JPH11105920A - Carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape which, when an electronic part such as an area type LSI package is to be mounted thereon and even if this electronic part deviates somewhat in positioning, is designed to guide the electronic part, while automatically correcting its position on the carrier tape, accurately to a prescribed position in a housing recess so as to store it. SOLUTION: In a carrier tape, a multiplicity of housing recesses 2, each capable of housing a semiconductor package, are formed longitudinally at regular intervals. At each of four corners of the housing recess 2, a ledge 2a is formed so that the semiconductor package can be placed with its peripheral bottom fringes on the ledges. Alternately with such ledges 2a positioning parts 4 for horizontal positioning of the semiconductor package, which positioning parts 4 do the positioning by contact with the sides of the semiconductor package, are formed. The positioning part 4 is formed as an inclined surface which forms at a prescribed angle a wider opening toward the periphery of the housing recess 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for accommodating electronic components, and more particularly to a BGA (Ball Grid Arra).
y), μBG called CSP (Chip Scale Package)
A, FBGA (Fine Pitch Ball Grid Array), LGA
(Land Grid Array), SON (Small Outline Non -Lea
ded Package), QON (Quad Outline Non-Leaded Pack)
age), a carrier tape suitable for accommodating a semiconductor package called an area LSI package such as a flip chip.

[0002]

2. Description of the Related Art The area type LSI package described above is
A large number of input / output electrode terminals (solder balls and solder bumps) are provided on the bottom of the package. When such semiconductor package is housed in a carrier tape and carried, for example, when the electrode terminals directly contact the carrier tape,
In addition to causing contamination of the electrode terminals and causing solder failure during mounting, when a solder failure occurs, it is difficult to find the solder failure because the electrode terminals are located on the bottom surface of the package. . In addition, a local load is applied to the package due to the contact between the electrode terminals and the carrier tape, which may cause deformation or the like.

Accordingly, the applicant of the present application has proposed a carrier tape in which the electrode terminals do not come into direct contact even if the above-mentioned area type LSI package is accommodated in Japanese Patent Application Laid-Open No. H08-1193.
No. 0 proposed. The carrier tape according to this proposal has a carrier tape 9 as shown in FIG.
A shelf 93 is formed on the peripheral wall surface of the housing recess 92 opened on the surface of the semiconductor device 1 so as to protrude inward, and the semiconductor package S is placed on the shelf 93.
A predetermined gap is provided between the electrode terminal Sa and the bottom surface of the accommodating recess 92 by the electrode terminal Sa.
It is designed not to contact with.

[0004]

The carrier tape according to the above-mentioned prior application was ideal as a shape for accommodating the electrode terminals of the semiconductor package so as not to directly contact the carrier tape. However, among area LSI packages, CSP is a chip-sized electronic component, and has a small terminal diameter and a small terminal pitch, and furthermore, a distance (overhang) from an outer peripheral edge of the package to an electrode terminal.
Is also very small. For this reason, the dimensional accuracy of a carrier tape for housing a semiconductor package such as a CSP must be extremely strict. Also, the accuracy of the insertion position of the carrier tape into the accommodation recess must be extremely strict. As a result, when the electronic component such as a semiconductor package is inserted into the receiving recess of the carrier tape by the taping device, even if the position of the electronic component is slightly shifted, there is a problem that the electronic component does not enter the receiving recess.

In order to solve such a problem, the accuracy of position control in the X, Y, and Z axes of the taping device is improved, or a special product is used for a suction nozzle for sucking and transporting a semiconductor package. However, it is necessary to reduce the production tact and take a sufficient time for alignment per unit, but this leads to an increase in equipment costs and costs and a decrease in production efficiency.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem. Even when electronic components such as an area-type LSI package are mounted on a carrier tape, the electronic components may be slightly misaligned. It is an object of the present invention to provide a carrier tape that can be accurately guided and stored at a predetermined position in a housing recess while automatically correcting the position on the carrier tape side.

