TWI575674B - Stacked wafer bonding process - Google Patents

Description

Stacked wafer bonding process

The invention relates to a stacked wafer bonding process, in particular to a design of a cutting mechanism and a rubberizing mechanism, so that the cut rubber material is less likely to generate bubbles when being bonded, and the loss of the rubber material can be reduced. The process has high speed and high yield performance, and is suitable for wafer (Wafer) back-end process, stacked wafer bonding process or the like.

The current semiconductor industry is broadly divided into three major areas: design, foundry, and packaging testing. It is considered that "integration" is of great importance to the semiconductor industry. In recent years, the semiconductor industry has been actively moving toward system-in-package (SiP) in order to achieve product performance and convenience.

In view of the development trend of packaged products, in order to improve the performance of a single package structure, a multi-chip stacked method has been developed to combine two or more wafers in a single package structure. In this way, the limitation of the operating speed of the system is minimized. Therefore, the wafer stacking and packaging method plays an indispensable role in the current semiconductor manufacturing process.

At present, in the wafer post-wafer process, a die bond is mostly used to bond the first wafer to the substrate, and a covered gel is provided between the first wafer and the second wafer, and the glue is dispensed. Or printing to form, however, because the coating glue system is formed by dispensing or printing, the thickness of the coating gel can not be uniform and the thickness is different, and it is easy to overflow and cause short circuit, and the coating gel is thick and thick. , to collect bubbles in the line of colloid, once the number of bubbles Too much will reduce the coating and adhesion of the overlying colloid.

Therefore, in view of the above-mentioned deficiencies, the present inventors have been able to propose a stacked wafer bonding process which is less prone to bubble generation during bonding and which can reduce the loss of the adhesive material, so that the user can easily operate the assembly, and is thoughtfully researched and designed. In order to provide user convenience, it is the motive of the invention developed by the inventors.

The main object of the present invention is to provide a stacked wafer bonding process, which comprises cutting a glue material on a tape roll mechanism from a feeding mechanism to a cutting mechanism, and then cutting the glue by a glue setting mechanism. The material is moved to the production platform to bond with the wafer, so that a layer of glue is added to the upper layer of the wafer for subsequent processes. This type of process has high elasticity and can be produced according to different product materials and sizes. The process can greatly reduce the loss of the rubber material, so that the process has the advantages of high speed, high elasticity and low cost consumption, thereby increasing the overall practicability and convenience.

Another object of the present invention is to provide a stacked wafer bonding process for moving the adhesive material forward to the cutting mechanism through the first jaw and the second jaw on the feeding mechanism, firstly the second jaw will Firstly closed on the glue material and simultaneously moved forward. After the second jaw is moved to the position, the first jaw is also closed on the glue material to control the length of the glue material to be cut. After the rubber material is removed from the cutting mechanism, the second jaw of the feeding mechanism moves forward and straightens the glue, and after the second jaw straightens the glue, the first The second jaw releases the glue, and the first jaw remains closed during the process, and the first jaw is closed after the second jaw moves to the feeding end to move the size distance to be cut. Opening, and the second jaw moves to the cutting end to move the size distance to be cut, and by the above action, the tape roll mechanism has a bottom film (Base) Film and Die Attach Film can be quickly sent to the cutting mechanism and cut by the cutting tool of the cutting mechanism, so that the feeding mechanism can control the length of the glue to be cut. It also has the effect of fast actuation and precise movement, which increases the overall speed.

A further object of the present invention is to provide a stacked wafer bonding process for adhering the cut adhesive material through a tape roll on the rubber dispensing mechanism, so that the cut rubber material can be taken out from the cutting mechanism. Then, the rubberizing mechanism is moved to the upper part of the production platform and then lowered to the cut material, which can be placed on the wafer of the production platform, and is pressed and micro-heated by the pressing body provided on the tape roll by the rubberizing mechanism. , so that the cut rubber can be flatly pressed onto the wafer of the production platform, and after the pressing body of the glue-setting mechanism is pressed, the pressed body will rise first to get detached from the tape roll of the rubber-distributing mechanism and cut well. The adhesive material, and then the tape roll of the rubberizing mechanism is raised, and the tape roll of the rubberizing mechanism also simultaneously removes the base film on the cut rubber material, so that the cut rubber material is cut. The Die Attach Film can be fixed on the wafer of the production platform, and the other wafers to be stacked are placed on the Die Attach Film, and the above-mentioned action can be used to make the setting mechanism cut. The glue is moved to the production platform and cut through the press The Die Attach Film of the good adhesive material can be attached to the wafer of the production platform, so that the rubberizing mechanism has the function of not being easy to generate bubbles when the bonding is performed, and also has the effect of accurate fitting, thereby increasing the overall sticking. Synergy.

