JP2023123172A - Resin sealing device and resin sealing method - Google Patents

Abstract

To provide a resin sealing device and a resin sealing method which removes dust stirred up in a sealing mold, when a mold is opened and a film is exchanged, and thereby can prevent occurrence of molding failures caused by the dust.SOLUTION: A resin sealing device 1 seals workpiece W with a resin R and processes the workpiece W into a molded article Wp using a press device 250 having a sealing mold 202 having an upper mold 204 and a lower mold 206, includes a supply duct 267 for supplying air from outside, and a discharge duct 268 for discharging the air to the outside, and has a first passage 272 for flowing the air between the upper mold 204 and the lower mold 206, and discharging dust, as a passage for passing the air through the discharge duct 268 from the supply duct 267.SELECTED DRAWING: Figure 2

Description

The present invention relates to a resin sealing apparatus and a resin sealing method.

Examples of a resin encapsulation apparatus and a resin encapsulation method for encapsulating a workpiece having an electronic component mounted on a base material with encapsulation resin (hereinafter sometimes simply referred to as "resin") and processing it into a molded product include: A transfer molding method and a compression molding method are known.

In the transfer molding method, a pot is provided to supply a predetermined amount of resin to a pair of sealing regions (cavities) provided in a sealing mold configured with an upper mold and a lower mold, and each sealing region is provided with a pot. In this technique, the workpieces are placed at corresponding positions, clamped with an upper mold and a lower mold, and resin is poured into the cavity from the pot for resin sealing. Also, in the compression molding method, a predetermined amount of resin is supplied to a sealing region (cavity) provided in a sealing mold configured with an upper mold and a lower mold, and a workpiece is placed in the sealing region. It is a technique of resin sealing by clamping with an upper mold and a lower mold. As an example, when using a sealing mold having a cavity in the upper mold, there is known a technique of supplying resin to the central position of the work collectively for molding. On the other hand, when using a sealing mold having a cavity in the lower mold, a technique of supplying a film and a resin covering the mold surface including the cavity and molding is known (Patent Document 1: JP 2021 -178411).

Japanese Patent Application Laid-Open No. 2021-178411

Conventionally, when a workpiece is resin-sealed, dust made of resin fine powder etc. adheres to the sealing mold and release film (hereinafter sometimes simply referred to as "film"). Therefore, the problem was that molding defects occurred.

In response to this problem, for example, Patent Document 1 discloses a technique for preventing the occurrence of defective molding by cleaning the workpiece before it is carried into the sealing mold of the press machine. .

On the other hand, dust that causes defective molding is not limited to dust adhering to the workpiece and entering the sealing mold. For example, a small amount of resin used for sealing (molding) remains in the sealing mold or film, and when the mold is opened or the film is replaced, the resin rises up as fine powder inside the sealing mold. It may become a source of dust.

The present invention has been made in view of the above circumstances, and can prevent the occurrence of molding defects caused by dust by removing the dust that is stirred up in the sealing mold when the mold is opened or the film is replaced. An object of the present invention is to provide a resin sealing device and a resin sealing method.

The present invention solves the above-described problems by means of solving means described below as one embodiment.

A resin sealing apparatus according to the present invention is a resin sealing apparatus that seals a workpiece with resin and processes it into a molded product using a press device that includes a sealing mold having an upper mold and a lower mold. a supply duct for supplying air from the outside, and a discharge duct for discharging the air to the outside, wherein the upper mold and the lower mold are provided as flow paths for flowing the air from the supply duct to the discharge duct. It is required to have a first flow path that allows the air to flow between and discharges dust.

According to this, the dust floating in the space between the upper die and the lower die can be discharged by allowing the air to flow through the first flow path. Therefore, it is possible to prevent the occurrence of defective molding due to dust.

Further, as a flow path for flowing the air from the supply duct to the discharge duct, a second flow path for discharging the heat of the sealing mold by flowing the air above the sealing mold is provided. It is preferable to further have. According to this, the heat of the sealing mold can be discharged by causing the air to flow through the second flow path.

Moreover, it is preferable to further include a shutter that allows the air to flow through either one of the first flow path and the second flow path. According to this, it is possible to switch between the first flow path and the second flow path at a predetermined timing and allow the air to flow through one of them.

Further, a film supply mechanism having an unwinding part and a winding part and supplying a roll-shaped film between the upper mold and the lower mold is further provided, wherein the first flow path is connected to the unwinding part It is preferable that the air is caused to flow in the same direction as the direction from the to the winding portion. According to this, by allowing air to flow in the feeding direction of the used film, the dust floating in the space between the upper mold and the lower mold is prevented from adhering to the unused film, and the sealing mold is sealed. can be discharged outside.

In addition, as the press device, two press devices, a first press device and a second press device, are provided, and the film supply mechanisms provided in each are positioned so that the unwinding portion is far from each other and the winding portion is close to each other. By being arranged, the film is sent out in the direction facing each other, and the discharge common to the first flow path provided in each intermediate position between the first press device and the second press device A duct is preferably provided. According to this, the structure of the device can be simplified by sharing the mechanism.

In addition, the first flow path includes an introduction straightening plate that introduces the air supplied from the supply duct toward between the upper mold and the lower mold, and a flow path between the upper mold and the lower mold. and an outlet rectifying plate that guides the air sent from the outlet toward the exhaust duct. According to this, the air supplied from the supply duct can be efficiently guided between the upper die and the lower die by providing the introduction current plate. In addition, by providing the outlet rectifying plate, the air sent from between the upper mold and the lower mold can be efficiently guided to the discharge duct.

