WO2018221277A1 - Method for manufacturing carrier tape for electronic components - Google Patents

Method for manufacturing carrier tape for electronic components Download PDF

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Publication number
WO2018221277A1
WO2018221277A1 PCT/JP2018/019381 JP2018019381W WO2018221277A1 WO 2018221277 A1 WO2018221277 A1 WO 2018221277A1 JP 2018019381 W JP2018019381 W JP 2018019381W WO 2018221277 A1 WO2018221277 A1 WO 2018221277A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor package
restricting projection
carrier tape
resin sheet
position restricting
Prior art date
Application number
PCT/JP2018/019381
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French (fr)
Japanese (ja)
Inventor
相沢　純一
Original Assignee
信越ポリマー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 信越ポリマー株式会社 filed Critical 信越ポリマー株式会社
Priority to MYPI2019007124A priority Critical patent/MY200723A/en
Priority to CN201880036565.1A priority patent/CN110662703B/en
Publication of WO2018221277A1 publication Critical patent/WO2018221277A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web

Definitions

  • the present invention relates to a method of manufacturing a carrier tape for electronic parts used for storage, supply, storage, inventory management, transportation, etc. of electronic parts made of semiconductor packages and the like.
  • the electronic component carrier tape When storing and transporting surface-mount semiconductor packages, carrier tapes for electronic components that can handle electronic components efficiently are used. 6 to 8, the electronic component carrier tape includes a resin sheet 20A wound around a take-up reel, and a surface-mount type semiconductor package 10 arranged in parallel in the longitudinal direction of the resin sheet 20A. A plurality of storage embosses 21A are stored, and after being manufactured by a manufacturer, it is transported from the manufacturer to a component manufacturer, or from the component manufacturer to an assembly manufacturer (see Patent Document 1).
  • the surface mount type semiconductor package 10 includes a planar rectangular package body 11 as shown in FIG. 8, and a plurality of lead frames from the front, rear, left and right peripheral surfaces of the package body 11. 12 projecting side by side. Each lead frame 12 protrudes laterally from the peripheral surface of the package body 11 and extends while being bent downward. The downwardly extending portion is a descending portion 13, and the tip of the descending portion 13 is bent while laterally extending. Protruding.
  • each storage emboss 21A includes an opening 22A formed in the resin sheet 20A, a peripheral wall 23A extending from the opening 22A toward the back surface of the resin sheet 20A, and an opening 22A extending from the peripheral wall 23A.
  • a bottom plate 24A extending in the center direction and a base plate 25A for mounting the semiconductor package 10 connected to the bottom plate 24A are formed.
  • a position restricting projection 26A that extends over the plurality of lead frames 12 of the semiconductor package 10 is formed. To prevent deformation.
  • the surface mount type semiconductor package 10 using the lead frame 12 is excellent in the reliability of the electrical connection and the surface mountability.
  • the peripheral surface of the package body 11 and the lead frame 12 are improved.
  • the portion between the lower part 13 extending downward and the so-called crotch part IL is narrowed, the pitch of the lead frames 12 is becoming narrower, and the lead frames 12 are further reduced in size. Is planned.
  • the conventional carrier tape for electronic components is configured as described above, and is small in size because the position restricting protrusion 26A having a substantially constant width is simply formed between the bottom plate 24A and the base plate 25A of the storage emboss 21A.
  • the crotch portion IL of the semiconductor package 10 is narrow, so that there is a gap between the position restricting protrusion 26A of the storage emboss 21A and the lead frame 12 of the semiconductor package 10. Since the position restricting protrusion 26A of the storage emboss 21 and the lead frame 12 of the semiconductor package 10 are in pressure contact with each other (see FIG. 8), the lead frame 12 may be easily deformed and damaged due to the pressure contact. is there.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a method for manufacturing a carrier tape for an electronic component that can effectively eliminate the possibility of damage to the protruding portion of the electronic component.
  • a resin sheet is sandwiched between an upper mold and a lower mold of a mold, a storage emboss for storing an electronic component is formed, and an electronic component protrudes between the bottom plate and a base plate.
  • a manufacturing method that interposes a position restricting projection that supports a portion, and a tip portion of the position restricting projection is formed by forming a molding rib for the position restricting projection on the lower mold of the mold and making the tip end into an R shape. It is characterized in that the wall thickness of the substrate is reduced and the width of the position restricting projection is suppressed.
  • the electronic component is a semiconductor package
  • the protruding portion of the electronic component is a lead frame that bends and protrudes from at least a part of the peripheral surface of the package body of the semiconductor package.
  • the storage embossing is connected to the opening formed in the resin sheet, a peripheral wall extending from the periphery of the opening toward the back surface of the resin sheet, a bottom plate extending from the peripheral wall toward the center of the opening, and the bottom plate.
  • the semiconductor package may include a raised bottom pedestal plate facing the package body, and a position restricting projection straddling the lead frame of the semiconductor package may be erected between the bottom plate and the pedestal plate.
  • molding rib shall be 0.2 mm or more and the thickness of a resin sheet or less.
  • the forming rib is tapered and the inner inclination angle of the forming rib is 4 ° or less.
  • the forming rib can be tapered, and the outer inclination angle of the forming rib can be made 10 ° or less.
  • molding rib can be 0.1 mm or more and 0.2 mm or less.
  • the resin sheet in the claims is preferably a thermoplastic resin sheet.
  • the resin sheet and the storage embossing are not particularly required to be transparent, opaque, or translucent.
  • the electronic component includes at least a surface mount type QFP type, DIP type, SOP type, and the like.
  • the thickness of the tip of the position restricting protrusion is preferably 0.1 mm or more and 0.2 mm or less.
  • the tip portion of the lower mold rib is formed in an R shape
  • the opposite covering portion of the resin sheet facing the tip portion of the molding rib is the tip of the molding rib when the carrier tape for electronic parts is manufactured. It moves from the portion toward the root portion and becomes thinner, and the width of the position restricting projection of the storage emboss becomes narrower. Therefore, a gap can be secured between the position restricting protrusion of the storage embossing and the protruding portion of the electronic component, and the risk of the protruding portion being deformed and damaged due to the contact between the position restricting protrusion and the protruding portion is reduced. be able to.
  • the molding rib for the position restricting projection is formed on the lower mold of the mold, and the tip thereof has an R shape. Therefore, even if the electronic component is stored in the storage emboss, the electronic component protrudes. There is an effect that the possibility of damaging the portion can be effectively eliminated.
  • the position restricting protrusion of the storage emboss and the lead frame of the semiconductor package are unlikely to come into strong contact, so that the lead frame may be deformed and damaged. Can be reduced.
  • a gap can be secured between the position restricting protrusion of the storage emboss and the lead frame of the semiconductor package straddling the position restricting protrusion. With the contact with the extending portion, the possibility that the lead frame is deformed and damaged can be reduced.
  • molding rib is 0.2 mm or more, the intensity
  • the fifth aspect of the present invention it is possible to improve the moldability of the position restricting projection of the storage emboss, and to easily form the tip end portion of the molded rib into an R shape.
  • the sixth aspect of the present invention it is possible to improve the moldability of the position restricting projection of the storage emboss.
  • it can prevent that the intensity
  • FIG. 7 is a cross-sectional explanatory view schematically showing the position restricting protrusion of FIG. 6. It is a fragmentary sectional view showing the relationship between a lead frame of a semiconductor package and a conventional position regulating protrusion.
  • a manufacturing method of a carrier tape for an electronic component in the present embodiment includes a resin sheet 20 on a mold 1 as shown in FIGS.
  • a plurality of molding ribs 30 for the position restricting protrusions 26 are formed on the lower mold 3 of the mold 1 and the tip portions 31 of the respective molding ribs 30 are curved, so that the thickness of the resin sheet 20 can be reduced during molding.
  • the width of the position restricting projection 26 is suppressed by partially changing.
  • the mold 1 includes an upper mold 2 and a lower mold 3 that are opposed to each other in the vertical direction so that the upper mold 2 is softened to the lower mold 3.
  • the carrier tape for electronic parts is hot press-molded by sandwiching and clamping.
  • type 3 are comprised, for example with an azrolled steel, a prehardened steel, quenching and tempering steel.
  • the surface-mount type semiconductor package 10 includes a thin package body 11 having a substantially square plane, and a plurality of packages are formed from the front, rear, left and right peripheral surfaces of the package body 11.
  • the lead frames 12 protrude in a line, and each lead frame 12 is bent into a gull wing shape (substantially L-shaped).
  • the package body 11 is generally formed to a thickness of about 1.4 mm to 3.8 mm.
