TW201922592A - Carrier tape and method for forming carrier tape - Google Patents

Abstract

Provided are: a carrier tape capable of reliably housing a component in a housing recess; and a method for forming the carrier tape. Disclosed is a carrier tape 1 having formed therein: housing recesses 3 each housing a component P; and flange parts 4 having feeding holes 2. In a connection part 5 between the housing recesses 3 in the transporting direction MD, a front surface 500 which is a surface on the side of an opening 31 of each housing recess 3 is formed at the same height as a front surface 400 of the flange part 4 so as to be flush therewith, and a back surface 501 of the connection part 5 on the opposite side from the front surface 500 is located at a different height from a back surface 401 of the flange part 4. Disclosed is a method for forming the carrier tape 1, wherein a sheet base material 10 is transported onto a drum-type vacuum forming mold 12 having, in a surface thereof, a recess mold 120 for forming the housing recess 3, and the sheet base material is subjected to vacuum forming. In the vacuum forming mold 12, the outer diameter of a connection part mold 121 is greater than the outer diameter of a flange part mold 122.

Description

Bearing belt and forming method of bearing belt

The present invention relates to a carrier tape having a receiving recess of a receiving part and a method for forming the same.

Previously, electronic components such as bare wafers (ICs) or integrated circuit (IC) wafers were stored in the storage recesses of the carrier tape for transportation between workshops or supply to mounting devices. In this carrier tape, a storage recess for accommodating parts such as electronic parts and a flange part having a feed hole are formed side by side in the longitudinal direction, and the storage recess and the feed hole are formed in the longitudinal direction (for example, refer to Patent Document 1). When the components are stored in the carrier tape by the packaging machine, the storage recess is sealed with the cover tape and wound up on a reel.

In recent years, in order to improve the storage efficiency of parts, the interval between the storage recesses has been narrowed (short). As described in the Patent Document 1, when a carrier tape is vacuum-formed using a drum-type vacuum forming mold having a concave die formed on the front surface, the carrier tape is formed. The shape is such that the front surface 500A, which is the opening side surface of the storage recessed portion of the connection portion, is lowered toward the bottom surface side of the storage recessed portion relative to the front surface of the flange portion (see FIGS. 7 and 8 (b)).
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-221651

[Problems to be solved by the invention]

When using a packaging machine to store parts in the storage recess of the carrier tape in which the connecting portion has a lowered shape, the parts may abut the upper surface of the connecting portion, the storage may be inclined, or protruding from the storage recess to cause an error. Stopped situation.

In view of this, the present invention has been made in view of the above problems, and an object of the present invention is to provide a carrier tape and a manufacturing method of a carrier tape which can reliably store parts in a storage recess.
[Technical means to solve the problem]

(1) An aspect of the present invention is a carrier tape having a receiving recess for storing parts and a flange part having a feeding hole, and a connecting portion between the receiving recesses in the transport direction. The front surface of the accommodating recess is the flat surface at the same height as the front surface of the flange portion, and the rear surface opposite to the front surface of the connecting portion is at a different height from the rear surface of the flange portion.
(2) In the aspect (1), when the front surface of the flange portion is used as a reference, the back surface of the connecting portion may be located at a distance from the front surface of the flange portion to the back surface of the connecting portion to be longer than the flange. The position where the distance from the front surface of the portion to the rear surface of the flange portion is shorter.
(3) In the aspect (1) or (2), the difference in height between the back surface of the flange portion and the back surface of the connection portion, that is, the depression amount of the connection portion may satisfy the following (Equation 1),
(Equation 1) H = T / 2-α ・ D, where the recessed amount of the connecting portion is set to H, the thickness of the flange portion is set to T, the interval between the storage recessed portions is set to D, and the unit of each dimension is set to Is mm, and α is 0.02 ≦ α ≦ 0.04.
(4) In one aspect of the above (1) to (3), the above-mentioned carrier tape may be formed using a drum vacuum forming mold.
(5) Another aspect of the present invention is a method for forming a carrier tape, which is formed by forming a sheet-shaped base material into a receiving recess of a receiving part, and a supporting tape having a flange portion having a feeding hole. The sheet-shaped substrate is transported to a drum vacuum forming mold having a concave mold for forming the storage recesses on the front surface, and the vacuum forming is performed on the front surface of the drum vacuum molding mold. The outer diameter of the connecting portion mold is larger than the outer diameter of the flange portion mold forming the flange portion.
[Effect of the invention]

According to the present invention, it is possible to provide a carrier tape and a manufacturing method of a carrier tape which can reliably store parts in a storage recess.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in the embodiments, the previous examples, the examples, and the comparative examples of this specification, the same components are assigned the same symbols.

