JPH07195553A - Manufacture of carrier tape - Google Patents

Abstract

PURPOSE:To provide a method for efficiently manufacturing a carrier tape which does not damage housed parts. CONSTITUTION:In manufacturing a carrier tape having recesses 1 connected at regular intervals, a base-like part 3 consisting of a plane and side faces is provided nearly at the center of each recesses 1 and a plurality of protrusions 4 are arranged intermittently on the peripheral edge of the plane of the base-like part 3. The protrusions 4 are punched and removed except the outside faces of the protrusions 4 so as to produce a tongue-like piece 7 for holding electronic parts 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to various fine electronic components,
The present invention relates to a method of manufacturing a carrier tape which is useful for accommodating and storing a large number of precision instrument parts and the like.

[0002]

2. Description of the Related Art A conventional carrier tape is a flat thermoplastic resin tape formed by press molding, vacuum forming, or the like, and a number of recesses are continuously arranged in the length direction of the tape to store parts therein. After that, the opening of the recess was covered with a flexible top tape, and while being adhered to the surface of the carrier tape, the reel was wound into a roll shape and conveyed and stored.

[0003]

However, as shown in FIG. 4 (a), when a smaller component such as an electronic component 32 is accommodated in the recess 31, the structure is not fixed at a fixed position. Therefore, the position is not determined, and when the carrier tape is wound, the mold portion 32a and the lead frame 3
The electronic component 32 composed of 2b may come into contact with the side wall 33 of the recess 31 and the tip of the lead frame 32b may be deformed.

In order to prevent this, a carrier tape has been proposed in which a plate-shaped base portion 34 having an upper portion is formed by press molding or vacuum forming at the center of the bottom surface of the recess 31 as shown in FIG. 4 (b). However, since the edge 35 of the trapezoidal portion 34 has a void inside, the thickness w thereof is about 0.5 mm, and the edge 35 is less likely to enter the gap between the mold portion 32a and the lead frame 32b, so that the lead frame 32b is removed. There are problems such as deformation and the inability to store the electronic component 32 in the recess 31. Therefore, as shown in FIG. 4C, a thicker than the edge 35 that stands upright at the boundary between the trapezoidal portion 34 and the bottom surface 36 by making a "U" -shaped cut on the inclined surface of the trapezoidal portion 34 and pushing and bending. A carrier tape provided with a narrow tongue piece 37 has been proposed, but the tongue piece 37, which was pushed up by bending after a long time, tends to fall back due to molding return, and therefore the electronic component 32. Insertion could occur when storing the.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to smoothly and reliably store a component in a recess, and the stored component is damaged by contact with a side wall or a bottom surface of the recess. A method of manufacturing a carrier tape without fear, which is a method of manufacturing a carrier tape in which recesses are continuously arranged at intervals, in which a trapezoidal portion composed of a flat surface and a side surface is formed substantially in the center of the recess. Also, after providing a plurality of projections intermittently on the peripheral edge of the flat surface of the platform, the projections are punched out and removed leaving the outer surface of the projections to form a tongue-shaped piece for holding an electronic component. The gist is a method of manufacturing a characteristic carrier tape.

First, the process of processing the carrier tape according to the present invention will be described with reference to the drawings. FIG. 1 (a) shows a semi-processed carrier tape. As shown in the figure, the bottom surface 2 of a recess 1 formed continuously at intervals in the length direction of the thermoplastic resin tape has a flat surface and a side surface. The trapezoidal part 3 is formed. Since the electronic parts are held on this trapezoidal portion 3, it is necessary to provide it at approximately the center of the bottom surface 2 of the recess 1. The trapezoidal portion 3 has a circular shape, a polygonal shape such as a triangle or a quadrangle,
Although there are other irregular shapes, a quadrangle is preferable from the viewpoint of the shape of electronic parts. A plurality of projections 4 are intermittently formed on the pedestal portion 3 on the peripheral edge of the plane. The outer surface 5 of the protrusion 4 is preferably a surface that is continuous with the side surface of the trapezoidal portion 3. For example, even if the outer surface 5 and the side surface of the trapezoidal portion 3 are on the same plane, the outer surface 5 and the trapezoidal portion 3 There may be a step at the boundary with the side surface of 3. The shape of the projection 4 is preferably a dam shape, but the upper surface 6 of the projection 4 may be flat or R-shaped. Protrusion 4
For example, when the trapezoidal portion 3 has a quadrangular shape, it is preferable that the trapezoidal portion 3 is provided on at least two opposite sides or diagonal corner portions from the viewpoint of holding an electronic component. When the trapezoidal portion 3 has a circular shape, a polygonal shape other than a quadrangle, or an irregular shape,
The protrusions 4 can be provided at a predetermined interval.

