JP2003146363A - Carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape which does not require a dimensional design by fitting to a spot and can be inexpensively manufactured and has a storing recessed part in which lead terminals of an electronic part can be stored without being bent. SOLUTION: The carrier tape 10 in which a plurality of storing recessed parts 11 for storing the electronic component 100 with a mold part 101 and the lead terminals 102 on the side face of the mold part are formed by specified intervals has a pinching part which is projected on the bottom face 12 of the storing recessed part and pinches the side end parts. 104 of the underside 103 on the bottom face side of the mold part by the first inclined faces 13 expanding and opening on the opening part side of the storing recessed part and facing each other to support and position the electronic component and is not brought into contact with the lead terminals.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an electronic component Q.
FP (Quad Flat Package), SOP
The present invention relates to an electronic component packaging container suitable for accommodating a semiconductor package such as (Small Outlined Package), and a carrier tape suitable for preventing displacement of electronic components after accommodating.

[0002]

2. Description of the Related Art A conventional carrier tape is disclosed, for example, in Japanese Patent Publication No. 4-42260 or Japanese Patent Publication No. 7-23172.
It is described in Japanese Patent Publication No. As shown in FIGS. 7 and 8, the carrier tape disclosed in the former publication has a storage recess 7 for storing an electronic component 100 as shown in FIG. 10 in a long strip.
1 is formed at regular intervals, a bottom 72 of the storage recess 71 is provided with an upwardly convex base 73, and a plurality of protrusions 74 are formed on the upper peripheral edge thereof. Parts body (hereinafter,
The mold part 101 is a base 73 surrounded by a protrusion 74.
The electronic component 100 is mounted on the upper surface 75 of the electronic component 100, its movement in the horizontal direction is regulated by the projection 74, the electronic component 100 is reliably positioned within a range of deviation that the recognition device of the electronic component mounting machine can handle, and the lead wire of the electronic component 100 ( Hereinafter, the lead terminal) 102 is protected.

The carrier tape disclosed in the latter publication is a carrier tape in which a large number of cavities (corresponding to the above-mentioned storage recesses) for storing electronic parts as shown in FIG. And the cavity is
It comprises a pedestal formed on the bottom surface thereof and a groove-shaped lead accommodating portion provided around the pedestal. A protruding ridge is provided on the upper surface side edge of the pedestal, and an interval between the protruding ridge and the protruding ridge facing the ridge is formed so as to sandwich the bottom surface of the mold portion of the semiconductor device. A groove is formed in the vicinity of a corner formed by the ridge and the upper surface of the pedestal, and the bottom surface of the mold of the semiconductor device is fitted between the two ridges and the surface formed by the upper surface of the pedestal so that the upper surface of the pedestal is joined. It is fixed exactly on.

[0004]

However, in the carrier tape disclosed in the above-mentioned publication, the mold part of the electronic component is received by the base or the like, and the protrusions or protrusions provided at the end of the base upper surface side. Thus, the electronic component can be reliably positioned and fixed by supporting the electronic component from the outer periphery or sandwiching the side surface of the mold portion, but there is a problem due to the following dimensional variation.

That is, the outer dimension W of the molded portion 101 of the electronic component 100 shown in FIG. 10 has variations (dimension crossovers), and in general, the carrier tape is formed by press molding or pressure molding using a thermoplastic sheet. Since it is shaped by vacuum forming, as shown in FIG.
3 The dimension A between the upper protrusions 74 also varies due to molding. Therefore, when the electronic component 100 is placed and housed on the base 73, a gap B is formed between the mold portion 101 and the protruding portion 74.
You can Depending on the size of the gap B, the electronic component 100
There is a risk that the electronic component 100 will shift to one side after being stored, and the protrusion 74 and the lead terminal 102 will come into contact with each other and bend.

In order to prevent the occurrence of the above-mentioned problems, the size tolerance of the outer dimension W may be set so that the gap B is made as small as possible. However, as described above, since there is a size variation in the carrier tape, the size tolerance is reduced. The problem cannot be solved only by reducing the size, and the size of the actual product is determined by determining the size between the protrusions in the storage recess of the carrier tape while observing the size variation of the electronic component.

Therefore, in the dimension designing, the outer dimension W of the electronic component, the dimension A between the protrusions of the carrier tape, and the like are repeatedly measured, and the work is performed while confirming the variation in the dimensions. Time is required for this, or in the mold for molding the carrier tape, it is necessary to perform a re-molding by matching the actual product, resulting in a substantial increase in manufacturing cost.

Further, since the base for receiving the mold part of the electronic component is formed by molding, the upper surface of the base is often not formed in a uniform plane. Even if the intervals between the protrusions or the protrusions are properly formed, if the flatness of the upper surface of the base is impaired, the electronic component is mounted while being tilted.
As a result, since the electronic components are not accurately positioned, the lead terminals may come into contact with the protrusions or protrusions and bend.

