TWM518818U - Glue bonding apparatus - Google Patents
Glue bonding apparatus Download PDFInfo
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- TWM518818U TWM518818U TW104211871U TW104211871U TWM518818U TW M518818 U TWM518818 U TW M518818U TW 104211871 U TW104211871 U TW 104211871U TW 104211871 U TW104211871 U TW 104211871U TW M518818 U TWM518818 U TW M518818U
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Description
本創作係有關於一種膠材貼合裝置,尤指一種可藉由一導線架傳輸模組、一膠材置放模組、一氣泡消除模組及一底膜層分離模組之組合設計,以具有減少膠材與晶片間氣泡之產生之效果,而適用於晶片貼合設備、半導體設備或類似之設備者。 The present invention relates to a glue fitting device, and more particularly to a combination design of a lead frame transfer module, a glue placement module, a bubble elimination module and a bottom film separation module. It has the effect of reducing the generation of bubbles between the glue and the wafer, and is suitable for a wafer bonding device, a semiconductor device or the like.
隨著半導體產業的製程日新月異下,晶片的堆疊成了一門重要的技術。 As the process of the semiconductor industry changes with each passing day, the stacking of wafers has become an important technology.
現有的製程模式為在晶圓切割之前需先將膠材整面附著於晶圓上再進行切割,使置放之晶片具有一層膠材可供堆疊使用。然,在現有的製程上如果膠材不先置於晶圓上,很難以自動化的設備在每片晶片上再加上一層膠材。 The existing process mode requires that the entire surface of the adhesive material be attached to the wafer and then cut before the wafer is cut, so that the placed wafer has a layer of glue for stacking. However, if the glue is not placed on the wafer in the existing process, it is difficult to add a layer of glue to each wafer in an automated process.
因此,本創作人有鑑於上述缺失,期能提出一種具有自動在已切割好之晶片上再加上一層膠材之膠材貼合裝置,令使用者可輕易操作組裝,乃潛心研思、設計組製,以提供使用者便利性,為本創作人所欲研創之創作動機者。 Therefore, in view of the above-mentioned deficiencies, the present author can propose a glue fitting device which automatically adds a layer of glue to the wafer which has been cut, so that the user can easily operate the assembly, and is thoughtfully researching and designing. The group system is designed to provide users with convenience and is the creative motive for the creators.
本創作之主要目的,在於提供一種膠材貼合裝置,藉由一導線架傳輸模組、一膠材置放模組、一氣泡消除模組及一底膜層分離模組, 使膠材能經由該膠材置放模組來定位於晶片上,再由該氣泡消除模組來進行消除置放後之膠材與晶片間所產生的氣泡,最後由底膜層分離模組將膠材之底膜(Base Film)與膠材之結合膜(Die Attach Film)分離,並將膠材之底膜(Base Film)帶走,以留下膠材之結合膜(Die Attach Film)於晶片上,讓本創作具有減少膠材與晶片間氣泡之產生,且能提昇生產速度及產能,進而增加整體之實用性者。 The main purpose of the present invention is to provide a glue bonding device, which comprises a lead frame transfer module, a glue placement module, a bubble elimination module and a bottom film separation module. The glue material can be positioned on the wafer through the glue placement module, and then the bubble elimination module is used to eliminate bubbles generated between the placed glue and the wafer, and finally the bottom film layer separation module The base film of the adhesive material is separated from the Die Attach Film, and the base film of the adhesive material is taken away to leave the adhesive film (Die Attach Film). On the wafer, this creation has the effect of reducing the generation of bubbles between the glue and the wafer, and can increase the production speed and productivity, thereby increasing the overall practicality.
本創作之另一目的,在於提供一種膠材貼合裝置,藉由該氣泡消除模組之氣泡消除機構中的壓力控制汽缸下方係設有至少一滾輪,並透過該滾輪在膠材經高溫要與晶片貼合前,能先將所產生的氣泡擠壓出去,避免因氣泡來導致其後續加熱過程時該晶片貼合處產生破裂或造成晶片散熱效果不佳等影響,進而增加整體之貼合性者。 Another object of the present invention is to provide a glue fitting device, wherein at least one roller is disposed under the pressure control cylinder in the bubble eliminating mechanism of the bubble eliminating module, and the roller is passed through the roller at a high temperature. Before bonding with the wafer, the generated bubbles can be first extruded to avoid the occurrence of cracks in the wafer bonding place due to the bubbles, or the heat dissipation effect of the wafer is not good, thereby increasing the overall fit. Sex.
為達上述目的,本創作為一種膠材貼合裝置,係包括:一導線架傳輸模組、一膠材置放模組、一氣泡消除模組及一底膜層分離模組,該導線架傳輸模組係設有至少一導線架、一輸送模組及一動力傳輸器,而該動力傳輸器係與該輸送模組相連接,以驅動該輸送模組作動,且該至少一導線架係與該輸送模組連接,使至少一導線架能隨該輸送模組作動而進行位移;該膠材置放模組係設有一膠材取放機構及一平台,該平台係設於該導線架傳輸模組之輸送模組旁,並供該導線架傳輸模組之導線架置放,而該膠材取放機構係組設於該導線架傳輸模組之輸送模組上,並延伸至該平台上方處;該氣泡消除模組係設有一氣泡消除機構及一平台,該平台係設於該導線架傳輸模組之輸送模組旁,並供導線架傳輸模組之導線架置放,而該氣泡消除機構係組設於該導線架傳輸模組之輸送模組上,並延伸 至該平台上方處;以及該底膜層分離模組係有一底膜分離機構及一平台,該平台係設於該導線架傳輸模組之輸送模組旁,並供導線架傳輸模組之導線架置放,而該底膜分離機構係組設於該導線架傳輸模組之輸送模組上,並延伸至該平台上方處者。 In order to achieve the above object, the present invention is a glue fitting device comprising: a lead frame transfer module, a glue placement module, a bubble elimination module and a bottom film separation module, the lead frame The transmission module is provided with at least one lead frame, a transport module and a power transmitter, and the power transmitter is connected to the transport module to drive the transport module to operate, and the at least one lead frame is Connected to the transport module, the at least one lead frame can be displaced with the movement of the transport module; the glue placement module is provided with a glue pick-and-place mechanism and a platform, and the platform is mounted on the lead frame Next to the transport module of the transmission module, and the lead frame of the lead frame transmission module is placed, and the glue pick-and-place mechanism is assembled on the transport module of the lead frame transport module, and extends to the Above the platform; the bubble elimination module is provided with a bubble elimination mechanism and a platform, the platform is disposed beside the transport module of the lead frame transmission module, and is placed for the lead frame of the lead frame transmission module, and The bubble elimination mechanism is assembled on the lead frame transmission Group of the delivery module, and extends Up to the top of the platform; and the bottom film separation module is provided with a bottom film separation mechanism and a platform, the platform is disposed beside the transport module of the lead frame transmission module, and is provided for the wire of the lead frame transmission module The substrate separation mechanism is assembled on the transport module of the lead frame transmission module and extends to the upper portion of the platform.
