JP2009007055A - Tray for semiconductor integrated circuit device, and manufacturing process for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tray for semiconductor integrated circuit devices preventing a damage of connector pins of the semiconductor devices, caused by a contact between the corner part of the semiconductor device and excellent in mass-production property, and a manufacturing process for semiconductor devices using the tray. <P>SOLUTION: A storing segment for semiconductor devices is provided with a plurality of rectangular blocks 14 formed to be protruded from the surface of a tray at the surface side of a tray 10 and having a shorter side than that of one side of the semiconductor device as seen in its top plan view. Sides of the plurality of blocks 14 for semiconductor devices are formed with steps having: supporting surfaces 17 for supporting outer edges except the corners of the semiconductor devices from below; and restricting surfaces 16 for restricting motion of the semiconductor device in a horizontal direction when the semiconductor devices are installed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a semiconductor integrated circuit device, in particular, a tray for housing a semiconductor integrated circuit device having a large number of connection terminals on the lower surface of a package such as a ball grid array or a pin grid array, and a method of manufacturing a semiconductor device using the tray. .

  As a package type of a semiconductor integrated circuit device (hereinafter, referred to as a semiconductor device), there is a type in which a connection terminal is arranged on one surface of a package such as a ball grid array type or a pin grid array type. The ball grid array type has a structure in which ball terminals as connection terminals are arranged in a matrix on the lower surface of a package. The pin grid array type has a structure in which lead pins as connection terminals are arranged in a matrix on the lower surface of the package.

  FIG. 8 is a diagram showing a structure of a ball grid array type semiconductor device (hereinafter referred to as BGA). 8A is a side view, FIG. 8B is a plan view, and FIG. 8C is a bottom view. As shown in FIGS. 8A and 8B, the package 2 of the semiconductor device 5 includes a substrate 3 on which a semiconductor chip (not shown) is mounted and a mold resin 4 that covers the semiconductor chip mounting surface of the substrate 3. Become. A plurality of wirings that are electrically connected to the semiconductor chip are formed on the substrate 3. Each wiring is connected to the ball terminal 1 on the back surface of the substrate 3 (the surface covered with the mold resin 4 is the front surface). Has been. On the back surface of the substrate 3, as shown in FIG. 8C, a large number of ball terminals 1 are arranged in a matrix. In a pin grid array type semiconductor device (hereinafter referred to as PGA), lead pins that are connection terminals are arranged in place of the ball terminals 1 in FIGS. 8A and 8C. The lead pin is fixed to the back surface of the substrate 3 using an adhesive method such as silver solder. Both BGA and PGA have features such that the number of connection terminals can be increased compared to a quad flat package (QFP) having connection terminals on the outer periphery of the package, and electrical noise is less generated. is doing.

  BGA and PGA are transported between processes and shipped and transported in a state of being stored in a dedicated tray. In recent years, solder balls constituting the ball terminal 1 of the BGA have shifted from lead solder balls to lead-free solder balls that do not substantially contain lead. For this reason, the adhesive strength between the wiring terminal portion of the substrate 3 and the solder ball becomes weak, and damage to the connection terminal such that the solder ball is detached during conveyance becomes remarkable.

  FIG. 9 is a diagram showing an overall configuration of a conventional general tray. FIG. 10 is an enlarged view showing the structure of the tray storage section (the area indicated by the broken line P1 in FIG. 9). As shown in FIG. 9, a plurality of storage portions 110 that store semiconductor devices such as BGA and PGA are formed on the surface 101 of the tray 100. As shown in FIG. 10, the storage unit 110 includes four blocks 111 that are provided on the surface 101 of the tray 100 and are substantially rectangular in a plan view. Each block 111 is arranged corresponding to each of the four sides constituting the outer periphery of the semiconductor device.

  Further, at both ends of each block 111 in the direction along the semiconductor device, projecting portions 111a projecting further upward are formed. In FIG. 10, the shaded area is the protrusion 111a. A concave pocket 112 for making a terminal (ball terminal or lead pin) of the semiconductor device in a non-contact state with respect to the tray surface is formed at the center of the region surrounded by each block 111. When the semiconductor device is stored in the storage portion 110, the wall surface 111b on the semiconductor device side of each block 111 regulates the movement of the semiconductor device in the horizontal direction. For this reason, the semiconductor device hardly moves in the horizontal direction. Further, the tray 100 can function as a lid for preventing the semiconductor device stored in the tray 100 from popping out by stacking the empty trays 100 of the same type in a state where the semiconductor device is stored. For example, when inspecting a connection terminal of a semiconductor device, it is necessary to expose a surface on which the connection terminals of the semiconductor device are arranged. In this case, a method is used in which the semiconductor device is transferred to the back side of the tray used as a lid in a state where the front and back sides are reversed by inverting the front and back sides of the tray 100 with the empty trays 100 stacked. There are many. For this reason, it is common to provide a storage portion for storing the semiconductor device also on the back side of the tray 100.

