JP5225609B2 - Compression molding equipment - Google Patents

Description

  The present invention relates to a compression molding apparatus that performs resin sealing by supplying and clamping a workpiece and a resin material on which a semiconductor chip is mounted on a substrate to a mold.

  For example, in transfer molding, in addition to a mold clamping drive source (such as an electric motor), a dedicated drive source (such as an electric motor) for driving a resin injection plunger is provided. For this reason, since a two-axis vertical movement mechanism and a control mechanism of the press and the plunger are required, the apparatus configuration is complicated.

Further, as the package portion is reduced in size and thickness, a compression molding apparatus is used in order to reduce the flow of resin and prevent the generation of useless scrap. In this compression molding apparatus, a semiconductor chip is molded by measuring a workpiece mounted on a circuit board and a resin material corresponding to the cavity recess, supplying the mold to a mold, and clamping (see Patent Document 1).
JP 2007-5675 A

  However, it is troublesome to measure the amount of resin according to the cavity capacity for each product, and if a small size cavity or matrix arrangement is used, it becomes difficult to supply the resin material to the workpiece or mold. For this reason, in order to eliminate the unfilled region of the resin material, it is necessary to provide a dummy cavity that is formed by supplying a resin material slightly larger than the cavity capacity and overflowing from the cavity recess. Moreover, in the conventional compression molding apparatus, the plunger position is standardized and the flexibility of the mold layout is impaired. Therefore, it is necessary to use a dedicated die that matches the size of the workpiece (substrate) and the resin sealing area.

  An object of the present invention is to provide a compression molding apparatus that solves the above-mentioned problems of the background art, can perform resin sealing by freely changing the mold layout according to the product, and has a simplified apparatus configuration. It is in.

In order to achieve the above object, the present invention comprises the following arrangement.
That is, it is a compression molding apparatus that performs resin sealing by supplying and clamping a work and a resin material on which a semiconductor chip is mounted on a substrate to a mold, and is supported by one of the press bases of the mold Of the plunger block that presses the resin block and the cavity block in which the cavity is formed, at least the cavity block is floatingly supported by a coil spring , and the workpiece is supported on the other press base side facing the plunger block or plunger block. The resin material exceeding at least the cavity capacity is supplied to the part facing the resin, and the plunger block presses the resin material while the coil block is pressed and contracted after the cavity block presses the workpiece by the clamping operation of the mold, so that the resin material Plan Only mold clamping force pressing by acting through Yaburokku, filled between the workpiece and the counter mold runner is formed in the cavity block which gate to flow the resin material into the cavities of the cavity block package portion, the molded article runners The gate and the molded product cull are integrally formed.
Further, the plunger block is characterized in that it is floatingly supported on the press base by a coil spring.
Further, the plunger block is fixedly supported on the press base, and a communication runner is formed on the resin pressing surface to communicate the mold cavities.
In addition, a circular plunger is movably inserted into a through hole provided in the plunger block, and a mold cull is engraved around the through hole.
In addition, a release film is stretched between the parting surfaces of the cavity block and the plunger block.

If the compression molding apparatus according to the present invention is used, the cavity block in which the cavity recess is formed is floating supported on the press base, so that the layout can be easily changed according to the resin sealing region of the product. The
Also, a resin material exceeding at least the cavity capacity is supplied onto the plunger block or the workpiece facing the plunger block, and only the mold clamping force is applied to the resin material by the plunger block, and the resin material flows on the workpiece. Then, since the cavity concave portion of the cavity block is filled, the drive source can be omitted and the apparatus configuration and the mold configuration can be simplified. In addition, since accurate measurement of the resin material is not required and the resin sealing can be performed if a resin material exceeding the cavity capacity is supplied, the molding process can be shortened and the resin material is not filled in the cavity recess. I don't have to.
The cavity block is floatingly supported on the press base by the first coil spring. When the plunger block presses the resin material after the cavity block presses the workpiece, the resin sealing can be performed without generating the resin flush. it can.
In addition, if the plunger block is fixedly supported by the press base and a communication runner is formed on the resin pressing surface to communicate the mold cavities, the resin speed filled in the plurality of cavity cavities will differ, and the resin pressure Even if a variation occurs, the communication runner can absorb the variation in the resin pressure and seal the resin. In addition, when a circular plunger is formed on the end face of the plunger block and a mold cull is engraved (engraved) around it, the mold cull can be used as a resin amount adjusting unit and a plurality of cavity recesses can be used. Variations in resin pressure filled in can be absorbed.
Further, when a release film is stretched on the parting surfaces of the cavity block and the plunger block, the mold does not become dirty, and the maintenance can be simplified.

