TWI846138B - Film lamination appratus and film lamination method - Google Patents

Abstract

A film lamination apparatus includes a substrate carrier, a lamination mechanism and a film peripheral support mechanism. The lamination mechanism is movable relative to the substrate carrier. The film peripheral support mechanism comprises a support member and a confining member. The support member is provided around the substrate carrier. The support member is separated from the film lamination mechanism at an idle state and pushed by the lamination mechanism at a pressed state. In the idle state, the support member abuts against the confining member, at least a portion of the support member is closer to the lamination mechanism than the substrate carrier, and the distance between the support member and the lamination mechanism is restricted by the confining member. In the pressed state, the support member is separated from the confining member and the support member is moved relative to the substrate carrier by pushing of the lamination mechanism.

Description

Laminating device and laminating method

The present invention relates to lamination technology, in particular to a lamination device and a lamination method including a peripheral support mechanism for the film material.

In the semiconductor or electronic component industry, it is necessary to attach film materials (including adhesive film, Mylar) to the substrate to serve as a construction layer or adhesive for subsequent processes. Generally speaking, the film material is first picked up and then transported to the film attachment work area corresponding to the substrate through a transmission mechanism, and then a laminating machine is used to complete the operation of pressing the film material onto the substrate surface.

However, in some cases, some problems may occur, which will affect the quality of the lamination between the film and the substrate. One of the problems is that the traditional method of picking up the film with a suction cup can easily cause the film to accidentally fall off the suction cup during the lamination process.

In view of the above problems, the present invention provides a laminating device and a laminating method, which help solve the problem that the film material is easy to fall off during the laminating operation.

The film pressing device disclosed in the present invention includes a substrate support platform, a film pressing mechanism and a film material peripheral support mechanism. The film pressing mechanism can move relative to the substrate support platform. The film material peripheral support mechanism includes a support member and a limit member. The support member is arranged around the substrate support platform. The support member has an idle state separated from the film pressing mechanism and a pressed state pushed by the film pressing mechanism. In the idle state, the support member abuts against the limit member, at least part of the support member is closer to the film pressing mechanism than the substrate support platform, and the distance between the support member and the film pressing mechanism is limited by the limit member. In the pressed state, the support member is separated from the limit member, and the support member moves relative to the substrate support platform by the push of the film pressing mechanism.

The laminating method disclosed in the present invention includes: picking up a film material with a laminating mechanism; moving the laminating mechanism close to a substrate disposed on a substrate carrier; clamping the periphery of the film material with the laminating mechanism and a supporting member located at a first level; pressing the film material onto the surface of the substrate with the laminating mechanism, and pushing the supporting member to move to a second level lower than the first level; removing the pushing force applied by the laminating mechanism to the supporting member to move the supporting member to the first level; and maintaining the supporting member at the first level by abutting the supporting member against a limiting member.

According to the lamination device and lamination method disclosed in the present invention, the lamination device includes a film material peripheral support mechanism that can be pushed by a lamination mechanism. When performing the lamination operation, the lamination mechanism and the support member jointly clamp the periphery of the film material so that the support member can support the periphery of the film material. The support member supports the periphery of the film material to help prevent the film material from accidentally falling off due to separation from the lamination mechanism. In particular, when the lamination method involves the need for a vacuum operating environment and/or the lamination device involves picking up the film material with a negative pressure adsorption force or adhesion force, the negative pressure adsorption force or adhesion force may be difficult to stably grasp the film material during vacuuming due to the removal of atmospheric pressure. In this way, the supporting mechanism around the membrane material can more obviously help prevent the membrane material from accidentally falling off during the vacuuming process.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

1: Laminating device

10: Upper cavity

20: Lower cavity

100: Chamber

30: Substrate carrier

310: Loading surface

40: Film pressing mechanism

410: Subject

411: Gas channel

412: Take the membrane part

420: Pressure-coated airbag

50: Film material peripheral support mechanism

510: Support parts

511: Subject

512: Gasket

5121: Upper surface

520: Limiting parts

521: Stop surface

60:Driver

H1: First level height

H2: Second level height

F: Film material

S: Substrate

S1: Surface

Dp: Film pressing direction

S1~S8: Steps

Figure 1 is a schematic diagram of a laminating device according to an embodiment of the present invention.

