TWI846138B - Film lamination appratus and film lamination method - Google Patents

Film lamination appratus and film lamination method Download PDF

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TWI846138B
TWI846138B TW111142436A TW111142436A TWI846138B TW I846138 B TWI846138 B TW I846138B TW 111142436 A TW111142436 A TW 111142436A TW 111142436 A TW111142436 A TW 111142436A TW I846138 B TWI846138 B TW I846138B
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support member
laminating
film
substrate
lamination
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TW111142436A
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TW202419261A (en
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陳明宗
賴家偉
洪建民
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志聖工業股份有限公司
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Abstract

A film lamination apparatus includes a substrate carrier, a lamination mechanism and a film peripheral support mechanism. The lamination mechanism is movable relative to the substrate carrier. The film peripheral support mechanism comprises a support member and a confining member. The support member is provided around the substrate carrier. The support member is separated from the film lamination mechanism at an idle state and pushed by the lamination mechanism at a pressed state. In the idle state, the support member abuts against the confining member, at least a portion of the support member is closer to the lamination mechanism than the substrate carrier, and the distance between the support member and the lamination mechanism is restricted by the confining member. In the pressed state, the support member is separated from the confining member and the support member is moved relative to the substrate carrier by pushing of the lamination mechanism.

Description

壓膜裝置及壓膜方法 Laminating device and laminating method

本發明係關於壓膜技術,特別是包含膜料周邊支持機構的壓膜裝置及壓膜方法。 The present invention relates to lamination technology, in particular to a lamination device and a lamination method including a peripheral support mechanism for the film material.

按,在半導體或電子零組件的產業中,會需要在基板上貼附膜料(含膠膜、麥拉膜(Mylar))以當作後續製程的建構層或是接著劑。一般而言,會先拾取膜料後透過傳動機構搬運至對應到基板的貼膜工作區域,接著使用壓膜機完成將膜料壓合至基板表面的作業。 In the semiconductor or electronic component industry, it is necessary to attach film materials (including adhesive film, Mylar) to the substrate to serve as a construction layer or adhesive for subsequent processes. Generally speaking, the film material is first picked up and then transported to the film attachment work area corresponding to the substrate through a transmission mechanism, and then a laminating machine is used to complete the operation of pressing the film material onto the substrate surface.

然而,在某些情況下可能會遇到一些問題,從而影響膜料與基板之間的壓合品質。其一問題為傳統用吸盤拾取膜料的方式容易導致膜料在壓膜作業中意外地自吸盤脫落。 However, in some cases, some problems may occur, which will affect the quality of the lamination between the film and the substrate. One of the problems is that the traditional method of picking up the film with a suction cup can easily cause the film to accidentally fall off the suction cup during the lamination process.

鑒於上述問題,本發明提供一種壓膜裝置及壓膜方法,有助於解決膜料在壓膜作業中容易脫落的問題。 In view of the above problems, the present invention provides a laminating device and a laminating method, which help solve the problem that the film material is easy to fall off during the laminating operation.

本發明所揭露之壓膜裝置包含一基板承載台、一壓膜機構以及一膜料周邊支持機構。壓膜機構可相對基板承載台移動。膜料周邊支持機構包含一支持件以及一限位件。支持件設置 於基板承載台周圍。支持件具有與壓膜機構相分離的一閒置狀態以及受到壓膜機構推壓的一受壓狀態。於閒置狀態,支持件抵靠於限位件,至少部分支持件較基板承載台更靠近壓膜機構,且支持件與該壓膜機構之間的距離被限位件限制。於受壓狀態,支持件與限位件相分離,且支持件藉由壓膜機構的推壓而相對基板承載台移動。 The film pressing device disclosed in the present invention includes a substrate support platform, a film pressing mechanism and a film material peripheral support mechanism. The film pressing mechanism can move relative to the substrate support platform. The film material peripheral support mechanism includes a support member and a limit member. The support member is arranged around the substrate support platform. The support member has an idle state separated from the film pressing mechanism and a pressed state pushed by the film pressing mechanism. In the idle state, the support member abuts against the limit member, at least part of the support member is closer to the film pressing mechanism than the substrate support platform, and the distance between the support member and the film pressing mechanism is limited by the limit member. In the pressed state, the support member is separated from the limit member, and the support member moves relative to the substrate support platform by the push of the film pressing mechanism.

