JP6446262B2 - Carrier tape for electronic parts and method for manufacturing the same - Google Patents

Description

  The present invention relates to an electronic component carrier tape used for storage, supply, storage, inventory management, transportation, and the like of an electronic component made of a semiconductor package and the like, and a method of manufacturing the same.

  A conventional carrier tape for electronic parts is, as shown in part in FIG. 16, a flexible sheet 2 wound around a take-up reel and a storage emboss for electronic parts 10 arranged side by side on the sheet 2. 20A, and after being manufactured by the manufacturer, it is transported from the manufacturer to the component manufacturer, or from the component manufacturer to the assembly manufacturer.

  As shown in part in FIG. 16, the sheet 2 is formed in a long shape, and a plurality of storage embosses 20 </ b> A are arranged in parallel at regular intervals in the longitudinal direction, and a cover for sealing the electronic component 10 on the surface. The tape is applied later. As shown in the figure, each storage emboss 20A is formed in a pocket shape having a predetermined depth, and stores the electronic component 10 in the peripheral wall 22A from the opening 21A. The bottom 33 of the storage emboss 20A is formed, for example, as a flat rectangular base on which the electronic component 10 is mounted at the center and is formed on the bottom, and when the sheet 2 is wound around the take-up reel at least at the periphery other than the center, the take-up reel It touches the peripheral surface.

When a manufacturer manufactures such a carrier tape for electronic components, first, the prepared long sheet 2 is preheated and set in a mold, and a plurality of storage embosses 20A are attached to the sheet 2 by the mold. If the sheet 2 is wound around a take-up reel after being formed at regular intervals, a carrier tape for electronic parts can be manufactured.
When the electronic component carrier tape is wound around the take-up reel, the electronic component carrier tape is wound, and the sheet 2 and the storage emboss 20A are curved and deformed in an arc shape, so that the storage emboss 20A is most easily deformed. The vicinity of the center may bulge in the direction of the opening 21A.

  Next, when the component manufacturer stores the electronic component 10 in the manufactured electronic component carrier tape, first, the electronic component carrier tape wound around the take-up reel is fed out, and a plurality of storage embosses of the sheet 2 are delivered. The electronic components 10 are sequentially stored in 20A, a cover tape is heated and fused to the surface of the sheet 2, and then a predetermined length of the electronic component carrier tape is wound around the take-up reel. The component 10 can be stored.

  When the carrier tape for electronic components is started to be wound on the take-up reel, the storage emboss 20A is curved and deformed in an arc shape along the peripheral surface of the take-up reel, and the vicinity of the central portion where deformation is most likely is in the direction of the opening 21A Bulge. Further, when the carrier tape for electronic components is wound, stress is generated and acts on the storage emboss 20A. Therefore, the storage emboss 20A is deformed, and the electronic component 10 stored in the storage emboss 20A is moved and displaced. Sometimes. Further, when handling the electronic component carrier tape, the electronic component 10 stored in the storage emboss 20A may move and be displaced due to impact or vibration.

  Next, when the assembly manufacturer mounts the electronic component 10 accommodated in the electronic component carrier tape on the circuit board, the electronic component carrier tape is set for each take-up reel in an automatic assembly apparatus such as a surface mounter, The electronic component carrier tape wound around the take-up reel is fed out, the cover tape is gradually peeled off from the surface of the sheet 2, and then the electronic component 10 is adsorbed and taken out from the storage emboss 20A of the sheet 2. The electronic component 10 can be surface-mounted on the substrate by soldering.

  When the carrier tape for electronic parts is transported from the parts maker to the assembly maker or handled, the electronic parts 10 in the storage emboss 20A may move and be displaced due to impact or vibration.

  By the way, when the electronic component 10 is a semiconductor component, specifically, a SOP (Small Outline Package) type semiconductor package 11 in which a plurality of leads 13 protrude side by side from two directions on the peripheral surface of the resin-molded package body 12. Alternatively, in the case of a QFP (Quad Flat Package) type semiconductor package 11 in which a plurality of leads 13 protrudes side by side from the four directions of the peripheral surface of the package body 12, the semiconductor package 11 stored in the storage emboss 20A is moved and positioned. If they are shifted, the lead 13 of the semiconductor package 11 comes into contact with the peripheral wall 22A and the bottom 33 of the storage emboss 20A, and as a result, the lead 13 is deformed (see FIG. 16).

  In order to deal with such a problem, conventionally, as shown in FIG. 17, a position restriction rib 40 </ b> A positioned outside the semiconductor package 11 at a certain height is formed on the storage emboss 20 </ b> A of the sheet 2. A method for preventing the lead 13 of the semiconductor package 11 from coming into contact with the peripheral wall 22A or the bottom 33 of the storage emboss 20A is proposed by straddling the rib 40A over the lead 13 of the semiconductor package 11 and positioning the rib 40A below the inner side. (See Patent Document 1). In addition, a method of projecting the position regulating rib 40A from the bottom 33 of the storage emboss 20A has been proposed (see Patent Document 2).

Japanese Patent No. 4124516 Japanese Patent Laid-Open No. 2003-81331

  However, although the methods of Patent Documents 1 and 2 can be expected to have a predetermined effect, they cannot always cope with recent changes in the structure of the semiconductor package 11 and may lead to deformation of the leads 13. This point will be described in detail. The recent semiconductor package 11 is thin with respect to the area of the package body 12 from the viewpoint of thinning and miniaturization, and may be configured to have a thickness of 3 mm or less, preferably 2 mm or less. Moreover, the leads 13 are becoming thinner from the viewpoint of high-density mounting.

  In such a thin semiconductor package 11, simply by forming the position regulating rib 40A having a certain height on the storage emboss 20A, the storage emboss 20A is deformed with a curl when manufacturing the carrier tape for electronic parts. When the storage emboss 20A is deformed during winding, handling or transportation of the carrier tape for electronic components, the lead 13 rides on the position regulating rib 40A, or the lead 13 contacts the peripheral wall 22A of the storage emboss 20A and deforms. A situation is expected (see FIGS. 17 and 18).

  Further, when the storage emboss 20A is curved and deformed, the vicinity of the central portion of the storage emboss 20A is most deformed. Therefore, the position regulating rib 40A located near the central portion of the storage emboss 20A greatly swells from the bottom side toward the opening 21A. 11 leads 13 are pushed up from below, and the lead 13 is expected to be greatly deformed (see FIGS. 18 and 19). This is because the lead 13 is particularly easily deformed when a force for deforming it outward or vertically is applied.