Further, the resin sealing method according to the present invention includes a sealing mold having an upper mold and a lower mold, and opening and closing a flow path for allowing air supplied from the outside to flow between the upper mold and the lower mold. A resin sealing method for processing a workpiece into a molded product by sealing the workpiece with resin using a resin sealing device including a shutter, wherein when opening the upper mold and the lower mold, the It is required to open the shutter to allow the air to flow between the upper mold and the lower mold.

According to the present invention, it is possible to remove dust that is stirred up inside the sealing mold when the mold is opened, the film is replaced, or the like. Therefore, it is possible to prevent the occurrence of defective molding due to dust.

1 is a plan view showing an example of a resin sealing device according to an embodiment of the invention; FIG. FIG. 2 is a cross-sectional view showing an example of a press device of the resin sealing device of FIG. 1; 2 is a cross-sectional view showing an example of a sealing mold of the resin sealing device of FIG. 1; FIG. FIG. 3 is a cross-sectional view showing an example of a configuration including two pressing devices of FIG. 2; FIG. 4 is an operation explanatory diagram of the resin sealing device according to the embodiment of the present invention; FIG. 4 is an operation explanatory diagram of the resin sealing device according to the embodiment of the present invention; FIG. 4 is an operation explanatory diagram of the resin sealing device according to the embodiment of the present invention;

(overall structure)
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic diagram) showing an example of a resin sealing device 1 according to this embodiment. For convenience of explanation, arrows in the drawing indicate the left-right direction (X direction), the front-rear direction (Y direction), and the up-down direction (Z direction) in the resin sealing device 1 . Further, in all the drawings for explaining each embodiment, members having the same functions are denoted by the same reference numerals, and repeated description thereof may be omitted.

The resin sealing apparatus 1 according to the present embodiment is an apparatus that uses a sealing mold 202 having an upper mold 204 and a lower mold 206 to perform resin sealing molding of a work (molded article) W. As shown in FIG. Below, as the resin sealing device 1, the upper mold 204 is provided with a plurality of cavities 208 (208A, 208B, 208C), and the lower mold 206 is provided with a plurality of workpiece holding portions 205 (205A, 205B, 205C). A compression molding apparatus that collectively seals a plurality of workpieces W with a resin R using a sealing die 202 will be described as an example. However, it is not limited to this configuration.

First, a workpiece W to be molded has a structure in which a plurality of electronic components Wb are mounted in a matrix on a base material Wa. More specifically, examples of the base material Wa include plate-shaped members (so-called strip workpieces) such as strip-shaped resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. . Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, radiator plates, conductive members, spacers, and the like. As another example of the base material Wa, a configuration using the above members formed in a circular shape, a square shape, or the like may be used (not shown).

Examples of methods for mounting the electronic component Wb on the base material Wa include mounting methods such as wire bonding mounting and flip chip mounting. Alternatively, in the case of a configuration in which the base material (a carrier plate made of glass or metal) Wa is peeled off from the molded article Wp after resin sealing, an adhesive tape having heat peelability or an ultraviolet curable resin that is cured by ultraviolet irradiation is used. There is also a method of sticking the electronic component Wb by using.

On the other hand, examples of the resin R include granular (including columnar), pulverized, or powdered thermosetting resins (for example, filler-containing epoxy resin, etc.) is used. The resin R is not limited to the above state, and may be in other states (shapes) such as liquid, plate, sheet, etc., and is a resin other than epoxy thermosetting resin. good too.

Examples of the film F include film materials excellent in heat resistance, peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, Fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride and the like are preferably used. In this embodiment, a roll-shaped film is used as the film F. As shown in FIG. As a modification, a strip-shaped film may be used (not shown).

Next, an outline of the resin sealing device 1 according to this embodiment will be described. As shown in FIG. 1, the resin sealing apparatus 1 includes a work supply unit 100A that mainly supplies a work W, a press unit 100B that mainly seals the work W with resin and processes it into a molded product Wp, a resin and a molded product storage unit 100D mainly configured to store the molded product Wp after resin sealing. Although the control section 150 that controls the operation of each mechanism in each unit is arranged in the work supply unit 100A, it may be arranged in another unit.

In the present embodiment, the work supply unit 100A, the press unit 100B, the resin supply unit 100C, the press unit 100B, and the molded product storage unit 100D are arranged in this order along a predetermined direction (eg, the X direction in FIG. 1). are placed. Here, a work conveying unit 104 that conveys the work W between the work supply unit 100A and the press unit 100B, and a molded product that conveys the molded product Wp between the press unit 100B and the molded product storage unit 100D. A transport section 106 is provided. A resin conveying section 108 for conveying the resin R is provided between the resin supply unit 100C and the press unit 100B.

In addition, in this embodiment, the work conveying section 104 is configured to include a work loader 210 and a moving device 130 having a slider 116, a guide 117, and the like. The molded article conveying section 106 includes a molded article loader 212 and a moving device 132 having a slider 118, a guide 119, and the like. Further, the resin conveying section 108 is configured to include a resin loader 304 and a moving device 134 having a guide 305 and the like. For example, the moving device 130 and the moving device 132 use linear motion mechanisms such as linear conveyors. Further, the moving device 134 is used in combination with a linear motion mechanism such as a linear conveyor and an elevating mechanism such as an elevator. However, it is not limited to these configurations.