[0007]

According to a first aspect of the present invention, there is provided a carrier tape having a plurality of receiving recesses formed on a surface thereof at predetermined intervals in a longitudinal direction, and an electrode provided on a bottom surface. A carrier tape for accommodating the electronic component in the accommodation recess, a height of the periphery of the accommodation recess from the bottom surface of the accommodation recess is larger than an electrode protruding height of the bottom surface of the electronic component, and a bottom edge of the electronic component. The shelf on which the portion can be placed is separated from the housing recess in the circumferential direction and formed so as to extend in the plane direction from the housing recess. A positioning portion for positioning in the direction is formed, and the positioning portion is formed as an inclined surface that expands at a predetermined angle toward the periphery of the housing recess.

Further, the carrier tape according to claim 2 is
2. The carrier tape according to claim 1, wherein the housing recess is substantially rectangular in plan view, and the shelf is formed at each of four corners of the housing recess, and the shelf is connected to the shelf between the shelf portions. A positioning portion formed of an inclined surface is formed.

Further, the carrier tape according to claim 3 is:
2. The carrier tape according to claim 1, wherein the housing recess is substantially rectangular in a plan view, and the shelf is formed at each of the center portions of four sides of the housing recess, and the shelf is continuous with the shelf between the shelf. Thus, a positioning portion composed of the inclined surface is formed.

Further, the carrier tape according to claim 4 is
2. The carrier tape according to claim 1, wherein the storage recess is substantially rectangular in a plan view, and the shelf is formed so as to make a round in a circumferential direction of the storage recess along an inner peripheral wall of the storage recess. A positioning part comprising a surface is formed at the four corners or the center of the four sides of the housing recess.

Further, the carrier tape according to claim 5 is:
The carrier tape according to any one of claims 1 to 4, wherein an inclination angle of the inclined surface of the positioning portion is in a range of 3 to 15 with respect to a vertical line of the surface of the carrier tape.

Further, the carrier tape according to claim 6 is:
In a carrier tape for accommodating an electronic component having an electrode provided on a bottom surface in a plurality of housing recesses formed at predetermined intervals in a longitudinal direction and having an opening formed on a surface thereof, the housing recesses are provided around the housing recess. The height from the bottom surface is greater than the electrode projecting height of the electronic component bottom surface, and the shelf on which the bottom peripheral edge of the electronic component can be placed is separated in the housing recess circumferential direction and is more planar than the housing recess. Along with the expansion, forming a positioning portion between these shelves to contact the side of the electronic component to position the electronic component in a planar direction,
A first inclined surface which expands the positioning portion toward the periphery of the accommodation concave portion at a gentle inclination angle, and a first inclined surface formed to be connected to a lower side of the first inclined surface. Are also constituted by a second inclined surface having a steep inclination angle.

Further, the carrier tape according to claim 7 is
7. The carrier tape according to claim 6, wherein the housing recess is substantially rectangular in plan view, and the shelf is formed at each of four corners of the housing recess, and the shelf is connected to the shelf between the shelf portions. A positioning portion formed of first and second inclined surfaces is formed.

Further, the carrier tape according to claim 8 is:
7. The carrier tape according to claim 6, wherein the housing recess is substantially rectangular in plan view, and the shelf is formed at the center of each of four sides of the housing recess, and the shelf is continuous with the shelf between the shelf. Thus, a positioning portion composed of the first and second inclined surfaces is formed.

Further, the carrier tape according to claim 9 is
7. The carrier tape according to claim 6, wherein the housing recess is substantially rectangular in plan view, and the shelf is formed by making a round in the housing recess circumferential direction along an inner peripheral wall of the housing recess. A positioning portion composed of the first and second inclined surfaces is formed at the four corners or the center of the four sides of the housing recess.

Further, the carrier tape according to claim 10 is the carrier tape according to claims 6 to 9, wherein
The inclination angle of the upper first inclined surface of the positioning portion is in a range of 3 to 15 ° with respect to a vertical line of the carrier tape surface, and the inclination angle of the lower second inclined surface is perpendicular to the carrier tape surface. The angle is in the range of 1 to 5 degrees with respect to the line.

