TWI789571B - Film laminator and film lamination method - Google Patents
Film laminator and film lamination method Download PDFInfo
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- TWI789571B TWI789571B TW109103784A TW109103784A TWI789571B TW I789571 B TWI789571 B TW I789571B TW 109103784 A TW109103784 A TW 109103784A TW 109103784 A TW109103784 A TW 109103784A TW I789571 B TWI789571 B TW I789571B
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Description
本發明係關於一種貼膜機及貼膜方法,特別是涉及能防止溢膠問題的貼膜機及貼膜方法。The invention relates to a film laminating machine and a film laminating method, in particular to a film laminating machine and a film laminating method capable of preventing glue overflow.
按,在半導體或電子零組件的產業中,會需要在基材上貼附膜料(含膠膜、麥拉膜(Mylar))以當作後續製程的建構層或是接著劑。一般而言,將膜料裁切後貼附於基材上,同步加熱膜料使其有一定程度的可流動性來填覆、接合基材。By the way, in the semiconductor or electronic component industry, it is necessary to attach a film (including adhesive film, Mylar film) on the substrate as a construction layer or an adhesive in the subsequent process. Generally speaking, the film material is cut and attached to the substrate, and the film material is heated synchronously to make it have a certain degree of fluidity to fill and bond the substrate.
然而,在加溫加壓膜料時,處於熱熔狀態的膜料容易從基材的邊緣溢出,這種溢膠情況會導致膜料高度不均勻或是汙染機台,進而影響貼膜良率以及貼膜品質。However, when the film material is heated and pressurized, the film material in a hot-melt state tends to overflow from the edge of the substrate. This overflow situation will lead to uneven height of the film material or pollute the machine, which will affect the film yield and Film quality.
鑒於以上的問題,本發明揭露一種貼膜機及貼膜方法,有助於解決被加熱的膜料在貼膜時會發生溢膠的問題。In view of the above problems, the present invention discloses a film laminating machine and a film laminating method, which help to solve the problem of glue overflow of the heated film material during film lamination.
本發明揭露的貼膜機包含一下腔體、一上腔體、一靜電吸盤以及一膜料撓曲元件。上腔體可相對下腔體移動以與下腔體密合。靜電吸盤設置於上腔體。膜料撓曲元件設置於上腔體,且膜料撓曲元件可相對上腔體活動以接近或遠離下腔體。The film laminating machine disclosed in the present invention includes a lower chamber, an upper chamber, an electrostatic chuck and a film material deflection element. The upper cavity can move relative to the lower cavity to be in close contact with the lower cavity. The electrostatic chuck is arranged on the upper cavity. The film material deflection element is arranged in the upper cavity, and the film material deflection element can move relative to the upper cavity to approach or leave the lower cavity.
本發明揭露的貼膜方法包含:以一靜電吸盤吸取不同材質的一第一膜料以及一第二膜料,其中第一膜料的尺寸大於第二膜料的尺寸,且第一膜料介於靜電吸盤與第二膜料之間;使第一膜料的周邊部分產生撓曲,以覆蓋基材與第二膜料的側邊;以及將第二膜料貼附於一基材。The film sticking method disclosed in the present invention includes: using an electrostatic chuck to absorb a first film material and a second film material of different materials, wherein the size of the first film material is larger than the size of the second film material, and the first film material is between Between the electrostatic chuck and the second film material; making the peripheral part of the first film material deflect so as to cover the base material and the side of the second film material; and attaching the second film material to a base material.
根據本發明所揭露的貼膜機,膜料撓曲元件可相對上腔體活動以接近或遠離下腔體。在執行貼膜程序時,可透過膜料撓曲元件推抵第一膜料來實現第一膜料周邊部分的撓曲。According to the film laminating machine disclosed in the present invention, the film deflection element can move relative to the upper cavity to approach or move away from the lower cavity. When performing the film sticking procedure, the deflection of the peripheral portion of the first film material can be achieved by pushing the film material deflection element against the first film material.
根據本發明所揭露的貼膜方法,靜電吸盤會吸取第一膜料以及第二膜料,其中第二膜料為要貼在基材表面上的膜料。由於第一膜料的尺寸大於第二膜料的尺寸,因此可以透過撓曲第一膜料的周邊部分來覆蓋第二膜料的側邊。藉此,當第二膜料被加熱而具有流動性時,會因為第一膜料周邊部分的阻擋而防止第二膜料從基材邊緣溢出,有效解決貼膜溢膠的問題。According to the film sticking method disclosed in the present invention, the electrostatic chuck will absorb the first film material and the second film material, wherein the second film material is the film material to be attached on the surface of the substrate. Since the size of the first film material is larger than that of the second film material, the side of the second film material can be covered by bending the peripheral portion of the first film material. Thereby, when the second film material is heated to have fluidity, the second film material will be prevented from overflowing from the edge of the base material due to the blockage of the peripheral part of the first film material, effectively solving the problem of adhesive overflow of the pasting film.