It should be noted that the resin sealing device 1 can change the overall configuration mode by changing the configuration of the unit. For example, the configuration shown in FIG. 1 is an example in which two sets of press units 100B are installed, but a configuration in which only one set of press units 100B is installed or a configuration in which other units are additionally installed is also possible (both not shown).

(work supply unit)
Next, the work supply unit 100A provided in the resin sealing apparatus 1 will be described in detail.

The work supply unit 100A includes a work stocker 110 used to store the work W, a work transfer unit 104 for transferring the work W into the sealing mold 202, and a transfer of the work W from the work stocker 110 to the work transfer unit 104. a supply pickup 120; A well-known stack magazine, slit magazine, or the like is used for the work stocker 110 .

The slider 116 of the work conveying section 104 functions to receive the work W from the supply pickup 120 , convey it, and transfer it to the work loader 210 . As a configuration example, three rows of work holding portions 116A, 116B, and 116C each capable of holding one work W are provided in parallel in the X direction. Also, it is configured to be movable in the X direction along the guide 117 between the work supply unit 100A and the press unit 100B. For the workpiece holding portions 116A, 116B, and 116C, a known holding mechanism (for example, a configuration that has holding claws to hold and hold, a configuration that has a suction hole communicating with a suction device and sucks, etc.) is used. (not shown).

The work loader 210 of the work conveying section 104 functions to receive the work W from the slider 116 , convey it, and transfer it to the sealing mold 202 . As a configuration example, three rows of work holding portions 210A, 210B, and 210C each capable of holding one work W are provided in parallel in the X direction. Further, it is configured to be movable in the Y direction (the direction orthogonal to the X direction in the horizontal plane) within the press unit 100B. For the workpiece holding portions 210A, 210B, and 210C, a known holding mechanism (for example, a configuration in which holding claws are provided to clamp, a configuration in which a suction hole communicating with a suction device is provided to suck, etc.) is used. (not shown).

According to this configuration, a maximum of three workpieces W are carried into the sealing mold 202 at once using the workpiece conveying unit 104 and held by the workpiece holding units 205 (205A, 205B, 205C) of the lower mold 206. can be made

In the present embodiment, the work conveying unit 104 is configured such that the slider 116 moves in the X direction and the work loader 210 moves in the Y direction to carry the work W into the sealing mold 202 . However, it is not limited to this, and a single work loader may be configured to move in the X direction and the Y direction as the work conveying unit 104 to carry the work W into the sealing mold 202 (unacceptable). shown).

The slider 116 also includes a heater (not shown) that heats the workpiece W from the lower surface side (base material Wa side). As an example, the heater uses a known heating mechanism (eg, electric heating wire heater, infrared heater, etc.). As a result, the workpiece W can be preheated before it is carried into the sealing mold 202 and heated. In addition, it is good also as a structure which does not have a heater.

(press unit)
Next, the press unit 100B included in the resin sealing device 1 will be described in detail. FIG. 2 shows a front cross-sectional view (schematic diagram) of the press device 250 provided in the press unit 100B. FIG. 3 shows a side cross-sectional view (schematic diagram) of the sealing die 202 provided in the pressing device 250. As shown in FIG.

The press unit 100B is a sealed mold having a pair of dies that can be opened and closed (for example, a plurality of die blocks made of alloy tool steel, a die plate, a die pillar, and other members assembled together). 202 and a press device 250 for opening and closing the sealing mold 202 . In this embodiment, of the pair of molds, one mold on the upper side in the vertical direction is the upper mold 204 and the other mold on the lower side is the lower mold 206 . The sealing mold 202 is closed and opened by the upper mold 204 and the lower mold 206 approaching and separating from each other. That is, the vertical direction (vertical direction) is the mold opening/closing direction.

As shown in FIG. 2, the press device 250 includes a pair of fixed platen 252 and movable platen 254, a plurality of connecting mechanisms 256 on which the platens 252 and 254 are installed, and a drive source (for example, a An electric motor) 260, a drive transmission mechanism (for example, a ball screw or a toggle link mechanism) 262, and the like.

Also, the sealing die 202 is arranged between a stationary platen 252 and a movable platen 254 in the press device 250 . In this embodiment, the upper mold 204 is assembled with a stationary platen 252 and the lower mold 206 is assembled with a movable platen 254 . However, the configuration is not limited to this, and the upper die 204 may be assembled with the movable platen and the lower die 206 may be assembled with the stationary platen, or both the upper die 204 and the lower die 206 may be assembled with the movable platen. (none shown).

First, the upper mold 204 of the sealing mold 202 will be described. As shown in FIG. 3, the upper die 204 comprises an upper plate 222, a cavity piece 226, a clamper 228, etc., which are assembled together. In this embodiment, a cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).

More specifically, the cavity piece 226 is fixedly attached to the lower surface of the upper plate 222 . On the other hand, the clamper 228 is configured in an annular shape so as to surround the cavity piece 226 , and is attached to the lower surface of the upper plate 222 via a biasing member 232 so as to be separated (floating) and vertically movable. The cavity piece 226 constitutes the inner part (bottom part) of the cavity 208 , and the clamper 228 constitutes the side part of the cavity 208 . In this embodiment, as shown in FIG. 1, three sets of cavities 208 are arranged side by side in the X direction in one upper mold 204 (208A, 208B, and 208C in the figure), and three or less workpieces W are collectively resin-sealed, but the present invention is not limited to this.

A suction groove (not shown) is provided on the mold surface 206a of the lower mold 206 facing the clamper 228, and communicates with a suction device (not shown). In addition, by providing a seal structure surrounding them, it is possible to deaerate the cavity 208 while the mold is closed by driving the suction device to reduce the pressure.

