JP2011240945A - Method for winding embossed carrier tape and embossed carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for winding embossed carrier tape whereby deformation in and damage to electronic components or the like accommodated in a plurality of embossed portions can be avoided, and to provide an embossed carrier tape.SOLUTION: Objects 40 to be accommodated are accommodated in the embossed portions 20 recessed in a base material 11 at predetermined intervals in the lengthwise direction of the base material, and the embossed carrier tape 10 is wound around a reel. In this case, each embossed portion 20 is formed so as to satisfy formula: H≤L×0.1, when its lengthwise dimension is L and its height when accommodated is H. In addition, the embossed carrier tape 10 is wound around the reel 30 with the flat base material 11 positioned on the side of the core 31 of the reel 30, and the embossed portion 20 directed on the outside. Accordingly, deformation in the embossed portions 20 can effectively be prevented, and deformation in the objects 40 accommodated in the embossed portions 20 and deformation or the like in terminals 42 can securely be prevented.

Description

  The present invention relates to an embossing carrier tape winding method and an embossing carrier tape in which an embossing carrier tape for storing various electronic parts, precision equipment parts and the like for storage, transfer and mounting is wound around a reel.

  The conventional embossed carrier tape has embossed parts that store electronic components etc. at regular intervals in the longitudinal direction of the long plastic sheet, and has a feed hole at the widthwise end of the plastic sheet. (See, for example, Patent Document 1).

  That is, as shown in FIG. 7, the embossed carrier tape 100 is provided with a plurality of embossed portions 102 that store objects to be stored such as electronic components in a longitudinal direction of a tape 101 made of polystyrene, for example. Protruding members 103 are provided at the bottom of the embossed portion 102, and extended portions 104 are provided at the four corners of the embossed portion 102. The protruding member 103 has ribs 106 erected on the four circumferences of the thick bottom portion 105 (see FIG. 9).

Therefore, as shown in FIG. 9, QFP (Quad Flat Package) having terminals 108 in four directions and SOP (Small) having terminals 108 in two directions.
When the electronic component 107 such as the Outline Package is accommodated in the embossed portion 102, the position is regulated by the rib 106 in order to prevent the terminal 108 from being damaged.
Then, after the electronic component 107 is accommodated in the embossed portion 102, a top tape (not shown) is attached to the upper surface of the tape 101 with heat or ultrasonic waves so as to seal the opening 102a of the embossed portion 102, and the embossed carrier tape 100. Is wound around the reel.

Japanese Patent Laying-Open No. 2005-320037 (FIG. 2)

  By the way, in the conventional method of winding the embossed carrier tape, after the electronic component 107 is accommodated in the embossed portion 102 and the top tape is heat-sealed, the opening 102a of the embossed portion 102 is directed outward as shown in FIG. Generally, it is wound around a reel 109.

  However, since the winding start is close to the winding core (not shown) that is the center of the reel 109, the winding radius of the embossed carrier tape 100 becomes small. In recent years, electronic components such as semiconductor packages have been made flat, thin, and large (for example, semiconductor packages having a side of 20 mm to 40 mm square) in a trend of downsizing and increasing capacity, and are low profile products. Has come to be used a lot. For reel cores, electronic component manufacturers use 60 mm, 80 mm, 100 mm, 150 mm, and the like, and embossed carrier manufacturers use 212 mm, 220 mm, etc. in addition to these. These reels are selected according to the dimensions of the electronic components to be stored and the embossed carrier tape.

In the case of an embossed carrier tape that accommodates a low-profile product with a large size as described above, a large winding core tended to be used, but the area of the embossed part is still large and it is almost linear On the winding core side of a reel with a small diameter, deformation may occur when winding along the reel winding core. Since the clearance to the opening of the embossed portion of the low profile product is set small, if the amount of deformation is large, it immediately becomes a problem.

That is, as shown in FIG. 9, the central portion in the longitudinal direction of the embossed portion 102 may be deformed outwardly (upward in FIG. 9) like a bow. When the embossed portion 102 is deformed in this way, the stored electronic component 107 is lifted to the center portion deformed like a bow and protrudes from the opening 102 a of the embossed portion 102. Such protruding of the electronic component from the opening does not satisfy the JIS standard C0806-3 and the IEC standard 60286-3 which are standards. In such a state, there is a problem that the production line is stopped because it is judged as defective by the device that monitors the protrusion of the embossed portion from the opening.

