JPH09255076A - Carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To securely set electronic parts in respective correct positions of a container when pressing the upper face of the molding of the electronic parts by a top tape to set the top tape, by holding the electronic parts by a projection for the rotary bottom face and two supporting projections in the containing part. SOLUTION: In a carrier table 1, a projection 3 for rotary bottom face at the central part of the container 2 and supporting projections 4, 5 are formed at both ends thereof with a distance separating them from each other. When electronic parts are contained in the container 2. The bottom of a molding 6 is set to contact the projection 3 for rotation and the supporting projections 4 and/or 5. When a top tape is stuck, the electronic parts are kept in the container 2 by the projection 3. And the molding is held in the container having the space of the bottom face 6 of molding 6 and the height supported by a point or a line, or a point contact or a line contact. The supporting projections 4, 5 contact a point or a ridge line from both sides of the molding 6 contacting the projection 3 to support the molding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape suitable for accommodating electronic parts having a mold part and leads.

[0002]

2. Description of the Related Art A carrier tape is made of a long plastic tape or the like, and various electronic components are housed in a recessed housing formed at predetermined intervals in the length direction of the tape. Those that are adhesively sealed by welding, adhesion, or the like are used. Various shapes have been proposed for the storage part, but the storage part is arranged in the central part of the pedestal with a flat bottom surface that fits with the bottom surface of the mold part of the electronic component, and the side edge direction of this pedestal. It is known that a lead accommodating portion is provided, and a dot-shaped projection for sandwiching the bottom surface of the mold portion is provided on the side edge of the pedestal, and a groove is provided between the projection and the side edge (Japanese Patent Laid-Open No. 3-133761). (See the official gazette). This pedestal is formed so that the top surface of the electronic components placed on it is slightly above the storage part. By attaching the top tape to the surface of the carrier tape, the electronic components on the pedestal can be gently moved by the top tape. It is designed to be pressed and held.

[0003]

However, in the above carrier tape, when the electronic component is dropped to be stored in the storage portion, the mold portion of the electronic component is supported at four or more points that are not in the same plane. Therefore, when bonding the top tape to the carrier tape, the electronic parts do not move to the correct position even when the mold part is pressed with the top tape, and it is not set in the correct position on the pedestal. Sometimes it is pressed and held by. The electronic component having the mold portion and the lead housed in such a state is easily detached from the pedestal due to an impact generated during transportation. Especially, in the case of an electronic component having a lead such as IC, the lead is It was often the case that the side wall collided and deformed, resulting in a defect, or that the electronic component could not be taken out from the storage portion when used in an automatic loading machine.

Therefore, in the conventional carrier tape, since it is important to align the pedestal with the normal position when the electronic component is dropped into the storage portion, strict dimensional accuracy is required, and the above-mentioned alignment is required. Requires a loading device with high dimensional accuracy, which is expensive and the carrier tape,
Due to the heat shrinkage ratio of the top tape, its alignment is limited. The present invention is a carrier tape in which the electronic component can be reliably set in the correct position in the storage portion and can be pressed and held by the top tape when the top tape is adhered even if the electronic component is dropped into the storage portion due to a slight mistake. The challenge is to provide.

[0005]

In the carrier tape of the present invention, the accommodating portion has a rolling protrusion having a surface shape on which the bottom surface of the mold portion of the electronic component to be accommodated rolls, and the rolling protrusion. From at least two support protrusions that are arranged apart from each other and support the bottom surface of the mold portion to be stored at a position below the lead root of the electronic component, and the lead storage portion that is arranged outward in the side edge direction of the support protrusion. It is a configuration.
In the carrier tape of the present invention, the electronic component is held in the accommodating portion by three points of one rolling protrusion and two bearing protrusions, in other words, by points or line segments on the same plane, and The upper surface of the mold part of the electronic component is pressed and set in the normal position.