Figure 2 is a schematic cross-sectional view of the film pressing mechanism of Figure 1.

Figure 3 is a flow chart of a lamination method according to an embodiment of the present invention.

Figures 4 to 12 are schematic diagrams of using the lamination device of Figure 1 to perform the lamination method of Figure 3.

The detailed features and advantages of the present invention are described in detail in the following implementation methods, and the content is sufficient for anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.

Please refer to Figure 1, which is a schematic diagram of a laminating device according to the first embodiment of the present invention. In this embodiment, the laminating device 1 includes an upper cavity 10, a lower cavity 20, a substrate support table 30, a laminating mechanism 40, and a film material peripheral support mechanism 50.

The upper chamber 10 and the lower chamber 20 are arranged corresponding to each other. Specifically, the upper chamber 10 can be moved close to the lower chamber 20 by a driving source (such as a motor cylinder, not shown), so that the upper chamber 10 can be assembled and connected with the lower chamber 20. When the upper chamber 10 and the lower chamber 20 are connected, the gas can be exhausted through the gas channel (not shown) formed in the upper chamber 10 or the lower chamber 20, and a negative pressure vacuum atmosphere can be provided in the chamber 100 formed by the upper chamber 10 and the lower chamber 20, thereby making the upper chamber 10 and the lower chamber 20 airtightly closed. The substrate carrier 30 is arranged on the side of the lower chamber 20 facing the upper chamber 10. The substrate carrier 30 is configured to carry, for example but not limited to, a circuit board or a silicon wafer.

The laminating mechanism 40 includes a main body 410 and a laminating airbag 420. The main body 410 is disposed in the upper chamber 10 and is located on a side of the upper chamber 10 facing the lower chamber 20, and the main body 410 can be moved close to the lower chamber 20 and the substrate support table 30 by a driving source (such as a motor cylinder, not shown). The laminating airbag 420 is disposed in the main body 410 and can expand relative to the substrate support table 30. The main body 410 can have a gas channel 411, and gas can be supplied to the space between the main body 410 and the laminating airbag 420 through the gas channel 411, thereby expanding the laminating airbag 420. The expansion of the laminating airbag 420 can push the laminating material, which will be further described later. The main body 410 of the laminating mechanism 40 also has a film removal portion 412 located around the laminating airbag 420. The film removal portion 412 may include an annular channel surrounding the laminating airbag 420, and may provide negative pressure adsorption force to the annular channel by evacuating air through the gas channel 411.

The laminating mechanism 40 of this embodiment includes a flexible laminating airbag 420, but the present invention is not limited thereto. In other embodiments, the laminating mechanism may not include a laminating airbag, but may be replaced by a rigid laminating plate disposed on the main body.

The film material peripheral support mechanism 50 includes a support member 510 and a stopper 520. The support member 510 is disposed around the substrate support table 30. The support member 510 can be movably disposed in the lower chamber 20. In detail, the support member 510 includes a main body 511 and a gasket 512 disposed on the main body 511 and surrounding the substrate support table 30. The main body 511 can be moved relative to the lower chamber 20 by a driving source. For example, the film pressing device 1 shown in FIG. 1 further includes a drive member 60 connected to the main body 511 of the support member 510. The drive member 60 is, for example but not limited to, a motor cylinder, which can drive the support member 510 to move close to the stopper 520 and the film pressing mechanism 40. The stopper 520 is fixed to the lower cavity 20 and has a stop surface 521 located between the main body 511 and the lower cavity 20. The gasket 512 is connected to the main body 511 and faces the film removal portion 412 of the main body 410 of the film pressing mechanism 40.