為了能夠更進一步瞭解本創作之特徵、特點和技術內容,請參閱以下有關本創作之詳細說明與附圖,惟所附圖式僅提供參考與說明用,非用以限制本創作。 In order to further understand the features, features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are only for reference and description, and are not intended to limit the present invention.
10‧‧‧導線架傳輸模組 10‧‧‧ lead frame transmission module
11‧‧‧導線架 11‧‧‧ lead frame
12‧‧‧輸送模組 12‧‧‧Transport module
13‧‧‧動力傳輸器 13‧‧‧Power transmitter
14‧‧‧夾爪 14‧‧‧claw
20‧‧‧膠材置放模組 20‧‧‧Glue placement module
21‧‧‧膠材取放機構 21‧‧‧Glue pick and place mechanism
211‧‧‧橫向移動馬達 211‧‧‧ lateral moving motor
212‧‧‧橫向移動模組 212‧‧‧Transverse Mobile Module
213‧‧‧Z軸升降馬達 213‧‧‧Z-axis lifting motor
214‧‧‧偏心輪 214‧‧‧eccentric wheel
215‧‧‧壓力控制汽缸 215‧‧‧Pressure controlled cylinder
216‧‧‧吸嘴 216‧‧ ‧ nozzle
22‧‧‧平台 22‧‧‧ platform
23‧‧‧影像辨識機構 23‧‧‧Image Identification Agency
30‧‧‧氣泡消除模組 30‧‧‧ bubble elimination module
31‧‧‧氣泡消除機構 31‧‧‧ bubble elimination mechanism
311‧‧‧橫向移動馬達 311‧‧‧ lateral moving motor
312‧‧‧橫向移動模組 312‧‧‧Horizontal Mobile Module
313‧‧‧Z軸升降馬達 313‧‧‧Z-axis lifting motor
314‧‧‧偏心輪 314‧‧‧Eccentric wheel
315‧‧‧壓力控制汽缸 315‧‧‧Pressure controlled cylinder
316‧‧‧滾輪 316‧‧‧Roller
32‧‧‧平台 32‧‧‧ platform
33‧‧‧影像辨識機構 33‧‧‧Image Identification Agency
40‧‧‧底膜層分離模組 40‧‧‧ bottom film separation module
41‧‧‧底膜分離機構 41‧‧‧Bottom membrane separation mechanism
411‧‧‧橫向移動馬達 411‧‧‧Horizontal moving motor
412‧‧‧橫向移動模組 412‧‧‧Horizontal Mobile Module
413‧‧‧Z軸升降馬達 413‧‧‧Z-axis lifting motor
414‧‧‧偏心輪 414‧‧‧Eccentric wheel
415‧‧‧壓力控制汽缸 415‧‧‧Pressure controlled cylinder
416‧‧‧收料膠帶捲 416‧‧‧Receiving tape roll
417‧‧‧收料馬達 417‧‧‧Receiving motor
418‧‧‧壓合頭 418‧‧‧Pressing head
42‧‧‧平台 42‧‧‧ platform
43‧‧‧影像辨識機構 43‧‧‧Image Identification Agency
50‧‧‧晶片 50‧‧‧ wafer
60‧‧‧膠材 60‧‧‧Stained materials
61‧‧‧底膜(Base Film) 61‧‧‧ Base Film
62‧‧‧結合膜(Die Attach Film) 62‧‧‧Die Attach Film
第1圖係為本創作實施例之立體外觀示意圖。 Fig. 1 is a perspective view showing the stereoscopic appearance of the present embodiment.
第2圖係為本創作實施例之膠材置放模組之立體外觀示意圖。 FIG. 2 is a schematic perspective view of the glue placement module of the present embodiment.
第3圖係為本創作實施例之膠材置放模組進行以吸嘴吸附膠材之側面示意圖。 Fig. 3 is a side view showing the suction material of the glue placing module of the present embodiment.
第4圖係為本創作實施例之膠材置放模組進行將吸附膠材置於晶片上之側面示意圖。 Fig. 4 is a side view showing the adhesive material placed on the wafer in the glue placement module of the present embodiment.
第5圖係為本創作實施例之氣泡消除模組之立體外觀示意圖。 Fig. 5 is a perspective view showing the appearance of the bubble removing module of the present embodiment.
第6圖係為本創作實施例之氣泡消除模組進行將滾輪置於晶片的膠材上端之側面示意圖。 Fig. 6 is a side view showing the bubble removing module of the present embodiment in which the roller is placed on the upper end of the adhesive material of the wafer.
第7圖係為本創作實施例之氣泡消除模組進行以滾輪滾壓於晶片上膠材之側面示意圖。 Fig. 7 is a side view showing the bubble removing module of the present embodiment in which the roller is rolled on the wafer.
