JP4369901B2 - Sealing device - Google Patents

Description

  The present invention relates to a resin sealing device including a mold that opens and closes oppositely.

  Conventionally, resin sealing of electronic parts using a mold has been widely performed. Here, the mold is opened and closed for each sealing unit, and each time the molded product before sealing and the molded product after sealing are attached to and removed from the mold by a dedicated device.

  More specifically, when the mold is opened after being sealed, the molded product take-out mechanism takes out the sealed molded product from the mold. Thereafter, the molded product before sealing is supplied to the same mold side (upper mold or lower mold) from which the molded product is taken out by the molded product supply mechanism, and the next sealing operation is performed. Be started.

  As described in Patent Document 1, in a conventional transfer device, a substrate or a lead frame (hereinafter sometimes simply referred to as a molded product) on which electronic components are mounted on a lower mold surface of a mold that opens and closes up and down. After mounting and resin sealing, the mold was opened with the molded product remaining in the lower mold, and this was taken out. In continuous operation, after the mold is opened, the resin-sealed molded product on the lower mold is taken out, and after this is carried out, the resin is held in the middle of the path for carrying in the molded product, and simultaneously conveyed, Set in the lower mold. Thus, the space for handling the molded product and the space for handling the molded product are separated in terms of time. However, there are spatially shared portions for the conveyance path of the molded product, resin, and molded product.

  In addition, as described in Patent Document 2, in a conventional compression molding apparatus, a substrate or a lead frame on which electronic components are mounted is attached to an upper mold surface of a mold that opens and closes up and down, and a product is sealed after resin sealing. The structure was such that the mold opened and left in the upper mold. In this case, the part to be molded and the place where the molded product are handled are separated in time, but the conveyance path has a portion that is spatially shared.

JP2001-7129A JP 2003-133352 A

  However, if the mold for supplying the molded product is the same as the mold for taking out the molded product, the next molded product must be supplied after the sealed molded product is taken out by the take-out mechanism. In other words, it could be an impediment to shortening the cycle time of the molded product.

  Further, when supplying and taking out the same mold, the supply route and the take-out route, and further, a part of the resin carry-in route are always overlapped. This is due to the occurrence of resin burrs and resin scum (mainly oozing out on the clamping surface of the mold during resin sealing), etc., in the molded product after sealing. Considering the possibility of scattering in the take-out process, this results in an increase in the possibility of sticking to a molded article supplied thereafter and causing a sealing abnormality. That is, since a load of several tons to several tens of tons is applied to the molded product in the resin sealing process, resin debris or the like is firmly attached to the molded product, or a part of the molded product is deformed. Effect.

  In particular, in the case of a product in which resin molding is performed on one side of a molded product, there are many that have an electrode on the surface in contact with the mold. This also increases the possibility of bonding failure when bonding the terminals.

  Also, the resin used as the molding material is the largest source of dust generation, and transporting this resin through the transport path where the same or many parts overlap as the molded product may cause the same problems as resin scum. high.

  Therefore, the present invention has been made to solve the above problems.

According to the present invention, in a resin sealing device that seals a molded product with a resin using first and second molds that open and close oppositely, the molded product is supplied to the first mold. and is configured to take out the resin sealed molded article from said second mold Rutotomoni, enters between the first, wherein when the second mold is opened first, second mold An entry member capable of being supplied to the entry member, and a molded article supply mechanism capable of supplying the article to be molded to the first mold, and taking out the molded article from the second mold. By providing both of the possible molded product take-out mechanisms , the above-mentioned problems are solved.

This makes it possible to take out the molded product and supply the molded product at the same time. Also, by transporting while ensuring the transfer space independent the molded article and the molded article, respectively, Ru can avoid adherence of the resin dregs, etc. floating. Further, according to the present invention, an entry member is provided which can enter between the first and second molds when the first and second molds are open, and the entry member includes the article to be molded as described above. A molding product supply mechanism that can be supplied to the first mold and a molded product extraction mechanism that can take out the molded product from the second mold are provided .

  As a result, the entry member serves as both a molded product supply mechanism and a molded product take-out mechanism, and further downsizing of the entire apparatus can be expected.