The support member 510 has an idle state separated from the film pressing mechanism 40 and a pressed state pushed by the film pressing mechanism 40. Please refer to FIG. 4 . In the idle state, the support member 510 abuts against the limiter 520, at least part of the support member 510 is closer to the film pressing mechanism 40 than the substrate support platform 30, and the distance between the support member 510 and the film pressing mechanism 40 is limited by the limiter 520. In other words, the main body 511 of the support member 510 abuts against the stopper surface 521 of the limiter 520. In the vertical direction, the gasket 512 of the support member 510 is closer to the film pressing mechanism 40 than the substrate support platform 30. Since the freedom of movement of the main body 511 of the support member 510 is limited by the stop surface 521 of the limiter 520, the vertical distance between the gasket 512 of the support member 510 and the laminating mechanism 40 is limited. In other words, when the main body 511 abuts against the stop surface 521, the gasket 512 cannot get closer to the laminating mechanism 40. Since the driving member 60 continuously drives the support member 510 to abut against the stopper 520, the support member 510 is normally in an idle state and maintained at a first horizontal height H1 higher than the supporting surface 310 of the substrate supporting table 30.

Referring to FIG. 7 , in the above-mentioned pressure-bearing state, the support member 510 is separated from the stop member 520, and the support member 510 is moved relative to the substrate support table 30 by the pressure of the film pressing mechanism 40. Specifically, when the main body 410 of the film pressing mechanism 40 moves close to the substrate support table 30, at least one of the film portion 412 and the film pressing airbag 420 pushes against the gasket 512 of the support member 510, thereby driving the main body 511 of the support member 510 to separate from the stop surface 521 of the stop member 520, and causing the main body 410 and the support member 510 to move in the same direction.

An embodiment of the present invention discloses a lamination method, and the lamination method can be performed using the lamination device 1 of FIG. 1. Please refer to FIG. 3 to FIG. 12, wherein FIG. 3 is a flow chart of the lamination method according to an embodiment of the present invention, and FIG. 4 to FIG. 12 are schematic diagrams of using the lamination device of FIG. 1 to perform the lamination method of FIG. 3. The lamination method disclosed in this embodiment includes steps S1 to S8 performed in sequence, which press a film material F (such as Mylar film) onto the surface of a substrate S (such as a silicon wafer). In other embodiments, the film material and the substrate may be a resin film and a multi-layer circuit board, respectively.

In step S1, the film material F is picked up by the film pressing mechanism 40. As shown in Figures 2 and 4, the film material F is picked up by the film taking part 412 of the main body 410 of the film pressing mechanism 40. The air is sucked through the gas channel 411 of the main body 410 to provide negative pressure adsorption force to the annular channel of the film taking part 412, so that the annular channel can adsorb the peripheral part of the film material F.

In step S2, the laminating mechanism 40 moves close to the substrate S disposed on the substrate support table 30. As shown in FIG5 , the main body 410 driving the laminating mechanism 40 moves close to the substrate support table 30 along the laminating direction Dp relative to the upper cavity 10 and the substrate support table 30. At this time, the support member 510 is in an idle state and is located at the first horizontal height H1, more specifically, the gasket 512 is located at the first horizontal height H1.

In step S3, the film pressing mechanism 40 and the support member 510 at the first horizontal height H1 jointly clamp the periphery of the film material F. As shown in Figures 5 and 6, the opposite sides of the periphery of the film material F are respectively attached to the gasket 512 of the support member 510 and the film removal part 412 of the film pressing mechanism 40, and the gasket 512 and the film removal part 412 jointly clamp the film material F. At this time, the film pressing mechanism 40 has not yet applied force to push or has only slightly pushed against the support member 510.

The first level height H1 is a value that has been predetermined before the lamination operation is performed, and the first level height H1 can be adjusted according to the characteristics of the substrate S and/or the film material F. For example, when the thickness of the substrate S is thicker, a new first level height can be re-determined, and the new first level height can be higher than the aforementioned first level height H1.