第8圖係為本創作實施例之底膜層分離模組之立體外觀示意圖。 Figure 8 is a schematic perspective view of the bottom film layer separation module of the present embodiment.
第9圖係為本創作實施例之底膜層分離模組進行將壓合頭置於晶片的膠材 上端之側面示意圖。 Figure 9 is a bottom view of the base film layer separation module of the present embodiment, wherein the pressure head is placed on the wafer. The side view of the upper end.
第10圖係為本創作實施例之底膜層分離模組進行加壓使壓合頭下方收料膠帶捲能貼附於晶片的膠材上之側面示意圖。 Figure 10 is a side elevational view showing the underlayer film separation module of the present embodiment being pressurized so that the take-up tape roll under the pressure-bonding head can be attached to the adhesive material of the wafer.
第11圖係為本創作實施例之底膜層分離模組進行壓合頭上升並同時將膠材之底膜一併往上提升之側面示意圖。 FIG. 11 is a schematic side view showing the bottom film layer separation module of the present embodiment in which the pressing head is raised and the base film of the rubber material is lifted upward.
第12圖係為本創作實施例之底膜層分離模組進行捲動收料膠帶捲以將黏貼於收料膠帶捲之底膜帶離壓合頭下方之側面示意圖。 Figure 12 is a schematic side view of the bottom film layer separation module of the present embodiment for rolling the take-up tape roll to adhere the bottom film of the take-up tape roll to the bottom of the press-fit head.
請參閱第1~12圖,係為本創作實施例之示意圖,而本創作之膠材貼合裝置的最佳實施方式係運用於各式晶片貼合設備、半導體設備或類似之設備上。而本創作之膠材貼合裝置係設有一導線架傳輸模組10、一膠材置放模組20、一氣泡消除模組30及一底膜層分離模組40(如第1圖所示);該導線架傳輸模組10係設有至少一導線架11、一輸送模組12及一動力傳輸器13,而該動力傳輸器13係與該輸送模組12相連接,以驅動該輸送模組12作動,其中該導線架傳輸模組10之輸送模組12內於本創作實施時係以螺桿機構來呈現(另也可採用皮帶機構、滾輪機構或類似之傳動機構),且該至少一導線架11係與該輸送模組12連接,而該輸送模組12上係設有至少一夾爪14,以透過該夾爪14來夾持住該導線架11,使至少一導線架11能隨該導線架傳輸模組10之輸送模組12作動而進行位移,其中該導線架11上係排列有複數個晶片50,藉以將導線架11上之晶片50來輸送至不同的工作站來進行生產作業。 Please refer to FIGS. 1~12 for a schematic view of the present embodiment, and the preferred embodiment of the present adhesive laminating apparatus is applied to various wafer bonding equipment, semiconductor equipment or the like. The glue bonding device of the present invention is provided with a lead frame transmission module 10, a glue placement module 20, a bubble elimination module 30 and a bottom layer separation module 40 (as shown in FIG. 1). The lead frame transmission module 10 is provided with at least one lead frame 11, a transport module 12 and a power transmitter 13, and the power transmitter 13 is connected to the transport module 12 to drive the transport. The module 12 is activated, wherein the transport module 12 of the lead frame transport module 10 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like) may be used, and the at least A lead frame 11 is connected to the transport module 12, and the transport module 12 is provided with at least one clamping jaw 14 for holding the lead frame 11 through the clamping jaw 14 so that at least one lead frame 11 is provided. Displaceable with the transport module 12 of the lead frame transport module 10, wherein the lead frame 11 is arranged with a plurality of wafers 50 for transporting the wafers 50 on the lead frame 11 to different workstations. Production operations.
而該膠材置放模組20係設有一膠材取放機構21及一平台22,該平台22係設於該導線架傳輸模組10之輸送模組12旁,並供該導線架傳輸模組10之導線架11置放,使導線架11能隨該導線架傳輸模組10之輸送模組12作動而位移至該平台22上,其中該平台22本身乃具有能發出熱能或進行加熱,以使平台22能產生溫度來傳導到置於導線架11上之晶片50,讓導線架11上之晶片50能加熱。而該膠材取放機構21係組設於該導線架傳輸模組10之輸送模組12上,並延伸至該平台22上方處,其中該膠材取放機構21係設有一橫向移動馬達211、一橫向移動模組212、一Z軸升降馬達213、一偏心輪214、一壓力控制汽缸215及一吸嘴216(如第2圖所示),而該橫向移動馬達211係與該橫向移動模組212相連接,且該橫向移動模組212內於本創作實施時係以螺桿機構來呈現(另也可採用皮帶機構、滾輪機構或類似之傳動機構),另該Z軸升降馬達213係組設於該橫向移動模組212上,使Z軸升降馬達213係於該橫向移動模組212上進行位移,藉以移動至需要作動之導線架11的位置上,而該Z軸升降馬達213係連著該偏心輪214,且該偏心輪214係與該壓力控制汽缸215相連接,使能進行上下移動,其中於本創作實施時係以偏心輪214來達成上下作動(另也可採用皮帶機構、螺桿機構或類似之傳動機構等方式來進行上下作動),另該吸嘴216係組設於該壓力控制汽缸215下方,而該吸嘴216係用來吸附生產使用之膠材60至導線架11之晶片50上(如第3圖所示),其中該膠材60係設有底膜(Base Film)61與結合膜(Die Attach Film)62兩層,而吸嘴216之接觸面為底膜(Base Film)61, 另結合膜(Die Attach Film)62則貼合於晶片50上,且透過該壓力控制汽缸215來控制該吸嘴216於取放膠材60時之所需力道,以避免晶片50受損(如第4圖所示),而上述之壓力控制汽缸215乃需搭配氣壓控制才能達到上述之作動(另也可以採用音圈馬達或其他類似機構等方式來進行控制)。另該膠材置放模組20之平台22上端處係設有一影像辨識機構23,該影像辨識機構23係具有攝像鏡頭,以能輔助膠材取放機構21之吸嘴216進行定位,並協助膠材60置放於晶片50上後的精準量測,以提升膠材60與晶片50的貼合位置之精度。 