TWM518818U - Glue bonding apparatus - Google Patents

Description

Rubber bonding device

The present invention relates to a glue fitting device, and more particularly to a combination design of a lead frame transfer module, a glue placement module, a bubble elimination module and a bottom film separation module. It has the effect of reducing the generation of bubbles between the glue and the wafer, and is suitable for a wafer bonding device, a semiconductor device or the like.

As the process of the semiconductor industry changes with each passing day, the stacking of wafers has become an important technology.

The existing process mode requires that the entire surface of the adhesive material be attached to the wafer and then cut before the wafer is cut, so that the placed wafer has a layer of glue for stacking. However, if the glue is not placed on the wafer in the existing process, it is difficult to add a layer of glue to each wafer in an automated process.

Therefore, in view of the above-mentioned deficiencies, the present author can propose a glue fitting device which automatically adds a layer of glue to the wafer which has been cut, so that the user can easily operate the assembly, and is thoughtfully researching and designing. The group system is designed to provide users with convenience and is the creative motive for the creators.

The main purpose of the present invention is to provide a glue bonding device, which comprises a lead frame transfer module, a glue placement module, a bubble elimination module and a bottom film separation module. The glue material can be positioned on the wafer through the glue placement module, and then the bubble elimination module is used to eliminate bubbles generated between the placed glue and the wafer, and finally the bottom film layer separation module The base film of the adhesive material is separated from the Die Attach Film, and the base film of the adhesive material is taken away to leave the adhesive film (Die Attach Film). On the wafer, this creation has the effect of reducing the generation of bubbles between the glue and the wafer, and can increase the production speed and productivity, thereby increasing the overall practicality.

Another object of the present invention is to provide a glue fitting device, wherein at least one roller is disposed under the pressure control cylinder in the bubble eliminating mechanism of the bubble eliminating module, and the roller is passed through the roller at a high temperature. Before bonding with the wafer, the generated bubbles can be first extruded to avoid the occurrence of cracks in the wafer bonding place due to the bubbles, or the heat dissipation effect of the wafer is not good, thereby increasing the overall fit. Sex.

In order to achieve the above object, the present invention is a glue fitting device comprising: a lead frame transfer module, a glue placement module, a bubble elimination module and a bottom film separation module, the lead frame The transmission module is provided with at least one lead frame, a transport module and a power transmitter, and the power transmitter is connected to the transport module to drive the transport module to operate, and the at least one lead frame is Connected to the transport module, the at least one lead frame can be displaced with the movement of the transport module; the glue placement module is provided with a glue pick-and-place mechanism and a platform, and the platform is mounted on the lead frame Next to the transport module of the transmission module, and the lead frame of the lead frame transmission module is placed, and the glue pick-and-place mechanism is assembled on the transport module of the lead frame transport module, and extends to the Above the platform; the bubble elimination module is provided with a bubble elimination mechanism and a platform, the platform is disposed beside the transport module of the lead frame transmission module, and is placed for the lead frame of the lead frame transmission module, and The bubble elimination mechanism is assembled on the lead frame transmission Group of the delivery module, and extends Up to the top of the platform; and the bottom film separation module is provided with a bottom film separation mechanism and a platform, the platform is disposed beside the transport module of the lead frame transmission module, and is provided for the wire of the lead frame transmission module The substrate separation mechanism is assembled on the transport module of the lead frame transmission module and extends to the upper portion of the platform.

In order to further understand the features, features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are only for reference and description, and are not intended to limit the present invention.