  If the lead 13 is greatly deformed, when the semiconductor package 11 is mounted on the circuit board, the deformed lead 13 and another adjacent lead 13 come into contact with each other to cause a short circuit or hinder the connection of the semiconductor package 11 by solder. Will be.

  The present invention has been made in view of the above, and an object of the present invention is to provide a carrier tape for an electronic component that can prevent damage to the electronic component stored in the storage emboss even if the electronic component is thin, and a method for manufacturing the same. It is said.

In the present invention, in order to solve the above problem, a long sheet wound around a take-up reel is provided with a storage emboss for storing electronic components,
The electronic component is a semiconductor package having a thickness of 3 mm or less in which a plurality of leads protrude from two or four directions on the peripheral surface of the package body.
The storage embossing is provided on the sheet, with an opening provided in the sheet, a peripheral wall extending from the periphery of the opening toward the back surface of the sheet and surrounding the semiconductor package, and being provided closer to the center of the sheet opening than the peripheral wall. A pedestal plate that partially mounts the package body, and a bottom plate that is supported by the pedestal plate and faces the package body of the semiconductor package,
The peripheral wall of the storage emboss is bent to have a substantially L-shaped cross section, and the plane is substantially non-contacting over the plurality of leads of the semiconductor package between the bottom portion and the base plate oriented in the direction of the center of the opening of the peripheral wall A frame-shaped position restriction projection is provided upright and oriented in the opening direction of the seat, and the pedestal plate is formed in a substantially planar shape surrounded by the position restriction projection, and at least near the two corners of the four corners of the pedestal plate. A plurality of flat L-shaped pedestal portions that support the package body of the semiconductor package, and a plurality of recessed portions are formed by recessing portions other than the plurality of pedestal portions so as not to contact the semiconductor package. Is set based on 1/3 of the sheet thickness <the height of the recessed portion of the pedestal plate <the height of the pedestal portion of the pedestal plate, and a cross section that defines a slight gap between the bottom plate and the package body of the semiconductor package Formed into a generally dish shape, The height of the bottom of the plate is aligned with the bottom of the peripheral wall, and the height of the position restricting rib is the highest near each pedestal and the lowest near each recessed part, and the maximum height of the position restricting protrusion is The difference between the height and the minimum height is set based on 1/3 of the sheet thickness <the difference between the maximum height and the minimum height of the position restricting protrusion <the height of the position restricting protrusion protruding from the surface of the pedestal. It is said.

A plurality of storage embosses can be arranged in the longitudinal direction of the sheet at predetermined intervals, and a cover tape covering the semiconductor package can be detachably attached to the surface of the sheet.
Further, the sheet can be provided with conductivity, and a plurality of feed holes can be drilled at a predetermined interval on at least one side of both sides in the longitudinal direction of the sheet .

Further, a position restricting protrusion is interposed between the bent bottom end of the peripheral wall of the storage emboss and the outer peripheral edge of the base plate, and a slight gap is provided between the inner peripheral edge of the base plate and the lower surface of the package body of the semiconductor package. It is possible to support a bottom plate having a substantially dish-shaped cross section that defines a gap, and to provide a through bottom hole at the bottom of the bottom plate.
In addition, the height of the pedestal plate can be gradually lowered from the pedestal portion toward the depressed portion .

In addition, the height of the position restricting protrusion can be gradually lowered from the vicinity of the pedestal portion of the pedestal plate toward the vicinity of the depressed portion .

Further, in the present invention, in order to solve the above problems, the method for manufacturing a carrier tape for electronic parts according to claim 1, 2, or 3 ,
A long sheet is sequentially fed out from the upstream side at a fixed length , and a fixed length portion of the sheet is heated and set in a mold. By this mold, a plurality of sheets are stored in a fixed length portion of the sheet. Embossing is molded at a predetermined interval, and a base plate and position restricting projections are integrally formed on the storage emboss, and at least two corners in the vicinity of the four corners of the base plate are a plurality of flat L-shaped bases. In addition, the portions other than the plurality of pedestal portions are recessed to form a plurality of recessed portions that are lower than the pedestal portion, and the position restricting rib is formed into a substantially planar shape so that its height is highest in the vicinity of each pedestal portion, and each recessed portion It is characterized in that it is the lowest in the vicinity, and then a fixed length portion of the sheet is taken out of the mold and moved downstream.

Here, the sheet in the claims may be transparent, opaque, or translucent. Further, it does not particularly ask whether there is conductivity . The vicinity of the four corners of the base plate includes at least the four corners of the base plate and the vicinity thereof.

Near the two corners of the base plate includes at least the two corners of the base plate and the vicinity thereof. Further, the position restricting projection can be formed in a substantially plane frame shape from the viewpoint of securing the rigidity of the storage emboss . The height of the position restricting projection is preferably the highest in the vicinity of the pedestal portion of the pedestal plate .

According to the present invention, when the storage emboss is bent and deformed at the time of manufacture, start of winding, winding and the like of the carrier tape for electronic parts, the pedestal plate easily swells in the opening direction of the seat. And the position restricting protrusions at the position where the base plate is easily deformed are formed low, and the amount of swelling in the opening direction of the sheet is small . Less contact with semiconductor package leads.

In addition, when an impact or vibration is applied during winding, handling, transportation, etc. of the carrier tape for electronic parts, the semiconductor package having a thickness of 3 mm or less stored in the sheet embossing is moved and tends to be displaced. However, the location where the base plate is difficult to deform and the position restricting projection at the location where the base plate is difficult to deform are formed relatively high, and the amount of deformation is small, so that the thickness of the semiconductor package is 3 mm or less. Effectively prevent misalignment by facing each other.

According to the present invention, the height of the pedestal plate and the position restricting projection is partially different from each other, and the height of the pedestal plate and the position restricting projection is lowered at the position where the pedestal plate is easily deformed. Even a thin semiconductor package having a thickness of 3 mm or less has an effect of preventing the thin semiconductor package stored in the storage emboss from being damaged.

In addition, even if the storage emboss is deformed during manufacture, winding, handling, transportation, etc. of carrier tapes for electronic parts, the lead of a thin semiconductor package with a thickness of 3 mm or less rides on or is stored in the position restricting projection. It is possible to prevent the lead from coming into contact with the peripheral wall of the emboss and deforming. In addition, even if the easily deformable part of the pedestal plate is deformed and swells, the position restricting projection of the easily deformable part of the pedestal plate is low, so that it is possible to eliminate the situation where the lead deforms by interfering with the lead of the thin semiconductor package. it can.