First, before describing the forming method of the carrier tape 1 according to the embodiment of the present invention, the carrier tape 1 will be described. Fig. 1 is a perspective view showing a carrier tape 1 according to the embodiment. FIG. 2 shows the carrier tape 1 according to the embodiment. (A) is a plan view, (b) is a cross-sectional view before viewing in the direction of the EE arrow in (a), and (c) is a side viewed in the direction of the FF arrow in (a). A sectional view. FIG. 3 is an enlarged view of a front sectional view of the carrier tape 1 according to the embodiment.

The carrier tape 1 shown in FIG. 1 is a person who stores a plurality of parts P, stores them, transfers them, and smoothly supplies the parts P to a mounting machine that mounts the parts P on a substrate. Examples of the component P include electronic components, precision components, and the like. A plurality of feeding holes 2 and receiving recesses 3 for receiving parts P are formed on the carrier tape 1 along the length direction of the tape (conveying direction MD) at specific intervals.

The feed hole 2 is passed through the flange portion 4 formed in the longitudinal direction. Furthermore, in this embodiment, the feed hole 2 has a circular shape in plan view, and the shape of the feed hole 2 and the feeding mechanism such as a space-fitting mounting machine are preferably worn. In addition, the feed hole 2 may be inserted into both sides of the storage recess 3 along both sides in the length direction of the belt.

The storage recess 3 is formed in accordance with the size and shape of the component P to be stored, and in this embodiment, it is formed into a substantially rectangular shape in plan view. In addition, in the storage recessed portion 3, the bottom surface 300 may be formed with a bottom hole 6 for inspection and the like, and the bottom surface 300 may be formed with a stand. The size of the storage recess 3 is usually in the range of 0.1 mm to 16 mm square, and the width of the carrier tape 1 is 4 mm to 24 mm. The storage recesses 3 in the conveying direction MD are connected portions 5.

The front surface 500 on the side of the opening 31 of the connection portion 5 is formed in a flat shape at the same or equivalent height as the front surface 400 of the flange portion 4, and the back surface 501 opposite to the front surface 500 of the connection portion 5 is located on the side of the flange portion 4. Different heights on the back 401. That is, the thickness t of the connecting portion 5 is different from the thickness T of the flange portion 4 (see FIG. 3).

In more detail, the back surface 501 of the connecting portion 5 is located higher than the back surface 401 of the flange portion 4 from a height higher than the bottom surface 300 of the receiving recess 3, or the front surface of the flange portion 4 When 400 is used as a reference, the distance between the front surface 400 and the back surface 501 of the connecting portion 5 is shorter than the distance between the front surface 400 and the back surface 401 of the flange portion 4. That is, the thickness t of the connecting portion 5 is smaller than the thickness T of the flange portion 4.

The carrier tape 1 is made of a thermoplastic resin. Examples of thermoplastic resins include synthetic resins such as polycarbonate, polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, and polypropylene, and carbon is kneaded with these resins to impart conductivity, Those who apply conductive coating to the front.

Here, the carrier tape 1 is formed by a forming device 100 of the carrier tape 1 described later. During the forming, the carrier tape 1 is formed into a plurality of rows of the carrier tape 1 such as 4 rows and 8 rows. Thereafter, a slit knife or the like is used. The devices are cut, and the carrier tapes 1 are cut and separated into one row to complete the manufacturing. Furthermore, there may be cases where positioning recesses are used between the rows of the plurality of rows of the carrier tapes 1 and at both end portions for positioning the feed holes 2 and the like.

Next, a forming apparatus 100 and a forming method of the carrier tape 1 will be described. FIG. 4 is a schematic view showing the forming apparatus 100 of the carrier tape 1. FIG. 5 is a flowchart showing a method of forming the carrier tape 1.

The forming apparatus 100 of the carrier tape 1 shown in FIG. 4 includes at least a heating roller 11, a drum vacuum forming mold 12, an accumulation portion 13, a stamper 14, and a transfer device 15.