The glue placement module 20 is provided with a glue pick-and-place mechanism 21 and a platform 22, which is disposed beside the transport module 12 of the lead frame transport module 10, and is used for the lead frame transfer mode. The lead frame 11 of the group 10 is placed such that the lead frame 11 can be displaced to the platform 22 with the operation of the transport module 12 of the lead frame transport module 10, wherein the platform 22 itself has the ability to generate heat or heat. In order for the platform 22 to generate temperature for conduction to the wafer 50 placed on the lead frame 11, the wafer 50 on the lead frame 11 can be heated. The glue pick-and-place mechanism 21 is disposed on the transport module 12 of the lead frame transport module 10 and extends above the platform 22, wherein the glue pick-and-place mechanism 21 is provided with a lateral movement motor 211. a lateral movement module 212, a Z-axis lifting motor 213, an eccentric wheel 214, a pressure control cylinder 215 and a suction nozzle 216 (as shown in FIG. 2), and the lateral movement motor 211 is coupled to the lateral movement The module 212 is connected, and the lateral movement module 212 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like), and the Z-axis lifting motor 213 is also used. The Z-axis lifting motor 213 is disposed on the lateral movement module 212 to be displaced to the position of the lead frame 11 to be actuated, and the Z-axis lifting motor 213 is disposed. The eccentric wheel 214 is connected to the pressure control cylinder 215 to enable up and down movement. In the present implementation, the eccentric wheel 214 is used to achieve the up and down movement (the belt mechanism can also be used. , screw mechanism or similar transmission mechanism The nozzle 216 is disposed under the pressure control cylinder 215, and the nozzle 216 is used to adsorb the used glue 60 to the wafer 50 of the lead frame 11 (eg, 3, wherein the adhesive material 60 is provided with two layers of a base film 61 and a die attach film 62, and the contact surface of the nozzle 216 is a base film 61. A die attach film 62 is attached to the wafer 50, and the pressure control cylinder 215 is used to control the force required by the nozzle 216 to pick and place the adhesive 60 to prevent the wafer 50 from being damaged (eg, As shown in Fig. 4, the pressure control cylinder 215 described above needs to be matched with the air pressure control to achieve the above operation (others can also be controlled by a voice coil motor or the like). An image recognition mechanism 23 is disposed at an upper end of the platform 22 of the glue placement module 20, and the image recognition mechanism 23 has an image pickup lens for assisting the positioning of the nozzle 216 of the glue pick-and-place mechanism 21 and assisting The precision of the adhesive 60 placed on the wafer 50 is measured to improve the accuracy of the bonding position of the adhesive 60 to the wafer 50.
另該氣泡消除組30係設有一氣泡消除機構31及一平台32,該平台32係設於該導線架傳輸模組10之輸送模組12旁,並供導線架傳輸模組10之導線架11置放,使導線架11能隨該導線架傳輸模組10之輸送模組12作動而位移至該平台32上,其中該平台32本身乃具有能發出熱能或進行加熱,以使平台32能產生溫度來傳導到置於導線架11上之晶片50,讓導線架11上之晶片50能加熱。而該氣泡消除機構31係組設於該導線架傳輸模組10之輸送模組12上,並延伸至該平台32上方處,其中該氣泡消除機構31係設有一橫向移動馬達311、一橫向移動模組312、一Z軸升降馬達313、一偏心輪314、一壓力控制汽缸315及至少一滾輪316(如第5圖所示),而該橫向移動馬達311係與該橫向移動模組312相連接,且該橫向移動模組312內於本創作實施時係以螺桿機構來呈現(另也可採用皮帶機構、滾輪機構或類似之傳動機構),另該Z軸升降馬達313係組設於該橫向移動模組312上,使Z軸升降馬達313係於該橫向移動模組312上進行位移, 藉以移動至需要作動之導線架11的位置上(如第6圖所示),而該Z軸升降馬達313係連著該偏心輪314,且該偏心輪314係與該壓力控制汽缸315相連接,使能進行上下移動,其中於本創作實施時係以偏心輪214來達成上下作動(另也可採用皮帶機構、螺桿機構或類似之傳動機構等方式來進行上下作動),另該滾輪316係組設於該壓力控制汽缸315下方,而該滾輪316係用來滾壓已附著於晶片50上之膠材60,以將膠材60之結合膜(Die Attach Film)62與晶片50間之氣泡擠出(如第7圖所示),其中該滾輪316係可採用大面積滾輪方式或同時使用多組滾輪方式來進行滾壓,且透過該壓力控制汽缸315來控制該滾輪316進行滾壓時之所需力道,以避免晶片50受損,而上述之壓力控制汽缸315乃需搭配氣壓控制才能達到上述之作動(另也可以採用音圈馬達或其他類似機構等方式來進行控制)。另該氣泡消除模組30之平台32上端處係設有一影像辨識機構33,該影像辨識機構33係具有攝像鏡頭,以能輔助定位該氣泡消除機構31之滾輪316的滾壓位置,以使該滾輪316在膠材60經高溫要與晶片50貼合前,能先將所產生的氣泡擠壓出去,避免因氣泡來導致其後續加熱過程時該晶片50貼合處產生破裂或造成晶片50散熱效果不佳等影響。 The air bubble eliminating mechanism 30 is provided with a bubble eliminating mechanism 31 and a platform 32. The platform 32 is disposed beside the transport module 12 of the lead frame transmission module 10, and is provided for the lead frame 11 of the lead frame transmission module 10. The lead frame 11 can be displaced to the platform 32 by the movement of the transport module 12 of the lead frame transport module 10, wherein the platform 32 itself has the ability to generate heat or heat to enable the platform 32 to be generated. The temperature is conducted to the wafer 50 placed on the lead frame 11 to allow the wafer 50 on the lead frame 11 to be heated. The bubble removing mechanism 31 is disposed on the transport module 12 of the lead frame transport module 10 and extends above the platform 32. The air bubble removing mechanism 31 is provided with a lateral moving motor 311 and a lateral movement. The module 312, a Z-axis lifting motor 313, an eccentric wheel 314, a pressure control cylinder 315 and at least one roller 316 (as shown in FIG. 5), and the lateral movement motor 311 is coupled to the lateral