JP2019094078A - Carrier tape and method for molding carrier tape - Google Patents
Carrier tape and method for molding carrier tape Download PDFInfo
- Publication number
- JP2019094078A JP2019094078A JP2017222985A JP2017222985A JP2019094078A JP 2019094078 A JP2019094078 A JP 2019094078A JP 2017222985 A JP2017222985 A JP 2017222985A JP 2017222985 A JP2017222985 A JP 2017222985A JP 2019094078 A JP2019094078 A JP 2019094078A
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- flange portion
- storage recess
- mold
- storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packages (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
本発明は、部品を収納する収納凹部を有するキャリアテープ及びキャリアテープの成形方法に関する。 The present invention relates to a carrier tape having a storage recess for storing components and a method of molding the carrier tape.
従来、ベアチップ（ベアダイ）やＩＣチップなどの電子部品は、キャリアテープの収納凹部に収納され、工場間の輸送や実装装置への供給などに利用されている。このキャリテープには、電子部品などの部品を収納する収納凹部と、送り孔を有するフランジ部とが、長手方向に並んで形成されており、また、収納凹部及び送り孔は長手方向に沿って形成されている（例えば、特許文献１参照）。そして、テーピング機でキャリアテープに部品が収納されると、収納凹部はカバーテープによってシールされて、リールに巻き取られている。 Heretofore, electronic components such as bare chips (bare dies) and IC chips have been stored in storage recesses of carrier tapes and used for transportation between factories and supply to mounting devices. In the carry tape, a storage recess for storing components such as electronic components and a flange portion having a feed hole are formed side by side in the longitudinal direction, and the storage recess and the feed hole are along the longitudinal direction. (See, for example, Patent Document 1). Then, when the component is stored in the carrier tape by the taping machine, the storage recess is sealed by the cover tape and wound up on the reel.
近年、部品の収納効率を上げるため、収納凹部の間隔が狭く（短く）なっているが、同特許文献１のように、表面に凹型が形成されたドラム式の真空成形金型を用いて、キャリアテープを真空成形すると、キャリアテープは、フランジ部の表面に対して、連結部の収納凹部の開口側の面である表面５００Ａが、収納凹部の底面側に段落ちした形状になって成形される（図７及び図８（ｂ）参照）。 In recent years, in order to increase the storage efficiency of parts, the space between the storage recesses is narrow (short), but as in Patent Document 1, using a drum-type vacuum forming mold having a concave formed on the surface, When the carrier tape is vacuum molded, the carrier tape is molded such that the surface 500A, which is the surface on the opening side of the storage recess of the connection portion, is stepped to the bottom side of the storage recess with respect to the surface of the flange portion. (See FIG. 7 and FIG. 8 (b)).
この連結部が段落ちした形状のキャリアテープの収納凹部に、テーピング機で部品を収納しようとすると、部品が連結部の上面に当たることがあり、斜めに収納されたり、収納凹部から飛び出したりして、エラーが起こり、テーピング機が停止することがある。 When it is attempted to store a component with a taping machine in the storage recess of the carrier tape having a shape in which the connection portion is stepped, the component may hit the upper surface of the connection portion, and may be stored diagonally or pop out from the storage recess. An error may occur and the taping machine may stop.
そこで、本発明は以上の課題に鑑みてなされたものであり、部品を収納凹部に確実に収納できるキャリアテープ及びキャリアテープの製造方法を提供することを目的とする。 Then, this invention is made in view of the above subject, and an object of this invention is to provide the manufacturing method of the carrier tape which can be accommodated reliably in an accommodation recessed part, and a carrier tape.
（１）本発明に係る一つの態様は、部品を収納する収納凹部と、送り孔を有するフランジ部とが形成されたキャリアテープであって、搬送方向における前記収納凹部同士の間である連結部は、前記収納凹部の開口側の面である表面が、前記フランジ部の表面と同じ高さでフラットに形成され、かつ、前記連結部の表面とは反対の裏面が、前記フランジ部の裏面とは異なる高さに位置するものである。
（２）上記（１）の態様において、前記フランジ部の表面を基準にしたとき、前記連結部の裏面は、前記フランジ部の裏面までの距離より短い距離に位置してもよい。
（３）上記（１）又は（２）の態様において、前記フランジ部の裏面と前記連結部の裏面との高さの差である前記連結部の凹み量が、下記の（式１）を満たしてもよい。
（式１）Ｈ＝Ｔ／２−α・Ｄ ただし、連結部の凹み量をＨ、フランジ部の厚みをＴ、収納凹部の間隔をＤとし、各寸法単位をｍｍとし、αは０．０２≦α≦０．０４である。 （４）上記（１）から（３）までの一つに態様において、前記キャリアテープは、ドラム式の真空成形金型で成形されていてもよい。
（５）本発明に係る別の一つの態様は、部品を収納する収納凹部と、送り孔を有するフランジ部とが形成されたキャリアテープをシート基材から成形するキャリアテープの成形方法であって、表面に前記収納凹部を成形する凹型を有するドラム式の真空成形金型に、前記シート基材を搬送し、真空成形するものであり、前記ドラム式の真空成形金型は、搬送方向における前記収納凹部同士の間である連結部を成形する連結部金型の外径が、前記フランジ部を成形するフランジ部金型の外径よりも大きいものである。
(1) One aspect according to the present invention is a carrier tape in which a storage recess for storing components and a flange portion having a feed hole are formed, and a connecting portion being between the storage recesses in the transport direction The surface which is the surface on the opening side of the housing recess is formed flat at the same height as the surface of the flange portion, and the back surface opposite to the surface of the connecting portion is the back surface of the flange portion Are located at different heights.
(2) In the aspect of (1), when the surface of the flange portion is used as a reference, the back surface of the connecting portion may be located at a distance shorter than the distance to the back surface of the flange portion.
(3) In the aspect of the above (1) or (2), the recess amount of the connection portion, which is the difference in height between the back surface of the flange portion and the back surface of the connection portion, satisfies the following (formula 1) May be
(Expression 1) H = T / 2−α · D However, assuming that the amount of depression of the connection portion is H, the thickness of the flange portion is T, the distance between the storage depressions is D, and each dimension unit is mm, α is 0.02 It is ≦ α ≦ 0.04. (4) In one aspect of the above (1) to (3), the carrier tape may be molded by a drum type vacuum molding die.
(5) Another aspect according to the present invention is a method of forming a carrier tape in which a carrier tape in which a housing recess for housing components and a flange portion having a feed hole are formed from a sheet base material is provided. The sheet base material is conveyed to a drum-type vacuum forming mold having a concave for forming the storage recess on the surface, and the sheet is vacuum-formed. The outer diameter of the connection part mold which forms the connection part which is between accommodation recessed parts is larger than the outer diameter of the flange part metal mold which forms the said flange part.
本発明によれば、部品を収納凹部に確実に収納できるキャリアテープ及びキャリアテープの製造方法を提供することができる。 According to the present invention, it is possible to provide a carrier tape and a method of manufacturing the carrier tape that can reliably store components in the storage recess.
以下、本発明の実施形態について、図面を参照して詳細に説明する。なお、本明細書の実施形態、従来例、実施例及び比較例においては、全体を通じて、同一の部材には同一の符号を付している。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiment, the conventional example, the example, and the comparative example of the present specification, the same components are denoted by the same reference numerals throughout.
