1237593 五、發明說明（1) 成 的 帶 載 之 件 元 子 電 承 造 製 來 用 vUtul 蝻種 領 一 術於。 技關置 之係裝 屬明其 所發及 明本法 發 方 【先前技術】 載帶是一種電子產業領域用來盛裝小型電子元件的連 續條帶式容器，參考第一圖所顯示，其大多係利用PS、PC 或其它塑膠材料，以一體押出成型所形成之連續式條帶結 構，該載帶（2 )上等距離地分佈複數個凹部（2 1 )，每一凹 部（2 1 )的底面及側邊均設有洞孔（2 2 )，且電子元件可以被_ 放置於凹部（2 1 )中，然後利用膠帶黏貼於載帶（2 )上遮住 各個凹部（2 1 )以防止該電子元件掉出。 包裝了電子元件的載帶（2 )被送到電子工廠進行插件 製程時，係利用機械設備一邊撕開膠帶，一邊利用設在機 械手臂的吸盤一個一個地吸取載帶凹部内的電子元件，再 將電子元件插到電路板上。 習知上係利用第二圖所示的模頭（1 )與輪狀成型模（3 ) 所組成的機構來製造載帶（2 )者。參考第三圖與第四圖所 示，所述成型模（3 )模座（3 2 ’）的外輪面設有複數個等距離 排列的凹模部（3 4 )，且每一凹模部（3 4 )的底面相對兩角端 @ 分別設有氣孔（3 5 ) ◦因此，當融熔成液態的PS、PC或其它 塑膠材料經由模頭（1 )流出而彼覆於輪狀成型模（3 )的輪面 以形成薄膜狀之載帶（2 )後，再利用抽風設備透過氣孔 (3 5 )將成型模（3 )與載帶（2 )間的空氣抽出，進而將載帶1237593 V. Description of the invention (1) The built-in component electronic bearing system is used to obtain vUtul technology. The installation of the technology belongs to the issuer and the publisher of the law. [Previous technology] Carrier tape is a continuous strip container used to hold small electronic components in the electronics industry. Refer to the first figure, most of which are It is a continuous strip structure formed by integral extrusion molding using PS, PC or other plastic materials. The carrier tape (2) distributes a plurality of recesses (2 1) at an equal distance. Each recess (2 1) There are holes (2 2) on the bottom and sides, and the electronic components can be placed in the recesses (2 1), and then taped to the carrier tape (2) to cover each recess (2 1) to prevent The electronic component falls out. When the carrier tape (2) packed with electronic components is sent to the electronics factory for the plug-in process, the electronic components in the recessed part of the carrier tape are sucked one by one by the mechanical equipment while tearing off the tape, and then sucking the electronic components one by one using the suction cup provided on the robot arm, and then Plug the electronic components onto the circuit board. The conventional system uses a mechanism composed of a die head (1) and a wheel-shaped molding die (3) shown in the second figure to manufacture a carrier tape (2). Referring to the third and fourth figures, the outer surface of the die seat (3 2 ′) of the forming die (3) is provided with a plurality of equally spaced concave die portions (3 4), and each concave die portion (3 4) The bottom of the bottom surface is opposite to the two corner ends @ with air holes (3 5). Therefore, when the molten PS, PC or other plastic materials flow out through the die head (1), they are covered on the wheel-shaped forming mold. (3) After the wheel surface is formed into a film-like carrier tape (2), the air between the forming die (3) and the carrier tape (2) is extracted through the air hole (3 5) by using a ventilation device, and the carrier tape is further extracted.