Next, as shown in FIGS. 1 (b) and 1 (c),
The tongue 7 can be formed by punching away the other side surface and the upper surface 6, leaving the outer surface 5 of the protrusion 4. When the electronic component 32 is stored in the recess 1 in which the tongue 7 is formed, the electronic component 32 is sandwiched by the tongue 7 and the lateral movement is sealed. Further, since the tongue-shaped piece 7 is not formed by bending, but is formed once and punched out, it has a high rigidity and does not cause a heal. Here, the protrusions 4 are continuously provided, and if the protrusions 4 are punched and removed to obtain the tongue-shaped pieces 7, all the trapezoidal portions 3 are removed.

Next, as shown in FIG. 1 (d), the recess 1 is covered with a top tape 8 and adhered to the flange 9. At this time, if the depth of the recess 1 is adjusted so as to minimize the clearance between the top tape 8 and the upper surface of the electronic component 32, the vertical movement of the stored electronic component 32 is blocked. Therefore, transporting electronic parts with such carrier tape,
If it is mounted after storage, no accident will occur. Next, a manufacturing process will be described with reference to the drawings, using a mold for manufacturing a carrier tape having such a recess 1.

(A) First step A heated thermoplastic resin tape 13 is introduced between the male mold 11 for pressing and the female mold 12 shown in FIG. 2 (a).
The lower surface of the center mold 14 of the male mold 11 has the same shape as the upper surface of the bottom of the recess 1 of the semi-processed carrier tape 15 shown in FIG. 1 (a), and the stripper 16 is arranged around this. Then, the stripper 16 is closely fitted to the inner center mold 14 and is vertically movable independently. The upper surface of the trapezoidal part forming die 17 at the center of the female die 12 is a semi-processed carrier tape 15
The bottom surface forming die 18 which has the same shape as the lower surface of the base portion 3 and which surrounds the base portion forming die 17 forms the bottom surface 2 of the semi-finished carrier tape 15, and the die 19 which surrounds the bottom surface forming die 18. The flange 9 of the semi-finished carrier tape 15 is placed on top of this. Then, the trapezoidal part forming mold 17 and the bottom surface forming mold 1
8 and the die 19 are closely fitted to each other, and the former two can move up and down. Therefore, the male die 11 is lowered to move the female die 12
2B, it is possible to form the recess 1 of the semi-processed carrier tape 15 shown in FIG. 1A in the thermoplastic resin tape 13 introduced in between. Then, when the male die 11 and then the bottom surface forming die 18 are raised, the semi-processed carrier tape 15 shown in FIG. 1A is released.

(B) Second Step Next, the semi-processed carrier tape 15 is placed on the punching female die 21 for the second step, as shown in FIG. 2 (c). A punching male die 22 facing the punching female die 21
Is a trapezoidal presser die 23 in the center, and a bottom presser die 24 surrounding this.
Consists of. The punching female die 21 is the female die 12 in the first step.
However, the trapezoidal part forming die 17 is the same as that of the above, but the trapezoidal part forming die 17 supports the lower surface of the trapezoidal portion 3 of the semi-processed carrier tape 15, and the projection cutting die 26 that surrounds this and fits tightly. It can be moved up and down. Therefore, FIG. 2 (d)
As shown in FIG. 2, after the punching male die 22 is lowered and the semi-finished carrier tape 15 is sandwiched between the punching female die 21 and the punching female die 21, the protrusion cutting die 26 is raised as shown in FIG. 2 (e). Of the side surfaces of the dam-like projection 4, only the outer side surface 5 which is continuous with the side surface of the trapezoidal portion is left so as to hold at least the electronic component, and the other side surface and the upper surface 6 are punched out, and the tongue-shaped piece 7 remains, The punching male die 22 and then the bottom surface forming die 18 can be raised to obtain the carrier tape shown in FIGS. 1 (b) and 1 (c). Here, when the protrusion 4 is punched out, the vicinity of the outer side surface 5 and the upper surface 6 is preferable. Then, since the projection cutting die 26 is lifted up and punched out, the outer side surface 5 is not compressed, and the tongue 7 obtained is not deformed. Here, if the clearance between the projection cutting die 26 and the punching male die 22 is too large, punching burrs are likely to appear, and if it is too small, deterioration of the die is accelerated, so it is about 0.
It is preferably 002 to 0.005 mm. FIG. 3 is a perspective view of another example obtained by the present invention, in which tongue-shaped pieces 7 are formed in an L shape at four corner portions of the base portion 3.