まず、本発明に係る実施形態のキャリアテープ１の成形方法を説明する前に、キャリアテープ１について説明する。図１は、実施形態のキャリアテープ１を示す斜視図である。図２は、実施形態のキャリアテープ１を示す、（ａ）平面図、（ｂ）（ａ）におけるＥ−Ｅ矢視の正面断面図、（ｃ）（ａ）におけるＦ−Ｆ矢視の側面断面図である。図３は、実施形態のキャリアテープ１を示す正面断面図の拡大図である。 First, the carrier tape 1 will be described before describing the method for molding the carrier tape 1 according to the embodiment of the present invention. FIG. 1 is a perspective view showing the carrier tape 1 of the embodiment. Fig. 2 shows the carrier tape 1 of the embodiment, (a) a plan view, (b) a front sectional view taken along the line E-E in (a), (c) a side face along the F-F direction in (a) FIG. FIG. 3: is an enlarged view of front sectional drawing which shows the carrier tape 1 of embodiment.
図１に示されるキャリアテープ１は、部品Ｐを複数収納して、保管したり、搬送したり、基板に部品Ｐを実装する実装機に部品Ｐを円滑に供給したりするものである。例えば、部品Ｐとして、電子部品や精密部品などが挙げられる。キャリアテープ１には、テープの長手方向（搬送方向ＭＤ）に沿って、送り孔２と部品Ｐを収納する収納凹部３とが、それぞれ所定の間隔で複数形成されている。 The carrier tape 1 shown in FIG. 1 accommodates a plurality of parts P, stores them, transports them, and supplies the parts P smoothly to a mounting machine that mounts the parts P on a substrate. For example, as the component P, an electronic component, a precision component, etc. may be mentioned. In the carrier tape 1, a plurality of feed holes 2 and a plurality of storage recesses 3 for storing components P are formed at predetermined intervals along the longitudinal direction (conveyance direction MD) of the tape.
送り孔２は、長手方向に沿って形成されたフランジ部４に穿設されている。なお、本実施形態では、送り孔２は、平面視において円形状であるが、送り孔２の形状や間隔は、実装機などの送り機構に合わせて穿設されるとよい。また、送り孔２は、テープの長手方向の二辺に沿って、収納凹部３の両側に穿設されることもある。 The feed hole 2 is bored in a flange portion 4 formed along the longitudinal direction. In the present embodiment, the feed holes 2 are circular in plan view, but the shapes and intervals of the feed holes 2 may be drilled in accordance with a feed mechanism such as a mounting machine. Also, the feed holes 2 may be bored on both sides of the storage recess 3 along the two longitudinal sides of the tape.
収納凹部３は、収納する部品Ｐの寸法及び形状に合わせて形成されるが、本実施形態では、平面視で略矩形状に形成されている。なお、収納凹部３は、検査用などに用いられる底孔６が底面３００に形成されることや、更に底面３００に台座が形成されることもある。また、収納凹部３の寸法は、通常０．１ｍｍ角から１６ｍｍ角の範囲であり、キャリアテープ１のテープ幅は４ｍｍから２４ｍｍである。そして、搬送方向ＭＤにおける収納凹部３同士の間は、連結部５となっている。 Although the accommodation recessed part 3 is formed according to the dimension and shape of the components P to accommodate, it is formed in substantially rectangular shape by planar view in this embodiment. In the storage recess 3, a bottom hole 6 used for inspection or the like may be formed in the bottom surface 300, and a pedestal may be further formed in the bottom surface 300. The dimensions of the storage recess 3 are usually in the range of 0.1 mm square to 16 mm square, and the tape width of the carrier tape 1 is 4 mm to 24 mm. And between the accommodation recessed parts 3 comrades in conveyance direction MD, it is the connection part 5. As shown in FIG.
連結部５は、開口３１側の面である表面５００が、フランジ部４の表面４００と同じ又は同等の高さでフラットに形成され、かつ、連結部５の表面５００とは反対の裏面５０１が、フランジ部４の裏面４０１とは異なる高さに位置している。つまり、連結部５の厚みｔが、フランジ部４の厚みＴと異なっている（図３参照）。 The connecting portion 5 has a surface 500 which is a surface on the side of the opening 31 formed flat at the same or equivalent height as the surface 400 of the flange portion 4 and a back surface 501 opposite to the surface 500 of the connecting portion 5 , And a height different from the back surface 401 of the flange 4. That is, the thickness t of the connecting portion 5 is different from the thickness T of the flange portion 4 (see FIG. 3).
より詳細には、連結部５の裏面５０１が、フランジ部４の裏面４０１よりも収納凹部３の底面３００からの高さが高い位置にあるか、フランジ部４の表面４００を基準にしたとき、連結部５の裏面５０１までの距離が、フランジ部４の裏面４０１までの距離よりも短い距離に位置している。つまり、連結部５の厚みｔが、フランジ部４の厚みＴよりも薄くなっている。 More specifically, when the back surface 501 of the connection portion 5 is at a position where the height from the bottom surface 300 of the storage recess 3 is higher than the back surface 401 of the flange portion 4 or based on the surface 400 of the flange portion 4 The distance to the back surface 501 of the connecting portion 5 is located at a distance shorter than the distance to the back surface 401 of the flange portion 4. That is, the thickness t of the connection portion 5 is thinner than the thickness T of the flange portion 4.
そして、このキャリアテープ１は、熱可塑性樹脂を材料として形成されている。熱可塑性樹脂としては、例えば、ポリカーボネート、ポリスチレン、ポリ塩化ビニル、アモルファスポリエチレンテレフタレート、ポリプロピレンなどの合成樹脂、これらの樹脂にカーボンを練り込んで導電性を付与したもの、表面に導電コーティングを施したものなどが挙げられる。 The carrier tape 1 is formed of a thermoplastic resin as a material. As a thermoplastic resin, for example, synthetic resins such as polycarbonate, polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, polypropylene, etc., carbon impregnated into these resins to impart conductivity, those having a conductive coating on the surface Etc.
ところで、このキャリアテープ１は、後述するキャリアテープ１の成形装置１００で形成されるが、成形時は、例えば４列、８列などの複数列のキャリアテープ１として形成されており、その後、スリット刃などの切断手段により、１列ごとのキャリアテープ１として切断・分離され、製造されるものである。なお、複数列のキャリアテープ１の列間や両端部に、送り孔２などを形成する際に用いられる位置決め用凹部が設けられることもある。 By the way, this carrier tape 1 is formed by a molding device 100 of the carrier tape 1 described later, but at the time of molding, it is formed as a plurality of carrier tape 1 rows, for example, 4 rows and 8 rows. It is cut and separated as carrier tape 1 for each row by a cutting means such as a blade and manufactured. In addition, the positioning recessed part used when forming feed hole 2 grade | etc., May be provided in between the row | line | columns of the carrier tape 1 of multiple rows | lines, or both ends.
つぎに、キャリアテープ１の成形装置１００及び成形方法について説明する。図４は、キャリアテープ１の成形装置１００を示す概略図である。図５は、キャリアテープ１の成形方法を示すフローチャートである。 Below, the shaping | molding apparatus 100 of the carrier tape 1 and the shaping | molding method are demonstrated. FIG. 4 is a schematic view showing a molding apparatus 100 for the carrier tape 1. FIG. 5 is a flowchart showing a method of molding the carrier tape 1.
