CN215451396U - Pin and lead frame - Google Patents
Pin and lead frame Download PDFInfo
- Publication number
- CN215451396U CN215451396U CN202121660220.9U CN202121660220U CN215451396U CN 215451396 U CN215451396 U CN 215451396U CN 202121660220 U CN202121660220 U CN 202121660220U CN 215451396 U CN215451396 U CN 215451396U
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- China
- Prior art keywords
- longitudinal wall
- pin
- lead
- degrees
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005452 bending Methods 0.000 claims abstract description 11
- 238000012858 packaging process Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Special Wing (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The embodiment of the present disclosure provides a pin and a lead frame, the pin includes: an inner lead portion adapted to be connected to a chip; an outer lead portion adapted to be connected to a circuit board; the inner pin part is connected with the outer pin part through a bending part; the pins comprise a first side which is far away from the circuit board in use and a second side opposite to the first side; the first side of the joint of the inner pin part and the bending part comprises a first step, the first step comprises a first longitudinal wall and a first transverse surface connected with the first longitudinal wall, the first longitudinal wall is adjacent to the inner pin part, and the included angle between the first longitudinal wall and the first side of the inner pin part ranges from 70 degrees to 90 degrees. The lead frame comprising the lead can provide larger lead bonding area for bonding the inner lead part and the chip in the packaging process. And bonding is facilitated.
Description
Technical Field
The disclosure relates to the technical field of semiconductor packaging, in particular to a pin and a lead frame.
Background
In recent years, with the rapid development of electronic technology, there has been an increasing demand for reliability in semiconductor packaging. The double-side Flat No-lead Package (DFN Package for short) is a No-lead Package technology for surface mounting, and the DFN packaged product has the characteristics of small volume, light weight and suitability for portable application, and the packaged structure has excellent electrical and thermal properties. Therefore, DFN packages are widely adopted in low pin type packages.
The DFN packaging body comprises a lead frame, and pins are arranged on the lead frame. During the packaging process, the inner lead portion of the lead frame needs to be connected to the chip. However, the lead bonding area of the lead portion of the lead frame used in current DFN packages is too small.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems existing in the prior art, the embodiments of the present disclosure provide a lead and a lead frame, which can provide a sufficient area of a wire bonding region when a chip is packaged.
To solve the above technical problem, an embodiment of the present disclosure provides a pin, including: an inner lead portion adapted to be connected to a chip; an outer lead portion adapted to be connected to a circuit board; the inner pin part is connected with the outer pin part through a bending part; the pins comprise a first side which is far away from the circuit board in use and a second side opposite to the first side; the first side of the joint of the inner pin part and the bending part comprises a first step, the first step comprises a first longitudinal wall and a first transverse surface connected with the first longitudinal wall, the first longitudinal wall is adjacent to the inner pin part, and the included angle between the first longitudinal wall and the first side of the inner pin part ranges from 70 degrees to 90 degrees.
In some embodiments, the first longitudinal wall has a height of 0.03mm to 0.20 mm; the included angle between the first longitudinal wall and the first transverse surface ranges from 90 degrees to 110 degrees.
In some embodiments, the length of the first transverse face is no more than 0.1 mm.
In some embodiments, the first lateral face and the bend are connected by a first arc at the first side.
In some embodiments, the radius of curvature of the first arc does not exceed the thickness of the pin.
In some embodiments, the junction of the outer lead portion and the bent portion includes a second step on the second side, the second step includes a second longitudinal wall and a second transverse face connected to the second longitudinal wall, the second longitudinal wall is adjacent to the outer lead portion, and an included angle between the second longitudinal wall and the second side of the outer lead portion ranges from 70 ° to 90 °.
In some embodiments, the second longitudinal wall has a height of 0.03mm to 0.20 mm; the included angle between the second longitudinal wall and the second transverse surface ranges from 90 degrees to 110 degrees.
In some embodiments, the length of the second transverse face is no more than 0.1 mm.
In some embodiments, the second lateral surface and the bend are connected by a second arc at the second side.
In some embodiments, the radius of curvature of the second arc does not exceed the thickness of the pin.
Further, the embodiment of the present disclosure also provides a lead frame, including the pin as described in any of the above embodiments.
Compared with the prior art, the technical scheme of the embodiment of the disclosure has the following beneficial effects:
the embodiment of the disclosure provides a pin and a lead frame, wherein the pin is provided with a first step between an inner lead part and a bent part, so that the overlarge curvature radius of the bent part caused by the lead frame forming process can be avoided, a larger lead bonding area can be provided, and the bonding of the inner lead part and a chip in the lead frame is facilitated.
Further, the second step is arranged between the outer pin part and the bent part in the embodiment of the disclosure, so that the risk of glue overflow in the injection molding process at the joint of the outer pin part and the bent part in the prior art can be avoided.
