TW201900383A - Method for molding carrier tape - Google Patents

Method for molding carrier tape Download PDF

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Publication number
TW201900383A
TW201900383A TW107115187A TW107115187A TW201900383A TW 201900383 A TW201900383 A TW 201900383A TW 107115187 A TW107115187 A TW 107115187A TW 107115187 A TW107115187 A TW 107115187A TW 201900383 A TW201900383 A TW 201900383A
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TW
Taiwan
Prior art keywords
carrier tape
sheet
hot air
forming
less
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TW107115187A
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Chinese (zh)
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TWI770170B (en
Inventor
今井將幸
杉本士朗
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日商信越聚合物股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/10Forming by pressure difference, e.g. vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C51/00Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
    • B29C51/26Component parts, details or accessories; Auxiliary operations
    • B29C51/42Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B47/00Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved
    • B65B47/02Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved with means for heating the material prior to forming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B47/00Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved
    • B65B47/08Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved by application of fluid pressure
    • B65B47/10Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved by application of fluid pressure by vacuum

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention is a method for molding a carrier tape (10) having one or more rows of perforations and accommodating recesses (3) that accommodate components. The method includes a conveying step for conveying a sheet material (10A) to a drum-type mold (120), and a molding step for drawing in the sheet material (10A) that has been conveyed to the surface of the drum-type mold (120) and performing vacuum molding. In the molding step, the sheet material (10A) is vacuum-molded while being heated by the blowing of hot air from a hot-air-heating means (160), and the blowing flow rate of the hot air is at least 0.125 mL/mm2 and no more than 3.75 mL/mm2 per unit area. The present invention makes it possible to provide a method for molding a carrier tape in which the rectangularity of an opening edge of an accommodating recess is ensured.

Description

承載帶之成形方法Carrier tape forming method

本發明係關於一種具有收納零件之收納凹部之承載帶之成形方法。The present invention relates to a method of forming a carrier tape having a housing recess for receiving a component.

先前,具有收納零件之收納凹部之承載帶例如係藉由以下方法而成形,即,利用加熱滾筒使作為母材帶之片材加熱軟化後,連續地供給至滾筒式模具而使收納凹部真空成形(參照專利文獻1)。In the prior art, the carrier tape having the housing recessed portion for accommodating the component is formed by, for example, heating and softening the sheet as the base material tape by the heating roller, and then continuously supplying the sheet to the drum mold to vacuum-form the housing recess. (Refer to Patent Document 1).

又,亦已知有一種承載帶之成形方法,其係利用加熱滾筒直接加熱片材後,於滾筒式模具上向成形中之收納凹部壓力噴射450℃以上且550℃以下之熱風,而使收納凹部真空成形(參照專利文獻2)。 [先前技術文獻] [專利文獻]Further, there is also known a method of forming a carrier tape by directly heating a sheet by a heating roller, and then ejecting hot air of 450° C. or more and 550° C. or less to the storage recessed pressure in the forming mold on the drum mold. Vacuum forming of the recess (refer to Patent Document 2). [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開平10-272684號公報 [專利文獻2]日本專利特開平11-207811號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei.

[發明所欲解決之問題][The problem that the invention wants to solve]

然而,如文獻2中所示,即便調整熱風之加熱溫度,收納凹部之開口緣亦會成為帶較大弧度之形狀(參照圖6),無法獲得矩形性,從而無法使收納凹部之成形精度穩定。However, as shown in Document 2, even if the heating temperature of the hot air is adjusted, the opening edge of the housing recess will have a shape with a large curvature (see Fig. 6), and the rectangular shape cannot be obtained, so that the forming precision of the housing recess cannot be stabilized. .

因此,本發明係鑒於以上之問題而完成者,其目的在於提供一種確保了收納凹部之開口緣之矩形性之承載帶之成形方法。 [解決問題之技術手段]Accordingly, the present invention has been made in view of the above problems, and an object thereof is to provide a method of forming a rectangular carrier tape that secures an opening edge of a housing recess. [Technical means to solve the problem]

(1)本發明之一態樣係一種承載帶之成形方法,該承載帶具有1行以上之收納零件之收納凹部,且該承載帶之成形方法包括:搬送步驟,其係將片材搬送至滾筒式模具;及成形步驟,其係將被搬送至上述滾筒式模具之表面之上述片材吸引而使之真空成形;於上述成形步驟中,一面自熱風加熱機構吹出熱風而加熱上述片材,一面使其真空成形,並且將上述熱風之吹出流量設為每單位面積0.125 mL/mm2 以上且3.75 mL/mm2 以下。 (2)於上述(1)之承載帶之成形方法中,可將上述熱風之吹出溫度設為300℃以上且700℃以下。 (3)於上述(1)或(2)之承載帶之成形方法中,可將上述熱風之吹出流量設為每一行寬10 L/min以上且60 L/min以下。 (4)於上述(1)至(3)中任一項之承載帶之成形方法中,可將上述片材之搬送速度設為2 m/min以上且10 m/min以下。 (5)於上述(1)至(4)中任一項之承載帶之成形方法中,可將上述滾筒式模具維持為20℃以上且100℃以下之溫度。 [發明之效果](1) One aspect of the present invention is a method of forming a carrier tape having a housing recess of one or more rows of storage parts, and the method of forming the carrier tape includes: a conveying step of conveying a sheet to a drum mold; and a forming step of sucking the sheet conveyed to the surface of the drum mold and vacuum forming the sheet; and in the forming step, blowing the hot air from the hot air heating mechanism to heat the sheet. The vacuum flow rate was set to 0.125 mL/mm 2 or more and 3.75 mL/mm 2 or less per unit area. (2) In the molding method of the carrier tape according to (1) above, the hot air blowing temperature may be 300 ° C or more and 700 ° C or less. (3) In the molding method of the carrier tape according to (1) or (2) above, the blowing flow rate of the hot air may be set to be 10 L/min or more and 60 L/min or less per line width. (4) The method of forming a carrier tape according to any one of the above (1) to (3), wherein the sheet conveying speed is 2 m/min or more and 10 m/min or less. (5) The method of forming a carrier tape according to any one of the above (1) to (4), wherein the drum mold is maintained at a temperature of 20 ° C or more and 100 ° C or less. [Effects of the Invention]

根據本發明,可提供一種確保了收納凹部之開口緣之矩形性之承載帶之成形方法。According to the present invention, it is possible to provide a method of forming a rectangular carrier tape which ensures the opening edge of the housing recess.