  Further, a molded product stock part for stocking the molded product, a molded product storage part for storing the molded product, and the molded product stock part to the first mold. When the area where the molded product is conveyed is the first area and the area where the molded article is conveyed from the second mold to the molded article storage unit is the second area, the first area It is good also as a structure provided with the apparatus which flows air from an area | region to the said 2nd area | region.

  This creates a one-way air flow from the first region to the second region, and actively prevents the flow of resin debris from the second region to which the molded product is conveyed to the first region. At the same time, it is possible to prompt the discharge of resin residue from the second region.

  Further, a resin supply unit may be provided, and the resin supply unit may be disposed at a position facing the first region with the first and second molds interposed therebetween.

  As a result, the area (first area) for handling the molded product and the area for handling the resin that can be the largest dust generation source are arranged to be maximally isolated, before being used for sealing to the molded product. It is possible to prevent the resin from adhering. In addition, with such an arrangement, the guides used for the conveyance mechanism (molded product supply mechanism, molded product takeout mechanism, resin supply mechanism) into the mold can be shared, and the cost of the apparatus can be reduced. .

  Further, the pressure in the resin supply unit may be set lower than the pressure around the molding target supply mechanism and in the first region.

  Thereby, it is possible to reliably prevent the dust of the resin from scattering from the resin supply unit to the periphery of the molded product supply mechanism and the first region.

  The first and second molds may be transfer molding dies.

  Accordingly, since the molded product is removed from the mold on the resin sealing surface side of the molded product, it is possible to suppress adhesion of the resin residue or the like to the molded product used for the next sealing.

  The second mold may be a compression mold having a bottom mold corresponding to the molded product and a frame-shaped mold that is slidably fitted to the bottom mold.

  Thereby, by applying to compression molding which does not have a pot, a runner, etc., generation | occurrence | production of the resin residue can be suppressed and it can suppress that the resin residue etc. adhere to the to-be-molded product used for the next sealing.

  In addition, a release film for improving releasability is supplied to the resin molding surface side of the second mold, and when the molded product is released from the first mold after sealing. The frame-shaped mold may be configured to protrude in the first mold direction as compared with the bottom mold.

  Thereby, scattering of resin residue etc. can be further suppressed, and the mold release load applied to the molded product when the molded product is taken out can be reduced.

Further, the advance input member, and vertically movable by a mechanism for opening and closing the mold, the molded article supply mechanism of the the first die and the molded article removing mechanism from the second mold, respectively Alternatively, it may be configured to abut against and retract from the opposing mold surface.

  As a result, the molded product supply mechanism and the molded product take-out mechanism can be brought into contact with and retracted from the opposing mold surfaces.

  According to the present invention, improvement in yield of the entire apparatus can be expected. Moreover, abnormal sealing can be prevented.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is an overall front view of a resin sealing device 1 as an example of an embodiment of the present invention, and FIG. 2 is a plan view. Both are perspective views for explanation.

  The resin sealing device 1 is a so-called compression-type resin sealing device that performs resin sealing using a compression mold.

  The resin sealing device 1 includes a casing 82, a resin supply unit 70, a sealing unit 84, and a transport unit 86. Reference numeral 88 denotes a foot.

  The sealing portion 84 is provided with a press 10 that opens and closes up and down. An upper mold (first mold) 21 is disposed on the fixed platen 11 of the press 10, and a lower mold (second mold) 22 is disposed on the movable platen 12 side. The upper mold 21 and the lower mold 22 can be appropriately replaced according to the type of the molded product to be resin-sealed. Further, the fixed platen 11 and the movable platen 12 may be configured upside down.

  The release film 3 is always supplied onto the surface (clamp surface C) of the lower mold 22, and the release film 3 can be supplied and wound by the film supply mechanism 30.

  The conveyance unit 86 includes a plurality of molded product stock magazines 51a that can stock a plurality of molded products before sealing with the sealing surface facing downward, and a plurality of molded products after resin sealing. A magazine 51b for storing a molded product that can be stored is arranged so as to overlap vertically. Both the magazines 51a and 51b can be moved up and down (moved up and down) as needed by the magazine elevator 50.