図４に示されるキャリアテープ１の成形装置１００は、加熱ロール１１と、ドラム式の真空成形金型１２と、アキューム部１３と、プレス金型１４と、搬送手段１５と、を少なくとも備えている。 The forming apparatus 100 of the carrier tape 1 shown in FIG. 4 includes at least a heating roll 11, a drum-type vacuum forming mold 12, an accumulator portion 13, a press mold 14, and a conveying means 15. .
加熱ロール１１は、図示しない供給手段から供給されたシート基材１０を、搬送方向ＭＤ下流に設けられたドラム式の真空成形金型１２に、回転により搬送しながら、加熱軟化させるものであり、シート基材１０を加熱できるように構成されている。シート基材１０を加熱ロール１１で加熱することにより、シート基材１０の巻き癖や波状のうねりをある程度矯正することができる。 The heating roll 11 heats and softens the sheet base material 10 supplied from a supply means (not shown) while rotating and conveying it to a drum type vacuum forming mold 12 provided downstream in the conveying direction MD, The sheet substrate 10 is configured to be able to be heated. By heating the sheet substrate 10 with the heating roll 11, it is possible to correct the curl and the undulation of the sheet substrate 10 to some extent.
ドラム式の真空成形金型１２は、成形する収納凹部３に対応する凹型（キャビティ）１２０を外周表面に複数有しており、搬送されたシート基材１０を回転により搬送しながら、シート基材１０に収納凹部３を真空形成するものであるが、ドラム式の真空成形金型１２の構造については、後で詳細に説明する。なお、各キャビティ１２０は、真空発生機などに接続されている。また、ドラム式の真空成形金型１２は、例えば、水などの冷温調媒体により、一定の温度に維持されている The drum-type vacuum forming mold 12 has a plurality of concaves (cavities) 120 corresponding to the housing recess 3 to be formed on the outer peripheral surface, and the sheet base 10 is conveyed by rotation while being conveyed The storage recess 3 is vacuum formed in 10, but the structure of the drum-type vacuum forming mold 12 will be described in detail later. Each cavity 120 is connected to a vacuum generator or the like. In addition, the drum-type vacuum forming mold 12 is maintained at a constant temperature, for example, by a cold-conditioning medium such as water.
アキューム部１３は、収納凹部３が形成されたシート基材１０Ａを、滞留させて一度冷却し、真空成形時の熱応力を除去するものである。 The accumulation part 13 makes the sheet base material 10A in which the accommodation recessed part 3 was formed stay, and once cools, and removes the thermal stress at the time of vacuum forming.
プレス金型１４は、シート基材１０Ａに送り孔２を打抜くものであり、さらに、収納凹部３の底面３００に底孔６も打抜く。 The press die 14 punches the feed hole 2 in the sheet base material 10A, and further punches the bottom hole 6 on the bottom surface 300 of the storage recess 3.
搬送手段１５は、シート基材１０Ａをアキューム部１３からプレス金型１４に間欠的に搬送するものである。 The conveying means 15 intermittently conveys the sheet base 10A from the accumulation portion 13 to the press die 14.
そして、成形装置１００は、上記の各種手段のほか、複数列に成形したキャリアテープ１を１列のキャリアテープ１に切断・分離する切断手段や、各キャリアテープ１の収納凹部３に部品Ｐを収納した後、カバーテープでテーピングするテーピング機や、リールに巻取る巻取手段などを備えている。 In addition to the various means described above, the forming apparatus 100 further includes a cutting means for cutting and separating the carrier tape 1 formed in a plurality of lines into the carrier tape 1 in one line, and the component P in the storage recess 3 of each carrier tape 1 After being stored, it is equipped with a taping machine which taps with a cover tape, a winding means for winding on a reel, and the like.
つづいて、キャリアテープ１の成形方法について説明すると、この成形方法は、シート基材１０をドラム式の真空成形金型１２に搬送する搬送工程Ｓ１と、ドラム式の真空成形金型１２の表面に搬送されたシート基材１０を吸引して、真空成形する成形工程Ｓ２と、収納凹部３の側方に送り孔２を打ち抜く送り孔打抜工程Ｓ３と、を少なくとも含んでおり、更に追加的に収納凹部３の底面３００に底孔を打ち抜く底孔打抜工程Ｓ４も含んでいる（図５参照）。 Subsequently, the method of molding the carrier tape 1 will be described. This molding method includes a conveying step S1 of conveying the sheet base material 10 to the drum type vacuum forming mold 12 and a surface of the drum type vacuum forming mold 12 The process further includes at least a forming step S2 for suctioning and vacuum forming the conveyed sheet base material 10 and a feed hole punching step S3 for punching out the feed hole 2 on the side of the storage recess 3 A bottom hole punching step S4 for punching out the bottom hole on the bottom surface 300 of the storage recess 3 is also included (see FIG. 5).
搬送工程Ｓ１では、シート基材１０を一定の搬送速度でドラム式の真空成形金型１２に搬送する。なお、搬送工程Ｓ１の前工程で、シート基材１０を加熱ロール１１で加熱を行ってもよい。 In the conveyance step S1, the sheet base material 10 is conveyed to the drum-type vacuum forming mold 12 at a constant conveyance speed. In addition, you may heat the sheet | seat base material 10 by the heating roll 11 in the pre-process of conveyance process S1.
次の成形工程Ｓ２では、シート基材１０をドラム式の真空成形金型１２の外周表面に真空吸着して真空成形を行う。その後、収納凹部３が形成されたシート基材１０Ａは、アキューム部１３で冷却される。さらに、その後、シート基材１０Ａは、搬送手段１５の間欠的な搬送により、プレス金型１４に送られる。 In the next forming step S2, the sheet base material 10 is vacuum-adsorbed to the outer peripheral surface of the drum-type vacuum forming mold 12 to perform vacuum forming. Thereafter, the sheet base 10 </ b> A in which the storage recess 3 is formed is cooled by the accumulation portion 13. Further, after that, the sheet substrate 10A is sent to the press die 14 by the intermittent conveyance of the conveyance means 15.
送り孔打抜工程Ｓ３では、シート基材１０Ａの収納凹部３を位置決め手段（図示なし）により位置決めしながら、プレス金型１４で送り孔２を打ち抜く。 In the feed hole punching step S3, the feed hole 2 is punched out by the press die 14 while the storage concave portion 3 of the sheet base material 10A is positioned by the positioning means (not shown).
底孔打抜工程Ｓ４でも、シート基材１０Ａの収納凹部３を位置決め手段により、プレス金型１４で底孔を打ち抜く。なお、送り孔打抜工程Ｓ３と底孔打抜工程Ｓ４とを、同時に行ってもよい。 Also in the bottom hole punching step S4, the bottom hole is punched out by the press die 14 by the positioning means of the storage concave portion 3 of the sheet base material 10A. The feed hole punching step S3 and the bottom hole punching step S4 may be performed simultaneously.
そして、送り孔２及び底孔６が形成されたキャリアテープ１は、切断手段で切断分離される。このようにして、単列のキャリアテープ１が成形される。 And carrier tape 1 in which feed hole 2 and bottom hole 6 were formed is cut and separated by cutting means. In this way, a single row carrier tape 1 is formed.