10‧‧‧ lead frame transmission module

11‧‧‧ lead frame

12‧‧‧Transport module

13‧‧‧Power transmitter

14‧‧‧claw

20‧‧‧Glue placement module

21‧‧‧Glue pick and place mechanism

211‧‧‧ lateral moving motor

212‧‧‧Transverse Mobile Module

213‧‧‧Z-axis lifting motor

214‧‧‧eccentric wheel

215‧‧‧Pressure controlled cylinder

216‧‧ ‧ nozzle

22‧‧‧ platform

23‧‧‧Image Identification Agency

30‧‧‧ bubble elimination module

31‧‧‧ bubble elimination mechanism

311‧‧‧ lateral moving motor

312‧‧‧Horizontal Mobile Module

313‧‧‧Z-axis lifting motor

314‧‧‧Eccentric wheel

315‧‧‧Pressure controlled cylinder

316‧‧‧Roller

32‧‧‧ platform

33‧‧‧Image Identification Agency

40‧‧‧ bottom film separation module

41‧‧‧Bottom membrane separation mechanism

411‧‧‧Horizontal moving motor

412‧‧‧Horizontal Mobile Module

413‧‧‧Z-axis lifting motor

414‧‧‧Eccentric wheel

415‧‧‧Pressure controlled cylinder

416‧‧‧Receiving tape roll

417‧‧‧Receiving motor

418‧‧‧Pressing head

42‧‧‧ platform

43‧‧‧Image Identification Agency

50‧‧‧ wafer

60‧‧‧Stained materials

61‧‧‧ Base Film

62‧‧‧Die Attach Film

Fig. 1 is a perspective view showing the stereoscopic appearance of the present embodiment.

FIG. 2 is a schematic perspective view of the glue placement module of the present embodiment.

Fig. 3 is a side view showing the suction material of the glue placing module of the present embodiment.

Fig. 4 is a side view showing the adhesive material placed on the wafer in the glue placement module of the present embodiment.

Fig. 5 is a perspective view showing the appearance of the bubble removing module of the present embodiment.

Fig. 6 is a side view showing the bubble removing module of the present embodiment in which the roller is placed on the upper end of the adhesive material of the wafer.

Fig. 7 is a side view showing the bubble removing module of the present embodiment in which the roller is rolled on the wafer.

Figure 8 is a schematic perspective view of the bottom film layer separation module of the present embodiment.

Figure 9 is a bottom view of the base film layer separation module of the present embodiment, wherein the pressure head is placed on the wafer. The side view of the upper end.

Figure 10 is a side elevational view showing the underlayer film separation module of the present embodiment being pressurized so that the take-up tape roll under the pressure-bonding head can be attached to the adhesive material of the wafer.

FIG. 11 is a schematic side view showing the bottom film layer separation module of the present embodiment in which the pressing head is raised and the base film of the rubber material is lifted upward.

Figure 12 is a schematic side view of the bottom film layer separation module of the present embodiment for rolling the take-up tape roll to adhere the bottom film of the take-up tape roll to the bottom of the press-fit head.

Please refer to FIGS. 1~12 for a schematic view of the present embodiment, and the preferred embodiment of the present adhesive laminating apparatus is applied to various wafer bonding equipment, semiconductor equipment or the like. The glue bonding device of the present invention is provided with a lead frame transmission module 10, a glue placement module 20, a bubble elimination module 30 and a bottom layer separation module 40 (as shown in FIG. 1). The lead frame transmission module 10 is provided with at least one lead frame 11, a transport module 12 and a power transmitter 13, and the power transmitter 13 is connected to the transport module 12 to drive the transport. The module 12 is activated, wherein the transport module 12 of the lead frame transport module 10 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like) may be used, and the at least A lead frame 11 is connected to the transport module 12, and the transport module 12 is provided with at least one clamping jaw 14 for holding the lead frame 11 through the clamping jaw 14 so that at least one lead frame 11 is provided. Displaceable with the transport module 12 of the lead frame transport module 10, wherein the lead frame 11 is arranged with a plurality of wafers 50 for transporting the wafers 50 on the lead frame 11 to different workstations. Production operations.