本發明所揭露之壓膜方法包含:以一壓膜機構拾取一膜料;以壓膜機構移動靠近設置於一基板承載台上的一基板;以壓膜機構和位於一第一水平高度的一支持件共同夾持膜料周邊;以壓膜機構將膜料壓合至基板的表面上,並且推壓支持件移動至低於第一水平高度的一第二水平高度;移除壓膜機構施加於支持件的推壓,以使支持件往第一水平高度移動;以及藉由支持件與一限位件抵靠,而使支持件維持在第一水平高度。 The laminating method disclosed in the present invention includes: picking up a film material with a laminating mechanism; moving the laminating mechanism close to a substrate disposed on a substrate carrier; clamping the periphery of the film material with the laminating mechanism and a supporting member located at a first level; pressing the film material onto the surface of the substrate with the laminating mechanism, and pushing the supporting member to move to a second level lower than the first level; removing the pushing force applied by the laminating mechanism to the supporting member to move the supporting member to the first level; and maintaining the supporting member at the first level by abutting the supporting member against a limiting member.

根據本發明揭露之壓膜裝置及壓膜方法,壓膜裝置包含可被壓膜機構推壓的膜料周邊支持機構。在執行壓膜作業時,壓膜機構和支持件共同夾持膜料的周邊,使得支持件能承托膜料的周邊。支持件承托膜料的周邊係有助於防止膜料因為與壓膜機構分離而意外地脫落。尤其,當壓膜方法涉及真空作業環境的需求和/或壓膜裝置涉及以負壓吸附力或黏附力拾取膜料時,所述負壓吸附力或黏附力在抽真空中時可能會因為大氣壓力的移除而難以穩固抓取膜料。如此一來,膜料周邊支持機構更明顯有助於防止膜料在抽真空的過程中意外地脫落。 According to the lamination device and lamination method disclosed in the present invention, the lamination device includes a film material peripheral support mechanism that can be pushed by a lamination mechanism. When performing the lamination operation, the lamination mechanism and the support member jointly clamp the periphery of the film material so that the support member can support the periphery of the film material. The support member supports the periphery of the film material to help prevent the film material from accidentally falling off due to separation from the lamination mechanism. In particular, when the lamination method involves the need for a vacuum operating environment and/or the lamination device involves picking up the film material with a negative pressure adsorption force or adhesion force, the negative pressure adsorption force or adhesion force may be difficult to stably grasp the film material during vacuuming due to the removal of atmospheric pressure. In this way, the supporting mechanism around the membrane material can more obviously help prevent the membrane material from accidentally falling off during the vacuuming process.

以上關於本發明內容之說明及以下實施方式之說明係用以示範與解釋本發明之原理,並提供本發明之專利申請範圍更進一步之解釋。 The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

1:壓膜裝置 1: Laminating device

10:上腔體 10: Upper cavity

20:下腔體 20: Lower cavity

100:腔室 100: Chamber

30:基板承載台 30: Substrate carrier

310:承載面 310: Loading surface

40:壓膜機構 40: Film pressing mechanism

410:主體 410: Subject

411:氣體通道 411: Gas channel

412:取膜部 412: Take the membrane part

420:壓膜氣囊 420: Pressure-coated airbag

50:膜料周邊支持機構 50: Film material peripheral support mechanism

510:支持件 510: Support parts

511:主體 511: Subject

512:墊圈 512: Gasket

5121:上表面 5121: Upper surface

520:限位件 520: Limiting parts

521:止擋面 521: Stop surface

60:驅動件 60:Driver

H1:第一水平高度 H1: First level height

H2:第二水平高度 H2: Second level height

F:膜料 F: Film material

S:基板 S: Substrate

S1:表面 S1: Surface

Dp:壓膜方向 Dp: Film pressing direction

S1~S8:步驟 S1~S8: Steps

圖1為根據本發明一實施例之壓膜裝置的示意圖。 Figure 1 is a schematic diagram of a laminating device according to an embodiment of the present invention.

圖2為為圖1之壓膜機構的剖切示意圖。 Figure 2 is a schematic cross-sectional view of the film pressing mechanism of Figure 1.