Also, depression of the deformable base plate and curved bulges into the opening direction of the sheet, the position regulating protrusion in the vicinity of recess is located in the most low in consideration of the amount of deformation of the vicinity of the recess portion, the thickness It is possible to eliminate a situation where the lead of the thin semiconductor package having a thickness of 3 mm or less interferes with the lead from below and the lead of the thin semiconductor package is greatly deformed. In addition, the stress relaxation effect due to deformation does not decrease, and it is possible to suppress a situation in which the lead of a thin semiconductor package having a thickness of 3 mm or less is likely to contact the position restricting protrusion. Further, since the height of the recessed portion of the pedestal plate is less than the height of the pedestal portion, the entire storage embossing becomes deep, and it is possible to prevent a situation where it is difficult to wind the sheet on the take-up reel. In addition, the stress relaxation effect due to deformation is less likely to be reduced, and it is possible to suppress a situation in which a thin semiconductor package lead having a thickness of 3 mm or less is likely to contact the position restricting protrusion. Furthermore, since the strength of the storage embossing can be maintained by the position restricting protrusion, it is possible to easily hold a thin semiconductor package having a thickness of 3 mm or less.

According to the second aspect of the present invention, the height of the pedestal plate does not change suddenly from the pedestal portion toward the depressed portion, but changes smoothly and gradually. It becomes possible to prevent damage.

According to the third aspect of the present invention, the height of the position restricting protrusion is not abruptly changed from the vicinity of the pedestal portion of the pedestal plate to the vicinity of the depressed portion, but gradually changes smoothly. It is possible to increase the strength and prevent deformation and breakage.

It is explanatory drawing which shows typically the state which wound the carrier tape for electronic components in the winding reel in embodiment of the carrier tape for electronic components which concerns on this invention. It is a plane explanatory view showing typically an embodiment of a carrier tape for electronic parts concerning the present invention. It is plane explanatory drawing which shows typically the accommodation embossing in embodiment of the carrier tape for electronic components which concerns on this invention. It is a section explanatory view showing typically the storage embossing in the embodiment of the carrier tape for electronic parts concerning the present invention. It is plane explanatory drawing which shows typically the state which accommodated the semiconductor package in the accommodation emboss in embodiment of the carrier tape for electronic components which concerns on this invention. It is a section explanatory view showing typically the state where a semiconductor package was stored in storage embossing in an embodiment of a carrier tape for electronic parts concerning the present invention. It is a section explanatory view showing typically the deformation state of the storage emboss in the embodiment of the carrier tape for electronic parts concerning the present invention. It is plane explanatory drawing which shows typically the accommodation embossing in 2nd Embodiment of the carrier tape for electronic components which concerns on this invention. It is sectional explanatory drawing which shows typically the accommodation embossing in 2nd Embodiment of the carrier tape for electronic components which concerns on this invention. It is a plane explanatory view showing typically the state where a semiconductor package was stored in storage embossing in a 2nd embodiment of a carrier tape for electronic parts concerning the present invention. It is sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the accommodation embossing in 2nd Embodiment of the carrier tape for electronic components which concerns on this invention. It is plane explanatory drawing which shows typically the accommodation embossing in 3rd Embodiment of the carrier tape for electronic components which concerns on this invention. It is sectional explanatory drawing which shows typically the accommodation embossing in 3rd Embodiment of the carrier tape for electronic components which concerns on this invention. It is plane explanatory drawing which shows typically the state which accommodated the semiconductor package in the accommodation embossing in 3rd Embodiment of the carrier tape for electronic components which concerns on this invention. It is sectional explanatory drawing which shows typically the state which accommodated the semiconductor package in the accommodation embossing in 3rd Embodiment of the carrier tape for electronic components which concerns on this invention. It is sectional explanatory drawing which shows the storage emboss of the carrier tape for electronic components in the past, and the semiconductor package which is an electronic component displaced. It is plane explanatory drawing which shows the accommodation emboss with the position control rib of the carrier tape for electronic components in the past, and the semiconductor package displaced. It is sectional explanatory drawing which shows the accommodation emboss with the position control rib of the carrier tape for electronic components in the past, and the semiconductor package displaced. It is a partial expanded sectional view which shows the relationship between the position regulation rib of the carrier tape for electronic components in the past, and the lead | read | reed of the semiconductor package displaced.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A carrier tape for an electronic component in the present embodiment is a long length wound around a take-up reel 1 as shown in FIGS. The thin sheet 2 is provided with a plurality of storage embosses 20 for storing the thin semiconductor package 11 as the electronic component 10, and between the peripheral wall 22 of each storage emboss 20 and the base plate 25, The position restricting ribs 40 are formed, and the heights of the base plate 25 and the position restricting ribs 40 are partially different from each other, and these 25 and 40 are lowered at places where the base plate 25 is easily deformed.

  As shown in FIG. 1, the take-up reel 1 is standardized to a predetermined size according to the application, and the sheet 2 is record-wound in one line or traverse-wound in a plurality of lines, It is set in an automatic assembly apparatus (for example, a surface mounter). The take-up reel 1 includes a general-purpose resin-made normal take-up reel excellent in versatility, a conductive take-up reel in which carbon or the like is blended, an anti-static take-up reel in which an anti-static effect is applied to the normal take-up reel, There are various types such as a lightweight foam core take-up reel, but it is not particularly limited as long as it can be set in an inspection device, an automatic assembly device or the like.

  As shown in part in FIG. 2, the sheet 2 is formed in, for example, a long band shape, and a plurality of storage embosses 20 are arranged in parallel in the longitudinal direction at a constant interval, and a plurality of feeding embossments 20 are provided on both sides in the longitudinal direction. The holes 3 are respectively perforated at regular intervals, and a cover tape for covering and protecting the semiconductor package 11 accommodated in the storage emboss 20 is attached to the surface so as to be peelable later.

  The material of the sheet 2 is not particularly limited, but transparent polystyrene having excellent versatility, A-PET, polyethylene terephthalate having excellent strength, polypropylene having excellent chemical resistance, ABS having excellent mechanical properties and moldability. Examples thereof include resins, polycarbonates having excellent impact resistance and dimensional stability. In order to prevent static electricity from being discharged into the air, an antistatic type in which an antistatic effect is applied to polystyrene or the like is used. When it is desired to prevent the generation of static electricity, a conductive type in which carbon or the like is blended with polystyrene or A-PET is used.