1237593 五、發明說明（2) (2 )的内底面貼附於成型模（3 )的外輪面以完成載帶（2 )的 成型。 參考第五圖所顯示，係以先前技術所成型後的載帶， 由於載帶（2 )成型時，載帶（2 )的凹面（2 1 )底部係受到吸力 而貼附於成型模（3 )的外輪面，因此底面會呈現平整形 態，但是載帶（2 )的上表面則因為不受到吸力作用，以致 於較為粗糙，甚至融熔的塑膠材料内含雜質時也會因為載 帶（2 )外部表面沒有作用力而會往上方突出，造成載帶（2 ) 頂部膠膜（2 4 )的貼合狀況不佳。 【發明内容】 《所欲解決之技術問題》 ，本發明所欲解決之技術問題，係習知的載帶成型機構 所成型後的載帶表面較為粗縫’粗彳造的載帶表面^會造成 膠膜封合力的不均勻，使得封合後的載帶膠膜脫落，而造 成後續製程無法完成，且成型之載帶口袋厚度無法一致， 對電子元件所提供之包裝保護較為脆弱。另外，習用技術 係在載帶成型後另行沖孔作業，如此則會造成精確度的降 低。因此，本發明基於前述習知之載帶結構或其製造方法 所存在的缺失加以改良。 《解決問題之技術手段》 本發明用以解決前述習知缺失的技術手段，其係包括 有模頭與成型模，其特徵在於：該成型模係包括一第一模1237593 V. Description of the invention (2) (2) The inner bottom surface is attached to the outer wheel surface of the forming die (3) to complete the forming of the carrier tape (2). As shown in the fifth figure, the carrier tape formed by the prior art is used. When the carrier tape (2) is formed, the bottom of the concave surface (2 1) of the carrier tape (2) is attracted to the mold (3). ) Of the outer wheel surface, so the bottom surface will appear flat, but the upper surface of the carrier tape (2) is rough because it is not attracted. Even the molten plastic material contains impurities due to the carrier tape (2). ) There is no force on the external surface and it will protrude upward, resulting in poor bonding of the top film (2 4) of the carrier tape (2). [Summary] "Technical problem to be solved", the technical problem to be solved by the present invention is that the surface of the carrier tape formed by the conventional carrier tape forming mechanism is relatively rough. The surface of the carrier tape is rough. As a result, the sealing force of the adhesive film is non-uniform, which causes the sealed adhesive tape to fall off, resulting in subsequent processes that cannot be completed, and the thickness of the formed carrier tape pockets cannot be consistent, which is fragile for the packaging protection provided by electronic components. In addition, the conventional technique is to punch holes separately after the carrier tape is formed, which will reduce the accuracy. Therefore, the present invention is improved based on the existing defects in the conventional carrier tape structure or the manufacturing method thereof. "Technical means for solving the problem" The present invention is a technical means for solving the lack of the conventional knowledge, which includes a die head and a forming die, and is characterized in that the forming die system includes a first die
1237593 五、發明說明（3) 座及一第二模座，該第一模座係底面設有複數個等距離排 列的凸模部之座體；該第二模座係底面設有複數個等距離 排列的凹模部之座體，該第一模座中的各個凸模部分別對 應該第二模座中的各個凹模部而構成加工該載帶之成型 區。 《對於先前技術之效果》 和先前技術相較，本發明之機構所成型後的載帶上、 下表面皆比先前技術所製成的載帶平整，且載帶之壁面與 底面都為均一之厚度，使得壁面強度增強，更能保護内部n 之電子元件，而增進電子元件包裝保護的可靠性，且封合 面平整，也不會產生封合力不均勻而脫落的缺失。 另外，本發明之係在載帶成型製程中同步完成沖孔作 業，因而可提升其精確度，且由於電子元件的尺寸日益細 小且精密，載帶上面被用來包裝電子元件的部位需要更精 密的要求，而本發明之機構所製成的載帶品質可以較習知 者更佳。 為使熟悉該項技藝人士瞭解本發明之目的、特徵及功 效，茲藉由下述具體實施例，並配合所附之圖式，對本發 明詳加說明如后。 € 【實施方式】 第六及第七圖係顯示本發明之載帶成型方法所使用的 載帶成型裝置，該載帶成型裝置主要係一押出機透過一模1237593 V. Description of the invention (3) A base and a second die base, the bottom of the first die base is provided with a plurality of equally spaced convex die portions; the bottom of the second die base is provided with a plurality of etc. The seat bodies of the concave die portions arranged at a distance, and each of the convex die portions in the first die seat respectively correspond to each of the concave die portions in the second die seat to constitute a molding area for processing the carrier tape. "Effects on the prior art" Compared with the prior art, the upper and lower surfaces of the carrier tape formed by the mechanism of the present invention are flatter than the carrier tape made by the prior art, and the wall surface and the bottom surface of the carrier tape are uniform. The thickness increases the strength of the wall surface, can better protect the electronic components inside n, and improves the reliability of the packaging protection of the electronic components, and the sealing surface is flat, and the loss of uneven sealing force will not occur. In addition, the system of the present invention completes the punching operation synchronously in the carrier tape forming process, so the accuracy can be improved, and because the size of electronic components is becoming smaller and more precise, the parts on the carrier tape used for packaging electronic components need to be more precise. The quality of the carrier tape made by the mechanism of the present invention can be better than that of a known person. In order to make those skilled in the art understand the purpose, features, and functions of the present invention, the following specific embodiments and the accompanying drawings are used to explain the present invention in detail as follows. € [Embodiment] The sixth and seventh figures show the carrier tape forming device used in the carrier tape forming method of the present invention. The carrier tape forming device is mainly an extruder through a die
第7頁 1237593 五、發明說明（4) 頭（1 )輸出待成型之載帶（2 )，並透過一成型模（3 )而達到 該載帶（2 )之成型者◦其中，該成型模（3 )係包括一第一模 座（3 1 )及一第二模座（3 2 )。該第一模座（3 1 )係一座體，其 底面設有複數個等距離排列的凸模部（3 3 )，且每一凸模部 (3 3 )的底面相對兩角端分別設有氣孔（3 5 );該第二模座 (3 2 )係一座體，其底面設有複數個等距離排列的凹模部 (34)，且每一凹模部（3 4 )的内底面相對兩角端分別設有氣 孔（3 5 )。因此，該成型模（3 )之第一模座（3 1 )中的各個凸 模部（3 3 )分別對應該中的各個凹模部（3 4 )，用以構成加工 該載帶（2 )之成型區（3 6 )。 φ 前述之成型模（3 )在加工過程中，可與模頭（1 )出料速 度配合，第一模座（3 1 )及第二模座（3 2 )會夾合待成型之載 帶（2 )，並沿著成型之載帶（2 )輸送的方向移動，直到載帶 (2 )成型完成，第一模座（3 1 )及第二模座（3 2 )釋放載帶 (2 )，成型模（3 )回到初始位置。因此，可使得模頭（1 )出 料及載帶（2)成型係連續作業者。 參考第八圖所顯示，基於前述本發明之載帶成型裝 置，其載帶成型方法之步驟為：步驟1 0 0，透過押出機之 模頭（1 )將融熔之PS、PC或其它塑膠材料，擠壓出而彼覆 於該成型模（3 )形成該載帶（2 );步驟2 0 0，利用該成型模 · (3 )之第一模座（3 1 )的各個凸模部（3 3 )及第二模座（3 2 )的 各個凹模部（3 4 )壓合載帶（2 )，參考第七及第八圖所顯 示，而該載帶（2 )會貼附於該成型模（3 )之第一模座（3 1 )及 第二模座（3 2 )間，並等距形成數個凹部（2 1 )，同時在該載Page 7 1237593 V. Description of the invention (4) The head (1) outputs the carrier tape (2) to be formed, and reaches the former of the carrier tape (2) through a forming die (3). Among them, the forming die (3) The system includes a first mold base (3 1) and a second mold base (3 2). The first mold base (3 1) is a single body, and the bottom surface is provided with a plurality of equally spaced convex mold portions (3 3), and the bottom surfaces of each convex mold portion (3 3) are respectively provided with opposite corner ends. Air holes (3 5); the second mold base (3 2) is a body, the bottom surface of which is provided with a plurality of equally spaced concave mold parts (34), and the inner bottom surface of each concave mold part (3 4) is opposite Air holes (3 5) are provided at the two corner ends, respectively. Therefore, each