ここで、ドラム式の真空成形金型１２及び成形工程Ｓ２について詳細に説明する。図６は、（ａ）実施形態のドラム式の真空成形金型１２を示す概略斜視図、（ｂ）従来のドラム式の真空成形金型１２Ａを示す概略斜視図である。 Here, the drum-type vacuum forming mold 12 and the forming step S2 will be described in detail. FIG. 6 is (a) a schematic perspective view showing a drum type vacuum forming mold 12 according to the embodiment, and (b) a schematic perspective view showing a conventional drum type vacuum forming mold 12A.
ドラム式の真空成形金型１２は、図６（ａ）に示すように、キャリアテープ１の収納凹部３を成形するキャビティ１２０を表面に有するものであり、成形する収納凹部３の寸法・形状（長さＡ０、幅Ｂ０、高さＫ０）、収納凹部３同士の間隔Ｄ及びシート基材１０Ａの厚み、すなわちフランジ部４の厚みＴなど（図２及び図３参照）に応じたキャビティ１２０を外周表面に複数有している。 As shown in FIG. 6A, the drum type vacuum molding die 12 has a cavity 120 for molding the housing recess 3 of the carrier tape 1 on the surface, and the size and shape of the housing recess 3 to be molded ( Length A0, width B0, height K0), distance D between the storage recesses 3 and the thickness of the sheet base 10A, ie, the thickness T of the flange portion 4 (see FIGS. 2 and 3), etc. There are multiple on the surface.
そして、搬送方向ＭＤにおける収納凹部３同士の間である連結部５を成形する連結部金型１２１の外径は、フランジ部４を成形するフランジ部金型１２２の外径よりも大きくなっている。つまり、連結部金型１２１の外径は、図２及び図３に示すように、成形時に連結部５の収納凹部３の開口３１側の面である表面５００が、フランジ部４の表面４００と同じ又は同等の高さでフラットに形成されるように、フランジ部金型１２２の外径に対して調整されている。 And the outer diameter of the connection part mold 121 which forms the connection part 5 which is between the accommodation recessed parts 3 in conveyance direction MD is larger than the outer diameter of the flange part mold 122 which forms the flange part 4 . That is, as shown in FIGS. 2 and 3, the outer diameter of the connecting part mold 121 is the surface 500 that is the surface on the opening 31 side of the storage recess 3 of the connecting part 5 at the time of molding It is adjusted with respect to the outer diameter of the flange part mold 122 so that it may be formed flat at the same or equivalent height.
更に言い換えると、連結部金型１２１の外径は、収納凹部３を成形する際に、連結部５が引き伸ばされて、連結部５がフランジ部４から落ち込む量を補って持ち上げるように、フランジ部金型１２２の外径に対して大きく調整されている。このように、連結部金型１２１の外径は、落ち込み量（段落ち量）を予測して、それを補うように決定している。 In other words, the outer diameter of the connection part mold 121 is a flange part so that the connection part 5 is stretched when the storage recess 3 is formed, and the connection part 5 is lifted to compensate for the amount of depression from the flange part 4 A large adjustment is made to the outer diameter of the mold 122. As described above, the outer diameter of the connecting part mold 121 is determined so as to compensate for the amount of depression (the amount of step-down).
具体的には、フランジ部４の裏面４０１と、連結部５の裏面５０１との高さの差である連結部５の凹み量Ｈが、以下の（式１）の範囲を満たすのが好ましい。
（式１） 連結部５の凹み量Ｈ＝フランジ部４の厚みＴ／２−α・収納凹部３の間隔Ｄ
ただし、０．０２≦α≦０．０４である。
Specifically, it is preferable that the recess amount H of the connecting portion 5 which is the difference in height between the back surface 401 of the flange portion 4 and the back surface 501 of the connecting portion 5 satisfy the range of (Expression 1) below.
(Formula 1) Depression amount H of the connection portion 5 = Thickness T of the flange portion 4 T / 2−α · Space D of the storage recess 3
However, 0.02 ≦ α ≦ 0.04.
また、連結部金型１２１の外径は、シート基材１０の材質、厚み、成形する収納凹部３の大きさによって異なるが、シート基材１０の厚みＴより小さい範囲で、フランジ部金型１２２の外径よりも大きく設定するのが好ましい。例えば、シート基材１０の厚みが０．２５ｍｍの場合、連結部金型１２１の外径を、フランジ部金型１２２の外径よりも、例えば、４８μｍ〜１０８μｍ程度大きくする。なお、本実施形態では、連結部金型１２１の外径とフランジ部金型１２２の外径との差を、１００μｍとしている。 The outer diameter of the connecting part mold 121 is different depending on the material and thickness of the sheet base 10 and the size of the storage recess 3 to be formed, but the flange part mold 122 is smaller than the thickness T of the sheet base 10. It is preferable to set it larger than the outer diameter of. For example, when the thickness of the sheet base material 10 is 0.25 mm, the outer diameter of the connection part mold 121 is larger than the outer diameter of the flange part mold 122 by, for example, about 48 μm to 108 μm. In the present embodiment, the difference between the outer diameter of the connection portion mold 121 and the outer diameter of the flange portion mold 122 is 100 μm.
シート基材１０に収納凹部３を成形する際、収納凹部３同士の間隔Ｄが狭いと、連結部５が収納凹部３側（底面３００側）に引っ張り込まれ、段落ち形状になることがあるが、本実施形態では、連結部金型１２１の外径がフランジ部金型１２２の外径に対して大きいため、連結部５が収納凹部３側（底面３００側）に引っ張り込まれることはなく、単に引き伸ばされるため、連結部５の厚みｔが薄くなる。なお、収納凹部３の高さＫ０が深くなると、引き伸ばされる量も多くなる。このようにして、連結部５の厚みｔと、フランジ部４の厚みＴとの差である凹み量Ｈが発生する。 When forming the storage recess 3 in the sheet substrate 10, if the space D between the storage recesses 3 is narrow, the connecting portion 5 may be pulled to the storage recess 3 side (the bottom surface 300 side) to form a stepped shape However, in the present embodiment, since the outer diameter of the connection portion mold 121 is larger than the outer diameter of the flange portion mold 122, the connection portion 5 is not pulled to the storage recess 3 side (bottom surface 300 side). Since it is simply stretched, the thickness t of the connecting portion 5 becomes thinner. When the height K0 of the storage recess 3 becomes deeper, the amount of stretching also increases. In this manner, a dent amount H which is the difference between the thickness t of the connecting portion 5 and the thickness T of the flange portion 4 is generated.
（従来例）
ここで、比較のため、従来のドラム式の真空成形金型１２Ａ及びこのドラム式の真空成形金型１２Ａで成形されたキャリアテープ１Ａについて説明する。図７は、従来のドラム式の真空成形金型１２Ａを用いて成形したキャリアテープ１Ａを示す、（ａ）平面図、（ｂ）（ａ）におけるＥ−Ｅ矢視の正面断面図、（ｃ）（ａ）におけるＦ−Ｆ矢視の側面断面図である。
(Conventional example)
Here, for comparison, a conventional drum-type vacuum molding die 12A and a carrier tape 1A molded with the drum-type vacuum molding die 12A will be described. FIG. 7 shows a carrier tape 1A molded using a conventional drum-type vacuum forming mold 12A, (a) a plan view, (b) a front sectional view taken along the line E-E in (a), (c It is side surface sectional drawing of the FF arrow in (a).