In addition, in this embodiment, a suction mechanism is provided for sucking and holding a film F supplied from a film supply mechanism 214 (to be described later) to the upper die 204 . For example, this suction mechanism includes a suction device (non-contact) through suction paths 230a and 230b provided through the clamper 228 and a suction path 230c provided through the upper plate 222 and the cavity piece 226. shown). Specifically, one end of each of the suction paths 230 a , 230 b , 230 c communicates with the mold surface 204 a of the upper mold 204 , and the other end is connected to a suction device arranged outside the upper mold 204 . As a result, the film F can be sucked from the suction paths 230a, 230b, and 230c by driving the suction device, and the film F can be held on the mold surface 204a including the inner surface of the cavity 208 by suction.

Thus, by providing the film F covering the inner surface of the cavity 208 and the mold surface 204a (a part) of the upper mold 204, the resin R portion on the upper surface of the molded article Wp can be easily peeled off. , the molded product Wp can be easily removed from the sealing mold 202 (in this case, the upper mold 204).

A gap of a predetermined size provided between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the cavity piece 226 constitutes part of the suction path 230a. Therefore, a sealing member 234 (for example, an O-ring) is arranged at a predetermined position of the gap to perform a sealing function when the film F is sucked.

Further, in this embodiment, an upper mold heating mechanism is provided to heat the upper mold 204 to a predetermined temperature. The upper mold heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power source, etc., and heating is controlled by a control unit 150 (none of which is shown). As an example, the heater is built in the upper plate 222 and a mold base (not shown) that accommodates them, and mainly applies heat to the entire upper mold 204 and the resin R (described later). Thereby, the upper mold 204 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated.

Next, the lower mold 206 of the sealing mold 202 will be described. As shown in FIG. 3, the lower die 206 comprises a lower plate 224, a holding plate 236, etc., which are assembled together. Here, the holding plate 236 is fixedly attached to the upper surface of the lower plate 224 (the surface on the upper die 204 side).

Further, in this embodiment, a workpiece holding portion 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the holding plate 236 . As an example, the workpiece holding section 205 has a suction path 240a which is arranged through the holding plate 236 and the lower plate 224 and communicates with a suction device (not shown). Specifically, one end of the suction path 240 a communicates with the mold surface 206 a of the lower mold 206 , and the other end is connected to a suction device arranged outside the lower mold 206 . As a result, the suction device is driven to suck the work W from the suction path 240a, and the work W can be attracted and held on the mold surface 206a (here, the upper surface of the holding plate 236). Furthermore, a configuration may be employed in which holding claws for holding the outer periphery of the work W are provided in parallel with the configuration including the suction path 240a (not shown).

Further, in this embodiment, a lower mold heating mechanism is provided to heat the lower mold 206 to a predetermined temperature. The lower mold heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power source, etc., and heating is controlled by a control unit 150 (none of which is shown). As an example, the heater is built in the lower plate 224 and a mold base (not shown) that accommodates them, and mainly applies heat to the entire lower mold 206 and the workpiece W. Thereby, the lower mold 206 is adjusted to a predetermined temperature (for example, 100° C. to 200° C.) and heated.

In this embodiment, one lower mold 206 is provided in correspondence with the structure of the upper mold 204 described above, that is, the structure in which three sets of cavities 208 are arranged side by side in the X direction (208A, 208B, and 208C in the figure). Although three sets of work holding portions 205 are arranged side by side in the X direction (205A, 205B, and 205C in the drawing), the present invention is not limited to this.

Here, the resin sealing device 1 according to this embodiment includes a supply duct 267 for supplying air from the outside and a discharge duct 268 for discharging the air to the outside. Furthermore, as a flow path for air to flow from the supply duct 267 to the discharge duct 268, a second flow path 271 for flowing air above the sealing mold 202 and between the upper mold 204 and the lower mold 206 A first flow path 272 is provided for air flow. According to this, the heat of the sealing mold 202 can be discharged (cooled) by causing the air to flow through the second flow path 271 . Also, by allowing air to flow through the first flow path 272, dust floating in the space inside and outside the sealing mold 202 (especially the space between the upper mold 204 and the lower mold 206) can be discharged. Therefore, it is possible to prevent the occurrence of defective molding due to dust.

As an example, the supply duct 267 is arranged in the press unit 100B, but is not limited to this, and may be arranged in the work supply unit 100A adjacent to the press unit 100B, the molded product storage unit 100D, and the like. may be configured. Further, although the discharge duct 268 is arranged in the resin supply unit 100C adjacent to the press unit 100B, it is not limited to this, and may be arranged in the press unit 100B or the like.

Further, the resin sealing apparatus 1 (specifically, the press unit 100B) according to the present embodiment presses the roll-shaped film F inside the sealing mold 202 (specifically, the upper mold 204 and the lower mold 206). and a film supply mechanism 214 for conveying (supplying) the film. In this film supply mechanism 214, an unused film F is sent out from an unwinding portion 214a, supplied to the opened sealing mold 202, used for resin sealing in the sealing mold 202, and then used. film F is taken up by the take-up portion 214b. As a modified example, the film supply mechanism 214 may be configured to individually supply the film F according to the number of installed cavities 208 (not shown).