The present invention has been made in order to solve the above-mentioned problems, does not require dimensional design according to the actual product, can be manufactured at low cost, and has a storage recess for storing lead terminals of electronic parts without bending. Is to provide the tape.

[0010]

SUMMARY OF THE INVENTION The present invention is a carrier tape in which a plurality of storage recesses for storing an electronic component having a mold portion and lead terminals on the side surface of the mold portion are formed at predetermined intervals. A first end which is formed so as to project from a bottom surface of the storage recess and which has a side end portion of a lower surface of the mold portion on the bottom surface side that expands toward the opening side of the storage recess.
The electronic component is supported and positioned by being sandwiched by an inclined surface, and has a sandwiching portion that does not come into contact with the lead terminals.

The first inclined surface may be formed of two continuous inclined surfaces, and the holding portion has a relief shape in which a corner of the lower surface of the mold portion is located so as to allow the corner to escape. Some are preferred.

[0012]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a first embodiment of a carrier tape according to the present invention.

As shown in FIG. 1, the carrier tape 10 according to the first embodiment of the present invention has a bottom surface 12 of a storage recess 11,
The side end portion 10 of the lower surface 103 on the bottom surface 12 side of the mold portion 101 that does not contact the lead terminal 102 of the electronic component 100.
4 has a sandwiching portion 13A projectingly formed on the bottom surface 12 for sandwiching the first inclined surface 13 that is opposed to the opening of the storage recess 11 and supporting and positioning the electronic component 100.

That is, in the holding portion 13A, the storage recess 1
The lower surface 103 of the mold part 101 of the electronic component 100 is attached to the first inclined surface 13 formed inside the base 14 provided on the first electronic component 100.
By abutting the side end portion 104 of the, the positioning is surely performed. At this time, the lower surface 10 of the mold part 100
The height and the inclination angle of the first inclined surface 13 are set and provided so that 3 does not contact the upper surface 15 of the base 14. It should be noted that the top surface 1 is not the shape of the base 14 but the top surface 1 as shown in FIG.
5 may be formed in the same plane as the bottom surface 12 and only the sandwiching portion 13A may be formed on the bottom surface 12.

As shown in FIG. 2, the second inclined surface 16 which is the outer wall surface of the base 14 is formed substantially vertically, and the height H ₁ of the first inclined surface is the stored electronic component 100. The height H _{2 of} the lead terminal 102 is kept lower than the height H ₂ of the horizontal portion 105 of the lead terminal 102, and the horizontal portion 105 of the lead terminal 102 is kept at a height at which the tips of the first inclined surface 13 and the second inclined surface 16 do not come into contact with each other. This prevents the lead terminal from bending. The intersection of the first inclined surface and the second inclined surface may be formed in an R shape or a C surface shape in addition to the shape shown in FIG.

Further, the second inclined surface 16 is formed substantially vertically,
The lead terminal 102 is prevented from coming into contact with the second inclined surface 16. In addition, the upper surface 15 of the base 14 has the electronic component 1
By keeping the gap D that does not contact the lower surface 103 of the mold part 101 of 00, unlike the conventional mounting on the base 73 of the carrier tape 70, the influence of the flatness of the upper surface 15 of the base 14 is eliminated. .

An inclination angle θ ₂ (where θ ₂ is an angle between the horizontal surface and the second inclined surface 16) formed by the second inclined surface 16 which is the outer wall surface of the base 14 and a horizontal plane perpendicular to the depth direction of the storage recess. Of the smaller part than 90 °), the length of the mold part 101 of the electronic component 100 and the horizontal part 105 of the lead terminal 102 may differ depending on the electronic component.
If it is too small, it may come into contact with the lead terminal 102, so it is 75 ° to 89 °, and preferably 80 ° to 89 °.

Further, as shown in FIG. 2, the first inclined surface 13
The angle of inclination θ ₁ with respect to the horizontal plane perpendicular to the depth direction of the storage recess (θ ₁ is represented by a value smaller than 90 ° among the angles formed by the horizontal plane and the first inclined surface 13) is approximately 45 °.
Is the most suitable angle. If the inclination angle θ ₁ is larger than about 45 °, when the electronic component 100 is housed and positioned, the outer dimension W of the mold portion 101 of the electronic component 100 is increased or decreased, whereby the upper surface 106 of the mold portion 101 of the housed electronic component 100 is changed. When the change in the position becomes large and is less than about 45 °, the first inclined surface 13 becomes gentle, and the lateral movement amount of the electronic component 100 increases due to the increase or decrease in the outer dimension W of the mold part 101. Therefore, the inclination angle θ ₁ of the first inclined surface 13 is set to 45 ° ± 45 ° depending on the accuracy of the outer dimension W of the mold part 101 of the electronic component 100 to be stored.
It is preferable to appropriately select from the range of 10 °, and more preferably the range of 45 ° ± 5 °.