  In addition, between the magazines 51a and 51b and the sealing portion 84 described above, it is possible to supply the molded product to the sealing portion 84 and to take out the molded product after sealing from the sealing portion 84. A supply take-out mechanism 40 in which a molded product supply mechanism and a molded product take-out mechanism are integrated is arranged. In the present embodiment, the supply / withdrawing mechanism 40 that is also an entry member is movable in a direction substantially perpendicular to the opening / closing direction of the press 10. Further, both the magazines 51a and 51b described above are positioned on an extension line in the moving direction of the supply / extraction mechanism 40. Further, the supply mechanism and the take-out mechanism are integrally formed, which contributes to the compactness of the entire apparatus. Of course, they may be configured as separate bodies. The supply / withdrawing mechanism 40 is configured to be able to enter between the molds 21 and 22 when the press 10 is operated and the upper mold 21 and the lower mold 22 are opened. Further, in this embodiment, when entering, the space between both molds 21 and 22 is shielded, and it also functions as a shielding member for further clarifying the independence of the conveyance path of the molded product and the conveyance path of the molded product. ing. Here, “shielding” means shielding the space to the extent that resin burrs, resin debris, etc. after resin sealing cannot directly reach the mating mold.

  Further, in the supply / outtake mechanism 40, a molded product taken out from the molded product stock magazine 51a can be positioned and placed on the upper mold 21 side in a state of entering between the two molds 21 and 22. A placement unit 41 (molded product supply mechanism) exists. On the other hand, on the lower mold 22 side, there is a take-out portion 42 (molded product take-out mechanism) capable of sucking and holding the molded product after sealing. Further, the placing portion 41 and the take-out portion 42 are supported by a pair of vertically movable moving mechanisms (not shown), and are brought into contact with and retracted from the die by the operation of the press 10 between the dies 21 and 22. Reference numeral 63 denotes a rail-shaped guide, and the molded product taken out by the take-out portion 42 along with the rail-shaped guide is stored in the molded product storage magazine 51b. For convenience of explanation, the supply / withdrawing mechanism 40 provides a first area in which the molded product is conveyed from the molded product stock magazine 51a to the upper mold 21 which is the first mold through the mounting portion 41. On the other hand, the second region E2 is a region where the molded product is conveyed from the lower die 22 which is the second die to the magazine 51b for storing the molded product via the take-out part 42 and the rail guide 63. And Reference numeral 60 denotes a substrate moving mechanism. A substrate chuck 61 capable of taking out a molding product stored in the molding product stock magazine 51a, and a molded product taken out from the sealing portion 84 by the supply take-out mechanism 40 into a rail shape. A push portion 62 that can be pushed along the guide 63 into the molded product storage magazine 51b is provided.

  Although not shown, from the first region E1 side to the second region E2 side by providing a suction mechanism at the lower part of the conveying unit 86 in FIG. The air can flow in one direction.

  The resin supply unit 70 is positioned to face the transfer unit 86 described above with the sealing unit 84 interposed therebetween, and further to the first region E1.

  The resin supply unit 70 has a resin stocker 71 for stocking a resin (semi-cured resin) 2 formed in a flat plate shape, a resin stocker elevator 72 capable of moving the resin stocker 71 up and down, and a resin 2 can be measured. A weighing unit 73 and a resin setting unit 74 on which the measured resin 2 is set are provided. The resin conveying mechanism 75 can convey the resin 2 from the resin stocker 71 to the resin setting unit 74. In addition, a resin charging portion 45 configured to allow the resin 2 set in the resin setting portion 74 to be charged into the sealing portion 84 is provided. Further, in the resin sealing device 1, the resin supply unit 70 is a space partitioned by a partition plate 83, and air in the space can be sucked by a suction mechanism (not shown).

  Reference numeral 80 denotes an electrical component.

  FIG. 3 is a left side view of the resin sealing device 1, and shows only the magazines 51a and 51b and the magazine elevator 50. FIG. 4 is a right side view of the resin sealing device 1, and illustrates each part constituting the resin supply unit 70.

  Next, the upper mold 21 and the lower mold 22 will be described in more detail with reference to FIG.

