JP3062066B2 - Manufacturing method of electronic component storage belt - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component storage band for storing electronic components such as semiconductors.

[0002]

2. Description of the Related Art When housing electronic parts such as semiconductors, FIG.
And an electronic component storage band a as shown in FIG. That is, the electronic component storage band a in this case has a band shape as a whole, and has a plurality of pockets b for accommodating the electronic components along the longitudinal direction.

[0003] When manufacturing such an electronic component storage band, first, a band-like body (film body) made of a synthetic resin is formed, and the pocket portion b is formed by squeezing by vacuum forming or pressing. Was.

[0004]

However, in the above-described vacuum forming, if there is a pinhole in the strip, air is evacuated from the pinhole during vacuum forming, and a pocket portion is formed in a portion corresponding to the pinhole. Could not be formed. In such a case, when manufacturing an electronic component storage belt having several thousand to 10,000 pockets, it has been contrary to the industry's demand that there be no even one defective pocket.

In vacuum forming and press forming, the radius is large at the corner of the pocket b, and
Due to the influence of the strength of the belt-shaped body, the depth dimension of the pocket portion is limited.

By the way, it is necessary to store an electronic component (not shown) as the pocket portion b.
As shown in FIG. 8 and FIG. 8, a receiving portion c for receiving an electronic component needs to be formed in the pocket portion b. However, in the receiving portion c shown in FIG. 7, the thickness t of the receiving portion c is relatively large, and it is not possible to form a sharp and thin rib, and in the receiving portion c shown in FIG. Is composed of the upright pieces, the dimension w between the upright pieces was unstable.

However, in recent years, ICs (integrated circuits) and the like have been highly integrated, the number of pins has been increased, the pins themselves have become thinner, and the pitch between pins has become smaller. Therefore, it is necessary to prevent lead bending and the like during transportation and the like, and it is necessary to use a sharply thin rib as a receiving portion, to reduce the radius of the corner portion of the pocket portion, and to have high dimensional accuracy.

Therefore, the present invention provides a highly accurate and
It is an object of the present invention to provide a method of manufacturing an electronic component storage band in which a defect does not occur in a pocket to be formed.

[0009]

To achieve the above object, according to the solution to ## engagement Ru electronic component housing zone manufacturing method according to the present invention, this after forming the strip material by cutting the sheet to a predetermined width After separately forming a band-shaped portion formed by penetrating a window portion by pressing at a predetermined interval along the longitudinal direction of the material and an electronic component storage pocket portion formed by injection molding, The opening edge of the electronic component storage pocket portion is fixed to the periphery of the window portion of the strip portion, and the strip portion and the electronic component storage pocket portion are integrated.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIGS. 1 and 2 show an electronic component storage band according to the present invention. The electronic component storage band includes an electronic component storage pocket portion 1 and a band portion 2. In this case, the pocket portion 1 is made of an injection molded product, and the belt portion 2 is made of a sheet 3
(See FIG. 3).

As shown in FIG. 1, rectangular windows 4 are provided in the belt 2 at a predetermined pitch along the longitudinal direction.
An opening edge 7 of the pocket portion 1 is integrally fixed to a peripheral edge of the window portion 4. That is, as shown in FIG. 2, the pocket 1 includes a peripheral wall 5, a bottom wall 6, and an outer flange protruding outward from an upper open end of the peripheral wall 5. Becomes the above-mentioned opening edge 7, and the opening edge 7 which is the outer flange portion
Is fixed to the back surface 8 of the belt-like portion 2 by bonding, heat fusion, welding, or the like. At this time, the inner surface 5a of the peripheral wall 5 is viewed in plan.
And the inner edge 4a of the window 4 is set to be substantially the same or the window 4 is set slightly larger than the surrounding wall 5.

On the inner surface 6a of the bottom wall 6 of the pocket portion 1, there is provided a receiving portion 9 on which an electronic component such as a semiconductor (not shown) is placed and held. As shown in FIG. 1, the receiving portion 9 has a rectangular shape in plan view and a triangular sectional shape, but is not limited to this.