Drawings
Other features and advantages of the present invention will be better understood by the following detailed description of alternative embodiments, taken in conjunction with the accompanying drawings, in which like characters represent the same or similar parts, and in which:
FIG. 1 is a schematic diagram of a process for forming a lead in the prior art;
FIG. 2 is a schematic diagram of a lead frame connected to a chip in the prior art;
fig. 3 is a schematic diagram of a pin structure according to an embodiment of the disclosure;
FIG. 4 is a schematic diagram of a partial enlarged structure at the first step of the lead in the embodiment shown in FIG. 3;
fig. 5 is a schematic diagram of a pin structure according to another embodiment of the disclosure;
FIG. 6 is a schematic diagram of a partial enlarged structure at a second step of the lead in the embodiment shown in FIG. 5;
fig. 7 is a schematic structural diagram of a lead frame according to another embodiment of the present disclosure;
FIG. 8 is a schematic cross-sectional view taken along line A-A of the embodiment shown in FIG. 7.
Detailed Description
At present, in the process of manufacturing the lead frame, the leads thereof need to be bent into a 3D shape, specifically referring to fig. 1, the bent portions between the inner lead portion and the outer lead portion of the lead frame are formed by extrusion between the upper mold 31 and the lower mold 32. Because the lead frame is made of metal materials, plastic deformation can occur in the molding process, and the bent part can form an arc shape.
Then, when the lead frame 10 and the chip 14 are packaged together by the wire 13, as shown in fig. 2, since the arc area of the bent portion of the lead 20 is too large, the area of the wire bonding area of the inner lead portion is too small, and bonding is inconvenient.
Therefore, the embodiment of the disclosure provides a lead and a lead frame, which can provide sufficient lead bonding area for the connection between the inner lead part of the lead frame and a chip in the chip packaging process.
In order to make the objects, technical solutions and effects of the present disclosure clearer and clearer, the present disclosure is further described in detail below with reference to the accompanying drawings and preferred embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the disclosure and do not limit the scope of the disclosure.
The disclosed embodiments provide a pin, which is a part of a lead frame, for electrically connecting a chip with a circuit board. Since the chip and the circuit board are not on the same plane, the lead of the lead frame needs to be bent in 3D.
Referring specifically to fig. 3, the pin 20 includes: an inner lead part 201, the inner lead part 201 being adapted to be connected to a chip; an outer lead portion 202, the outer lead portion 202 adapted to be connected to a circuit board; the inner lead part 201 and the outer lead part 202 are connected through a bending part 203; the pin 20 includes a first side 206 that is remote from the circuit board in use and a second side 207 opposite the first side 206.
In some embodiments, the thickness of the lead is in a range of 0.10mm to 0.40mm, and the material of the lead may be copper alloy. For example, a C194 copper material or a C7025 copper material, and the like.
In the embodiment shown in fig. 3, the connection of the inner lead part 201 and the bent part 203 includes a first step 204 on the first side 206.
A partially enlarged structural schematic diagram of the first step 204, that is, a structural schematic diagram of a part inside a dashed line frame in fig. 3 is shown in fig. 4, the first step 204 includes a first longitudinal wall 2041 and a first transverse surface 2042 connected to the first longitudinal wall 2041, the first longitudinal wall 2041 is adjacent to the inner pin 201, and the first transverse surface 2042 is adjacent to the bent portion 203.
In the above embodiment, the first step 204 of the inner lead part 201 can ensure that the area of the wire bonding region is increased on the premise that the bending degree between the inner lead part 201 and the bending part 203 is not changed, thereby facilitating the bonding of the inner lead part 201 and the chip.
In some embodiments, the first longitudinal wall may have a height of 0.03mm to 0.20mm, and an included angle between the first longitudinal wall and the first side of the inner lead part may range from 70 ° to 90 °.
In some embodiments, the length of the first transverse face is no more than 0.1mm, and the included angle between the first longitudinal wall and the first transverse face may range from 90 ° to 110 °.
In the embodiment shown in fig. 4, the first transverse surface 2042 is connected to the bent portion 203 at the first side 206 by a first arc 2043.
In some embodiments, the radius of curvature of the first arc does not exceed the thickness of the pin.
In some embodiments, referring to fig. 5 in particular, the connection point of the outer lead portion 202 and the bent portion 203 includes a second step 205 on the second side 207.
A partial structural schematic diagram of the second step 205, that is, a structural schematic diagram of a part within a dashed line frame in fig. 5, is shown in fig. 6, and includes a second longitudinal wall 2051 and a second transverse face 2052 connected to the second longitudinal wall 2051, where the second longitudinal wall 2051 is adjacent to the outer lead part 202, and the second transverse face 2052 is adjacent to the bent part 203.
In the above embodiment, the second step 205 of the outer lead portion 202 can make one side of the lead frame close to the circuit board, that is, the second side 207, be very close to a plane on the premise of not changing the bending degree between the outer lead portion 202 and the bending portion 203, and when sealing and injection molding, the outer lead portion 205 can be closely attached to a lower injection molding surface to reduce the risk of leakage of the sealing resin.
In some embodiments, the second longitudinal wall has a height of 0.03mm to 0.20mm, and an included angle between the second longitudinal wall and the second side of the outer lead portion may range from 70 ° to 90 °.
In some embodiments, the second transverse face has a length of no more than 0.1mm, and the angle between the second longitudinal wall and the second transverse face may range from 90 ° to 110 °.
