JP3062066B2 - Manufacturing method of electronic component storage belt - Google Patents

Manufacturing method of electronic component storage belt

Info

Publication number
JP3062066B2
JP3062066B2 JP7317274A JP31727495A JP3062066B2 JP 3062066 B2 JP3062066 B2 JP 3062066B2 JP 7317274 A JP7317274 A JP 7317274A JP 31727495 A JP31727495 A JP 31727495A JP 3062066 B2 JP3062066 B2 JP 3062066B2
Authority
JP
Japan
Prior art keywords
electronic component
component storage
band
pocket
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP7317274A
Other languages
Japanese (ja)
Other versions
JPH09131811A (en
Inventor
克弘 大西
Original Assignee
株式会社ミネロン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ミネロン filed Critical 株式会社ミネロン
Priority to JP7317274A priority Critical patent/JP3062066B2/en
Publication of JPH09131811A publication Critical patent/JPH09131811A/en
Application granted granted Critical
Publication of JP3062066B2 publication Critical patent/JP3062066B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体等の電子部
品を収納する電子部品収納帯の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component storage band for storing electronic components such as semiconductors.

【0002】[0002]

【従来の技術】半導体等の電子部品を収納する際、図6
と図9に示すような電子部品収納帯aを使用する場合が
あった。即ち、この場合の電子部品収納帯aは、全体が
帯状とされ、長手方向に沿って電子部品が収納される複
数のポケット部b…が形成されている。
2. Description of the Related Art When housing electronic parts such as semiconductors, FIG.
And an electronic component storage band a as shown in FIG. That is, the electronic component storage band a in this case has a band shape as a whole, and has a plurality of pockets b for accommodating the electronic components along the longitudinal direction.

【0003】ところで、このような電子部品収納帯を製
造する場合、まず、合成樹脂からなる帯状体(フィルム
体)を形成し、真空成形やプレス加工等にて絞ってポケ
ット部bを成形していた。
[0003] When manufacturing such an electronic component storage band, first, a band-like body (film body) made of a synthetic resin is formed, and the pocket portion b is formed by squeezing by vacuum forming or pressing. Was.

【0004】[0004]

【発明が解決しようとする課題】ところが、上述の如き
真空成形では、帯状体にピンホールがあれば、真空成形
する際、このピンホールから空気が抜け、このピンホー
ルに対応する部位にポケット部を形成することができな
かった。このような場合、数1000〜10000 個のポケット
部を有する電子部品収納帯を製造する際に1個でも不良
のポケット部があってもいけないという業界の要請に反
するものとなっていた。
However, in the above-described vacuum forming, if there is a pinhole in the strip, air is evacuated from the pinhole during vacuum forming, and a pocket portion is formed in a portion corresponding to the pinhole. Could not be formed. In such a case, when manufacturing an electronic component storage belt having several thousand to 10,000 pockets, it has been contrary to the industry's demand that there be no even one defective pocket.

【0005】また、真空成形やプレス成形では、ポケッ
ト部bのコーナ部においてはアールが大きく、しかも、
帯状体の強度等の影響により、ポケット部の深さ寸法に
限界があった。
In vacuum forming and press forming, the radius is large at the corner of the pocket b, and
Due to the influence of the strength of the belt-shaped body, the depth dimension of the pocket portion is limited.

【0006】ところで、ポケット部bとしては、電子部
品(図示省略)を収納する必要があり、そのため、図7
や図8に示すように、ポケット部bに電子部品を受ける
受部cを形成する必要があった。しかしながら、図7に
示す受部cにおいては、受部cの肉厚寸法tが比較的大
となり、鋭角に細高いリブとすることができず、図8に
示す受部cでは、受部cは起立片からなるので、起立片
間寸法wが不安定となっていた。
By the way, it is necessary to store an electronic component (not shown) as the pocket portion b.
As shown in FIG. 8 and FIG. 8, a receiving portion c for receiving an electronic component needs to be formed in the pocket portion b. However, in the receiving portion c shown in FIG. 7, the thickness t of the receiving portion c is relatively large, and it is not possible to form a sharp and thin rib, and in the receiving portion c shown in FIG. Is composed of the upright pieces, the dimension w between the upright pieces was unstable.