以下,參照圖式對本發明之實施形態進行詳細說明。再者,於本說明書之實施形態中,貫穿全文地對相同構件標附相同符號。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments of the present specification, the same members are denoted by the same reference numerals throughout the drawings.

首先,在說明本發明之實施形態之承載帶1之成形方法之前,對承載帶1進行說明。圖1係承載帶1之立體圖,圖2係表示複數行承載帶10之俯視圖。 圖1所示之承載帶1係收納複數個零件P,進行保管,或進行搬送,或將零件P順利地供給至在基板安裝零件P之安裝機者。作為零件P,可列舉例如電子零件或精密零件等。First, the carrier tape 1 will be described before explaining the molding method of the carrier tape 1 according to the embodiment of the present invention. 1 is a perspective view of a carrier tape 1, and FIG. 2 is a plan view showing a plurality of rows of carrier tapes 10. The carrier tape 1 shown in FIG. 1 is a device in which a plurality of components P are housed, stored, or transported, or the component P is smoothly supplied to a mounting device of the substrate mounting component P. Examples of the component P include electronic components and precision components.

於該承載帶1,沿著帶之搬送方向MD(長度方向),分別以特定之間隔形成有複數個進給孔2及收納零件P之收納凹部3。再者,於本實施形態中,進給孔2在俯視下呈圓形狀,但進給孔2之尺寸、形狀及間隔宜對照安裝機等進給機構而貫穿設置。又,進給孔2亦存在沿著帶之長度方向MD之兩邊而貫穿設置於收納凹部3之兩側的情況。In the carrier tape 1, a plurality of feed holes 2 and a housing recess 3 for accommodating the component P are formed at specific intervals along the transport direction MD (longitudinal direction) of the tape. Further, in the present embodiment, the feed hole 2 has a circular shape in plan view, but the size, shape, and interval of the feed hole 2 are preferably provided so as to be continuous with the feed mechanism such as a mounting machine. Further, the feed hole 2 may be provided on both sides of the housing recess 3 along both sides in the longitudinal direction MD of the belt.

收納凹部3係對照所要收納之零件P之尺寸及形狀而形成,於本實施形態中,在俯視下形成為大致矩形狀。再者,收納凹部3亦存在於底面形成用於檢查用等之底孔4、或進而於底面形成台座之情況。再者,收納凹部3之尺寸通常為0.1 mm見方至16 mm見方之範圍內,承載帶1之帶寬為4 mm至24 mm之範圍內。The housing recess 3 is formed in accordance with the size and shape of the component P to be housed. In the present embodiment, the housing recess 3 is formed in a substantially rectangular shape in plan view. Further, the housing recess 3 may be formed in the bottom surface to form a bottom hole 4 for inspection or the like, or to form a pedestal on the bottom surface. Further, the size of the housing recess 3 is usually in the range of 0.1 mm square to 16 mm square, and the bandwidth of the carrier tape 1 is in the range of 4 mm to 24 mm.

並且,該承載帶1以熱塑性樹脂為材料而形成。作為熱塑性樹脂,例如可列舉:聚碳酸酯、聚苯乙烯、聚氯乙烯、非晶形聚對苯二甲酸乙二酯、聚丙烯等合成樹脂;將碳混練於該等樹脂中而賦予導電性而成者;於表面實施導電塗覆而成者等。Further, the carrier tape 1 is formed of a thermoplastic resin. Examples of the thermoplastic resin include synthetic resins such as polycarbonate, polystyrene, polyvinyl chloride, amorphous polyethylene terephthalate, and polypropylene; and carbon is kneaded in the resins to impart conductivity. Into the person; the surface of the conductive coating is made.

然,該承載帶1係利用下述承載帶10之成形裝置100而形成,成形時,形成為例如4行、8行等複數行承載帶10,其後,藉由開縫刀等切斷機構而切斷、分離成每1行承載帶1,從而製造而成。再者,亦存在於複數行承載帶10之行間或兩端部設有形成進給孔2等時所使用之定位用凹部的情況。However, the carrier tape 1 is formed by the forming device 100 of the carrier tape 10 described below, and is formed into a plurality of rows of carrier tapes 10, for example, four rows, eight rows, and the like, and thereafter, a cutting mechanism such as a slitting knife or the like is formed. It is manufactured by cutting and separating into a carrier tape 1 per row. Further, there are cases in which the positioning recesses used for forming the feed holes 2 and the like are provided between the rows or both end portions of the plurality of rows of the carrier tapes 10.

繼而,對承載帶10之成形裝置100及成形方法進行說明。圖3係表示用於本發明之實施形態之承載帶10之成形方法的承載帶10之成形裝置100之概略圖,圖4係表示本發明之實施形態之承載帶10之成形方法之流程圖。Next, the molding apparatus 100 and the molding method of the carrier tape 10 will be described. 3 is a schematic view showing a molding apparatus 100 for a carrier tape 10 used in a molding method of the carrier tape 10 according to the embodiment of the present invention, and FIG. 4 is a flow chart showing a molding method of the carrier tape 10 according to the embodiment of the present invention.

圖3所示之承載帶10之成形裝置100至少具備:預加熱輥110、滾筒式模具120、蓄積部130、壓模140、搬送機構150、及熱風加熱機構160。The molding apparatus 100 of the carrier tape 10 shown in FIG. 3 includes at least a preheating roller 110, a drum mold 120, an accumulation unit 130, a stamper 140, a conveying mechanism 150, and a hot air heating mechanism 160.