The glue placement module 20 is provided with a glue pick-and-place mechanism 21 and a platform 22, which is disposed beside the transport module 12 of the lead frame transport module 10, and is used for the lead frame transfer mode. The lead frame 11 of the group 10 is placed such that the lead frame 11 can be displaced to the platform 22 with the operation of the transport module 12 of the lead frame transport module 10, wherein the platform 22 itself has the ability to generate heat or heat. In order for the platform 22 to generate temperature for conduction to the wafer 50 placed on the lead frame 11, the wafer 50 on the lead frame 11 can be heated. The glue pick-and-place mechanism 21 is disposed on the transport module 12 of the lead frame transport module 10 and extends above the platform 22, wherein the glue pick-and-place mechanism 21 is provided with a lateral movement motor 211. a lateral movement module 212, a Z-axis lifting motor 213, an eccentric wheel 214, a pressure control cylinder 215 and a suction nozzle 216 (as shown in FIG. 2), and the lateral movement motor 211 is coupled to the lateral movement The module 212 is connected, and the lateral movement module 212 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like), and the Z-axis lifting motor 213 is also used. The Z-axis lifting motor 213 is disposed on the lateral movement module 212 to be displaced to the position of the lead frame 11 to be actuated, and the Z-axis lifting motor 213 is disposed. The eccentric wheel 214 is connected to the pressure control cylinder 215 to enable up and down movement. In the present implementation, the eccentric wheel 214 is used to achieve the up and down movement (the belt mechanism can also be used. , screw mechanism or similar transmission mechanism The nozzle 216 is disposed under the pressure control cylinder 215, and the nozzle 216 is used to adsorb the used glue 60 to the wafer 50 of the lead frame 11 (eg, 3, wherein the adhesive material 60 is provided with two layers of a base film 61 and a die attach film 62, and the contact surface of the nozzle 216 is a base film 61. A die attach film 62 is attached to the wafer 50, and the pressure control cylinder 215 is used to control the force required by the nozzle 216 to pick and place the adhesive 60 to prevent the wafer 50 from being damaged (eg, As shown in Fig. 4, the pressure control cylinder 215 described above needs to be matched with the air pressure control to achieve the above operation (others can also be controlled by a voice coil motor or the like). An image recognition mechanism 23 is disposed at an upper end of the platform 22 of the glue placement module 20, and the image recognition mechanism 23 has an image pickup lens for assisting the positioning of the nozzle 216 of the glue pick-and-place mechanism 21 and assisting The precision of the adhesive 60 placed on the wafer 50 is measured to improve the accuracy of the bonding position of the adhesive 60 to the wafer 50.

The air bubble eliminating mechanism 30 is provided with a bubble eliminating mechanism 31 and a platform 32. The platform 32 is disposed beside the transport module 12 of the lead frame transmission module 10, and is provided for the lead frame 11 of the lead frame transmission module 10. The lead frame 11 can be displaced to the platform 32 by the movement of the transport module 12 of the lead frame transport module 10, wherein the platform 32 itself has the ability to generate heat or heat to enable the platform 32 to be generated. The temperature is conducted to the wafer 50 placed on the lead frame 11 to allow the wafer 50 on the lead frame 11 to be heated. The bubble removing mechanism 31 is disposed on the transport module 12 of the lead frame transport module 10 and extends above the platform 32. The air bubble removing mechanism 31 is provided with a lateral moving motor 311 and a lateral movement. The module 312, a Z-axis lifting motor 313, an eccentric wheel 314, a pressure control cylinder 315 and at least one roller 316 (as shown in FIG. 5), and the lateral movement motor 311 is coupled to the lateral movement module 312. Connected, and the lateral movement module 312 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like is also used), and the Z-axis lifting motor 313 is assembled The lateral movement module 312 is configured to displace the Z-axis lifting motor 313 on the lateral movement module 312. By moving to the position of the lead frame 11 to be actuated (as shown in FIG. 6), the Z-axis lifting motor 313 is coupled to the eccentric 314, and the eccentric 314 is connected to the pressure control cylinder 315. The upper and lower movements are enabled, wherein the eccentric wheel 214 is used to achieve the up and down movement during the creation of the present invention (the belt mechanism, the screw mechanism or the like can also be used to move up and down), and the roller 316 is also used. The assembly is disposed under the pressure control cylinder 315, and the roller 316 is used to roll the glue 60 attached to the wafer 50 to bond the bubble between the Die Attach Film 62 and the wafer 50 of the glue 60. Extrusion (as shown in Fig. 7), wherein the roller 316 can be rolled by using a large-area roller method or a plurality of sets of rollers simultaneously, and the roller 316 is controlled to be rolled by the pressure control cylinder 315. The required force is to avoid damage to the wafer 50, and the pressure control cylinder 315 described above needs to be matched with the air pressure control to achieve the above operation (others can also be controlled by a voice coil motor or the like). An image recognition mechanism 33 is disposed at an upper end of the platform 32 of the bubble eliminating module 30. The image recognition mechanism 33 has an imaging lens to assist in positioning the rolling position of the roller 316 of the bubble eliminating mechanism 31. The roller 316 can squeeze the generated air bubbles before the adhesive material 60 is bonded to the wafer 50 at a high temperature to avoid cracking of the wafer 50 at the bonding stage or cause heat dissipation of the wafer 50 due to the bubble. The effect is not good.