The heating roller 11 transfers the sheet-like substrate 10 supplied from a supply device (not shown) to a drum-type vacuum forming mold 12 disposed downstream in the conveying direction MD while rotating and softens while heating the sheet-like substrate.材 10。 Material 10. By heating the sheet-like substrate 10 with the heating roller 11, the winding inertia force and wave-like fluctuations of the sheet-like substrate 10 can be corrected to some extent.

The outer surface of the drum-type vacuum forming mold 12 has a plurality of concave molds (cavities) 120 corresponding to the accommodating recesses 3 to be formed. One side of the sheet-shaped substrate 10 transferred by the rotary conveyance and one side of the sheet-shaped substrate 10 The storage recess 3 is formed in a vacuum. The structure of the drum vacuum forming mold 12 will be described in detail later. Each cavity 120 is connected to a vacuum generator or the like. In addition, the drum-type vacuum forming mold 12 can be maintained at a constant temperature by a cold temperature-regulating medium such as water.

The accumulation portion 13 stagnates the sheet-like base material 10A on which the storage recessed portion 3 is formed and cools it once, thereby removing thermal stress during vacuum forming.

The stamper 14 is for punching the feed hole 2 on the sheet-like substrate 10A, and further punching the bottom hole 6 on the bottom surface 300 of the storage recess 3.

The transfer device 15 is a person who intermittently transfers the sheet-like substrate 10A from the accumulation portion 13 to the stamper 14.

In addition to the various devices described above, the forming apparatus 100 further includes a cutting device for cutting the carrier tapes 1 formed into a plurality of rows and separating the carrier tapes 1 into one row, and accommodates the parts P in each of the carrier tapes 1. After the recess 3, a packaging machine using an upper cover tape for packaging, and a winding device for winding the reel.

Next, a description will be given of a forming method of the carrier tape 1. The forming method includes at least a transfer step S1 of transferring the sheet-like substrate 10 to the drum vacuum forming mold 12, and a sheet that has been transferred to the front surface of the drum vacuum forming mold 12. The base material 10 is sucked and vacuum-formed in the forming step S2, and the feeding hole punching step S3 in which the feeding hole 2 is punched on the side of the storage recess 3, and further includes a punching bottom in the bottom surface 300 of the storage recess 3 The bottom hole punching step S4 (see FIG. 5).

In the transfer step S1, the sheet-like substrate 10 is transferred to the drum-type vacuum forming mold 12 at a constant transfer speed. In addition, in the step before the conveyance step S1, the sheet-like base material 10 can be heated by the heating roller 11.

In the next forming step S2, the sheet-like substrate 10 is vacuum-adsorbed on the front surface of the outer periphery of the drum-type vacuum forming mold 12 and vacuum-formed. Thereafter, the sheet-like base material 10A having the storage recessed portion 3 formed therein is cooled by the accumulation portion 13. After that, the sheet-like substrate 10A is transferred to the stamper 14 by intermittent transfer of the transfer device 15.

In the feeding hole punching step S3, the receiving recess 3 of the sheet-shaped base material 10A is positioned by a positioning device (not shown), and the feeding hole 2 is punched by the stamper 14.

In the bottom hole punching step S4, the receiving recess 3 of the sheet-shaped base material 10A is positioned by the positioning device, and the bottom hole is punched by the stamper 14. Furthermore, the feeding hole punching step S3 and the bottom hole punching step S4 may be performed simultaneously.

The carrier tape 1 having the feed holes 2 and the bottom holes 6 is cut and separated by a cutting device. In this way, the single-row carrier tape 1 is formed.

Here, the drum vacuum forming mold 12 and the forming step S2 will be described in detail. FIG. 6 (a) is a schematic perspective view showing the drum vacuum forming mold 12 according to the embodiment, and (b) is a schematic perspective view showing the conventional drum vacuum forming mold 12A.

As shown in FIG. 6 (a), the drum-type vacuum forming mold 12 has a cavity 120 on the front side for forming the storage recess 3 of the carrier tape 1, and the outer front surface has a plurality of sizes corresponding to the storage recess 3 to be formed. A cavity 120 having a shape (length A0, width B0, height K0), a distance D between the receiving recesses 3 and a thickness of the sheet-like base material 10A, that is, a thickness T of the flange portion 4 (see FIGS. 2 and 3).