Hereinafter, a preferred embodiment of a compression molding apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
The compression molding apparatus molds a workpiece W in which a plurality of semiconductor chips 1 are mounted on a substrate (resin substrate, lead frame, etc.) 2 and a resin material (including liquid resin, granular resin, powder resin, solid resin, etc.) 3 Molding is performed by feeding to a mold and clamping.

Hereinafter, a specific configuration of the compression molding apparatus will be described as an example.
[First embodiment]
In FIG. 1A, the upper die 4 has a cavity block 7 suspended and supported on an upper die press base 5 via a first coil spring 6. The cavity block 7 is a single mold block provided with a plurality of through holes in the center. In FIG. 1B, an air vent 8 a communicating with the outer edge portion of the cavity recess 8 is formed on the clamp surface of the cavity block 7.

  In FIG. 1A, the plunger block 10 is supported on the upper die base 5 via a second coil spring 9. The plunger block 10 is provided to be movable up and down through a through hole formed in the cavity block 7. A mold runner gate 11 is formed between the cavity recess 8 of the cavity block 7 and the plunger block 10 (see FIG. 1B). The lower die 12 is provided with a support plate 14 for supporting the workpiece W on the lower die press base 13.

  The workpiece 3 is supplied with the resin material 3 exceeding at least all the cavity capacities. In the present embodiment, the position where the resin material 3 is supplied is on the circuit board 2 facing the plunger block 10. The resin material 3 may be supplied in advance onto the workpiece W and carried into the mold, or may be fed after being carried into the mold (on the plunger block 10).

  The compression molding operation will be described. First, in FIG. 1A, the workpiece W is carried into the support plate 14 together with the resin material 3. Further, the release film 15 is held by suction on the parting surface of the upper mold 4 (not shown). For example, when the lower mold 12 is moved up by a vertical movement mechanism (not shown), the cavity block 7 first presses the circuit board 2 of the workpiece W and closes the cavity recess 8. Next, the plunger block 10 presses the resin material 3 with the further clamping operation of the lower press base 13. Thereby, the resin material 3 supplied to the opposing part of the plunger block 10 is filled into the cavity recess 8 through the mold runner gate 11.

  FIG.1 (c) shows the molded article 18 taken out from a molding die after resin sealing. A package part 19 in which the semiconductor chip 1 is sealed and a molded product runner gate 20 and a molded product cull 21 that connect the package parts 19 are formed. The molded product cal 21 serves as an adjustment unit corresponding to the variation (surplus) of the resin amount.

As described above, since the cavity block 7 is floatingly supported on the upper press base 5, the layout can be easily changed in accordance with the resin block region of the product.
Further, since the cavity recesses 8 of the plurality of cavity blocks 7 are filled through the resin path formed on the workpiece W, it is not necessary to accurately measure the amount of resin, and the resin material 3 is not filled in the cavity recesses 8. The molding quality can be improved.
Further, when the plunger block 10 presses the resin material 3 after the cavity block 7 presses the work W, the resin can be sealed without generating a resin flush.
Further, even if a difference occurs in the resin speed filled in the plurality of cavity recesses 7 and the resin pressure varies, the second coil spring 9 can absorb the resin pressure variation and seal the resin.
In particular, although the molded product Cull 21 is formed on the workpiece W (see FIG. 1C), it is formed on an unnecessary portion that is removed later, so that the product is not affected.