  FIG. 11 is a view showing the back surface 102 of the tray 100. FIG. 12 is an enlarged view showing the structure of the storage portion (the area indicated by the broken line P2 in FIG. 11) on the back side of the tray 100. The storage unit 120 on the back surface side is normally arranged so that the position overlaps with the storage unit 110 on the front surface side when used as a lid as described above. That is, in one tray, the storage unit 120 on the back surface side is formed in a state where the position overlaps coaxially with the storage unit 110 on the front surface side. Similar to the front-side storage unit 110, the back-side storage unit 120 also includes four blocks 121 that are provided on the back surface of the tray 100 and are substantially rectangular in plan view. Each block 121 is arranged at a position facing each block 111 on the front side when the trays 100 are stacked. A protruding portion 121 a that protrudes further upward is formed at the center of each block 121. In FIG. 12, the shaded area is the protrusion 121a. A concave pocket 122 is formed in the central portion of the region surrounded by each block 121 for making the portion covered with the mold resin 4 of the semiconductor device in a non-contact state with respect to the tray back surface 102. The horizontal movement of the semiconductor device stored in the storage unit 120 is restricted by the wall surface 121b of each block 121 on the semiconductor device side.

  When the trays 100 are stacked, the protrusions 121a are fitted between the protrusions 111a provided on the block 111 on the opposite surface side. Therefore, when the front and back surfaces are reversed with the trays 100 stacked, the semiconductor device can be smoothly transferred from the front surface side storage portion 110 of one tray 100 to the back surface side storage portion 120 of the other tray 100. Similarly, the semiconductor device 5 can be smoothly transferred from the back surface side storage portion 120 of one tray 100 to the front surface side storage portion 110 of the other tray 100.

  Patent Document 1 described later discloses a tray in which the walls 111b and 121b of the blocks 111 and 121 constituting the storage units 110 and 120 form one straight line. In this case, the length of each of the blocks 111 and 121 in the direction along the semiconductor device is shorter than the length a (see FIG. 8) of one side of the semiconductor device shown in FIG. For this reason, the corner part (part of the arrow E part of FIG.8 (b), FIG.8 (c)) of the board | substrate 3 of the accommodated semiconductor device 5 does not contact each block 111,121. For this reason, the substrate 3 and the blocks 111 and 121 are prevented from being damaged due to the collision between the corner portion E and the blocks 111 and 121. Further, since the wall surfaces of the blocks 111 and 121 and the side surfaces of the semiconductor device 5 are in line contact in the horizontal plane, movement of the semiconductor device in the rotational direction is also restricted.

Further, Patent Document 2 described later discloses a tray in which a concave pocket 112 is not provided in the tray and an inclined surface is formed downward from a portion corresponding to the wall surface 111b or 121b of each block 111 or 121. . In the tray, the inclined surface supports the outer edge portion 6a (see FIG. 8C) of the surface on which the terminals of the semiconductor device are arranged, and the inclination angle of the inclined surface is appropriately set, whereby the semiconductor device The terminal and the tray are in a non-contact state.
JP 2000-318789 A JP 2000-315723 A

  However, the above-described conventional tray 100 supports the entire outer periphery of the substrate 3 of the semiconductor device with the concave pocket 112 at the center of the storage portion 110 in order to bring the terminals of the semiconductor device and the tray 100 into a non-contact state. Yes. Therefore, the connection terminal and the tray 100 are not in contact with each other, but the lower surface of the end portion of the substrate 3 is in contact with the tray 100. For this reason, the tray 100 comes into contact with the corner portion E of the package 2, and the corner portion E is not in a completely non-contact state.

  In addition, in a tray using an inclined surface, the design of the tray is complicated, and the semiconductor device is not always supported horizontally. That is, there is a problem in the storage property and stability of the semiconductor device. In Patent Document 2, a block is provided at a corner portion of the back-side storage unit, and the position of the semiconductor device is regulated so that the semiconductor device is supported horizontally. Therefore, also in this embodiment, the corner portion E of the semiconductor device is not in a completely non-contact state.