In the resin sealing apparatus 1 according to the present embodiment, two pressing devices 250, ie, a first pressing device 250A and a second pressing device 250B are provided. Here, the film supply mechanism 214 provided in each press device 250 (the film supply mechanism 214A provided in the first press device 250A and the film supply mechanism 214B provided in the second press device 250B) 214a is arranged at a far position and the winding part 214b is arranged at a near position. In other words, the direction in which the film F is delivered by the film supply mechanism 214A and the direction in which the film F is delivered by the film supply mechanism 214B are arranged to face each other.

Further, the above-described first flow path 272 is configured to flow air in the same direction as the direction from the unwinding portion 214a to the winding portion 214b in each of the film supply mechanism 214A and the film supply mechanism 214B. there is According to this, the dust (fine powder of the resin R) that rises up in the sealing mold 202 when the mold is opened and the film F is replaced (delivered) is removed in the same direction as the used film F is delivered. By allowing the air to flow, it is possible to prevent the dust from adhering to the unused film F and to discharge it to the outside of the sealing mold 202 .

Here, in the present embodiment, the resin supply unit 100C is arranged between the press unit 100B having the first press device 250A and the press unit 100B having the second press device 250B (intermediate position). be. Therefore, the discharge duct 268 common to all of the second flow path 271 and the first flow path 272 of the first press device 250A and the second flow path 271 and the first flow path 272 of the second press device 250B is a resin supply unit. 100C (see FIG. 4). As a result, the device structure can be simplified.

In addition, a shutter 274 for opening and closing the flow path is provided in the first flow path 272 at a position upstream of a position where air enters between the upper die 204 and the lower die 206 (FIG. 5A). ), see FIG. 5(b)). As a result, the first flow path 272 can be opened and closed at a predetermined timing, and the flow of air between the upper die 204 and the lower die 206 can be stopped or stopped (details will be described later).

Further, the first flow path 272 is provided with an introduction current plate 276 that introduces the air supplied from the supply duct 267 toward the space between the upper die 204 and the lower die 206 . Thereby, the air supplied from the supply duct 267 can be efficiently guided between the upper die 204 and the lower die 206 . In addition, the first flow path 272 is provided with an outlet current plate 278 that guides the air sent from between the upper mold 204 and the lower mold 206 toward the discharge duct 268 . Thereby, the air sent out from between the upper mold 204 and the lower mold 206 can be efficiently guided to the discharge duct 268 . One or both of the lead-in current plate 276 and the lead-out current plate 278 may be omitted.

(resin supply unit)
Next, the resin supply unit 100C included in the resin sealing apparatus 1 will be described in detail.

The resin supply unit 100C includes a resin stocker 302 used to store the resin R, a dispenser 312 that supplies the resin R from the resin stocker 302, and a resin loader 304 that conveys the supplied resin R into the sealing mold 202. It has Also, three dispensers 312 are arranged so that the resin R can be supplied simultaneously to three pressure plates 314 (described later) provided corresponding to the three sets of cavities 208 . In this embodiment, the resin loader 304 is configured to load the resin R into the sealing mold 202 along the X direction.

The resin supply unit 100C also includes a resin heater 306 that heats the resin R transported by the resin loader 304 at a position adjacent to the dispenser 312 or the like. As an example, the resin heater 306 uses a known heating mechanism (for example, an electric heating wire heater, an infrared heater, etc.). As a result, the surface of the granular resin R placed on the pressing plate 314 can be heated to be melted or softened. It is possible to prevent the occurrence of defective molding of products and malfunction of the device. A configuration without the resin heater 306 may be employed.

Here, as shown in FIG. 6, the resin loader 304 includes a pressing plate 314 on which the resin R dropped from the dispenser 312 is placed on the upper surface 314a, and a pressure plate 314 which extends from the outer periphery to a position higher than the upper surface 314a. A guard 316 having a peripheral wall portion 316a surrounding the entire circumference is provided. In this embodiment, one upper mold 204 has three sets of cavities 208, and three workpieces W (for example, strip-shaped workpieces) are arranged in one lower mold 206 and collectively sealed with resin. to obtain three molded products Wp at the same time (three or less can also be set). Accordingly, three pressing plates 314 (314A, 314B, 314C) are provided corresponding to the positions of the cavities 208. As shown in FIG. Also, the guard 316 is configured such that a peripheral wall portion 316a surrounds the entire periphery of the three pressing plates 314 (314A, 314B, 314C). That is, the guard 316 is configured as a frame provided around each pressing plate 314 .

Further, as shown in FIG. 6, the resin loader 304 is configured to be vertically movable (that is, reciprocally movable in the Z direction). Furthermore, the resin loader 304 is provided with a moving sticking mechanism 315 that moves the pressing plate 314 upward to press the placed resin R against the film F within the cavity 208 . According to this, the resin loader 304 can be lifted to bring the peripheral wall portion 316a of the guard 316 into contact with the upper mold 204 (for example, the mold surface 204a of the clamper 228). Further, in this state, the pressing plate 314 is moved upward by the moving sticking mechanism 315, and the resin R placed on the pressing plate 314 is removed as a film in the cavity 208 of the upper die 204 heated to a predetermined temperature. F can be pressed (see FIG. 7). Therefore, the heat of the upper mold 204 can be transferred to the resin R through the film F, so that the resin R is softened (melted) to generate an adhesive force to adhere to the lower surface of the film F. can be done. However, the present invention is not limited to this configuration, and a configuration may be adopted in which a mechanism for raising and lowering the guard 316 is provided in the resin loader 304 and the guard 316 is raised and lowered with respect to the resin loader 304 from which the peripheral wall portion 316a is removed (not shown). ).

