JPH01294463A - Electronic component link - Google Patents

Electronic component link

Info

Publication number
JPH01294463A
JPH01294463A JP63117890A JP11789088A JPH01294463A JP H01294463 A JPH01294463 A JP H01294463A JP 63117890 A JP63117890 A JP 63117890A JP 11789088 A JP11789088 A JP 11789088A JP H01294463 A JPH01294463 A JP H01294463A
Authority
JP
Japan
Prior art keywords
electronic component
tape
suction
recess
concavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63117890A
Other languages
Japanese (ja)
Inventor
▲きし▼下 浩幸
Hiroyuki Kishishita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP63117890A priority Critical patent/JPH01294463A/en
Publication of JPH01294463A publication Critical patent/JPH01294463A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate errors in the mount suction by a suction nozzle, by providing a bottom surface of a concavity of a tape with a protrusion which makes a contact area between the bottom surface and an electronic component smaller. CONSTITUTION:An electronic component link 21 is composed of a tape 23, on which concavities 22 have been provided in the longitudinal direction with a uniform space, and an electronic component A which has been stored in respective concavities 22. On the tape 23, feeding holes 24 with a uniform space have been provided along the longitudinal direction, and the concavities 22 are formed with a uniform space. On the bottom surface of the concavity 22, a protrusion 25 which makes the contact area with the rear surface of the stored electronic component A smaller has been provided. When the electronic component A is taken out by suction from the concavity 22 by a suction nozzle for a mounter, the tenacity of a lubricant B becomes weaker than the suction force, and the electronic component A can be assuredly taken out from the concavity 22 by suction, and the reliability of the mounter can be improved.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 この発明は、テープに一定の間隔で設けた凹部に電子部
品を収納した包装形態の電子部品連に関するものである
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a packaged series of electronic components in which electronic components are housed in recesses provided at regular intervals in a tape.

〈従来の技術〉 チップ状の電子部品をプリント基板へ実装する場合に、
マウンターを用いて自動的に行なうには、テープの長手
方向に沿って一定の間隔で設けた凹部にチップ状の電子
部品を収納した電子部品連が使用されており、マウンタ
ー内においてテープを間歇的に移動させて電子部品を吸
引ノズルで吸収したりしてプリント基板に取付けるよう
にしている。
<Conventional technology> When mounting chip-shaped electronic components on a printed circuit board,
To do this automatically using a mounter, an electronic component chain is used that stores chip-shaped electronic components in recesses provided at regular intervals along the length of the tape, and the tape is intermittently placed inside the mounter. The electronic components are then moved to the PCB, and the electronic components are absorbed by a suction nozzle and then attached to the printed circuit board.

従来、上記した電子部品連の形態には、主として第6図
に示すように、合成樹脂製テープ1の長手方向に沿って
一定の間隔で送り孔2を設けると共に、凹部3をエンボ
ス加工によって形成し、各凹部3内にチップ状の電子部
品Aを収納し、凹部3の上面開口をカバーテープ4で閉
鎖したエンボステープと、第7図の如く、厚紙を用いた
テープ5に一定の間隔で送り孔6と収納孔7とを設け、
テープの両面にカバーテープ8.9を重ねて収納孔7内
に電子部品Aを収納した紙テープの二つの方式がある。
Conventionally, as shown in FIG. 6, in the form of the electronic component series described above, feed holes 2 are provided at regular intervals along the longitudinal direction of a synthetic resin tape 1, and recesses 3 are formed by embossing. A chip-shaped electronic component A is housed in each recess 3, and an embossed tape with the top opening of the recess 3 closed with a cover tape 4 and a tape 5 made of cardboard are placed at regular intervals as shown in FIG. A feed hole 6 and a storage hole 7 are provided,
There are two methods of paper tape, in which cover tapes 8 and 9 are stacked on both sides of the tape and the electronic component A is stored in the storage hole 7.

ところで、トリマーコンデンサのような回転門構を備え
た電子部品は内部に潤滑剤が組込まれており、これが外
部に溶出する場合があり、従ってこのような電子部品を
電子部品連とする場合には、前者のエンボステープを使
用するのが好ましい。
By the way, electronic parts with rotating gate structures such as trimmer capacitors have lubricant built into them, and this may leak out to the outside. Therefore, when such electronic parts are included in electronic parts, , it is preferable to use the former embossed tape.