  That is, in the tray having the conventional structure, the corner portion E of the package 2 contacts the support portion 113 (see FIG. 10) or the support portion 123 (see FIG. 12) that supports the BGA 5. Therefore, deformation stress due to vertical vibration is generated in the corner portion of the substrate 3 that is not covered with the mold resin 4 and is relatively weak in strength due to a slight impact when the tray is transported in a state where the BGA 5 is stored. This deformation stress has an effect in a direction in which the wiring terminal portion of the substrate 3 and the solder ball are peeled off, and there is a problem that the connection terminal of the semiconductor device is damaged.

  The present invention has been proposed in view of the above-described conventional circumstances, and can prevent damage to the connection terminal of the semiconductor device due to contact between the corner portion of the semiconductor device and the tray. It is an object of the present invention to provide a semiconductor integrated circuit device tray excellent in mass productivity and a method for manufacturing a semiconductor device using the tray.

  In order to solve the above problems, the present invention employs the following technical means. First, according to the present invention, a semiconductor integrated circuit device having a rectangular substrate and a plurality of terminals regularly arranged on one surface of the substrate and protruding from the one surface is stored one by one with the terminals facing downward. A plurality of first storage portions on the front surface side, and a semiconductor integrated circuit having a plurality of second storage portions on the back surface side for storing the semiconductor integrated circuit devices one by one in a state where the semiconductor integrated circuit device is turned upside down. The circuit device tray is assumed. In the tray for a semiconductor integrated circuit device according to the present invention, the first storage portion is formed on the surface side of the tray so as to protrude from the surface of the tray, and has a side shorter than the length of one side of the substrate in plan view. A plurality of rectangular blocks having A region surrounded by the plurality of blocks is an installation portion of the semiconductor integrated circuit device on the tray surface side. When the semiconductor integrated circuit device is installed on the side where the plurality of blocks are installed, a support surface that supports the outer edge portion excluding the corner portion of the substrate from below, and a regulation that regulates horizontal movement of the substrate A step portion having a surface is formed. The second storage portion includes a plurality of rectangular blocks that are formed on the back surface side of the tray so as to protrude from the back surface of the tray and have sides shorter than one side of the substrate in plan view. A region surrounded by the plurality of blocks is an installation portion of the semiconductor integrated circuit device on the back side of the tray. On the side where the plurality of blocks are installed, when the semiconductor integrated circuit device is installed with the back side facing upward, a support surface that supports the outer edge portion excluding the corner portion of the substrate from below, and the horizontal direction of the substrate The step part which has the control surface which controls the movement of is formed.

  According to this configuration, the accommodated semiconductor integrated circuit device does not contact the tray at portions other than the step portion. For this reason, it is possible to prevent damage to the connection terminals of the housed semiconductor device, in particular, the semiconductor device including the connection terminal made lead-free.

  The number of each block of the first and second storage units is, for example, four for one storage unit, and each step unit of the four blocks is arranged corresponding to the four sides of the substrate. It is possible to adopt a configuration to

  The height of the support surface formed on the block of the first storage unit from the tray surface can be made larger than the protruding amount of the terminal of the semiconductor integrated circuit device from the substrate. Similarly, the height of the support surface formed on the block of the second storage unit from the back surface of the tray is larger than the protruding amount of the semiconductor integrated circuit device from the substrate on the other surface of the substrate. Can do. Furthermore, the length of the support surface formed on the block of the first storage unit from the end on the installation unit side to the end on the regulation surface side is shorter than the shortest distance from the substrate end to the outermost terminal. Can also be reduced.

  In the method of manufacturing a semiconductor device including the step of storing the semiconductor integrated circuit device in the above-described semiconductor integrated circuit tray and transporting the semiconductor integrated circuit device, the terminal of the semiconductor integrated circuit device does not substantially contain lead Particularly suitable. Further, the terminal of the semiconductor integrated circuit device is particularly suitable when it is a ball terminal or a pin terminal.

  According to the present invention, the semiconductor device can be stored in a state where there is no portion where the corner portion of the semiconductor device and the tray are in contact with each other. As a result, when a stored semiconductor device, in particular, a semiconductor device including a connection terminal that has been made lead-free, can be prevented from being damaged such as detachment of the connection terminal.

  In addition, the tray for a semiconductor integrated circuit device according to the present invention is configured by a block having a storage portion having a step portion, and there is no need to form a pocket on the surface of the tray unlike a conventional tray. For this reason, compared with the past, it can manufacture easily irrespective of manufacturing methods, such as shaping | molding and cutting.