従来の真空成形金型１２Ａでは、図６（ｂ）に示すように、搬送方向ＭＤにおける収納凹部３同士の間である連結部５を成形する連結部金型１２１Ａの外径が、フランジ部４を成形するフランジ部金型１２２の外径と同じになっている。 In the conventional vacuum forming mold 12A, as shown in FIG. 6B, the outer diameter of the connecting part mold 121A for forming the connecting part 5 which is between the storage concave parts 3 in the transport direction MD is the flange 4 Is the same as the outer diameter of the flange part mold 122 for forming
また、従来のドラム式の真空成形金型１２Ａを用いて成形されたキャリアテープ１Ａでは、連結部５Ａの表面５００Ａが、フランジ部４の表面４００に対して段落ちしたキャリアテープ１Ａとなる（図７（ｃ）参照）。そのため、連結部５Ａの表面５００Ａが湾曲した形状になり易い。さらに、収納凹部３の高さＫ０が高い（深い）と、連結部５Ａが引き伸ばされる量が増え、連結部５Ａは更に段落ちするようになる。これらは、ドラム式の真空成形金型１２Ａを用いた真空成形時に、特に顕著に現れる。 Further, in the carrier tape 1A molded using the conventional drum-type vacuum forming mold 12A, the surface 500A of the connecting portion 5A becomes the carrier tape 1A stepped off with respect to the surface 400 of the flange portion 4 (see FIG. 7 (c)). Therefore, the surface 500A of the connecting portion 5A is likely to be curved. Furthermore, when the height K0 of the housing recess 3 is high (deep), the amount by which the connecting portion 5A is stretched is increased, and the connecting portion 5A is further stepped down. These are particularly noticeable when vacuum forming using a drum-type vacuum forming mold 12A.
（実施例）
以下、本発明に係る実施形態のキャリアテープ１及びキャリアテープ１の成形方法による効果を、実施例、比較例を挙げてより詳細に説明する。図８は、（ａ）実施形態のキャリアテープ１の収納凹部３に部品Ｐを収納する様子を示す概略図、（ｂ）従来のキャリアテープ１Ａの収納凹部３Ａに部品Ｐを収納する様子を示す概略図である。
(Example)
Hereinafter, the effect by the shaping | molding method of the carrier tape 1 of embodiment which concerns on this invention, and the carrier tape 1 is demonstrated in more detail, giving an Example and a comparative example. FIG. 8 is (a) a schematic view showing how a component P is stored in the storage recess 3 of the carrier tape 1 according to the embodiment, and (b) shows how the component P is stored in the storage recess 3A of the conventional carrier tape 1A. FIG.
ドラム式の真空成形金型１２には、フランジ部金型１２２の外径が１００ｍｍのものに、幅が８ｍｍ、厚みＴが０．２５ｍｍのシート基材１０を搬送して、真空成形を行い、実施例１〜３及び比較例のキャリアテープを成形した。なお、収納凹部３の設計寸法である、長さＡ０、高さＫ０、間隔Ｄは、表１の実施例１〜３及び比較例のとおりであり、ピッチは４ｍｍ、幅Ｂ０は、長さＡ０と同じとした。 In the vacuum mold 12 of the drum type, the sheet substrate 10 having a width of 8 mm and a thickness T of 0.25 mm is conveyed to vacuum mold in which the outer diameter of the flange part mold 122 is 100 mm. The carrier tapes of Examples 1 to 3 and Comparative Example were molded. The length A0, the height K0, and the interval D, which are design dimensions of the storage recess 3, are as in the examples 1 to 3 and the comparative example of Table 1, the pitch is 4 mm, the width B0 is a length A0. Same as
その後、キャリアテープ１の収納凹部３に部品Ｐを挿入する部品挿入テストを行った。 この部品挿入テストの結果を表１に示す。「○」は、良好に挿入できた状態、「×」は、挿入できなかった状態であり、凹み量Ｈは、連結部５の厚みｔとフランジ部４と厚みＴの差から求めた。 Thereafter, a component insertion test was performed in which the component P was inserted into the storage recess 3 of the carrier tape 1. The results of this part insertion test are shown in Table 1. "○" is a state in which the insertion was successful, "×" is a state in which the insertion was not possible, and the amount of depression H was obtained from the difference between the thickness t of the connecting portion 5 and the thickness T of the flange portion 4.
実施例１〜３と比較例とを比較すると、連結部５の凹み量Ｈが大き過ぎると、部品Ｐの挿入結果が悪くなることがわかる。 When Examples 1-3 and a comparative example are compared, it turns out that the insertion result of parts P will get worse, when the amount H of dents of connecting part 5 is too large.
上述の（式１）において、フランジ部４の厚みＴを、シート基材１０の厚みと同じ０．２５ｍｍとし、間隔Ｄを０．５ｍｍとすると、０．１０５≦Ｈ≦０．１１５となるが、比較例における実際の連結部５の凹み量Ｈは、０．１３１ｍｍであるから、（式１）を満たさない。 Assuming that the thickness T of the flange portion 4 is 0.25 mm, which is the same as the thickness of the sheet substrate 10, and the distance D is 0.5 mm in the above-described (Expression 1), 0.105 ≦ H ≦ 0.115. Since the actual depression amount H of the connection portion 5 in the comparative example is 0.131 mm, the expression (1) is not satisfied.
一方、上述の（式１）において、フランジ部４の厚みＴを、シート基材１０の厚みと同じ０．２５ｍｍとし、間隔Ｄを０．８ｍｍとすると、（式１）は０．０９３≦Ｈ≦０．１０９となり、実施例１における実際の連結部５の凹み量Ｈは、０．１０８ｍｍであるから、（式１）を満たし、以下同様に、実施例２の場合の（式１）は０．０２５≦Ｈ≦０．０７５、実施例３の場合の（式１）は０．０４１≦Ｈ≦０．０８３となるから、実施例１〜３のいずれの場合でも、（式１）を満たしている。 On the other hand, in the above (formula 1), assuming that the thickness T of the flange portion 4 is 0.25 mm, which is the same as the thickness of the sheet substrate 10, and the distance D is 0.8 mm, (formula 1) is 0.093 ≦ H. Since it becomes ≦ 0.109 and the actual dent amount H of the connection portion 5 in the embodiment 1 is 0.108 mm, the equation 1 is satisfied, and similarly, the equation 1 in the case of the embodiment 2 is Since 0.025 ≦ H ≦ 0.075 and (Equation 1) in the case of Example 3 becomes 0.041 ≦ H ≦ 0.083, (Equation 1) can be obtained in any case of Examples 1 to 3. I meet.
このように、（式１）を満たす連結部５の凹み量Ｈであれば、部品Ｐの収納凹部３への挿入結果に問題はないことが確認できた。 As described above, it can be confirmed that the insertion result of the component P into the storage recess 3 has no problem as long as the recess amount H of the connecting portion 5 satisfying (Expression 1).