上記トリマーコンデンサは潤滑剤としてシリコンオイル
を使用しているが、コンデンサに潤滑剤が付着していた
り、温度上昇により内部の潤滑剤が溶出すると、第8図
に示すように、テープ1における凹部3の底面と電子部
品Aの裏面の間に潤滑剤Bが溜まることになる。
The above-mentioned trimmer capacitor uses silicone oil as a lubricant, but if the lubricant adheres to the capacitor or if the lubricant inside dissolves due to temperature rise, the concave part 3 in the tape 1 as shown in FIG. The lubricant B will accumulate between the bottom surface of the electronic component A and the back surface of the electronic component A.

〈発明が解決しようとする課題〉 上記のように凹部3と底面と電子部品Aの裏面間に溜っ
た潤滑剤Bは経済的に固化することによって粘着力が生
じ、電子部品Aが凹部3の底面に固定化され、このため
第8図と第9図のように、電子部品Aをマウンターの吸
引ノズル10で吸着して凹部3から取出す場合、潤滑剤
Bの粘着力が吸引ノズル10の吸着力よりも大きくなり
、吸引ノズル10の吸着ミスが発生し、プリント基板へ
の実装が不可能になるという問題がある。
<Problems to be Solved by the Invention> As described above, the lubricant B accumulated between the recess 3, the bottom surface, and the back surface of the electronic component A is economically solidified to generate adhesive force, and the electronic component A is attached to the recess 3. Therefore, when the electronic component A is suctioned by the suction nozzle 10 of the mounter and taken out from the recess 3 as shown in FIGS. 8 and 9, the adhesive force of the lubricant B is This causes a problem in that the suction nozzle 10 makes a suction error, and mounting on a printed circuit board becomes impossible.

〈発明の目的〉 この発明は、上記のような問題点を解決するためになさ
れたものであり、テープの凹部内に収納した電子部品と
凹部の底面との接触面積を少なくし、付着した潤滑剤等
の粘着力を小さくし、吸引ノズルによるマウント吸着の
ミスをなくして信頼性を向上させることができる電子部
品連を提供することが目的である。
<Purpose of the Invention> The present invention was made to solve the above-mentioned problems, and it reduces the contact area between the electronic components stored in the recesses of the tape and the bottom surface of the recesses, and reduces the amount of adhered lubricant. It is an object of the present invention to provide a series of electronic components that can improve reliability by reducing the adhesive force of agents, etc., and eliminating errors in mounting suction by suction nozzles.

く課題を解決するための手段〉 上記のような課題を解決するため、この発明は、長手方
向に一定の間隔で凹部を設けたテープと、このテープの
各凹部内に収納された電子部品とで構成され、テープの
凹部における底面にこの底面と電子部品の接触面積を少
なくする突起を設けた構造としたものである。
Means for Solving the Problems> In order to solve the above problems, the present invention provides a tape in which recesses are provided at regular intervals in the longitudinal direction, and an electronic component housed in each recess of the tape. The tape has a structure in which a protrusion is provided on the bottom surface of the concave portion to reduce the contact area between the bottom surface and the electronic component.

く作用〉 テープの凹部における底面に突起が設けられているので
、凹部底面とこの凹部内に収納した電子部品の接触面積
が少なく、電子部品から溶出した潤滑剤が凹部底面と電
子部品の裏面間で固化しても粘着力の発生は小さく、マ
ウンターの吸引ノズルで電子部品を凹部内から確実に吸
着して取出すことができる。
Effect> Since the protrusion is provided on the bottom of the recess of the tape, the contact area between the bottom of the recess and the electronic component housed in the recess is small, and the lubricant eluted from the electronic component is transferred between the bottom of the recess and the back surface of the electronic component. Even if it solidifies, the generation of adhesive force is small, and the mounter's suction nozzle can reliably suck and remove the electronic component from within the recess.

〈実施例〉 以下、この発明の実施例を添附図面の第1図乃至第5図
に基づいて説明する。
<Embodiments> Hereinafter, embodiments of the present invention will be described based on FIGS. 1 to 5 of the accompanying drawings.

第1図のように、電子部品連21は、長手方向に一定の
間隔で凹部22を設けたテープ23と、このテープ23
の各凹部22内に収納した電子部品Aとで構成され、電
子部品Aは例えば回転機構を備えたチップ状のトリマー
コンデンサーである。
As shown in FIG. 1, the electronic component series 21 includes a tape 23 provided with recesses 22 at regular intervals in the longitudinal direction, and a tape 23 provided with recesses 22 at regular intervals in the longitudinal direction.
The electronic component A is, for example, a chip-shaped trimmer capacitor equipped with a rotation mechanism.