of the male die portions (3 3) in the first die base (3 1) of the forming die (3) corresponds to each of the female die portions (3 4) in the corresponding one, so as to constitute and process the carrier tape (2). ) Of the forming area (3 6). φ The aforementioned forming die (3) can be matched with the discharging speed of the die head (1) during processing. The first die holder (3 1) and the second die holder (3 2) will clamp the carrier tape to be formed. (2), and move along the conveying direction of the formed carrier tape (2) until the carrier tape (2) is formed, and the first mold base (3 1) and the second mold base (3 2) release the carrier belt (2) ), The forming die (3) returns to the initial position. Therefore, the die (1) can be discharged and the carrier tape (2) can be formed continuously. Referring to the eighth figure, the carrier tape forming method based on the foregoing invention, the steps of the carrier tape forming method are as follows: Step 100, the melted PS, PC, or other plastic is passed through the die head (1) of the extruder. Material, extruded and covered with the forming die (3) to form the carrier tape (2); step 2 0, using each forming part of the first die base (3 1) of the forming die (3) (3 3) and each die part (3 4) of the second mold base (3 2) press the carrier tape (2), as shown in the seventh and eighth figures, and the carrier tape (2) will be attached Between the first die base (3 1) and the second die base (3 2) of the forming die (3), a plurality of concave portions (2 1) are formed at an equal distance, and at the same time in the carrier
第8頁 1237593 五、發明說明（5) / ο \，j, 驟Qnn的形成貫穿之洞孔（22)，達到載帶（2)的成型，·步 ( 评欲成型區（3 6 )之各個凸模部（3 3 )及各個凹模部 r N \各個氣孔（3 5 )的負壓狀態，並使得成型之載帶 並輸脫送離該成型模（3)中的第一模座（31)及第二模座（32)， r 9 ^达至下一程序；步驟4 0 0，將形成之載帶（2 )依其凹部 5⑽ 、 裁切成條狀，如第一圖所顯示者；步驟 用。’將裁切後的載帶（2 )收集成捲，以提供後續步驟使 之承F過載帶（2)收集成捲後，可提供電子元件（23) (21)ί丄別Ϊ驟係包括：步驟6〇〇,在載帶（2)之各個凹部 貼覆封^ 2 Γ入電子元件（23);步驟7 0 0,利用膠膜（24) 貼义J個已裝有電子元件（23)之凹部⑵)開口。 過該成Ϊ模的可第經—過戊广(35)的抽氣程序’而透 合載=⑴，使得載帶（H1)及第二模座（32)直接壓 出料速度配合中第^型杈（3)在加―工過程中，可與模頭（1) 型之載帶（2)，並^^座，（31)及第二模座（32)會夾合待成 到載帶（2)成型完:者”型之載帶（2)輸送的方向移動’直 載帶⑴，成型：二(Γ及第二… Q)出料及載帶r s Γ 因此，可使得模頭 以本發明之型係連續作業者。 示，*於塑膠材料:模後的載帶係如第九圖所 上下表面係直接貼附於成型模（2)的第〜各 1237593 五、發明說明（6) 模座（3 1 )及第二模座（3 2 )之間，因此其上、下表面會呈現 平整形態，且其角度與尺寸更為精準，口袋厚度均一，並 使得該載帶（2 )與覆蓋之膠膜（2 4 )間可以獲得良好的封合 力，而不致造成膠膜（2 4 )脫落鬆開，使得電子元件（2 3 )掉 出。 參考第十圖所顯示，前述供給融熔材料的模頭（1 )與 進行載帶成型的成型模（3 )之間，可至少增設一輪狀之輔 助滾輪（4 )，該輔助滾輪（4 )係具有高溫者，可用以提供一 緩衝區，以等待該成型模（3 )載帶成型週期所需的時間。 另外，可至少增設一輪狀之帶動滾輪（5 )，該帶動滾輪（5 ) _ 係提供帶動完成成型作業後的載帶（2 )，藉以輔助輸送該 載帶（2)。 因此，在前述載帶成型之步驟中，押出機之模頭（1 ) 擠壓出的融溶材料，係先披覆於該輔助滾輪（4 )，使得可 維持融熔材料之加工溫度，再輸送至該成型模（3 )中，以 進行載帶（2)的成型作業。再者，完成成型作業後的載帶 (2 )，會受到該帶動滚輪（5 )的牽引而輸送至·後段作業程序 中 〇 以上所述者僅為用以解釋本發明之較佳實施例，並非 企圖據以對本發明作任何形式上之限制，是以，凡有在相 _ 同之發明精神下所作有關本發明之任何修飾或變更，皆仍 應包括在本發明意圖保護之範疇。Page 8 1237593 V. Description of the invention (5) / ο, j, Step Qnn is formed through the hole (22) to achieve the formation of the carrier tape (2), step (Evaluation of the molding area (3 6)) The negative pressure state of each male die part (3 3) and each female die part r N \ each air hole (3 5), so that the formed carrier tape is conveyed away from the first die seat in the forming die (3) (31) and the second mold base (32), r 9 ^ to the next procedure; step 4 0 0, the formed carrier tape (2) is cut into strips according to the recess 5⑽, as shown in the first figure Displayer; for step. 