In order to achieve the above object, the stacked wafer bonding process of the present invention mainly transfers the glue material on the tape roll mechanism from the feeding mechanism to the cutting mechanism for cutting action, and then the glue is cut by the glue setting mechanism. The material is moved to the production platform to be bonded to the crystal. The main steps are as follows: (a) conveying the adhesive film having the base film and the die attach film to the tape roll mechanism by the feeding mechanism (b) reusing the first jaw and the second jaw on the feeding mechanism to move the rubber forward, firstly the second jaw is first closed on the glue, and the same Moving forward to control the length of the glue to be cut. After the second jaw is moved to the position, the first jaw will also be closed on the rubber material for auxiliary positioning; (c) the second to be fed mechanism After the jaw is moved to the position, the cutting tool of the cutting mechanism also moves onto the glue and presses the glue, and simultaneously performs the cutting action; (d) cutting the cutting tool in the cutting mechanism After the rubber material, the second jaw of the feeding mechanism moves slightly backward in the closed state, so that the rubber material can be separated from the cut rubber material; (e) the rubberizing mechanism is moved to the cutting mechanism, and through The tape roll on the glue setting mechanism is used to adhere the cut glue to enable the cut glue to be taken out from the cutting mechanism; (f) the glue setting mechanism with the cut glue Moving to the top of the production platform and then descending until the cut glue can be placed on the wafer of the production platform; (g) re-pressing and micro-heating the pressure-bonding body provided on the tape roll through the glue-setting mechanism The cut glue can be flatly pressed onto the wafer of the production platform; (h) after the press-fit body of the glue-setting mechanism is pressed, the press-fit It will rise first to get rid of the tape roll of the glue-setting mechanism and the cut glue; (i) the tape roll of the glue-removing mechanism is raised again, and the tape roll of the glue-setting mechanism will also cut the glue at the same time. The base film is removed so that the cut film of the cut film can be fixed on the wafer of the production platform; and (j) the other wafers to be stacked are placed in combination. On the Die Attach Film.

For a fuller understanding of the features, features and aspects of the present invention, reference should be made to the accompanying drawings.

The preferred embodiment of the stacked wafer bonding process of the present invention is applied to a Wafer back-end process, a stacked wafer bonding process or the like, in particular, it will have a base film and a bonding film. (Die Attach Film) glue is cut and will be cut The bonded film of the cut (Die Attach Film) is attached to the wafer of the production platform.

In the stacked wafer bonding process of the present invention, the adhesive material of the tape roll mechanism is mainly conveyed by the feeding mechanism to the cutting mechanism for cutting operation, and then the glued material is moved to the production platform by the rubber setting mechanism. Performing a bonding operation with the wafer, wherein the wafer is cut by a wafer and placed on a substrate having a glue, and then the wafer is fixed in the oven, and the wafer completed through the above steps is sent to the wafer. The production platform is to be fitted.

The first step of the above-mentioned stacked wafer bonding process is that (a) conveying the adhesive film having the base film and the Die Attach Film on the tape roll mechanism to the cutting mechanism by the feeding mechanism; Since the tape roll mechanism is provided with a rubber material having a base film and a die attach film, the glue material is usually two or three layers, and if the three layers are removed, the mechanism can be removed first. Then, the rubber material having the base film and the Die Attach Film is transported to the cutting mechanism through the feeding mechanism, and the feeding mechanism includes the cylinder, the motor, the driving wheel, the auxiliary wheel, and the first Components such as the jaws and the second jaws are capable of transporting the glue in parallel and quickly to the cutting mechanism, and after completing the above steps, the next step is performed.

The glue in the above step is divided into a base film and a die attach film, and the adhesive between the base film and the die attach film prevents detachment before production. This viscosity will result in the inability to smoothly separate the Base Film and the Die Attach Film during the step (i), so that some products are required to reduce the adhesion between the two layers by illuminating the lamp through a ultraviolet (UV) light source. In the process of the present invention, an ultraviolet (UV) light source illumination lamp can be installed on the rubber material in the process of feeding the feeding mechanism to the cutting mechanism, and when the rubber material needs to reduce its viscosity from high viscosity. At low viscosity, the ultraviolet (UV) light source from the lamp can be illuminated by an ultraviolet (UV) light source to achieve the desired purpose.