[0017]

In the case of the carrier tape according to any one of the first to fifth aspects, since the positioning portion has an inclined surface that expands outward at a predetermined angle, an electronic device such as a semiconductor package dropped into the housing recess. A component (hereinafter, represented by a semiconductor package) comes into contact with the inclined surface and falls toward the accommodation recess while being guided along the inclined surface. Therefore, even when the semiconductor package dropped into the receiving recess from the taping device is displaced from the receiving recess, the position of the semiconductor package is automatically corrected in the process of sliding down, and finally the semiconductor package is finally adjusted. The package is placed on the shelf in a state where the package and the housing recess are almost aligned.

Further, in the case of the carrier tape according to claims 6 to 10, an upper first inclined surface in which the positioning portion has a gentle inclination angle, and a lower second inclined surface following the steep inclination angle. As a result, the semiconductor package dropped into the housing recess first falls toward the center of the housing recess while being guided in contact with the first inclined surface having a gentle upper inclination angle. Therefore, even if the semiconductor package dropped into the housing recess 2 from the taping device is displaced from the housing recess, the position of the semiconductor package is automatically corrected in the process of sliding down. Then, when the semiconductor package that has been guided and dropped by the first inclined surface is finally mounted on the shelf in the accommodation recess, the semiconductor package mounted on the shelf changes from a steep inclination angle. The periphery of the second inclined surface is surrounded by the second inclined surface, so that the movement in the left-right direction is reliably prevented, and the device is extremely stably placed at the fixed position.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 show a first embodiment of a carrier tape according to the present invention. Figure 1 shows the first
1 is a schematic perspective view of the carrier tape according to the embodiment, FIG. 2 is a plan view thereof, and FIG. 3 is an enlarged sectional view taken along the line AA in FIG.

In the figure, 1 indicates a carrier tape,
The carrier tape 1 is entirely made of a thermoplastic resin sheet such as polystyrene, acrylonitrile-butadiene-styrene resin, polyvinyl chloride resin, polyethylene terephthalate, or polypropylene. It is formed into a shape as described below by molding or press molding. Alternatively, injection molding may be performed using the above resin.

At a substantially central portion of the carrier tape 1, a housing recess 2 opening toward a surface (upper side in the figure) on the side where electronic components such as semiconductor packages are taken in and out is provided at a constant interval along the feeding direction of the carrier tape 1. Formed by
On one side in the width direction, feed holes 3 penetrating the front and back of the carrier tape 1 are formed at predetermined intervals. The accommodation recess 2
Has a rectangular parallelepiped shape opening in a rectangular shape in a plan view, and a shelf 2a for mounting the semiconductor package S is formed at four corners thereof. Positioning portions 4 each having an inclined surface expanding toward the front are formed.

The shelf 2a has a substantially hook shape (L shape) in plan view, and the height of the shelf surface (upper surface) is equal to the height of the electrode S of the semiconductor package S.
It is formed to be slightly higher than the protruding height of a.
These four shelves 2a protrude inward by a predetermined dimension W from the outer shape of the main body of the semiconductor package S indicated by a two-dot chain line, and the electrodes on the bottom surface of the semiconductor package S are provided on the protruding shelves 2a. It is configured such that a peripheral portion outside of Sa is mounted. The outer edge of the outer side of the shelf 2a is located outside the outer shape of the main body of the semiconductor package S. The protrusion w of the shelf 2a is appropriately set in consideration of the distance between the outer end of the electrode terminal of the semiconductor package S and the outer peripheral edge of the package.