【0007】しかして、近年のIC(集積回路)等にお
いては高集積化が進み、ピン数が増え、しかも、ピン自
体も細くなると共にピン間ピッチも小さくなってきてい
る。従って、搬送中等において、リード曲り等を防ぐ必
要があり、受部として鋭角に細高いリブとしたり、ポケ
ット部のコーナ部のアールを小さくすると共に、寸法精
度も高精度とする必要があった。
However, in recent years, ICs (integrated circuits) and the like have been highly integrated, the number of pins has been increased, the pins themselves have become thinner, and the pitch between pins has become smaller. Therefore, it is necessary to prevent lead bending and the like during transportation and the like, and it is necessary to use a sharply thin rib as a receiving portion, to reduce the radius of the corner portion of the pocket portion, and to have high dimensional accuracy.

【0008】そこで、本発明では、高精度に、しかも、
形成すべきポケット部に不良は発生することのない電子
部品収納帯の製造方法を提供することを目的とする。
Therefore, the present invention provides a highly accurate and
It is an object of the present invention to provide a method of manufacturing an electronic component storage band in which a defect does not occur in a pocket to be formed.

【0009】[0009]

【課題を解決するための手段】上述の目的を達成するた
めに、本発明に係る電子部品収納帯製造方法は、シート
体を所定の幅寸法に切断して帯素材を形成した後この素
材に長手方向に沿って所定間隔でプレス加工にて窓部を
貫設してなる帯状部と、射出成形にて形成される電子部
品収納用ポケット部とを、夫々別個に形成した後、該帯
状部の窓部の周縁に、電子部品収納用ポケット部の開口
端縁を固着して、該帯状部と電子部品収納用ポケット部
とを一体化するものである。
To achieve the above object, according to the solution to ## engagement Ru electronic component housing zone manufacturing method according to the present invention, this after forming the strip material by cutting the sheet to a predetermined width After separately forming a band-shaped portion formed by penetrating a window portion by pressing at a predetermined interval along the longitudinal direction of the material and an electronic component storage pocket portion formed by injection molding, The opening edge of the electronic component storage pocket portion is fixed to the periphery of the window portion of the strip portion, and the strip portion and the electronic component storage pocket portion are integrated.

【0010】[0010]

【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて詳説する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0011】図1と図2は本発明に係る電子部品収納帯
を示し、この電子部品収納帯は、電子部品収納用ポケッ
ト部1…と、帯状部2と、からなる。この場合、ポケッ
ト部1は射出成形品からなり、帯状部2はシート体3
(図3参照)の切断品である。
FIGS. 1 and 2 show an electronic component storage band according to the present invention. The electronic component storage band includes an electronic component storage pocket portion 1 and a band portion 2. In this case, the pocket portion 1 is made of an injection molded product, and the belt portion 2 is made of a sheet 3
(See FIG. 3).

【0012】帯状部2には、図1に示すように、長手方
向に沿った所定ピッチで矩形状の窓部4…が貫設され、
この窓部4の周縁に、ポケット部1の開口端縁7が一体
状に固着されている。即ち、ポケット部1は、図2に示
すように、周囲壁5と、底壁6と、該周囲壁5の上方開
口端から外方に突出される外鍔部と、を備え、外鍔部が
上述の開口端縁7となり、この外鍔部である開口端縁7
が、帯状部2の裏面8に、接着や熱融着や溶着等にて固
着される。この際、平面的に見て、周囲壁5の内面5a
と窓部4の内縁4aとを略一致乃至窓部4を周囲壁5よ
り僅かに大きく設定している。
As shown in FIG. 1, rectangular windows 4 are provided in the belt 2 at a predetermined pitch along the longitudinal direction.
An opening edge 7 of the pocket portion 1 is integrally fixed to a peripheral edge of the window portion 4. That is, as shown in FIG. 2, the pocket 1 includes a peripheral wall 5, a bottom wall 6, and an outer flange protruding outward from an upper open end of the peripheral wall 5. Becomes the above-mentioned opening edge 7, and the opening edge 7 which is the outer flange portion
Is fixed to the back surface 8 of the belt-like portion 2 by bonding, heat fusion, welding, or the like. At this time, the inner surface 5a of the peripheral wall 5 is viewed in plan.
And the inner edge 4a of the window 4 is set to be substantially the same or the window 4 is set slightly larger than the surrounding wall 5.