  • the plurality of lead frames 12 are, for example, 44 to 120 frames and are arranged at a pitch of 0.5 mm, 0.4 mm, 0.3 mm, or the like.
  • Each lead frame 12 protrudes laterally from the peripheral surface of the package body 11 and extends while being bent downward.
  • the downwardly extending portion is a descending portion 13, and the tip of the descending portion 13 is bent while laterally extending. Protrusively.
  • the resin sheet 20 is formed of a molding material containing a predetermined resin and is generally formed into an elongated flexible belt having a thickness of about 0.2 to 0.5 mm.
  • a plurality of storage embosses 21 are hot-press molded at predetermined intervals and wound around a take-up reel.
  • the predetermined resin of the molding material is not particularly limited, and examples thereof include thermoplastic resins such as polystyrene resin, polyethylene terephthalate resin, polycarbonate resin, polyethylene resin, and polypropylene resin, alloys thereof, and laminates thereof. It is done. If necessary, a predetermined filler such as carbon black, carbon fiber, or nanofiber for preventing static electricity is appropriately blended with the molding material, or a conductive resin layer to which the filler is added is laminated.
  • the surface of the resin sheet 20 is coated with various antistatic agents, conductive polymer paints such as polythiophene and polypyrrole. Further, a cover tape for sealing the semiconductor package 10 in the storage emboss 21 is attached to the surface of the resin sheet 20 excluding both side portions later. In the longitudinal direction of at least one side of the both sides of the resin sheet 20, a plurality of feed sprocket holes (not shown) are drilled at predetermined intervals, and each sprocket hole is formed into a flat circular round hole.
  • each storage emboss 21 has a substantially square opening 22 formed in the resin sheet 20, and a rear surface direction of the resin sheet 20 from the periphery of the opening 22 (downward direction in FIG. 3). ), A bottom plate 24 extending from the lower end of the peripheral wall 23 toward the center of the opening 22 (right direction in FIG. 3), and connected to the bottom plate 24 to face the package body 11 of the semiconductor package 10. And a raised bottom pedestal plate 25, and is formed into a short bottomed rectangular tube shape, in other words, a pocket shape.
  • the peripheral wall 23 of the storage emboss 21 gradually and slightly inclines toward the center of the opening 22 as it extends from the front surface side of the resin sheet 20 toward the lower back surface.
  • the bottom plate 24 is formed as a flat plate having a flat frame shape, and contacts the peripheral surface of the take-up reel when the take-up reel is wound.
  • the pedestal plate 25 is formed as a planar square flat plate positioned above the bottom plate 24, and is surrounded by the bottom plate 24 in plan view, and contacts the peripheral surface of the take-up reel when the take-up reel is wound.
  • a round through hole is drilled in the center of the base plate 25. This through hole confirms the presence or absence of the semiconductor package 10, takes out the semiconductor package 10 from the storage emboss 21, and controls the attitude of the semiconductor package 10 using vacuum. Used for
  • a planar frame that spans a plurality of lead frames 12 of the semiconductor package 10 with a slight gap between the inner peripheral edge of the bottom plate 24 and the peripheral edge of the base plate 25.
  • a shape position restricting projection 26 is formed upright.
  • the position restricting projection 26 is formed in a hollow shape having a substantially inverted J-shaped cross section that fits between the package body 11 of the semiconductor package 10 and the descending portion 13 of the lead frame 12 with a slight gap, and is on the lead frame 12 side.
  • the lower end of the long piece 27 located on the bottom plate 24 is connected to the inner peripheral edge of the bottom plate 24, and the end of the short piece 28 located on the package body 11 side is connected to the peripheral edge of the base plate 25 to surround the base plate 25.
  • the semiconductor package 10 functions to prevent displacement of the semiconductor package 10 and deformation of the lead frame 12.
  • the thickness of the curved tip portion 29 of the position restricting protrusion 26 is 0.1 mm or more and 0.2 mm or less, preferably 0.1 mm or more and 0.18 mm or less, more preferably 0.1 mm or more and 0.15 mm or less are good.
  • each forming rib 30 is basically processed into a tapered isosceles triangle that gradually becomes thinner as it goes upward by a machining center or the like, and the tip 31 has a slightly rounded R shape.
  • the resin sheet 20 is partially stretched at the time of hot press molding of the electronic component carrier tape to reduce the thickness of the tip portion 29 of the position restricting protrusion 26 and to narrow the width of the position restricting protrusion 26. It works as follows.
  • the width W of the root portion of the molding rib 30 is set to 0.2 mm or more and the thickness of the resin sheet 20 or less. Therefore, the width W of the molding rib 30 is set to 0.2 mm or more and 0.3 mm or less when the thickness of the resin sheet 20 is 0.3 mm, and when the thickness of the resin sheet 20 is 0.5 mm. , 0.2 mm or more and 0.5 mm or less. This is because when the width W of the molding rib 30 is less than 0.2 mm, the strength of the molding rib 30 is insufficient, and the mold 1 may be deformed during hot press molding.
  • the width W of the molding rib 30 exceeds the thickness of the resin sheet 20, the tip portion 31 of the molding rib 30 becomes thick, and the thickness of the resin sheet 20 is increased when the resin sheet 20 is stretched by hot press molding. This is because it does not change partially.
  • the inner inclination angle ⁇ 1 of the molding rib 30 is 4 ° or less, preferably 1 ° or more, from the viewpoint of improving the moldability of the position restricting projection 26 or easily forming the tip portion 31 of the molding rib 30 into an R shape. It is 4 ° or less, more preferably 2 ° or more and 4 ° or less, and further preferably 3 ° or more and 4 ° or less. Further, the outer inclination angle ⁇ 2 of the forming rib 30 is preferably 10 ° or less from the viewpoint of improving the formability of the position restricting protrusion 26.
  • the forming rib 30 is a tapered isosceles triangle, it is 10 ° or less, preferably 1 ° or more and 10 ° or less, more preferably 2 ° or more and 10 ° or less, and further preferably 4 ° or more and 10 ° or less.
  • the tip R of the tip portion 31 of the molding rib 30 is 0.1 mm or more and 0.2 mm or less, preferably 0.14 mm or more and 0.2 mm or less, more preferably from the viewpoint of eliminating the strength shortage of the tip portion 31 of the molding rib 30. Is preferably 0.18 mm or more and 0.2 mm or less. Further, the height of the forming rib 30 is not particularly limited, and is changed according to the shape of the semiconductor package 10 or the lead frame 12.
  • the upper mold 2 and the lower mold 3 of the mold 1 are opened, and the cavity 4 of the lower mold 3 is preheated and softened.
  • the carrier tape for electronic parts is hot press molded by stretching and deformation of the resin sheet 20 can do.
  • the opposing covering portion 20a of the resin sheet 20 that opposes the curved tip portion 31 of the molding rib 30 moves from the tip portion 31 of the molding rib 30 toward the root portion and becomes thin.
  • the restricting protrusion 26 becomes thin (see FIG. 4).
  • the distal end portion 31 of the forming rib 30 is not formed flat but curved in an R shape, so that the position restricting projection 26 can be formed narrow and narrow. Therefore, even if the crotch portion IL of the semiconductor package 10 is narrow, a gap can be secured between the position restricting projection 26 of the storage emboss 21 and the lead frame 12 in which the semiconductor package 10 is reduced in size (see FIG. 5), the risk of the lead frame 12 being easily deformed and damaged in accordance with the pressure contact between the position restricting projection 26 and the descending portion 13 of the lead frame 12 can be eliminated.
  • the position restricting projection 26 of the resin sheet 20 can be easily removed from the molding rib 30 of the lower mold 3.
  • the plurality of lead frames 12 protrude from the front, rear, left and right peripheral surfaces of the package body 11 in the semiconductor package 10, but the plurality of lead frames 12 protrude from the left and right side surfaces of the package body 11. You may let them.
  • the base plate 25 of the storage emboss 21 is formed in a planar square shape, the central portion excluding the peripheral portion of the base plate 25 may be recessed in a substantially tray shape so as to be aligned with the height of the bottom plate 24.
  • the basic shape of the forming rib 30 is a tapered isosceles triangle, the tip 31 thereof may be curved into an R shape as a tapered right triangle.
  • Example 1 In order to manufacture carrier tapes for electronic parts, the upper and lower molds of the mold are opened, and a resin sheet heated and softened is set in the cavity of the lower mold. The lower mold was clamped to apply pressure, and a carrier tape for electronic parts that accommodates a QFP type semiconductor package in a storage emboss was hot-press molded.