The bottom layer separation module 40 is provided with a bottom film separation mechanism 41 and a platform 42. The platform 42 is disposed beside the transportation module 12 of the lead frame transmission module 10, and is provided for the lead frame transmission module 10 The lead frame 11 is placed such that the lead frame 11 can be displaced to the platform 42 with the movement of the transport module 12 of the lead frame transport module 10, wherein the platform 42 itself has the ability to generate heat or heat to enable the platform 42 can generate temperature to conduct The wafer 50 on the lead frame 11 allows the wafer 50 on the lead frame 11 to be heated. The bottom film separating mechanism 41 is disposed on the transport module 12 of the lead frame transport module 10 and extends above the platform 42. The bottom film separating mechanism 41 is provided with a lateral moving motor 411 and a The lateral movement module 412, a Z-axis lifting motor 413, an eccentric wheel 414, a pressure control cylinder 415, a receiving tape roll 416, at least one receiving motor 417 and a pressing head 418 (as shown in FIG. 8) And the lateral movement motor 411 is connected to the lateral movement module 412, and the lateral movement module 412 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like may also be used). The Z-axis lifting motor 413 is disposed on the lateral movement module 412, and the Z-axis lifting motor 413 is displaced on the lateral movement module 412 to move to the lead frame that needs to be actuated. The position of 11 (as shown in FIG. 9), and the Z-axis lifting motor 413 is coupled to the eccentric 414, and the eccentric 414 is coupled to the pressure control cylinder 415 to enable up and down movement, wherein In the implementation of this creation, the eccentric wheel 214 is used to achieve the upper and lower The movement (otherwise, the belt mechanism, the screw mechanism or the like) can be used to perform the up and down operation, and the pressure head 418 is assembled under the pressure control cylinder 415, and the pressure head 418 is pressed. On the take-up tape roll 416 (as shown in FIG. 10), the take-up tape roll 416 can be flatly attached to the glue 60 for bonding to the base film 61 of the glue 60. And the Z-axis lifting motor 413 is actuated to drive the pressure control cylinder 415, the pressing head 418, the receiving tape roll 416 and the receiving motor 417 to rise in tandem, and simultaneously combine the base film 61 of the rubber material 60. The Die Attach Film 62 is separated, and the separated Base Film 61 is adhered to the take-up tape roll 416 (as shown in FIG. 11), and the Die Attach Film 62 is adhered to the wafer 50. On the other, the receipt glue The tape roll 416 is sleeved on the receiving motor 417. When the base film 61 is adhered to the take-up tape roll 416 after separation, the receiving tape roll 416 is rolled by the receiving motor 417 to be attached to the receiving tape 416. The base film 61 of the tape roll 416 is taped under the press head 418 (as shown in FIG. 12), wherein the pressure control cylinder 415, the press head 418, the take-up tape roll 416, and the take-up motor 417. Multiple sets may be configured to separate the plurality of glues 60 at a time, or to increase the area of the press head 418 and the take-up tape roll 416 to increase work efficiency, and control the press head 418 through the pressure control cylinder 415. The force required to press down to avoid damage to the wafer 50, and the pressure control cylinder 415 described above needs to be matched with the air pressure control to achieve the above action (others can also be controlled by a voice coil motor or the like) . Further, an image recognition mechanism 43 is disposed at an upper end of the platform 42 of the base film separation module 40. The image recognition mechanism 43 has an imaging lens to assist the positioning of the pressing head 418 of the base film separation mechanism 41, and assists Accurate measurement after pressing the glue 60 on the wafer 50 to improve the precision of the press position.

Moreover, the action of the creation is that the suction material 216 is sucked by the suction nozzle 216 of the rubber pick-and-place mechanism 21, and then the suction nozzle 216 is moved to the platform by the lateral movement module 212 and the Z-axis lifting motor 213. 22 above the lead frame 11 of the wafer 50, and the position after the movement can be assisted by the image recognition mechanism 23, when the nozzle 216 is moved to the position, the nozzle 216 moves downward and is pressed against the lead frame. The wafer 50 of the 11 can be adhered to the wafer 50. The platform 22 under the lead frame 11 can adjust the temperature according to the characteristics of the adhesive material 60, so that the adhesive material 60 can be easily attached to the wafer 50. The pressure control cylinder 215 above the suction nozzle 216 can adjust the pressure with the product, so that the suction nozzle 216 is pressed down without causing damage to the wafer 50, and after the above operation is completed, the suction nozzle 216 is lifted upward. l to move to the original position and prepare for the next stage of adsorption of the glue 60.