【0013】また、ポケット部1の底壁6の内面6aに
は、図示省略の半導体等の電子部品が載置保持される受
部9が立設されている。この受部9は図1に示すよう
に、平面的に見て、矩形状とされ、その断面形状が三角
形とされるが、勿論これに限るものではない。
On the inner surface 6a of the bottom wall 6 of the pocket portion 1, there is provided a receiving portion 9 on which an electronic component such as a semiconductor (not shown) is placed and held. As shown in FIG. 1, the receiving portion 9 has a rectangular shape in plan view and a triangular sectional shape, but is not limited to this.

【0014】次に、この電子部品収納帯の製造方法を説
明する。まず、図3(イ)に示すように、ポリスチレン
(PS)、PVC、PET等からなる所定肉厚のシート
体3を形成した後、このシート体3を所定の幅寸法Hに
切断して帯素材11を形成する。
Next, a method of manufacturing the electronic component storage band will be described. First, as shown in FIG. 3A, a sheet 3 having a predetermined thickness made of polystyrene (PS), PVC, PET, or the like is formed. The material 11 is formed.

【0015】その後、図示省略のプレス機によるプレス
加工にて図3(ロ)に示すようにこの帯素材11にその長
手方向に沿って所定ピッチで窓部4…を貫設し、帯状部
2を形成する。
Thereafter, as shown in FIG. 3B, windows 4 are pierced at a predetermined pitch along the longitudinal direction of the band material 11 by press working with a press machine (not shown). To form

【0016】そして、ポケット部1は射出成形にて形成
し、このポケット部1と帯状部2とを、図4に示すよう
に、接着等して一体化すれば、この電子部品収納帯を形
成することができるが、この場合、図5に示すように、
射出成形金型12に、この帯状部2をその長手方向に沿っ
て矢印の如く間欠的に送り込みつつ、この射出成形金型
12に樹脂を押し込み、これにより、ポケット部1を形成
すると共に、このポケット部1を帯状部2に一体化し
て、この射出成形金型12から製品としての電子部品収納
帯を送出させるようにするのが好ましい。
The pocket part 1 is formed by injection molding, and the pocket part 1 and the belt-shaped part 2 are integrated by bonding or the like as shown in FIG. In this case, as shown in FIG.
The belt-shaped portion 2 is intermittently fed into the injection molding die 12 along the longitudinal direction as indicated by an arrow, and the injection molding die is
The resin is pushed into the pocket 12, thereby forming the pocket 1, and integrating the pocket 1 with the belt 2 so as to send out the electronic component storage band as a product from the injection mold 12. Is preferred.

【0017】即ち、図5に示す方法では、ポケット部1
の形成と、このポケット部1と帯状部2との一体化と
を、同時に行っているが、上述の如く、ポケット部1と
帯状部2とを夫々別個に形成し、その後、帯状部2のポ
ケット部1…を固着するようにしてもよい。
That is, in the method shown in FIG.
And the integration of the pocket portion 1 and the band portion 2 are simultaneously performed. However, as described above, the pocket portion 1 and the band portion 2 are separately formed, and then the band portion 2 is formed. The pockets 1 may be fixed.

【0018】ところで、上述の如く形成された電子部品
収納帯は、各ポケット部1…に電子部品が収納され、こ
れに、例えば、この帯状部2と略同一幅の帯体からなる
蓋体にて、各ポケット部1の開口部を施蓋し、これらを
渦巻き状に巻設して、保持する。
In the electronic component storage band formed as described above, the electronic components are stored in the pockets 1..., For example, in a lid made of a band having substantially the same width as the band 2. Then, the opening of each pocket portion 1 is covered, and these are spirally wound and held.