In addition, when the electronic component is supported only at the center of the embossed part deformed like a bow, it becomes unstable like riding on a seesaw, and when the top tape is heat sealed to the embossed carrier tape, etc. In addition, there is a problem that the terminal 108 that is easily deformed by tilting the electronic component to one side is deformed in contact with the bottom surface of the emboss or the rib.
In particular, the deformation of the embossed part was remarkable when a low-profile product was wound around a reel having a small winding core diameter.

  Accordingly, the present invention has been made in view of the above problems, and provides an embossed carrier tape winding method and an embossed carrier tape capable of avoiding deformation and damage of electronic components and the like housed in an embossed portion. With the goal.

  The embossed carrier tape winding method according to the present invention includes a plurality of embossed portions that are recessed at predetermined intervals along a longitudinal direction of a long tape-shaped base material and store a product to be stored, and a widthwise outer edge portion of the base material. A method of winding an embossed carrier tape having a feed hole provided at predetermined intervals along the reel, wherein the embossed portion has a longitudinal dimension of L and a storage height of H. Sometimes, H ≦ L × 0.1 is formed, and the base material is the reel core side, the embossed portion is outside, and the embossed carrier tape is wound around the reel. ing.

  Moreover, since the embossed carrier tape is wound around the reel with the flat base material on the reel core side and the embossed portion on the outside, deformation of the embossed portion can be effectively prevented and stored in the embossed portion. It is possible to reliably prevent deformation of the stored item, deformation of the terminal, and the like.

  The embossed carrier tape winding method according to the present invention includes: a pedestal on which the embossed portion is mounted with the article to be stored; and a position restriction rib that is provided on a peripheral edge of the pedestal and restricts the position of the article to be stored. It has the composition which has.

  With this configuration, a pedestal for mounting the stored product is provided inside the embossed portion, and a position regulating rib for controlling the position of the stored product is provided on the periphery of the pedestal, so that the movement of the stored product is controlled. Therefore, it is possible to reliably prevent deformation or damage of the stored items accompanying movement.

  Furthermore, the winding method of the embossed carrier tape of the present invention is such that the embossed carrier tape stores the article to be stored in the embossed portion, and then seals the opening of the embossed portion with a top tape and then winds it around the reel. have.

  With this configuration, after storing the article to be stored in the embossed part, the opening of the embossed part is sealed with the top tape, so that the article to be stored can be prevented from falling or moving when the embossed carrier tape is wound around the reel. . In addition, dust can be prevented from entering and stored.

  Furthermore, the embossed carrier tape of the present invention includes a plurality of embossed portions that are recessed at a predetermined interval along the longitudinal direction of the long tape-shaped base material and store articles to be stored, and an outer edge portion in the width direction of the base material. An embossed carrier tape having feed holes provided at predetermined intervals along the longitudinal direction, where L is the longitudinal dimension of the embossed portion and H is the storage height of the embossed portion. The configuration is 0.1.

  In the present invention, since the flat base material is the reel core side, the embossed portion is outside, and the embossed carrier tape is wound around the reel, it is effective that the central portion of the embossed portion protrudes and deforms like a bow toward the opening side. Embossing carrier tape winding method and embossing, which can prevent, and can reliably prevent the protrusion of the stored article stored in the embossed part from opening of the embossed part and the deformation of the terminal, etc. A carrier tape can be provided.

It is a perspective view which shows the winding method of the embossed carrier tape of embodiment concerning this invention. It is a top view of the embossed carrier tape of embodiment concerning this invention. It is sectional drawing of the III-III position in FIG. It is sectional drawing which shows the state which accommodated the semiconductor package in the embossed part. It is sectional drawing which shows the state which winds an embossed carrier tape on a reel. It is sectional drawing which shows the state which wound the embossed carrier tape around the reel. It is a top view of the conventional embossed carrier tape. It is sectional drawing which shows the winding method of the conventional embossed carrier tape. It is sectional drawing which shows the subject in the winding method of the conventional embossing carrier tape.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the accompanying drawings. Note that the same number is assigned to the same element throughout the description of the embodiment.
As shown in FIGS. 1 to 3, an embossed carrier tape 10 according to an embodiment of the present invention includes a plastic tape 11 that is a long tape-like base material and a predetermined interval along the longitudinal direction of the plastic tape 11. A plurality of embossed portions 20 for storing electronic components such as a semiconductor package 40 (see FIG. 4) that are provided in a plurality of recesses, and feed holes 12 provided at predetermined intervals along the widthwise outer edge of the plastic tape 11 Have.