そして、部品Ｐをテーピング機でキャリアテープ１の収納凹部３に収納する場合、実施形態のドラム式の真空成形金型１２を用いて成形したキャリアテープ１では、図８（ａ）に示すように、部品Ｐは収納凹部３の内壁に沿って矢印方向に向かい、所定の位置に収納される。また、連結部５の表面５００が、フランジ部４の表面４００と同じ高さでフラットに形成されているため、図示しないカバーテープでキャリアテープ１を収納凹部３の周囲をシールした場合、カバーテープと連結部５の表面５００が密着し、両者に隙間が生じることがなかった。そのため、カバーテープを剥離することなく、収納凹部３を開口させる場合でも、カバーテープをカットすることができる。 When the component P is stored in the storage recess 3 of the carrier tape 1 by a taping machine, as shown in FIG. 8A, the carrier tape 1 is molded using the drum vacuum molding die 12 of the embodiment. The component P is directed in the arrow direction along the inner wall of the housing recess 3 and stored at a predetermined position. In addition, since the surface 500 of the connection portion 5 is formed flat at the same height as the surface 400 of the flange portion 4, when the carrier tape 1 is sealed around the recess 3 with a cover tape not shown, the cover tape And the surface 500 of the connection part 5 closely_contact | adhered, and the clearance gap did not arise in both. Therefore, the cover tape can be cut even when the storage recess 3 is opened without peeling the cover tape.
一方、従来のドラム式の真空成形金型１２Ａを用いて成形したキャリアテープ１Ａでは、図８（ｂ）に示すように、部品Ｐをテーピング機で収納凹部３に収納する際に、部品Ｐが連結部５Ａの上面に当たることで、傾きながら斜めに挿入されて、収納されたり、収納凹部３から矢印方向に飛び出したり（乗り上げたり）して、テーピング機に挿入エラーが起こり、機械停止が発生することがあった。 On the other hand, in the carrier tape 1A molded using the conventional drum-type vacuum forming mold 12A, as shown in FIG. 8 (b), when the component P is stored in the storage recess 3 by the taping machine, the component P is By hitting the upper surface of the connection part 5A, it is inserted obliquely while being inclined and stored, or jumps out from the recess 3 in the direction of the arrow (runs up), an insertion error occurs in the taping machine, and a machine stop occurs. There was a thing.
以上説明したとおり、本発明の実施形態のキャリアテープ１は、部品Ｐを収納する収納凹部３と、送り孔２を有するフランジ部４とが形成されたキャリアテープ１であって、搬送方向ＭＤにおける収納凹部３同士の間である連結部５は、収納凹部３の開口３１側の面である表面５００が、フランジ部４の表面４００と同じ高さでフラットに形成され、かつ、連結部５の表面５００とは反対の裏面５０１が、フランジ部４の裏面４０１とは異なる高さに位置するものである。さらに、実施形態では、フランジ部４の表面４００を基準にしたとき、連結部５の裏面５０１は、フランジ部４の裏面４０１までの距離より短い距離に位置するか、連結部５の厚みｔが、フランジ部４の厚みＴよりも薄い。これにより、キャリアテープ１の収納凹部３に部品Ｐを収納する際、部品Ｐが連結部５の側面に当たるため、収納凹部３に部品Ｐを確実に収納することができる。また、キャリアテープ１の収納凹部３の周囲をカバーテープでシールする場合でも、カバーテープと連結部５の表面５００が密着し易いため、良好にシールすることができる。 As described above, the carrier tape 1 according to the embodiment of the present invention is the carrier tape 1 in which the housing concave portion 3 for housing the component P and the flange portion 4 having the feed hole 2 are formed. The connection portion 5 between the storage concave portions 3 has a surface 500 which is a surface on the opening 31 side of the storage concave portion 3 formed flat at the same height as the surface 400 of the flange portion 4. The back surface 501 opposite to the front surface 500 is located at a height different from the back surface 401 of the flange 4. Furthermore, in the embodiment, when the surface 400 of the flange portion 4 is used as a reference, the back surface 501 of the connecting portion 5 is located at a distance shorter than the distance to the back surface 401 of the flange portion 4 or the thickness t of the connecting portion 5 is , Thinner than the thickness T of the flange portion 4. As a result, when the component P is stored in the storage recess 3 of the carrier tape 1, the component P contacts the side surface of the connecting portion 5, so that the component P can be reliably stored in the storage recess 3. Further, even when the periphery of the storage recess 3 of the carrier tape 1 is sealed with a cover tape, since the cover tape and the surface 500 of the connecting portion 5 easily adhere to each other, the sealing can be excellent.
実施形態では、フランジ部４の裏面４０１と連結部５の裏面５０１との高さの差である連結部５の凹み量Ｈが、上述した（式１）を満たす。（式１）を満たすように、収納凹部３の各寸法を設定することで、収納凹部３に部品Ｐを確実に収納することができるキャリアテープ１を設計することができる。 In the embodiment, the recess amount H of the connecting portion 5 which is the difference between the heights of the back surface 401 of the flange portion 4 and the back surface 501 of the connecting portion 5 satisfies the above-described (Expression 1). By setting the dimensions of the storage recess 3 so as to satisfy (Expression 1), it is possible to design the carrier tape 1 capable of reliably storing the component P in the storage recess 3.
実施形態では、キャリアテープ１は、ドラム式の真空成形金型１２で成形されている。ドラム式の真空成形金型１２を用いることにより、フランジ部４の表面４００を基準にしたとき、連結部５の裏面５０１は、フランジ部４の裏面４０１までの距離より短い距離に位置するか、連結部５の厚みｔが、フランジ部４の厚みＴよりも薄いキャリアテープ１を容易に成形することができる。 In the embodiment, the carrier tape 1 is formed by a drum-type vacuum forming mold 12. When the surface 400 of the flange portion 4 is used as a reference by using the drum-type vacuum forming mold 12, the back surface 501 of the connecting portion 5 may be located at a distance shorter than the distance to the back surface 401 of the flange portion 4 The carrier tape 1 in which the thickness t of the connecting portion 5 is thinner than the thickness T of the flange portion 4 can be easily formed.
また、本発明に係る実施形態のキャリアテープ１の成形方法は、部品Ｐを収納する収納凹部３と、送り孔２を有するフランジ部４とが形成されたキャリアテープ１をシート基材１０から成形するキャリアテープ１の成形方法であって、表面に収納凹部３を成形する凹型１２０を有するドラム式の真空成形金型１２に、シート基材１０を搬送し、真空成形するものであり、ドラム式の真空成形金型１２は、搬送方向ＭＤにおける収納凹部３同士の間である連結部５を成形する連結部金型１２１の外径が、フランジ部４を成形するフランジ部金型１２２の外径よりも大きいものである。これにより、収納凹部３の開口３１側の面である連結部５の表面５００が、フランジ部４の表面４００と同じ高さでフラットに形成され、かつ、連結部５の裏面５０１が、フランジ部４の表面４００を基準にしたとき、フランジ部４の裏面４０１までの距離より短い距離に位置するか、連結部５の厚みｔが、フランジ部４の厚みＴよりも薄いキャリアテープ１を成形することができる。そのため、部品Ｐを収納凹部３に確実に収納できるキャリアテープ１を成形することができる。 Further, in the method of molding the carrier tape 1 according to the embodiment of the present invention, the carrier tape 1 in which the housing recess 3 for housing the component P and the flange portion 4 having the feed hole 2 are formed is molded from the sheet substrate 10 Method of forming the carrier tape 1 by conveying the sheet substrate 10 to a drum type vacuum forming mold 12 having a concave 120 for forming the storage recess 3 on the surface, and vacuum forming the drum base type; In the vacuum forming mold 12 of the present invention, the outer diameter of the connecting portion mold 121 for forming the connecting portion 5 which is between the storage concave portions 3 in the transport direction MD is the outer diameter of the flange portion mold 122 for forming the flange portion 4 It is bigger than. Thereby, the surface 500 of the connection portion 5 which is the surface on the opening 31 side of the housing recess 3 is formed flat at the same height as the surface 400 of the flange portion 4 and the back surface 501 of the connection portion 5 is the flange portion The carrier tape 1 is formed at a distance shorter than the distance to the back surface 401 of the flange 4 based on the surface 400 of 4 or the thickness t of the connecting portion 5 is thinner than the thickness T of the flange 4 be able to. Therefore, the carrier tape 1 which can reliably store the component P in the storage recess 3 can be formed.
