CN213026113U - Pin symmetrical multi-row lead frame for semiconductor packaging - Google Patents
Pin symmetrical multi-row lead frame for semiconductor packaging Download PDFInfo
- Publication number
- CN213026113U CN213026113U CN202021398886.7U CN202021398886U CN213026113U CN 213026113 U CN213026113 U CN 213026113U CN 202021398886 U CN202021398886 U CN 202021398886U CN 213026113 U CN213026113 U CN 213026113U
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- pin
- frames
- frame
- transverse ribs
- lead frame
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- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 title abstract description 17
- 239000000463 material Substances 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 230000006872 improvement Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model provides a pin symmetrical multi-row lead frame for semiconductor packaging, which comprises two parallel frames and a plurality of transverse ribs arranged perpendicular to the frames, wherein two ends of each transverse rib are respectively connected with the two frames; a plurality of film carrying platforms and pin parts with the same number as the film carrying platforms are respectively arranged on two sides of each transverse rib, and the film carrying platforms and the pin parts on the adjacent transverse ribs are symmetrically arranged; an outer connecting rib is arranged between two adjacent transverse ribs which are arranged oppositely at the pin part, and the outer connecting rib is connected with the pin part on the two adjacent transverse ribs; the utility model has the advantages that: each frame can accommodate 168 frames, which is more than four times of a single-row frame in the prior art, so that the production efficiency is improved; meanwhile, the two sides of the frame are provided with the frames for protection, so that the lead part is prevented from deforming, and the packaging yield is improved.
Description
Technical Field
The utility model relates to a semiconductor package technical field especially relates to pin symmetry type multirow lead frame for semiconductor package.
Background
The TO94 package is a very popular direct-insert package, which is commonly used by the current semiconductor chip package, and with the continuous development of technology in recent decades, the chip package technology is continuously improved, the electronic original devices are popularized and used, and the requirements of the market on product quality and delivery date are more strict.
The semiconductor packaging structure is a carrier for an integrated circuit, plays the roles of mounting, fixing, sealing, protecting a chip, enhancing the electric heating performance and the like in the packaging process, is connected to pins of a packaging shell by leads through bonding pads on the chip, and is connected with other devices by leads on a soldering tin circuit board to play a role of electric connection; therefore, the package structure is generally used for mounting, fixing and guiding a lead frame, and also includes a package body for protecting the chip, sealing and matching with the lead frame.
The prior art discloses a traditional single-row lead frame, and it is when the plastic envelope, normally transversely puts for the mould to the assembly realizes moulding plastics together, because the cooperation length of the pin of single-row lead frame when transversely putting in the mould is too long, and lead frame and mould are different alloy material, and both compound dies after, through high temperature, the clearance between pin and the mould increases, overflows the glue in the easy side of process of plastic envelope, in addition, if the injecting glue is long for a time, injecting glue pressure is big. In addition, the conventional lead frame is usually of a single-row frame structure, and the pins on two sides of the conventional lead frame are not protected by frames, so that the conventional lead frame is easily deformed in the process of conveying a material box on an equipment track during packaging, and the packaging yield is low; the single row frame structure is 254mm in length and 22.34mm in width, and each frame can accommodate 40 frames; the demand of the market on TO94 products is large in the future, the production efficiency of single-row frame packaging in unit time is low, the packaging yield is low, and the demand of the customer market cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to prior art's not enough, provide pin symmetry type multirow lead frame for semiconductor package.
The utility model discloses a following technical means realizes solving above-mentioned technical problem:
the pin symmetrical multi-row lead frame for semiconductor packaging comprises two parallel frames and a plurality of transverse ribs perpendicular to the frames, wherein two ends of each transverse rib are respectively connected with the two frames; a plurality of film carrying platforms and pin parts with the same number as the film carrying platforms are respectively arranged on two sides of each transverse rib, and the film carrying platforms and the pin parts on the adjacent transverse ribs are symmetrically arranged; outer connecting ribs are arranged between two adjacent transverse ribs of the lead parts which are oppositely arranged, and the outer connecting ribs are connected with the lead parts on the two adjacent transverse ribs.
As an improvement of the above technical solution, the frame and the transverse bar are made of the same material, preferably copper alloy.
As an improvement of the technical scheme, a plurality of circular identification holes are formed in the two frames, and the identification holes in the two frames are symmetrically arranged.
As an improvement of the technical scheme, a plurality of oval positioning holes are formed in the frames, and the positioning holes in the two frames are symmetrically arranged.
As an improvement of the technical scheme, the slide glass area comprises a base island and four inner pins, the pin part comprises four outer pins, the inner pins and the outer pins are connected through transverse ribs, and the base island is connected with one inner pin.
The utility model has the advantages that: each frame can accommodate 168 frames, which is more than four times of a single-row frame in the prior art, so that the production efficiency is improved; meanwhile, the two sides of the frame are provided with the frames for protection, so that the lead part is prevented from being easily deformed in the process of conveying the material box at the equipment rail when packaged, and the packaging yield is improved.
Compared with a single-row frame in the prior art, the length-width ratio is reduced, the mechanical stability of the frame is improved, the frame is not easy to deform, and the packaging yield is improved.