As shown in FIG. 3, the positioning portion 4 is formed as an inclined surface which expands obliquely upward from the bottom surface at a predetermined inclination angle θ _1.
The facing distance L at the same height position a is set substantially equal to the main body size of the semiconductor package S. The tilt angle θ ₁ is selected from an optimum value depending on the size and weight of the semiconductor package S to be accommodated, the coefficient of friction of the package surface, and the like, but may be set in a range of approximately 3 ° to 15 °. preferable. Further, it is preferable that the length D of each positioning portion 4 in the side direction be equal to or more than の (D ≧ L / 2) of each side length L of the main body of the semiconductor package S.

In the carrier tape 1 according to the first embodiment, the semiconductor package S is housed in the housing recess 2 with the peripheral edge of the bottom surface placed on the shelf surface of the shelf 2a. However, for example, from the taping device,
When the semiconductor package S dropped into the inside and the receiving recess 2 are displaced from each other, the dropped semiconductor package S moves toward the receiving recess 2 along the inclined surface of the positioning portion 4 arranged on four sides. Slide down. As a result, even if the semiconductor package S dropped from the taping device is displaced, its position is automatically corrected in the process of sliding down, and finally the semiconductor package and the accommodation recess 2 are moved. Shelf 2a in a state where they almost match
Placed on top.

FIG. 4 shows a second embodiment of the carrier tape according to the present invention. The second embodiment is different from the first embodiment.
In this embodiment, the shelves 2a provided only at the four corners of the accommodating recess 2 protrude by W over the entire circumference of the accommodating recess 2, and the four shelves 2a are integrally connected. Since other parts are the same as those in FIGS. 1 to 3, the same parts are denoted by the same reference numerals, and the detailed description thereof will be omitted.

FIG. 5 shows a third embodiment of the carrier tape according to the present invention. This third embodiment is similar to the first embodiment.
In the embodiment, the positioning portions 4 formed at the center of the four sides of the housing recess 2 are formed at the four corners of the housing recess 2, and the shelf portions 2 a formed at the four corners of the housing recess 2 are each It is formed at the center of each side. Since other parts are the same as those in FIGS. 1 to 3, the same parts are denoted by the same reference numerals, and the detailed description thereof will be omitted.

FIG. 6 shows a fourth embodiment of the carrier tape according to the present invention. This fourth embodiment is similar to the third embodiment.
In the embodiment, the shelf 2a formed only at the center of the four sides of the accommodation recess 2 is projected by W over the entire circumference of the accommodation recess 2, and the four shelves 2a are integrally connected.
The other parts are the same as those in FIG. 5, and thus the same parts are denoted by the same reference numerals and detailed description thereof will be omitted.

FIGS. 7 to 9 show a fifth embodiment of the carrier tape according to the present invention. 7 is a schematic perspective view of the fifth embodiment, FIG. 8 is a plan view thereof, and FIG. 9 is an enlarged cross-sectional view taken along the line BB in FIG. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

The fifth embodiment is the same as the first embodiment (FIGS. 1 to 3), except that the positioning portion 4 has a two-step inclined surface. and forming a first inclined surface 4a of the same angle of inclination theta ₁ and embodiment, a small second inclination angle theta ₂ than the inclination angle theta ₁ wherein the first on the lower side (theta ₂ <theta ₁ Second)
Are formed continuously. Note that as in the first embodiment the approximate range of 3 ° to 15 ° to the above-described first as an inclined angle theta _1, also the approximate range of 1 ° to 5 ° and the second as the inclination angle theta ₂ It is preferable to set Also, the height h of the second inclined surface 4b is 1/1 / the height H of the main body of the semiconductor package S from the upper surface of the shelf 2a.
It is preferable to set it to about 2 · H to 2/3 · H.

As described above, when the inclined surface has a two-stage configuration of θ ₁ and θ ₂ , the semiconductor package S dropped into the accommodation recess 2 can be more stably mounted at the fixed position. That is, in the case of the inclined surface only large inclination angle theta ₁ angle, but towards the semiconductor package S was dropped into the concave 2 more stably accommodating recess widely can be guided, whereas, Due to the large inclination angle, when the semiconductor package S is finally placed on the shelf 2a in the accommodation recess 2, the position regulation in the left-right direction may become unstable. However, when the second inclined surface 4b having a small inclination angle is formed below the first inclined surface 4a as in the fifth embodiment, the semiconductor package S mounted on the shelf 2a becomes more compact. The position is regulated by the steep second inclined surface, so that it is extremely stably placed at the fixed position.