上記テープ23は、合成樹脂を用い、長手方向に沿って
一定の間隔で送り孔24を設けると共に、同じく一定の
間隔で電子部品へを収納する凹部22をエンボス加工に
よって形成したエンボステープである。
The tape 23 is an embossed tape that is made of synthetic resin and has feed holes 24 provided at regular intervals along the longitudinal direction, and concave portions 22 for housing electronic components formed at regular intervals by embossing.

尚記テープ23における凹部22の底面には、収納した
電子部品への裏面との接触面積を少なくする突起25が
設けられている。
A protrusion 25 is provided on the bottom surface of the recess 22 in the tape 23 to reduce the contact area with the back surface of the stored electronic component.

この突起25は、電子部品Aを傾斜しないように安定よ
く支持できるものであれば構造や形状は限定されないが
、第1図と第2図に示す第1の例は、チー123の長手
方向に沿う二条のリブ状突起に形成し、電子部品Aを線
接触の状態で支持するようにしたものである。
The structure and shape of this protrusion 25 are not limited as long as it can stably support the electronic component A without tilting, but in the first example shown in FIGS. 1 and 2, the protrusion 25 is It is formed into two rib-like protrusions along the line, and supports the electronic component A in a line-contact state.

また、第3図と第4図の第2の例は、凹部22の底面四
か所に先鋭状の突起を設け、電子部品Aを点接触の状態
で支持するように形成したものを示している。
Further, the second example shown in FIGS. 3 and 4 shows a recess 22 having four sharp protrusions on the bottom surface to support the electronic component A in point contact. There is.

なお、電子部品Aを収納した凹部22は、テープ23上
に貼り合わせたカバーテープ26によって閉鎖するが、
このカバーテープ26に代えて、電子部品連21をリー
ルに渦巻状に巻回するときテープ23間に介在させる層
間紙を用いてもよく、また、電子部品Aが出ないように
テープ23を巻回することによってカバーテープ26の
使用を省くこともできる。
Note that the recess 22 housing the electronic component A is closed by a cover tape 26 pasted on the tape 23;
Instead of this cover tape 26, an interlayer paper may be used which is interposed between the tapes 23 when the electronic component string 21 is spirally wound around a reel. The use of the cover tape 26 can also be omitted by rotating it.

この発明の電子部品連は上記のような構成であり、テー
プ23の各凹部22内に収納された電子部品Aは第5図
に示すように、凹部22の底面に設けた突起25で支持
され、突起25と電子部品Aの裏面とは線もしくは点接
触状態になり、接触面積が少ないと共に、凹部22の底
面から浮き上がった状態になっている。
The electronic component series of the present invention has the above-mentioned configuration, and the electronic components A stored in each recess 22 of the tape 23 are supported by projections 25 provided on the bottom of the recess 22, as shown in FIG. The protrusion 25 and the back surface of the electronic component A are in line or point contact, and the contact area is small and the protrusion 25 is raised from the bottom surface of the recess 22.

従って、電子部品Aに付着していたり、内部から溶出し
た潤滑剤Bが凹部22の底1面と電子部品への裏面間に
溜まり、これが固化したような場合でも潤滑剤Bの電子
部品Aに対する接着量が少なく、潤滑剤Bによって発生
する接着力が弱いものとなる。
Therefore, even if the lubricant B attached to the electronic component A or eluted from the inside accumulates between the bottom surface of the recess 22 and the back surface of the electronic component and solidifies, the lubricant B will not affect the electronic component A. The amount of adhesion is small, and the adhesive force generated by lubricant B is weak.

このため、マウンターの吸引ノズルで凹部22内から電
子部品Aを吸着して取出す場合、潤滑剤Bの粘着力は吸
引力よりも弱くなり、吸引によって凹部22内から電子
部品A@−確実に取出すことができ、マウンターの信頼
性を向上させることができる。
Therefore, when the suction nozzle of the mounter suctions and removes the electronic component A from the recess 22, the adhesive force of the lubricant B becomes weaker than the suction force, and the suction ensures that the electronic component A is removed from the recess 22. The reliability of the mounter can be improved.

なお、この発明においてもテープとしては第7図に示し
たような厚紙を用いるものでもよい。
In the present invention, cardboard as shown in FIG. 7 may also be used as the tape.