圖3為根據本發明一實施例之壓膜方法的流程圖。 Figure 3 is a flow chart of a lamination method according to an embodiment of the present invention.

圖4至圖12為使用圖1之壓膜裝置執行圖3之壓膜方法的示意圖。 Figures 4 to 12 are schematic diagrams of using the lamination device of Figure 1 to perform the lamination method of Figure 3.

於以下實施方式中詳細敘述本發明之詳細特徵及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露的內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易理解本發明。以下實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。 The detailed features and advantages of the present invention are described in detail in the following implementation methods, and the content is sufficient for anyone familiar with the relevant technology to understand the technical content of the present invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the present invention. The following embodiments are to further illustrate the viewpoints of the present invention, but do not limit the scope of the present invention by any viewpoint.

請參照圖1,為根據本發明第一實施例之壓膜裝置的示意圖。在本實施例中,壓膜裝置1包含上腔體10、下腔體20、基板承載台30、壓膜機構40以及膜料周邊支持機構50。 Please refer to Figure 1, which is a schematic diagram of a laminating device according to the first embodiment of the present invention. In this embodiment, the laminating device 1 includes an upper cavity 10, a lower cavity 20, a substrate support table 30, a laminating mechanism 40, and a film material peripheral support mechanism 50.

上腔體10和下腔體20彼此對應設置。具體來說,上腔體10可藉由驅動源(例如馬達氣缸,未繪示)移動靠近下腔體20,從而上腔體10可與下腔體20組裝相接。在上腔體10與下腔 體20相接的情況下,可透過形成在上腔體10或下腔體20的氣體通道(未繪示)抽氣,而在上腔體10與下腔體20共同形成的腔室100內提供負壓的真空氣氛,進而使上腔體10與下腔體20氣密閉合。基板承載台30設置於下腔體20朝向上腔體10的一側。基板承載台30被配置成用以承載例如但不限於電路板或矽晶圓。 The upper chamber 10 and the lower chamber 20 are arranged corresponding to each other. Specifically, the upper chamber 10 can be moved close to the lower chamber 20 by a driving source (such as a motor cylinder, not shown), so that the upper chamber 10 can be assembled and connected with the lower chamber 20. When the upper chamber 10 and the lower chamber 20 are connected, the gas can be exhausted through the gas channel (not shown) formed in the upper chamber 10 or the lower chamber 20, and a negative pressure vacuum atmosphere can be provided in the chamber 100 formed by the upper chamber 10 and the lower chamber 20, thereby making the upper chamber 10 and the lower chamber 20 airtightly closed. The substrate carrier 30 is arranged on the side of the lower chamber 20 facing the upper chamber 10. The substrate carrier 30 is configured to carry, for example but not limited to, a circuit board or a silicon wafer.

壓膜機構40包含主體410以及壓膜氣囊420。主體410設置於上腔體10並且位於上腔體10朝向下腔體20的一側,並且主體410可藉由驅動源(例如馬達氣缸,未繪示)移動靠近下腔體20和基板承載台30。壓膜氣囊420設置於主體410並且可相對基板承載台30膨脹。主體410可具有氣體通道411,並且可透過所述氣體通道411供應氣體至主體410和壓膜氣囊420之間的空間中,進而令壓膜氣囊420膨脹。壓膜氣囊420的膨脹可推壓膜料,這將於後續進一步描述。壓膜機構40的主體410還具有位於壓膜氣囊420周圍的取膜部412。取膜部412可包含圍繞壓膜氣囊420的環狀通道,且可經由氣體通道411抽氣對環狀通道提供負壓吸附力。 The laminating mechanism 40 includes a main body 410 and a laminating airbag 420. The main body 410 is disposed in the upper chamber 10 and is located on a side of the upper chamber 10 facing the lower chamber 20, and the main body 410 can be moved close to the lower chamber 20 and the substrate support table 30 by a driving source (such as a motor cylinder, not shown). The laminating airbag 420 is disposed in the main body 410 and can expand relative to the substrate support table 30. The main body 410 can have a gas channel 411, and gas can be supplied to the space between the main body 410 and the laminating airbag 420 through the gas channel 411, thereby expanding the laminating airbag 420. The expansion of the laminating airbag 420 can push the laminating material, which will be further described later. The main body 410 of the laminating mechanism 40 also has a film removal portion 412 located around the laminating airbag 420. The film removal portion 412 may include an annular channel surrounding the laminating airbag 420, and may provide negative pressure adsorption force to the annular channel by evacuating air through the gas channel 411.