  • the lower mold forming rib was set such that the inner inclination angle ⁇ 1 was 4 °, the outer inclination angle ⁇ 2 was 0 °, and the tip R was 0.2 mm. Moreover, the sheet
  • Example 2 Basically, it was the same as in Example 1, but the inner inclination angle ⁇ 1 of the lower mold forming rib was set to 4 °, the outer inclination angle ⁇ 2 to 10 °, and the tip R to 0.2 mm. Moreover, the sheet
  • the lower mold forming rib was set such that the inner inclination angle ⁇ 1 was 4 °, the outer inclination angle ⁇ 2 was 0 °, and the tip R was 0.0 mm.
  • the resin sheet was a polystyrene resin sheet as in the examples. It was 0.2 mm when the thickness of the front-end
  • the method for producing a carrier tape for electronic parts according to the present invention is used in the fields of electrical, electronic and semiconductor production.
  • Mold 2 Upper mold 3 Lower mold 4 Cavity 10
  • Semiconductor package (electronic component) 11
  • Package body 12
  • Lead frame (protrusion) 13
  • Lower part 20
  • Resin sheet 20a
  • Opposite covering part 21
  • Storage emboss 22 Opening
  • Peripheral wall 24
  • Bottom plate 25
  • Base plate 26
  • Position restricting projection 27
  • Long piece 28
  • Tip part 30
  • Molding rib 31 Tip part IL Inseam part W Width ⁇ 1 Inner inclination angle of forming rib ⁇ 2

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Packages (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Provided is a method for manufacturing a carrier tape for electronic components, said method making it possible to effectively eliminate the risk of damage to projecting parts of semiconductor packages or other electronic components. This manufacturing method involves: holding a softened resin sheet between an upper die 2 and a lower die 3 of a mold; hot-press molding a bottomed, low-profile rectangular-tube-shaped accommodating emboss that accommodates a semiconductor package; and forming a position-restricting projection spanned by the lead frame of the semiconductor package between a bottom plate of the accommodating emboss and a raised-bottom seat plate. In the lower die 3, a molding rib 30 for the position-restricting projection is formed so as to project in a tapering manner, and a distal-end part 31 thereof is curved into a rounded shape, thereby reducing the wall thickness of the distal-end part of the position-restricting projection and minimizing the width of the position-restricting projection. Because the width of the position-restricting projection can be reduced to a narrow form, it is possible to eliminate the risk that the lead frame will be easily deformed and damaged due to pressure contact between the position-restricting projection of the accommodating emboss and the lower part of the lead frame of the semiconductor package.

Description

電子部品用キャリアテープの製造方法Manufacturing method of carrier tape for electronic parts
　本発明は、半導体パッケージ等からなる電子部品の収納、供給、保管、在庫管理、輸送等に用いられる電子部品用キャリアテープの製造方法に関するものである。 The present invention relates to a method of manufacturing a carrier tape for electronic parts used for storage, supply, storage, inventory management, transportation, etc. of electronic parts made of semiconductor packages and the like.
　表面実装型の半導体パッケージを保管したり、輸送する場合には、電子部品を効率的に取り扱うことのできる電子部品用キャリアテープが使用されている。この電子部品用キャリアテープは、図６ないし図８に示すように、巻取りリールに巻回される樹脂シート２０Ａと、この樹脂シート２０Ａの長手方向に並設されて表面実装型の半導体パッケージ１０を収納する複数の収納エンボス２１Ａとを備え、製造メーカで製造された後、製造メーカから部品メーカに輸送されたり、あるいは部品メーカからアッセンブリメーカに輸送される（特許文献１参照）。 When storing and transporting surface-mount semiconductor packages, carrier tapes for electronic components that can handle electronic components efficiently are used. 6 to 8, the electronic component carrier tape includes a resin sheet 20A wound around a take-up reel, and a surface-mount type semiconductor package 10 arranged in parallel in the longitudinal direction of the resin sheet 20A. A plurality of storage embosses 21A are stored, and after being manufactured by a manufacturer, it is transported from the manufacturer to a component manufacturer, or from the component manufacturer to an assembly manufacturer (see Patent Document 1).
　表面実装型の半導体パッケージ１０は、例えばＱＦＰタイプの場合、図８に部分的に示すように、平面矩形のパッケージ本体１１を備え、このパッケージ本体１１の前後左右の周面から複数本のリードフレーム１２がそれぞれ並んで突出している。各リードフレーム１２は、パッケージ本体１１の周面から横方向に突出して下方に屈曲しながら伸びるが、この下方に伸びる部分が下降部１３とされ、この下降部１３の先端が屈曲しながら横方向に突出している。 For example, in the case of the QFP type, the surface mount type semiconductor package 10 includes a planar rectangular package body 11 as shown in FIG. 8, and a plurality of lead frames from the front, rear, left and right peripheral surfaces of the package body 11. 12 projecting side by side. Each lead frame 12 protrudes laterally from the peripheral surface of the package body 11 and extends while being bent downward. The downwardly extending portion is a descending portion 13, and the tip of the descending portion 13 is bent while laterally extending. Protruding.
　各収納エンボス２１Ａは、図６や図７に示すように、樹脂シート２０Ａに形成される開口２２Ａと、この開口２２Ａから樹脂シート２０Ａの裏面方向に伸びる周壁２３Ａと、この周壁２３Ａから開口２２Ａの中心部方向に伸びる底板２４Ａと、この底板２４Ａに接続されて半導体パッケージ１０を搭載する台座板２５Ａとを備えて形成されている。底板２４Ａと台座板２５Ａとの間には、半導体パッケージ１０の複数本のリードフレーム１２に跨がれる位置規制突起２６Ａが形成され、この位置規制突起２６Ａが半導体パッケージ１０の位置ずれやリードフレーム１２の変形を防止する。 As shown in FIGS. 6 and 7, each storage emboss 21A includes an opening 22A formed in the resin sheet 20A, a peripheral wall 23A extending from the opening 22A toward the back surface of the resin sheet 20A, and an opening 22A extending from the peripheral wall 23A. A bottom plate 24A extending in the center direction and a base plate 25A for mounting the semiconductor package 10 connected to the bottom plate 24A are formed. Between the bottom plate 24A and the pedestal plate 25A, a position restricting projection 26A that extends over the plurality of lead frames 12 of the semiconductor package 10 is formed. To prevent deformation.
　ところで、リードフレーム１２を用いる表面実装型の半導体パッケージ１０は、電気的接続の信頼性や表面実装性に優れるが、近年の実装密度向上の要請に鑑み、パッケージ本体１１の周面とリードフレーム１２の下方に伸びる下降部１３との間の部分、いわゆる股下部分ＩＬが狭小化されるとともに、複数本のリードフレーム１２のピッチが狭くなってきており、しかも、各リードフレーム１２の益々の小型化が図られている。 By the way, the surface mount type semiconductor package 10 using the lead frame 12 is excellent in the reliability of the electrical connection and the surface mountability. However, in view of the recent demand for improving the mounting density, the peripheral surface of the package body 11 and the lead frame 12 are improved. The portion between the lower part 13 extending downward and the so-called crotch part IL is narrowed, the pitch of the lead frames 12 is becoming narrower, and the lead frames 12 are further reduced in size. Is planned.
特開２０１６‐１２０９６１号公報Japanese Patent Application Laid-Open No. 2016-120961
　従来における電子部品用キャリアテープは、以上のように構成され、収納エンボス２１Ａの底板２４Ａと台座板２５Ａとの間に、幅が略一定の位置規制突起２６Ａが単に形成されるに止まるので、小型化が図られた近年の半導体パッケージ１０の収納や保管に十分に対応することができず、損傷させるおそれがある。 The conventional carrier tape for electronic components is configured as described above, and is small in size because the position restricting protrusion 26A having a substantially constant width is simply formed between the bottom plate 24A and the base plate 25A of the storage emboss 21A. However, it is not possible to sufficiently accommodate the storage and storage of the recent semiconductor package 10 which has been realized, and there is a risk of damage.
　この点について説明すると、収納エンボス２１Ａに半導体パッケージ１０を収納すると、半導体パッケージ１０の股下部分ＩＬが狭い関係上、収納エンボス２１Ａの位置規制突起２６Ａと半導体パッケージ１０のリードフレーム１２との間に隙間が存在せず、収納エンボス２１の位置規制突起２６Ａと半導体パッケージ１０のリードフレーム１２とが圧接する（図８参照）ので、この圧接に伴い、リードフレーム１２が簡単に変形して損傷するおそれがある。 Explaining this point, when the semiconductor package 10 is stored in the storage emboss 21A, the crotch portion IL of the semiconductor package 10 is narrow, so that there is a gap between the position restricting protrusion 26A of the storage emboss 21A and the lead frame 12 of the semiconductor package 10. Since the position restricting protrusion 26A of the storage emboss 21 and the lead frame 12 of the semiconductor package 10 are in pressure contact with each other (see FIG. 8), the lead frame 12 may be easily deformed and damaged due to the pressure contact. is there.