預加熱輥110係一面藉由旋轉將自未圖示之供給機構供給之片材10A搬送至設置於搬送方向MD下游之滾筒式模具120,一面使該片材10A加熱軟化,且該預加熱輥110以能夠於100℃左右之溫度下加熱片材10A之方式構成。藉由利用預加熱輥110預加熱片材10A,可在某種程度上矯正片材10A之捲繞習性及波狀起伏。The preheating roll 110 conveys the sheet 10A supplied from the supply mechanism (not shown) to the drum mold 120 provided downstream of the conveyance direction MD, and heats and softens the sheet 10A, and the preheating roll 110 is configured to be capable of heating the sheet 10A at a temperature of about 100 °C. By preheating the sheet 10A by the preheating roller 110, the winding habit and undulation of the sheet 10A can be corrected to some extent.

滾筒式模具120於外周具有複數個與所要成形之收納凹部3之尺寸、形狀及間隔相對應之模穴(未圖示),一面藉由旋轉將搬送來之片材10A進行搬送,一面於片材10A真空形成收納凹部3。再者,各模穴連接於真空產生機等。又,滾筒式模具120例如藉由水等冷熱調節介質而於大致20℃至100℃之範圍內維持為固定之溫度。The drum mold 120 has a plurality of cavities (not shown) corresponding to the size, shape, and spacing of the housing recesses 3 to be formed on the outer circumference, and is conveyed while being conveyed by the sheet 10A conveyed by the rotation. The material 10A vacuum forms the housing recess 3 . Further, each cavity is connected to a vacuum generator or the like. Further, the drum mold 120 is maintained at a constant temperature in a range of approximately 20 ° C to 100 ° C by, for example, a cold heat regulating medium such as water.

蓄積部130係使形成有收納凹部3之片材10A滯留而將其一次冷卻,去除真空成形時之熱應力。In the accumulating portion 130, the sheet 10A in which the housing recess 3 is formed is retained and once cooled, and thermal stress during vacuum forming is removed.

壓模140係於片材10A沖壓出進給孔2,視需要於收納凹部3之底面亦沖壓出底孔4。The stamper 140 is formed by punching the feed hole 2 into the sheet 10A, and the bottom hole 4 is also punched out on the bottom surface of the housing recess 3 as necessary.

搬送機構150將片材10A自蓄積部130間歇地搬送至壓模140。The conveyance mechanism 150 intermittently conveys the sheet 10A from the accumulation unit 130 to the stamper 140.

熱風加熱機構160係用於對片材10A吹出熱風並吹至其上者,且具有複數個未圖示之熱風吹出口。該熱風加熱機構160係以熱風吹出口與片材10A相隔大致1 mm至10 mm左右之方式設置。The hot air heating mechanism 160 is for blowing hot air onto the sheet 10A and blowing it thereon, and has a plurality of hot air blowing ports (not shown). The hot air heating mechanism 160 is disposed such that the hot air blowing port is spaced apart from the sheet 10A by approximately 1 mm to 10 mm.

熱風吹出口係沿片材10A之寬度方向,以與形成各行收納凹部3之位置對應之方式設置,其開口形狀可為矩形狀,亦可為圓形狀或橢圓形狀,且以特定之吹出流量向形成各行收納凹部3之位置均勻地吹出熱風。通常,熱風之吹出流量為每單位面積0.125 mL/mm2 以上且3.75 mL/mm2 以下之範圍、或者每一行寬(8 mm)10 L/min以上且60 L/min以下之範圍。The hot air blowing outlet is provided in a width direction of the sheet 10A so as to correspond to a position at which each row of the housing recesses 3 is formed, and the opening shape may be a rectangular shape, a circular shape or an elliptical shape, and a specific flow rate may be blown. The hot air is uniformly blown at a position where each row of the housing recesses 3 is formed. Generally, the blowing flow rate of the hot air is in the range of 0.125 mL/mm 2 or more and 3.75 mL/mm 2 or less per unit area, or in the range of 10 L/min or more and 60 L/min or less per line width (8 mm).

又,熱風之吹出溫度於熱風吹出口之附近,通常為大致300℃以上且700℃以下之範圍,較佳為600℃以下。再者,熱風之吹出溫度亦可根據片材10A之材料熔點而設定。Further, the blowing temperature of the hot air is in the vicinity of the hot air blowing port, and is usually in the range of approximately 300 ° C or more and 700 ° C or less, preferably 600 ° C or less. Further, the blowing temperature of the hot air may be set according to the melting point of the material of the sheet 10A.

並且,成形裝置100除上述之各類機構以外,還具備如下等機構:切斷機構,其將成形為複數行之承載帶10切斷、分離成1行承載帶1;及捲取機構,其將零件P收納至各承載帶1之收納凹部3後捲取至捲盤。Further, the molding apparatus 100 includes, in addition to the above-described various types of mechanisms, a cutting mechanism that cuts and separates the carrier tape 10 formed into a plurality of rows into one row of the carrier tapes 1, and a winding mechanism. The parts P are housed in the housing recess 3 of each carrier tape 1 and then taken up to the reel.

繼而,對承載帶10之成形方法進行說明,該成形方法至少包括:搬送步驟S1,其係將片材10A搬送至滾筒式模具120;及成形步驟S2,其係將被搬送至滾筒式模具120之表面之片材10A吸引而使之真空成形(參照圖4)。Next, a molding method of the carrier tape 10 will be described. The molding method includes at least a conveying step S1 for conveying the sheet 10A to the drum mold 120, and a forming step S2 for conveying to the drum mold 120. The sheet 10A on the surface is attracted and vacuum formed (see Fig. 4).

於搬送步驟S1中,將片材10A以固定之搬送速度搬送至滾筒式模具120。此時,搬送速度為大致1 m/min至15 m/min,較佳為2 m/min至10 m/min。再者,於搬送步驟S1之前步驟中,可藉由預加熱輥110預加熱片材10A。In the conveyance step S1, the sheet 10A is conveyed to the drum mold 120 at a fixed conveyance speed. At this time, the conveying speed is approximately 1 m/min to 15 m/min, preferably 2 m/min to 10 m/min. Further, in the step before the transporting step S1, the sheet 10A may be preheated by the preheating roller 110.