  Hereinafter, an embodiment of a tray for a semiconductor integrated circuit according to the present invention will be described in detail with reference to the drawings. In the following embodiments, the present invention is embodied by a tray for a semiconductor integrated circuit device that houses a BGA as shown in FIG. In the following description, the normal use state of the tray, that is, the state in which the tray is placed horizontally, is referred to as a reference state, and the vertical upward direction is expressed as up and the vertical downward direction is expressed as down. In addition, the tray of this embodiment is used by stacking a plurality of trays of the same type, like the conventional tray 100, and is stacked upward by stacking empty trays in a state where semiconductor devices are stored. The tray functions as a lid.

  FIG. 1 is a plan view showing the overall configuration of the tray of this embodiment. As shown in FIG. 1, the tray 10 of this embodiment has a substantially rectangular plate shape. On the front surface 11 of the tray 10, a plurality of storage portions (first storage portions) 12 that store the BGA 5 are arranged. The storage units 12 are arranged at a constant pitch along the longitudinal direction (long side) and the short direction (short side) of the tray 10. In the example of FIG. 1, 14 storage units 12 are arranged, and 14 BGAs 5 can be stored in one tray 10. The front-side storage unit 12 stores the BGA 5 with the terminals of the BGA 5 facing downward.

  FIG. 2 is an enlarged plan view showing a region including one storage portion 12 (region indicated by a broken line Q1 in FIG. 1). 3 is a cross-sectional view taken along line AA shown in FIG. As shown in FIGS. 2 and 3, each storage unit 12 includes four blocks 14 (14 a, 14 b) that are substantially rectangular in a plan view on the surface 11 of the tray 10. Each block 14 is arranged corresponding to each side (each side of the substrate 3) constituting the outer periphery of the BGA 5. That is, each storage unit 12 includes a pair of blocks 14a that are arranged to face each other in parallel with a certain interval, and a pair of blocks 14b that are arranged to face each other in parallel with a certain interval. In the present embodiment, the long side of the block 14 a is arranged in parallel with the short side of the tray 10, and the long side of the block 14 b is arranged in parallel with the long side of the tray 10. Accordingly, the pair of blocks 14a and the pair of blocks 14b are arranged in directions orthogonal to each other. In FIG. 2, an area surrounded by the four blocks 14 is an installation portion of the BGA 5. Each block 14 is arranged so that the center of each block 14 faces the center of each side of the substrate 3 in a state where the BGA 5 is stored in the storage unit 12. In the following description, portions corresponding to each of the pair of blocks 14a and 14b will be described with appropriate reference numerals (a or b).

  A step portion is formed on each block 14 on the installation portion side. Each step portion is constituted by a support surface 17 (17a, 17b) substantially parallel to the surface 11 of the tray 10 and a regulation surface 16 (16a, 16b) rising substantially perpendicularly from the support surface 17. The support surface 17 supports the BGA 5 from below in a tray state with the surface 11 facing upward. That is, the outer edge portion 6a (see FIG. 8C) of the terminal arrangement surface 6 on which the connection terminals of the substrate 3 are arranged is supported. Here, the outer edge portion 6a refers to an outer edge region of the package 2 (substrate 3) located outside the ball terminal 1 disposed on the outermost side. Further, the restriction surface 16 restricts the movement of the BGA 5 in the horizontal direction. In the following description, the wall surface constituting the end of the support surface 17 of each block 14 on the installation portion side is referred to as a wall surface 18 (18a, 18b).

  Moreover, in this embodiment, each block 14 is provided with the protrusion part 15 (15a, 15b). The protrusions 15 are formed at both ends of each block 14 in the direction along the BGA 5 stored in the storage unit 12. In FIG. 2, the shaded area is the protrusion 15. As shown in FIG. 3, the protrusion 15 has a shape in which the width in the direction perpendicular to the restriction surface 16 becomes narrower toward the tip of the protrusion 15. That is, the side surface of the protruding portion 15 on the arrangement portion side is inclined in the direction opposite to the arrangement portion as it goes toward the tip of the protruding portion 15. For this reason, the side surface of the projecting portion 15 on the arrangement portion side also has a function of a guide for guiding the BGA 5 to the arrangement portion when the BGA 5 is accommodated in the accommodation portion 12.