以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the disclosure and the following description of the implementation are used to demonstrate and explain the spirit and principle of the present invention, and provide a further explanation of the patent application scope of the present invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are described in detail below in the implementation mode, and its content is enough to make any person familiar with the related art understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings , anyone skilled in the art can easily understand the purpose and advantages of the present invention. The following examples further describe the concepts of the present invention in detail, but do not limit the scope of the present invention in any way.
請參照圖1,為根據本發明一實施例之膜切膜機與貼膜機的示意圖。在本實施例中,貼膜機1用以拾取切膜機2裁切完成的膜料並將此膜料貼附至基材上。貼膜機1包含一下腔體10、一上腔體20、一靜電吸盤30、一氣囊膜40以及一加熱器50。切膜機2連接一工作平台3,其用以承載經切膜機2內部之切刀(未另繪示)裁切後的膜料。Please refer to FIG. 1 , which is a schematic diagram of a film cutting machine and a film laminating machine according to an embodiment of the present invention. In this embodiment, the film attaching machine 1 is used to pick up the film material cut by the film cutting machine 2 and attach the film material to the substrate. The film laminating machine 1 includes a
下腔體10設置有一承載台,其用以承載基材,例如晶圓或是印刷電路板。上腔體20可相對下腔體10移動,並且下腔體10可以與上腔體20密合而共同形成密閉腔室。The
靜電吸盤30、氣囊膜40與加熱器50設置於上腔體20。詳細來說,氣囊膜40的邊緣與加熱器50固定於上腔體20的內壁。靜電吸盤30設置於上腔體20並且與氣囊膜40相連。靜電吸盤30與加熱器50分別位於氣囊膜40的相對二側,並且靜電吸盤30面向下腔體10。The
透過上腔體20移動至工作平台3上方,靜電吸盤30能吸取放置在工作平台3上的膜料。又,透過上腔體20移動至下腔體10上方,上腔體20與靜電吸盤30能將膜料貼附於基材表面上。Through the
以下說明根據本發明一實施例的貼膜方法。請一併參照圖2至圖6,其中圖2為根據本發明一實施例之貼膜方法的流程示意圖,圖3至圖6為圖1之貼膜機執行貼膜方法的示意圖。在本實施例中,可經由貼膜機1執行貼膜方法,並且貼膜方法包含步驟S11~S15。A film sticking method according to an embodiment of the present invention will be described below. Please refer to FIG. 2 to FIG. 6 together, wherein FIG. 2 is a schematic flow chart of a film sticking method according to an embodiment of the present invention, and FIGS. 3 to 6 are schematic views of the film sticking method executed by the film sticking machine in FIG. 1 . In this embodiment, the film lamination method can be performed via the film lamination machine 1, and the film lamination method includes steps S11-S15.