  FIG. 5 is a diagram schematically showing the upper mold 21 and the lower mold 22. The clamp surface C of the upper mold 21 is provided with suction holes 21a, and a molded product 90 before being resin-sealed is disposed. The molded product 90 is sucked by the suction hole 21a and a suction mechanism (not shown) and is sucked and fixed to the upper mold 21.

  On the other hand, the lower mold 22 includes a bottom mold 23 that constitutes the bottom of the cavity, and a frame-shaped mold 24 that is fitted around the bottom mold 23 so as to be movable up and down. The clamp surface C of the frame-shaped mold 24 is provided with a suction hole 24a connected to a suction mechanism (not shown). The release film 3 is supplied on the clamp surface C of the lower mold 22. As this release film 3, for example, a polytetrafluoroethylene (PTFE) film, an ethylene-tetrafluoroethylene (ETFE), a polyethylene terephthalate (PET) film, a polypropylene (PP) film, a polyvinylidene fluoride (PBDF) film or the like is used. .

  Next, the operation of the resin sealing device 1 will be described.

  First, the operation of the transport unit 86 will be described.

  The substrate chuck 61 grips and pulls out the end portion of the molded product 90 set in advance in the molded product supply magazine 51a. The drawn molded product 90 is released so as to be placed on the mounting portion 41 of the supply / withdrawing mechanism 40, and then the substrate chuck 61 is retracted. The supply / withdrawing mechanism 40 on which the molded product 90 is placed on the placement portion 41 enters between the molds 21 and 22 at a predetermined timing when the upper mold 21 and the lower mold 22 are opened. At this time, after the molded product on the lower mold 22 that has already been sealed is sucked and held on the extraction part 42 and the molded product 90 of the mounting part 41 is set on the upper mold 21, both molds 21, Retreat from between 22 (details will be described later). At this time, the supply / withdrawing mechanism 40 that enters between the molds 21 and 22 functions as a shielding member, and functions to partition the molded product 90 and the conveyance path (conveyance space) of the molded product. Thereby, it is possible to greatly reduce the possibility that resin burrs and resin residues generated from the already sealed molded product adhere to the molded product 90 before sealing.

  In conjunction with the operation of the conveying unit 86, the resin supply unit 70 operates as follows.

  The resin 2 stocked in the resin stocker 71 is sucked and held by the resin transport mechanism 75 and transported to the weighing unit 73. The resin stocker 71 from which the resin 2 has been taken out is prepared for the next removal by the resin stocker elevator 72 being raised by the height of the taken out resin.

  If the measurement result in the measurement unit 73 is within a predetermined allowable range, the resin conveyance mechanism 75 sucks and holds it again and conveys it to the resin setting unit 74. A maximum of two sets of resins 2 can be set in the resin setting portion 74, and the resin sets move each time one resin 2 is set. The resin 2 set in the resin setting portion 74 is adsorbed and held by the resin charging portion 45 and enters between the two dies 21 and 22 at a predetermined timing when the upper die 21 and the lower die 22 are opened. Then, it is transported into the cavity portion of the lower mold 22. In addition, the resin supply part 70 is provided in the position which opposes 1st area | region E1 on both sides of the 1st, 2nd metal mold | die, and, thereby, the area | region (1st area | region) which handles a to-be-molded product, and Further, it is possible to prevent the resin before being used for sealing from adhering to the product to be molded by disposing the region that handles the resin that can be the largest dust generation source as far as possible. In addition, with such an arrangement, the guides used for the conveyance mechanism (molded product supply mechanism, molded product takeout mechanism, resin supply mechanism) into the mold can be shared, and the cost of the apparatus can be reduced. . Further, since the internal air is sucked into the resin supply unit 70 by a suction mechanism (not shown), the resin supply unit 70 is placed from the first region E1 of the sealing unit 84 and the transport unit 86, that is, the molded product stock magazine 51a. The negative pressure is lower than the area where the molded product is conveyed to the upper mold 21 which is the first mold through the portion 41. Therefore, resin dust or the like generated in the resin supply unit 70 is not scattered on the first region E1 side where the molded product 90 exists, preventing adhesion and improving sealing accuracy.