Drawings
Fig. 1 is a schematic structural view of a pin-symmetrical multi-row lead frame for semiconductor packaging according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of two transverse ribs opposite to the lead portion, and the film loading table and the lead portion on the transverse ribs in the embodiment of the present invention;
FIG. 3 is a schematic structural view of the slide holder and the lead portion according to the embodiment of the present invention;
the structure comprises a frame 1, transverse ribs 2, a slide holder 3, a pin part 4, an outer connecting rib 5, an identification hole 6, a positioning hole 7, a base island 31, an inner pin 32 and an outer pin 41.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Examples
As shown in fig. 1 and 2, the pin-symmetric multi-row lead frame for semiconductor packaging in this embodiment includes two parallel frames 1 and a plurality of transverse ribs 2 perpendicular to the frames 1, where two ends of the transverse ribs 2 are respectively connected to the two frames 1; a plurality of slide carriers 3 and pin parts 4 with the same number as the slide carriers 3 are respectively arranged on two sides of the transverse ribs 2, and the slide carriers 3 and the pin parts 4 on the adjacent transverse ribs 2 are symmetrically arranged; outer connecting ribs 5 are arranged between two adjacent transverse ribs 2 which are oppositely arranged on the pin parts 4, and the outer connecting ribs 5 are connected with the pin parts 4 on the two adjacent transverse ribs 2.
Each frame can accommodate 168 frames, which is more than four times of a single-row frame in the prior art, so that the production efficiency is improved; meanwhile, the two sides of the frame are provided with the frames 1 for protection, so that the lead part is prevented from being easily deformed in the process of conveying the material box and the equipment track when packaged, and the packaging yield is improved.
Compared with a single-row frame in the prior art, the length-width ratio is reduced, the mechanical stability of the frame is improved, the frame is not easy to deform, and the packaging yield is improved.
The frame 1 and the transverse ribs 2 are made of the same material, and preferably made of copper alloy; avoid frame 1 and horizontal muscle 2 because of different materials, the deformation volume is different when high temperature is moulded plastics.
As shown in fig. 1 and 2, a plurality of circular identification holes 6 are formed in the two frames 1, and the identification holes 6 in the two frames 1 are symmetrically arranged; a plurality of oval positioning holes 7 are formed in the frames 1, and the positioning holes 7 in the two frames 1 are symmetrically arranged; the round identification hole 6 and the oval positioning hole 7 are arranged to perform identification and positioning functions, and the shapes are different to avoid mistakes.
As shown in fig. 3, the chip region 3 includes a base island 31 and four inner leads 32, the lead portion 4 includes four outer leads 41, the inner leads 32 and the outer leads 41 are connected by the transverse ribs 2, and the base island 31 is connected to one inner lead 32.
It is noted that, in this document, relational terms such as first and second, and the like, if any, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (5)
1. Semiconductor package is with many rows of lead frame of pin symmetry type, its characterized in that: the frame comprises two parallel frames (1) and a plurality of transverse ribs (2) which are perpendicular to the frames (1), wherein two ends of each transverse rib (2) are respectively connected with the two frames (1); a plurality of film carrying platforms (3) and pin parts (4) with the same number as the film carrying platforms (3) are respectively arranged on two sides of each transverse rib (2), and the film carrying platforms (3) and the pin parts (4) on the adjacent transverse ribs (2) are symmetrically arranged; outer connecting ribs (5) are arranged between two adjacent transverse ribs (2) which are oppositely arranged on the pin parts (4), and the outer connecting ribs (5) are connected with the pin parts (4) on the two adjacent transverse ribs (2).
2. The pin-symmetrical multi-row lead frame for semiconductor packages according to claim 1, wherein: the frame (1) and the transverse ribs (2) are made of the same material and are made of copper alloy.
3. The pin-symmetrical multi-row lead frame for semiconductor packages according to claim 1 or 2, wherein: a plurality of circular identification holes (6) are formed in the two frames (1), and the identification holes (6) in the two frames (1) are symmetrically arranged.
4. The pin-symmetrical multi-row lead frame for semiconductor packages according to claim 3, wherein: the frame (1) is provided with a plurality of oval positioning holes (7), and the positioning holes (7) on the two frames (1) are symmetrically arranged.
5. The pin-symmetrical multi-row lead frame for semiconductor packages according to claim 1, wherein: the slide holder (3) comprises a base island (31) and four inner pins (32), the pin part (4) comprises four outer pins (41), the inner pins (32) are connected with the outer pins (41) through transverse ribs (2), and the base island (31) is connected with one inner pin (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021398886.7U CN213026113U (en) | 2020-07-16 | 2020-07-16 | Pin symmetrical multi-row lead frame for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021398886.7U CN213026113U (en) | 2020-07-16 | 2020-07-16 | Pin symmetrical multi-row lead frame for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213026113U true CN213026113U (en) | 2021-04-20 |
Family
ID=75503218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021398886.7U Expired - Fee Related CN213026113U (en) | 2020-07-16 | 2020-07-16 | Pin symmetrical multi-row lead frame for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213026113U (en) |
-
2020
- 2020-07-16 CN CN202021398886.7U patent/CN213026113U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210420 |