of the narrowing of the lead pitch during surface mounting, the semiconductor package may be stacked to increase the density of the package.

JP 10-17073 A Japanese Patent Laid-Open No. 2002-240851 Japanese Patent Laid-Open No. 2003-26281

  Since the conventional carrier tape is configured as described above, it is not easy to properly accommodate the semiconductor package in the pocket hole, and there is a problem that the semiconductor package is easily damaged. This problem will be described in detail. Since the conventional carrier tape is simply embossed, when the positioning rib or positioning fitting hole is formed in the pocket hole, the positioning rib or positioning fitting hole is formed with high accuracy. It is not easy. In addition, since semiconductor packages are generally transfer-molded with epoxy resin, dimensional variations often occur in the package body and leads, and tolerances are larger than pocket holes, so it is necessary to consider dimensional variations. .

  For the above reasons, it is difficult to position and store the semiconductor package in the pocket hole with high accuracy, and the collision between the wall of the pocket hole and the lead of the semiconductor package cannot be avoided. The posture of the lead may be inclined and lead deformation or the like may occur.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above, and a carrier capable of avoiding a collision between the wall of the recess and the lead of the electronic component and suppressing damage of the lead by positioning and storing the electronic component in the recess with high accuracy. The purpose is to provide tape.

In the present invention, in order to solve the above-mentioned problem, the tape material is provided with a recess for storing the electronic components in which the lead groups protrude from the periphery of the component body,
The recess includes a surrounding wall that surrounds the electronic component and a bottom plate that covers an open bottom of the surrounding wall, and the position restricting portion that fits into the gap formed in the predetermined lead group of the electronic component on the surrounding wall. The position restricting portion can be brought into contact with the component body of the electronic component, and a base on which the component body of the electronic component is mounted is provided on the bottom plate, and the lead group of the electronic component and the bottom plate are separated by the base. It is characterized by doing so.

In addition, the concave portion is formed in a substantially rectangular plane, and the surrounding wall is inclined so as to gradually become narrower toward the bottom plate direction,
A heat sink is attached to the bottom of the component body as an electronic component as a surface-mount type semiconductor package, an engagement piece is formed on the peripheral edge of the heat sink, and the engagement piece is inserted into the component body via a gap of a predetermined lead group. Can be fixed to.

  Also, a position restricting portion is provided at the center of at least one of the pair of facing walls forming the surrounding wall of the recess, and the position restricting portion is gradually increased from the opening side of the recess toward the bottom plate. It can be formed from a first inclined surface that is inclined and a second inclined surface that is gradually inclined from the front end of the first inclined surface toward the bottom plate and is capable of contacting the component main body of the electronic component.

  Further, among the pair of opposing walls forming the surrounding wall of the recess, a position restricting portion is provided in a region extending from the vicinity of the central portion to the corner of at least one facing wall, and the position restricting portion is provided on the bottom plate from the opening side of the recess. A first inclined surface that gradually inclines as it goes in the direction, and a second inclined surface that inclines gradually as it goes from the tip of the first inclined surface toward the bottom plate and can contact the component body of the electronic component, It can also be formed from.

  Here, the tape material in the claims can be formed by laminating a single kind or plural kinds of material sheets in addition to the forming method. This tape material can be provided with a single recess or a plurality of recesses. The electronic component includes at least a surface-mount type semiconductor package (for example, QFP type, HQFP type, LQFP type, TQFP type, etc.).

  The predetermined lead group of the electronic component may be a group of leads, a plurality of leads, or an entire lead group. The gap formed in the predetermined lead group may be generated by partially reducing the number of leads. Furthermore, the pair of opposing walls forming the surrounding wall of the recess may be either the front or rear wall or both side walls.

  According to the present invention, when the electronic component is stored in the concave portion of the tape material, the gap of the electronic component is directed in the direction in which the position restricting portion protruding from the surrounding wall exists, and the electronic component is fitted in the concave portion to the pedestal. If the component body of the electronic component is supported, the electronic component can be stored in the recess. At this time, since the position restricting portion interferes with the gap of the electronic component to fill the clearance and contacts the periphery of the component main body, the electronic component is properly positioned and the lead of the lead group collides with the surrounding wall of the recess. There are few things.

  According to the present invention, by positioning and storing the electronic component in the recess with high accuracy, there is an effect that the collision between the wall of the recess and the lead of the electronic component can be avoided and damage to the lead can be suppressed.