[Second Embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated.
In FIG. 2, the plunger block 10 is directly supported by the upper press base 5 without a coil spring. The plunger block 10 is inserted into a through hole provided in the single cavity block 7. A long release film 15 is stretched on the parting surfaces of the cavity block 7 and the plunger block 10 of the upper mold 4. A plurality of cavity recesses 8 are formed in the cavity block 7. A film suction hole 8 b for sucking the release film 15 is formed in the cavity recess 8.

  As an example, the release film 15 is wound up in a roll shape, pulled out from the feeding roll 16, passed through the upper mold 4, and conveyed so as to be wound up on the winding roll 17. The release film 15 is held by suction on the upper mold surface. It has heat resistance that can withstand the heating temperature of the mold, and is easily peeled off from the mold surface and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP, fluorine Impregnated glass cloth, polypropylene, polyvinyl chloride and the like are preferably used. By using the release film 15, it is not necessary to provide a cleaner part for cleaning the mold surface after ejector pins or resin molding in the mold.

In FIG. 3A, a mold runner gate 11 is formed between the cavity recess 8 and the plunger block 10 on the clamp surface of the cavity block 7, and a plurality of plunger blocks 10 are connected to the mold communication runner 22. It is communicated by. The mold communication runner 22 is provided so that the resin amount and the resin pressure are uniform for each cavity recess 8.
3B, in addition to the molded product runner gate 20 and the molded product cull 21 (adjustment unit) that connect the package parts 19 to the molded product 18, the molded product communication runner 23 that communicates the molded product culls 21 with each other. It is formed.

  Moreover, in FIG. 4A, instead of using the plurality of plunger blocks 10, a plunger block 24 connected to one section having a rectangular shape may be used. The plunger block 24 is provided to be vertically movable through a through hole formed in the single cavity block 7. A mold runner gate 11 is formed between the cavity recess 8 and the plunger block 24 on the clamp surface of the cavity block 7. In this case, the resin material 3 is supplied along the longitudinal direction to the central portion of the circuit board 2 in accordance with the shape of the plunger block 24. In FIG. 4B, a molded product runner gate 20 and a molded product cull 21 (adjustment unit) are formed in the molded product 18 to communicate the package portions 19 with each other.

[Third embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated.
In this embodiment, the schematic configuration of the compression molding apparatus is the same as that of the second embodiment, but the shapes of the plunger block and the mold cull are different.

  5A and 5B, the end face of the plunger block 25 is formed as a circular end face 25a (see FIG. 5B; a plan view of the upper mold clamping face). The plunger block 25 is supported on the upper press base 5 via the second coil spring 9. The plunger block 25 is provided so as to be vertically movable through a through hole formed in the single cavity block 7. In FIG. 5B, a mold cull 26 is engraved (engraved) around the circular end face 25a. The mold cull 26 may be formed for each plunger block 25 (see the upper half of FIG. 5B), or may be formed so that the circular end surfaces 25a of the single plunger block 25 communicate with each other. Good (refer to the lower half of FIG. 5B). In this case, the mold cull 26 can be used as a resin amount adjusting unit, and variations in resin pressure filled in the plurality of cavity recesses 8 can be absorbed. A mold runner gate 11 is formed between the mold cull 26 and the cavity recess 8. In FIG. 5C, a molded product runner gate 20 and a molded product cull 21 (adjustment unit) that connect the package portions 19 to each other are formed in the molded product 18.