　本発明は上記に鑑みなされたもので、電子部品の突出部が損傷するおそれを有効に排除することのできる電子部品用キャリアテープの製造方法を提供することを目的としている。 The present invention has been made in view of the above, and an object of the present invention is to provide a method for manufacturing a carrier tape for an electronic component that can effectively eliminate the possibility of damage to the protruding portion of the electronic component.
　本発明においては上記課題を解決するため、金型の上型と下型とに樹脂シートを挟み、電子部品を収納する収納エンボスを成形してその底板と台座板との間に電子部品の突出部を支持する位置規制突起を介在する製造方法であり、金型の下型に、位置規制突起用の成形リブを形成してその先端部をＲ形状とすることにより、位置規制突起の先端部の肉厚を薄くし、位置規制突起の幅を抑制することを特徴としている。 In the present invention, in order to solve the above-mentioned problem, a resin sheet is sandwiched between an upper mold and a lower mold of a mold, a storage emboss for storing an electronic component is formed, and an electronic component protrudes between the bottom plate and a base plate. Is a manufacturing method that interposes a position restricting projection that supports a portion, and a tip portion of the position restricting projection is formed by forming a molding rib for the position restricting projection on the lower mold of the mold and making the tip end into an R shape. It is characterized in that the wall thickness of the substrate is reduced and the width of the position restricting projection is suppressed.
　なお、電子部品を半導体パッケージとし、電子部品の突出部を、半導体パッケージのパッケージ本体の周面の少なくとも一部から屈曲して突出するリードフレームとすることが好ましい。
　また、収納エンボスは、樹脂シートに形成される開口と、この開口の周縁部から樹脂シートの裏面方向に伸びる周壁と、この周壁から開口の中心部方向に伸びる底板と、この底板に接続されて半導体パッケージのパッケージ本体に対向する上げ底の台座板とを含み、底板と台座板との間に、半導体パッケージのリードフレームに跨がれる位置規制突起を起立させて形成することができる。 Preferably, the electronic component is a semiconductor package, and the protruding portion of the electronic component is a lead frame that bends and protrudes from at least a part of the peripheral surface of the package body of the semiconductor package.
The storage embossing is connected to the opening formed in the resin sheet, a peripheral wall extending from the periphery of the opening toward the back surface of the resin sheet, a bottom plate extending from the peripheral wall toward the center of the opening, and the bottom plate. The semiconductor package may include a raised bottom pedestal plate facing the package body, and a position restricting projection straddling the lead frame of the semiconductor package may be erected between the bottom plate and the pedestal plate.
　また、成形リブの幅を０．２ｍｍ以上樹脂シートの厚さ以下とすることが好ましい。
　また、成形リブを先細りに形成し、この成形リブの内側傾斜角を４°以下とすることが好ましい。
　また、成形リブを先細りに形成し、この成形リブの外側傾斜角を１０°以下とすることができる。
　また、成形リブの先端Ｒを０．１ｍｍ以上０．２ｍｍ以下とすることができる。 Moreover, it is preferable that the width | variety of a shaping | molding rib shall be 0.2 mm or more and the thickness of a resin sheet or less.
Further, it is preferable that the forming rib is tapered and the inner inclination angle of the forming rib is 4 ° or less.
Further, the forming rib can be tapered, and the outer inclination angle of the forming rib can be made 10 ° or less.
Moreover, the front-end | tip R of a shaping | molding rib can be 0.1 mm or more and 0.2 mm or less.
　ここで、特許請求の範囲における樹脂シートは、熱可塑性樹脂製のシートが好ましい。この樹脂シートと収納エンボスとは、透明、不透明、半透明を特に問うものではない。また、電子部品は、半導体パッケージの場合、少なくとも表面実装型のＱＦＰタイプ、ＤＩＰタイプ、ＳＯＰタイプ等が含まれる。位置規制突起の先端部の厚さは、０．１ｍｍ以上０．２ｍｍ以下が好ましい。 Here, the resin sheet in the claims is preferably a thermoplastic resin sheet. The resin sheet and the storage embossing are not particularly required to be transparent, opaque, or translucent. In the case of a semiconductor package, the electronic component includes at least a surface mount type QFP type, DIP type, SOP type, and the like. The thickness of the tip of the position restricting protrusion is preferably 0.1 mm or more and 0.2 mm or less.
　本発明によれば、下型の成形リブの先端部をＲ形状に形成するので、電子部品用キャリアテープの製造時に、成形リブの先端部に対向する樹脂シートの対向被覆部が成形リブの先端部から根元部方向に移動して薄くなり、収納エンボスの位置規制突起の幅が狭くなる。したがって、収納エンボスの位置規制突起と電子部品の突出部との間に隙間を確保することができ、位置規制突起と突出部との接触に伴い、突出部が変形して損傷するおそれを低減することができる。 According to the present invention, since the tip portion of the lower mold rib is formed in an R shape, the opposite covering portion of the resin sheet facing the tip portion of the molding rib is the tip of the molding rib when the carrier tape for electronic parts is manufactured. It moves from the portion toward the root portion and becomes thinner, and the width of the position restricting projection of the storage emboss becomes narrower. Therefore, a gap can be secured between the position restricting protrusion of the storage embossing and the protruding portion of the electronic component, and the risk of the protruding portion being deformed and damaged due to the contact between the position restricting protrusion and the protruding portion is reduced. be able to.
　本発明によれば、金型の下型に、位置規制突起用の成形リブを形成してその先端部をＲ形状とするので、例え収納エンボスに電子部品を収納しても、電子部品の突出部が損傷するおそれを有効に排除することができるという効果がある。 According to the present invention, the molding rib for the position restricting projection is formed on the lower mold of the mold, and the tip thereof has an R shape. Therefore, even if the electronic component is stored in the storage emboss, the electronic component protrudes. There is an effect that the possibility of damaging the portion can be effectively eliminated.
　請求項２記載の発明によれば、電子部品が半導体パッケージの場合、収納エンボスの位置規制突起と半導体パッケージのリードフレームとが強く接触することが少ないので、リードフレームが変形して損傷するおそれを低減することができる。
　請求項３記載の発明によれば、収納エンボスの位置規制突起と、この位置規制突起を跨ぐ半導体パッケージのリードフレームとの間に隙間を確保することができ、位置規制突起とリードフレームの下方に伸びる部分との接触に伴い、リードフレームが変形して損傷するおそれを低減することができる。 According to the second aspect of the present invention, when the electronic component is a semiconductor package, the position restricting protrusion of the storage emboss and the lead frame of the semiconductor package are unlikely to come into strong contact, so that the lead frame may be deformed and damaged. Can be reduced.
According to the third aspect of the present invention, a gap can be secured between the position restricting protrusion of the storage emboss and the lead frame of the semiconductor package straddling the position restricting protrusion. With the contact with the extending portion, the possibility that the lead frame is deformed and damaged can be reduced.
　請求項４記載の発明によれば、成形リブの幅が０．２ｍｍ以上なので、成形リブの強度を確保し、電子部品用キャリアテープの成形時に金型の変形を招くおそれを排除することができる。また、成形リブの幅が樹脂シートの厚さ以下なので、成形リブの先端部を細くし、電子部品用キャリアテープの成形時に樹脂シートの厚みを変化させることが可能となる。 According to invention of Claim 4, since the width | variety of a shaping | molding rib is 0.2 mm or more, the intensity | strength of a shaping | molding rib is ensured and the possibility of causing a deformation | transformation of a metal mold | die at the time of shaping | molding of the carrier tape for electronic components can be excluded. . Further, since the width of the molding rib is equal to or less than the thickness of the resin sheet, the tip of the molding rib can be narrowed, and the thickness of the resin sheet can be changed when the carrier tape for electronic parts is molded.
　請求項５記載の発明によれば、収納エンボスの位置規制突起の成形性を向上させたり、成形リブの先端部をＲ形状に容易に形成することが可能となる。
　請求項６記載の発明によれば、収納エンボスの位置規制突起の成形性を向上させることが可能となる。
　請求項７記載の発明によれば、成形リブの先端部の強度が不足するのを防ぐことができる。 According to the fifth aspect of the present invention, it is possible to improve the moldability of the position restricting projection of the storage emboss, and to easily form the tip end portion of the molded rib into an R shape.
According to the sixth aspect of the present invention, it is possible to improve the moldability of the position restricting projection of the storage emboss.
According to invention of Claim 7, it can prevent that the intensity | strength of the front-end | tip part of a shaping | molding rib is insufficient.
