JPH0378771U - - Google Patents

Info

Publication number
JPH0378771U
JPH0378771U JP13946389U JP13946389U JPH0378771U JP H0378771 U JPH0378771 U JP H0378771U JP 13946389 U JP13946389 U JP 13946389U JP 13946389 U JP13946389 U JP 13946389U JP H0378771 U JPH0378771 U JP H0378771U
Authority
JP
Japan
Prior art keywords
mounted electronic
electronic component
component storage
storage band
band
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13946389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13946389U priority Critical patent/JPH0378771U/ja
Publication of JPH0378771U publication Critical patent/JPH0378771U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aは本考案の表面実装電子部品収納帯の
外観斜視図であり、第1図bは同図a中X−X線
断面図である。第2図a〜fは収納凹部の底面に
形成した突出部の他の実施例を示し、第2図a〜
c及び第2図eは夫々の他の実施例の部分平面図
であり、第2図dは同じく部分断面図であり、第
2図fは第2図e中Y−Y線断面図である。第3
図は従来の電子部品収納帯の外観斜視図であり、
第4図a〜bは、従来の電子部品収納帯の収納凹
部の部分断面図である。 1,31……テープ状部材、2,32……収納
凹部、3……表面実装電子部品、4,34……カ
バーテープ、5……送り穴、6a,6b,26a
〜26n……突出部、21……底面。
FIG. 1a is an external perspective view of the surface-mounted electronic component storage band of the present invention, and FIG. 1b is a sectional view taken along the line X--X in FIG. 1a. FIGS. 2a to 2f show other embodiments of the protrusion formed on the bottom surface of the storage recess, and FIGS.
FIG. 2 c and FIG. 2 e are partial plan views of other embodiments, FIG. 2 d is a partial sectional view, and FIG. 2 f is a sectional view taken along the line Y--Y in FIG. 2 e. . Third
The figure is an external perspective view of a conventional electronic component storage band.
4a to 4b are partial cross-sectional views of a storage recess of a conventional electronic component storage band. 1, 31... Tape-shaped member, 2, 32... Storage recess, 3... Surface mounted electronic component, 4, 34... Cover tape, 5... Spread hole, 6a, 6b, 26a
~26n...protrusion, 21...bottom surface.

Claims (1)

【実用新案登録請求の範囲】 テープ状部材の一面に、表面実装電子部品の収
納凹部が等間隔に複数個配設されてなる表面実装
電子部品収納帯において、 収納凹部の底面に表面実装電子部品の底面を支
持する複数個の突出部を形成したことを特徴とす
る表面実装電子部品収納帯。
[Scope of Utility Model Registration Claim] In a surface-mounted electronic component storage band in which a plurality of storage recesses for surface-mounted electronic components are arranged at equal intervals on one surface of a tape-like member, the surface-mounted electronic components are placed on the bottom surface of the storage recess. A surface-mounted electronic component storage band characterized by forming a plurality of protrusions that support the bottom surface of the surface-mounted electronic component storage band.
JP13946389U 1989-11-30 1989-11-30 Pending JPH0378771U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13946389U JPH0378771U (en) 1989-11-30 1989-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13946389U JPH0378771U (en) 1989-11-30 1989-11-30

Publications (1)

Publication Number Publication Date
JPH0378771U true JPH0378771U (en) 1991-08-09

Family

ID=31686506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13946389U Pending JPH0378771U (en) 1989-11-30 1989-11-30

Country Status (1)

Country Link
JP (1) JPH0378771U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527384A (en) * 2009-05-20 2012-11-08 ザ ベルグクイスト カンパニー Packaging method for thermal interface material
JP2015164157A (en) * 2014-02-28 2015-09-10 北川工業株式会社 Embossment carrier tape and packaging device
JP2015221673A (en) * 2014-05-22 2015-12-10 信越ポリマー株式会社 Carrier tape
JP2016120961A (en) * 2014-12-25 2016-07-07 信越ポリマー株式会社 Carrier tape for electronic component and method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155399B2 (en) * 1979-09-17 1986-11-27 Tokyo Shibaura Electric Co
JPH01294463A (en) * 1988-05-14 1989-11-28 Murata Mfg Co Ltd Electronic component link

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155399B2 (en) * 1979-09-17 1986-11-27 Tokyo Shibaura Electric Co
JPH01294463A (en) * 1988-05-14 1989-11-28 Murata Mfg Co Ltd Electronic component link

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012527384A (en) * 2009-05-20 2012-11-08 ザ ベルグクイスト カンパニー Packaging method for thermal interface material
JP2014141305A (en) * 2009-05-20 2014-08-07 Bergquist Co:The Method for packaging thermal interface materials
JP2015164157A (en) * 2014-02-28 2015-09-10 北川工業株式会社 Embossment carrier tape and packaging device
JP2015221673A (en) * 2014-05-22 2015-12-10 信越ポリマー株式会社 Carrier tape
JP2016120961A (en) * 2014-12-25 2016-07-07 信越ポリマー株式会社 Carrier tape for electronic component and method of manufacturing the same

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