本實施例的壓膜機構40包含具有可撓性的壓膜氣囊420,但本發明並不以此為限。在其他實施例中,壓膜機構可不含有壓膜氣囊,取而代之為剛性的壓合平板設置於主體。 The laminating mechanism 40 of this embodiment includes a flexible laminating airbag 420, but the present invention is not limited thereto. In other embodiments, the laminating mechanism may not include a laminating airbag, but may be replaced by a rigid laminating plate disposed on the main body.

膜料周邊支持機構50包含支持件510以及限位件520。支持件510設置於基板承載台30周圍。支持件510可活動地設置於下腔體20。詳細來說,支持件510包含主體511以及設 置於主體511並且環繞基板承載台30的墊圈512。主體511可藉由驅動源相對下腔體20移動,例如圖1所示的壓膜裝置1進一步包含與支持件510的主體511相連接的驅動件60。驅動件60例如但不限於是馬達氣缸,其可驅動支持件510移動靠近限位件520和壓膜機構40。限位件520固定於下腔體20並且具有位於主體511和下腔體20之間的止擋面521。墊圈512連接於主體511並且朝向壓膜機構40之主體410的取膜部412。 The film material peripheral support mechanism 50 includes a support member 510 and a stopper 520. The support member 510 is disposed around the substrate support table 30. The support member 510 can be movably disposed in the lower chamber 20. In detail, the support member 510 includes a main body 511 and a gasket 512 disposed on the main body 511 and surrounding the substrate support table 30. The main body 511 can be moved relative to the lower chamber 20 by a driving source. For example, the film pressing device 1 shown in FIG. 1 further includes a drive member 60 connected to the main body 511 of the support member 510. The drive member 60 is, for example but not limited to, a motor cylinder, which can drive the support member 510 to move close to the stopper 520 and the film pressing mechanism 40. The stopper 520 is fixed to the lower cavity 20 and has a stop surface 521 located between the main body 511 and the lower cavity 20. The gasket 512 is connected to the main body 511 and faces the film removal portion 412 of the main body 410 of the film pressing mechanism 40.

支持件510具有與壓膜機構40相分離的閒置狀態以及受到壓膜機構40推壓的受壓狀態。請先參照圖4,於所述之閒置狀態下,支持件510抵靠於限位件520,至少部分支持件510較基板承載台30更靠近壓膜機構40,且支持件510與壓膜機構40之間的距離被限位件520限制。進一步來說,支持件510的主體511抵靠於限位件520的止擋面521。在垂直方向上,支持件510的墊圈512較基板承載台30更靠近壓膜機構40。由於支持件510的主體511的移動自由度被限位件520的止擋面521侷限,因此支持件510的墊圈512與壓膜機構40之間的垂直距離被限制。也就是說,在主體511抵靠於止擋面521的情況下,墊圈512無法更加靠近壓膜機構40。由於驅動件60持續驅動支持件510抵靠於限位件520,因此支持件510常態地處在閒置狀態而維持在高於基板承載台30之承載面310的第一水平高度H1。 The support member 510 has an idle state separated from the film pressing mechanism 40 and a pressed state pushed by the film pressing mechanism 40. Please refer to FIG. 4 . In the idle state, the support member 510 abuts against the limiter 520, at least part of the support member 510 is closer to the film pressing mechanism 40 than the substrate support platform 30, and the distance between the support member 510 and the film pressing mechanism 40 is limited by the limiter 520. In other words, the main body 511 of the support member 510 abuts against the stopper surface 521 of the limiter 520. In the vertical direction, the gasket 512 of the support member 510 is closer to the film pressing mechanism 40 than the substrate support platform 30. Since the freedom of movement of the main body 511 of the support member 510 is limited by the stop surface 521 of the limiter 520, the vertical distance between the gasket 512 of the support member 510 and the laminating mechanism 40 is limited. In other words, when the main body 511 abuts against the stop surface 521, the gasket 512 cannot get closer to the laminating mechanism 40. Since the driving member 60 continuously drives the support member 510 to abut against the stopper 520, the support member 510 is normally in an idle state and maintained at a first horizontal height H1 higher than the supporting surface 310 of the substrate supporting table 30.