步驟S11係為提供第一膜料201以及第二膜料202。請併參照圖1和圖3,在圖1中的切膜機2可輸送第一膜料201與第二膜料202至工作平台3。第一膜料201例如但不限於是非熱熔性材質的膜料,比如聚對苯二甲酸乙二酯(PET)膜。第二膜料202例如但不限於是熱熔性材質的膜料,比如加熱後能具有一定程度流動性的膠料,諸如ABF材料或光阻膜。在本實施例中,第一膜料201的尺寸大於第二膜料202的尺寸,更具體來說是第一膜料201的面積大於第二膜料202的面積,使得第二膜料202的邊緣可以被第一膜料201的邊緣圍繞。此處敘述的「熱熔性」與「非熱熔性」材質,是指在同一溫度下分別具有相對低與相對高的熱熔性的兩個材質,意即第一膜料201的熱熔性小於第二膜料202的熱熔性,但並非限制第一膜料201在任意溫度下均不具有熱熔性。Step S11 is to provide the
步驟S12係為用靜電吸盤30吸取第一膜料201以及第二膜料202。如圖3所示,靜電吸盤30吸取第一膜料201以及第二膜料202。在吸取完成後,第一膜料201是介於靜電吸盤30與第二膜料202之間。Step S12 is to suck the
在本實施例中,靜電吸盤30吸取第一膜料201和吸取第二膜料202的作動是分開執行的。具體而言,切膜機2的工作平台3可以有兩個置放區,且切膜機2可以將裁切好的第一膜料201與第二膜料202分別輸送至兩個置放區,或著是切膜機2以預設的時間間隔將第一膜料201與第二膜料202於不同的時間點輸送至工作平台3。上腔體20先移動到承載第一膜料201的置放區上方,並且下移讓靜電吸盤30吸取第一膜料201;接著,上腔體20移動到承載第二膜料202的置放區上方,並且下移讓已經有吸附第一膜料201的靜電吸盤30吸取第二膜料202,但前述依序吸取膜料的方式並非用以限制本發明。在部分實施例中,切膜機2輸送到工作平台3的第一膜料201與第二膜料202可以先堆疊組成多層膜,接著靜電吸盤30同時吸取第一膜料201和第二膜料202。In this embodiment, the actions of the
步驟S13係為上腔體20與下腔體10密合而形成密閉腔室S,並且對密閉腔室S抽真空。如圖4所示,於下腔體10和上腔體20密合時,基材100以及吸附有第一膜料201與第二膜料202的靜電吸盤30皆位於腔室S內。下腔體10或上腔體20具有一個抽氣孔H,並且從抽氣孔H將腔室S內的空氣抽出,而使腔室S內部形成真空狀態。腔室S抽真空可以防止第二膜料202內部殘留氣泡,有助於在後續貼膜時提升貼膜品質。Step S13 is to seal the
步驟S14係為使第一膜料201的周邊部分產生撓曲,以覆蓋第二膜料202的側邊。如圖5所示,在本實施例中,由於第一膜料201的尺寸較大並且位於第二膜料202上方,第一膜料201的周邊部分2011會因為自身重力的影響而下垂,即重力會使周邊部分2011自然地向下撓曲。視撓曲程度不同,周邊部分2011能位在第二膜料202的周圍或是接觸第二膜料202的邊緣,進而覆蓋第二膜料202的側邊,而撓曲程度可取決於第一膜料201的材質。在其他實施例中,可以用額外增設的機構元件推抵第一膜料201的周邊部分2011,而讓撓曲變得更加明顯。Step S14 is to make the peripheral part of the
步驟S15係為透過靜電吸盤30將第二膜料202貼附於基材100。如圖6所示,驅動機構(例如螺桿、汽缸或步進馬達,未繪示)將靜電吸盤30相對上腔體20下移靠近下腔體10。從外部通入氣體至貼膜機1的上腔體20內讓氣囊膜40膨脹以推壓靜電吸盤30,進而使第二膜料202貼附於基材100表面上。可以透過增加上腔體20內氣體的氣壓與氣體體積而使氣囊膜40進一步膨脹以施力推壓靜電吸盤30,從而將第二膜料202更牢固地貼附。貼膜機1的加熱器50加熱第二膜料202使其變成可流動的熱熔狀態,從而提升第二膜料202與基材100表面之間的黏著強度。完成第二膜料202的貼附後,第一膜料201可以被移除。在本實施例中,第一膜料201的周邊部分2011能覆蓋第二膜料202的側邊,而有助於防止熱熔狀態的第二膜料202從基材100的邊緣溢出。Step S15 is to attach the
另外,由於第一膜料201採用與第二膜料202不同的材質,當第二膜料202被加熱成可流動的熱熔狀態時,第一膜料201仍維持為非熱熔狀態,因此能有效阻擋第二膜料202在水平方向上的的流動。此處敘述的「不同材質」,是指第一膜料201和第二膜料202的熱熔性有明顯的不同,例如在同一溫度下熱熔性程度不同的兩個PET膜,並非限制第一膜料201和第二膜料202必須採用不同的材質製成。In addition, since the
圖7為根據本發明另一實施例之貼膜機的示意圖。在本實施例中,貼膜機1a包含一下腔體10、一上腔體20、一靜電吸盤30、一氣囊膜40、一加熱器50以及一膜料撓曲元件60。關於下腔體10、上腔體20、靜電吸盤30、氣囊膜40與加熱器50的描述請參考關於圖1之貼膜機的內容,以下不針對這些元件再做贅述。Fig. 7 is a schematic diagram of a film laminating machine according to another embodiment of the present invention. In this embodiment, the film laminating machine 1 a includes a
膜料撓曲元件60設置於上腔體20,並且可相對上腔體20活動以接近或遠離下腔體10。詳細來說,本實施例的膜料撓曲元件60為一環形充氣環,並且靜電吸盤30與膜料撓曲元件60分別位於氣囊膜40的相對二側,換句話說加熱器50與膜料撓曲元件60位於氣囊膜40的同一側。The
圖8為根據本發明另一實施例之貼膜方法的流程示意圖。圖9至圖11為圖7之貼膜機執行貼膜方法的示意圖。在本實施例中,可經由貼膜機1a執行貼膜方法,並且貼膜方法包含步驟S21~S26。FIG. 8 is a schematic flowchart of a film sticking method according to another embodiment of the present invention. 9 to 11 are schematic diagrams of the film laminating method performed by the film laminating machine in FIG. 7 . In this embodiment, the film lamination method can be performed via the film lamination machine 1a, and the film lamination method includes steps S21-S26.