In addition, the next step is to (b) reuse the first jaw and the second jaw on the feeding mechanism to move the rubber forward, firstly the second jaw will be closed on the glue first, and at the same time Move forward to control the length of the rubber material to be cut. After the second jaw is moved to the position, the first jaw will also be closed on the rubber material for auxiliary positioning; when the feeding mechanism will have a base film (Base Film And the adhesive material of the Die Attach Film is conveyed to the cutting mechanism, the first jaw of the feeding mechanism first releases the glue, and the second jaw is first closed on the glue, and At the same time, the rubber material is moved forward to control the length of the rubber material to be cut. After the second jaw is moved to the position, the first jaw is also closed on the rubber material to assist the positioning, so that the feeding mechanism is first. The clamping jaw and the second clamping jaw can fix the rubber material, so that the rubber material is not easy to slide, so as to accurately control the length of the rubber material to be cut, and after completing the above steps, the next step is performed.

In addition, the next step is (c) after the second jaw of the feeding mechanism is moved to the position, the cutting tool of the cutting mechanism is also moved to the glue and pressed against the glue, and simultaneously cut down. Cutting action; when the second jaw of the feeding mechanism is moved to the position, the glue moving at the cutting mechanism with the second jaw is also moved to the length that can be cut, and the cutting mechanism is provided with cutting The cutting tool moves the cutting tool to the glue material and presses the glue material, wherein the cutting tool is provided with foam underneath the cutting tool to protect the cutting tool from crushing the glue material without damaging the glue At the same time, the cutting mechanism will open the negative pressure to fix the glue to the cutting mechanism by vacuuming, so that the cutting tool can be cut downwards to cut the glue to the required length. After completing the above steps, the next step is taken.

In addition, the next step is to (d) after the cutting tool of the cutting mechanism cuts the glue, the second jaw of the feeding mechanism moves slightly backward in the closed state, so that the glue and the cutting are good. The glue can be separated; when the cutting tool of the cutting mechanism performs the required length of the material cutting After that, the second jaw of the feeding mechanism is closed on the rubber material, and the second jaw starts to move slightly backward (as shown in Fig. 7), so that the glue on the cutting mechanism and the cut glue The material can be properly separated, so that the rubber material cut by the cutting tool and the cut rubber material will not stick together due to the residual glue, and the next step is completed after the above steps are completed.

In addition, the next step is to (e) move the rubberizing mechanism to the cutting mechanism, and stick the cut rubber through the tape roll on the rubberizing mechanism, so that the cutting can be done. The rubber material is taken out from the cutting mechanism; when the cutting tool of the cutting mechanism cuts the rubber material, the cutting tool will first break away from the pressed rubber material, and at the same time, the rubberizing mechanism will move to the cutting mechanism. Above, then move down to the position of the cut glue, wherein the glue setting mechanism is provided with a tape roll heel and the tape roll on the glue mechanism is used to adhere the cut glue. At the same time, the cutting mechanism will close the negative pressure, so that the glue-removing mechanism can move the cut rubber material upwards along with the tape roll while moving upwards, so that the cut-off glue can be self-cut. The cutting mechanism is taken out, and after the above steps are completed, the next step is performed.

In the above step, before the rubberizing mechanism is moved to the cutting mechanism, the image identification system can be additionally used to identify the cut adhesive material, wherein the image recognition system has a photosensitive coupling element (CCD) to enable the image to be imaged. Turning into a digital signal, and at the same time at the top of the cutting mechanism, when the cutting tool of the cutting mechanism cuts the glue, the cutting tool will first break away from the pressed glue, and then the image can be recognized by the image. The system determines the position and size of the cut rubber to confirm that the size of the cut rubber is in accordance with the requirements, and avoids the time difference and yield of the next process due to the size difference.

In addition, the next step is to (f) move the rubberizing mechanism with the cut rubber to the top of the production platform and then descend to the wafer where the cut rubber can be placed on the production platform. When the adhesive tape of the rubberizing mechanism is adhered to the cut rubber, the rubberizing mechanism can be moved to the upper part of the production platform at the same time, and then the cutting material can be placed on the production platform. On the wafer, the cut glue can accurately correspond to the wafer, and after the above steps are completed, the next step is performed.