6 (a) and 6 (b), the upper die 4 is provided with a cavity block 27 and a plunger block 29 each having a cavity recess 8 instead of the single cavity block 7. A circular plunger 28 is movably inserted into a through hole provided in the plunger block 29 , and a mold cull 26 is engraved around the through hole . In FIG. 6D, the space surrounded by the end faces of the plunger block 29 and the circular plunger 28 corresponds to the pot 36. Each cavity block 27 is suspended and supported from the upper press base 5 by a first coil spring 6, the circular plunger 28 is suspended by a second coil spring 9, and each plunger block 29 is suspended by two third coil springs 37. ing. 6D is a cross-sectional view taken along the line EE in FIG. 6E showing a plan view of the upper clamping surface, and the right half view in FIG. 6D is that in FIG. 6E. It is arrow FF sectional drawing.

  A mold runner gate 11 is formed between the mold cull 26 and the cavity recess 8. The mold runner gate 11 is formed in a tapered shape toward the cavity recess 8 so as to facilitate gate break after molding. In addition, the support plate 14 of the lower mold 12 is formed with a set recess 14 a for setting the circuit board 2. This is because the circuit board 2 facing the mold runner gate 11 is used as a resin path.

  In FIG. 6C, a molded product runner 20 and a molded product cull 21 (adjustment unit) are formed in the molded product 18 so as to communicate the package portions 19 with each other. The molded product runner gate 20 and the molded product cal 21, which are unnecessary resins, are separated at the connection portion between the tapered molded product runner gate 20 and the package portion 19.

[Fourth embodiment]
Next, another example of the compression molding apparatus will be described with reference to FIGS. The same members as those in the first embodiment are denoted by the same reference numerals and the description thereof is incorporated.
In this embodiment, the structures of the upper mold 4 and the lower mold 12 of the first embodiment and the compression molding apparatus are reversed. That is, the workpiece is held by the upper mold 4 and the resin material 3 is supplied to the lower mold 12 so as to be compression molded. A cavity block 32 and a plunger block 34 are provided in the lower mold 12, and the resin material 3 is supplied into a pot 36 formed on the plunger block 10.

  In FIG. 7, the upper die 4 is provided with a support plate 30 on the upper die base plate 5. The support plate 30 is provided with suction holes 30a for sucking and holding the workpiece W. In this embodiment, it is assumed that large-sized workpieces W on which a plurality of semiconductor chips 1 are mounted on a circuit board 2 are molded together.

  In the lower mold 12, the cavity block 32 is floatingly supported on the lower mold base plate 31 via the first coil spring 6. A plurality of cavity recesses 33 are formed in the cavity block 32. The cavity recess 33 is formed with a film suction hole 33a for sucking the release film 15 described above. An air vent (not shown) is formed on the clamp surface of the cavity block 32 so that the cavity recess 33 communicates with the outer edge.

  The plunger block 34 is supported on the lower press base 31 via the second coil spring 9. The plunger block 34 is provided to be movable up and down through a through hole formed in the single cavity block 32. A mold runner gate 35 is formed between the cavity recess 33 of the cavity block 32 and the plunger block 34.

  A long release film 15 is stretched between the parting surfaces of the cavity block 32 and the plunger block 34. As an example, the release film 15 is wound up in a roll shape, drawn out from the feeding roll 16, passed through the lower mold 12, and conveyed so as to be wound up on the winding roll 17.

  The compression molding operation will be described. The workpiece W is sucked and held on the support plate 30, and the resin material 3 is supplied to the end surface (pot 36) of the plunger block 34 on which the release film 15 is sucked and held. For example, when the lower mold 12 is moved up by a vertical movement mechanism (not shown), the cavity block 32 first presses the circuit board 2 of the workpiece W through the release film 15 and closes the cavity recess 33. Next, the plunger block 34 presses the resin material 3 as the lower die press base 13 is further clamped. As a result, the resin material 3 supplied to the facing portion of the plunger block 34 is filled into the cavity recess 33 through the runner gate 35. At this time, the resin remaining in the pot 36 becomes a resin amount adjusting unit.

