JPS6140695Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to the main body of a carrier of an integrated circuit such as an IC, LSI, or super LSI.

Conventionally, this type of carrier is made by extruding synthetic resin into a cylindrical shape, and conductive powder such as carbon black or metal powder is mixed in advance into the resin to prevent static electricity from accumulating. The IC is pushed into this cylinder and transported to an electrical equipment assembly factory.

However, during the assembly of the equipment in the assembly factory, the conductive powder inside the container may fall out of the equipment, which may adversely affect the precision of the equipment. Additionally, because conventional products are three-dimensionally molded, they are bulky when transported to IC manufacturing plants. moreover,
In conventional carriers, the main body of the IC is supported by the tip of the IC's terminals, so the tips and outer parts of the IC's terminals come into contact with the inner wall of the carrier, causing the terminals to bend, especially in the case of integrated circuits with thin terminals. It also causes some inconvenience.

The present invention was developed in view of the above points, and uses a strip-shaped sheet made of a metal foil layer on a paper layer as a base material, and is configured to be foldable and assembleable, thereby further improving the holding position of the integrated circuit. The idea is to eliminate the drawbacks of conventional carriers by changing the position from the tip of the conventional IC terminal to the base of the IC terminal. That is, in the present invention, a bottom wall is defined at the center along the longitudinal direction of the strip sheet, first side walls are defined on the left and right sides of the bottom wall, second side walls are defined on the left and right sides of the bottom wall, and at least the first side wall is defined on the left and right sides of the bottom wall. A metal layer is laminated at the boundary between the side wall and the second side wall,
And, a perforated line that starts from the left end of the bottom wall, passes through the first left side wall, the bottom wall, the first right side wall and ends at the right end of the bottom wall, a folded line that crosses the area surrounded by the perforated line, and the folded line. A plurality of upright pieces are formed by cuts at opposite ends of the upright pieces, and the first and second side walls overlap each other, and they are made to stand up from the left and right sides of the bottom wall, and the cuts of the upright pieces are aligned with the punched line edge of the side wall. The gist is a main body of a carrier for integrated circuits which is cut into the main body of the integrated circuit carrier.

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 shows the layer structure of the material of the carrier body. In the figure, 10 is paper, 12 is aluminum foil thereon, and these are bonded together with an adhesive 14.

FIG. 2 shows a blank of the carrier body. First, reference numeral 16 denotes a bottom wall, which is partitioned at the center along the longitudinal direction of the belt-shaped sheet. 18,
Reference numeral 20 denotes a first side wall that is partitioned on the left and right sides of the bottom wall, and 22 and 24 are second side walls that are further partitioned on the left and right sides thereof. There are 26 fold lines between each of these walls.
It is divided by.

Moreover, 28 is a standing piece, and a plurality of pieces are provided at equal intervals. Each upright piece has a loop formed by a punching line 30 that starts from the left end of the bottom wall 16, passes through the left first side wall 18, the bottom wall 16, the right first side wall 20, and ends at the right end of the bottom wall. It is divided into two by a fold line 32 that crosses the area surrounded by. It is desirable that creases between the walls are not provided in the upright piece as shown in the drawings. 34 is a notch provided at the end opposite to the fold line. This cut is formed by a punch line and a crease. Further, 36 is a small curved portion of the punch line formed at the left and right ends of the fold line 32.

Next, the operation of assembling the above blanks to form a carrier body will be described.

As shown in FIG. 3, first and second side walls 18, 22,
20 and 24 are superposed. Do this so that the aluminum foil is on the outside. Polymerization is carried out by securely bending or pasting along the creases 26. In addition, in order to eliminate or alleviate the occurrence of the step difference due to the polymerization, the thickness of the paper layer at the overlapped portions of the side walls 18, 22, 20, and 24 may be reduced in advance. And, these first and second side walls 18, 22,
20 and 24 are made to stand at right angles to the bottom wall 16. In addition, contrary to what is illustrated, the first side wall may be erected so as to be located outside the second side wall. In this case, the entire outer wall of the carrier body will be covered with aluminum foil.

Next, as shown in FIG.
It bites into the edge of the punched line 30 of No. 4 and further engages with the small curved portion 36. The small curved portion will serve as a stopper.

Thus, when the carrier body is assembled, the LSI 38 straddles the boundary line 26 between the first side wall and the second side wall, as shown in FIG. In this state, the terminals 40 of the LSI do not contact the upright piece 28 and are located inside the left and right ends of the upright piece.
Also, preferably the width of the resin part of the LSI is 1
The width is set to be approximately equal to the width between 8 and 20, so that the terminal 40 does not come into contact with the side wall. This is especially advantageous when the terminals are long and narrow, such as in a VLSI. Also, the terminal 40 of the LSI is connected to the aluminum foil 1 on the side wall.
2, and static electricity escapes through this, which effectively prevents the LSI from being destroyed by charging.

Thereafter, the carrier body is housed in a cylinder or box 42 as shown in FIGS. 4 and 5, and is fixed so that the LSI 38 will not roll or move during transportation. Note that, instead of using a cylinder or a box, a suitable cover may be placed on the carrier and fixed to the carrier body using an adhesive tape or the like (not shown).

As described above, since the carrier body according to the present invention is made of a sheet made of stacked metal foil layers, it does not have the problem of falling carbon black as in conventional products.

Furthermore, since the terminals of the integrated circuit are configured to straddle each other, accidents such as the terminals touching other parts and bending during transportation will not occur.

Furthermore, since the carrier body of the present invention can be folded flat, it is convenient for transporting the carrier itself.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of the layer structure of the carrier body according to the present invention. FIG. 2 is a partially cutaway exploded view of the carrier body. FIG. 3 is a partially assembled perspective view of the carrier body. FIG. 4 is a partially cutaway perspective view showing a fully assembled carrier body with an LSI straddled over it together with a cylindrical body, and FIG. 5 is a vertical cross-sectional view of the assembled state of the carrier body shown in FIG. 4. 10... paper layer, 12... metal foil layer, 16... bottom wall, 18, 20, 22, 24... side wall, 28...
Standing piece, 30... Punching line, 34... Cut, 38...
...LSI, 40...LSI terminal.

Claims (1)

[Scope of utility model registration request] A bottom wall is defined at the center along the longitudinal direction of the strip sheet, first side walls are defined on the left and right sides of the bottom wall, second side walls are defined on the left and right sides of the bottom wall, and at least the first side wall and the second side wall are defined. A metal layer is laminated at the boundary of the bottom wall, and a punching line starts from the left end of the bottom wall, passes through the first left side wall, the bottom wall, the first right side wall, and ends at the right end of the bottom wall, and is surrounded by the punching line. A plurality of upright pieces are formed by a fold line that crosses the broken part and a cut at the end opposite to the fold line, and the first and second side walls are overlapped and raised from the left and right sides of the bottom wall. A main body of a carrier for an integrated circuit, which is formed by biting into the edge of the punched line of the side wall.