本発明に係る電子部品用キャリアテープの製造方法の実施形態における金型の上型と下型とを模式的に示す全体説明図である。It is a whole explanatory view showing typically the upper model and the lower model of the metallic mold in the embodiment of the manufacturing method of the carrier tape for electronic parts concerning the present invention. 本発明に係る電子部品用キャリアテープの製造方法の実施形態における金型の成形リブを模式的に示す要部断面説明図である。It is principal part explanatory drawing which shows typically the shaping | molding rib of the metal mold | die in embodiment of the manufacturing method of the carrier tape for electronic components which concerns on this invention. 本発明に係る電子部品用キャリアテープの製造方法の実施形態における収納エンボスを模式的に示す部分断面説明図である。It is a fragmentary sectional view showing typically storage embossing in an embodiment of a manufacturing method of a carrier tape for electronic parts concerning the present invention. 図３の収納エンボスの位置規制突起を模式的に示す要部断面説明図である。It is principal part cross-sectional explanatory drawing which shows typically the position control protrusion of the storage embossing of FIG. 本発明に係る電子部品用キャリアテープの製造方法の実施形態における半導体パッケージのリードフレームと位置規制突起との関係を模式的に示す部分断面説明図である。It is a fragmentary sectional view showing typically the relation between the lead frame of the semiconductor package and the position restricting projection in the embodiment of the manufacturing method of the carrier tape for electronic parts according to the present invention. 従来の収納エンボスを示す部分断面説明図である。It is a fragmentary sectional view showing the conventional storage embossing. 図６の位置規制突起を模式的に示す断面説明図である。FIG. 7 is a cross-sectional explanatory view schematically showing the position restricting protrusion of FIG. 6. 半導体パッケージのリードフレームと従来の位置規制突起との関係を示す部分断面説明図である。It is a fragmentary sectional view showing the relationship between a lead frame of a semiconductor package and a conventional position regulating protrusion.
　以下、図面を参照して本発明の好ましい実施の形態を説明すると、本実施形態における電子部品用キャリアテープの製造方法は、図１ないし図５に示すように、金型１に樹脂シート２０を挟持させ、表面実装型の半導体パッケージ１０用の収納エンボス２１を複数成形してその底板２４と台座板２５との間に半導体パッケージ１０のリードフレーム１２を担持する位置規制突起２６を介在する製造方法であり、金型１の下型３に、位置規制突起２６用の複数の成形リブ３０を形成し、各成形リブ３０の先端部３１を湾曲させることにより、成形時に樹脂シート２０の厚さを部分的に変化させて位置規制突起２６の幅を抑制するようにしている。 Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A manufacturing method of a carrier tape for an electronic component in the present embodiment includes a resin sheet 20 on a mold 1 as shown in FIGS. A manufacturing method in which a plurality of storage embosses 21 for a surface-mount type semiconductor package 10 are formed, and a position restricting protrusion 26 for supporting the lead frame 12 of the semiconductor package 10 is interposed between the bottom plate 24 and the base plate 25. A plurality of molding ribs 30 for the position restricting protrusions 26 are formed on the lower mold 3 of the mold 1 and the tip portions 31 of the respective molding ribs 30 are curved, so that the thickness of the resin sheet 20 can be reduced during molding. The width of the position restricting projection 26 is suppressed by partially changing.
　金型１は、図１に示すように、上下方向に相対向する上型２と下型３とを接離可能に備え、上型２が下型３に軟化した長尺の樹脂シート２０を挟んで型締めされることにより、電子部品用キャリアテープを熱プレス成形する。これら上型２と下型３とは、例えばアズロールド鋼、プリーハードン鋼、焼入れ・焼戻し鋼等により構成される。 As shown in FIG. 1, the mold 1 includes an upper mold 2 and a lower mold 3 that are opposed to each other in the vertical direction so that the upper mold 2 is softened to the lower mold 3. The carrier tape for electronic parts is hot press-molded by sandwiching and clamping. These upper mold | type 2 and lower mold | type 3 are comprised, for example with an azrolled steel, a prehardened steel, quenching and tempering steel.
　表面実装型の半導体パッケージ１０は、図５に部分的に示すように、例えばＱＦＰタイプの場合、平面略正方形の薄いパッケージ本体１１を備え、このパッケージ本体１１の前後左右の周面から複数本のリードフレーム１２がそれぞれ一列に並んで突出しており、各リードフレーム１２がガルウイング形（略Ｌ字形）に屈曲形成される。 As shown partially in FIG. 5, for example, in the case of the QFP type, the surface-mount type semiconductor package 10 includes a thin package body 11 having a substantially square plane, and a plurality of packages are formed from the front, rear, left and right peripheral surfaces of the package body 11. The lead frames 12 protrude in a line, and each lead frame 12 is bent into a gull wing shape (substantially L-shaped).
　パッケージ本体１１は、一般的には１．４ｍｍ～３．８ｍｍ程度の厚さに形成される。また、複数本のリードフレーム１２は、例えば４４～１２０のフレーム数とされ、０．５ｍｍ、０．４ｍｍ、０．３ｍｍ等のピッチで配列される。各リードフレーム１２は、パッケージ本体１１の周面から横方向に突出して下方に屈曲しながら伸びるが、この下方に伸びる部分が下降部１３とされ、この下降部１３の先端が屈曲しながら横方向に突出する。 The package body 11 is generally formed to a thickness of about 1.4 mm to 3.8 mm. The plurality of lead frames 12 are, for example, 44 to 120 frames and are arranged at a pitch of 0.5 mm, 0.4 mm, 0.3 mm, or the like. Each lead frame 12 protrudes laterally from the peripheral surface of the package body 11 and extends while being bent downward. The downwardly extending portion is a descending portion 13, and the tip of the descending portion 13 is bent while laterally extending. Protrusively.
　樹脂シート２０は、図３に示すように、所定の樹脂を含有した成形材料により、一般的には０．２～０．５ｍｍ程度の厚さを有する細長い可撓性の帯形に形成され、長手方向に、複数の収納エンボス２１が所定の間隔で熱プレス成形されており、巻取りリールに巻回される。 As shown in FIG. 3, the resin sheet 20 is formed of a molding material containing a predetermined resin and is generally formed into an elongated flexible belt having a thickness of about 0.2 to 0.5 mm. In the longitudinal direction, a plurality of storage embosses 21 are hot-press molded at predetermined intervals and wound around a take-up reel.
　成形材料の所定の樹脂としては、特に限定されるものではないが、例えばポリスチレン樹脂、ポリエチレンテレフタレート樹脂、ポリカーボネート樹脂、ポリエチレン樹脂、ポリプロピレン樹脂等の熱可塑性樹脂、これらのアロイ、これらの積層物があげられる。この成形材料には、必要に応じ、所定のフィラー、例えば静電気対策用のカーボンブラック、カーボン繊維、ナノファイバー等が適宜配合されたり、上記フィラーが添加された導電樹脂層が積層されたりする。 The predetermined resin of the molding material is not particularly limited, and examples thereof include thermoplastic resins such as polystyrene resin, polyethylene terephthalate resin, polycarbonate resin, polyethylene resin, and polypropylene resin, alloys thereof, and laminates thereof. It is done. If necessary, a predetermined filler such as carbon black, carbon fiber, or nanofiber for preventing static electricity is appropriately blended with the molding material, or a conductive resin layer to which the filler is added is laminated.
　樹脂シート２０の表面には、各種の帯電防止剤、ポリチオフェン、ポリピロール等の導電性高分子塗料等が塗布されたりする。また、樹脂シート２０の両側部を除く表面には、収納エンボス２１内の半導体パッケージ１０を封止するカバーテープが後から貼着される。樹脂シート２０の両側部のうち、少なくとも一側部の長手方向には、図示しない送り用の複数のスプロケット孔が所定の間隔をおき並べて穿孔され、各スプロケット孔が平面円形の丸孔に形成される。 The surface of the resin sheet 20 is coated with various antistatic agents, conductive polymer paints such as polythiophene and polypyrrole. Further, a cover tape for sealing the semiconductor package 10 in the storage emboss 21 is attached to the surface of the resin sheet 20 excluding both side portions later. In the longitudinal direction of at least one side of the both sides of the resin sheet 20, a plurality of feed sprocket holes (not shown) are drilled at predetermined intervals, and each sprocket hole is formed into a flat circular round hole. The
　各収納エンボス２１は、図３や図４に示すように、樹脂シート２０に形成される平面略正方形の開口２２と、この開口２２の周縁部から樹脂シート２０の裏面方向（図３の下方向）に伸びる周壁２３と、この周壁２３の下端部から開口２２の中心部方向（図３の右方向）に伸びる底板２４と、この底板２４に接続されて半導体パッケージ１０のパッケージ本体１１に対向して搭載する上げ底の台座板２５とを備え、背の低い有底角筒形、換言すれば、ポケット形に形成される。 As shown in FIGS. 3 and 4, each storage emboss 21 has a substantially square opening 22 formed in the resin sheet 20, and a rear surface direction of the resin sheet 20 from the periphery of the opening 22 (downward direction in FIG. 3). ), A bottom plate 24 extending from the lower end of the peripheral wall 23 toward the center of the opening 22 (right direction in FIG. 3), and connected to the bottom plate 24 to face the package body 11 of the semiconductor package 10. And a raised bottom pedestal plate 25, and is formed into a short bottomed rectangular tube shape, in other words, a pocket shape.