以上、本発明の好ましい実施形態について詳述したが、本発明は上述した実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形、変更が可能である。 Although the preferred embodiments of the present invention have been described above in detail, the present invention is not limited to the above-described embodiments, and various modifications may be made within the scope of the subject matter of the present invention described in the claims. Changes are possible.
（変形例）
上記実施形態では、キャリアテープ１の収納凹部３は、高さＫ０が比較的高いものであったが、高さＫ０が比較的浅いものもある。図９は、変形例のキャリアテープ１を示す正面断面図の拡大図である。
(Modification)
In the above embodiment, the storage recess 3 of the carrier tape 1 has a relatively high height K0, but may have a relatively shallow height K0. FIG. 9 is an enlarged view of a front cross-sectional view showing a carrier tape 1 of a modification.
変形例のキャリアテープ１では、収納凹部３の高さＫ０が、フランジ部４の厚みＴよりも小さくなっている。つまり、フランジ部４の表面４００を基準にしたとき、収納凹部３の底面３００までの距離は、フランジ部４の裏面４０１までの距離よりも短くなっている。また、連結部５の裏面５０１までの距離は、フランジ部４の裏面４０１までの距離よりも短く、つまり、連結部５の厚みｔが、フランジ部４の厚みＴよりも薄く、上記実施形態と同様である。 In the carrier tape 1 of the modified example, the height K 0 of the housing recess 3 is smaller than the thickness T of the flange portion 4. That is, when based on the surface 400 of the flange portion 4, the distance to the bottom surface 300 of the housing recess 3 is shorter than the distance to the back surface 401 of the flange portion 4. Further, the distance to the back surface 501 of the connecting portion 5 is shorter than the distance to the back surface 401 of the flange portion 4, that is, the thickness t of the connecting portion 5 is smaller than the thickness T of the flange portion 4 It is similar.
上記実施形態では、ドラム式の真空成形金型１２を用いて、キャリアテープ１の収納凹部３を成形したが、これに限らず、圧空成形で成形してもよい。また、あらかじめ製造されたシート基材１０をドラム式の真空成形金型１２に供給したが、プラスチック樹脂のシート押出成形で、シート基材１０を形成しながら、ドラム式の真空成形金型１２に供給するような、メルトｔｏフォームであってもよい。 In the above embodiment, the storage recess 3 of the carrier tape 1 is formed using a drum-type vacuum forming mold 12, but the invention is not limited to this, and the forming may be performed by pressure forming. In addition, although the sheet base material 10 manufactured in advance was supplied to the drum type vacuum forming mold 12, the drum type vacuum forming mold 12 is formed while the sheet base material 10 is formed by sheet extrusion of plastic resin. It may be melt to foam as supplied.
１，１Ａ キャリアテープ
２ 送り孔
３，３Ａ 収納凹部、３１，３１Ａ 開口、３００，３００Ａ 底面
４ フランジ部、４００ 表面、４０１ 裏面
５，５Ａ 連結部、５００，５００Ａ 表面、５０１，５０１Ａ 裏面
６ 底孔
１０，１０Ａ シート基材、１１ 加熱ロール、１２，１２Ａ ドラム式の真空成形金型、１３ アキューム部、１４ プレス金型、１５ 搬送装置
１００ 成形装置
１２０ キャビティ（凹型）、１２１ 連結部金型、１２１Ａ 連結部金型、１２２ フランジ部金型
ＭＤ 搬送方向
Ｐ 部品
Ｔ フランジ部の厚み、Ｄ 収納凹部同士の間隔、Ｈ 連結部の凹み量、ｔ 連結部の厚み
1, 1A Carrier tape 2 Feed hole 3, 3A Storage recess, 31, 31A opening, 300, 300A Bottom surface 4 Flange portion, 400 surface, 401 Back surface 5, 5A Connecting portion, 500, 500A Surface, 501, 501A Back surface 6 Bottom hole DESCRIPTION OF SYMBOLS 10, 10A Sheet base material, 11 heating roll, 12, 12A drum-type vacuum forming mold, 13 accumulation part, 14 press mold, 15 conveyance apparatus 100 forming apparatus 120 cavity (concave), 121 connection part mold, 121A Connection part mold, 122 Flange part mold MD Conveyance direction P Part T Thickness of flange part D Distance between storage recesses H amount of dent of connection part, thickness of connection part
Claims (5)
搬送方向における前記収納凹部同士の間である連結部は、前記収納凹部の開口側の面である表面が、前記フランジ部の表面と同じ高さでフラットに形成され、かつ、前記連結部の表面とは反対の裏面が、前記フランジ部の裏面とは異なる高さに位置する
ことを特徴とするキャリアテープ。 A carrier tape in which a storage recess for storing components and a flange portion having a feed hole are formed,
The connection portion between the storage recesses in the transport direction has a surface, which is the surface on the opening side of the storage recess, formed flat at the same height as the surface of the flange portion, and the surface of the connection portion A carrier tape characterized in that the reverse side opposite to that is located at a height different from that of the reverse side of the flange portion.
ことを特徴とする請求項１に記載のキャリアテープ。 2. The carrier tape according to claim 1, wherein the back surface of the connecting portion is located at a distance shorter than the distance to the back surface of the flange portion based on the front surface of the flange portion.
ことを特徴とする請求項１又は２に記載のキャリアテープ。
（式１） Ｈ＝Ｔ／２−α・Ｄ
ただし、連結部の凹み量をＨ、フランジ部の厚みをＴ、収納凹部の間隔をＤとし、各寸法単位をｍｍとし、αは０．０２≦α≦０．０４である。 The carrier tape according to claim 1 or 2, wherein the recess amount of the connection portion, which is the difference between the height of the back surface of the flange portion and the back surface of the connection portion, satisfies the following (formula 1). .
(Formula 1) H = T / 2−α · D
However, H is the amount of depression of the connection portion, T is the thickness of the flange portion, T is the distance between the storage depressions, D is each dimension unit, and α is 0.02 ≦ α ≦ 0.04.
ことを特徴とする請求項１から３までのいずれか１項に記載のキャリアテープ。 The carrier tape according to any one of claims 1 to 3, wherein the carrier tape is molded with a drum-type vacuum molding die.