  The width of the sheet 2 is adjusted to a standardized length such as 12, 16, 24, 32, 44, 56, 72 mm, for example. The thickness of the sheet 2 is not particularly limited, but is 0.17 to 0.50 mm, preferably 0.25 to 0.40 mm, more preferably from the viewpoint of achieving both flexibility and strength. Thinness around 0.30 mm is good. Further, the cover tape is not particularly limited. For example, a base material such as a polyester film, a polyethylene terephthalate film, or a polyethylene film has a room temperature adhesive pressure-sensitive adhesive layer or a heat-fusible pressure-sensitive adhesive layer. A stacked type is used. The cover tape includes a conductive type, an antistatic type, and a transparent type.

  As shown in FIG. 5 and FIG. 6 and the like, the thin semiconductor package 11 is a surface mount type of QFP, LQFP, and TQFP having a thickness of 3 mm or less. A plurality of leads 13 straddling the position restricting ribs 40 of the storage emboss 20 from the direction protrude outside, and each lead 13 is thinly bent into a gull wing shape (L-shape). After the electronic component carrier tape is set in the automatic assembling apparatus together with the take-up reel 1, the semiconductor package 11 is taken out from the storage emboss 20 by the automatic assembling apparatus and is surface-mounted on the circuit board.

  As shown in FIGS. 3 and 4, each storage emboss 20 includes an opening 21 perforated in the sheet 2, a peripheral wall 22 extending from the peripheral edge of the opening 21 toward the back surface of the sheet 2, and the peripheral wall 22. A flat frame-shaped pedestal plate 25 that is provided on the center side of the opening 21 of the sheet 2 and on which the semiconductor package 11 is mounted, and a bottom plate 31 that is supported by the pedestal plate 25 and contacts the peripheral surface of the take-up reel 1. Between the bottom 24 of the peripheral wall 22 and the pedestal plate 25, a planar frame-shaped position regulating rib 40 facing the semiconductor package 11 is interposed, and is integrally formed in a pocket shape of a predetermined depth. Is done.

  The opening 21 and the bottom plate 31 of the sheet 2 are both formed in a planar rectangle (specifically, a square), and the opening 21 is formed in a size corresponding to the size of the semiconductor package 11. On the other hand, unlike the opening 21, the bottom plate 31 is formed smaller than the package body of the semiconductor package 11.

  The peripheral wall 22 is formed in a rectangular tube shape that is longer (higher) than the thickness of the semiconductor package 11, and is bent to have a substantially L-shaped cross section, and is directed toward the back surface of the sheet 2 (downward direction in FIGS. 4 and 6). Accordingly, the semiconductor package 11 is gradually inclined slightly toward the center of the opening 21 of the sheet 2. The bottom portion 24 bent from the lower end of the wall portion 23 of the peripheral wall 22 is flattened and directed toward the center portion of the opening 21 of the sheet 2 and contacts the peripheral surface of the take-up reel 1. A position regulating rib 40 that stands in the direction toward the opening 21 of the sheet 2 is integrally provided at the tip of the bottom 24.

  The pedestal plate 25 is formed in a planar frame shape surrounded by the position regulating rib 40 by combining a plurality of straight partition sides 26 vertically and horizontally, and between the opening 21 of the seat 2 and the bottom 24 of the peripheral wall 22. And surrounds the bottom plate 31 and partially mounts the lower surface of the package body 12 in the semiconductor package 11. From the viewpoint of protecting the leads 13 of the semiconductor package 11, the pedestal plate 25 is formed so that the heights of the four corner portions 27 and the central portions 29 of the partition sides 26 are different and uneven.

  That is, the pedestal plate 25 has four corners 27, in other words, intersecting portions of a plurality of partition sides 26 are plane L-shaped pedestal portions 28, and the plurality of pedestal portions 28 are package bodies 12 in the semiconductor package 11. The four corners of the lower surface of the contact are supported. The plurality of pedestal portions 28 are formed by raising the vicinity of the four corners 27 of the pedestal plate 25 in the direction of the opening 21 of the seat 2 in a plane L shape as necessary.

  On the other hand, the portions other than the plurality of pedestal portions 28, in other words, the central portion vicinity 29 of each partition side 26 is recessed toward the bottom plate 31 so as not to contact the peripheral surface of the lower surface of the semiconductor package 11, and more than the pedestal portion 28. The lower and lower depressions 30 are used. The plurality of depressions 30 are recessed and positioned at positions lower than the plurality of pedestal portions 28, thereby positioning each pedestal portion 28 relatively high. The plurality of pedestal portions 28 and the depressed portions 30 are formed in a relationship of decreasing from the relatively higher pedestal portion 28 direction toward the lower depressed portion 30 direction.

The height (dent amount) of the depressed portion 30 of the base plate 25 is set based on the following formula. That is,
1/3 of the sheet thickness <the height of the recessed portion of the pedestal plate <the height of the pedestal portion of the pedestal plate (Formula 1)
Is set based on

  Here, the thickness of the sheet 2 is 1/3 because when the thickness is 1/3 or less, the stress relaxation effect due to deformation is reduced, and the lead 13 of the semiconductor package 11 is likely to come into contact with the position regulating rib 40. is there. Further, the height of the depressed portion 30 of the pedestal plate 25 is a height (height) from the depressed start position of the depressed portion 30 to the depressed end position. In addition, the height of the recessed portion 30 of the pedestal plate 25 is less than the height of the pedestal portion 28. If the recessed portion 30 height of the pedestal plate 25 is equal to or higher than the height of the pedestal portion 28, the entire storage emboss 20 becomes deeper. This is because the sheet 2 cannot be taken up on the take-up reel 1.

  Since the pedestal plate 25 is a place where each pedestal portion 28 intersects with a plurality of partition sides 26, the pedestal plate 25 has a characteristic that it hardly deforms at the time of winding, handling, transporting, etc. of the carrier tape for electronic parts. On the other hand, among the plurality of recessed portions 30 of the base plate 25, at least the recessed portions 30 of the pair of left and right partition sides 26, in other words, a pair of left and right partition sides in the longitudinal direction of the seat 2 (left and right direction in FIG. 2). The vicinity 29 of the central portion 26 has a characteristic that the sheet 2 is most deformed in the direction of the opening 21 of the sheet 2 and curved like a bow because the sheet 2 is curved and warped in the longitudinal direction.