In step S4, a vacuum atmosphere is formed. Specifically, the vacuum atmosphere is provided in the chamber 100 formed by the upper chamber 10 and the lower chamber 20 by evacuating air through a gas channel (not shown separately) formed in the upper chamber 10 or the lower chamber 20. A portion of the main body 410 of the laminating mechanism 40 and the laminating airbag 420, the film material F, the substrate carrier 30, the substrate S, a portion of the main body 511 of the support member 510, and the gasket 512 are all accommodated in the vacuum atmosphere. The limiter 520 is located outside the vacuum atmosphere. The air pressure of this vacuum atmosphere can be ^10-5 torr to ^10-6 torr. The vacuum atmosphere helps to avoid the formation of bubbles after the film material F and the substrate S are bonded, but the present invention is not limited thereto. In other embodiments, it is not necessary to evacuate the chamber 100. Since the film taking part 412 of the film pressing mechanism 40 and the gasket 512 of the supporting member 510 clamp the periphery of the film material F together, the gasket 512 can support the periphery of the film material F, thereby helping to prevent the film material F from accidentally falling off due to separation from the film taking part 412 during the vacuuming process.

In step S5, after the film pressing mechanism 40 and the support member 510 jointly clamp the periphery of the film material F, the film pressing mechanism 40 is continuously moved close to the substrate S to push the support member 510, and the support member 510 moves together with the film pressing mechanism 40 due to the pushing of the film pressing mechanism 40. As shown in Figures 5 to 7, the gasket 512 of the support member 510 and the film taking part 412 of the film pressing mechanism 40 jointly clamp the periphery of the film material F. Then, the main body 410 of the film pressing mechanism 40 is continuously moved close to the substrate S along the film pressing direction Dp, so that the film taking part 412 pushes the gasket 512. By pushing the gasket 512 with the film removal part 412, the support member 510 in the idle state becomes in the pressurized state and moves along the film pressing direction Dp together with the film pressing mechanism 40. Furthermore, since the driving force of the driving member 60 is less than the pushing force of the film pressing mechanism 40, the support member 510 will be pushed by the film pressing mechanism 40 and move along the film pressing direction Dp, and at the same time, the main body 511 of the support member 510 is separated from the stop surface 521 of the limit member 520.

In step S6, the film pressing mechanism 40 pushes the support member 510 to move to a second level H2 lower than the first level H1, and presses the film material F onto the surface of the substrate S. As shown in Figures 7 and 8, the support member 510, which is in a pressurized state due to the film taking part 412 pressing the gasket 512, moves from the first level H1 in Figure 6 to the second level H2 in Figure 8, wherein the second level H2 is lower than the first level H1. More specifically, the upper surface 5121 of the gasket 512 at the second level H2 is located at the same level as the surface S1 of the substrate S. The film pressing airbag 420 of the film pressing mechanism 40 expands to press the film material F onto the surface S1 of the substrate S.

In step S7, the push applied by the film pressing mechanism 40 to the support member 510 is removed, so that the support member 510 moves to the first horizontal height H1. As shown in FIG9 and FIG10, the main body 410 of the film pressing mechanism 40 continues to move away from the substrate S in the opposite direction of the film pressing direction Dp, and the film taking part 412 releases the adsorption force used to adsorb the film material F, so that the film material F and the film pressing mechanism 40 are separated. The periphery of the film material F is supported on the gasket 512 of the support member 510. As the main body 410 moves away from the substrate S, the push applied by the film taking part 412 to the gasket 512 of the support member 510 is removed. Since the pushing force of the film removal part 412 on the gasket 512 of the support member 510 has been removed, the driving member 60 can drive the support member 510 back to the first horizontal height H1 in Figure 6.

In step S8, the support member 510 is maintained at the first level H1 by abutting against the limit member 520. As shown in Figures 11 and 12, the gasket 512 of the support member 510 returns to the first level H1, and the main body 511 of the support member 510 abuts against the stop surface 521 of the limit member 520 again, and the stop surface 521 prevents the support member 510 from being driven by the driving member 60, so that the gasket 512 of the support member 510 can be maintained at the first level H1.