　収納エンボス２１の周壁２３は、図３に示すように、樹脂シート２０の表面側から裏面下方向に伸びるに従い、開口２２の中心部方向に徐々に僅かに傾斜する。また、底板２４は、平面枠形の平坦な板に形成され、巻取りリールの巻回時に巻取りリールの周面に接触する。台座板２５は、底板２４よりも上方に位置する平面正方形の平板に形成され、平面視で底板２４に包囲されており、巻取りリールの巻回時に巻取りリールの周面に接触する。この台座板２５の中心部には、丸い貫通孔が穿孔され、この貫通孔が半導体パッケージ１０の有無の確認、収納エンボス２１からの半導体パッケージ１０の取り出し、バキュームを用いた半導体パッケージ１０の姿勢制御に利用される。 As shown in FIG. 3, the peripheral wall 23 of the storage emboss 21 gradually and slightly inclines toward the center of the opening 22 as it extends from the front surface side of the resin sheet 20 toward the lower back surface. Further, the bottom plate 24 is formed as a flat plate having a flat frame shape, and contacts the peripheral surface of the take-up reel when the take-up reel is wound. The pedestal plate 25 is formed as a planar square flat plate positioned above the bottom plate 24, and is surrounded by the bottom plate 24 in plan view, and contacts the peripheral surface of the take-up reel when the take-up reel is wound. A round through hole is drilled in the center of the base plate 25. This through hole confirms the presence or absence of the semiconductor package 10, takes out the semiconductor package 10 from the storage emboss 21, and controls the attitude of the semiconductor package 10 using vacuum. Used for
　底板２４の内周縁部と台座板２５の周縁部との間には図３ないし図５に示すように、半導体パッケージ１０の複数本のリードフレーム１２に僅かな隙間を介して跨がれる平面枠形の位置規制突起２６が起立して形成される。この位置規制突起２６は、半導体パッケージ１０のパッケージ本体１１とリードフレーム１２の下降部１３との間に僅かな隙間を介して嵌合する断面略逆Ｊ字形の中空に形成され、リードフレーム１２側に位置する長片２７の下端部が底板２４の内周縁部に接続されるとともに、パッケージ本体１１側に位置する短片２８の端部が台座板２５の周縁部に接続されて台座板２５を包囲しており、半導体パッケージ１０の位置ずれやリードフレーム１２の変形を防止するよう機能する。 As shown in FIGS. 3 to 5, a planar frame that spans a plurality of lead frames 12 of the semiconductor package 10 with a slight gap between the inner peripheral edge of the bottom plate 24 and the peripheral edge of the base plate 25. A shape position restricting projection 26 is formed upright. The position restricting projection 26 is formed in a hollow shape having a substantially inverted J-shaped cross section that fits between the package body 11 of the semiconductor package 10 and the descending portion 13 of the lead frame 12 with a slight gap, and is on the lead frame 12 side. The lower end of the long piece 27 located on the bottom plate 24 is connected to the inner peripheral edge of the bottom plate 24, and the end of the short piece 28 located on the package body 11 side is connected to the peripheral edge of the base plate 25 to surround the base plate 25. Thus, the semiconductor package 10 functions to prevent displacement of the semiconductor package 10 and deformation of the lead frame 12.
　位置規制突起２６の湾曲した先端部２９の厚さは、位置規制突起２６の強度を維持する観点から、０．１ｍｍ以上０．２ｍｍ以下、好ましくは０．１ｍｍ以上０．１８ｍｍ以下、より好ましくは０．１ｍｍ以上０．１５ｍｍ以下が良い。 From the viewpoint of maintaining the strength of the position restricting protrusion 26, the thickness of the curved tip portion 29 of the position restricting protrusion 26 is 0.1 mm or more and 0.2 mm or less, preferably 0.1 mm or more and 0.18 mm or less, more preferably 0.1 mm or more and 0.15 mm or less are good.
　複数の成形リブ３０は、金型１の下型３のキャビティ４内にそれぞれ起立して突出形成される。各成形リブ３０は、図２に示すように、基本的には上方に向かうに従い、徐々に細くなる先細りの二等辺三角形にマニシングセンタ等で加工され、先端部３１が僅かに丸いＲ形状に湾曲形成されており、電子部品用キャリアテープの熱プレス成形時に樹脂シート２０を部分的に延伸して位置規制突起２６の先端部２９の肉厚を薄くし、位置規制突起２６の幅を狭くするよう機能する。 The plurality of molding ribs 30 are formed to protrude in the cavity 4 of the lower mold 3 of the mold 1. As shown in FIG. 2, each forming rib 30 is basically processed into a tapered isosceles triangle that gradually becomes thinner as it goes upward by a machining center or the like, and the tip 31 has a slightly rounded R shape. The resin sheet 20 is partially stretched at the time of hot press molding of the electronic component carrier tape to reduce the thickness of the tip portion 29 of the position restricting protrusion 26 and to narrow the width of the position restricting protrusion 26. It works as follows.
　成形リブ３０の根元部の幅Ｗは、０．２ｍｍ以上樹脂シート２０の厚さ以下に設定される。したがって、成形リブ３０の幅Ｗは、樹脂シート２０の厚さが０．３ｍｍの場合には、０．２ｍｍ以上０．３ｍｍ以下とされ、樹脂シート２０の厚さが０．５ｍｍの場合には、０．２ｍｍ以上０．５ｍｍ以下とされる。これは、成形リブ３０の幅Ｗが０．２ｍｍ未満の場合には、成形リブ３０の強度が不足し、熱プレス成形時に金型１の変形を招くおそれがあるからである。これに対し、成形リブ３０の幅Ｗが樹脂シート２０の厚さを越える場合には、成形リブ３０の先端部３１が太くなり、熱プレス成形による樹脂シート２０の延伸時に樹脂シート２０の厚みが部分的に変化しなくなるからである。 The width W of the root portion of the molding rib 30 is set to 0.2 mm or more and the thickness of the resin sheet 20 or less. Therefore, the width W of the molding rib 30 is set to 0.2 mm or more and 0.3 mm or less when the thickness of the resin sheet 20 is 0.3 mm, and when the thickness of the resin sheet 20 is 0.5 mm. , 0.2 mm or more and 0.5 mm or less. This is because when the width W of the molding rib 30 is less than 0.2 mm, the strength of the molding rib 30 is insufficient, and the mold 1 may be deformed during hot press molding. On the other hand, when the width W of the molding rib 30 exceeds the thickness of the resin sheet 20, the tip portion 31 of the molding rib 30 becomes thick, and the thickness of the resin sheet 20 is increased when the resin sheet 20 is stretched by hot press molding. This is because it does not change partially.
　成形リブ３０の内側傾斜角θ１は、位置規制突起２６の成形性を向上させたり、成形リブ３０の先端部３１を容易にＲ形状に湾曲形成する観点から、４°以下、好ましくは１°以上４°以下、より好ましくは２°以上４°以下、さらに好ましくは３°以上４°以下が良い。また、成形リブ３０の外側傾斜角θ２は、位置規制突起２６の成形性を向上させる観点から、１０°以下が良い。成形リブ３０が先細りの二等辺三角形の場合には、１０°以下、好ましくは１°以上１０°以下、より好ましくは２°以上１０°以下、さらに好ましくは４°以上１０°以下が良い。 The inner inclination angle θ1 of the molding rib 30 is 4 ° or less, preferably 1 ° or more, from the viewpoint of improving the moldability of the position restricting projection 26 or easily forming the tip portion 31 of the molding rib 30 into an R shape. It is 4 ° or less, more preferably 2 ° or more and 4 ° or less, and further preferably 3 ° or more and 4 ° or less. Further, the outer inclination angle θ2 of the forming rib 30 is preferably 10 ° or less from the viewpoint of improving the formability of the position restricting protrusion 26. When the forming rib 30 is a tapered isosceles triangle, it is 10 ° or less, preferably 1 ° or more and 10 ° or less, more preferably 2 ° or more and 10 ° or less, and further preferably 4 ° or more and 10 ° or less.