進一步先參照圖7,於所述之受壓狀態下,支持件510與限位件520相分離,且支持件510藉由壓膜機構40的推壓而 相對基板承載台30移動。進一步來說,當壓膜機構40的主體410移動靠近基板承載台30時,取膜部412和壓膜氣囊420至少其中一者推抵支持件510的墊圈512,進而帶動支持件510的主體511與限位件520的止擋面521相分離,並且使主體410和支持件510沿著相同方向移動。 Referring to FIG. 7 , in the above-mentioned pressure-bearing state, the support member 510 is separated from the stop member 520, and the support member 510 is moved relative to the substrate support table 30 by the pressure of the film pressing mechanism 40. Specifically, when the main body 410 of the film pressing mechanism 40 moves close to the substrate support table 30, at least one of the film portion 412 and the film pressing airbag 420 pushes against the gasket 512 of the support member 510, thereby driving the main body 511 of the support member 510 to separate from the stop surface 521 of the stop member 520, and causing the main body 410 and the support member 510 to move in the same direction.

本發明的一實施例揭露一種壓膜方法,並且可以使用圖1的壓膜裝置1執行此壓膜方法。請參照圖3至圖12,其中圖3為根據本發明一實施例之壓膜方法的流程圖,且圖4至圖12為使用圖1之壓膜裝置執行圖3之壓膜方法的示意圖。本實施例揭露的壓膜方法包含依序執行的步驟S1至S8,其將膜料F(例如麥拉膜)壓合至基板S(例如矽晶圓)的表面上。在其他實施例中的膜料和基板可分別是樹脂膜和多層電路板。 An embodiment of the present invention discloses a lamination method, and the lamination method can be performed using the lamination device 1 of FIG. 1. Please refer to FIG. 3 to FIG. 12, wherein FIG. 3 is a flow chart of the lamination method according to an embodiment of the present invention, and FIG. 4 to FIG. 12 are schematic diagrams of using the lamination device of FIG. 1 to perform the lamination method of FIG. 3. The lamination method disclosed in this embodiment includes steps S1 to S8 performed in sequence, which press a film material F (such as Mylar film) onto the surface of a substrate S (such as a silicon wafer). In other embodiments, the film material and the substrate may be a resin film and a multi-layer circuit board, respectively.

於步驟S1,係以壓膜機構40拾取膜料F。如圖2和圖4所示,係以壓膜機構40的主體410之取膜部412拾取膜料F。經由主體410的氣體通道411抽氣對取膜部412的環狀通道提供負壓吸附力,使得環狀通道能吸附膜料F的周邊部分。 In step S1, the film material F is picked up by the film pressing mechanism 40. As shown in Figures 2 and 4, the film material F is picked up by the film taking part 412 of the main body 410 of the film pressing mechanism 40. The air is sucked through the gas channel 411 of the main body 410 to provide negative pressure adsorption force to the annular channel of the film taking part 412, so that the annular channel can adsorb the peripheral part of the film material F.

於步驟S2,係壓膜機構40移動靠近設置於基板承載台30上的基板S。如圖5所示,驅動壓膜機構40的主體410相對於上腔體10和基板承載台30沿著壓膜方向Dp移動靠近基板承載台30。此時,支持件510處在閒置狀態並位於第一水平高度H1,更具體而言係墊圈512位於第一水平高度H1。 In step S2, the laminating mechanism 40 moves close to the substrate S disposed on the substrate support table 30. As shown in FIG5 , the main body 410 driving the laminating mechanism 40 moves close to the substrate support table 30 along the laminating direction Dp relative to the upper cavity 10 and the substrate support table 30. At this time, the support member 510 is in an idle state and is located at the first horizontal height H1, more specifically, the gasket 512 is located at the first horizontal height H1.