【0019】なお、ポケット部1や該ポケット部1に形
成される受部9の形状としては、上述のものに限らず、
収納すべき電子部品の形状に対応したものとできる。と
ころで、ポケット部1は、本発明では射出成形で形成さ
れるので、複雑な形状であっても、簡単かつ高精度に製
造でき、しかも、コーナ部においてもアールを小さくで
き、かつ、受部9を鋭角に細高いリブとすることができ
る。
The shape of the pocket portion 1 and the receiving portion 9 formed in the pocket portion 1 are not limited to those described above.
It can be adapted to the shape of the electronic component to be stored. By the way, since the pocket portion 1 is formed by injection molding in the present invention, it can be manufactured easily and with high accuracy even if it has a complicated shape, and the radius can be reduced even at the corner portion, and the receiving portion 9 can be formed. Can be made into a sharp and thin rib at an acute angle.

【0020】[0020]

【発明の効果】本発明は上述の如く構成されているの
で、次に記載する効果を奏する。
Since the present invention is configured as described above, the following effects can be obtained.

【0021】 ポケット部1を真空成形で形成しない
ので、仮に、帯状部2にピンホール等があっても、ポケ
ット部1を確実に形成でき、これにより、帯状部2をあ
まり高精度に形成する必要はなく、帯状部2の製造が容
易となり、かつ、コスト高とならない。 ポケット部
1は射出成形品であるので、複雑な形状のものやその深
さ寸法が比較的大きいもの等を確実に製造できると共
に、ポケット部1としての形状・寸法を高精度に仕上げ
ることができ、しかも、コーナ部においてもアールを小
さくでき、かつ、受部9を鋭角に細高いリブとすること
ができ、これにより、搬送中等においてもリード曲り等
を有効に防止することができる。 真空成形では帯状
部の厚さ寸法をあまり小とすることができなかったが、
ポケット部1と帯状部2とが別々に製造されるので、帯
状部2の厚さ寸法をかなり小とすることができ、このた
め、電子部品を収納して、渦巻き状に巻設する際、巻設
し易く、かつ、嵩高とならない。 真空成形やプレス
成形に比べて、ポケット部1の設計の自由度が大きく、
設計が容易となる。
Since the pocket portion 1 is not formed by vacuum forming, even if the band portion 2 has a pinhole or the like, the pocket portion 1 can be reliably formed, thereby forming the band portion 2 with very high precision. There is no necessity, and the manufacture of the strip 2 becomes easy, and the cost does not increase. Since the pocket portion 1 is an injection molded product, it is possible to reliably manufacture a complicated shape or a product having a relatively large depth dimension, and to finish the shape and size of the pocket portion 1 with high precision. In addition, the radius can be reduced even at the corner portion, and the receiving portion 9 can be formed as a sharp and thin rib, thereby effectively preventing lead bending and the like even during transportation. Although the thickness of the strip could not be made too small by vacuum forming,
Since the pocket portion 1 and the band portion 2 are manufactured separately, the thickness of the band portion 2 can be made considerably small. Therefore, when storing the electronic components and winding them in a spiral shape, It is easy to wind and does not become bulky. Compared to vacuum molding and press molding, the degree of freedom in designing the pocket part 1 is greater,
Design becomes easy.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る電子部品収納帯の斜視図である。FIG. 1 is a perspective view of an electronic component storage band according to the present invention.

【図2】要部断面図である。FIG. 2 is a sectional view of a main part.

【図3】製造方法説明図である。FIG. 3 is an explanatory view of a manufacturing method.

【図4】帯状部とポケット部の断面図である。FIG. 4 is a cross-sectional view of a band portion and a pocket portion.

【図5】製造方法を示す簡略図である。FIG. 5 is a simplified diagram showing a manufacturing method.

【図6】従来の電子部品収納帯の断面図である。FIG. 6 is a sectional view of a conventional electronic component storage band.

【図7】従来の電子部品収納帯の断面図である。FIG. 7 is a sectional view of a conventional electronic component storage band.

【図8】従来の電子部品収納帯の断面図である。FIG. 8 is a sectional view of a conventional electronic component storage band.

【図9】従来の電子部品収納帯の簡略平面図である。FIG. 9 is a simplified plan view of a conventional electronic component storage band.