'Collect the trimmed carrier tape (2) into a roll to provide subsequent steps to collect the overload tape (2) into a roll, and provide electronic components (23) (21) ί丄 Do not include the following steps: Step 600, covering and sealing ^ 2 electronic components (23) in each recess of the carrier tape (2); Step 7 0, using the adhesive film (24) to paste J The recess ⑵) containing the electronic component (23) is opened. After passing through the process of being able to pass through the mold-exhaust program of Wu Guang (35) ', the penetration load = ⑴, so that the carrier tape (H1) and the second mold base (32) are directly pressed to match the speed of the middle section. The ^ type fork (3) can be combined with the carrier tape (2) of the die head (1) and the ^^ seat during the processing process, and the (31) and the second die seat (32) will be clamped until the The carrier tape (2) is formed: the carrier tape (2) of the type is moved in the direction of conveyance 'straight carrier tape ⑴, forming: two (Γ and second ... Q) discharge and carrier tape rs Γ Therefore, the die head can be made According to the model of the present invention, continuous operators are shown. * In plastic materials: the carrier tape after the mold is directly attached to the molding die (2) as shown in Figure 9 above and below. Each of 1237593 5. Description of the invention ( 6) Between the mold base (3 1) and the second mold base (3 2), the upper and lower surfaces will be flat, and the angle and size will be more accurate, the thickness of the pockets will be uniform, and the carrier tape ( 2) A good sealing force can be obtained with the covering film (2 4) without causing the film (2 4) to fall off and loosen, so that the electronic component (2 3) falls out. As shown in the tenth figure, the foregoing Supply of molten material At least one wheel-shaped auxiliary roller (4) can be added between the die head (1) of the material and the forming die (3) for carrier tape forming. The auxiliary roller (4) has a high temperature and can be used to provide a buffer. Area to wait for the time required for the molding die (3) to carry the belt molding cycle. In addition, at least one wheel-shaped driving roller (5) can be added. The driving roller (5) _ The belt (2) is used to assist in conveying the carrier tape (2). Therefore, in the aforementioned step of forming the carrier tape, the molten material extruded from the die (1) of the extruder is first covered on the auxiliary roller (4) so that the processing temperature of the molten material can be maintained, and then transferred to the forming die (3) to perform the forming operation of the carrier tape (2). Furthermore, the carrier tape (2) after completing the forming operation, It will be dragged by the driving roller (5) to be transported to the rear operation procedure. The above is only for explaining the preferred embodiment of the present invention, and it is not intended to limit the present invention in any form. Therefore, anyone who makes the invention in the same spirit Any modification or change, are still to be included in the scope of protection of the purpose of the invention.