於步驟S3,係以壓膜機構40和位於第一水平高度 H1的支持件510共同夾持膜料F的周邊。如圖5和圖6所示,膜料F的周邊之相對兩側分別貼附於支持件510的墊圈512及壓膜機構40的取膜部412,並且墊圈512和取膜部412共同夾持膜料F。此時,壓膜機構40尚未施力推壓或是僅微幅地推抵支持件510。 In step S3, the film pressing mechanism 40 and the support member 510 at the first horizontal height H1 jointly clamp the periphery of the film material F. As shown in Figures 5 and 6, the opposite sides of the periphery of the film material F are respectively attached to the gasket 512 of the support member 510 and the film removal part 412 of the film pressing mechanism 40, and the gasket 512 and the film removal part 412 jointly clamp the film material F. At this time, the film pressing mechanism 40 has not yet applied force to push or has only slightly pushed against the support member 510.

第一水平高度H1為執行壓膜作業之前就已經預先確定的數值,並且可依據基板S及/或膜料F的特性調整所述之第一水平高度H1。舉例來說,當基板S的厚度較厚時,可重新確定新的第一水平高度,並且新的第一水平高度可高於前述之第一水平高度H1。 The first level height H1 is a value that has been predetermined before the lamination operation is performed, and the first level height H1 can be adjusted according to the characteristics of the substrate S and/or the film material F. For example, when the thickness of the substrate S is thicker, a new first level height can be re-determined, and the new first level height can be higher than the aforementioned first level height H1.

於步驟S4,係形成真空氣氛。具體來說,透過形成在上腔體10或下腔體20的氣體通道(未另繪示)抽氣,而在上腔體10與下腔體20共同形成的腔室100內提供真空氣氛。壓膜機構40的一部分主體410和壓膜氣囊420、膜料F、基板承載台30、基板S、支持件510的一部分主體511和墊圈512皆容置於真空氣氛內。限位件520位於真空氣氛之外。此真空氣氛的氣壓可為10-5托(torr)至10-6托。真空氣氛有助於避免膜料F與基板S貼合後形成氣泡,但本發明並不以此為限。在其他實施例中可不需要將腔室100抽真空。由於壓膜機構40的取膜部412和支持件510的墊圈512共同夾持膜料F的周邊,墊圈512能承托膜料F的周邊,從而有助於防止膜料F在抽真空的過程中因為與取膜部412分離而意外地脫落。 In step S4, a vacuum atmosphere is formed. Specifically, the vacuum atmosphere is provided in the chamber 100 formed by the upper chamber 10 and the lower chamber 20 by evacuating air through a gas channel (not shown separately) formed in the upper chamber 10 or the lower chamber 20. A portion of the main body 410 of the laminating mechanism 40 and the laminating airbag 420, the film material F, the substrate carrier 30, the substrate S, a portion of the main body 511 of the support member 510, and the gasket 512 are all accommodated in the vacuum atmosphere. The limiter 520 is located outside the vacuum atmosphere. The air pressure of this vacuum atmosphere can be 10-5 torr to 10-6 torr. The vacuum atmosphere helps to avoid the formation of bubbles after the film material F and the substrate S are bonded, but the present invention is not limited thereto. In other embodiments, it is not necessary to evacuate the chamber 100. Since the film taking part 412 of the film pressing mechanism 40 and the gasket 512 of the supporting member 510 clamp the periphery of the film material F together, the gasket 512 can support the periphery of the film material F, thereby helping to prevent the film material F from accidentally falling off due to separation from the film taking part 412 during the vacuuming process.