【符号の説明】[Explanation of symbols]

1 電子部品収納用ポケット部 2 帯状部 3 シート体 4 窓部 7 開口端縁 11 帯素材 12 射出成形金型 DESCRIPTION OF SYMBOLS 1 Pocket part for electronic component storage 2 Strip part 3 Sheet body 4 Window part 7 Opening edge 11 Strip material 12 Injection molding die

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 シート体3を所定の幅寸法に切断して帯
素材11を形成した後この素材11に長手方向に沿って所定
間隔でプレス加工にて窓部4を貫設してなる帯状部2
と、射出成形にて形成される電子部品収納用ポケット部
1とを、夫々別個に形成した後、該帯状部2の窓部4の
周縁に、電子部品収納用ポケット部1の開口端縁7を固
着して、該帯状部2と電子部品収納用ポケット部1とを
一体化することを特徴とする電子部品収納帯の製造方
法。
1. A sheet body 3 is cut into a predetermined width dimension to form a band.
After the material 11 is formed, the material 11 is
Band 2 formed by penetrating window 4 by pressing at intervals
And an electronic component storage pocket formed by injection molding
1 and 2 are separately formed, and then the windows 4 of the strip 2 are
The opening edge 7 of the electronic component storage pocket 1 is fixed to the periphery.
And the band-shaped portion 2 and the electronic component storage pocket portion 1 are attached to each other.
Manufacturing method of electronic component storage belt characterized by integration
Law.
JP7317274A 1995-11-09 1995-11-09 Manufacturing method of electronic component storage belt Expired - Lifetime JP3062066B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7317274A JP3062066B2 (en) 1995-11-09 1995-11-09 Manufacturing method of electronic component storage belt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7317274A JP3062066B2 (en) 1995-11-09 1995-11-09 Manufacturing method of electronic component storage belt

Publications (2)

Publication Number Publication Date
JPH09131811A JPH09131811A (en) 1997-05-20
JP3062066B2 true JP3062066B2 (en) 2000-07-10

Family

ID=18086411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7317274A Expired - Lifetime JP3062066B2 (en) 1995-11-09 1995-11-09 Manufacturing method of electronic component storage belt

Country Status (1)

Country Link
JP (1) JP3062066B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003059775A1 (en) * 2002-01-10 2003-07-24 Kaneko Denki Kabushiki Kaisha Carrier tape and article filling apparatus comprising carrier tape

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107399170B (en) * 2017-07-31 2023-04-18 安徽诚越电子科技有限公司 High-efficient sign indicating number device of beating of electric capacity

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003059775A1 (en) * 2002-01-10 2003-07-24 Kaneko Denki Kabushiki Kaisha Carrier tape and article filling apparatus comprising carrier tape

Also Published As

Publication number Publication date
JPH09131811A (en) 1997-05-20

Similar Documents

Publication Publication Date Title
JP5358510B2 (en) Embossed carrier tape, method for manufacturing the same, and packaged part wound body
JP3062066B2 (en) Manufacturing method of electronic component storage belt
JP6114514B2 (en) Carrier tape for storing electronic components, method for manufacturing carrier tape for storing electronic components, and package
JPH06263164A (en) Carrier tape and manufacture thereof
JP2022121473A (en) Lid of container
JPH0577060U (en) Electronic parts storage belt
JPH0510283U (en) Electronic component storage container
CN213861119U (en) Composite material tray
JPH0617145B2 (en) Electronic component carrier
JPH0788949A (en) Production of embossed carrier tape
JPH06286781A (en) Parts holder
JP3907240B2 (en) Carrier tape
JPH10329888A (en) Carrier tape, method of manufacturing carrier tape and taping packaging member
JP2593932Y2 (en) Carrier tape
JP2766834B2 (en) Case for storing refill parts for ink ribbon cartridge and method of manufacturing the same
JPH07195553A (en) Manufacture of carrier tape
JPS59152830A (en) Manufacture of synthetic resin container
JPS627555Y2 (en)
JPS6140695Y2 (en)
JPH0140659Y2 (en)
JPS5872408A (en) Preparation of synthetic resin formed article
JPH08252875A (en) Manufacture of sensor
JP2550263B2 (en) Chip type electronic component package
JPS5921172B2 (en) Lead frame connecting piece cutting device
JPS5937209B2 (en) Manufacturing method of box-shaped synthetic resin molded product