於後續之成形步驟S2中,將片材10A真空吸附於滾筒式模具120之外周,並且一面自熱風加熱機構160吹出熱風而加熱片材10A,一面使其真空成形。此時,滾筒式模具120以至少能夠在片材10A之加熱過程中抽真空之方式而構成。In the subsequent molding step S2, the sheet 10A is vacuum-adsorbed to the outer circumference of the drum mold 120, and the hot air is blown from the hot air heating mechanism 160 to heat the sheet 10A, and vacuum forming is performed. At this time, the drum mold 120 is configured to be capable of evacuating at least during the heating of the sheet 10A.

其後,形成有收納凹部3之承載帶10於蓄積部130進行冷卻,藉由搬送機構150之間歇性搬送,而利用壓模140貫穿設置進給孔2等。然後,形成有進給孔2及收納凹部3之承載帶10藉由切斷機構而被切斷分離。以此方式,單行之承載帶1成形。Thereafter, the carrier tape 10 in which the housing recess 3 is formed is cooled by the storage unit 130, and the feed hole 150 is inserted through the stamper 140 by intermittent transfer of the conveying mechanism 150. Then, the carrier tape 10 in which the feed hole 2 and the housing recess 3 are formed is cut and separated by a cutting mechanism. In this way, a single row of carrier tapes 1 is formed.

此處,藉由實施例1及實施例2,詳細說明利用本發明之實施形態之承載帶10之成形方法所取得之效果。 圖5係利用本發明之實施形態之承載帶1之成形方法形成之承載帶1之圖,(a)係俯視圖,(b)係A-A剖視圖,(c)係B-B剖視圖,圖6係成形性較差之承載帶1A之圖,(a)係俯視圖,(b)係C-C剖視圖,(c)係D-D剖視圖。再者,圖5及圖6中之影線係為了容易地確認開口緣310、310A之區域差而附加者。Here, the effects obtained by the molding method of the carrier tape 10 according to the embodiment of the present invention will be described in detail by way of the first embodiment and the second embodiment. Fig. 5 is a view showing a carrier tape 1 formed by a forming method of a carrier tape 1 according to an embodiment of the present invention, wherein (a) is a plan view, (b) is a cross-sectional view taken along line AA, (c) is a cross-sectional view taken along line BB, and Fig. 6 is a poor formability. The carrier tape 1A is a plan view, (a) is a plan view, (b) is a CC cross-sectional view, and (c) is a DD cross-sectional view. Further, the hatching in FIGS. 5 and 6 is added in order to easily confirm the difference in the area between the opening edges 310 and 310A.

(實施例1) 於本實施例中,自聚碳酸酯製(熔點約250℃)之片材10A中形成包含4行承載帶1之承載帶10,該承載帶1為8 mm寬。再者,收納凹部3之設計尺寸為:開口緣310為1.0 mm×2.5 mm之矩形狀,深度為0.8 mm,搬送方向MD之間隔為2 mm。(Example 1) In the present embodiment, a carrier tape 10 comprising four rows of carrier tapes 1 was formed from a sheet 10A made of polycarbonate (melting point of about 250 ° C), and the carrier tape 1 was 8 mm wide. Further, the housing recess 3 has a design size in which the opening edge 310 has a rectangular shape of 1.0 mm × 2.5 mm, a depth of 0.8 mm, and a distance of the transfer direction MD of 2 mm.

成形裝置100之成形條件係將預加熱輥110之溫度設為100℃。又,將熱風加熱機構160之熱風吹出口設置為與片材10A相隔1.5 mm,將熱風溫度設為600℃。將滾筒式模具120之溫度設為60℃。The molding conditions of the molding apparatus 100 are such that the temperature of the preheating roll 110 is set to 100 °C. Further, the hot air blowing port of the hot air heating mechanism 160 was set to be 1.5 mm apart from the sheet 10A, and the hot air temperature was set to 600 °C. The temperature of the drum mold 120 was set to 60 °C.

並且,使熱風之吹出流量自每一行寬(8 mm)5 L/min變化至65 L/min,並且使搬送速度自1.0 m/min變化至11 m/min。Further, the blowing flow rate of the hot air was changed from 5 L/min per line width (8 mm) to 65 L/min, and the conveying speed was changed from 1.0 m/min to 11 m/min.

承載帶1之成形評價係藉由如下方式進行:針對收納凹部3,沿著搬送方向MD利用顯微鏡觀察於寬度方向中央切斷之剖面中之開口緣310,測定半徑R(mm)。評價基準為:於半徑R為0.3 mm以下之情形時,視為良好(○);於半徑R大於0.3 mm之情形時,或承載帶1斷裂之情形時,視為不良(×)。於表1中表示該等結果。The forming evaluation of the carrier tape 1 is performed by measuring the radius R (mm) in the storage recessed portion 3 by observing the opening edge 310 in the cross section cut in the center in the width direction in the transport direction MD by the microscope. The evaluation criteria are: when the radius R is 0.3 mm or less, it is considered to be good (○); when the radius R is larger than 0.3 mm, or when the carrier tape 1 is broken, it is regarded as defective (×). These results are shown in Table 1.

[表1] [Table 1]

如表1所示,於吹出流量超過60 L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。同樣,於搬送速度未達2 m/min之情形時,亦係片材10A斷裂而無法連續地成形。As shown in Table 1, when the discharge flow rate exceeds 60 L/min, the sheet 10A is in a high temperature state, and there is a case where it is melted, and as a result, the sheet 10A is broken and cannot be continuously formed. Similarly, when the conveying speed is less than 2 m/min, the sheet 10A is broken and cannot be continuously formed.