步驟S21係為提供第一膜料201以及第二膜料202。此步驟與前述實施例的步驟S11相似,故不再贅述。Step S21 is to provide the
步驟S22係為用靜電吸盤30吸取第一膜料201以及第二膜料202。此步驟與前述實施例的步驟S12相似,故不再贅述。Step S22 is to suck the
步驟S23係為上腔體20與下腔體10密合而形成密閉腔室S,並且對密閉腔室S抽真空。此步驟與前述實施例的步驟S13相似,故不再贅述。Step S23 is to seal the
步驟S24係為將第二膜料202預貼至基材100。如圖9所示,驅動機構(例如螺桿、汽缸或步進馬達,未繪示)將靜電吸盤30相對上腔體20下移靠近下腔體10。從外部通入氣體至貼膜機1的上腔體20內,讓氣囊膜40膨脹以推壓靜電吸盤30,進而讓第二膜料202與基材100表面接觸。Step S24 is to pre-attach the
步驟S25係為使第一膜料201的周邊部分產生撓曲,以覆蓋第二膜料202的側邊。如圖10所示,通入氣體至膜料撓曲元件60(環形充氣環)的內部空間610,而讓膜料撓曲元件60膨脹。膨脹的膜料撓曲元件60推抵第一膜料201,而使第一膜料201的周邊部分2011產生撓曲。由於膜料撓曲元件60的內部與上腔體20的腔室互不連通,通入至膜料撓曲元件60內的氣體並不會影響到上腔體20內的氣壓與氣體體積,因此氣囊膜40不會因為膜料撓曲元件60充氣而有膨脹或消氣的情況。膨脹的膜料撓曲元件60推抵第一膜料201的周邊部分2011,而使周邊部分2011撓曲以覆蓋第二膜料202與基材100的側邊。圖7至圖10繪示出加熱器50與膜料撓曲元件60位於氣囊膜40的同一側,而能避免膜料撓曲元件60在充氣時因過度膨脹而破裂,但本發明並不以此為限。在其他實施例中,靜電吸盤30與膜料撓曲元件60皆位於氣囊膜40的同一側。Step S25 is to make the peripheral portion of the
步驟S26係為透過靜電吸盤30將第二膜料202貼附於基材100。如圖11所示,進一步通入氣體至上腔體20內讓氣囊膜40更加膨脹,而使氣囊膜40施加力F推壓靜電吸盤30,從而將第二膜料202更牢固地貼附在基材100表面。加熱器50加熱第二膜料202使其變成可流動的熱熔狀態,從而提升第二膜料202與基材100表面之間的黏著強度。在本實施例中,透過用膜料撓曲元件60撓曲第一膜料201的周邊部分2011來覆蓋第二膜料202的側邊,而有助於防止熱熔狀態的第二膜料202從基材100的邊緣溢出。完成第二膜料202貼附在基材100表面後,第一膜料201可以被移除。Step S26 is to attach the
綜上所述,本發明所揭露的貼膜機包含膜料撓曲元件,其可相對上腔體活動以接近或遠離下腔體。在執行貼膜程序時,可透過膜料撓曲元件推抵第一膜料來實現第一膜料周邊部分的撓曲。To sum up, the film laminating machine disclosed in the present invention includes a film material deflection element, which can move relative to the upper chamber to approach or move away from the lower chamber. When performing the film sticking procedure, the deflection of the peripheral portion of the first film material can be achieved by pushing the film material deflection element against the first film material.