〈発明の効果〉 以上のように、この発明によると、電子部品を収納する
ようテープに一定の間隔で設けた凹部の底面に、電子部
品を線もしくは点接触状態で支持する突起を設けたので
、凹部底面と電子部品の接触面積が少なくなり、電子部
品から溶出して凹部底面と電子部品の裏面間に溜った潤
滑剤の粘着力を弱くすることができ、従ってマウンター
の吸引ノズル等で電子部品を取出すときに、吸着ミスの
発生がなくなり、マウンターの信頼性を向上させること
ができる。
<Effects of the Invention> As described above, according to the present invention, protrusions that support electronic components in a line or point contact state are provided on the bottom surfaces of recesses provided at regular intervals in the tape to accommodate electronic components. , the contact area between the bottom of the recess and the electronic component is reduced, which weakens the adhesive force of the lubricant eluted from the electronic component and accumulated between the bottom of the recess and the back of the electronic component. This eliminates the occurrence of suction errors when taking out parts, and improves the reliability of the mounter.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの発明に係る電子部品連の第1の例を示す平
面図、第2図は第1図の矢印■−■に沿う断面図、第3
図は同第2図の例を示す平面図、第4図は第3図の矢印
■−IVに沿う断面図、第5図は電子部品の収納状態を
示す断面図、第6図と第7図は従来の電子部品連を示す
斜視図、第8図と第9図は同上における電子部品のマウ
ンターによる吸引状態を示す説明図である。 21・・・電子部品連       22・・・凹部2
3・・・テープ         24・・・送り孔2
5・・・突起          A・・・電子部品出
願人代理人  弁理士  和  1)  昭第1図  
    う2□ 第3図      第4図 25  B  25 第6図
FIG. 1 is a plan view showing a first example of an electronic component series according to the present invention, FIG. 2 is a sectional view taken along arrows ■-■ in FIG.
The figure is a plan view showing the example shown in Fig. 2, Fig. 4 is a sectional view along the arrow ■-IV in Fig. 3, Fig. 5 is a sectional view showing the storage state of electronic components, and Figs. The figure is a perspective view showing a conventional electronic component series, and FIGS. 8 and 9 are explanatory diagrams showing the suction state of the electronic component by the mounter in the same. 21...Electronic component series 22...Concave portion 2
3... Tape 24... Feed hole 2
5...Protrusion A...Electronic component applicant's agent Patent attorney Kazu 1) Showa 1
U2□ Figure 3 Figure 4 25 B 25 Figure 6

Claims (1)

【特許請求の範囲】[Claims] (1)長手方向に沿って一定の間隔で凹部を設けたテー
プと、このテープの各凹部内に収納された電子部品とで
構成され、テープの凹部における底面にこの底面と電子
部品の接触面積を少なくする突起を設けた電子部品連。
(1) Consisting of a tape with recesses provided at regular intervals along the longitudinal direction, and electronic components housed in each recess of the tape, the contact area between the bottom surface and the electronic components on the bottom surface of the recesses of the tape. A series of electronic components with protrusions to reduce
JP63117890A 1988-05-14 1988-05-14 Electronic component link Pending JPH01294463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63117890A JPH01294463A (en) 1988-05-14 1988-05-14 Electronic component link

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63117890A JPH01294463A (en) 1988-05-14 1988-05-14 Electronic component link

Publications (1)

Publication Number Publication Date
JPH01294463A true JPH01294463A (en) 1989-11-28

Family

ID=14722756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63117890A Pending JPH01294463A (en) 1988-05-14 1988-05-14 Electronic component link

Country Status (1)

Country Link
JP (1) JPH01294463A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378771U (en) * 1989-11-30 1991-08-09
US5361901A (en) * 1991-02-12 1994-11-08 Minnesota Mining And Manufacturing Company Carrier tape
US5396988A (en) * 1992-04-30 1995-03-14 Minnesota Mining And Manufacturing Company Electronic component carrier tape with generic pockets
JP2012527384A (en) * 2009-05-20 2012-11-08 ザ ベルグクイスト カンパニー Packaging method for thermal interface material
JP2017202841A (en) * 2016-05-10 2017-11-16 Koa株式会社 Package for chip part

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127474A (en) * 1984-11-20 1986-06-14 松下電器産業株式会社 Molded shape for conveying electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127474A (en) * 1984-11-20 1986-06-14 松下電器産業株式会社 Molded shape for conveying electronic part

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0378771U (en) * 1989-11-30 1991-08-09
US5361901A (en) * 1991-02-12 1994-11-08 Minnesota Mining And Manufacturing Company Carrier tape
US5396988A (en) * 1992-04-30 1995-03-14 Minnesota Mining And Manufacturing Company Electronic component carrier tape with generic pockets
JP2012527384A (en) * 2009-05-20 2012-11-08 ザ ベルグクイスト カンパニー Packaging method for thermal interface material
JP2017202841A (en) * 2016-05-10 2017-11-16 Koa株式会社 Package for chip part

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