又,於吹出流量未達10 L/min之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大(參照圖6)。同樣,於搬送速度超過10 m/min之情形時,亦由於片材10A無法以進行追隨之方式延伸,故而開口緣310A之半徑R變大。Further, when the blowing flow rate is less than 10 L/min, since the sheet 10A is not sufficiently heated, it cannot extend in a manner following the cavity of the drum mold 120, so that the radius R of the opening edge 310A of the recess 3A is accommodated. It becomes larger (refer to Figure 6). Similarly, when the conveying speed exceeds 10 m/min, the sheet 10A cannot be extended in a chamfering manner, and the radius R of the opening edge 310A becomes large.

另一方面,於吹出流量為10 L/min至60 L/min,搬送速度為2 m/min以上且10 m/min以下之範圍(若換算成每單位面積,則為0.125 mL/mm2 以上且3.75 mL/mm2 以下),開口緣310之半徑R未變大(參照圖5),獲得較多良好評價(○)。On the other hand, the flow rate is from 10 L/min to 60 L/min, and the conveying speed is in the range of 2 m/min or more and 10 m/min or less (if converted to unit area, it is 0.125 mL/mm 2 or more). Further, 3.75 mL/mm 2 or less), the radius R of the opening edge 310 did not become large (see FIG. 5), and a good evaluation (○) was obtained.

由此,由該表1可知,若不論搬送速度,熱風加熱機構160之吹出流量未達10 L/min或超過60 L/min,則無法獲得良好評價(○)。相反可知,若不論吹出流量,搬送速度未達2 m/min或超過10 m/min,則無法獲得良好評價(○)。又,可知,若搬送速度超過6 m/min,則會產生於低吹出流量下無法獲得良好評價(○)之情形。Therefore, as is clear from the above Table 1, if the blowing flow rate of the hot air heating mechanism 160 is less than 10 L/min or exceeds 60 L/min regardless of the conveying speed, a good evaluation (○) cannot be obtained. On the other hand, it is understood that a good evaluation (○) cannot be obtained if the conveying speed is less than 2 m/min or exceeds 10 m/min regardless of the blowing flow rate. Moreover, it is understood that when the conveying speed exceeds 6 m/min, a good evaluation (○) cannot be obtained at a low blowing flow rate.

繼而,將搬送速度設為6.0 m/min,使熱風之吹出流量自5 L/min變化至65 L/min,使滾筒式模具120之溫度自10℃變化至110℃,測定開口緣310之半徑R(mm),且與上述同樣地進行評價。於表2表示該等結果。Then, the conveying speed was set to 6.0 m/min, the blowing flow rate of the hot air was changed from 5 L/min to 65 L/min, and the temperature of the drum mold 120 was changed from 10 ° C to 110 ° C, and the radius of the opening edge 310 was measured. R (mm) was evaluated in the same manner as above. These results are shown in Table 2.

[表2] [Table 2]

如表2所示,於吹出流量超過60 L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。於吹出流量未達10 L/min之時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。As shown in Table 2, when the discharge flow rate exceeds 60 L/min, the sheet 10A is in a high temperature state, and there is a case where it is melted, and as a result, the sheet 10A is broken and cannot be continuously formed. When the blowing flow rate is less than 10 L/min, since the sheet 10A is not sufficiently heated, it cannot extend so as to follow the cavity of the drum mold 120, so that the radius R of the opening edge 310A of the housing recess 3A becomes large.

又,於滾筒式模具120之加熱溫度超過100℃之情形時,片材10A處於高溫狀態,存在熔融之情況,於自滾筒式模具120脫模時,收納凹部3A大幅度變形而成形。因此,產生捲取不良,而無法連續地成形。又,於滾筒式模具120之加熱溫度未達20℃之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。When the heating temperature of the drum mold 120 exceeds 100 ° C, the sheet 10A is in a high temperature state and is melted. When the drum mold 120 is released from the drum mold 120, the storage recess 3A is largely deformed and molded. Therefore, the winding is poor, and it cannot be continuously formed. Further, when the heating temperature of the drum mold 120 is less than 20 ° C, since the sheet 10A is not sufficiently heated, it cannot be extended to follow the cavity of the drum mold 120, so that the opening edge 310A of the recess 3A is accommodated. The radius R becomes larger.

另一方面,於吹出流量10 L/min至60 L/min(若換算成每單位面積,則為0.2 mL/mm2 以上且1.25 mL/mm2 以下),且滾筒式模具120之加熱溫度為20℃以上且100℃以下之範圍,開口緣310之半徑R未變大,而獲得較多良好評價(○)。On the other hand, at a flow rate of 10 L/min to 60 L/min (0.2 mL/mm 2 or more and 1.25 mL/mm 2 or less in terms of unit area), and the heating temperature of the drum mold 120 is In the range of 20 ° C or more and 100 ° C or less, the radius R of the opening edge 310 did not become large, and a good evaluation (○) was obtained.

由此,由該表2可知:若不論滾筒式模具120之溫度,熱風加熱機構160之吹出流量未達10 L/min(若換算成每單位面積,則為0.2 mL/mm2 )或超過60 L/min(若換算成每單位面積,則為1.25 mL/mm2 ),則無法獲得良好評價(○)。相反可知,若不論吹出流量,滾筒式模具120之溫度未達20℃或超過100℃,則無法獲得良好評價(○)。又,可知,若滾筒式模具120之溫度未達60℃,則會產生於低吹出流量下無法獲得良好評價(○)之情形。Therefore, it can be seen from Table 2 that the blowing flow rate of the hot air heating mechanism 160 is less than 10 L/min (0.2 mL/mm 2 per unit area) or more than 60, regardless of the temperature of the drum mold 120. L/min (if it is converted to 1.25 mL/mm 2 per unit area), a good evaluation (○) cannot be obtained. On the other hand, when the temperature of the drum mold 120 is less than 20 ° C or exceeds 100 ° C regardless of the discharge flow rate, a good evaluation (○) cannot be obtained. Moreover, it is understood that when the temperature of the drum mold 120 is less than 60 ° C, a good evaluation (○) cannot be obtained at a low blowing flow rate.