In summary, according to the laminating device and laminating method disclosed in the present invention, the laminating device includes a film material peripheral support mechanism that can be pushed by the laminating mechanism. When performing the laminating operation, the laminating mechanism and the support member jointly clamp the periphery of the film material, so that the support member can support the periphery of the film material, thereby helping to prevent the film material from accidentally falling off due to separation from the laminating mechanism. In particular, when the laminating method involves the requirement of a vacuum operating environment and/or the laminating device involves picking up the film material with a negative pressure adsorption force or adhesion force, the negative pressure adsorption force or adhesion force may be difficult to stably grasp the film material during vacuuming due to the removal of atmospheric pressure. In this way, the supporting mechanism around the membrane material can more obviously help prevent the membrane material from accidentally falling off during the vacuuming process.

Although the embodiments of the present invention are disclosed as described above, they are not intended to limit the present invention. Anyone familiar with the relevant technology can make some changes to the shape, structure, features and spirit described in the scope of the application of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

1: Laminating device

10: Upper cavity

20: Lower cavity

100: Chamber

30: Substrate carrier

310: Loading surface

40: Film pressing mechanism

410: Subject

412: Take the membrane part

420: Pressure-coated airbag

50: Film material peripheral support mechanism

510: Support parts

511: Subject

512: Gasket

520: Limiting parts

521: Stop surface

60:Driver

Claims (8)

A laminating device comprises: a substrate supporting platform; a laminating mechanism which can move relative to the substrate supporting platform; and a film material peripheral supporting mechanism, comprising a supporting member and a limiting member, wherein the supporting member is arranged around the substrate supporting platform; wherein the supporting member has an idle state separated from the laminating mechanism and a pressed state pushed by the laminating mechanism, wherein in the idle state, the supporting member abuts against the limiting member, at least a part of the supporting member is closer to the laminating mechanism than the substrate supporting platform, and the distance between the supporting member and the laminating mechanism is limited by the limiting member , and in the pressurized state, the support member is separated from the limit member, and the support member moves relative to the substrate carrier by the pressing of the film pressing mechanism; wherein the film pressing device further comprises: a lower chamber, wherein the substrate carrier is located in the lower chamber, the support member can be movably arranged in the lower chamber, and the limit member is fixed to the lower chamber; and an upper chamber, which is arranged corresponding to the lower chamber, the film pressing mechanism can be movably arranged in the upper chamber and is located on one side of the upper chamber facing the lower chamber, and the upper chamber can move relative to the lower chamber to be airtightly closed with the lower chamber. The laminating device as described in claim 1, wherein the upper cavity and the lower cavity are hermetically closed to form a vacuum atmosphere, the substrate carrier, the laminating mechanism and the supporting member of the film material peripheral supporting mechanism are contained in the vacuum atmosphere, and the limiting member is located outside the vacuum atmosphere. The laminating device as described in claim 1 further comprises a driving member connected to the supporting member, wherein the driving member drives the supporting member to move closer to the limiting member and the laminating mechanism. The laminating device as described in claim 1, wherein the support member in the idle state is maintained at a first level higher than a supporting surface of the substrate supporting table, and the support member in the pressurized state moves from the first level to a second level, and the second level is lower than the first level. The laminating device as described in claim 1, wherein the laminating mechanism includes a laminating airbag and a film removal portion located around the laminating airbag, and the support member faces the film removal portion. A lamination method includes: picking up a film material with a lamination mechanism; moving the lamination mechanism close to a substrate disposed on a substrate carrier; clamping the periphery of the film material with the lamination mechanism and a support member at a first level; pushing the support member with the lamination mechanism to move to a second level lower than the first level, and pressing the film material onto the surface of the substrate; removing the pushing force applied by the lamination mechanism to the support member to move the support member to the first level; and maintaining the support member at the first level by abutting the support member against a stop member; wherein the lamination method further includes providing a vacuum atmosphere for accommodating the substrate, the lamination mechanism and the support member in a chamber formed by an upper cavity and a lower cavity. The lamination method as described in claim 6, wherein the vacuum atmosphere is formed after the periphery of the film material is clamped by the lamination mechanism and the support member. The lamination method as described in claim 6 further comprises: after the lamination mechanism and the support member jointly clamp the periphery of the film material, the lamination mechanism is continuously moved close to the substrate to push the support member, and the support member moves together with the lamination mechanism due to the pushing of the lamination mechanism.

Images