The outer diameter of the connecting portion mold 121 of the connecting portion 5 between the storage recesses 3 in the forming conveying direction MD is larger than the outer diameter of the flange portion mold 122 of the forming flange portion 4. That is, as shown in FIG. 2 and FIG. 3, the outer diameter of the connecting part mold 121 is the same as or the same as the front face 400 of the flange part 4 as the surface 500 on the side of the opening 31 of the receiving recess 3 of the connecting part 5 during molding. The method of forming the height into a flat shape is adjusted with respect to the outer diameter of the flange portion mold 122.

In other words, the outer diameter of the connecting portion mold 121 is compared with that of the flange portion mold 122 in such a manner that the connecting portion 5 is stretched to compensate for the amount of the falling portion 5 rising from the flange portion 4 when the storage recess 3 is formed. The outer diameter is greatly adjusted. In this way, the outer diameter of the connection part mold 121 is determined so as to predict the amount of decrease (reduction amount) and compensate for it.

Specifically, it is preferable that the difference between the height of the back surface 401 of the flange portion 4 and the back surface 501 of the connection portion 5, that is, the depression amount H of the connection portion 5 satisfies the following range (Expression 1).
(Expression 1) The recessed amount H of the connecting portion 5 = the thickness T / 2 of the flange portion 4-α, the interval D of the storage recess 3
Among them, 0.02 ≦ α ≦ 0.04.

The outer diameter of the connecting part mold 121 varies depending on the material and thickness of the sheet-like base material 10 and the size of the storage recess 3 to be formed. It is preferable to set the diameter within a range smaller than the thickness T of the sheet-like base material 10. It is larger than the outer diameter of the flange part mold 122. For example, when the thickness of the sheet-like base material 10 is 0.25 mm, the outer diameter of the connecting portion mold 121 is set to be larger than the outer diameter of the flange portion mold 122 by, for example, about 48 μm to 108 μm. In this embodiment, the difference between the outer diameter of the connecting part mold 121 and the outer diameter of the flange part mold 122 is 100 μm.

When the storage recesses 3 are formed on the sheet-like base material 10, when the interval D between the storage recesses 3 is relatively narrow, the connection portion 5 may be stretched to the storage recess 3 side (bottom surface 300 side), and may be reduced in shape. In the embodiment, since the outer diameter of the connecting portion mold 121 is larger than the outer diameter of the flange portion mold 122, the connecting portion 5 is only stretched but not stretched to the storage recess 3 side (bottom surface 300 side), Therefore, the thickness t of the connection portion 5 becomes thin. Furthermore, when the height K0 of the storage recess 3 becomes deep, the amount of stretching also increases. In this way, a difference between the thickness t of the connecting portion 5 and the thickness T of the flange portion 4, that is, the amount of depression H is generated.

(Previous example)
Among them, for comparison, the conventional drum vacuum forming mold 12A and the carrier tape 1A formed by the drum vacuum forming mold 12A will be described. FIG. 7 shows a carrier tape 1A formed using a conventional drum-type vacuum forming mold 12A. (A) is a top view, (b) is a cross-sectional view before viewing in the direction of the EE arrow in (a), and (c) is along (a). ) Side sectional view viewed in the direction of the FF arrow.

In the previous vacuum forming mold 12A, as shown in FIG. 6 (b), the outer diameter of the connecting portion mold 121A of the connecting portion 5 between the receiving recesses 3 in the forming conveying direction MD is the same as that of the forming flange portion 4. The flange part mold 122 has the same outer diameter.

In the carrier tape 1A formed by the conventional drum-type vacuum forming mold 12A, the front surface 500A of the connecting portion 5A is lower than the front surface 400 of the flange portion 4 (see FIG. 7 (c)). Accordingly, the front surface 500A of the connecting portion 5A is easily curved. Furthermore, when the height K0 of the storage recess 3 is high (deeper), the amount of stretching of the connecting portion 5A increases, and the connecting portion 5A decreases further. This situation is particularly noticeable when vacuum forming is performed using the drum vacuum forming mold 12A.

(Example)
Hereinafter, the effects of the carrier tape 1 and the forming method of the carrier tape 1 according to the embodiment of the present invention will be described in more detail with examples and comparative examples. Fig. 8 (a) is a schematic view showing a case where the part P is stored in the storage recess 3 of the carrier tape 1 of the embodiment, and (b) is a case where the part P is stored in the storage recess 3A of the previous carrier tape 1A. Sketch map.