  In this embodiment, the BGA 5 having the package 2 having a square planar shape is accommodated. Therefore, the blocks 14a and 14b have the same shape, and the distance between the pair of blocks 14a and the distance between the pair of blocks 14b are the same. That is, the lengths of the blocks 14 in the direction along the BGA 5 are all the same (length K1). Further, the distance between the wall surfaces 18a facing each other and the distance between the wall surfaces 18b facing each other are the same (length K2). Furthermore, the distance between the regulating surfaces 16a facing each other and the distance between the regulating surfaces 16b facing each other are the same (length K3).

  Here, the length K1 of each block 14 in the direction along the BGA 5 is shorter than the length a of one side of the BGA 5 (see FIG. 8B). In the present embodiment, in particular, the length is shorter than the length L of the mold resin 4 (see FIG. 8B). The distance K2 between the wall surfaces 18a facing each other is shorter than the length a of one side of the BGA 5 and is longer than the length c of one side of the ball terminal group 1 formation region (see FIG. 8A). It is getting bigger. Furthermore, the distance K3 between the regulation surfaces 16 facing each other is slightly larger than the length a of one side of the BGA 5.

  In the present embodiment, the length of the support surface 17 from the end on the installation portion side to the end on the regulation surface 16 side is made shorter than the shortest distance from the end of the substrate 3 to the outermost connection terminal. The difference between the length K2 and the length c (K2-c) is larger than the difference between the length K3 and the length a (K3-a). Further, the height d1 of the wall surface 18 (see FIG. 3) is larger than the protruding amount h1 of the ball terminal 1 from the substrate 3 (see FIG. 8A). Note that when a BGA having a package with a rectangular planar shape is accommodated, the design can be similarly made according to the dimensions of the package.

  When the BGA 5 is stored in the storage unit 12 having such a configuration, the outer edge portion 6 a of the terminal arrangement surface of the substrate 3 is supported by the support surface 17 of the block 14. And when BGA5 accommodated in the accommodating part 12 tries to move to a horizontal direction, the center part of the side surface of BGA5 will contact the control surface 16 of the block 14, and the further movement is controlled. Further, since the side surface of the BGA 5 is in line contact with the regulating surface 16, the rotational movement of the BGA 5 is also regulated.

  In the present embodiment, the length K1 of the block 14 in the direction along the BGA 5 is shorter than the length a of one side of the BGA 5 and is arranged corresponding to only the central part of each side constituting the outer periphery of the substrate 3. . For this reason, the corner portion E of the BGA 5 does not contact the block 14 and other portions of the tray 10.

  Further, the difference between the length K3 between the regulating surfaces 16 of the block 14 and the length a of one side of the BGA 5 is the length K2 between the wall surfaces 18 of the block 14 and the length c of one side of the ball terminal 1 group forming region. Smaller than the difference. For this reason, even if the BGA 5 stored in the storage portion 12 contacts the regulation surface 16, the ball terminal 1 does not contact the wall surface 18 of the block 14. Therefore, the ball terminal 1 and the surface 11 of the tray 10 can be brought into a non-contact state without forming the conventional pocket 112 (see FIG. 10) on the tray surface at the center of the storage portion 12.

  On the other hand, the same number of storage units 22 as the front-side storage units 12 are formed on the rear surface of the tray 10. FIG. 4 is a plan view showing the configuration of the tray 10 in a state in which the back surface of the tray faces upward. The storage portion 22 on the back surface 21 of the tray 10 is coaxially overlapped with the storage portion 12 on the front surface 11 side, and has the same pitch and the same pitch as the front surface side storage portion 12 along the long side and the short side of the tray 10. It is arranged in the direction. In the example of FIG. 4, 14 storage portions 22 corresponding to the 14 storage portions 12 on the front surface side are arranged, and 14 BGAs 5 can be stored in one tray 10. The storage unit 22 on the back side stores the BGA 5 with the terminals of the BGA 5 facing upward.

  FIG. 5 is an enlarged plan view showing a region including one storage portion 22 (region indicated by a broken line Q2 in FIG. 4). 6 is a cross-sectional view taken along line BB shown in FIG. Note that the area indicated by the broken line Q1 in FIG. 1 and the area indicated by the broken line Q2 in FIG.

  As shown in FIGS. 5 and 6, each storage unit 22 has four blocks 24 (24 a and 24 b) that are substantially rectangular in a plan view on the back surface 21 of the tray 10, similarly to the front side storage unit 12. Prepare. Each block 24 is arranged corresponding to each side constituting the outer periphery of the BGA 5. That is, each storage unit 22 includes a pair of blocks 24a arranged in parallel with each other at a constant interval and a pair of blocks 24b arranged in parallel with each other at a constant interval. In the present embodiment, the long side of the block 24 a is arranged in parallel with the short side of the tray 10, and the long side of the block 24 b is arranged in parallel with the long side of the tray 10. Therefore, the pair of blocks 24a and the pair of blocks 24b are arranged in directions orthogonal to each other. In FIG. 5, the area surrounded by the four blocks 24 is an installation part of the BGA 5. Further, each block 24 is arranged so that the center of each block 24 faces the center of each side of the substrate 3 in a state where the BGA 5 is stored in the storage unit 22. In the following description, portions corresponding to each of the pair of blocks 24a and 24b will be described with appropriate reference numerals (a or b).