  FIG. 8 shows an apparatus configuration similar to that of FIG. 7 except that the mold configuration assumes a circuit board 2 separated as a workpiece W. The cavity block 32 and the plunger block 34 are floatingly supported on the lower press base 31 via the first and second coil springs 6 and 9. A runner gate 35 is formed between the plunger block 34 and the cavity recess 33. The mold runner gate 35 is tapered toward the cavity recess 33. Further, a set recess 30 b for setting the circuit board 2 is formed in the support plate 30 of the upper mold 4. This is because the circuit board 2 facing the mold runner gate 35 is used as a resin path.

In each of the above-described embodiments, the case where the upper mold 4 is a fixed mold and the lower mold 12 is a movable mold has been described. However, the upper mold 4 may be a movable mold, and the lower mold 12 may be a fixed mold. Any of the movable types may be used.
The release film 15 can be omitted, and various modifications can be made.

It is sectional drawing of the compression molding apparatus which concerns on 1st Example, the top view of an upper mold | type clamp surface, and explanatory drawing of a molded product. It is sectional drawing of the compression molding apparatus which concerns on 2nd Example. FIG. 5 is a plan view of an upper clamp surface according to another example of FIG. 2 and an explanatory view of a molded product. FIG. 5 is a plan view of an upper clamp surface according to another example of FIG. 2 and an explanatory view of a molded product. It is sectional drawing of the compression molding apparatus which concerns on 3rd Example, the top view of an upper mold | type clamp surface, and explanatory drawing of a molded product. It is sectional drawing of the compression molding apparatus which concerns on the other example of FIG. 5, the top view of an upper mold clamp surface, and explanatory drawing of a molded product. It is sectional drawing of the compression molding apparatus which concerns on 4th Example. It is sectional drawing of the compression molding apparatus which concerns on the other example of FIG.

Explanation of symbols

W Work 1 Semiconductor chip 2 Circuit board 3 Resin material 4 Upper mold 5 Upper mold press base 6 First coil spring 7, 27, 32 Cavity block
8, 33 Cavity recess 8a Air vent
8b Film suction hole
9 Second coil spring
10, 24, 25, 29, 34 Plunger block
11, 35 Die runner gate
12 Lower mold
13 Lower press base
14, 30 Support plate
14a, 30b Set recess
15 release film
16 Feeding roll
17 Winding roll
18 Molded products
19 Package part
20 Molded product runner gate
21 Molded product
22 Die runner
23 Molded product communication runner
25a Circular end face 28 Circular plunger
26 Mold Cull
30 Support plate
30a Adsorption hole
31 Lower mold base plate
36 Pot 37 Third coil spring

Claims (5)

A compression molding apparatus that performs resin sealing by supplying and clamping a workpiece and a resin material on which a semiconductor chip is mounted on a substrate to a mold,
Among the mold dies, a cavity block formed with a cavity recess supported by one of the press bases and a plunger block for pressing the resin material, at least the cavity block is floatingly supported by a coil spring , and the other press base is opposed Work is supported on the side ,
Resin material exceeding at least the cavity capacity is supplied to the plunger block or the part facing the plunger block, and the plunger block presses the resin material while compressing the coil spring after the cavity block presses the workpiece by the clamping operation of the mold. As a result, only the mold clamping force is applied to the resin material through the plunger block and pressed, and the resin material flows between the mold runner gates formed on the cavity block facing the workpiece to fill the cavity recess of the cavity block. A compression molding apparatus in which a package part, a molded product runner gate, and a molded product cull are integrally formed.   The compression molding apparatus according to claim 1, wherein the plunger block is floatingly supported on the press base by a coil spring.   The compression molding apparatus according to claim 1, wherein the plunger block is fixedly supported by the press base, and a communication runner is formed on the resin pressing surface to communicate the mold cavities.   2. A compression molding apparatus according to claim 1, wherein a circular plunger is movably inserted into a through hole provided in the plunger block, and a die cull is formed around the through hole.   The compression molding apparatus according to claim 1, wherein a release film is stretched on the parting surfaces of the cavity block and the plunger block.

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