(實施例2) 於本實施例中,除使用聚苯乙烯製(熔點約240℃)之片材10A代替碳酸酯製之片材10A以外之成形條件設為與實施例1相同。於表3及表4中表示該等結果。(Example 2) In the present Example, the molding conditions other than the sheet 10A made of polystyrene (melting point of about 240 ° C) instead of the sheet 10A made of carbonate were the same as in Example 1. These results are shown in Tables 3 and 4.

[表3] [table 3]

如表3所示,於吹出流量超過60 L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。同樣,於搬送速度未達2 m/min之情形時,亦係片材10A斷裂而無法連續地成形。As shown in Table 3, when the discharge flow rate exceeds 60 L/min, the sheet 10A is in a high temperature state, and there is a case where it is melted, and as a result, the sheet 10A is broken and cannot be continuously formed. Similarly, when the conveying speed is less than 2 m/min, the sheet 10A is broken and cannot be continuously formed.

又,於吹出流量未達10 L/min之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。同樣,於搬送速度超過10 m/min之情形時,亦由於片材10A無法以進行追隨之方式延伸,故而開口緣310A之半徑R變大。Further, when the blowing flow rate is less than 10 L/min, since the sheet 10A is not sufficiently heated, it cannot extend in a manner following the cavity of the drum mold 120, so that the radius R of the opening edge 310A of the recess 3A is accommodated. Become bigger. Similarly, when the conveying speed exceeds 10 m/min, the sheet 10A cannot be extended in a chamfering manner, and the radius R of the opening edge 310A becomes large.

另一方面,於吹出流量為10 L/min至60 L/min且搬送速度為2 m/min以上且10 m/min以下之範圍,開口緣310之半徑R未變大,而獲得良好評價(○)。On the other hand, in the range where the blowing flow rate is from 10 L/min to 60 L/min and the conveying speed is 2 m/min or more and 10 m/min or less, the radius R of the opening edge 310 does not become large, and a good evaluation is obtained ( ○).

由此,由該表3可知:若不論搬送速度,熱風加熱機構160之吹出流量未達10 L/min或超過60 L/min,則無法獲得良好評價(○)。相反可知,若不論吹出流量,搬送速度未達2 m/min或超過10 m/min,則無法獲得良好評價(○)。Therefore, as is clear from Table 3, if the blowing flow rate of the hot air heating mechanism 160 is less than 10 L/min or exceeds 60 L/min regardless of the conveying speed, a good evaluation (○) cannot be obtained. On the other hand, it is understood that a good evaluation (○) cannot be obtained if the conveying speed is less than 2 m/min or exceeds 10 m/min regardless of the blowing flow rate.

又,由表1及表3之對比可知,聚苯乙烯製之片材10A即便於低流量、高速度之區域、或低流量、溫度之區域中,開口緣310之半徑R亦不會變大,相較於聚碳酸酯製之片材10A,成形性良好。Further, from the comparison between Table 1 and Table 3, it is understood that the radius R of the opening edge 310 does not become large even in a region of low flow rate, high speed, or a region of low flow rate and temperature. Compared with the sheet 10A made of polycarbonate, the formability is good.

[表4] [Table 4]

如表4所示,於吹出流量超過60 L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。於吹出流量未達10 L/min之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。As shown in Table 4, when the discharge flow rate exceeds 60 L/min, the sheet 10A is in a high temperature state, and there is a case where it is melted, and as a result, the sheet 10A is broken and cannot be continuously formed. When the blowing flow rate is less than 10 L/min, since the sheet 10A is not sufficiently heated, it cannot be extended in the manner of following the cavity of the drum mold 120, so that the radius R of the opening edge 310A of the housing recess 3A becomes large. .

又,於滾筒式模具120之加熱溫度超過100℃之情形時,片材10A處於高溫狀態,存在熔融之情況,於自滾筒式模具120脫模時,收納凹部3A大幅度變形而成形。因此,產生捲取不良,而無法連續地成形。又,於滾筒式模具120之加熱溫度未達20℃之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。When the heating temperature of the drum mold 120 exceeds 100 ° C, the sheet 10A is in a high temperature state and is melted. When the drum mold 120 is released from the drum mold 120, the storage recess 3A is largely deformed and molded. Therefore, the winding is poor, and it cannot be continuously formed. Further, when the heating temperature of the drum mold 120 is less than 20 ° C, since the sheet 10A is not sufficiently heated, it cannot be extended to follow the cavity of the drum mold 120, so that the opening edge 310A of the recess 3A is accommodated. The radius R becomes larger.

此外,於吹出流量為10 L/min至60 L/min,且滾筒式模具120之加熱溫度為20℃以上且100℃以下之範圍,開口緣310之半徑R未變大,而獲得較多良好評價(○)。Further, in the case where the blowing flow rate is from 10 L/min to 60 L/min, and the heating temperature of the drum mold 120 is in the range of 20 ° C or more and 100 ° C or less, the radius R of the opening edge 310 does not become large, and more excellent is obtained. Evaluation (○).

由此,由該表4可知:若不論滾筒式模具120之溫度,熱風加熱機構160之吹出流量未達10 L/min(若換算成每單位面積,則為0.2 mL/mm2 )或超過60 L/min(若換算成每單位面積,則為1.25 mL/mm2 ),則無法獲得良好評價(○)。相反可知,若不論吹出流量,滾筒式模具120之溫度未達20℃或超過100℃,則無法獲得良好評價(○)。又,可知若滾筒式模具120之溫度未達60℃,則會產生於低吹出流量下無法獲得良好評價(○)之情形。Therefore, it can be seen from Table 4 that the blowing flow rate of the hot air heating mechanism 160 is less than 10 L/min (0.2 mL/mm 2 per unit area) or more than 60, regardless of the temperature of the drum mold 120. L/min (if it is converted to 1.25 mL/mm 2 per unit area), a good evaluation (○) cannot be obtained. On the other hand, when the temperature of the drum mold 120 is less than 20 ° C or exceeds 100 ° C regardless of the discharge flow rate, a good evaluation (○) cannot be obtained. Moreover, it is understood that when the temperature of the drum mold 120 is less than 60 ° C, a good evaluation (○) cannot be obtained at a low blowing flow rate.