　成形リブ３０の先端部３１の先端Ｒは、成形リブ３０の先端部３１の強度不足を解消する観点から、０．１ｍｍ以上０．２ｍｍ以下、好ましくは０．１４ｍｍ以上０．２ｍｍ以下、より好ましくは０．１８ｍｍ以上０．２ｍｍ以下が良い。また、成形リブ３０の高さは、特に限定されるものではなく、半導体パッケージ１０やリードフレーム１２の形状等に応じて変更される。 The tip R of the tip portion 31 of the molding rib 30 is 0.1 mm or more and 0.2 mm or less, preferably 0.14 mm or more and 0.2 mm or less, more preferably from the viewpoint of eliminating the strength shortage of the tip portion 31 of the molding rib 30. Is preferably 0.18 mm or more and 0.2 mm or less. Further, the height of the forming rib 30 is not particularly limited, and is changed according to the shape of the semiconductor package 10 or the lead frame 12.
　上記構成において、電子部品用キャリアテープを製造する場合には、金型１の上型２と下型３とを型開きし、下型３のキャビティ４に、予熱して軟化させた長尺の樹脂シート２０をセットして沿わせた後、上型２と下型３とを型締めして圧力を作用させれば、樹脂シート２０の延伸・変形により、電子部品用キャリアテープを熱プレス成形することができる。この熱プレス成形の際、成形リブ３０の湾曲した先端部３１を対向被覆する樹脂シート２０の対向被覆部２０ａは、成形リブ３０の先端部３１から根元部方向に移動し、薄くなるので、位置規制突起２６が細くなる（図４参照）。 In the above configuration, when manufacturing a carrier tape for electronic parts, the upper mold 2 and the lower mold 3 of the mold 1 are opened, and the cavity 4 of the lower mold 3 is preheated and softened. After the resin sheet 20 is set and aligned, if the upper mold 2 and the lower mold 3 are clamped and pressure is applied, the carrier tape for electronic parts is hot press molded by stretching and deformation of the resin sheet 20 can do. At the time of this hot press molding, the opposing covering portion 20a of the resin sheet 20 that opposes the curved tip portion 31 of the molding rib 30 moves from the tip portion 31 of the molding rib 30 toward the root portion and becomes thin. The restricting protrusion 26 becomes thin (see FIG. 4).
　上記によれば、成形リブ３０の先端部３１をフラットに形成するのではなく、Ｒ形状に湾曲形成するので、位置規制突起２６の幅を狭くして細く形成することができる。したがって、例え半導体パッケージ１０の股下部分ＩＬが狭くても、収納エンボス２１の位置規制突起２６と半導体パッケージ１０の小型化が図られたリードフレーム１２との間に隙間を確保することができ（図５参照）、位置規制突起２６とリードフレーム１２の下降部１３との圧接に伴い、リードフレーム１２が簡単に変形して損傷するおそれを排除することができる。 According to the above, the distal end portion 31 of the forming rib 30 is not formed flat but curved in an R shape, so that the position restricting projection 26 can be formed narrow and narrow. Therefore, even if the crotch portion IL of the semiconductor package 10 is narrow, a gap can be secured between the position restricting projection 26 of the storage emboss 21 and the lead frame 12 in which the semiconductor package 10 is reduced in size (see FIG. 5), the risk of the lead frame 12 being easily deformed and damaged in accordance with the pressure contact between the position restricting projection 26 and the descending portion 13 of the lead frame 12 can be eliminated.
　また、成形リブ３０の基本形を先細りの二等辺三角形とすれば、成形リブ３０の内外両側に抜き勾配をそれぞれ確保して離型抵抗を減少させることができる。したがって、下型３の成形リブ３０から樹脂シート２０の位置規制突起２６を容易に脱型することができる。 Further, if the basic shape of the forming rib 30 is a tapered isosceles triangle, it is possible to secure a draft on both the inner and outer sides of the forming rib 30 and reduce the mold release resistance. Therefore, the position restricting projection 26 of the resin sheet 20 can be easily removed from the molding rib 30 of the lower mold 3.
　なお、上記実施形態では半導体パッケージ１０におけるパッケージ本体１１の前後左右の周面から複数本のリードフレーム１２をそれぞれ突出させたが、パッケージ本体１１の左右両側面から複数本のリードフレーム１２をそれぞれ突出させても良い。また、収納エンボス２１の台座板２５を平面正方形に形成したが、台座板２５の周縁部を除く中央部を断面略トレイ形に凹ませて底板２４の高さに揃えても良い。さらに、成形リブ３０の基本形を先細りの二等辺三角形としたが、先細りの直角三角形としてその先端部３１をＲ形状に湾曲形成しても良い。 In the above embodiment, the plurality of lead frames 12 protrude from the front, rear, left and right peripheral surfaces of the package body 11 in the semiconductor package 10, but the plurality of lead frames 12 protrude from the left and right side surfaces of the package body 11. You may let them. Further, although the base plate 25 of the storage emboss 21 is formed in a planar square shape, the central portion excluding the peripheral portion of the base plate 25 may be recessed in a substantially tray shape so as to be aligned with the height of the bottom plate 24. Furthermore, although the basic shape of the forming rib 30 is a tapered isosceles triangle, the tip 31 thereof may be curved into an R shape as a tapered right triangle.
　以下、本発明に係る電子部品用キャリアテープの製造方法の実施例を比較例と共に説明する。
〔実施例１〕
　電子部品用キャリアテープを製造するため、金型の上型と下型とを型開きし、下型のキャビティに、加熱して軟化させた樹脂シートをセットして沿わせた後、上型と下型とを型締めして圧力を作用させ、ＱＦＰタイプの半導体パッケージを収納エンボスに収納する電子部品用キャリアテープを熱プレス成形した。 Hereinafter, an example of a manufacturing method of a carrier tape for electronic parts concerning the present invention is described with a comparative example.
[Example 1]
In order to manufacture carrier tapes for electronic parts, the upper and lower molds of the mold are opened, and a resin sheet heated and softened is set in the cavity of the lower mold. The lower mold was clamped to apply pressure, and a carrier tape for electronic parts that accommodates a QFP type semiconductor package in a storage emboss was hot-press molded.
　下型の成形リブは、内側傾斜角θ１を４°、外側傾斜角θ２を０°、先端Ｒを０．２ｍｍにそれぞれ設定した。また、樹脂シートは、ポリスチレン樹脂製のシートを使用した。熱プレス成形した収納エンボスの位置規制突起の先端部の厚さを測定したところ、０．１５ｍｍであった。 The lower mold forming rib was set such that the inner inclination angle θ1 was 4 °, the outer inclination angle θ2 was 0 °, and the tip R was 0.2 mm. Moreover, the sheet | seat made from a polystyrene resin was used for the resin sheet. It was 0.15 mm when the thickness of the front-end | tip part of the position control protrusion of the hot embossed storage emboss was measured.
〔実施例２〕
　基本的には、実施例１と同様であるが、下型の成形リブの内側傾斜角θ１を４°、外側傾斜角θ２を１０°、先端Ｒを０．２ｍｍにそれぞれ設定した。また、樹脂シートは、ポリスチレン樹脂製のシートを用いた。熱プレス成形した収納エンボスの位置規制突起の先端部の厚さを測定したところ、０．１０ｍｍであった。 [Example 2]
Basically, it was the same as in Example 1, but the inner inclination angle θ1 of the lower mold forming rib was set to 4 °, the outer inclination angle θ2 to 10 °, and the tip R to 0.2 mm. Moreover, the sheet | seat made from a polystyrene resin was used for the resin sheet. It was 0.10 mm when the thickness of the front-end | tip part of the position control protrusion of the hot embossed storage embossing was measured.
〔比較例〕
　電子部品用キャリアテープを製造するため、金型の上型と下型とを型開きし、下型のキャビティに、加熱して軟化させた樹脂シートをセットして沿わせた後、上型と下型とを型締めして圧力を作用させ、ＱＦＰタイプの半導体パッケージを収納エンボスに収納する電子部品用キャリアテープを熱プレス成形した。 [Comparative Example]
In order to manufacture carrier tapes for electronic parts, the upper and lower molds of the mold are opened, and a resin sheet heated and softened is set in the cavity of the lower mold. The lower mold was clamped to apply pressure, and a carrier tape for electronic parts that accommodates a QFP type semiconductor package in a storage emboss was hot-press molded.