於步驟S5,在壓膜機構40和支持件510共同夾持 膜料F的周邊後,持續移動壓膜機構40靠近基板S以推壓支持件510,且支持件510藉由壓膜機構40的推壓而與壓膜機構40一併移動。如圖5至圖7所示,支持件510的墊圈512和壓膜機構40的取膜部412共同夾持膜料F的周邊。接著,壓膜機構40的主體410沿著壓膜方向Dp持續移動靠近基板S,從而使得取膜部412推壓墊圈512。藉由取膜部412推壓墊圈512,處在閒置狀態的支持件510變成處在受壓狀態而與壓膜機構40一併沿著壓膜方向Dp移動。進一步來說,由於驅動件60的驅動力小於壓膜機構40的推壓力,因此支持件510會被壓膜機構40推動而沿著壓膜方向Dp移動,同時支持件510的主體511與限位件520的止擋面521相分離。 In step S5, after the film pressing mechanism 40 and the support member 510 jointly clamp the periphery of the film material F, the film pressing mechanism 40 is continuously moved close to the substrate S to push the support member 510, and the support member 510 moves together with the film pressing mechanism 40 due to the pushing of the film pressing mechanism 40. As shown in Figures 5 to 7, the gasket 512 of the support member 510 and the film taking part 412 of the film pressing mechanism 40 jointly clamp the periphery of the film material F. Then, the main body 410 of the film pressing mechanism 40 is continuously moved close to the substrate S along the film pressing direction Dp, so that the film taking part 412 pushes the gasket 512. By pushing the gasket 512 with the film removal part 412, the support member 510 in the idle state becomes in the pressurized state and moves along the film pressing direction Dp together with the film pressing mechanism 40. Furthermore, since the driving force of the driving member 60 is less than the pushing force of the film pressing mechanism 40, the support member 510 will be pushed by the film pressing mechanism 40 and move along the film pressing direction Dp, and at the same time, the main body 511 of the support member 510 is separated from the stop surface 521 of the limit member 520.

於步驟S6,係以壓膜機構40推動支持件510移動至低於第一水平高度H1的第二水平高度H2,並且將膜料F壓合至基板S的表面上。如圖7和圖8所示,因取膜部412推壓墊圈512而處在受壓狀態的支持件510自圖6的第一水平高度H1移動至圖8的第二水平高度H2,其中第二水平高度H2低於第一水平高度H1。更進一步來說,位於第二水平高度H2的墊圈512之上表面5121與基板S的表面S1位於同一水平面。壓膜機構40的壓膜氣囊420膨脹以將膜料F壓合至基板S的表面S1上。 In step S6, the film pressing mechanism 40 pushes the support member 510 to move to a second level H2 lower than the first level H1, and presses the film material F onto the surface of the substrate S. As shown in Figures 7 and 8, the support member 510, which is in a pressurized state due to the film taking part 412 pressing the gasket 512, moves from the first level H1 in Figure 6 to the second level H2 in Figure 8, wherein the second level H2 is lower than the first level H1. More specifically, the upper surface 5121 of the gasket 512 at the second level H2 is located at the same level as the surface S1 of the substrate S. The film pressing airbag 420 of the film pressing mechanism 40 expands to press the film material F onto the surface S1 of the substrate S.

於步驟S7,係移除壓膜機構40施加於支持件510的推壓,以使支持件510往第一水平高度H1移動。如圖9和圖10所示,壓膜機構40的主體410沿著壓膜方向Dp的反方向持續移 動遠離基板S,並且取膜部412解除用來吸附膜料F的吸附力而使得膜料F和壓膜機構40分離。膜料F的周邊承載於支持件510的墊圈512上。由於主體410移動遠離基板S,取膜部412施加於支持件510之墊圈512的推壓力被移除。由於取膜部412施加於支持件510之墊圈512的推壓力已經被移除,驅動件60能夠重新驅動支持件510復歸至圖6中的第一水平高度H1。 In step S7, the push applied by the film pressing mechanism 40 to the support member 510 is removed, so that the support member 510 moves to the first horizontal height H1. As shown in FIG9 and FIG10, the main body 410 of the film pressing mechanism 40 continues to move away from the substrate S in the opposite direction of the film pressing direction Dp, and the film taking part 412 releases the adsorption force used to adsorb the film material F, so that the film material F and the film pressing mechanism 40 are separated. The periphery of the film material F is supported on the gasket 512 of the support member 510. As the main body 410 moves away from the substrate S, the push applied by the film taking part 412 to the gasket 512 of the support member 510 is removed. Since the pushing force of the film removal part 412 on the gasket 512 of the support member 510 has been removed, the driving member 60 can drive the support member 510 back to the first horizontal height H1 in Figure 6.