  The bottom plate 31 is formed in a substantially dish-shaped cross section, and its peripheral edge inclined upward is connected to the inner peripheral edge of the pedestal plate 25, and the flat bottom is aligned with the height of the bottom 24 of the peripheral wall 22. The semiconductor package 11 is opposed to the vicinity of the central portion excluding the peripheral portion of the lower surface of the package main body 12, and a slight gap is defined between them, and the peripheral surface of the take-up reel 1 is contacted.

  As shown in FIG. 2, a round through bottom hole 32 is arbitrarily drilled as needed at the bottom center of the bottom plate 31, and this through bottom hole 32 is taken out from the storage emboss 20 of the semiconductor package 11, It is used for confirmation of presence / absence, attitude control of the semiconductor package 11 using vacuum, and the like. Such a bottom plate 31 contributes to the flattening of the surface of the base plate 25 and functions to stabilize the posture of the semiconductor package 11 inserted and housed.

  As shown in FIGS. 3 and 4, the position restricting rib 40 is formed in a narrow flat frame shape surrounding the base plate 25, and between the end of the peripheral wall 22 bottom 24 and the outer peripheral edge of the base plate 25. Is located lower than the opening 21 of the storage emboss 20, straddles the plurality of leads 13 of the semiconductor package 11, and is separated without contacting each lead 13.

  The position regulating rib 40 is formed to be shorter than the height of the peripheral wall 22 and is opposed to the substantially lower half of the inner surface of the wall 23, and the plurality of leads 13 of the semiconductor package 11 are placed in the gap between the wall 23. Accommodate. From the viewpoint of protecting the lead 13 of the semiconductor package 11, the height of the position restricting rib 40, specifically, the upper end portion of the position restricting rib 40 connected to the pedestal plate 25 is different from the conventional example. The height is different between the vicinity of the pedestal portion 28 and the vicinity of the depressed portion 30 so as to be uneven.

  That is, as shown in FIG. 3 and FIG. 4, the position restricting rib 40 is formed in a substantially L-shaped plane in the vicinity of each pedestal portion 28 where the pedestal plate 25 is difficult to deform, and each pedestal plate 25 is easily deformed. In the vicinity of the depressed portion 30, it is the lowest in a plane substantially I-shaped, and between each of the pedestal portions 28 of the pedestal plate 25 and the vicinity of each of the depressed portions 30 abruptly and linearly inclines and becomes lower. . Such a position regulating rib 40 is formed to be relatively high in each pedestal portion 28 by being formed lowest in the vicinity of each depression 30.

The difference (dent amount) between the maximum height and the minimum height of the position regulating rib 40 is set based on the following equation. That is,
1/3 of sheet thickness <difference between maximum height and minimum height of position restricting rib <height of position restricting rib protruding from the surface of the pedestal portion (Formula 2)
Is set based on

  Here, the thickness of the sheet 2 is 1/3 because when the thickness is 1/3 or less, the stress relaxation effect due to deformation is reduced, and the lead 13 of the semiconductor package 11 is likely to come into contact with the position regulating rib 40. is there. Further, the maximum height of the position restricting rib 40 is the maximum height of the position restricting rib 40 protruding from the surface of the pedestal portion 28 of the pedestal plate 25. On the other hand, the minimum height of the position restriction rib 40 is the minimum height of the position restriction rib 40 protruding from the surface of the pedestal portion 28.

  The difference between the maximum height and the minimum height is a value obtained by subtracting the minimum height from the maximum height of the position regulating rib 40 protruding from the surface of the pedestal portion 28. Further, the difference between the maximum height and the minimum height of the position restricting rib 40 is less than the height of the position restricting rib 40 protruding from the surface of the pedestal portion 28. The difference between the maximum height and the minimum height protrudes from the surface of the pedestal portion 28. When the height of the regulating rib 40 is not less than the height, the position regulating rib 40 cannot maintain the strength of the storage embossing 20 and it is based on the reason that it is difficult to hold the semiconductor package 11.

  The difference (indentation amount) between the maximum height and the minimum height of the position regulating rib 40 depends on the type and size of the semiconductor package 11, but is, for example, 0.10 to 0.40 mm, preferably 0.10 to 0.38 mm. More preferably, it is set within the range of 0.10 to 0.35 mm.

  The inner surface of the position regulating rib 40 in the vicinity of each pedestal portion 28 of the pedestal plate 25 is positioned and opposed to the peripheral surface side of the package body 12 of the semiconductor package 11 when the semiconductor package 11 is fitted and stored in the storage emboss 20. On the other hand, the outer surface of the position restricting rib 40 in the vicinity of each pedestal portion 28 is bent to be obliquely below the lead 13 protruding from the peripheral surface of the package body 12 when the semiconductor package 11 is fitted and stored in the storage emboss 20. It faces the inside of the part via a clearance and protects the lead 13 in a non-contact state.

  When the semiconductor package 11 is inserted and stored in the storage emboss 20, the inner surface of the position regulating rib 40 in the vicinity of each depressed portion 30 of the base plate 25 is positioned below the peripheral surface side of the package body 12 of the semiconductor package 11 and slightly. Oppositely, the outer surface is opposed to the inside of a bent portion that is bent obliquely below the lead 13 protruding from the peripheral surface of the package body 12 via a clearance. The position restricting rib 40 in the vicinity of the depressed portion 30 is not zero, but is formed to be the shortest and shortest. Therefore, the facing range of the semiconductor package 11 with respect to the peripheral surface of the package body 12 is narrowed. The position regulating rib 40 in the vicinity of the depressed portion 30 functions to prevent the storage emboss 20 from being twisted or deformed and to maintain the shape of the storage emboss 20.

  In the above configuration, when manufacturing a carrier tape for electronic parts, first, a continuous long sheet 2 and a predetermined manufacturing apparatus are prepared, and the sheets 2 are sequentially sequentially from the upstream side of the manufacturing apparatus at a certain length. The sheet 2 is fed out, and a certain length portion of the sheet 2 is heated and softened by a heater or the like and set in a dedicated mold (not shown).

  When the fixed length portion of the sheet 2 is set in the mold in this manner, the mold is clamped or the like to form a plurality of storage embosses 20 into the fixed length portion of the sheet 2 at regular intervals, and each storage emboss is formed. 20, the base plate 25 and the position restricting rib 40 are integrally formed, and the height of the base plate 25 and the position restricting rib 40 are partially different from each other. While making each low, it makes relatively high in the base part 28 which the base plate 25 is hard to deform | transform, and its vicinity.