　下型の成形リブは、内側傾斜角θ１を４°、外側傾斜角θ２を０°、先端Ｒを０．０ｍｍにそれぞれ設定した。また、樹脂シートは、実施例同様、ポリスチレン樹脂製のシートとした。熱プレス成形した収納エンボスの位置規制突起の先端部の厚さを測定したところ、０．２ｍｍであった。 The lower mold forming rib was set such that the inner inclination angle θ1 was 4 °, the outer inclination angle θ2 was 0 °, and the tip R was 0.0 mm. The resin sheet was a polystyrene resin sheet as in the examples. It was 0.2 mm when the thickness of the front-end | tip part of the position control protrusion of the hot embossed storage emboss was measured.
〔評　価〕
　実施例１、２の収納エンボスに半導体パッケージを収納した後、収納エンボスの位置規制突起と半導体パッケージのリードフレームとの接触関係を検査したところ、位置規制突起とリードフレームとの間に隙間が形成されており、リードフレームが変形して損傷するおそれがないことが判明した。 [Evaluation]
After the semiconductor package was stored in the storage emboss of Examples 1 and 2, the contact relationship between the position restriction protrusion of the storage emboss and the lead frame of the semiconductor package was inspected, and a gap was formed between the position restriction protrusion and the lead frame. It has been found that there is no risk of the lead frame being deformed and damaged.
　これに対し、比較例の収納エンボスに半導体パッケージを収納した後、収納エンボスの位置規制突起と半導体パッケージのリードフレームとの接触関係を検査したところ、成形リブの先端部がフラットなので、位置規制突起が太く、位置規制突起とリードフレームとが接触した。 On the other hand, after storing the semiconductor package in the storage emboss of the comparative example, when the contact relationship between the position restriction protrusion of the storage emboss and the lead frame of the semiconductor package was inspected, the tip portion of the molding rib was flat. The position restricting protrusion and the lead frame were in contact with each other.
　本発明に係る電子部品用キャリアテープの製造方法は、電気、電子、半導体の製造分野で使用される。 The method for producing a carrier tape for electronic parts according to the present invention is used in the fields of electrical, electronic and semiconductor production.
１　　　　金型
２　　　　上型
３　　　　下型
４　　　　キャビティ
１０　　　半導体パッケージ（電子部品）
１１　　　パッケージ本体
１２　　　リードフレーム（突出部）
１３　　　下降部
２０　　　樹脂シート
２０ａ　　対向被覆部
２１　　　収納エンボス
２２　　　開口
２３　　　周壁
２４　　　底板
２５　　　台座板
２６　　　位置規制突起
２７　　　長片
２８　　　短片
２９　　　先端部
３０　　　成形リブ
３１　　　先端部
ＩＬ　　　股下部分
Ｗ　　　　成形リブの根元部の幅
θ１　　　成形リブの内側傾斜角
θ２　　　成形リブの外側傾斜角 1 Mold 2 Upper mold 3 Lower mold 4 Cavity 10 Semiconductor package (electronic component)
11 Package body 12 Lead frame (protrusion)
13 Lower part 20 Resin sheet 20a Opposite covering part 21 Storage emboss 22 Opening 23 Peripheral wall 24 Bottom plate 25 Base plate 26 Position restricting projection 27 Long piece 28 Short piece 29 Tip part 30 Molding rib 31 Tip part IL Inseam part W Width θ1 Inner inclination angle of forming rib θ2 Outer inclination angle of forming rib

Claims (7)

  1. 　金型の上型と下型とに樹脂シートを挟み、電子部品を収納する収納エンボスを成形してその底板と台座板との間に電子部品の突出部を支持する位置規制突起を介在する電子部品用キャリアテープの製造方法であり、
    　金型の下型に、位置規制突起用の成形リブを形成してその先端部をＲ形状とすることにより、位置規制突起の先端部の肉厚を薄くし、位置規制突起の幅を抑制することを特徴とする電子部品用キャリアテープの製造方法。     An electronic device in which a resin sheet is sandwiched between an upper mold and a lower mold of a mold, a storage emboss for storing electronic components is formed, and a position restricting projection for supporting a protruding portion of the electronic component is interposed between the bottom plate and the base plate A method for manufacturing a carrier tape for parts,
    By forming a molding rib for the position restricting projection on the lower mold of the mold and making the tip end into an R shape, the thickness of the tip of the position restricting projection is reduced and the width of the position restricting projection is suppressed. The manufacturing method of the carrier tape for electronic components characterized by the above-mentioned.
  2. 　電子部品を半導体パッケージとし、電子部品の突出部を、半導体パッケージのパッケージ本体の周面の少なくとも一部から屈曲して突出するリードフレームとする請求項１記載の電子部品用キャリアテープの製造方法。 The method of manufacturing a carrier tape for an electronic component according to claim 1, wherein the electronic component is a semiconductor package, and the protruding portion of the electronic component is a lead frame that is bent and protrudes from at least a part of the peripheral surface of the package body of the semiconductor package.
  3. 　収納エンボスは、樹脂シートに形成される開口と、この開口の周縁部から樹脂シートの裏面方向に伸びる周壁と、この周壁から開口の中心部方向に伸びる底板と、この底板に接続されて半導体パッケージのパッケージ本体に対向する上げ底の台座板とを含み、底板と台座板との間に、半導体パッケージのリードフレームに跨がれる位置規制突起を起立させて形成する請求項２記載の電子部品用キャリアテープの製造方法。 The storage emboss includes an opening formed in the resin sheet, a peripheral wall extending from the periphery of the opening toward the back surface of the resin sheet, a bottom plate extending from the peripheral wall toward the center of the opening, and a semiconductor package connected to the bottom plate 3. A carrier for electronic parts as claimed in claim 2, further comprising a raised base plate opposed to the package body, wherein a position restricting projection straddling the lead frame of the semiconductor package is erected between the bottom plate and the base plate. Tape manufacturing method.
  4. 　成形リブの幅を０．２ｍｍ以上樹脂シートの厚さ以下とする請求項１、２、又は３記載の電子部品用キャリアテープの製造方法。 4. The method for producing a carrier tape for electronic parts according to claim 1, wherein the width of the molding rib is 0.2 mm or more and not more than the thickness of the resin sheet.
  5. 　成形リブを先細りに形成し、この成形リブの内側傾斜角を４°以下とする請求項１ないし４のいずれかに記載の電子部品用キャリアテープの製造方法。 The method for producing a carrier tape for electronic parts according to any one of claims 1 to 4, wherein the molding rib is tapered and the inner inclination angle of the molding rib is 4 ° or less.
  6. 　成形リブを先細りに形成し、この成形リブの外側傾斜角を１０°以下とする請求項１ないし４のいずれかに記載の電子部品用キャリアテープの製造方法。 The method for producing a carrier tape for electronic parts according to any one of claims 1 to 4, wherein the molding rib is tapered and the outer inclination angle of the molding rib is 10 ° or less.
  7. 　成形リブの先端Ｒを０．１ｍｍ以上０．２ｍｍ以下とする請求項４、５、又は６記載の電子部品用キャリアテープの製造方法。 The manufacturing method of the carrier tape for electronic components of Claim 4, 5 or 6 which makes the front-end | tip R of a shaping | molding rib 0.1 mm or more and 0.2 mm or less.
PCT/JP2018/019381 2017-06-02 2018-05-18 Method for manufacturing carrier tape for electronic components WO2018221277A1 (en)

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JPH07195553A (en) * 1993-12-28 1995-08-01 Urawa Polymer Kk Manufacture of carrier tape
JPH08207132A (en) * 1995-02-01 1996-08-13 Shin Etsu Polymer Co Ltd Production of carrier tape
JP2003146363A (en) * 2001-11-08 2003-05-21 Shin Etsu Polymer Co Ltd Carrier tape
JP2011240945A (en) * 2010-05-17 2011-12-01 Shin Etsu Polymer Co Ltd Method for winding embossed carrier tape and embossed carrier tape

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JPH07101461A (en) * 1993-09-30 1995-04-18 Yayoi Kk Emboss carrier tape
JP3985942B2 (en) * 2001-10-17 2007-10-03 住友ベークライト株式会社 Manufacturing method of embossed carrier tape
CN103660273A (en) * 2013-12-09 2014-03-26 苏州康铂塑料科技有限公司 Device and method for manufacturing carrier bands
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JPH07195553A (en) * 1993-12-28 1995-08-01 Urawa Polymer Kk Manufacture of carrier tape
JPH08207132A (en) * 1995-02-01 1996-08-13 Shin Etsu Polymer Co Ltd Production of carrier tape
JP2003146363A (en) * 2001-11-08 2003-05-21 Shin Etsu Polymer Co Ltd Carrier tape
JP2011240945A (en) * 2010-05-17 2011-12-01 Shin Etsu Polymer Co Ltd Method for winding embossed carrier tape and embossed carrier tape

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JP2018203329A (en) 2018-12-27

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