第10頁 1237593 圖式簡單說明 圖 體 立 構 結 的 帶 β JJ· 之 件 元 子 ^¾ ^\B 置 放 3來 明用 說示 單顯 簡為 式圖 圖一 Γ第 面 〇 平 圖 部 意 局 示 之 面 帶 平 載 之 出 帶 型 載。成 成圖膜 形體膠 模立將 型之模 成模型 合型成 配成的 頭知知 模習習 示示示 顯顯顯 為為為 圖圖圖二三四 第第第 糙 粗 為 面 上 帶 β 之 型 成 所 模 型 成 的 知 習 用 rnj 示 顯 。 為 圖圖 視五 剖第 視 面 平 。之 圖帶 視載 剖成 面形 平模 部型 局成 之合 帶配 膠頭 貼模 黏明 面發 上本 帶示 載顯 在為 並圖 ，六 面第 平 部 局 之 帶 β 43· 為 型 成 膜 膠 將 模 型 成 的 明 發 本 示 顯 為 圖 〇 七 圖第 子 裝 填 帶 〇 4β1 圖之 程型 流成 之所 法模 方型 5L成 成的 帶明 載發 明本 發用 本利 示示 。顯顯 圖為為 視圖圖 剖八九 面第第 平 部 局 之 件 元 示。 顯圖 為視 圖面 十平 第之 例 施 實 1 另 帶 JJI 成 形 模 型 成 合 配 。頭 圖模 視明 剖發 面本 明 說 虎 符 件 元 4 頭帶部孔 模載凹洞Page 1235759 The diagram briefly illustrates the body structure with β JJ · in the figure body. ^ ¾ ^ \ B Place 3 to show the use of a single display to simplify the diagram. Figure 1 The intentional display shows a flat load and a belt load. The figure shows the shape of the film, the plastic mold, the model, the model, the model, and the combination of the head and the model. The display shows that it is the first rough surface with β in the figure. The knowledge of the model is shown by rnj. For the figure, the first and fifth planes are flat. The picture tape is cut into a flat shape, and the flat tape is formed. The tape is matched with a rubber head, and the sticky surface is posted on the tape. The tape shows the load. The tape on the six sides of the flat plate is β 43 ·. The film-forming glue shows the model's Mingfa display as Figure 007. The sub-loading tape 〇4β1. The process of the flow of the model is formed by the method of 5L. The display diagram is a diagram showing the eighth and ninth plane sections of the view. The picture shown is the example of the ten-level view of the drawing. Implementation 1 In addition, the JJI forming model is used for combination. The head model is clearly cut and the face book is said to be a tiger symbol. Element 4 Headband hole Moulded cavity
第11頁 1237593__- 圖式簡單說明 電子元件（2 3 ) 膠膜（24) 成型模（3 ) 第一模座（3 1 ) 第二模座（3 2 ) 模座（3 2 ’） 凸模部（3 3 ) 凹模部（3 4 ) 氣孔（3 5 ) 成型區（36) · 輔助滾輪（4 )Page 111237593 __- Schematic description of electronic components (2 3) Film (24) Mold (3) First mold base (3 1) Second mold base (3 2) mold base (3 2 ') convex mold (3 3) Die part (3 4) Air hole (3 5) Molding area (36) · Auxiliary roller (4)
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