  In addition, by a suction mechanism provided at the lower part of the transport unit 86 and a blower mechanism provided at the upper part of the transport unit 86, the first region E1 side to the second region E2 side, i.e., the second mold is lowered. Air is flowed in one direction from the mold 22 to the area where the molded product is conveyed to the molded product storage magazine 51b via the take-out part 42 and the rail guide 63, and the molded product before the resin residue is sealed. At the same time, the resin residue generated in the second region is discharged.

  Next, the operation of the sealing portion 84 will be described.

  Due to the action of the conveying section 86 described above, the product to be molded is supplied to the upper mold 21 and is sucked and fixed by the suction holes 21a. On the other hand, on the lower mold 22 side, the sealed molded product is taken out by the action of the conveying unit 86, and only the release film 3 exists on the clamp surface C of the lower mold 22. After the molded product is taken out, the suction of the release film 3 is once released, and a new film is supplied by the film supply mechanism 30. Thereafter, suction is performed again, and the release film 3 is attracted to the clamp surface of the lower mold 22. Further, in this state, the resin 2 is supplied to the lower mold 22 side by the function of the resin supply unit 70 described above.

  As described here, by using the release film 3, the molded product is easily released, and at the same time the release load applied to the molded product is reduced. Therefore, resin burrs and the like are scattered by the impact at the time of release. This can be further suppressed.

  Since the lower die 22 is sufficiently warmed to melt the resin 2, the lower die 22 flows according to the shape of the cavity as the press 10 moves and the upper die 21 and the lower die 22 are clamped, The molded product 90 is resin-sealed. At the time when both molds 21 and 22 are opened after sealing, the suction of the suction holes 21a provided in the upper mold 21 is released, so that the sealed molded product remains on the lower mold 22 side. At this time, the frame-shaped mold 24 constituting the lower mold 22 protrudes toward the upper mold 21 by the thickness of the molded product as compared with the bottom mold 23, but is separated due to the presence of the release film 3 described above. Molding is done smoothly. After that, the same operation is repeated.

  Next, the movement of the molds 21 and 22 and the supply / withdrawing mechanism 40 in the sealing portion 84 will be described with reference to FIG.

  FIG. 6 is a diagram schematically showing the supply / withdrawing mechanism 40 that has entered between the two molds 21 and 22 when the upper mold 21 and the lower mold 22 are open. (A) thru | or (E) is a figure of each state, and progresses with (A), (B) ... (E) with time.

  First, as shown in (A), when the upper mold 21 and the lower mold 22 are opened, the supply / withdrawing mechanism 40 enters at a predetermined timing. At this time, the molded product 90 to be resin-sealed is positioned and placed on the placement portion 41. In addition, a molded product that has already been sealed exists on the lower mold 22 side. Next, as shown in (B), the lower die 22 is raised by the action of the press 10. Thereby, the already sealed molded product is held in the take-out part 42. The movement of the press 10 continues further, and the supply take-out mechanism 40 is further raised together (C). As a result, the molded product 90 placed on the placement unit 41 comes into contact with the clamp surface of the upper mold 21. Along with this, the rise stops and the molded product 90 is adsorbed to the upper mold 21 by the action of the adsorption holes 21a provided in the upper mold 21 (C). Thereafter, as the press 10 is lowered, the lower die 22 is also lowered (D) and (E), and the supply / withdrawing mechanism 40 holding the molded product is retracted from between the dies.

  As described above, in the present invention, since the mold on the side to supply the molded product is different from the mold on the side to take out the molded product, it is possible to perform the next step without waiting for the removal of the molded product in the previous stage. Since the molded product can be supplied, improvement in the yield of the entire apparatus can be expected. In addition, by dividing the conveyance path (space) between the molded product and the molded product, the possibility that resin residue or the like adheres to the molded product before sealing is reduced. In particular, in the case of the compression molding described as the present embodiment, there is no pot part for temporarily storing the molten resin as its structure, and there is no runner part serving as a passage for transporting the molten resin to the cavity. Thus, it is possible to suppress the occurrence of resin burrs and the like that may occur in these portions.