  According to the second aspect of the present invention, if the surrounding wall of the concave portion is inclined so as to be gradually narrowed in the direction of the bottom plate, the electronic component can be molded without damaging the concave portion during molding or stored in the concave portion. Jumping out can be prevented. Further, if the electronic component is a semiconductor package, the semiconductor package is positioned in the recess with high accuracy, thereby preventing a collision between the surrounding wall of the recess and the lead of the semiconductor package and suppressing damage to the lead.

  According to the third aspect of the present invention, when the gap of the electronic component is formed at the center of the lead group, the collision between the surrounding wall of the recess and the electronic component can be avoided. In addition, since the first inclined surface of the position restricting portion is opposed to the electronic component by guiding the air gap, the position restricting portion and the electronic component can be easily aligned. In addition, since the second inclined surface is fitted into the opposing gap of the electronic component and contacts the periphery of the component main body, the stored electronic component can be appropriately positioned.

  According to the invention described in claim 4, when the gap of the electronic component is formed not in the center of the lead group but in the region extending from the center to the corner, the collision between the surrounding wall of the recess and the electronic component is prevented. It can be easily avoided. Further, simple alignment between the position restricting portion and the electronic component can be expected by the first inclined surface of the position restricting portion. Furthermore, proper positioning of the stored electronic component can be expected by the second inclined surface.

It is a whole perspective explanatory view showing typically an embodiment of a carrier tape concerning the present invention. It is a partial plane explanatory view showing typically an embodiment of a carrier tape concerning the present invention. It is back surface explanatory drawing which shows typically the semiconductor package in embodiment of the carrier tape which concerns on this invention. It is a section explanatory view showing typically the pocket hole in the embodiment of the carrier tape concerning the present invention. It is a section explanatory view showing typically the state where a semiconductor package was stored in a pocket hole in an embodiment of a carrier tape concerning the present invention. It is another cross-sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the pocket hole in embodiment of the carrier tape which concerns on this invention. It is a partial plane explanatory view showing typically a 2nd embodiment of a carrier tape concerning the present invention. It is sectional explanatory drawing which shows typically the pocket hole in 2nd Embodiment of the carrier tape which concerns on this invention. It is sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the pocket hole in 2nd Embodiment of the carrier tape which concerns on this invention. It is another cross-sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the pocket hole in 2nd Embodiment of the carrier tape which concerns on this invention. It is a partial plane explanatory view showing typically a 3rd embodiment of a carrier tape concerning the present invention. It is sectional explanatory drawing which shows typically the pocket hole in 3rd Embodiment of the carrier tape which concerns on this invention. It is sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the pocket hole in 3rd Embodiment of the carrier tape which concerns on this invention. It is a partial plane explanatory view showing a 4th embodiment of a carrier tape concerning the present invention typically. It is sectional explanatory drawing which shows typically the pocket hole in 4th Embodiment of the carrier tape which concerns on this invention. It is sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the pocket hole in 4th Embodiment of the carrier tape which concerns on this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. A carrier tape in the present embodiment is a flexible tape wound around a reel 1 as a core material as shown in FIGS. The material 2 is formed with a plurality of pocket holes 20 for housing a surface-mount type semiconductor package 10 called an HQFP type or the like, and each of the pair of lead groups 12 of the semiconductor package 10 is formed on the surrounding wall 21 of each pocket hole 20. A pair of position restricting portions 30 that are fitted into the formed gap 16 are projected.

  As shown in FIGS. 1 and 2, the tape material 2 is formed into a continuous strip-shaped sheet using, for example, a molding material containing a predetermined synthetic resin, and a planar rectangular hole 20 is formed in the longitudinal direction. The top tape 3 made of a thin sheet covering the plurality of pocket holes 20 is partially bonded or heat-sealed to the surface.

  Examples of the molding material for the tape material 2 include polyvinyl chloride, polystyrene, amorphous, polyethylene terephthalate, polycarbonate, polypropylene, polybutylene terephthalate, and ABS resin. These are used alone, or two or more kinds of blends or alloys are used, and conductive materials such as carbon, metal oxide, and conductive polymer are blended as necessary. Examples of the molding method for molding the tape material 2 include a press molding method, a vacuum molding method, a pressure air molding method, a vacuum pressure molding method, and the like. By these molding methods, the tape material 2 is 0.2. Molded to a thickness of ˜0.5 mm.