FIG. 10 shows a sixth embodiment of the carrier tape according to the present invention. In the sixth embodiment, the shelves 2a provided only at the four corners of the housing recess 2 in the fifth embodiment are protruded by W over the entire circumference of the housing recess 2, and the four shelves 2a are integrally connected. It was done. Since other parts are the same as those in FIGS. 7 to 9, the same parts are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 11 shows a seventh embodiment of the carrier tape according to the present invention. In the seventh embodiment, the positioning portions 4 formed at the center of the four sides of the housing recess 2 in the sixth embodiment are formed at the four corners of the housing recess 2 and formed at the four corners of the housing recess 2. Is formed at the center of each side of the accommodation recess 2 respectively. Since other parts are the same as those in FIGS. 7 to 9, the same parts are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 12 shows an eighth embodiment of the carrier tape according to the present invention. In the eighth embodiment, the shelf 2a formed only at the center of the four sides of the housing recess 2 in the seventh embodiment is protruded by W over the entire circumference of the housing recess 2, and the four shelves 2a are They are connected together. Since other parts are the same as those in FIGS. 7 to 9, the same parts are denoted by the same reference numerals, and detailed description thereof will be omitted.

The carrier tape in each of the above-described embodiments is not particularly limited with respect to the shape of the shelf, but as shown in FIG. 13, the inner edge of the shelf surface of the shelf avoids the electrodes on the bottom surface of the semiconductor package. So that it is roughly wavy,
It is also possible to increase the mounting area on the bottom surface of the semiconductor package.

The present invention is not limited to the above embodiments, and various modifications and combinations can be made in accordance with the gist of the present invention.

[0036]

As described above, according to the first to fifth aspects of the present invention, since the positioning portion has an inclined surface that expands outward at a predetermined angle, the positioning portion is moved from the taping device into the housing recess. Even when the electronic component such as the dropped semiconductor package is misaligned with the receiving recess, the electronic component is automatically corrected in its position as it slides down. Are placed on the shelf in a state where they match. For this reason, it can always be stably placed at a fixed position.

In the invention according to claims 6 to 10, an upper first inclined surface which expands the positioning portion outward at a gentle inclination angle and a steep inclination continuous with the first inclined surface. Since it was constituted by the lower second inclined surface consisting of a corner, the upper first inclined surface having a gentle inclination angle allows
The same effects as those of the inventions according to the first to fifth aspects can be obtained, and the lower second steep inclination angle can be obtained.
Of the electronic component such as the semiconductor package finally mounted on the shelf in the housing recess, the electronic component mounted in the housing recess can be moved in the left-right direction. Movement can be reliably prevented.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a carrier tape according to a first embodiment.

FIG. 2 is a plan view of the carrier tape of FIG.

FIG. 3 is a sectional view taken along the line AA in FIG.

FIG. 4 is a schematic perspective view of a carrier tape according to a second embodiment.

FIG. 5 is a schematic perspective view of a carrier tape according to a third embodiment.

FIG. 6 is a schematic perspective view of a carrier tape according to a fourth embodiment.

FIG. 7 is a schematic perspective view of a carrier tape according to a fifth embodiment.

FIG. 8 is a plan view of the carrier tape of FIG. 7;

FIG. 9 is a sectional view taken along the line BB in FIG. 7;

FIG. 10 is a schematic perspective view of a carrier tape according to a sixth embodiment.

FIG. 11 is a schematic perspective view of a carrier tape according to a seventh embodiment.

FIG. 12 is a schematic perspective view of a carrier tape according to an eighth embodiment.

FIG. 13 is a schematic plan view showing another example of the shelf shape.