In the drum-type vacuum forming mold 12, a sheet-like substrate 10 having a width of 8 mm and a thickness T of 0.25 mm was transported to a flange portion mold 122 having an outer diameter of 100 mm and vacuum-formed. ～ 3 and the carrier tape of the comparative example. In addition, the design dimensions of the storage recess 3, that is, the length A0, the height K0, and the interval D are as shown in Examples 1 to 3 and Comparative Examples in Table 1, the pitch is 4 mm, and the width B0 is set to be the same as the length A0.

Thereafter, a part insertion test in which the part P is inserted into the receiving recess 3 of the carrier tape 1 is performed. The results of the part insertion test are shown in Table 1. "○" is a state where it can be inserted well, "×" is a state where it cannot be inserted, and the recessed amount H is calculated from the difference between the thickness t of the connecting portion 5 and the thickness T of the flange portion 4.

[Table 1]

It can be seen from comparison of Examples 1 to 3 and the comparative example that when the recessed amount H of the connecting portion 5 is too large, the insertion result of the part P becomes worse.

In the above (formula 1), the thickness T of the flange portion 4 is set to be the same as the thickness of the sheet-like substrate 10, that is, 0.25 mm, and the interval D is set to 0.5 mm, so 0.105 ≦ H ≦ 0.115. The actual recessed amount H of the connecting portion 5 is 0.131 mm, so it does not satisfy (Expression 1).

On the other hand, in the above (formula 1), if the thickness T of the flange portion 4 is set to be 0.25 mm, which is the same as the thickness of the sheet-like base material 10, and the interval D is set to 0.8 mm, then (formula 1) is 0.093. ≦ H ≦ 0.109, the actual recessed amount H of the connecting portion 5 in Example 1 is 0.108 mm, so that (Expression 1) is satisfied, and the following is also the same, because (Expression 1) in the case of Example 2 is 0.025 ≦ H ≦ 0.075, (Expression 1) in the case of Example 3 is 0.041 ≦ H ≦ 0.083, so in any of the cases of Examples 1 to 3, (Expression 1) is satisfied.

In this way, it can be confirmed that if the depression amount H of the connecting portion 5 that satisfies (Expression 1) is satisfied, there is no problem in the insertion result of the component P into the storage concave portion 3.

Furthermore, when the component P is stored in the storage recess 3 of the carrier tape 1 by the packaging machine, as shown in FIG. 8 (a), in the carrier tape 1 formed by the drum-type vacuum forming mold 12 of the embodiment, The component P faces the arrow direction along the inner wall of the storage recess 3 and is stored at a specific position. In addition, the front surface 500 of the connecting portion 5 is formed to be flat at the same height as the front surface 400 of the flange portion 4. Therefore, when the periphery of the storage recess 3 of the carrier tape 1 is sealed by a cover tape (not shown), The upper cover tape is in close contact with the front surface 500 of the connecting portion 5, and there is no gap between the two. Accordingly, even when the storage recess 3 is opened without peeling off the upper cover tape, the upper cover tape can be cut.

On the other hand, as shown in FIG. 8 (b), in the carrier tape 1A formed by the conventional drum-type vacuum forming mold 12A, when the part P is stored in the storage recess 3 by the packaging machine, the part P will abut against Because of the upper surface of the connecting portion 5A, it may be inserted while being slanted while being slanted, or it may protrude (rid on) from the storage recess 3 in the direction of the arrow, causing the packaging machine to be inserted incorrectly or the machine to stop.

As described above, in the carrier tape 1 according to the embodiment of the present invention, the storage recesses 3 in which the storage parts P are formed and the flange portions 4 having the feed holes 2 are formed, and the storage recesses 3 in the transport direction MD are connected to each other. The front surface 500 of the portion 5 on the side of the opening 31 of the receiving recess 3 is formed in a flat shape at the same height as the front surface 400 of the flange portion 4, and the back surface 501 opposite to the front surface 500 of the connecting portion 5 is located on the flange portion. The back of 4 has a different height of 401. Furthermore, in the embodiment, when the front surface 400 of the flange portion 4 is used as a reference, the distance between the back surface 501 of the connecting portion 5 and the front surface 400 to the back surface 501 is shorter than the distance between the front surface 400 and the back surface 401 of the flange portion 4. In other words, the thickness t of the connecting portion 5 is thinner than the thickness T of the flange portion 4. Accordingly, when the component P is stored in the storage recessed portion 3 of the carrier tape 1, the component P is abutted to the side surface of the connecting portion 5, so that the component P can be reliably stored in the storage recessed portion 3. In addition, even when the periphery of the storage recess 3 of the carrier tape 1 is sealed by the top cover tape, the top cover tape and the front surface 500 of the connecting portion 5 are easily in close contact, so that it can be sealed well.