  In the longitudinal direction of at least one side portion of the left and right side portions of the tape material 2, a plurality of feed holes 4 are drilled in a line at a predetermined pitch, and each feed hole 4 is drilled in a flat circular shape. However, as shown in FIG. 2, when a plurality of feed holes 4 are drilled at a predetermined pitch in the longitudinal direction of the left and right side portions of the tape material 2, each feed hole 4 may be a flat circular shape. Are preferably perforated into a flat oval shape or an oval shape, and the long axis is preferably oriented in the left-right width direction of the tape material 2.

  As shown in FIGS. 2 and 3, the semiconductor package 10 includes, for example, a substantially rectangular package body 11 that protects an LSI, and lead groups 12 that are electrodes protrude from front, rear, left, and right peripheral surfaces of the package body 11. A plurality of leads 13 forming each lead group 12 are bent and provided for surface mounting of a printed circuit board.

  The package body 11 is, for example, transfer molded with an epoxy resin or the like, and a heat sink 14 that exhibits a heat dissipation function is attached to the bottom surface. The heat sink 14 is formed in a substantially rectangular flat plate that is smaller than the bottom surface of the package body 11 using, for example, a metal such as copper, aluminum, tungsten, or the like that exhibits a heat dissipation action, and an alloy thereof. The engagement pieces 15 are integrally formed with an interval of 180 °, and each engagement piece 15 is bent toward the package body 11.

  Among the plurality of lead groups 12, a pair of lead groups 12 facing each other in the front-rear direction or the left-right direction is formed with a space 16 by omitting the central lead 13, and the heat sink 14 is bent through each space 16. The joining piece 15 is engaged with and fixed to the peripheral surface of the package body 11. Each lead group 12 is formed by arranging a plurality of leads 13 in a line at a predetermined pitch, but the number of leads 13 is increased at a low pitch in response to the recent demand for high-density mounting. Each lead 13 is bent and formed in a substantially Z shape by, for example, copper or a copper alloy, and is bonded and fixed to the surface of a printed board (not shown) by solder reflow.

  As shown in FIGS. 2, 4 to 6, each pocket hole 20 protrudes downward from the back surface of the tape material 2 to surround the semiconductor package 10, and an opening of the surrounding wall 21. The bottom plate 25 that covers the bottom is integrally formed with a substantially dish-shaped cross section (also having a substantially cross-sectional tray shape), and has a size corresponding to the size of the semiconductor package 10.

  The surrounding wall 21 has a front wall 22, a rear wall 23, and left and right side walls 24 facing each other, and four corners are chamfered. The front, rear, left and right walls 22, 23, and 24 are formed so as to be gradually narrowed from the opening side toward the bottom plate 25 from the viewpoint of convenience of molding.

  The inclination angles of the front, rear, left and right walls 22, 23, and 24 are adjusted to a range of 1 to 20 °, for example. The reason why the inclination angle is in the range of 1 to 20 ° is that if it is 1 ° or more, it is possible to effectively prevent the generation of scratches on the wall surface during molding. Further, if it is 20 ° or less, the semiconductor package 10 accommodated in the pocket hole 20 can be prevented from popping out.

  The vicinity of the central portion excluding the peripheral edge of the bottom plate 25 is raised to a substantially inverted mortar shape to define a pedestal 26, and the pedestal 26 detachably supports and mounts the package body 11 of the semiconductor package 10. The pedestal 26 is formed into a substantially rectangular chamfered flat surface, and the surface thereof is flattened as necessary, or formed to be uneven so as to reduce the contact area with the semiconductor package 10.

  Such a pedestal 26 contacts the heat sink 14 of the semiconductor package 10, so that the lead group 12 of the semiconductor package 10 is slightly separated so as not to contact the surface periphery of the bottom plate 25, and the lead group 12 contacts the bottom plate 25. Therefore, it effectively prevents the performance from being worn or soiled.

  As shown in FIGS. 2, 4 to 6, the pair of position restricting portions 30 are integrally disposed at the center portions of the front wall 22 and the rear wall 23 facing each other of the surrounding wall 21, respectively. In other words, in other words, project in the direction of the pedestal 26 and face each other. From the viewpoint of improving the moldability, each position restricting portion 30 includes a first inclined surface 31 that is gradually inclined from the opening side of the pocket hole 20 toward the bottom plate 25, and the first inclined surface 31. A second inclined surface 32 that is gradually inclined from the front end toward the bottom plate 25 is integrally formed.