  On the other hand, although not described as an embodiment, the present invention can also be applied to transfer molding. In this case, the molded product remains on the mold on the resin sealing surface side of the molded product and is taken out. For this reason, it is possible to suppress adhesion of resin residue or the like to the molded product used for the next sealing.

  In addition, in the resin sealing device 1 described above, the plate-like resin is described on the drawing. However, the resin-sealing device 1 is not limited to this, and for example, a granular resin or a tableted pellet-like resin, It is of course possible to use a liquid resin. Moreover, it is good also as a structure which separates and measures these resin and throws it into a metal mold | die directly.

  The present invention can be widely applied not only to the compression type resin sealing device described as the embodiment of the present invention but also to, for example, a transfer type resin sealing device.

The front view of the resin sealing apparatus 1 which is an example of embodiment of this invention The top view of the resin sealing apparatus 1 which is an example of embodiment of this invention The left view of the resin sealing apparatus 1 which is an example of embodiment of this invention The right view of the resin sealing apparatus 1 which is an example of embodiment of this invention Schematic diagram of upper mold and lower mold Schematic representation of the relationship between the mold and the supply take-out mechanism

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Resin sealing apparatus 2 ... Resin 3 ... Release film 10 ... Press 11 ... Fixed platen 12 ... Movable platen 21 ... Upper metal mold 21a ... Adsorption hole 22 ... Lower metal mold 23 ... Bottom mold 24 ... Frame-shaped metal mold 24a ... Adsorption hole 30 ... Film supply mechanism 40 ... Supply / extraction mechanism 41 ... Placement unit 42 ... Extraction unit 45 ... Resin input unit 50 ... Magazine elevator 51a ... Magazine for stock of molded product 51b ... Magazine for storing molded product 60 ... Substrate moving mechanism DESCRIPTION OF SYMBOLS 61 ... Substrate chuck 62 ... Substrate pushing part 63 ... Rail-shaped guide 70 ... Resin supply part 71 ... Resin stocker 72 ... Resin stocker elevator 73 ... Metering part 74 ... Resin set part 75 ... Resin conveyance mechanism 80 ... Electrical equipment 82 ... Casing 83 ... Partition plate 84 ... Sealing part 86 ... Conveying part

Claims (8)

In a resin sealing device that seals a molded product with a resin using first and second molds that open and close oppositely,
It said the molded article was fed into the first mold is configured to take out the resin sealed molded article from said second mold Rutotomoni,
An entry member capable of entering between the first and second molds when the first and second molds are open; and
The entry member includes both a molded product supply mechanism that can supply the molded product to the first mold and a molded product take-out mechanism that can extract the molded product from the second mold. A resin sealing device characterized by being provided . Oite to claim 1,
Furthermore, a molded product stock section for stocking the molded products,
A molded product storage section for storing the molded product;
A region in which the molded product is conveyed from the molded product stock part to the first mold is defined as a first region, and the molded product is conveyed from the second mold to the molded product storage unit. A resin sealing device comprising: a device for causing air to flow from the first region to the second region when the region to be used is the second region. In claim 2 ,
Furthermore, a resin supply unit is provided,
The resin supply device, wherein the resin supply unit is disposed at a position facing the first region with the first and second molds interposed therebetween. In claim 3 ,
The pressure in the said resin supply part is set lower than the pressure of the circumference | surroundings of the said to-be-molded product supply mechanism, and the said 1st area | region. The resin sealing apparatus characterized by the above-mentioned. In any one of Claims 1 thru | or 4 ,
The first and second molds are transfer molding dies. A resin sealing device, wherein: In any one of Claims 1 thru | or 5 ,
The second mold is a compression mold having a bottom mold corresponding to the molded product and a frame-shaped mold that is slidably fitted to the bottom mold. . In claim 6 ,
A release film for improving releasability is supplied to the resin molding surface side of the second mold, and at the time of releasing the molded product from the first mold after sealing, A frame-shaped mold projects in the first mold direction as compared with the bottom mold. In any one of Claims 1 thru | or 7 ,
The advance input member is vertically movable,
A mechanism for opening and closing the mold, and a mechanism for supplying a molded product to the first mold and a mechanism for taking out a molded product from the second mold are brought into contact with and retracted from the opposing mold surfaces, respectively. A resin sealing device.

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