As a modification of the resin sealing apparatus 1 related to the supply of the resin R, a dispenser is provided in the work supply unit 100A to supply the resin R onto the work W, and the work W is transported by the work conveying unit 104 or the like to the sealing mold. A configuration for transporting into 202 may be employed (not shown).

(molded product storage unit)
Next, the molded product storage unit 100D included in the resin sealing device 1 will be described in detail.

The molded product storage unit 100D includes a molded product stocker 112 used to store the molded product Wp, a molded product transfer unit 106 that transfers the molded product Wp to the outside of the sealing mold 202, and a molded product stocker from the molded product transfer unit 106. and a storage pickup 122 for delivering the molded product Wp to 112 . A known stack magazine, slit magazine, or the like is used for the molded product stocker 112 .

The molded product loader 212 of the molded product conveying unit 106 functions to receive the molded product Wp from the sealing mold 202 , convey it, and transfer it to the slider 118 . As a configuration example, molded product holding portions 212A, 212B, and 212C are arranged in three rows in the X direction and each can hold one molded product Wp. Moreover, it is configured to be movable in the Y direction within the press unit 100B. For the molded article holding portions 212A, 212B, and 212C, a known holding mechanism (for example, a structure that has holding claws to sandwich, a structure that has a suction hole communicating with a suction device and sucks, etc.) is used. (not shown).

The slider 118 of the molded product conveying unit 106 receives the molded product Wp from the molded product loader 212 , conveys it, and delivers it to the storage pickup 122 . As a configuration example, molded product holding portions 118A, 118B, and 118C that are arranged in three rows in the X direction and each can hold one molded product Wp are provided. Also, it is configured to be movable along the guide 119 between the press unit 100B and the molded article storage unit 100D. For the molded article holding portions 118A, 118B, and 118C, a known holding mechanism (for example, a structure that has holding claws to sandwich, a structure that has a suction hole communicating with a suction device and sucks, etc.) is used. (not shown).

According to this configuration, a maximum of three molded products Wp that are resin-sealed and held in the cavities 208 (208A, 208B, 208C) of the upper mold 204 are sealed at once using the molded product conveying unit 106. It can be carried out to the outside of the clamping die 202 .

In the present embodiment, the molded product conveying unit 106 is configured such that the molded product loader 212 moves in the Y direction and the slider 118 moves in the X direction to carry out the molded product Wp out of the sealing mold 202. ing. However, the present invention is not limited to this, and the molded product conveying unit 106 may be configured such that one molded product loader moves in the X direction and the Y direction to carry out the molded product Wp out of the sealing mold 202. (not shown).

In the resin sealing apparatus 1 having the above configuration, the work loader 210 is configured to load the workpiece W into the sealing mold 202 along the Y direction, and the molded product loader 212 is configured to load the workpiece W along the Y direction. The molded product Wp is carried out to the outside of the sealing mold 202 by pressing. On the other hand, the resin loader 304 is configured to load the resin R into the sealing mold 202 along the X direction. As a result, the carry-in route of the workpiece W and the carry-out route of the molded product Wp to the sealing mold 202 can be substantially prevented from overlapping with the carry-in route of the resin R, and the work conveying unit 104 and the molded product conveying unit The separation between the portion 106 and the resin conveying portion 108 can be reliably performed. Therefore, it is possible to prevent foreign substances (such as burrs) generated from the molded product Wp and foreign substances (such as dust) generated from the resin R being conveyed from adhering to the workpiece W and the sealing mold 202, thereby improving the molding quality. be able to.

Also, the work stocker 110 and the molded product stocker 112 are arranged relatively on the upper side of the apparatus, and the resin stocker 302 is arranged relatively on the lower side of the apparatus. Further, the moving devices 130 and 132 and the moving device 134 are arranged so that their moving directions are perpendicular to each other. This allows the overall dimensions of the device to be compact. In addition, these configurations also contribute to ensuring the isolation between the workpiece conveying section 104 and the molded article conveying section 106 and the resin conveying section 108 . Furthermore, since the work stocker 110 and the molded product stocker 112 can be exchanged without bending down, the workability can be improved.

(resin sealing operation)
Next, the operation of performing resin sealing using the resin sealing apparatus 1 according to this embodiment (that is, the resin sealing method according to this embodiment) will be described. Here, three sets of cavities 208 are provided in one upper mold 204, and three workpieces W (for example, strip-shaped workpieces) are placed in one lower mold 206 and resin-sealed together. , a configuration for obtaining three molded products Wp at the same time. However, it is not limited to this configuration.

As a preparatory step, a heating step (upper mold heating step) of adjusting and heating the upper mold 204 to a predetermined temperature (for example, 100° C. to 200° C.) is performed by the upper mold heating mechanism. Further, a heating step (lower mold heating step) is performed by adjusting and heating the lower mold 206 to a predetermined temperature (for example, 100° C. to 200° C.) by the lower mold heating mechanism. Further, the film F is conveyed (sent out) from the unwinding portion 214a to the winding portion 214b by the film supply mechanism 214, and is placed at a predetermined position (a position between the upper mold 204 and the lower mold 206) in the sealing mold 202. A step of supplying the film F (initial film supplying step) is performed.

Hereinafter, the order of carrying out the work conveying step of conveying the work W from the work supply unit 100A to the press unit 100B and then carrying out the resin conveying step of conveying the resin R from the resin supply unit 100C to the press unit 100B will be described. The resin transfer process may be performed before the work transfer process.