movement module 312. Connected, and the lateral movement module 312 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like is also used), and the Z-axis lifting motor 313 is assembled The lateral movement module 312 is configured to displace the Z-axis lifting motor 313 on the lateral movement module 312. By moving to the position of the lead frame 11 to be actuated (as shown in FIG. 6), the Z-axis lifting motor 313 is coupled to the eccentric 314, and the eccentric 314 is connected to the pressure control cylinder 315. The upper and lower movements are enabled, wherein the eccentric wheel 214 is used to achieve the up and down movement during the creation of the present invention (the belt mechanism, the screw mechanism or the like can also be used to move up and down), and the roller 316 is also used. The assembly is disposed under the pressure control cylinder 315, and the roller 316 is used to roll the glue 60 attached to the wafer 50 to bond the bubble between the Die Attach Film 62 and the wafer 50 of the glue 60. Extrusion (as shown in Fig. 7), wherein the roller 316 can be rolled by using a large-area roller method or a plurality of sets of rollers simultaneously, and the roller 316 is controlled to be rolled by the pressure control cylinder 315. The required force is to avoid damage to the wafer 50, and the pressure control cylinder 315 described above needs to be matched with the air pressure control to achieve the above operation (others can also be controlled by a voice coil motor or the like). An image recognition mechanism 33 is disposed at an upper end of the platform 32 of the bubble eliminating module 30. The image recognition mechanism 33 has an imaging lens to assist in positioning the rolling position of the roller 316 of the bubble eliminating mechanism 31. The roller 316 can squeeze the generated air bubbles before the adhesive material 60 is bonded to the wafer 50 at a high temperature to avoid cracking of the wafer 50 at the bonding stage or cause heat dissipation of the wafer 50 due to the bubble. The effect is not good.
另該底膜層分離模組40係有一底膜分離機構41及一平台42,該平台42係設於該導線架傳輸模組10之輸送模組12旁,並供導線架傳輸模組10之導線架11置放,使導線架11能隨該導線架傳輸模組10之輸送模組12作動而位移至該平台42上,其中該平台42本身乃具有能發出熱能或進行加熱,以使平台42能產生溫度來傳導到置 於導線架11上之晶片50,讓導線架11上之晶片50能加熱。而該底膜分離機構41係組設於該導線架傳輸模組10之輸送模組12上,並延伸至該平台42上方處,其中該底膜分離機構41係設有一橫向移動馬達411、一橫向移動模組412、一Z軸升降馬達413、一偏心輪414、一壓力控制汽缸415、一收料膠帶捲416、至少一收料馬達417及一壓合頭418(如第8圖所示),而該橫向移動馬達411係與該橫向移動模組412相連接,且該橫向移動模組412內於本創作實施時係以螺桿機構來呈現(另也可採用皮帶機構、滾輪機構或類似之傳動機構),另該Z軸升降馬達413係組設於該橫向移動模組412上,使Z軸升降馬達413係於該橫向移動模組412上進行位移,藉以移動至需要作動之導線架11的位置上(如第9圖所示),而該Z軸升降馬達413係連著該偏心輪414,且該偏心輪414係與該壓力控制汽缸415相連接,使能進行上下移動,其中於本創作實施時係以偏心輪214來達成上下作動(另也可採用皮帶機構、螺桿機構或類似之傳動機構等方式來進行上下作動),另該壓合頭418係組設於該壓力控制汽缸415下方,而該壓合頭418係壓合於收料膠帶捲416上(如第10圖所示),使收料膠帶捲416能平整貼合於膠材60上,用以貼合於該膠材60之底膜(Base Film)61,並透過Z軸升降馬達413作動上升以帶動壓力控制汽缸415、壓合頭418、收料膠帶捲416及收料馬達417連動上升,並同時將膠材60之底膜(Base Film)61與結合膜(Die Attach Film)62分離,讓分離後底膜(Base Film)61黏貼於收料膠帶捲416上(如第11圖所示),而結合膜(Die Attach Film)62則黏貼於晶片50上,另該該收料膠 帶捲416係套設於收料馬達417上,當分離後底膜(Base Film)61黏貼於收料膠帶捲416時,透過收料馬達417捲動收料膠帶捲416,以將黏貼於收料膠帶捲416之底膜(Base Film)61帶離壓合頭418下方(如第12圖所示),其中該壓力控制汽缸415、壓合頭418、收料膠帶捲416及收料馬達417可配置多組,以達到一次分離多個膠材60,或增加壓合頭418及收料膠帶捲416之面積,來提升工作效率,且透過該壓力控制汽缸415來控制該壓合頭418進行下壓時之所需力道,以避免晶片50受損,而上述之壓力控制汽缸415乃需搭配氣壓控制才能達到上述之作動(另也可以採用音圈馬達或其他類似機構等方式來進行控制)。另該底膜層分離模組40之平台42上端處係設有一影像辨識機構43,該影像辨識機構43係具有攝像鏡頭,以能輔助底膜分離機構41之壓合頭418進行定位,並協助壓合於晶片50上之膠材60後的精準量測,以提升壓合位置之精度。 The bottom layer separation module 40 is provided with a bottom film separation mechanism 41 and a platform 42. The platform 42 is disposed beside the transportation module 12 of the lead frame transmission module 10, and is provided for the lead frame transmission module 10 The lead frame 11 is placed such that the lead frame 11 can be displaced to the platform 42 with the movement of the transport module 12 of the lead frame transport module 10, wherein the platform 42 itself has the ability to generate heat or heat to enable the platform 42 can generate temperature to conduct The wafer 50 on the lead frame 11 allows the wafer 50 on the lead frame 11 to be heated. The bottom film separating mechanism 41 is disposed on the transport module 12 of the lead frame transport module 10 and extends above the platform 42. The bottom film separating mechanism 41 is provided with a lateral moving motor 411 and a The lateral movement module 412, a Z-axis lifting motor 413, an eccentric wheel 414, a pressure control cylinder 415, a receiving tape roll 416, at least one receiving motor 417 and a pressing head 418 (as shown in FIG. 