The second inclined surface 16 and the side wall 17 of the storage recess 11.
A space between and is a storage groove portion 18 that is a space in which the lead terminal 102 is stored. The width of the storage groove portion 18 is equal to the width of the lead terminal 10.
It suffices that the tip of the lead wire 2 has a sufficient size so that it does not come into contact with the side wall 17 of the housing recess 11, and the depth of the housing groove 18 is such that the tip of the lead terminal 102 is the bottom of the housing groove 18 when the electronic component 100 is positioned. That is, it is sufficient if there is a depth that does not contact the bottom surface 12. Further, the storage groove portion 18 is formed with a sufficient size so that the leading end of the lead terminal 102 does not contact the carrier tape 10, but since the storage recess portion 11 may be deformed due to external stress, as shown in FIG. Alternatively, the side wall 17 and the bottom surface 12 of the storage recess 11 may be formed with a groove-shaped rib 31.

First and second parts formed in the storage recess 11
As shown in FIG. 4, the inclined surfaces 13 and 16 may be formed in a continuous form in which the corners are connected, but the corners of the mold portion 101 of the electronic component 100 to be housed are the first and second inclined surfaces. For those that hit the corners 19 of 13 and 16,
Has a relief shape that allows the corners of the mold portion 101 to escape.

As for the shape of the relief, as shown in FIG. 5 (a), the first and second inclined surfaces 51 and 52 are formed at the corners 5
A structure which is not formed in the vicinity of 3 or FIG.
As shown in (b), it is preferable that the first and second inclined surfaces 54 and 55 have holes 56 at the corners. Hole 5
The shape of 6 is not limited to a circle, but may be an ellipse, a polygon, or the like. Further, as the escape shape, the corner portion 19 in FIG. 4 may have an R shape.

Next, the second carrier tape according to the present invention is used.
An embodiment will be described. As shown in FIG. 6, in the carrier tape 60 of the second embodiment of the present invention, the first inclined surface of the carrier tape 10 is composed of a continuous lower inclined surface 61 and an upper inclined surface 62. belongs to. The lower sloping surface 61 is an sloping surface having the same inclination angle as the first sloping surface 13 of the carrier tape 10, and an upper sloping surface 62 is continuously provided above the lower sloping surface 61. It is designed to be sandwiched between.

The upper sloping surface 62 is formed such that its inclination angle is larger than that of the lower sloping surface 61, and the length of the horizontal portion 105 of the lead terminal 102 of the electronic component 100 is short. The inclined surface 13 is effective when the lead terminal 102 contacts the second inclined surface 16.

[0024]

EXAMPLE As an electronic component to be stored, in the electronic component 100 shown in FIG. 10, the outer dimension W of the mold part 101 is 20 mm × 20 mm, the height H is 0.7 mm, and the maximum outer dimension W ₀ including the lead terminal 102 is set. 22.02 mm x 2
LQFP (Leaded Q) of 0.02 mm and a standoff amount (distance H _s in the height direction between the lower surface 103 of the mold unit 101 and the lowermost end of the lead terminal 102) of 0.1 mm.
A 20 □ 144-pin IC package manufactured by Uad Flat Package was used.

(Conventional Example) As a conventional example of a carrier tape suitable for accommodating the LQFP, the size of the upper surface 75 of the base 73 surrounded by the protrusions 74 shown in FIG. 8 is 19.75 mm × 1.
A carrier tape (hereinafter referred to as a conventional example) having a height of 9.75 mm (the distance from the upper surface 75 to the tip of the protrusion 74) of the protrusion 74 of 0.3 mm was manufactured.

Prior to the production of the conventional example, the variation in the external dimensions of the mold part of the electronic component is ± 0.1.
mm, and the variation in the dimension of the upper surface of the base of the carrier tape is ± 0.1 mm, the outer dimension of the mold section is the maximum dimension, and the dimension of the upper surface is the dimension with respect to the positional relationship between the protrusion and the stored electronic component. FIG. 9 shows the result of simulation with the minimum dimension. It can be seen that the lead terminal 102 comes into contact with the protrusion 74 when the electronic component 100 is biased.

LQFP2 which is actually an IC package
After storing 0 □ 144 pins in the storage recess of the conventional example, a cover tape covering the upper part of the storage recess was adhesively fixed to the upper surface of the conventional example and wound on a predetermined reel to obtain a product of the conventional example. As a result of performing a drop test that is usually performed on the product, it was found that some IC package lead terminals open outward.