In the embodiment, the difference between the height of the back surface 401 of the flange portion 4 and the back surface 501 of the connection portion 5, that is, the depression amount H of the connection portion 5 satisfies the above-mentioned (Expression 1). By setting each size of the storage recess 3 so as to satisfy (Expression 1), the carrier tape 1 capable of reliably storing the component P in the storage recess 3 can be designed.

In the embodiment, the carrier tape 1 is formed using a drum vacuum forming mold 12. By using the drum-type vacuum forming mold 12, the carrier tape 1 can be easily formed. In the carrier tape 1, when the front surface 400 of the flange portion 4 is used as a reference, the back surface 501 of the connecting portion 5 is located on the front surface 400 to the back surface 501. A position where the distance is shorter than the distance from the front surface 400 to the back surface 401 of the flange portion 4, or the thickness t of the connecting portion 5 is thinner than the thickness T of the flange portion 4.

In addition, the forming method of the carrier tape 1 according to the embodiment of the present invention is a carrier tape 1 having a receiving recess 3 for storing parts P and a supporting tape 1 having a flange portion 4 of a feed hole 2 formed from a sheet-like substrate 10, The sheet-shaped substrate 10 is transported to a drum-type vacuum forming mold 12 having a concave mold 120 for forming and accommodating the concave portion 3 on the front surface and performing vacuum forming. The drum-type vacuum forming mold 12 is an accommodating concave portion 3 in the conveying direction MD. The outer diameter of the connecting portion mold 121 of the connecting portion 5 between them is larger than the outer diameter of the flange portion mold 122 of the forming flange portion 4. Thereby, a carrier tape 1 can be formed in which the surface on the side of the opening 31 of the accommodating recess 3, that is, the front surface 500 of the connecting portion 5 is formed to be flat at the same height as the front surface 400 of the flange portion 4, When the back surface 501 of the connecting portion 5 is based on the front surface 400 of the flange portion 4, the distance between the front surface 400 and the back surface 501 is shorter than the distance between the front surface 400 and the back surface 401 of the flange portion 4, or the connecting portion The thickness t of 5 is thinner than the thickness T of the flange portion 4. Thereby, the carrier tape 1 capable of reliably storing the component P in the storage recess 3 can be formed.

The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the above embodiments, and various changes and modifications can be made within the scope of the gist of the present invention described in the scope of patent application.

(Modification)
In the above embodiment, the accommodating recessed portion 3 of the carrier tape 1 is a case in which the height K0 is high, and a case in which the height K0 is shallow. FIG. 9 is an enlarged view of a cross-sectional view of the carrier tape 1 before the modification.

In the carrier tape 1 of the modified example, the height K0 of the receiving recessed portion 3 is smaller than the thickness T of the flange portion 4. That is, when the front surface 400 of the flange portion 4 is used as a reference, the distance between the front surface 400 and the bottom surface 300 of the receiving recess 3 is shorter than the distance between the front surface 400 and the rear surface 401 of the flange portion 4. In addition, the distance from the front surface 400 to the back surface 501 of the connecting portion 5 is shorter than the distance from the front surface 400 to the back surface 401 of the flange portion 4, that is, the thickness t of the connecting portion 5 is thinner than the thickness T of the flange portion 4. The embodiment is the same.

In the above-mentioned embodiment, the storage recessed part 3 of the carrier tape 1 is formed by the drum-type vacuum forming mold 12, but it is not limited to this, and it can also be formed by pressure forming. In addition, the sheet-shaped base material 10 manufactured in advance is supplied to the drum-type vacuum forming mold 12, but the sheet-shaped base material 10 may be formed by using sheet-shaped extrusion molding of a plastic resin, and may be supplied to the drum-type. Melt to form of the vacuum forming mold 12.