8) And the lateral movement motor 411 is connected to the lateral movement module 412, and the lateral movement module 412 is presented by a screw mechanism during the creation of the present invention (a belt mechanism, a roller mechanism or the like may also be used). The Z-axis lifting motor 413 is disposed on the lateral movement module 412, and the Z-axis lifting motor 413 is displaced on the lateral movement module 412 to move to the lead frame that needs to be actuated. The position of 11 (as shown in FIG. 9), and the Z-axis lifting motor 413 is coupled to the eccentric 414, and the eccentric 414 is coupled to the pressure control cylinder 415 to enable up and down movement, wherein In the implementation of this creation, the eccentric wheel 214 is used to achieve the upper and lower The movement (otherwise, the belt mechanism, the screw mechanism or the like) can be used to perform the up and down operation, and the pressure head 418 is assembled under the pressure control cylinder 415, and the pressure head 418 is pressed. On the take-up tape roll 416 (as shown in FIG. 10), the take-up tape roll 416 can be flatly attached to the glue 60 for bonding to the base film 61 of the glue 60. And the Z-axis lifting motor 413 is actuated to drive the pressure control cylinder 415, the pressing head 418, the receiving tape roll 416 and the receiving motor 417 to rise in tandem, and simultaneously combine the base film 61 of the rubber material 60. The Die Attach Film 62 is separated, and the separated Base Film 61 is adhered to the take-up tape roll 416 (as shown in FIG. 11), and the Die Attach Film 62 is adhered to the wafer 50. On the other, the receipt glue The tape roll 416 is sleeved on the receiving motor 417. When the base film 61 is adhered to the take-up tape roll 416 after separation, the receiving tape roll 416 is rolled by the receiving motor 417 to be attached to the receiving tape 416. The base film 61 of the tape roll 416 is taped under the press head 418 (as shown in FIG. 12), wherein the pressure control cylinder 415, the press head 418, the take-up tape roll 416, and the take-up motor 417. Multiple sets may be configured to separate the plurality of glues 60 at a time, or to increase the area of the press head 418 and the take-up tape roll 416 to increase work efficiency, and control the press head 418 through the pressure control cylinder 415. The force required to press down to avoid damage to the wafer 50, and the pressure control cylinder 415 described above needs to be matched with the air pressure control to achieve the above action (others can also be controlled by a voice coil motor or the like) . Further, an image recognition mechanism 43 is disposed at an upper end of the platform 42 of the base film separation module 40. The image recognition mechanism 43 has an imaging lens to assist the positioning of the pressing head 418 of the base film separation mechanism 41, and assists Accurate measurement after pressing the glue 60 on the wafer 50 to improve the precision of the press position.
再者,本創作之作動乃是先由膠材取放機構21之吸嘴216來吸取膠材60後,再透過橫向移動模組212及Z軸升降馬達213來將吸嘴216移動至位於平台22上方的導線架11之晶片50上,且移動後之位置乃能透過影像辨識機構23來輔助定位,當吸嘴216移動至定位後,該吸嘴216即往下移動並壓合於導線架11之晶片50上,使膠材60能貼合於晶片50上,其中該導線架11下方之平台22能依膠材60特性來調整溫度,使膠材60較易附著於晶片50,而該吸嘴216上方之壓力控制汽缸215係能配合產品調整壓力,使吸嘴216下壓時不會造成晶片50損傷,而完成上述作動後,該吸嘴216即往上抬 升,以移動至原先位置處並準備進行下一段膠材60之吸附。 Moreover, the action of the creation is that the suction material 216 is sucked by the suction nozzle 216 of the rubber pick-and-place mechanism 21, and then the suction nozzle 216 is moved to the platform by the lateral movement module 212 and the Z-axis lifting motor 213. 22 above the lead frame 11 of the wafer 50, and the position after the movement can be assisted by the image recognition mechanism 23, when the nozzle 216 is moved to the position, the nozzle 216 moves downward and is pressed against the lead frame. The wafer 50 of the 11 can be adhered to the wafer 50. The platform 22 under the lead frame 11 can adjust the temperature according to the characteristics of the adhesive material 60, so that the adhesive material 60 can be easily attached to the wafer 50. The pressure control cylinder 215 above the suction nozzle 216 can adjust the pressure with the product, so that the suction nozzle 216 is pressed down without causing damage to the wafer 50, and after the above operation is completed, the suction nozzle 216 is lifted upward. l to move to the original position and prepare for the next stage of adsorption of the glue 60.