本發明所揭露的貼膜方法中,靜電吸盤會吸取第一膜料以及第二膜料,其中第二膜料為要貼在基材表面上的膜料。由於第一膜料的尺寸大於第二膜料的尺寸,因此可以透過撓曲第一膜料的周邊部分來覆蓋第二膜料的側邊。藉此,當第二膜料被加熱而具有流動性時,會因為第一膜料周邊部分的阻擋而防止第二膜料從基材邊緣溢出,有效解決貼膜溢膠的問題。In the film sticking method disclosed in the present invention, the electrostatic chuck will absorb the first film material and the second film material, wherein the second film material is the film material to be attached on the surface of the substrate. Since the size of the first film material is larger than that of the second film material, the side of the second film material can be covered by bending the peripheral portion of the first film material. Thereby, when the second film material is heated to have fluidity, the second film material will be prevented from overflowing from the edge of the base material due to the blockage of the peripheral part of the first film material, effectively solving the problem of adhesive overflow of the pasting film.
雖然本發明以前述之實施例揭露如上,然而這些實施例並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention is disclosed above with the aforementioned embodiments, these embodiments are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, all changes and modifications are within the scope of patent protection of the present invention. For the scope of protection defined by the present invention, please refer to the appended scope of patent application.
1、1a:貼膜機 2:切膜機 3:工作平台 10:下腔體 20:上腔體 S:腔室 30:靜電吸盤 40:氣囊膜 50:加熱器 60:膜料撓曲元件 610:內部空間 100:基材 201:第一膜料 2011:周邊部分 202:第二膜料 H:抽氣孔 F:力 S11~S15、S21~S26:步驟1, 1a: Laminating machine 2: film cutting machine 3: Working platform 10: Lower cavity 20: Upper cavity S: chamber 30: Electrostatic chuck 40: air bag membrane 50: heater 60: Membrane material deflection element 610: interior space 100: Substrate 201: The first film material 2011: Peripheral part 202: Second film material H: air hole F: force S11~S15, S21~S26: steps
圖1為根據本發明一實施例之切膜機與貼膜機的示意圖。 圖2為根據本發明一實施例之貼膜方法的流程示意圖。 圖3至圖6為圖1之貼膜機執行貼膜方法的示意圖。 圖7為根據本發明另一實施例之貼膜機的示意圖。 圖8為根據本發明另一實施例之貼膜方法的流程示意圖。 圖9至圖11為圖7之貼膜機執行貼膜方法的示意圖。FIG. 1 is a schematic diagram of a film cutting machine and a film laminating machine according to an embodiment of the present invention. FIG. 2 is a schematic flowchart of a film sticking method according to an embodiment of the present invention. 3 to 6 are schematic diagrams of the film laminating method performed by the film laminating machine in FIG. 1 . Fig. 7 is a schematic diagram of a film laminating machine according to another embodiment of the present invention. FIG. 8 is a schematic flowchart of a film sticking method according to another embodiment of the present invention. 9 to 11 are schematic diagrams of the film laminating method performed by the film laminating machine in FIG. 7 .
1a:貼膜機1a: Laminating machine
10:下腔體10: Lower cavity
20:上腔體20: Upper cavity
30:靜電吸盤30: Electrostatic chuck
40:氣囊膜40: air bag membrane
50:加熱器50: heater
60:膜料撓曲元件60: Membrane material deflection element
Claims (11)
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CN108582751A (en) * | 2018-03-19 | 2018-09-28 | 广东欧珀移动通信有限公司 | Method for adhering film and electronic equipment |
CN109624298A (en) * | 2019-01-11 | 2019-04-16 | 深圳凯和科技有限公司 | Method for adhering film |
CN110014717A (en) * | 2018-01-08 | 2019-07-16 | 阳程科技股份有限公司 | Application of a surface device and its applying method |
CN110576590A (en) * | 2018-06-04 | 2019-12-17 | 蓝思科技(长沙)有限公司 | Film pasting method of 3D glass, tool for 3D glass film pasting and film pasting equipment |
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CN110014717A (en) * | 2018-01-08 | 2019-07-16 | 阳程科技股份有限公司 | Application of a surface device and its applying method |
CN108582751A (en) * | 2018-03-19 | 2018-09-28 | 广东欧珀移动通信有限公司 | Method for adhering film and electronic equipment |
CN110576590A (en) * | 2018-06-04 | 2019-12-17 | 蓝思科技(长沙)有限公司 | Film pasting method of 3D glass, tool for 3D glass film pasting and film pasting equipment |
CN109624298A (en) * | 2019-01-11 | 2019-04-16 | 深圳凯和科技有限公司 | Method for adhering film |
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