  A step portion is formed on each block 24 on the installation portion side. Each step portion is constituted by a support surface 27 (27a, 27b) substantially parallel to the back surface 21 of the tray 10 and a regulation surface 26 (26a, 26b) rising from the support surface 17. The support surface 27 supports the BGA 5 from below in a tray state with the back surface 21 facing upward. That is, the outer edge part 7a (refer FIG.8 (b)) of the mold arrangement | positioning surface 7 with which the mold resin 4 of the board | substrate 3 was provided is supported. Further, the regulation surface 26 regulates the movement of the substrate 3 in the horizontal direction. In the following, the wall surface that constitutes the installation portion side end of the support surface 27 of each block 24 is referred to as a wall surface 28 (28a, 28b).

  Moreover, in this embodiment, each block 24 is provided with the protrusion part 25 (25a, 25b). The protruding portion 25 is formed in the central portion of each block 24 in the direction along the BGA 5 stored in the storage portion 22. In FIG. 5, the shaded area is the protrusion 25. As shown by a broken line in FIG. 5, the protrusions 25 are fitted between the protrusions 15 provided on the block 14 on the opposite surface side when the trays 10 are stacked. Further, as shown in FIG. 6, the protruding portion 25 has a shape in which the width in the direction perpendicular to the restriction surface 26 in a plan view becomes narrower toward the tip of the protruding portion 25. That is, the side surface of the protruding portion 25 on the arrangement portion side is inclined in the direction opposite to the arrangement portion as it goes toward the tip of the protruding portion 25. For this reason, the side surface of the projecting portion 25 on the arrangement portion side also has a function of a guide for guiding the BGA 5 to the arrangement portion when the BGA 5 is accommodated in the accommodation portion 22. In the present embodiment, unlike the protruding portion 15 on the front surface side, the side surface of the protruding portion 25 is the restricting surface 26.

  As described above, in this embodiment, the BGA 5 having the package 2 having a square planar shape is accommodated. In this embodiment, the mold resin 4 also has a substantially square horizontal cross section. Therefore, the blocks 24a and 24b have the same shape, and the distance between the pair of blocks 24a and the distance between the pair of blocks 24b are the same. That is, the lengths of the blocks 24 in the direction along the BGA 5 are all the same (length K4). Further, the distance between the wall surfaces 28a facing each other and the distance between the wall surfaces 28b facing each other are the same (length K5). Furthermore, the distance between the restricting surfaces 26a facing each other and the distance between the restricting surfaces 26b facing each other are the same (length K6).

  Here, the length K4 of each block 24 in the direction along the BGA 5 is shorter than the length a of one side of the BGA 5 (see FIG. 8B). In the present embodiment, the length K4 is the same as the length K1 in the direction along the BGA 5 of each block 14 on the surface side. Further, the distance K5 between the wall surfaces 28 facing each other is shorter than the length a of one side of the BGA 5. Furthermore, the distance K6 between the restricting surfaces 26 facing each other is slightly larger than the length a of one side of the BGA 5.

  Further, the height d2 (see FIG. 6) of the wall surface 28 is larger than the protruding amount h2 of the mold resin 4 from the substrate 3 (see FIG. 8A). Note that when a BGA having a package with a rectangular planar shape is accommodated, the design can be similarly made according to the dimensions of the package.

  When the BGA 5 is stored in the storage unit 22 having such a configuration with the ball terminal 1 facing upward with the back surface 21 of the tray 10 facing upward, the outer edge portion 7a of the mold placement surface 7 of the substrate 3 becomes the block 24. The support surface 27 is supported. When the BGA 5 stored in the storage unit 22 attempts to move in the horizontal direction during transportation or the like, the central portion of the side surface of the BGA 5 comes into contact with the restriction surface 26 of the block 24 and further movement is restricted. Further, since the side surface of the BGA 5 is in line contact with the regulating surface 26, the rotational movement of the BGA 5 is also regulated.