而當該導線架11上之晶片50皆完成貼合膠材60後,該導線架傳輸模組10便透過輸送模組12來將導線架11輸送至氣泡消除模組30之平台32上,並先由影像辨識機構33來進行滾壓位置之定位確認,再將氣泡消除機構31之滾輪316移動至定位後,該滾輪316即往下移動並壓合於導線架11之晶片50上,並貼附於晶片50上方之膠材60上,以讓滾輪316能壓著膠材60滾動,以將膠材60之結合膜(Die Attach Film)62與晶片50間之氣泡擠出,其中該導線架11下方之平台32能依膠材60特性來調整溫度,使膠材60較易附著於晶片50,而該滾輪316上方之壓力控制汽缸315係能配合產品調整壓力,使滾輪316下壓時不會造成晶片50損傷,而完成上述作動後,該滾輪316即往上抬升,以移動至原先位置處並準備進行下一次膠材60的壓合。 After the wafer 50 on the lead frame 11 is completed, the lead frame transfer module 10 transports the lead frame 11 to the platform 32 of the bubble eliminating module 30 through the transport module 12, and First, the image recognition mechanism 33 performs the positioning confirmation of the rolling position, and after the roller 316 of the bubble eliminating mechanism 31 is moved to the positioning, the roller 316 is moved downward and pressed onto the wafer 50 of the lead frame 11 and pasted. Attached to the glue 60 above the wafer 50, the roller 316 can be pressed against the glue 60 to extrude bubbles between the die attach film 62 of the glue 60 and the wafer 50, wherein the lead frame The platform 32 below 11 can adjust the temperature according to the characteristics of the glue material 60, so that the glue material 60 can be easily attached to the wafer 50, and the pressure control cylinder 315 above the roller 316 can adjust the pressure with the product, so that the roller 316 is not pressed. The wafer 50 is damaged, and after the above operation is completed, the roller 316 is lifted up to move to the original position and ready for the next press of the glue 60.
而當該導線架11上之晶片50皆完成膠材60壓合使氣泡擠出後,該導線架傳輸模組10便透過輸送模組12來將導線架11輸送至底膜層分離模組40之平台42上,並先由影像辨識機構43來進行位置之定位確認,再將底膜分離機構41之壓合頭418移動至定位後,該壓合頭418即往下移動並壓合於導線架11之晶片50上,使位於壓合頭418下方之收料膠帶捲416能貼附於晶片50上方之膠材60的結合膜(Die Attach Film)62上,其中該導線架11下方之平台42能依膠材60特性來調整溫度,使膠材60較易附著於晶片50,而該壓合頭418上方之壓力控制汽缸415係能配合產品調整壓力,使壓合頭41 8下壓時不會造成晶片50損傷,再者,當壓合頭418下方之收料膠帶捲416貼附於晶片50上方之膠材60的結合膜(Die Attach Film)62後,乃透過Z軸升降馬達413作動上升以帶動壓力控制汽缸415、壓合頭418、收料膠帶捲416及收料馬達417連動上升,並同時將膠材60之底膜(Base Film)61與結合膜(Die Attach Film)62分離,讓分離後底膜(Base Film)61黏貼於收料膠帶捲416上,而結合膜(Die Attach Film)62則黏貼於晶片50上,且該分離後底膜(Base Film)61乃隨著收料膠帶捲416往上升後也一併往上提升,因此,當壓合頭418上升至一定高度後,該收料馬達417捲動收料膠帶捲416,以將黏貼於收料膠帶捲416之底膜(Base Film)61帶離壓合頭418下方,藉此,以完成將裁切好之膠材60貼合於已固定好之晶片50上,且減少膠材60與晶片50間氣泡之產生,讓膠材60與晶片50的貼合位置之精度能提升,並具有提昇生產速度及產能之效果。 When the wafer 50 on the lead frame 11 is pressed and the bubbles are extruded, the lead frame transport module 10 transports the lead frame 11 to the base film separation module 40 through the transport module 12. On the platform 42, the image recognition mechanism 43 first confirms the position, and after the pressing head 418 of the bottom film separating mechanism 41 is moved to the positioning, the pressing head 418 moves downward and is pressed against the wire. On the wafer 50 of the frame 11, the take-up tape roll 416 located below the press head 418 can be attached to the Die Attach Film 62 of the glue 60 above the wafer 50, wherein the platform below the lead frame 11 42 can adjust the temperature according to the characteristics of the glue 60, so that the glue 60 can be easily attached to the wafer 50, and the pressure control cylinder 415 above the pressure head 418 can adjust the pressure with the product, so that the pressure head 41 When the pressing is performed, the wafer 50 is not damaged. Further, when the receiving tape roll 416 under the pressing head 418 is attached to the bonding film 62 of the adhesive 60 above the wafer 50, it is transmitted through Z. The shaft lifting motor 413 is actuated to drive the pressure control cylinder 415, the pressing head 418, the receiving tape roll 416 and the receiving motor 417 to rise in tandem, and at the same time, the base film 61 of the rubber material 60 and the bonding film (Die) The Attach Film 62 is separated, and the separated Base Film 61 is adhered to the take-up tape roll 416, and the Die Attach Film 62 is adhered to the wafer 50, and the separated base film (Base Film) ) 61 is also lifted up as the take-up tape roll 416 is raised, so that when the press head 418 is raised to a certain height, the take-up motor 417 rolls the take-up tape roll 416 to be adhered to The base film 61 of the take-up tape roll 416 is taken under the pressing head 418, whereby the cut-off glue 60 is attached to the fixed wafer 50, and the glue 60 is reduced. The generation of bubbles between the wafer 50 and the wafer 50 allows the precision of the bonding position of the glue 60 and the wafer 50 to be improved, and the production speed and productivity are improved. The effect.
藉由以上詳細說明,可使熟知本項技藝者明瞭本創作的確可達成前述目的,實已符合專利法之規定,爰提出專利申請。 By the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objectives, and has been in compliance with the provisions of the Patent Law, and has filed a patent application.
惟以上所述者,僅為本創作之較佳實施例而已,當不能以此限定本創作實施之範圍;故,凡依本創作申請專利範圍及創作說明書內容所作之簡單的等效變化與修飾,皆應仍屬本創作專利涵蓋之範圍內。 However, the above is only the preferred embodiment of the present invention, and the scope of the creation of the present invention cannot be limited by this; therefore, the simple equivalent changes and modifications made by the scope of the patent application and the content of the creation specification are All should remain within the scope of this creation patent.