  As the molding method, (1) a press molding method for molding the storage emboss 20 by sandwiching the heat-softened sheet 2 between the convex and concave molds, and (2) heat-softening the concave mold of the mold. The compressed air forming method for forming the storage emboss 20 by pressing the sheet 2 with compressed air, (3) The gap between the mold and the heat-softened sheet 2 is evacuated, and the sheet 2 is brought into close contact with the mold to store emboss (4) Vacuuming the inside of the mold and adsorbing the heat-softened sheet 2 to the convex mold or concave mold of the mold while rotating the mold, the storage emboss 20 And vacuum rotary molding method for molding the material. These molding methods are not particularly limited, and any of them may be used. However, the press molding method (1) and the pneumatic molding method (2) can accurately and easily cope with the complicated internal shape and R of the storage emboss 20. Is preferred.

  When the base plate 25 and the position regulating rib 40 are integrally formed in each storage emboss 20, the mold is opened after cooling the sheet 2 and the storage emboss 20, and both sides of a certain length portion of the sheet 2 taken out from the mold A plurality of feed holes 3 are perforated at regular intervals, and then a certain length portion of the sheet 2 is moved to the downstream side of the manufacturing apparatus and wound on an empty take-up reel 1 for electronic components. A carrier tape can be manufactured.

  At this time, if the fixed length portion of the sheet 2 is not a predetermined width dimension, the fixed length portion of the sheet 2 taken out from the mold is slit to a predetermined width dimension to adjust the size. A plurality of feed holes 3 can be perforated at regular intervals on both sides of a certain length portion of the sheet 2. The plurality of feed holes 3 may be perforated before the storage emboss 20 is molded, or may be perforated together with the storage emboss 20 at the time of molding.

  Next, when the semiconductor package 11 is inserted and stored in the manufactured carrier tape for electronic components, the semiconductor package 11 is sequentially inserted and stored in the plurality of storage embosses 20 of the sheet 2 as in the conventional example. After the cover tape is heated and fused to the surface, a carrier tape for electronic parts having a predetermined length is wound around the take-up reel 1.

  When the carrier tape for electronic components is started to be wound on the take-up reel 1, the peripheral wall bottom 24 and the bottom plate 31 of the storage emboss 20 come into contact with the peripheral surface of the take-up reel 1, as shown in FIG. The embossed storage 20 is curved and deformed in an arc shape from the bottom plate 31 side toward the opening 21 along the peripheral surface of the base plate 25, and the most deformable depressed portion 30 of the base plate 25 bulges toward the opening 21. 30 and the position restricting rib 40 in the vicinity of the depressed portion 30 are formed to be the lowest and have a small amount of bulging with respect to the direction of the opening 21, so that they swell greatly in the direction of the opening 21 and press against the leads 13 of the semiconductor package 11 without being pushed up. . Therefore, large deformation of the lead 13 can be prevented very effectively.

  Further, when winding or handling the carrier tape for electronic components, stress is generated and the storage emboss 20 is deformed, and the semiconductor package 11 in the storage emboss 20 may be displaced from front to back and left and right. The position restricting rib 40 in the vicinity of the pedestal portion 28 of the plate 25 is strong in the pedestal portion 28 and has a small amount of deformation. Therefore, the position restricting rib 40 contacts the package main body 12 of the semiconductor package 11 to prevent displacement and to prevent dropping. Or Therefore, the function and performance of the semiconductor package 11 can be maintained without the lead 13 being deformed or damaged due to the positional deviation of the semiconductor package 11.

  Next, when the semiconductor package 11 fitted and stored in the electronic component carrier tape is mounted on the circuit board, the electronic component carrier tape wound around the take-up reel 1 of the automatic assembly apparatus is fed out as in the conventional example. Then, the semiconductor package 11 is surface-mounted by solder on the circuit board.

  When the carrier tape for electronic parts is transported from the parts maker to the assembly maker or handled, the semiconductor package 11 in the storage emboss 20 may be displaced from front to back and left and right. The position restricting rib 40 in the vicinity of 28 contacts the peripheral surface of the package body 12 of the semiconductor package 11 and restricts the position. Due to this position regulating action, the lead 13 of the semiconductor package 11 is not deformed or damaged, so that the function and performance of the semiconductor package 11 can be expected to be maintained.

  According to the above configuration, even if the storage emboss 20 is deformed by winding the electronic component carrier tape, or when the storage emboss 20 is deformed during winding, handling, transportation, etc. of the carrier tape for electronic components, It is possible to eliminate a situation in which the thin lead 13 of the thin semiconductor package 11 rides on the position regulating rib 40 or the thin lead 13 comes into contact with the peripheral wall 22 of the storage emboss 20 to be deformed.

  Further, even if the depressed portion 30 of the base plate 25 that is most easily deformed swells and curves in the direction of the opening 21, the position regulating rib 40 in the vicinity of the depressed portion 30 is positioned lowest considering the amount of deformation in the vicinity of the depressed portion 30. Therefore, it is possible to eliminate a situation in which the thin lead 13 of the semiconductor package 11 interferes from below and the lead 13 is greatly deformed. As described above, since the large deformation of the lead 13 can be suppressed and prevented, when the semiconductor package 11 is mounted on the circuit board, the largely deformed lead 13 and another adjacent lead 13 do not contact and short-circuit. . In addition, the connection of the semiconductor package 11 by solder is not hindered.

  Next, FIGS. 8 to 11 show a second embodiment of the present invention. In this case, the height of the pedestal plate 25 is smoothly inclined from each pedestal portion 28 toward the depressed portion 30. The position restricting rib 40 is gradually lowered from the vicinity of each pedestal portion 28 to the vicinity of the depressed portion 30 while being smoothly inclined. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In the present embodiment, the same effect as the above embodiment can be expected, and the height of the base plate 25 and the position regulating rib 40 does not change suddenly and linearly, but is inclined in a relatively wide range. Obviously, the strength of the position restricting rib 40 can be increased to prevent deformation and breakage.

  Next, FIGS. 12 to 15 show a third embodiment of the present invention. In this case, the height of the pedestal plate 25 is smoothly continued from each pedestal portion 28 toward the depressed portion 30. The height of the position restricting rib 40 is gradually lowered while smoothly and continuously curving from the vicinity of the pedestal portion 28 to the vicinity of the depressed portion 30 of the pedestal plate 25. Yes. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  Also in this embodiment, the same effect as the above embodiment can be expected, and the height of the base plate 25 and the position regulating rib 40 changes smoothly and continuously, which is effective for stress relaxation. Further, the semiconductor package 11 can be positioned with high accuracy, and interference with the leads 13 of the semiconductor package 11 can be prevented over a wide range.