The thermoplastic resin used as the material for the carrier tape is polyvinyl chloride, polystyrene, amorphous polyethylene terephthalate, polycarbonate, polypropylene, etc., and carbon is kneaded into these resins or a conductive coating is applied on the surface of the resin tape. Examples include those that have been given.

[0012]

According to the method of manufacturing the carrier tape of the present invention,
Continuous molding is possible, the thickness of the tongue 7 of each recess 1 of the obtained carrier tape is 0.2 to 0.3 mm,
Since it is thinner than the edge 35 shown in FIG. 4B, the lead frame 32b of the electronic component may be deformed,
There is no problem that the electronic parts cannot be stored in the recess. Since the tongue piece 7 of the recess 1 according to the present invention is a part of the protrusion of the trapezoidal portion 3 that is heat-molded in the primary step, it is possible to form the upward rising angle in a nearly vertical state. Therefore, as in the case of the tongue-shaped piece 37 formed by pressing and bending shown in FIG. 4 (c) described above, a so-called thermal history is applied, so that the molding return occurs due to the passage of time and weather conditions such as temperature. There is no phenomenon of falling. Since the present invention is a method of partially punching out a semi-processed carrier tape that has been primarily processed, it is possible to obtain carrier tapes of various shapes, and in the obtained carrier tape, the strength of the tongue piece is particularly excellent. There is.

[0013]

EXAMPLES Specific embodiments of the present invention will be described below with reference to examples. The surface of a vinyl chloride tape in which carbon having a width of 24 mm and a thickness of 0.3 mm is kneaded is heated to a soft temperature or higher, and this is heated by the above-described FIGS. 2 (a), (b), (c),
In the steps shown in (d) and (e), when sequentially press-molded, a QFP type IC having lead portions in four directions
A carrier tape useful for inserting a tape was obtained. Further, this carrier tape was stored in a constant temperature and humidity device at a temperature of 50 ° C. and a humidity of 80% for 3 months, and the recess 1 in FIG.
The state of the tongue 7 was examined, but no change such as molding back was observed.

[0014]

According to the present invention, it is possible to smoothly and reliably store a component in the recess, and the stored component moves in the recess due to the winding of the carrier tape and the vibration during transportation. As a result, a carrier tape which is not likely to be damaged by coming into contact with the side wall or the bottom surface of the recess was obtained very efficiently.

[Brief description of drawings]

1A is a perspective view of a semi-processed carrier tape obtained by the present invention, FIG. 1B is a perspective view of a completed carrier tape, FIG. 1C is a partial perspective view of FIG. 1B, and FIG. b) X
It is a sectional view taken along the line X.

2 (a), (b), (c), (d) and (e) are explanatory views of steps of the present invention.

FIG. 3A is a perspective view of a carrier tape of another example obtained by the present invention, and FIG. 3B is a partial perspective view of FIG.

4 (a), (b) and (c) are cross-sectional views of a recess of a carrier tape obtained by a conventional method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Recess 2 ... Bottom 31 ... Recess 3 ... Trapezoidal part 32 ... Electronic component 4 ... Projection 32a ... Mold part 5 ... Outer surface 32b ... Lead frame 6 ... Other side and upper surface 33 ... Side wall 7 ... Tongue-shaped piece 34 ... Trapezoidal part 8 ... Top tape 35 ... Edge 9 ... Flange 36 ... Bottom surface 11 ... Male mold 37 ... Tongue piece 12 ... Female mold 13 ... Thermoplastic resin tape 14 ... Central mold 15 ... Semi-finished carrier tape 16 ... Stripper 17 ... Trapezoidal part forming mold 18 ... Bottom surface forming mold 19 ... Die 21 ... Punching female metal mold 22 ... Punching male metal mold 23 ... Trapezoidal part pressing mold 24 ... Bottom presser mold 25 ... Trapezoidal part supporting mold 26 ... Projection cutting type 27 ... Other side surface and upper surface

Claims (1)

[Claims] 1. A method of manufacturing a carrier tape in which recesses are continuously arranged at intervals, wherein a trapezoidal portion having a flat surface and a side surface is formed substantially at the center of the recess, and a flat peripheral edge of the flat surface of the trapezoidal portion is provided. A method for manufacturing a carrier tape, which comprises providing a plurality of projections intermittently and then punching and removing the projections while leaving an outer surface of the projections to obtain a tongue-shaped piece for holding an electronic component.