In the embodiment shown in fig. 6, the second transverse surface 2052 is connected to the bent portion 203 at the second side 207 by a second circular arc 2053.
In some embodiments, the radius of curvature of the second arc does not exceed the thickness of the pin.
The present disclosure also provides a lead frame including the lead according to any of the foregoing embodiments.
As a specific example, as shown in fig. 7, the lead frame 10 includes pins 20 adapted to provide electrical paths for a chip and a circuit board; and a base island 12 adapted to provide mechanical support for the chip. Specifically, the base island 12 is a boss structure, and a base island step 17 is arranged on one side of the base island 12 far away from the chip, so that the area of one side of the base island 12 far away from the circuit board is larger than that of one side of the base island 12 close to the circuit board, and the base island step 17 is suitable for avoiding the overflow of sealing resin and covering one side of the base island 12 close to the circuit board during sealing; a V-shaped groove 18 is further arranged on the base island 12, the V-shaped groove 18 is suitable for preventing chip solder from overflowing and climbing to one side of the base island 12 close to the circuit board, and the base island 12 is connected with the frame substrate 15 through two base island connecting ribs 16. The leads 20 of the lead frame 10 further include inner lead portions and outer lead portions, and the inner lead portions are adapted to be connected to the chip through wires when the chip is packaged; the outer pin part is suitable for connecting the packaging body which is subjected to the packaging process with the circuit board through solder.
Specifically, referring to fig. 8, fig. 8 shows a structural schematic view of a-a section in the embodiment shown in fig. 7, that is, a structural schematic view of the first step 204 and the second step 205.
While the foregoing embodiments have been described in some detail and with reference to specific details thereof, it will be apparent to one skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims.
Claims (11)
1. A pin, comprising:
an inner lead portion adapted to be connected to a chip;
an outer lead portion adapted to be connected to a circuit board;
the inner pin part is connected with the outer pin part through a bending part;
the pins comprise a first side which is far away from the circuit board in use and a second side opposite to the first side; the first side of the joint of the inner pin part and the bending part comprises a first step, the first step comprises a first longitudinal wall and a first transverse surface connected with the first longitudinal wall, the first longitudinal wall is adjacent to the inner pin part, and the included angle between the first longitudinal wall and the first side of the inner pin part ranges from 70 degrees to 90 degrees.
2. The pin according to claim 1, wherein the height of said first longitudinal wall is between 0.03mm and 0.20 mm; the included angle between the first longitudinal wall and the first transverse surface ranges from 90 degrees to 110 degrees.
3. A pin according to claim 1, wherein the length of the first transverse face is no more than 0.1 mm.
4. The pin according to claim 1, wherein the first transverse surface and the bent portion are connected by a first arc at the first side.
5. A pin according to claim 4, wherein the radius of curvature of the first arc does not exceed the thickness of the pin.
6. The pin according to claim 1, wherein a junction of the outer lead portion and the bent portion includes a second step on the second side, the second step includes a second longitudinal wall and a second transverse surface connected to the second longitudinal wall, the second longitudinal wall is adjacent to the outer lead portion, and an included angle between the second longitudinal wall and the second side of the outer lead portion ranges from 70 ° to 90 °.
7. The pin according to claim 6, wherein the height of said second longitudinal wall is between 0.03mm and 0.20 mm; the included angle between the second longitudinal wall and the second transverse surface ranges from 90 degrees to 110 degrees.
8. A pin according to claim 6, wherein the length of the second transverse face is no more than 0.1 mm.
9. The pin according to claim 6, wherein the second transverse surface is connected to the bent portion at the second side by a second arc.
10. A pin according to claim 9, wherein the radius of curvature of the second arc does not exceed the thickness of the pin.
11. A lead frame comprising a pin according to any one of claims 1 to 10.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121660220.9U CN215451396U (en) | 2021-07-20 | 2021-07-20 | Pin and lead frame |
| TW111207803U TWM641162U (en) | 2021-07-20 | 2022-07-20 | Pin and lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121660220.9U CN215451396U (en) | 2021-07-20 | 2021-07-20 | Pin and lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215451396U true CN215451396U (en) | 2022-01-07 |
Family
ID=79683467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121660220.9U Active CN215451396U (en) | 2021-07-20 | 2021-07-20 | Pin and lead frame |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN215451396U (en) |
| TW (1) | TWM641162U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116613131A (en) * | 2023-06-02 | 2023-08-18 | 上海类比半导体技术有限公司 | Integrated circuit package frame |
-
2021
- 2021-07-20 CN CN202121660220.9U patent/CN215451396U/en active Active
-
2022
- 2022-07-20 TW TW111207803U patent/TWM641162U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM641162U (en) | 2023-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231124 Address after: 239004 No. 288, Wenzhong Road, Zhongxin Suchu high tech Industrial Development Zone, Chuzhou City, Anhui Province Patentee after: Advanced semiconductor materials (Anhui) Co.,Ltd. Address before: 518103 building 15, Fuqiao second industrial zone, Yongfu Road, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Advanced semiconductor materials (Shenzhen) Co.,Ltd. |
|
| TR01 | Transfer of patent right |