(Embodiment 1) As Embodiment 1, the dimension between the tips of the first inclined surface 13 of the holding portion shown in FIG. 1 is 20.0 m.
m, the inclination angle θ ₁ of the first inclined surface is 45 °, the bottom surface 12 is set 0.1 mm below the upper surface 15 of the base 14, and the dimension between the side walls of the storage recess 17 is 24.02 mm. A tape (hereinafter, referred to as Example 1) was produced.

(Embodiment 2) As Embodiment 2, in Embodiment 1, the sandwiching portion has a planar shape and a continuous square shape, but the corner portion formed by the adjacent inclined surfaces is R2, which is a relief. A carrier tape (hereinafter, referred to as Example 2) having the same size as that of Example 1 except for the shape was produced.

(Embodiment 3) As Embodiment 3, FIG.
The four sides of the inclined surface are independently formed, the length of one side of the inclined surface is 18 mm, and the other dimensions such as the space between the protrusions are the same as those of the carrier tape of Example 1 (hereinafter, referred to as Example 1). 3) was produced.

(Embodiment 4) As Embodiment 4, as shown in FIG. 6, the lower inclined surface 61 has an inclination angle of 45 ° and a height of 1.
0 mm, the inclination angle of the upper sloping surface 62 is 60 °, the height is 0.5 mm, and the dimension between the tips of the upper sloping surface 62 is 20.0.
A carrier tape (hereinafter, referred to as Example 4) having the same dimensions as those of Example 1 was prepared.

Next, with respect to Examples 1, 2, 3, and 4, the same drop test products as those in the conventional example were prepared and subjected to a drop test. Regarding all of Examples 1 to 4, no result was found that the bending of the lead terminal and the coplanarity (applicability concerning soldering of the shape of the lead terminal) as in the conventional example were inferior.

[0033]

According to the present invention, the two functions of placing and positioning electronic components are performed on the same inclined surface formed in the storage recess, thereby reducing the influence of dimensional variation when the storage recess is formed. be able to. In addition, variations in the outer dimensions of the molded portion of the electronic component can be absorbed by using the inclined surface.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a carrier tape according to the present invention.

FIG. 2 is an enlarged cross-sectional view in the vicinity of the sandwiching portion of FIG.

FIG. 3 is a perspective view showing a carrier tape having a rib according to another embodiment of the present invention.

FIG. 4 is a plan view of the carrier tape shown in FIG.

FIG. 5 is a plan view of a carrier tape according to another embodiment of the present invention, in which (a) is a configuration in which a corner portion of a base has no inclined surface,
(B) shows a structure in which holes are provided at the corners of the base.

FIG. 6 is an enlarged cross-sectional view in the vicinity of a holding portion in a carrier tape according to a second embodiment of the present invention.

FIG. 7 is a plan view of a conventional carrier tape containing electronic components.

8 is a sectional view taken along line QQ of FIG.

9A and 9B show an electronic component housed in a conventional carrier tape, FIG. 9A is a cross-sectional view of a state in which a lead terminal is not in contact with a protrusion, and FIG. 9B is a bend in which the lead terminal is in contact with a protrusion. It is sectional drawing of a state.

FIG. 10 is a side view of the electronic component.

[Explanation of symbols]

10, 60, 70 Carrier tape 11,71 Storage recess 12, 72 bottom 13, 51, 54 First inclined surface 13A clamping part 14 base 15 Upper surface 16, 52, 55 Second inclined surface 17,77 Side wall 18 Storage groove 19,53 corner 31 ribs 56 holes 61 Lower slope 62 Upper slope 73 base 74 Projection 100 electronic components 101 Mold part 102 lead terminal 103 bottom surface 104 side edge 105 Horizontal part 106 upper surface

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 3E067 AA12 AB46 AC04 AC11 BA26A                       BB14A EC12 ED20 FA09                       FC03                 3E096 AA06 BA08 BB08 CA15 CC01                       DA04 DA23 DB06 DC01 EA02X                       FA09 FA31 GA03 GA05

Claims (3)

[Claims] 1. A carrier tape having a plurality of storage recesses formed at predetermined intervals for storing an electronic component having a mold portion and a lead terminal on a side surface of the mold portion, the projection protruding to a bottom surface of the storage recess. The electronic component is supported and positioned by sandwiching the side end of the lower surface of the mold portion on the bottom surface side between the first inclined surfaces that face each other and expand toward the opening of the storage recess, and support the electronic component. A carrier tape having a holding portion that does not contact the lead terminals. 2. The carrier tape according to claim 1, wherein the first inclined surface is composed of two continuous inclined surfaces. 3. The carrier tape according to claim 1, wherein the sandwiching portion has a relief shape where a corner of the lower surface of the mold portion is located so as to allow the corner to escape.