FIG. 14 is a schematic sectional view showing the structure of a carrier tape according to the prior application.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Housing recess 2a Shelf part 3 Sending hole 4 Positioning part 4a 1st inclined surface 4b 2nd inclined surface S Semiconductor package (electronic component) Sa electrode θ1 _1st inclination angle θ2 _2nd inclination angle

Claims (10)

[Claims] 1. A carrier tape in which a large number of accommodation recesses opened on the surface are formed at predetermined intervals in a longitudinal direction, and an electronic component having an electrode provided on a bottom surface is accommodated in the accommodation recess. The height of the recess from the bottom of the receiving recess is greater than the height of the electrode protruding from the bottom of the electronic component, and the shelf on which the bottom edge of the electronic component can be placed is spaced apart in the circumferential direction of the receiving recess. And a positioning portion for positioning the electronic component in the planar direction by contacting the side portion of the electronic component between the shelves, and forming the positioning portion around the housing recess. A carrier tape characterized by having an inclined surface that expands at a predetermined angle toward the carrier tape. 2. The storage recess is substantially rectangular in plan view, and the shelf is formed at each of the four corners of the storage recess, and the inclined portion is formed between the shelf portions so as to be continuous with the shelf. The carrier tape according to claim 1, wherein a portion is formed. 3. The storage recess is substantially rectangular in plan view, the shelf is formed at the center of each of four sides of the storage recess, and the inclined surface is formed between the shelf and connected to the shelf. 2. The carrier tape according to claim 1, wherein a positioning portion comprising: 4. The positioning recess formed by the storage recess having a substantially rectangular shape in a plan view, the shelf being formed along the inner peripheral wall of the storage recess in a circumferential direction of the storage recess, and being formed by the inclined surface. 2. The carrier tape according to claim 1, wherein a center of each of the four corners or four sides of the housing recess is formed. 5. The carrier tape according to claim 1, wherein an inclination angle of the inclined surface of the positioning portion is in a range of 3 to 15 ° with respect to a vertical line of a surface of the carrier tape. . 6. A carrier tape in which a plurality of receiving recesses opened on the surface are formed at predetermined intervals in a longitudinal direction and an electronic component provided with an electrode on a bottom surface is received in the receiving recess. The height of the recess from the bottom of the receiving recess is greater than the height of the electrode protruding from the bottom of the electronic component, and the shelf on which the bottom edge of the electronic component can be placed is spaced apart in the circumferential direction of the receiving recess. And a positioning portion for positioning the electronic component in the planar direction by contacting a side portion of the electronic component between the shelves, and positioning the positioning portion around the housing recess. A first inclined surface which expands at a gentle inclination angle toward the second, and a second inclined surface which is formed to be connected to the lower side of the first inclined surface and which is steeper than the first inclined surface. That it was made up of an inclined surface Characteristic carrier tape. 7. The accommodation recess is substantially rectangular in plan view, and the shelf is formed at each of the four corners of the accommodation recess, and the first and second spaces are formed between the shelf portions so as to be continuous with the shelf portion. 7. The carrier tape according to claim 6, wherein a positioning portion made of an inclined surface is formed. 8. The storage recess is substantially rectangular in plan view, and the shelf is formed at the center of each of the four sides of the storage recess, and the first recess is formed between the shelf portions so as to be continuous with the shelf. 7. The carrier tape according to claim 6, wherein a positioning portion comprising a second inclined surface is formed. 9. The storage recess is substantially rectangular in plan view, and the shelf is formed along the inner peripheral wall of the storage recess in a circumferential direction of the storage recess, and the first and second shelves are formed. 7. A positioning part comprising an inclined surface is formed at a center of four corners or four sides of the housing recess.
The described carrier tape. 10. The inclination angle of the first inclined surface above the positioning portion is 3 to 1 with respect to a vertical line of the surface of the carrier tape.
The angle of the lower second inclined surface is set in a range of 1 to 5 degrees with respect to a vertical line of the surface of the carrier tape. A carrier tape according to any of the above.