10‧‧‧導線架傳輸模組 10‧‧‧ lead frame transmission module
11‧‧‧導線架 11‧‧‧ lead frame
12‧‧‧輸送模組 12‧‧‧Transport module
13‧‧‧動力傳輸器 13‧‧‧Power transmitter
14‧‧‧夾爪 14‧‧‧claw
20‧‧‧膠材置放模組 20‧‧‧Glue placement module
21‧‧‧膠材取放機構 21‧‧‧Glue pick and place mechanism
211‧‧‧橫向移動馬達 211‧‧‧ lateral moving motor
212‧‧‧橫向移動模組 212‧‧‧Transverse Mobile Module
213‧‧‧Z軸升降馬達 213‧‧‧Z-axis lifting motor
214‧‧‧偏心輪 214‧‧‧eccentric wheel
215‧‧‧壓力控制汽缸 215‧‧‧Pressure controlled cylinder
216‧‧‧吸嘴 216‧‧ ‧ nozzle
22‧‧‧平台 22‧‧‧ platform
23‧‧‧影像辨識機構 23‧‧‧Image Identification Agency
30‧‧‧氣泡消除模組 30‧‧‧ bubble elimination module
31‧‧‧氣泡消除機構 31‧‧‧ bubble elimination mechanism
311‧‧‧橫向移動馬達 311‧‧‧ lateral moving motor
312‧‧‧橫向移動模組 312‧‧‧Horizontal Mobile Module
313‧‧‧Z軸升降馬達 313‧‧‧Z-axis lifting motor
314‧‧‧偏心輪 314‧‧‧Eccentric wheel
315‧‧‧壓力控制汽缸 315‧‧‧Pressure controlled cylinder
316‧‧‧滾輪 316‧‧‧Roller
32‧‧‧平台 32‧‧‧ platform
33‧‧‧影像辨識機構 33‧‧‧Image Identification Agency
40‧‧‧底膜層分離模組 40‧‧‧ bottom film separation module
41‧‧‧底膜分離機構 41‧‧‧Bottom membrane separation mechanism
411‧‧‧橫向移動馬達 411‧‧‧Horizontal moving motor
412‧‧‧橫向移動模組 412‧‧‧Horizontal Mobile Module
413‧‧‧Z軸升降馬達 413‧‧‧Z-axis lifting motor
414‧‧‧偏心輪 414‧‧‧Eccentric wheel
415‧‧‧壓力控制汽缸 415‧‧‧Pressure controlled cylinder
416‧‧‧收料膠帶捲 416‧‧‧Receiving tape roll
417‧‧‧收料馬達 417‧‧‧Receiving motor
418‧‧‧壓合頭 418‧‧‧Pressing head
42‧‧‧平台 42‧‧‧ platform
43‧‧‧影像辨識機構 43‧‧‧Image Identification Agency
50‧‧‧晶片 50‧‧‧ wafer
60‧‧‧膠材 60‧‧‧Stained materials
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104211871U TWM518818U (en) | 2015-07-23 | 2015-07-23 | Glue bonding apparatus |
CN201520689928.5U CN205028890U (en) | 2015-07-23 | 2015-09-08 | Glue material laminating device |
JP2015005003U JP3201560U (en) | 2015-07-23 | 2015-10-02 | Adhesive layer laminating equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW104211871U TWM518818U (en) | 2015-07-23 | 2015-07-23 | Glue bonding apparatus |
Publications (1)
Publication Number | Publication Date |
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TWM518818U true TWM518818U (en) | 2016-03-11 |
Family
ID=54874222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104211871U TWM518818U (en) | 2015-07-23 | 2015-07-23 | Glue bonding apparatus |
Country Status (3)
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JP (1) | JP3201560U (en) |
CN (1) | CN205028890U (en) |
TW (1) | TWM518818U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607878B (en) * | 2015-07-23 | 2017-12-11 | Youngtek Electronics Corp | Rubber adhesive system and method |
CN108878298A (en) * | 2017-05-12 | 2018-11-23 | 鸿骐新技股份有限公司 | Biological identification chip module sealed in unit and its packaging method |
TWI760977B (en) * | 2019-06-19 | 2022-04-11 | 萬潤科技股份有限公司 | Heat dissipation pad bonding method and equipment |
TWI806167B (en) * | 2021-09-23 | 2023-06-21 | 均華精密工業股份有限公司 | Film attaching apparatus for chip |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109755140B (en) * | 2019-02-27 | 2023-10-17 | 西安派瑞功率半导体变流技术股份有限公司 | Universal automatic press-fitting mechanism for high-power semiconductor device |
CN111048448B (en) * | 2019-11-30 | 2023-06-02 | 宁波启谱自动化科技有限公司 | Normal temperature taping machine for integrated circuit lead frame |
CN111688334A (en) * | 2020-06-15 | 2020-09-22 | 歌尔股份有限公司 | Bubble repairing equipment and bubble repairing method |
CN112208198A (en) * | 2020-09-10 | 2021-01-12 | 许从平 | Brand pad printing machine for earphone round cover |
-
2015
- 2015-07-23 TW TW104211871U patent/TWM518818U/en unknown
- 2015-09-08 CN CN201520689928.5U patent/CN205028890U/en not_active Expired - Fee Related
- 2015-10-02 JP JP2015005003U patent/JP3201560U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI607878B (en) * | 2015-07-23 | 2017-12-11 | Youngtek Electronics Corp | Rubber adhesive system and method |
CN108878298A (en) * | 2017-05-12 | 2018-11-23 | 鸿骐新技股份有限公司 | Biological identification chip module sealed in unit and its packaging method |
TWI760977B (en) * | 2019-06-19 | 2022-04-11 | 萬潤科技股份有限公司 | Heat dissipation pad bonding method and equipment |
TWI806167B (en) * | 2021-09-23 | 2023-06-21 | 均華精密工業股份有限公司 | Film attaching apparatus for chip |
Also Published As
Publication number | Publication date |
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CN205028890U (en) | 2016-02-10 |
JP3201560U (en) | 2015-12-17 |
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