又,由表2及表4之對比可知,聚苯乙烯製之片材10A即便於低流量、高速度之區域、或低流量、溫度之區域中,開口緣310之半徑R亦不會變大,相較於聚碳酸酯製之片材10A,成形性良好。Further, as can be seen from the comparison between Table 2 and Table 4, the radius R of the opening edge 310 does not become large even in a region of low flow rate, high speed, or a region of low flow rate and temperature. Compared with the sheet 10A made of polycarbonate, the formability is good.

根據以上之實施例1及實施例2,可謂較佳為將自熱風加熱機構160吹出之熱風之吹出流量設為每一行寬(8 mm)10 L/min以上且60 L/min以下。換言之,較佳為將熱風之吹出流量設為每單位面積0.125 mL/mm2 以上且3.75 mL/mm2 以下。According to the first embodiment and the second embodiment, it is preferable that the flow rate of the hot air blown from the hot air heating means 160 is 10 L/min or more and 60 L/min or less per line width (8 mm). In other words, it is preferable to set the blowing flow rate of the hot air to 0.125 mL/mm 2 or more and 3.75 mL/mm 2 or less per unit area.

又,較佳為將片材10A之搬送速度設為2 m/min以上且10 m/min以下。進而可謂,較佳為將滾筒式模具120之加熱溫度維持為20℃以上且100℃以下之溫度。Moreover, it is preferable to set the conveyance speed of the sheet 10A to 2 m/min or more and 10 m/min or less. Further, it is preferable to maintain the heating temperature of the drum mold 120 at a temperature of 20 ° C or more and 100 ° C or less.

如以上所說明,實施形態之承載帶10之成形方法係成形具有1行以上之進給孔2及收納零件P之收納凹部3之承載帶10之方法,該承載帶10之成形方法包括:搬送步驟S1,其係將片材10A搬送至滾筒式模具120;及成形步驟S2,其係將被搬送至滾筒式模具120之表面之片材10A吸引而使之真空成形;於成形步驟S2中,一面自熱風加熱機構160吹出熱風而加熱片材10A,一面使其真空成形,並且將熱風之吹出流量設為每單位面積0.125 mL/mm2 以上且3.75 mL/mm2 以下。藉此,藉由向利用滾筒式模具120成形中之片材10A(或收納凹部3)壓力噴射熱風,可加熱片材10A而使其軟化以適應模穴,因此可確保收納凹部3之開口緣310之矩形性。換言之,可將收納凹部3之開口緣310抑制為較小之半徑R。As described above, the molding method of the carrier tape 10 of the embodiment is a method of molding the carrier tape 10 having the feed hole 2 of one row or more and the housing recess 3 of the storage part P, and the method of forming the carrier tape 10 includes: conveying Step S1, which conveys the sheet 10A to the drum mold 120; and a forming step S2, which sucks the sheet 10A conveyed to the surface of the drum mold 120 to vacuum-form it; in the forming step S2, While the hot air is blown from the hot air heating mechanism 160 to heat the sheet 10A, the hot air blowing flow rate is set to 0.125 mL/mm 2 or more and 3.75 mL/mm 2 or less per unit area. Thereby, by blowing the hot air to the sheet 10A (or the housing recess 3) formed by the drum mold 120, the sheet 10A can be heated and softened to accommodate the cavity, thereby ensuring the opening edge of the housing recess 3. 310 rectangular. In other words, the opening edge 310 of the housing recess 3 can be suppressed to a smaller radius R.

於實施形態中,將熱風之吹出溫度設為300℃以上且700℃以下。藉此,藉由向利用滾筒式模具120成形中之片材10A(或收納凹部3)壓力噴射熱風,可加熱片材10A而使其軟化。In the embodiment, the hot air blowing temperature is set to 300 ° C or more and 700 ° C or less. Thereby, by blowing the hot air to the sheet 10A (or the housing recess 3) formed by the drum mold 120, the sheet 10A can be heated and softened.

於實施形態中,將熱風之吹出流量設為每一行寬10 L/min以上且60 L/min以下。藉此,可以適當之吹出流量加熱軟化片材10A。In the embodiment, the flow rate of the hot air is set to be 10 L/min or more and 60 L/min or less per line width. Thereby, the flow rate heating softening sheet 10A can be appropriately blown out.

於實施形態中,將片材10A之搬送速度設為2 m/min以上且10 m/min以下。藉此,可以適當之吹出流量(加熱熱量)加熱軟化片材10A。In the embodiment, the conveying speed of the sheet 10A is set to 2 m/min or more and 10 m/min or less. Thereby, the flow rate (heating heat) can be appropriately blown to heat the softened sheet 10A.

於實施形態中,將滾筒式模具120維持為20℃以上且100℃以下之溫度。藉此,可以適當之加熱熱量加熱軟化片材10A。In the embodiment, the drum mold 120 is maintained at a temperature of 20 ° C or more and 100 ° C or less. Thereby, the sheet 10A can be softened by heating with appropriate heat.

(變化例) 於上述實施形態中,熱風加熱機構160之熱風吹出口係以對應於各行之方式設置有複數個,但亦可僅設置1個對應於4行寬度之寬幅之狹縫開口。(Variation) In the above embodiment, the hot air blowing means of the hot air heating means 160 is provided in plural numbers corresponding to each row, but only one slit opening corresponding to a width of four rows may be provided.

於上述實施形態中,滾筒式模具120以能夠至少在片材10A之加熱中抽真空之方式構成,但亦可以在即將加熱之前進行抽真空或加熱結束後進行抽真空之方式構成。In the above embodiment, the drum mold 120 is configured to be capable of being evacuated at least in the heating of the sheet 10A. However, it may be configured such that the vacuum is applied immediately before the heating or the heating is completed.