  The first inclined surface 31 is integrated with at least the upper portion of the front wall 22 or the rear wall 23 and is inserted between the lead 13 and the lead 13 that define the gap 16 of the semiconductor package 10 when the semiconductor package 10 is stored. The side surfaces of these leads 13 are in contact with each other so that the gap 16 of the semiconductor package 10 can be guided. The second inclined surface 32 is integrated with at least the peripheral portion of the bottom plate 25 and is fitted into the opposing gap 16 of the semiconductor package 10 to contact the peripheral surface of the package body 11 or the engagement piece 15 of the heat sink 14. , And functions to position the stored semiconductor package 10.

  In the above configuration, when the semiconductor package 10 is stored in the pocket hole 20 of the carrier tape, the pair of gaps 16 of the semiconductor package 10 are directed in the front-rear direction of the pocket hole 20 and the semiconductor package 10 is inserted into the pocket hole 20. If the heat sink 14 is mounted on the base 26, the semiconductor package 10 can be stored in the pocket hole 20. At this time, the inclined second inclined surface 32 of each position restricting portion 30 is fitted into the gap 16 of the semiconductor package 10 and contacts the peripheral surface of the package body 11 or the engagement piece 15 of the heat sink 14. Package 10 is properly positioned.

  According to the above configuration, the pair of position restricting portions 30 projecting from the pocket holes 20 position the package body 11 of the semiconductor package 10 to prevent the front / rear / left / right misalignment. The semiconductor package 10 can be positioned and accommodated in the pocket hole 20 with high accuracy even if the package body 11 and the leads 13 of the semiconductor package 10 have dimensional variations.

  Therefore, the collision between the surrounding wall 21 of the pocket hole 20 and the lead 13 of the semiconductor package 10 can be easily avoided, and the posture of the semiconductor package 10 is inclined and the lead 13 is deformed / damaged due to the collision. Can be prevented. Further, since the rotation of the semiconductor package 10 can be suppressed by sandwiching the semiconductor package 10 by the pair of position restricting portions 30, it is possible to prevent stress from being concentrated on some leads 13 of the lead group 12 and causing damage. Become. Furthermore, since the first and second inclined surfaces 31 and 32 of the position restricting portion 30 are inclined, the work when the position restricting portion 30 is molded and removed can be facilitated.

  Next, FIGS. 7 to 10 show a second embodiment of the present invention. In this case, the front wall 22 and the rear wall that form the surrounding wall 21 according to the position change of the gap 16 of the semiconductor package 10 are shown. The position restricting portions 30 are respectively provided in a region extending from the center portion to the corner portion 27 of the wall 23.

  In the semiconductor package 10, the gaps 16 are defined by the omission of the leads 13 from the center to the corners of the pair of lead groups 12 facing each other in the front-rear or left-right direction. Similarly to the above-described embodiment, each position restricting portion 30 includes a first inclined surface 31 that gradually inclines from the opening side of the pocket hole 20 toward the bottom plate 25, and a tip of the first inclined surface 31. It forms from the 2nd inclined surface 32 which inclines gradually as it goes to the baseplate 25. As shown in FIG. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  Even in this embodiment, the same effect as the above embodiment can be expected, and even if the gap 16 of the semiconductor package 10 is formed not in the center of the lead group 12 but in the region extending from the center to the corner 27, the pocket Obviously, the collision between the surrounding wall 21 of the hole 20 and the semiconductor package 10 can be easily avoided.

  Next, FIG. 11 thru | or FIG. 13 shows the 3rd Embodiment of this invention, In this case, the position control part 30 is protrudingly provided only in the center part of the front wall 22 which forms the surrounding wall 21, The number of position restricting portions 30 is reduced. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.

  In this embodiment, the same effect as that of the above embodiment can be expected, and the backlash can be suppressed to about ½ or less compared to the case where the position restricting portion 30 does not protrude from the surrounding wall 21. Clearly, the rotation and damage of the semiconductor package 10 can be suppressed to about ½ or less. Further, due to the decrease in the position restricting portion 30, it is possible to expect simplification of the mold structure for molding the carrier tape.