1,1A‧‧‧bearing belt

2‧‧‧feed hole

3,3A‧‧‧Storage recess

4‧‧‧ flange

5,5A‧‧‧Connecting Department

6‧‧‧ bottom hole

10,10A‧‧‧sheet substrate

11‧‧‧heating roller

12, 12A‧‧‧Drum type vacuum forming mold

13‧‧‧accumulation department

14‧‧‧Die

15‧‧‧ transport device

31, 31A‧‧‧ opening

100‧‧‧forming device

120‧‧‧cavity (cavity)

121‧‧‧Joint Department Mould

121A‧‧‧Connecting part mould

122‧‧‧Flange Mould

300, 300A‧‧‧ Underside

400‧‧‧ positive

401‧‧‧Back

500, 500A‧‧‧Front

501, 501A‧‧‧Back

AO‧‧‧length

BO‧‧‧Width

D‧‧‧ Space between the recesses

E‧‧‧line

F‧‧‧line

H‧‧‧ Depression in the joint

KO‧‧‧ height

MD‧‧‧ Transport direction

P‧‧‧Parts

S1‧‧‧step

S2‧‧‧step

S3‧‧‧step

S4‧‧‧step

t‧‧‧Thickness of connecting part

T‧‧‧Thickness of flange

FIG. 1 is a perspective view showing a carrier tape according to the embodiment.

Fig. 2 shows the carrier tape of the embodiment, (a) is a top view, (b) is a cross-sectional view before looking in the direction of the EE arrow in (a), and (c) is a side view looking in the direction of the FF arrow in (a) Sectional view.

FIG. 3 is an enlarged view of a front cross-sectional view of the carrier tape according to the embodiment.

Fig. 4 is a schematic view showing a forming apparatus for a carrier tape.

Fig. 5 is a flowchart showing a method for forming a carrier tape.

Fig. 6 (a) is a schematic perspective view showing a drum-type vacuum forming mold according to an embodiment, and (b) is a schematic perspective view showing a conventional drum-type vacuum forming mold.

FIG. 7 shows a carrier tape formed by using a previous drum vacuum forming mold, (a) is a top view, (b) is a cross-sectional view before viewing in the direction of the EE arrow in (a), and (c) is along (a) A side cross-sectional view viewed in the direction of the FF arrow.

FIG. 8 (a) is a schematic view showing a case where parts are stored in a storage recessed portion of a carrier tape of an embodiment, and (b) is a schematic view showing a case where parts are stored in a storage recessed portion of a previous carrier tape.

FIG. 9 is an enlarged view of a cross-sectional view of a carrier tape according to a modification.

Claims (5)

A carrying belt characterized by: It is formed with a storage recessed part for storing parts and a flange part with a feed hole, The connection portion between the storage recesses in the conveying direction, the front surface of the storage recess on the open side, that is, the front surface is formed at the same height as the front surface of the flange portion, and the back surface is opposite to the front surface of the connection portion. The height is different from the back surface of the flange portion. If the carrier tape of item 1 is requested, Wherein, when the front side of the flange portion is used as a reference, the distance between the back surface of the connection portion and the back surface of the connection portion is greater than the distance from the front surface of the flange portion to the back surface of the flange portion. Short position. If the carrier tape of item 1 or 2 is requested, The difference between the height of the back surface of the flange portion and the back surface of the connection portion, that is, the depression amount of the connection portion satisfies the following (Equation 1), (Equation 1) H = T / 2－α ・ D, Among them, the recessed amount of the connecting portion is set to H, the thickness of the flange portion is set to T, the interval between the storage recessed portions is set to D, each dimension unit is set to mm, and α is 0.02 ≦ α ≦ 0.04. If the carrier tape of any one of items 1 to 3 is requested, The carrier tape is formed using a drum vacuum forming mold. A method for forming a carrier tape is characterized by: It is a carrier belt formed by forming a sheet-shaped base material with a storage recessed part and a flange with a feeding hole, The forming method of the carrier tape is a method of conveying the sheet-like base material to a drum-type vacuum forming mold having a concave mold for forming the accommodating concave portion on the front surface, and performing vacuum forming. In the drum-type vacuum forming mold, an outer diameter of a connecting portion mold of a connecting portion between the accommodating concave portions in a forming conveying direction is larger than an outer diameter of a flange portion mold for forming the flange portion.