First, as a work transfer step, a step of transferring the work W into the sealing mold 202 by the work transfer unit 104 is performed. As an example, the work W is preheated by the slider 116 and conveyed to the press unit 100B. Next, the workpiece W is conveyed into the sealing mold 202 by the workpiece loader 210 and held at a predetermined position of the lower mold 206 (not shown). In this embodiment, three workpieces W are held side by side by the workpiece holders 205A, 205B, and 205C. Note that the preheating step may be omitted.

Next, as a resin conveying step, a step of conveying the resin R from the resin supply unit 100C to the press unit 100B is performed. As an example, the resin loader 304 transports the three pressing plates 314 together with the guards 316 surrounding the pressing plates 314 so that the three pressing plates 314 are directly below the nozzles of the three dispensers 312 . At this time, the guard 316 (surrounding wall portion 316a) surrounds the entire periphery of the pressing plate 314 to a position higher than the upper surface 314a. In this state, a placement step is performed in which a prescribed amount of resin R is dropped (supplied) from the nozzle of each dispenser 312 onto the upper surface 314a of each pressing plate 314 and placed thereon. As described above, the guard 316 is a frame that surrounds the entire periphery of the pressing plate 314 . Therefore, when dropping the resin R, it is possible to prevent the resin R from spilling from the pressing plate 314 . In this embodiment, the resin R is supplied so as to be flatter. A step of flattening (making the thickness uniform) may be performed while spreading the resin R to the outermost peripheral position.

Next, a step of heating (preheating) the resin R being conveyed by the resin loader 304 is performed by the resin heater 306 . For example, the resin R is preheated to a temperature (for example, 60° C. to 80° C.) at which the resin R is not completely melted or melted by pressing a heated part or by radiant heat, and the grains of the resin R are welded (or softened) and integrated. As a result, the surface of the granular resin R placed on the pressing plate 314 can be welded (or softened), preventing the generation of dust (fine powder of the resin R, etc.) during transportation, and molding the product. It is possible to prevent the occurrence of defects and malfunction of the device. Note that the preheating step may be omitted.

Here, in parallel with (or before or after) the step of conveying the resin by the resin loader 304, the film F is conveyed (sent out) from the unwinding portion 214a to the winding portion 214b by the film supply mechanism 214, and sealed. A step of supplying the film F to a predetermined position (a position between the upper mold 204 and the lower mold 206) in the stopper die 202 (film supplying process) is performed. In this process, only the unused film F is supplied at the first time, but from the second time onwards, the used film F is sent out (discharged) and the unused film F is supplied at the same time.

In this embodiment, the shutter 274 of the first flow path 272 is closed when the film supply step is performed (that is, when the film F is sent out from between the upper mold 204 and the lower mold 206) (see FIG. 5). (a)) to the open state (see FIG. 5(b)), externally supplied air is introduced between the upper mold 204 and the lower mold 206, and the film F is fed along the feeding direction. Then, the step of circulating is carried out. Incidentally, the step of causing the air to flow may be performed when opening the sealing mold 202 instead of performing the film supplying step or together with this.

Normally, when the film F is replaced (sent out), the film F is moved after releasing the adsorption to the upper mold 204, so dust in the sealing mold 202 (adhesion to the used film F, etc.) Fine powder of resin R) is likely to rise. On the other hand, according to the above process, air is allowed to flow into the sealing mold 202 along the feeding direction of the used film F, and the dust is prevented from adhering to the unused film F while sealing. It is possible to eject the metal mold 202 to the outside.

Next, as shown in FIG. 6, an adsorption process (film adsorption process) is performed in which the film F is adsorbed and held on the mold surface 204a including the inner surface of the cavity 208 by the adsorption mechanism. Next, a step of conveying the resin R placed on the pressing plate 314 into the sealing mold 202 (between the upper mold 204 and the lower mold 206) by the resin loader 304 is performed. In this step, the resin loader 304 is arranged at a predetermined position inside the sealing mold 202 (between the upper mold 204 and the lower mold 206), and the resin loader 304 starts to rise from that state. When the peripheral wall portion 316a of the guard 316 comes into contact with the upper mold 204 (in this case, the mold surface 204a of the clamper 228), the upward movement of the resin loader 304 is stopped.

Next, as shown in FIG. 7, the moving sticking mechanism 315 is driven to start lifting the pressing plate 314 . At this time, only the pressing plate 314 is moved upward (that is, into the cavity 208), and the step of pressing the resin R placed on the upper surface 314a to the lower surface of the film F for adhesion is performed.

In this manner, the resin R placed on the pressing plate 314 can be pressed against the film F within the cavity 208 of the upper mold 204 heated to a predetermined temperature. Therefore, the heat of the upper die 204 can be transferred to the resin R through the film F, so that the resin R softens (melts) and an adhesive force is generated, and the effect of sticking to the lower surface of the film F is obtained. be done. It should be noted that the sticking process is preferably carried out in a short period of time so that the moving sticking mechanism 315 is not heated by radiant heat or heat transfer through the resin R. In this regard, the step of attaching the resin R to the lower surface of the film F can be efficiently performed by performing the preheating step described above to integrate the resin R in advance. Specifically, since the resin R is integrated, the resin R can be adhered to the lower surface of the film F in a short time. Further, since the resin R is integrated, it is possible to prevent particles of the resin R from remaining on the pressing plate 314 .

Next, the step of driving the moving sticking mechanism 315 to start lowering the pressing plate 314 and the step of starting lowering the resin loader 304 are performed. Next, a step of moving the resin loader 304 out of the sealing mold 202 is performed.