After the wafer 50 on the lead frame 11 is completed, the lead frame transfer module 10 transports the lead frame 11 to the platform 32 of the bubble eliminating module 30 through the transport module 12, and First, the image recognition mechanism 33 performs the positioning confirmation of the rolling position, and after the roller 316 of the bubble eliminating mechanism 31 is moved to the positioning, the roller 316 is moved downward and pressed onto the wafer 50 of the lead frame 11 and pasted. Attached to the glue 60 above the wafer 50, the roller 316 can be pressed against the glue 60 to extrude bubbles between the die attach film 62 of the glue 60 and the wafer 50, wherein the lead frame The platform 32 below 11 can adjust the temperature according to the characteristics of the glue material 60, so that the glue material 60 can be easily attached to the wafer 50, and the pressure control cylinder 315 above the roller 316 can adjust the pressure with the product, so that the roller 316 is not pressed. The wafer 50 is damaged, and after the above operation is completed, the roller 316 is lifted up to move to the original position and ready for the next press of the glue 60.

When the wafer 50 on the lead frame 11 is pressed and the bubbles are extruded, the lead frame transport module 10 transports the lead frame 11 to the base film separation module 40 through the transport module 12. On the platform 42, the image recognition mechanism 43 first confirms the position, and after the pressing head 418 of the bottom film separating mechanism 41 is moved to the positioning, the pressing head 418 moves downward and is pressed against the wire. On the wafer 50 of the frame 11, the take-up tape roll 416 located below the press head 418 can be attached to the Die Attach Film 62 of the glue 60 above the wafer 50, wherein the platform below the lead frame 11 42 can adjust the temperature according to the characteristics of the glue 60, so that the glue 60 can be easily attached to the wafer 50, and the pressure control cylinder 415 above the pressure head 418 can adjust the pressure with the product, so that the pressure head 41 When the pressing is performed, the wafer 50 is not damaged. Further, when the receiving tape roll 416 under the pressing head 418 is attached to the bonding film 62 of the adhesive 60 above the wafer 50, it is transmitted through Z. The shaft lifting motor 413 is actuated to drive the pressure control cylinder 415, the pressing head 418, the receiving tape roll 416 and the receiving motor 417 to rise in tandem, and at the same time, the base film 61 of the rubber material 60 and the bonding film (Die) The Attach Film 62 is separated, and the separated Base Film 61 is adhered to the take-up tape roll 416, and the Die Attach Film 62 is adhered to the wafer 50, and the separated base film (Base Film) ) 61 is also lifted up as the take-up tape roll 416 is raised, so that when the press head 418 is raised to a certain height, the take-up motor 417 rolls the take-up tape roll 416 to be adhered to The base film 61 of the take-up tape roll 416 is taken under the pressing head 418, whereby the cut-off glue 60 is attached to the fixed wafer 50, and the glue 60 is reduced. The generation of bubbles between the wafer 50 and the wafer 50 allows the precision of the bonding position of the glue 60 and the wafer 50 to be improved, and the production speed and productivity are improved. The effect.

By the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objectives, and has been in compliance with the provisions of the Patent Law, and has filed a patent application.

However, the above is only the preferred embodiment of the present invention, and the scope of the creation of the present invention cannot be limited by this; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the content of the creation specification are All should remain within the scope of this creation patent.