In addition, the next step is to (g) repress and pressurize the embossed body provided on the tape roll through the rubberizing mechanism, so that the cut glue can be flatly pressed onto the wafer of the production platform; When the cut material corresponding to the tape roll of the rubber dispensing mechanism is lowered corresponding to the wafer of the production platform, the pressing body of the rubberizing mechanism disposed on the tape roll simultaneously pressurizes the cut rubber material. And the micro-heating operation, in addition to allowing the cut film with the base film and the Die Attach Film to be flattened and pressed on the wafer of the production platform, the cut material can also be cut. The base film and the Die Attach Film can be separated, and after the above steps are completed, the next step is performed.

In addition, the next step is to (h) after the pressure-bonding body of the rubber-filling mechanism is pressed, the pressure-bonding body will first rise to separate from the tape roll of the rubber-laying mechanism and the cut rubber material; After the embossing body presses the cut film having the base film and the Die Attach Film to the wafer of the production platform, the pressing body of the rubberizing mechanism first rises to deviate from the setting. The tape roll of the glue mechanism and the cut glue, and the tape roll of the glue mechanism is attached to the wafer with the cut film with the base film and the Die Attach Film. And after completing the above steps, proceed to the next step.

In addition, the next step is to (i) further raise the tape roll of the rubber dispensing mechanism, and the tape roll of the rubberizing mechanism also simultaneously removes the base film on the cut rubber material, so that the base film is removed. The die attach film (Die Attach Film) can be fixed on the wafer of the production platform; when the pressing body of the rubberizing mechanism rises, the tape roll of the rubberizing mechanism also rises, and the tape roll rises. with It will also be carried away with the base film of the cut adhesive tape adhered to the tape roll, and the tape roll of the glue-setting mechanism is rolled to be cut on the glue. The base film is placed under the press-fit body of the disengagement glue mechanism, and the die-bonded die attach film (Die Attach Film) can be fixedly attached to the wafer of the production platform, and after the above steps are completed, Next step.

In addition, the next step is to (j) place another wafer to be stacked on the Die Attach Film; when only the die attach film (Die Attach Film) is left on the wafer of the production platform, The other wafers to be stacked can be placed on the Die Attach Film, and the process of the above steps is repeated, so that the rubberizing mechanism can move the cut glue to the production platform and stack. The wafer is subjected to the next bonding operation, whereby the cut process is easy to generate bubbles when the bonded material is bonded, and the loss of the adhesive material can be reduced, so that the process has high speed and high yield. The effectiveness, which in turn increases the overall usability and convenience.

After the above step (d), after the cutting tool of the cutting mechanism cuts the glue, the second jaw of the feeding mechanism moves slightly backward in the closed state, so that the glue and the cut glue are good. After the action, the cutting mechanism and the feeding mechanism perform the following steps to allow the first jaw and the second jaw of the feeding mechanism to return to the initial state.

The first step is to remove the cutting tool of the cutting mechanism to the top of the cut glue; when the cutting tool of the cutting mechanism finishes cutting the glue, the cutting tool will first Remove the pressed rubber and remove it to the top of the cut rubber. After completing the above steps, proceed to the next step.

In addition, the next step is that after the glue to be cut is taken out by the cutting mechanism, the second jaw of the feeding mechanism moves forward and straightens the glue; when the glue setting mechanism is in progress The upper movement will also be the same as the cut rubber glued by the tape roll of the rubberizing mechanism. After the cutting mechanism is taken out, the second jaw of the feeding mechanism is changed from the original slightly rearward moving position to the forward movement, and the glue is straightened by the action, so that the rubber material can be restored to the original flatness. Look at the appearance, and after completing the above steps, proceed to the next step.

In addition, the next step is that after the second jaw is straightened, the second jaw releases the glue, and the first jaw remains closed during the process; when the second jaw of the feeding mechanism After the rubber material is straightened, the second jaw of the feeding mechanism is changed from the original closing on the rubber material to the action of releasing the separating rubber material, so that only the first jaw of the feeding mechanism is closed on the rubber material. And after completing the above steps, proceed to the next step.

In addition, the next step is to close the clamping material after the second jaw moves to the feeding end for the size distance to be cut, the first clamping jaw is released, and the second clamping jaw is moved to the cutting end again. The dimension distance of the cutting; when the second jaw of the feeding mechanism moves the glue to the feeding end to the size distance to be cut, the second jaw will close and clamp the glue, and the first jaw will be released. The rubber material moves the second jaw to the cutting end to move the size distance to be cut, thereby allowing the first jaw and the second jaw of the feeding mechanism to return to the above steps, and repeating the above steps.