Next, FIGS. 14 to 16 show a fourth embodiment of the present invention. In this case, the position is restricted only in the region extending from the center portion to the corner portion 27 of the front wall 22 forming the surrounding wall 21. The portions 30 are provided so as to reduce the number of position restricting portions 30. The other parts are substantially the same as those in the above embodiment, and thus description thereof is omitted.
Also in this embodiment, the same effect as the said embodiment can be anticipated, and also the position control part 30 can be diversified.

  In addition, you may give a conductive coating to the surface of the tape material 2 in the said embodiment. Further, the semiconductor package 10 may be of a type in which the heat sink 14 is not attached to the bottom surface of the package body 11 as long as there is a gap 16. Alternatively, the engagement pieces 15 may be extended from the four peripheral edges of the heat sink 14, and the gaps 16 may be defined in each lead group 12 as the number of the engagement pieces 15 increases. It is also possible to make a through hole in the center of the pedestal 26 and use the through hole to detect the semiconductor package 10 with a photoelectric sensor, or push the semiconductor package 10 out of the pocket hole 20.

  Further, depending on the location of the gap 16 of the semiconductor package 10, it is possible to project the position restricting portion 30 in the central portion of the side wall 24 that forms the surrounding wall 21, or in the region extending from the central portion of the side wall 24 to the corner portion 27. It is. Further, depending on the number of the gaps 16, it is possible to project the position restricting portions 30 on the front wall 22, the rear wall 23, the central portion of the side wall 24, etc. that form the surrounding wall 21. When the position restricting portion 30 is disposed at a plurality of locations, the disposed portion is not limited to the line symmetrical position of the center line of the pocket hole 20 orthogonal to the longitudinal direction of the tape material 2, and may be a point symmetrical position, An asymmetric position is also acceptable.

  Moreover, the 1st inclined surface 31 can be integrated not in the upper part of the surrounding wall 21, but in the intermediate part vicinity in the up-down direction. Further, the second inclined surface 32 may be in direct contact with the peripheral surface of the package body 11, may be in indirect contact with a part of the heat sink 14, or may be in contact with both of them. good.

  The carrier tape according to the present invention can be used in the fields of electrical, electronic, and semiconductor manufacturing.

1 reel 2 tape material 10 semiconductor package (electronic component)
11 Package body (component body)
12 Lead group 13 Lead 14 Heat sink 15 Engagement piece 16 Air gap 20 Pocket hole (concave portion)
21 Surrounding wall 22 Front wall (opposite wall)
23 Rear wall (opposite wall)
24 Side wall 25 Bottom plate 26 Pedestal 27 Corner portion 30 Position restricting portion 31 First inclined surface 32 Second inclined surface

Claims (4)

A carrier tape provided with a recess for storing electronic components in which a lead group protrudes from the periphery of the component body on the tape material,
The recess includes a surrounding wall that surrounds the electronic component and a bottom plate that covers an open bottom of the surrounding wall, and the position restricting portion that fits into the gap formed in the predetermined lead group of the electronic component on the surrounding wall. The position restricting portion can be brought into contact with the component body of the electronic component, and a base on which the component body of the electronic component is mounted is provided on the bottom plate, and the lead group of the electronic component and the bottom plate are separated by the base. A carrier tape characterized by that. The concave portion is formed in a substantially rectangular plane, and the surrounding wall is inclined so that it gradually narrows in the direction of the bottom plate,
A heat sink is attached to the bottom of the component body as an electronic component as a surface-mount type semiconductor package, an engagement piece is formed on the peripheral edge of the heat sink, and the engagement piece is inserted into the component body via a gap of a predetermined lead group. The carrier tape according to claim 1, which is fixed to the tape.   A position restricting portion is provided at the center of at least one of the pair of facing walls forming the enclosing wall of the recess, and the position restricting portion is gradually inclined from the opening side of the recess toward the bottom plate. 3. The first inclined surface and a second inclined surface that is gradually inclined from the front end of the first inclined surface toward the bottom plate and can contact the component main body of the electronic component. Carrier tape.   Of the pair of opposing walls forming the surrounding wall of the recess, a position restricting portion is provided in a region extending from the vicinity of the central portion to the corner of at least one facing wall, and the position restricting portion is provided in the direction of the bottom plate from the opening side of the recess. Formed from a first inclined surface that gradually inclines as it goes and a second inclined surface that inclines gradually from the tip of the first inclined surface to the bottom plate and can contact the component body of the electronic component The carrier tape according to claim 1 or 2.

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