In the state before the top tape is adhered, the rolling protrusion supports the bottom surface of the mold portion of the electronic component between the two spaced-apart bearing protrusions. The surface shape of this rolling protrusion is the mold part when an electronic component is placed on the rolling protrusion (except when the center of gravity of the electronic component happens to be stationary and coincides) when there is no supporting protrusion. The bottom surface of the roller has a shape that allows it to slide while rolling on the rolling protrusions, and when the top tape is adhered to the carrier tape, it must have low slip resistance so that the mold part can easily move by pressing the top tape. There is a need to.

As a concrete example of such a shape, as shown in FIGS. 5 (a) to 5 (c), a dot shape having a circular or elliptical cross section or a ridge having a triangular cross section. It is conceivable that the product has a shape or a combination thereof as illustrated in FIG. In addition, this dot shape includes an intermittent ridge formed by connecting dots and dots. Further, as shown in FIG. 6, the rolling projection has a slightly wide top if the mold portion 16 is tilted by the rolling projection 13 when an electronic component is dropped into the storage recess. However, when the top tape is adhered, the bottom surface of the mold part 16 must have a width such that the bottom surface of the mold part 16 slides and rolls to be horizontally corrected. This rolling protrusion is usually
It is provided near the center of the storage portion, but is not limited to this as long as it has a rolling function.

Further, the bearing protrusion is disclosed in Japanese Patent Laid-Open No. 13376/1993.
When the bearing is mounted in the same manner as the one disclosed in Japanese Patent Laid-Open No. 1, the height of the upper surface of the electronic component is slightly above the storage portion, and after the top tape is bonded to the carrier tape, the electronic component is substantially molded. It supports the bottom surface of the part, and does not necessarily have to be supported by the rolling projection in this state. In other words, when the rolling projection has the electronic parts to be stored in the storage portion and the top tape is adhered, [0
010], it is not always necessary to contact the bottom surface of the mold portion. The support protrusions are formed with the top tape adhered to the carrier tape and separated from each other by the rolling protrusions on the bottom surface of the electronic component. It is important that the lead wire is formed so as to contact the side surface below the root of the lead wire so as not to contact the lead wire. If the lead wire comes into contact with the support protrusion with the electronic component placed in the normal position, the lead may be deformed due to the shock generated during transportation, leading to a defective product. Therefore, it is preferable that the tips of the support protrusions are formed so as to contact the bottom surface 0.2 to 1 mm below the roots of the leads of the mold portion when the electronic component is set in the normal position. Further, it is necessary that the abutting surface of the support projection on the mold portion is formed as an inclined surface on which the mold portion is easily slid when pressed by adhesion of the top tape. As such a shape, it is advisable to form a protrusion having a cross-sectional shape similar to that of the rolling protrusion illustrated in FIGS. 5A to 5C and having an intermittent or continuous linear shape. further,
Usually, at least two bearing protrusions are provided with rolling protrusions interposed therebetween, but, for example, a plurality of bearing protrusions may be provided so as to partially support the four corners of the bottom surface of the mold part. By providing the rolling protrusions and the bearing protrusions as described above, the strength of the storage portion itself of the carrier tape is improved.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION In the following, a detailed description will be given based on FIGS. 1 to 4 illustrating an example of an embodiment of the present invention. FIG.
Is a plan view of the storage portion of the carrier tape, and FIG.
FIG. 2 is a view taken along the line AA of FIG. 1 and is a schematic cross-sectional view of a state in which an electronic component is placed in a normal position in a storage portion of a carrier tape. 3 (a) and 3 (b) are schematic cross-sectional views showing a state in which electronic components are placed in the storage part of the carrier tape having a storage part different from that shown in FIG. 2, and FIG. ，
(B) is a schematic sectional drawing which shows the accommodation state of the electronic component after adhesion of a top tape. As shown in FIGS. 1 and 2, in the carrier tape 1 of the present invention, rolling protrusions 3 and 3'are formed in the central portion of the storage portion 2, and support protrusions 4 and 5 are formed on both sides of the rolling protrusions 3 and 3 '. Has been done. Carrier tape 1 of the present invention
When the electronic parts are stored in the storage part 2, the mold part 6 does not necessarily need to be set in the normal position, and the bottom surface of the mold part 6 is provided with the rolling projections 3 and 3'and the support projections 4 and / or 5. All you have to do is set it so that it touches. In the type of FIGS. 1 and 2, when the top tape is adhered, the rolling protrusions 3 have a bottom surface of the mold portion 6 when the electronic parts are accommodated in the accommodating portion 2 and the top tape is adhered, and a dot or line shape. The height of supporting the points, that is, the height of point contact or ridge line contact, and the support protrusions 4 and 5 contact with the rolling protrusions 3 from both sides of the mold portion 6 by point or linear ridge lines. We support. Further, outside the side edges of the support protrusions 4 and 5, storage portions 10 and 11 for the leads 7 and 8 of the electronic component are provided, and the leads are stored without contacting the storage portions.