10‧‧‧ lead frame transmission module

11‧‧‧ lead frame

12‧‧‧Transport module

13‧‧‧Power transmitter

14‧‧‧claw

20‧‧‧Glue placement module

21‧‧‧Glue pick and place mechanism

211‧‧‧ lateral moving motor

212‧‧‧Transverse Mobile Module

213‧‧‧Z-axis lifting motor

214‧‧‧eccentric wheel

215‧‧‧Pressure controlled cylinder

216‧‧ ‧ nozzle

22‧‧‧ platform

23‧‧‧Image Identification Agency

30‧‧‧ bubble elimination module

31‧‧‧ bubble elimination mechanism

311‧‧‧ lateral moving motor

312‧‧‧Horizontal Mobile Module

313‧‧‧Z-axis lifting motor

314‧‧‧Eccentric wheel

315‧‧‧Pressure controlled cylinder

316‧‧‧Roller

32‧‧‧ platform

33‧‧‧Image Identification Agency

40‧‧‧ bottom film separation module

41‧‧‧Bottom membrane separation mechanism

411‧‧‧Horizontal moving motor

412‧‧‧Horizontal Mobile Module

413‧‧‧Z-axis lifting motor

414‧‧‧Eccentric wheel

415‧‧‧Pressure controlled cylinder

416‧‧‧Receiving tape roll

417‧‧‧Receiving motor

418‧‧‧Pressing head

42‧‧‧ platform

43‧‧‧Image Identification Agency

50‧‧‧ wafer

60‧‧‧Stained materials

Claims (7)

A glue material fitting device comprises: a lead frame transmission module, wherein the lead frame transmission module is provided with at least one lead frame, a conveying module and a power transmission, and the power transmission system and the conveying The module is connected to drive the transport module to operate, and the at least one lead frame is connected to the transport module, so that at least one lead frame can be displaced with the movement of the transport module; a glue placement module The glue placement module is provided with a glue pick-and-place mechanism and a platform, the platform is disposed beside the transport module of the lead frame transport module, and the lead frame of the lead frame transport module is placed And the glue pick-and-place mechanism is disposed on the transport module of the lead frame transport module and extends to the top of the platform; a bubble elimination module, the bubble elimination module is provided with a bubble elimination mechanism and a platform, the platform is disposed beside the transport module of the lead frame transmission module, and is disposed for the lead frame of the lead frame transmission module, and the bubble elimination mechanism is disposed in the transport of the lead frame transmission module On the module and extending above the platform; And a bottom film layer separating module, wherein the bottom film separating module is provided with a bottom film separating mechanism and a platform, the platform is disposed beside the conveying module of the lead frame transmission module, and is provided for the lead frame transmission module The lead frame is disposed, and the bottom film separating mechanism is assembled on the conveying module of the lead frame transmission module and extends to the upper portion of the platform. The glue laminating device according to claim 1, wherein the glue pick-and-place mechanism further comprises a lateral moving motor, a lateral moving module, a Z-axis lifting motor, an eccentric wheel, and a pressure control. a cylinder and a nozzle, wherein the lateral movement motor is connected to the lateral movement module, and the Z-axis lifting motor is assembled on the lateral movement module to make the Z-axis lift and lower The yoke is coupled to the eccentric wheel, and the eccentric wheel is coupled to the eccentric wheel, and the eccentric is coupled to the pressure control cylinder, and the nozzle is assembled to the pressure control cylinder Below. The glue laminating device according to claim 1, wherein the bubble eliminating mechanism further comprises a lateral moving motor, a lateral moving module, a Z-axis lifting motor, an eccentric wheel, a pressure control cylinder and At least one roller, and the lateral movement motor is connected to the lateral movement module, and the Z-axis lifting motor is assembled on the lateral movement module, so that the Z-axis lifting motor is attached to the lateral movement module. Displacement, and the Z-axis hoisting motor is coupled to the eccentric, and the eccentric transmission is coupled to the pressure control cylinder, and the roller is disposed below the pressure control cylinder. The rubber material laminating device according to claim 1, wherein the bottom film separating mechanism is further provided with a lateral moving motor, a lateral moving module, a Z-axis lifting motor, an eccentric wheel, and a pressure control cylinder. a receiving tape roll, at least one receiving motor and a pressing head, wherein the lateral moving motor is connected to the lateral moving module, and the Z-axis lifting motor is assembled on the lateral moving module. Disposing a Z-axis lifting motor on the lateral movement module, wherein the Z-axis lifting motor is coupled to the eccentric wheel, and the eccentric wheel is coupled to the pressure control cylinder, and the pressing head is assembled Below the pressure control cylinder, the press head is press-fitted onto the take-up tape roll, and the take-up tape roll is sleeved on the take-up motor. The adhesive applicator of claim 1, wherein the upper end of the platform of the glue placement module further comprises an image recognition mechanism, wherein the image recognition mechanism has an image pickup lens. The glue laminating device according to claim 1, wherein the bubble eliminating module is flat The image recognition mechanism is further provided with an image recognition mechanism. The adhesive applicator of claim 1, wherein the bottom layer of the base film separation module further comprises an image recognition mechanism, wherein the image recognition mechanism has a camera lens.