  In the present embodiment, the length K4 of the block 24 in the direction along the BGA 5 is shorter than the length a of one side of the BGA 5 and is arranged corresponding to only the central part of each side constituting the outer periphery of the substrate 3. . For this reason, the corner portion E of the BGA 5 does not contact the block 24 and other portions of the tray 10. Further, the mold resin 4 and the back surface 21 of the tray 10 can be brought into a non-contact state without forming the conventional pocket 122 (see FIG. 12) on the tray surface at the center of the storage portion 22.

  FIG. 7 is a partial cross-sectional view showing a state in which the trays 10 having the above configuration are overlapped. In FIG. 7, the two trays 10 are stacked in a state in which the protruding portion 15 of the block 14 on the front surface side and the protruding portion 25 of the block 22 on the back surface side are fitted. The alignment between the trays 10 to be overlapped can be easily realized by providing a known positioning means for aligning the two. In the example of FIG. 7, the outer edge 31 on the front surface side of the tray 10 is fitted with the outer edge 32 on the rear surface side of the tray 10. Here, the side surface on the inner side of the tray of the rear surface side outer edge 32 is configured by a vertical surface, and the side surface of the outer surface side of the front surface side outer edge 31 is configured by an inclined surface that is inclined toward the inner side of the tray toward the tip. Yes. For this reason, alignment can be accurately performed only by stacking the upper tray 10 on the lower tray 10 so that the outer edges of both trays 10 overlap.

  As shown in FIG. 7, the tray 10 of this embodiment stores one BGA 5 between each front surface side storage portion 12 of the lower tray 10 and the corresponding back surface side storage portion 22 of the upper tray 10. can do. As described above, in the tray 10 according to the present embodiment, even in the case where they are overlapped, only the central portion of each side constituting the outer periphery of the package 2 is in contact with the tray 10 in the semiconductor device. That is, the corner portion E of the package 2 is not in contact with the tray 10. Therefore, it is possible to prevent damage to the connection terminal of the semiconductor device having the connection terminal which has been protected for protection of the housed semiconductor device, and in particular has been made lead-free.

  As described above, according to the present invention, the semiconductor device can be accommodated in a state where there is no portion where the corner portion of the semiconductor device and the tray are in contact with each other. As a result, it is possible to prevent damage such as detachment of the connection terminal in the housed semiconductor device, in particular, the semiconductor device including the connection terminal made lead-free.

  In addition, the tray for a semiconductor integrated circuit device according to the present invention is configured by a block having a storage portion having a step portion, and there is no need to form a pocket on the surface of the tray unlike a conventional tray. For this reason, it can manufacture easily compared with the past.

  The tray 10 can be manufactured regardless of a manufacturing method such as molding or cutting. In addition, the tray 10 is preferably formed integrally with a heat-resistant synthetic resin so that the tray 10 is easy to manufacture and lightweight. Furthermore, in order to prevent electrostatic breakdown of the housed semiconductor device, the tray 10 preferably has conductivity. Examples of heat-resistant conductive synthetic resins include polyphenylene ether resins, polyether sulfone resins, and polyetherimide resins mixed with conductive fillers such as carbon particles, carbon fibers, metal particles, and metal fibers. Polyacrylic sulfone resin or polyester resin can be used. In addition, a through hole may be provided in the central portion of the bottom surface of the first storage unit (second storage unit). Thereby, a tray can be reduced in weight.

  Moreover, in the manufacturing process of a semiconductor device including the step of transporting a semiconductor device such as a BGA or PGA using a tray, the semiconductor device is being transported by transporting the semiconductor device using the tray of the present invention. Can be prevented from being damaged. This manufacturing method is particularly effective as a method for manufacturing a semiconductor device including a connection terminal made lead-free.

  The present invention is not limited to the embodiment described above, and various modifications and applications are possible without departing from the technical idea of the present invention. For example, in the above description, the protrusions are provided on the front-side block and the back-side block, respectively, and the two are fitted to each other. However, in the present application, the protrusions are not essential elements. In the above description, the configuration in which one block is arranged on each side of the substrate constituting the outer periphery of the semiconductor device has been described. However, a plurality of blocks may be arranged on each side. That is, the number of blocks is arbitrary as long as the arrangement does not contact the corner portion of the semiconductor device.

  In addition, the tray for storing the BGA has been described above. However, the present invention can be applied to a tray for storing any semiconductor device having a connection terminal on one side of the package in addition to the PGA.