FIG. 3 shows a carrier tape having a cross-sectional shape different from that of FIG. 2. The carrier tape disclosed in FIG.
The bottom surface between the bearing projections 4, 5 and the rolling projection 3 and the leads 7, 8
While the bottom surfaces of the storage portions 10 and 11 of No. 1 were at the same height, the bottom surface of the storage portion of the lead was formed deeper. As shown in FIG. 3A, the mold part 6 of the electronic component is
Is tilted, the rolling projection 3 and the bearing projection 4 and / or
Or, even if the top tape 9 is set on the carrier tape 1, when the top tape 9 is bonded to the carrier tape 1, the back surface of the top tape 9 presses the top surface of the mold portion 6 so that the mold portion 6 and the rolling protrusion 3 are formed. The tip ends of the bearing protrusions 4 and 5 are rolled while sliding, and finally, as shown in FIG. 3B, the bearing protrusions 4 and 5 are supported so that the bottom surface of the mold portion 6 is the rolling protrusion 3.
It is stopped and held at a regular position in the storage section 2 in a state of being separated from. As a result, the electronic component is not stored in the storage portion 2 while being displaced from the normal position.

When the electronic parts are accommodated in the accommodating portion and the top tape is adhered, the bottom surface of the mold portion has three points, that is, the rolling protrusion and the supporting protrusion when the top tape is adhered, as described in the description of FIG. Most preferably, it is supported by ridge line or point contact with.

There are two ideas regarding the resistance of the rolling projection to the pressing force of the top tape, in other words, the compressive strength of the rolling projection, and either of them can be adopted in the present invention. That is, one is a rigid structure and the other is a flexible structure.
The rigid structure has a rigidity that supports the bottom surface of the mold part and serves as an axis when the mold part rolls when the mold part is pressed by the top tape. At this time, the wall thickness of the rolling projection is It is preferable that the thickness is approximately equal to or half of the thickness of the support protrusion so long as the top tape is not crushed.
In this case, even if the electronic component is displaced due to an impact received during transportation, the pressing force of the top tape 9 causes the molding portion 6 to naturally move as shown in FIG. The bottom surface slides on the tips of the rolling protrusion 3 and the bearing protrusions 4 and 5 to return to the normal position. Further, as shown in FIG. 4 (b), the flexible structure is assumed to have an elastic flexibility such that it is dented when the mold part is supported by the support protrusion and set in the normal position. In the case of such a flexible structure, the rolling of the electronic parts in the storage portion becomes easier than in the case of the rigid structure. In order to make this flexible structure effective, it is preferable that the thickness of the rolling projection is formed thinner than the thickness of the support projection. Further, in the case of this flexible structure, since the stored electronic components are well held by the top tape, the electronic components will not be displaced during transportation.

The carrier tape of the present invention is formed by injection molding, vacuum molding, or the like of thermoplastic plastic sheets such as polypropylene, polyethylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, saponified ethylene vinyl acetate copolymer, polyester and nylon. It can be manufactured by pressure molding and press molding.