As a modification of the resin conveying step, as described above, the resin R may be supplied onto the workpiece W and conveyed together with the workpiece W into the sealing mold 202 by the workpiece conveying unit 104 or the like ( not shown).

Next, as a mold closing step, a step of closing the sealing mold 202 and clamping the workpiece W under heat and pressure is performed. At this time, the shutter 274 of the first flow path 272 is closed (although it may be left open, since the mold is closed, the air between the upper mold 204 and the lower mold 206 is closed). cannot flow).

In the mold closing process, the cavity piece 226 is relatively lowered in each cavity 208 to heat and press the resin R against the work W (the work W is held by some of the work holding portions 205A to 205C). may not be). As a result, the resin R is thermally cured and resin sealing (molding) is completed.

Next, as a mold opening step, the sealing mold 202 is opened and the molded product Wp is taken out from the sealing mold 202 by the molded product conveying unit 106 (molded product loader 212).

In this embodiment, when the sealing mold 202 is opened, the shutter 274 of the first channel 272 is closed (see FIG. 5A) and opened (see FIG. 5B). , the air supplied from the outside is introduced between the upper mold 204 and the lower mold 206, and the process of flowing along the delivery direction of the film F is performed. As described above, the step of passing air may be performed when performing the film supplying step instead of when the sealing mold 202 is opened, or together with this.

Normally, when the sealing mold 202 is opened, the sealing mold 202 is moved (opening operation) and the molded product Wp is ejected. The fine powder of the resin R adhering to the surface, etc.) tends to rise up. On the other hand, according to the above-described process, air is allowed to flow into the sealing mold 202, that is, between the upper mold 204 and the lower mold 206, and the dust is discharged out of the sealing mold 202. It is possible to

Finally, the molded product conveying unit 106 (slider 118) conveys the molded product Wp from the press unit 100B to the molded product storage unit 100D and stores it in the molded product stocker 112. FIG.

The above is the main operation of resin sealing performed using the resin sealing apparatus 1 . However, the above order of steps is only an example, and it is possible to change the order of the steps before and after or perform them in parallel as long as there is no problem. For example, in the present embodiment, since a plurality (two sets as an example) of press units 100B are provided, it is possible to efficiently form a molded product by performing the above operations in parallel.

As described above, according to the resin sealing apparatus and the resin sealing method according to the present invention, it is possible to remove dust that is stirred up inside the sealing mold when the mold is opened, the film is replaced, or the like. Therefore, it is possible to prevent the occurrence of defective molding due to dust.

It should be noted that the present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the scope of the present invention. In particular, although thermosetting resins in the form of granules, pulverized, and powder have been exemplified as sealing resins, they are not limited to these, and liquid, plate-like, sheet-like resins, etc. are used. configuration can also be applied.

Further, in the above-described embodiments, the resin sealing apparatus and the resin sealing method using the compression molding method in which the upper mold has a cavity have been described as an example. It can also be applied to devices and resin sealing methods. Furthermore, the present invention can be applied to a resin sealing device and a resin sealing method using a transfer molding method.

1 resin sealing device 202 sealing mold 267 supply duct 268 discharge duct 271 second channel 272 first channel W work

Claims (8)

A resin encapsulation apparatus for encapsulating a workpiece with resin and processing it into a molded product using a press apparatus equipped with an encapsulation die having an upper die and a lower die,
A supply duct that supplies air from the outside and a discharge duct that discharges the air to the outside,
A first flow path for flowing the air between the upper mold and the lower mold to discharge dust is provided as a flow path for flowing the air from the supply duct to the discharge duct. resin sealing equipment. As a flow path for flowing the air from the supply duct to the discharge duct, it further has a second flow path for flowing the air above the sealing mold to discharge the heat of the sealing mold. 2. The resin sealing device according to claim 1, wherein: 3. The resin sealing device according to claim 2, further comprising a shutter that allows the air to flow through either one of the first flow path and the second flow path. further comprising a film feeding mechanism having an unwinding section and a winding section and feeding a roll of film between the upper mold and the lower mold;
2. The resin sealing device according to claim 1, wherein the first flow path is configured to allow the air to flow in the same direction as the direction from the unwinding portion to the winding portion. A first press device and a second press device are provided as the press devices, and the film supply mechanisms provided in each are arranged at a position far from the unwinding section and close to the winding section. By being arranged, the film is sent out in the facing direction,
5. The resin seal according to claim 4, wherein the discharge duct common to the first flow path provided in each of the first press device and the second press device is disposed at an intermediate position between the first press device and the second press device. stop device. The first flow path includes an introduction rectifying plate that introduces the air supplied from the supply duct toward between the upper mold and the lower mold, and the air that is delivered from between the upper mold and the lower mold. 2. The resin sealing device according to claim 1, further comprising at least one of a leading-out rectifying plate for leading the discharged air toward the discharging duct. Using a resin sealing device comprising a sealing mold having an upper mold and a lower mold, and a shutter for opening and closing a flow path for allowing air supplied from the outside to flow between the upper mold and the lower mold A resin sealing method for sealing a workpiece with resin and processing it into a molded product,
A resin sealing method, wherein the shutter is opened when the upper mold and the lower mold are opened to allow the air to flow between the upper mold and the lower mold. The resin sealing device further comprises a film supply mechanism having an unwinding part and a winding part and supplying a roll-shaped film between the upper mold and the lower mold,
8. The resin according to claim 7, wherein the shutter is opened when the film is sent out from between the upper mold and the lower mold to allow the air to flow between the upper mold and the lower mold. Sealing method.

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