  In the above-described embodiment, the plurality of feed holes 3 are formed at both sides in the longitudinal direction of the sheet 2 at a predetermined interval. However, the plurality of feed holes 3 are formed at only one side in the longitudinal direction of the sheet 2 at a predetermined interval. May be perforated. The semiconductor package 11 may be an SOP, SSOP, TSOP type or the like having a thickness of 3 mm or less, or a QFP or SOP type having a thickness of 3 mm or more. In the case where the semiconductor package 11 is of the SOP type, the storage emboss 20 is formed in a planar rectangle instead of a planar square.

  Further, among the four corners of the pedestal portion 28 of the pedestal plate 25, the height of the position regulating ribs 40 in the vicinity of the pedestal portions 28 at the three corners may be higher than the position regulating ribs 40 at other locations, or on a diagonal line. The height of the position restricting ribs 40 in the vicinity of the pedestal portions 28 at the two corners can be made higher than the position restricting ribs 40 at other locations. Furthermore, although the height of the position restricting rib 40 in the vicinity of the recessed portion 30 of each partition side 26 may be minimized, when the semiconductor package 11 is a surface mount type of SOP, it is viewed from two directions on the peripheral surface of the package body 12. Since the plurality of leads 13 protrude side by side, only the height of the position regulating rib 40 in the vicinity of the depressed portion 30 of the pair of left and right partition sides 26 may be made the lowest.

  Examples of the carrier tape for electronic parts and the manufacturing method thereof according to the present invention will be described below together with comparative examples.

[Example 1]
First, a continuous long sheet is prepared, a fixed length portion of the sheet is heated and softened by a heater and set in a dedicated mold, and the mold is clamped to fix a fixed length portion of the sheet. A plurality of storage embosses were press-formed at regular intervals, and a base plate and a position regulating rib were integrated into each storage emboss.

  The sheet was a conductive type made of commercially available polystyrene having a width of 44 mm and a thickness of 0.3 mm. Each storage emboss was press-molded to a size corresponding to a surface-mount type semiconductor package having an outer dimension of 24 mm × 24 mm. Further, the position regulating rib was press-molded into the shape of the first embodiment. The maximum height of the position regulating rib in the vicinity of the pedestal portion of the pedestal plate was 0.35 mm. The difference between the maximum height and the minimum height of the pedestal portion of the pedestal plate (the amount of dent) and the difference between the maximum height and the minimum height of the position regulating rib (the amount of dent) were both 0.10 mm.

  After press-molding multiple storage embosses on a sheet, after cooling the storage embossing, open the mold, remove the mold and remove multiple feed holes on both sides of a certain length of the sheet. Then, the carrier tape for electronic parts shown in FIG. 2 was manufactured by moving a certain length of the sheet to the downstream side and winding it on an empty take-up reel. As the take-up reel, a type having a core diameter of φ80 to 320 mm was selected, and a 20 m carrier tape for electronic parts was taken up.

  Subsequently, the manufactured carrier tape for electronic components is stored in an environment of 40 ° C. × 24 hours, and the curvature value of the curved storage emboss of the carrier tape for electronic components is determined by a depth of focus meter (manufactured by Union Co., Ltd .: non-contact level difference measuring instrument). The measurement results are shown in Table 1. As a result of the measurement, the curvature value of the storage emboss was 0.35 mm.

  Next, the semiconductor package of the above size is inserted and stored in the storage emboss of the carrier tape for electronic components drawn out from the take-up reel, and a cover tape is attached to the surface of the sheet, and the carrier tape for electronic components is attached to the take-up reel. It was wound again. The lead of the semiconductor package and the position regulating rib of the storage emboss were opposed to each other through a clearance.

  When the carrier tape for electronic parts was wound around the take-up reel, the take-up reel was packed into a packaged product, and the packaged product was dropped from a height of about 1 m to perform a drop test. This drop test was performed with the three surfaces, one edge, and one corner of the packaged product facing downward. After completion of the drop test, the presence or absence of deformation of the lead of the semiconductor package was visually confirmed or measured, and the results were examined and evaluated in Table 1. In the evaluation, when the clearance between the lead of the semiconductor package and the position restricting rib of the storage emboss exceeded 0 mm, it was judged as acceptable (OK), and when it was less than 0 mm, it was judged as unacceptable (NG).

[Example 2]
Although it was basically the same as in Example 1, the difference between the maximum height and the minimum height of the pedestal portion of the pedestal plate (the amount of dents) and the difference between the maximum height and the minimum height of the position regulating ribs (the amount of dents) were , Both were changed to 0.15 mm. Further, the curvature value of the storage emboss was changed to 0.31 mm.
Example 3
Although it was basically the same as in Example 1, the difference between the maximum height and the minimum height of the pedestal portion of the pedestal plate (the amount of dents) and the difference between the maximum height and the minimum height of the position regulating ribs (the amount of dents) were , Both were changed to 0.20 mm. Further, the curvature value of the storage emboss was changed to 0.26 mm.

Example 4
Although it was basically the same as in Example 1, the difference between the maximum height and the minimum height of the pedestal portion of the pedestal plate (the amount of dents) and the difference between the maximum height and the minimum height of the position regulating ribs (the amount of dents) were , Both were changed to 0.25 mm. In addition, the curvature value of the storage emboss was changed to 0.19 mm.

Example 5
Basically the same as in Example 1, but the difference between the maximum height and the minimum height (dent amount) of the pedestal portion of the base plate and the difference between the maximum height and the minimum height (dent amount) of the position regulating rib are Was also changed to 0.30 mm. Further, the curvature value of the storage emboss was set to 0.12 mm.
Example 6
Basically the same as in Example 1, but the difference between the maximum height and the minimum height (dent amount) of the pedestal portion of the base plate and the difference between the maximum height and the minimum height (dent amount) of the position regulating rib are Was also changed to 0.35 mm. Further, the curvature value of the storage emboss was set to 0.04 mm.

Example 7
The base plate and the position regulating rib of each storage emboss were formed in the shape of the second embodiment, and the others were the same as in Example 3.
Example 8
The base plate and the position regulating rib of each storage emboss were formed in the shape of the third embodiment, and the others were the same as in Example 3.