[0014]

【Example】

[Example 1] An automatic loading machine was used to store the carrier tape of the present invention in a package size of 14 mm x 14 mm and a thickness of 1.
LQFP (hereinafter, simply referred to as IC) having a length of 4 mm and a lead pitch of 0.5 mm was housed in a 1,000 package, transported, and loaded on a circuit board by an automatic loading device. The carrier tape used was polypropylene, which was injection-molded into a tape having a storage part having the structure shown in FIGS. This carrier tape has a width of 24 mm, and the accommodating portions 2 are repeatedly provided at intervals of 24 mm in the length direction of the carrier tape in accordance with the dimensions of the IC to be accommodated. The dimensions of the accommodating portion 2 are 16.5 × 16. .5 ×
1.9 mm, and the rolling projections 3, 3 ′ provided at the center of the bottom surface of the storage part 2 have a height of 0.6 mm and a bottom of 1.0 mm.
The protrusion-shaped support protrusions 4 and 5 formed on both sides of the protrusion-shaped support protrusions 3 having a triangular cross-section and a triangular-pyramid-shaped protrusion 3 ′ having the same size have a height of 1.0 mm. , Bottom 0.
It was formed into a ridge having a triangular section of 5 mm. Further, the bearing protrusions 4 and 5 have their tips abutted 0.3 mm downward from the roots of the leads 7 and 8 of the mold portion 6 of the IC while the IC is placed in the normal position in the storage portion, and The upper surface of the 1.4 mm thick mold part is 0.1 mm from the upper surface of the carrier tape.
It is placed at the height and position that appears above, and the rolling projections 3,
The wall thickness of 3'and the supporting projections 4 and 5 was set to 0.25 mm like the bottom surface of the storage part. [Example 2] A carrier tape was produced under the same conditions as in Example 1 except that the thickness of the tips of the rolling protrusions 3 and 3'was set to be 0.1 mm thinner than the thickness of the bearing protrusions 4 and 5. did.

An automatic loading machine (Vanguard Systems Co., V
N1100 (trade name), 15,000 of the above-mentioned ICs were housed, sealed by welding with a top tape, transported by a truck for 200 km, and then the ICs were taken out from the carrier tape by the same automatic loading machine. As a result, all could be completely taken out from the carrier tapes of the present invention produced in Examples 1 and 2. [Comparative Example 1] For comparison, the conventional Japanese Patent Laid-Open No. 3-1337
When the same work as above was performed using the carrier tape disclosed in No. 61, there were 10 ICs that could not be taken out per 20,000.

[0016]

According to the carrier tape of the present invention, since it is not necessary to set the electronic component in the normal position of the pedestal when it is stored, the storage work can be simplified and speeded up, and the carrier tape itself. Since the dimensional accuracy of is not strictly required, the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view of a storage portion of a carrier tape according to the present invention.

FIG. 2 is a partial schematic cross-sectional view taken along the line AA of FIG. 1 in a state where an electronic component is placed in a normal position.

3 (a) and 3 (b) are schematic cross-sectional views of another state before and after attaching the electronic component to the storage portion of the carrier tape and adhering the top tape.

4 (a) and 4 (b) are schematic cross-sectional views showing a housed state of electronic components after bonding a top tape in a different mode of the present invention.

5 (a), (b), (c) are partial cross-sectional views of different aspects of rolling protrusions, and (d) is
It is a partial perspective view which shows another example of a rolling protrusion.

FIG. 6 is a schematic cross-sectional explanatory view showing how the bottom surface of the mold part slides on the rolling protrusions.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Carrier tape 2 Storage part 3,3 ', 13 Rolling protrusion 4,5 Supporting protrusion 6,16 Mold part 7,8 Lead 9 Top tape 10,11 Lead storage part

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Katsuyoshi Nakano 1-406-1 Yoshino-cho, Omiya City, Saitama Prefecture Shin-Etsu Polymer Co., Ltd. Tokyo Factory

Claims (1)

[Claims] 1. A carrier tape having a plurality of accommodating portions for accommodating an electronic component having a mold portion and leads in a lengthwise direction at predetermined intervals, wherein the accommodating portion has a bottom surface of the mold portion of the electronic component to be accommodated. A rolling protrusion having a surface shape that rolls, and at least two bearing protrusions that are arranged to be spaced apart from each other with the rolling protrusion interposed therebetween and that support the bottom surface of the mold portion to be housed at a position below the lead root; A carrier tape comprising a lead accommodating portion arranged outward in the side edge direction of the bearing protrusion.