Next, a method of manufacturing the electronic component storage band will be described. First, as shown in FIG. 3A, a sheet 3 having a predetermined thickness made of polystyrene (PS), PVC, PET, or the like is formed. The material 11 is formed.

Thereafter, as shown in FIG. 3B, windows 4 are pierced at a predetermined pitch along the longitudinal direction of the band material 11 by press working with a press machine (not shown). To form

The pocket part 1 is formed by injection molding, and the pocket part 1 and the belt-shaped part 2 are integrated by bonding or the like as shown in FIG. In this case, as shown in FIG.
The belt-shaped portion 2 is intermittently fed into the injection molding die 12 along the longitudinal direction as indicated by an arrow, and the injection molding die is
The resin is pushed into the pocket 12, thereby forming the pocket 1, and integrating the pocket 1 with the belt 2 so as to send out the electronic component storage band as a product from the injection mold 12. Is preferred.

That is, in the method shown in FIG.
And the integration of the pocket portion 1 and the band portion 2 are simultaneously performed. However, as described above, the pocket portion 1 and the band portion 2 are separately formed, and then the band portion 2 is formed. The pockets 1 may be fixed.

In the electronic component storage band formed as described above, the electronic components are stored in the pockets 1..., For example, in a lid made of a band having substantially the same width as the band 2. Then, the opening of each pocket portion 1 is covered, and these are spirally wound and held.

The shape of the pocket portion 1 and the receiving portion 9 formed in the pocket portion 1 are not limited to those described above.
It can be adapted to the shape of the electronic component to be stored. By the way, since the pocket portion 1 is formed by injection molding in the present invention, it can be manufactured easily and with high accuracy even if it has a complicated shape, and the radius can be reduced even at the corner portion, and the receiving portion 9 can be formed. Can be made into a sharp and thin rib at an acute angle.

[0020]

Since the present invention is configured as described above, the following effects can be obtained.

Since the pocket portion 1 is not formed by vacuum forming, even if the band portion 2 has a pinhole or the like, the pocket portion 1 can be reliably formed, thereby forming the band portion 2 with very high precision. There is no necessity, and the manufacture of the strip 2 becomes easy, and the cost does not increase. Since the pocket portion 1 is an injection molded product, it is possible to reliably manufacture a complicated shape or a product having a relatively large depth dimension, and to finish the shape and size of the pocket portion 1 with high precision. In addition, the radius can be reduced even at the corner portion, and the receiving portion 9 can be formed as a sharp and thin rib, thereby effectively preventing lead bending and the like even during transportation. Although the thickness of the strip could not be made too small by vacuum forming,
Since the pocket portion 1 and the band portion 2 are manufactured separately, the thickness of the band portion 2 can be made considerably small. Therefore, when storing the electronic components and winding them in a spiral shape, It is easy to wind and does not become bulky. Compared to vacuum molding and press molding, the degree of freedom in designing the pocket part 1 is greater,
Design becomes easy.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component storage band according to the present invention.

FIG. 2 is a sectional view of a main part.

FIG. 3 is an explanatory view of a manufacturing method.

FIG. 4 is a cross-sectional view of a band portion and a pocket portion.

FIG. 5 is a simplified diagram showing a manufacturing method.

FIG. 6 is a sectional view of a conventional electronic component storage band.

FIG. 7 is a sectional view of a conventional electronic component storage band.

FIG. 8 is a sectional view of a conventional electronic component storage band.

FIG. 9 is a simplified plan view of a conventional electronic component storage band.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Pocket part for electronic component storage 2 Strip part 3 Sheet body 4 Window part 7 Opening edge 11 Strip material 12 Injection molding die

Claims (1)

(57) [Claims] 1. A sheet body 3 is cut into a predetermined width dimension to form a band.
After the material 11 is formed, the material 11 is
Band 2 formed by penetrating window 4 by pressing at intervals
And an electronic component storage pocket formed by injection molding
1 and 2 are separately formed, and then the windows 4 of the strip 2 are
The opening edge 7 of the electronic component storage pocket 1 is fixed to the periphery.
And the band-shaped portion 2 and the electronic component storage pocket portion 1 are attached to each other.
Manufacturing method of electronic component storage belt characterized by integration
Law.