From the above detailed description, it will be apparent to those skilled in the art that the present invention can achieve the foregoing objects, and the invention has been in accordance with the provisions of the patent law.

However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; therefore, the simple equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the invention are modified. All should remain within the scope of the invention patent.

Claims (6)

A stacked wafer bonding process mainly comprises conveying a glue material on a tape roll mechanism from a feeding mechanism to a cutting mechanism for cutting, and the cutting mechanism is provided with a cutting tool and under the cutting tool Foam is provided at the place to protect the cutting tool from crushing the rubber material without damaging the rubber material, and then the glued material is moved to the production platform to be attached to the wafer. The main steps are as follows: (a) conveying the adhesive film having the base film and the Die Attach Film on the tape roll mechanism to the cutting mechanism by the feeding mechanism; (b) reusing the feeding mechanism The first jaw and the second jaw move the glue forward, firstly the second jaw is first closed on the glue and simultaneously moved forward to control the length of the glue to be cut, to be After the two jaws are moved to the positioning, the first jaws are also closed on the rubber material for auxiliary positioning; (c) after the second jaw of the feeding mechanism is moved to the positioning, the cutting tool of the cutting mechanism is also moved to The rubber material is pressed against the rubber material, and at the same time, the cutting action is performed downward; (d) in the cutting mechanism After the cutting tool cuts the glue, the second jaw of the feeding mechanism moves slightly backward in the closed state, so that the glue can be separated from the cut glue; (e) the glue mechanism is moved to the cutting Cutting the mechanism and sticking the cut rubber through the tape roll on the rubberizing mechanism, so that the cut rubber can be taken out from the cutting mechanism; (f) will be cut with good The glue dispensing mechanism of the rubber material is moved to the upper part of the production platform and then lowered until the cut rubber material can be placed on the wafer of the production platform; (g) the pressure is applied through the pressure-bonding body provided on the tape roll. And micro-heating operation, so that the cut glue can be flatly pressed onto the wafer of the production platform; (h) After the press-fit body of the glue-retaining mechanism is pressed, the press-fit body will rise first to disengage the tape roll of the glue-disposing mechanism and the cut-off glue; (i) the tape roll of the glue-removing mechanism is raised again The tape roll of the rubberizing mechanism also carries away the base film on the cut rubber material, so that the cut film of the cut adhesive film (Die Attach Film) can be fixed on the production platform. On the wafer; and (j) placing other wafers to be stacked on the Die Attach Film. The stacked wafer bonding process of claim 1, wherein after the step (d), the cutting mechanism and the feeding mechanism further comprise the steps of: removing the cutting tool of the cutting mechanism to the cutting The top of the good rubber material; after the rubber material to be cut is taken out by the cutting mechanism, the second jaw of the feeding mechanism moves forward and straightens the glue; after the second jaw is straightened After the glue, the second jaw releases the glue, and the first jaw remains closed during the process; and the second jaw moves to the feed end to close the size of the material to be cut, and then closes the clamp. The first jaw is released, and the second jaw moves to the cutting end to move the size distance to be cut. The stacked wafer bonding process according to claim 1, wherein the second clamping device in the step (b) moves to the positioning, the cutting mechanism further opens the negative pressure to vacuum the rubber material. Fixed, and in step (e), when the setting mechanism is to take out the cut glue from the cutting mechanism, the cutting mechanism further closes the negative pressure, so that the cut glue can be glued Take away. For example, in the stacked wafer bonding process described in claim 1, wherein the rubberizing mechanism in the step (e) is moved to the cutting mechanism, and the image recognition system is further The cut rubber is identified by position and size to confirm that the cut rubber meets the requirements. The stacked wafer bonding process according to claim 1, wherein the tape roll of the rubberizing mechanism in the (i) step rises and the base film on the cut rubber material is removed. The tape roll of the setting mechanism is further rolled to bring the base film on the cut rubber material to the lower side of the pressing body of the adhesive mechanism. The stacked wafer bonding process according to claim 1, wherein the glue is further irradiated by a ultraviolet (UV) light source when being sent by the feeding mechanism to the cutting mechanism, and the glue needs to be glued. When the viscosity is lowered from high viscosity to low viscosity, it can be irradiated by ultraviolet (UV) light source emitted from the lamp through a ultraviolet (UV) light source.