The embossed carrier tape 10 can be used for storing and transporting the semiconductor package 40 by housing the semiconductor package 40 in the embossed portion 20 and winding it around a reel 30.
The reel 30 includes a core 31 that is a central axis, and a pair of side plates 32 and 32 each having a normal disk shape provided at both ends of the core 31. Accordingly, the embossed carrier tape 10 is wound around the outside of the core 31 between the pair of side plates 32 and 32.

The embossed portion 20 can be formed by press molding, vacuum forming, pressure forming, or a combination of these plastic tapes 11 made of thermoplastic (for example, made of polystyrene resin with conductivity). It is also possible to form 20 separately and join it to the opening 112 provided in the plastic tape 11.
The feed holes 12 are for feeding the embossed carrier tape 10 at a predetermined speed, and are provided at predetermined intervals along the outer edge of the plastic tape 11 at at least one outer position of the embossed portion 20 in the plastic tape 11. ing. A flat portion 113 is provided between the embossed portion 20 (that is, the opening 112) and the feed hole 12. A flat portion 113 is also provided between the adjacent embossed portions 20.

  As shown in FIG. 4, the embossed portion 20 is an overall rectangular recess, and has an opening 112 in the plastic tape 11 and a side wall 24 downward from the opening 112 (downward in FIG. 4). The side wall 24 has a bottom 22 at the lower end, and the side wall 24 is provided at a slight inclination angle (for example, 3 °) so that the bottom 22 side is narrowed. A pedestal 21 for mounting the semiconductor package 40 is formed at the center of the bottom 22 so as to project upward from the bottom 22 of the embossed portion 20 (upward in FIG. 4, on the side of the plastic tape 11).

The height from the upper surface 221 of the bottom portion 22 of the embossed portion 20 to the upper surface 211 of the pedestal 21 is set to a height at which the terminal 42 does not contact the bottom portion 22 when the semiconductor package 40 is stored in the pedestal 21. The height H at which the embossed portion 20 can be stored, that is, the height from the upper surface 211 of the base 21 to the upper surface 111 of the plastic tape 11 is set to be slightly larger than the thickness of the main body 41 of the semiconductor package 40.
The storable height H is set so that H ≦ L × 0.1 when the longitudinal length of the embossed portion 20 is L (see FIG. 2). For example, when the longitudinal length L is 20 mm, H ≦ 2 mm.

  As shown in FIG. 4, at the edge of the pedestal 21, position restricting ribs 23 that restrict the movement of the semiconductor package 40 housed in the pedestal 21 are provided on four sides. An outer inclined surface 231 is provided on the outer peripheral side of the position restricting rib 23, and an inner inclined surface 232 is provided on the inner peripheral side of the position restricting rib 23. The inner inclined surface 232 is inclined at an angle close to the inclination of the main body 41 of the semiconductor package 40, and can contact the main body 41 of the semiconductor package 40 in a state close to surface contact when the semiconductor package 40 is stored in the base 21. It has become. On the other hand, the outer inclined surface 231 is inclined at an angle close to the inclination of the terminal 42 of the semiconductor package 40, and can come into contact with the terminal 42 in a state close to surface (line) contact.

A height H2 of the position regulating rib 23 from the upper surface 211 of the base 21 is set to a height that does not contact the terminal 42 of the semiconductor package 40.
Therefore, the position restricting rib 23 is disposed between the main body 41 and the terminal 42 without contacting the terminal 42 of the semiconductor package 40.
The base 21 and the position regulating rib 23 can be integrally formed at the same time when the embossed portion 20 is formed. Thereby, while the rigidity of the position control rib 23 increases, the rigidity of the embossed part 20 increases, and the deformation | transformation of the embossed part 20 can be suppressed.

When the semiconductor package 40 is accommodated in such an embossed carrier tape 10, the main body 41 of the semiconductor package 40 is placed on the base 21 of the embossed portion 20, and the terminal 42 gets over the position regulating rib 23 and the side wall 24. Store it so that it does not come into contact.
Thereafter, the top tape 13 is attached to the upper surface 111 of the plastic tape 11 by heat sealing to seal the opening 112 of the embossed portion 20. At this time, as shown in FIG. 2, the top tape 13 is affixed to the flat portion 113 so as not to cover the feed hole 12.