表面に前記収納凹部を成形する凹型を有するドラム式の真空成形金型に、前記シート基材を搬送し、真空成形するものであり、
前記ドラム式の真空成形金型は、搬送方向における前記収納凹部同士の間である連結部を成形する連結部金型の外径が、前記フランジ部を成形するフランジ部金型の外径よりも大きい
ことを特徴とするキャリアテープの成形方法。 A method for forming a carrier tape, comprising forming a carrier tape having a storage recess for storing parts and a flange portion having a feed hole, from a sheet base material,
The sheet base material is conveyed to a drum-type vacuum forming mold having a concave shape for forming the storage recess on the surface, and vacuum forming is performed,
In the drum-type vacuum forming mold, an outer diameter of a connecting portion mold for forming a connecting portion between the storage concave portions in the transport direction is greater than an outer diameter of a flange portion mold for forming the flange portion. A method of forming a carrier tape characterized by having a large size.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017222985A JP2019094078A (en) | 2017-11-20 | 2017-11-20 | Carrier tape and method for molding carrier tape |
| CN201880067098.9A CN111225862A (en) | 2017-11-20 | 2018-11-19 | Carrier tape and carrier tape forming method |
| TW107141096A TW201922592A (en) | 2017-11-20 | 2018-11-19 | Carrier tape and method for forming carrier tape |
| PCT/JP2018/042656 WO2019098364A1 (en) | 2017-11-20 | 2018-11-19 | Carrier tape and method for forming carrier tape |
| KR1020207015377A KR20200087171A (en) | 2017-11-20 | 2018-11-19 | Carrier tape and forming method of carrier tape |
| PH12020550153A PH12020550153A1 (en) | 2017-11-20 | 2020-03-26 | Carrier tape and method for forming carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017222985A JP2019094078A (en) | 2017-11-20 | 2017-11-20 | Carrier tape and method for molding carrier tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2019094078A true JP2019094078A (en) | 2019-06-20 |
Family
ID=66539010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017222985A Pending JP2019094078A (en) | 2017-11-20 | 2017-11-20 | Carrier tape and method for molding carrier tape |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP2019094078A (en) |
| KR (1) | KR20200087171A (en) |
| CN (1) | CN111225862A (en) |
| PH (1) | PH12020550153A1 (en) |
| TW (1) | TW201922592A (en) |
| WO (1) | WO2019098364A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020235452A1 (en) | 2019-05-17 | 2020-11-26 | 株式会社Ｎｔｔドコモ | User terminal and wireless communication method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0551764U (en) * | 1991-12-12 | 1993-07-09 | 信越ポリマー株式会社 | Embossed carrier tape |
| JP2014221651A (en) * | 2013-05-13 | 2014-11-27 | 信越ポリマー株式会社 | Embossed carrier tape |
| KR101552789B1 (en) * | 2014-03-05 | 2015-09-11 | 대일티앤씨 주식회사 | A carrier tape for preventing free move of asymmetry typed electronic device and packing using the same |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH051764U (en) * | 1991-06-27 | 1993-01-14 | 日立電線株式会社 | Wire material winding bobbin take-out device |
| JPH0672408A (en) * | 1992-08-26 | 1994-03-15 | Matsushita Electric Ind Co Ltd | Positioning method of taping of tab electronic parts and positioning member of taping of tab electronic parts |
| TW577852B (en) * | 2001-01-22 | 2004-03-01 | John D Pylant | Apparatus and methods for improving uniform cover tape adhesion on a carrier tape |
| US20060157381A1 (en) * | 2005-01-20 | 2006-07-20 | Adams James T | Component carrier and method for making |
| CN201183641Y (en) * | 2008-03-11 | 2009-01-21 | 玮锋科技股份有限公司 | Electronic component packaging tape coiling having rib structure |
| TW200940420A (en) * | 2008-03-27 | 2009-10-01 | 3M Innovative Properties Co | Packaging device of electronic component, packaging method of electronic component, and packaging equipment thereof |
| JP5299378B2 (en) * | 2010-08-11 | 2013-09-25 | 株式会社村田製作所 | Carrier tape, carrier tape manufacturing apparatus, and carrier tape manufacturing method |
| MY181811A (en) * | 2013-05-14 | 2021-01-07 | Shinetsu Polymer Co | Carrier tape manufacturing sheet, method for manufacturing carrier tape manufacturing sheet and package |
| CN203461307U (en) * | 2013-08-30 | 2014-03-05 | 天水华天集成电路包装材料有限公司 | Power device carrying belt |
-
2017
- 2017-11-20 JP JP2017222985A patent/JP2019094078A/en active Pending
-
2018
- 2018-11-19 KR KR1020207015377A patent/KR20200087171A/en not_active Application Discontinuation
- 2018-11-19 CN CN201880067098.9A patent/CN111225862A/en active Pending
- 2018-11-19 WO PCT/JP2018/042656 patent/WO2019098364A1/en active Application Filing
- 2018-11-19 TW TW107141096A patent/TW201922592A/en unknown
-
2020
- 2020-03-26 PH PH12020550153A patent/PH12020550153A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0551764U (en) * | 1991-12-12 | 1993-07-09 | 信越ポリマー株式会社 | Embossed carrier tape |
| JP2014221651A (en) * | 2013-05-13 | 2014-11-27 | 信越ポリマー株式会社 | Embossed carrier tape |
| KR101552789B1 (en) * | 2014-03-05 | 2015-09-11 | 대일티앤씨 주식회사 | A carrier tape for preventing free move of asymmetry typed electronic device and packing using the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020235452A1 (en) | 2019-05-17 | 2020-11-26 | 株式会社Ｎｔｔドコモ | User terminal and wireless communication method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019098364A1 (en) | 2019-05-23 |
| PH12020550153A1 (en) | 2021-02-22 |
| CN111225862A (en) | 2020-06-02 |
| KR20200087171A (en) | 2020-07-20 |
| TW201922592A (en) | 2019-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5358510B2 (en) | Embossed carrier tape, method for manufacturing the same, and packaged part wound body | |
| JPH11500579A (en) | Component carrier tape | |
| JP2008528390A (en) | Component carrier and manufacturing method | |
| WO2019098364A1 (en) | Carrier tape and method for forming carrier tape | |
| JP6596707B2 (en) | Manufacturing method of carrier tape | |
| JP2007119011A (en) | Manufacturing method and manufacturing equipment for embossed carrier tape | |
| JPH06263164A (en) | Carrier tape and manufacture thereof | |
| JP4926436B2 (en) | Embossed carrier tape | |
| JP2007126169A (en) | Method for manufacturing electronic part storing member, and electronic part storing member | |
| JP6076194B2 (en) | Embossed carrier tape and manufacturing method thereof | |
| JP2006160370A (en) | Embossed carrier tape and method for manufacturing the same | |
| JP5970414B2 (en) | Embossed carrier tape | |
| JP6809678B2 (en) | Carrier tape molding method | |
| JP7441081B2 (en) | Molding method of carrier tape | |
| JP3698518B2 (en) | Manufacturing method of carrier tape | |
| JP4233318B2 (en) | Method and apparatus for manufacturing carrier tape | |
| JP6072333B1 (en) | Manufacturing method of embossed carrier tape | |
| JP5736908B2 (en) | Manufacturing method of carrier tape | |
| JP2006273426A (en) | Embossing carrier tape and its manufacturing method | |
| JP4425413B2 (en) | Method and apparatus for manufacturing carrier tape | |
| JP2023175257A (en) | Carrier tape and molding method of carrier tape | |
| JP5436973B2 (en) | Vacuum forming mold and carrier tape forming method | |
| JP2006117250A (en) | Electronic component conveyor and its manufacturing method | |
| JP4466930B2 (en) | Manufacturing method of carrier tape | |
| WO2015029212A1 (en) | Embossed carrier tape, device for manufacturing embossed carrier tape, and method for manufacturing embossed carrier tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200414 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201013 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201203 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210302 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20210629 |