  The tray for a semiconductor integrated circuit device according to the present invention is a multi-pin BGA or PGA package systemized for image processing of a CPU (Central Processing Unit), DVD (Digital Versatile Disc) or PDP (Plasma Display Panel) of a personal computer. It is useful as a method for manufacturing a semiconductor device that can prevent the tray and the connection terminal from being damaged when the semiconductor device having the connection terminal on the lower surface thereof is transported or transported.

The top view which shows the surface side of the tray in one Embodiment of this invention The top view which shows the surface side storage part of the tray in one Embodiment of this invention Sectional view in AA shown in FIG. The top view which shows the back surface side of the tray in one Embodiment of this invention The top view which shows the back side storage part in one Embodiment of this invention Sectional drawing in BB shown in FIG. The fragmentary sectional view which shows the state which piled up two trays in one Embodiment of this invention Diagram showing BGA Plan view showing the surface side of a conventional tray The top view which expands and shows the surface side storage part of the conventional tray Plan view showing the back side of a conventional tray The top view which expands and shows the back side storage part of the conventional tray

Explanation of symbols

1 Ball terminal (terminal for connection)
2 Package 3 Substrate 4 Mold resin 5 BGA (Semiconductor integrated circuit device)
10 tray 12 front surface side storage section (first storage section)
14, 14a, 14b Block 16, 16a, 16b Restriction surface 17, 17a, 17b Support surface 18, 18a, 18b Wall surface 22 Back surface side storage portion (second storage portion)
24, 24a, 24b Block 26, 26a, 26b Restricting surface 27, 27a, 27b Support surface 28, 18a, 28b Wall surface

Claims (8)

A first storage portion for storing a semiconductor substrate having a rectangular substrate and a plurality of terminals regularly arranged on one surface of the substrate and projecting from the one surface, with the terminals facing downward. A tray for a semiconductor integrated circuit device having a plurality of second storage portions on the back surface side for storing the semiconductor integrated circuit devices one by one in a state where the semiconductor integrated circuit device is turned upside down. There,
The first storage portion is
A plurality of rectangular blocks formed on the surface side of the tray so as to protrude from the surface of the tray and having sides shorter than the length of one side of the substrate in plan view;
An installation portion of the semiconductor integrated circuit device on the tray surface side surrounded by the plurality of blocks;
When the semiconductor integrated circuit device formed on the installation part side of the plurality of blocks is installed, a support surface that supports an outer edge part excluding a corner part of the substrate from below, and a horizontal movement of the substrate A step part having a regulating surface to regulate;
With
The second storage portion is
A plurality of rectangular blocks formed on the back side of the tray so as to protrude from the back side of the tray and having sides shorter than the length of one side of the substrate in plan view;
An installation portion of the semiconductor integrated circuit device on the back side of the tray, surrounded by the plurality of blocks;
A support surface that is formed on the installation portion side of the plurality of blocks, and supports the outer edge portion excluding the corner portion of the substrate from below when the semiconductor integrated circuit device is installed with the back surface side facing upward; A step portion having a restricting surface for restricting horizontal movement of
A tray for a semiconductor integrated circuit device, comprising:   4. Each block of the first and second storage units is provided for one storage unit, and each step unit of the four blocks is arranged corresponding to four sides of the substrate. 2. A tray for a semiconductor integrated circuit device according to 1.   3. The semiconductor according to claim 1, wherein a height of a support surface formed on the block of the first storage unit from a tray surface is larger than a protruding amount of a terminal of the semiconductor integrated circuit device from the substrate. Integrated circuit device tray.   The height of the support surface formed in the block of the second storage unit from the back surface of the tray is larger than the protruding amount of the semiconductor integrated circuit device from the substrate on the other surface of the substrate. 3. A tray for a semiconductor integrated circuit device according to 2.   The length of the support surface formed on the block of the first storage unit from the installation unit side end to the regulation surface side end is smaller than the shortest distance from the substrate end to the outermost terminal. The tray for a semiconductor integrated circuit device according to claim 1 or 2.   A method for manufacturing a semiconductor device comprising the steps of: housing a semiconductor integrated circuit device in a tray for a semiconductor integrated circuit device according to claim 1; and transporting the semiconductor integrated circuit device, wherein a terminal of the semiconductor integrated circuit device substantially contains lead. A method for manufacturing a semiconductor device, characterized in that the semiconductor device is not contained.   The method of manufacturing a semiconductor device according to claim 6, wherein the terminal of the semiconductor integrated circuit device is a ball terminal.   The method of manufacturing a semiconductor device according to claim 6, wherein the terminal of the semiconductor integrated circuit device is a pin terminal.

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