Next, the winding method of the carrier tape concerning this invention is demonstrated.
As shown in FIGS. 1, 5, and 6, when the embossed carrier tape 10 that contains the semiconductor package 40 and is sealed with the top tape 13 as described above is wound around the reel 30, the plastic tape 11 side, that is, the top The tape 13 is wound with the core 31 side of the reel 30 and the embossed portion 20 facing outside.
FIG. 6 shows a state in which the embossed carrier tape 10 is laminated and wound. However, the position where the embossed carrier tape 10 can be bent is between the adjacent embossed portions 20 due to the rigidity of the embossed portion 20. In some cases, a space is generated between the embossed carrier tapes 10 to be laminated.

As described above, according to the method for winding the embossed carrier tape of the embodiment of the present invention, the semiconductor package 40 is accommodated in the embossed portion 20 that is provided with a plurality of recesses at predetermined intervals along the longitudinal direction of the plastic tape 11. The embossed carrier tape 10 sealed with the tape 13 is wound around a reel.
At this time, since the embossed carrier tape 10 is wound around the reel 30 with the flat plastic tape 11 facing the core 31 of the reel 30 and the embossed portion 20 on the outside, the embossed portion 20 is deformed in the direction opposite to the opening 112. Since the storage depth of the embossed portion 20 tends to increase, it is possible to reliably prevent protrusion of the embossed portion 20 of the semiconductor package 40 stored in the embossed portion 20 from the opening 112, deformation of the terminal 42, and the like. it can.

  Further, the embossed portion 20 was formed so that H ≦ L × 0.1 when the longitudinal dimension was L and the storage height was H.

  Further, since the pedestal 21 on which the semiconductor package 40 is mounted is provided inside the embossed portion 20 and the position restricting rib 23 that restricts the position of the semiconductor package 40 is provided on the periphery of the pedestal 21, the movement of the semiconductor package 40 is restricted. It is possible to reliably prevent deformation or damage of the terminals 42 of the semiconductor package 40 due to movement.

  Moreover, since the position restricting rib 23 is provided integrally, the rigidity of the embossed portion 20 is increased, and deformation of the embossed portion 20 can be suppressed. Accordingly, deformation of the semiconductor package 40 accommodated in the embossed portion 20 can be suppressed.

  In addition, since the opening 112 of the embossed portion 20 is sealed with the top tape 13 after the semiconductor package 40 is stored in the embossed portion 20, the semiconductor package 40 is prevented from moving or dropping when the embossed carrier tape 10 is wound around the reel 30. can do. Furthermore, the semiconductor package 40 can be stored while being protected from dust and the like.

  As mentioned above, although this invention was demonstrated using embodiment, it cannot be overemphasized that the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiments. Further, it is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

10 Embossed carrier tape 11 Plastic tape (base material)
112 Opening 12 Feeding hole 13 Top tape 20 Embossed portion 21 Base 23 Position regulating rib 30 Reel 31 Core 40 Semiconductor package (contained product)
H Storage height L Longitudinal dimension

Claims (4)

A plurality of embossed portions that are recessed at predetermined intervals along the longitudinal direction of the long tape-shaped base material and store articles to be stored, and feed holes provided at predetermined intervals along the widthwise outer edge portion of the base material A method of winding an embossed carrier tape that winds an embossed carrier tape on a reel,
The embossed portion is formed such that H ≦ L × 0.1 when the longitudinal dimension is L and the storage height is H,
A method for winding an embossed carrier tape, characterized in that the embossed carrier tape is wound around the reel with the substrate as the core side of the reel and the embossed portion as the outside.   The embossed carrier according to claim 1, wherein the embossed portion includes a pedestal on which the article to be stored is mounted, and a position restriction rib that is provided on a peripheral edge of the pedestal and restricts the position of the article to be stored. How to wrap the tape.   3. The embossed carrier tape according to claim 1 or 2, wherein the embossed carrier tape stores the article to be stored in the embossed part, and then winds the embossed part around the reel after sealing the opening of the embossed part with a top tape. How to wrap embossed carrier tape. A plurality of embossed portions that are recessed at predetermined intervals along the longitudinal direction of the long tape-shaped base material and store articles to be stored, and feed holes provided at predetermined intervals along the widthwise outer edge portion of the base material An embossed carrier tape having
An embossed carrier tape, wherein H ≦ L × 0.1, where L is a longitudinal dimension of the embossed portion and H is a storage height of the embossed portion.

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