以上詳細地敍述了本發明之較佳實施形態,但本發明並不限定於上述實施形態,可於申請專利範圍所記載之本發明之主旨之範圍內進行各種變化、變更。The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the above-described embodiments, and various changes and modifications can be made within the scope of the invention as described in the appended claims.

1‧‧‧承載帶1‧‧‧ Carrying belt

1A‧‧‧承載帶1A‧‧‧ carrying belt

2‧‧‧進給孔2‧‧‧ Feed hole

3‧‧‧收納凹部3‧‧‧ Storage recess

3A‧‧‧收納凹部3A‧‧‧ Storage recess

4‧‧‧檢查孔4‧‧‧Check hole

10‧‧‧承載帶10‧‧‧ Carrying belt

10A‧‧‧片材10A‧‧‧Sheet

100‧‧‧成形裝置100‧‧‧Forming device

110‧‧‧預加熱輥110‧‧‧Preheating roller

120‧‧‧滾筒式模具120‧‧‧Roller mould

130‧‧‧蓄積部130‧‧‧Accumulation Department

140‧‧‧壓模140‧‧‧Molding

150‧‧‧搬送機構150‧‧‧Transportation agency

160‧‧‧熱風加熱機構160‧‧‧hot air heating mechanism

310‧‧‧開口緣310‧‧‧Open edge

310A‧‧‧開口緣310A‧‧‧ Opening edge

MD‧‧‧搬送方向(長度方向)MD‧‧‧Transport direction (length direction)

P‧‧‧零件P‧‧‧ parts

S1‧‧‧搬送步驟S1‧‧‧Transfer steps

S2‧‧‧成形步驟S2‧‧‧ forming step

圖1係承載帶之立體圖。 圖2係表示複數行承載帶之俯視圖。 圖3係表示用於本發明之實施形態之承載帶之成形方法的承載帶之成形裝置之概略圖。 圖4係表示本發明之實施形態之承載帶之成形方法之流程圖。 圖5係利用本發明之實施形態之承載帶之成形方法所形成之承載帶之圖,(a)係俯視圖,(b)係A-A剖視圖,(c)係B-B剖視圖。 圖6係成形性較差之承載帶之圖,(a)係俯視圖,(b)係C-C剖視圖,(c)係D-D剖視圖。Figure 1 is a perspective view of a carrier tape. Figure 2 is a plan view showing a plurality of rows of carrier tapes. Fig. 3 is a schematic view showing a molding apparatus for a carrier tape used in a method of forming a carrier tape according to an embodiment of the present invention. Fig. 4 is a flow chart showing a method of forming a carrier tape according to an embodiment of the present invention. Fig. 5 is a view showing a carrier tape formed by a method for forming a carrier tape according to an embodiment of the present invention, wherein (a) is a plan view, (b) is a cross-sectional view taken along line A-A, and (c) is a cross-sectional view taken along line B-B. Fig. 6 is a view showing a carrier tape having poor formability, (a) is a plan view, (b) is a C-C cross-sectional view, and (c) is a D-D cross-sectional view.

Claims (7)

一種承載帶之成形方法,該承載帶具有1行以上之收納零件之收納凹部,該承載帶之成形方法之特徵在於包括: 搬送步驟,其係將片材搬送至滾筒式模具;及 成形步驟,其係將被搬送至上述滾筒式模具之表面之上述片材吸引而使之真空成形; 於上述成形步驟中,一面自熱風加熱機構吹出熱風而加熱上述片材,一面使其真空成形,並且將上述熱風之吹出流量設為每單位面積0.125 mL/mm2 以上且3.75 mL/mm2 以下。A method for forming a carrier tape, the carrier tape having a storage recess of one or more storage parts, the method of forming the carrier tape comprising: a transporting step of conveying a sheet to a drum mold; and a forming step, The sheet is conveyed to the surface of the drum mold and sucked and vacuum-molded; in the forming step, the sheet is heated by blowing hot air from the hot air heating mechanism, and the sheet is vacuum formed. The blowing flow rate of the hot air is set to be 0.125 mL/mm 2 or more and 3.75 mL/mm 2 or less per unit area. 如請求項1之承載帶之成形方法,其中 將上述熱風之吹出溫度設為300℃以上且700℃以下。The method of forming a carrier tape according to claim 1, wherein the hot air blowing temperature is set to 300 ° C or more and 700 ° C or less. 如請求項1之承載帶之成形方法,其中 將上述熱風之吹出流量設為每一行寬10 L/min以上且60 L/min以下。The method of forming a carrier tape according to claim 1, wherein the flow rate of the hot air is set to be 10 L/min or more and 60 L/min or less per line width. 如請求項2之承載帶之成形方法,其中 將上述熱風之吹出流量設為每一行寬10 L/min以上且60 L/min以下。The method of forming a carrier tape according to claim 2, wherein the flow rate of the hot air is set to be 10 L/min or more and 60 L/min or less per line width. 如請求項1至4中任一項之承載帶之成形方法,其中 將上述片材之搬送速度設為2 m/min以上且10 m/min以下。The method of forming a carrier tape according to any one of claims 1 to 4, wherein the sheet conveying speed is 2 m/min or more and 10 m/min or less. 如請求項1至4中任一項之承載帶之成形方法,其中 將上述滾筒式模具維持為20℃以上且100℃以下之溫度。The method of forming a carrier tape according to any one of claims 1 to 4, wherein the drum mold is maintained at a temperature of 20 ° C or more and 100 ° C or less. 如請求項5之承載帶之成形方法,其中 將上述滾筒式模具維持為20℃以上且100℃以下之溫度。The method of forming a carrier tape according to claim 5, wherein the drum mold is maintained at a temperature of 20 ° C or more and 100 ° C or less.
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JP3388698B2 (en) * 1997-11-21 2003-03-24 信越ポリマー株式会社 Manufacturing method of carrier tape
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