[Comparative Example 1]
A continuous long sheet is prepared, this sheet is preheated by a heater and set in a dedicated mold, and the mold is clamped to press multiple storage embosses at regular intervals in the longitudinal direction of the sheet. And the conventional position control rib shown in FIG.18 and FIG.19 was integrated with each accommodation emboss. About the magnitude | size of the sheet | seat and each accommodation embossing, it was set as the same as the Example. The position restricting rib is a conventional type in which the height is always 0.35 mm and constant, and the difference between the maximum height and the minimum height (dent amount) is 0.00 mm.

  When a plurality of storage embosses were press-molded on a sheet and a position regulating rib having a constant height was integrated with each storage emboss, a carrier tape for electronic parts was manufactured by the same manufacturing method as in the example. The take-up reel was the same as in the example.

  Next, the manufactured carrier tape for electronic parts is stored in the same environment as in the example, and the curvature value of the curved storage emboss of the carrier tape for electronic parts is measured with a depth of focus meter (manufactured by Union: non-contact level difference measuring instrument). The measurement results are shown in Table 2. As a result of the measurement, the curvature value of the storage emboss was 0.54 mm.

  Next, the semiconductor package of the above size is inserted and stored in the storage emboss of the carrier tape for electronic components drawn out from the take-up reel, and a cover tape is attached to the surface of the sheet, and the carrier tape for electronic components is attached to the take-up reel. It was wound again. The lead of the semiconductor package and the position regulating rib of the storage emboss were opposed to each other through a clearance.

  When the carrier tape for electronic parts was wound around the take-up reel, the take-up reel was packed into a packaged product, and the packaged product was dropped from a height of about 1 m to perform a drop test. This drop test has the same contents as the example, and after the test is completed, the presence or absence of deformation of the lead of the semiconductor package is visually confirmed or measured, and the result is described in Table 2. evaluated. The evaluation criteria were the same as in the examples.

[Comparative Example 2]
The carrier tape for electronic parts is configured as shown in FIG. 16, and the position regulating rib is not integrated with the storage emboss of the sheet and is omitted. Except for this position regulating rib, the same as in Comparative Example 1, but the curvature value of the storage emboss was 0.42 mm.

In the case of Examples 1 to 8, as shown in Table 1, the clearance between the lead of the semiconductor package and the position restricting rib of the storage emboss exceeds 0 mm, and no deformation is seen in the lead of the semiconductor package, which is very good. The result was obtained. From these Examples 1 to 8, it was found that if the difference (dent amount) between the maximum height and the minimum height of the position regulating rib is set to 0.10 mm or more, the lead of the semiconductor package does not deform.
Even when the position regulating rib was changed to the shape of the second and third embodiments and press-molded, the leads of the semiconductor package were not deformed, and good results could be obtained.

  On the other hand, in Comparative Examples 1 and 2, the lead of the semiconductor package was deformed, and sufficient results could not be obtained.

  The carrier tape for electronic parts and the manufacturing method thereof according to the present invention are used in the field of manufacturing machinery, electricity, electronics, semiconductors, liquid crystals, and the like.

1 take-up reel 2 sheet 10 electronic component 11 semiconductor package 12 package body 13 lead 20 storage emboss 21 opening 22 peripheral wall 23 wall 24 bottom 25 pedestal plate 26 partition side 27 near four corners 28 pedestal plate 29 near central portion 30 depressed portion 31 Bottom plate 40 Position restriction rib (position restriction protrusion)

Claims (4)

An electronic component carrier tape provided with a storage emboss for storing an electronic component on a long sheet wound on a take-up reel ,
The electronic component is a semiconductor package having a thickness of 3 mm or less in which a plurality of leads protrude from two or four directions on the peripheral surface of the package body.
The storage embossing is provided on the sheet, with an opening provided in the sheet, a peripheral wall extending from the periphery of the opening toward the back surface of the sheet and surrounding the semiconductor package, and being provided closer to the center of the sheet opening than the peripheral wall. A pedestal plate that partially mounts the package body, and a bottom plate that is supported by the pedestal plate and faces the package body of the semiconductor package,
The peripheral wall of the storage emboss is bent to have a substantially L-shaped cross section, and the plane is substantially non-contacting over the plurality of leads of the semiconductor package between the bottom portion and the base plate oriented in the direction of the center of the opening of the peripheral wall A frame-shaped position restriction projection is provided upright and oriented in the opening direction of the seat, and the pedestal plate is formed in a substantially planar shape surrounded by the position restriction projection, and at least near the two corners of the four corners of the pedestal plate. A plurality of flat L-shaped pedestal portions that support the package body of the semiconductor package, and a plurality of recessed portions are formed by recessing portions other than the plurality of pedestal portions so as not to contact the semiconductor package. Is set based on 1/3 of the sheet thickness <the height of the recessed portion of the pedestal plate <the height of the pedestal portion of the pedestal plate, and a cross section that defines a slight gap between the bottom plate and the package body of the semiconductor package Formed into a generally dish shape, The height of the bottom of the plate is aligned with the bottom of the peripheral wall, and the height of the position restricting rib is the highest near each pedestal and the lowest near each recessed part, and the maximum height of the position restricting protrusion is The difference between the height and the minimum height is set based on 1/3 of the sheet thickness <the difference between the maximum height and the minimum height of the position restricting protrusion <the height of the position restricting protrusion protruding from the surface of the pedestal. Carrier tape for electronic parts. The carrier tape for electronic components according to claim 1 , wherein the height of the base plate is gradually lowered from the base portion toward the depressed portion. The carrier tape for electronic parts according to claim 1 or 2 , wherein the height of the position restricting protrusion is gradually lowered from the vicinity of the pedestal portion of the pedestal plate to the vicinity of the depressed portion. It is a manufacturing method of the carrier tape for electronic parts according to claim 1, 2, or 3 .
A long sheet is sequentially fed out from the upstream side at a fixed length , and a fixed length portion of the sheet is heated and set in a mold. By this mold, a plurality of sheets are stored in a fixed length portion of the sheet. Embossing is molded at a predetermined interval, and a base plate and position restricting projections are integrally formed on the storage emboss, and at least two corners in the vicinity of the four corners of the base plate are a plurality of flat L-shaped bases. In addition, the portions other than the plurality of pedestal portions are recessed to form a plurality of recessed portions that are lower than the pedestal portion, and the position restricting rib is formed into a substantially planar shape so that its height is highest in the vicinity of each pedestal portion, and each recessed portion A method of manufacturing a carrier tape for electronic parts, characterized in that it is lowest in the vicinity, and then a fixed length portion of the sheet is taken out of the mold and moved downstream.

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