於步驟S8,係藉由支持件510與限位件520抵靠,而使支持件510維持在第一水平高度H1。如圖11和圖12所示,支持件510的墊圈512復歸至第一水平高度H1,並且支持件510的主體511再次抵靠於限位件520的止擋面521,並且止擋面521使得支持件510無法再繼續被驅動件60驅動,進而支持件510的墊圈512可維持在第一水平高度H1。 In step S8, the support member 510 is maintained at the first level H1 by abutting against the limit member 520. As shown in Figures 11 and 12, the gasket 512 of the support member 510 returns to the first level H1, and the main body 511 of the support member 510 abuts against the stop surface 521 of the limit member 520 again, and the stop surface 521 prevents the support member 510 from being driven by the driving member 60, so that the gasket 512 of the support member 510 can be maintained at the first level H1.

綜上所述,根據本發明揭露之壓膜裝置及壓膜方法,壓膜裝置包含可被壓膜機構推壓的膜料周邊支持機構。在執行壓膜作業時,壓膜機構和支持件共同夾持膜料的周邊,使得支持件能承托膜料的周邊,進而有助於防止膜料在因為與壓膜機構分離而意外地脫落。尤其,當壓膜方法涉及真空作業環境的需求和/或壓膜裝置涉及以負壓吸附力或黏附力拾取膜料時,所述負壓吸附力或黏附力在抽真空中時可能會因為大氣壓力的移除而難以穩固抓取膜料。如此一來,膜料周邊支持機構更明顯有助於防止膜料在抽真空的過程中意外地脫落。 In summary, according to the laminating device and laminating method disclosed in the present invention, the laminating device includes a film material peripheral support mechanism that can be pushed by the laminating mechanism. When performing the laminating operation, the laminating mechanism and the support member jointly clamp the periphery of the film material, so that the support member can support the periphery of the film material, thereby helping to prevent the film material from accidentally falling off due to separation from the laminating mechanism. In particular, when the laminating method involves the requirement of a vacuum operating environment and/or the laminating device involves picking up the film material with a negative pressure adsorption force or adhesion force, the negative pressure adsorption force or adhesion force may be difficult to stably grasp the film material during vacuuming due to the removal of atmospheric pressure. In this way, the supporting mechanism around the membrane material can more obviously help prevent the membrane material from accidentally falling off during the vacuuming process.

本發明之實施例揭露雖如上所述,然並非用以限定 本發明,任何熟習相關技藝者,在不脫離本發明之精神和範圍內,舉凡依本發明申請範圍所述之形狀、構造、特徵及精神當可做些許之變更,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed as described above, they are not intended to limit the present invention. Anyone familiar with the relevant technology can make some changes to the shape, structure, features and spirit described in the scope of the application of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

1:壓膜裝置 1: Laminating device

10:上腔體 10: Upper cavity

20:下腔體 20: Lower cavity

100:腔室 100: Chamber

30:基板承載台 30: Substrate carrier

310:承載面 310: Loading surface

40:壓膜機構 40: Film pressing mechanism

410:主體 410: Subject

412:取膜部 412: Take the membrane part

420:壓膜氣囊 420: Pressure-coated airbag

50:膜料周邊支持機構 50: Film material peripheral support mechanism

510:支持件 510: Support parts

511:主體 511: Subject

512:墊圈 512: Gasket

520:限位件 520: Limiting parts

521:止擋面 521: Stop surface

60:驅動件 60:Driver

Claims (8)

一種壓膜裝置,包含:一基板承載台;一壓膜機構,可相對該基板承載台移動;以及一膜料周邊支持機構,包含一支持件以及一限位件,該支持件設置於該基板承載台周圍;其中,該支持件具有與該壓膜機構相分離的一閒置狀態以及受到該壓膜機構推壓的一受壓狀態,於該閒置狀態,該支持件抵靠於該限位件,至少部分該支持件較該基板承載台更靠近該壓膜機構,且該支持件與該壓膜機構之間的距離被該限位件限制,以及於該受壓狀態,該支持件與該限位件相分離,且該支持件藉由該壓膜機構的推壓而相對該基板承載台移動;其中該壓膜裝置更包含:一下腔體,其中該基板承載台位於該下腔體,該支持件可活動地設置於該下腔體,該限位件固定於該下腔體;以及一上腔體,對應該下腔體設置,該壓膜機構可移動地設置於該上腔體並且位於該上腔體朝向該下腔體的一側,且該上腔體可相對該下腔體移動以與該下腔體氣密閉合。 A laminating device comprises: a substrate supporting platform; a laminating mechanism which can move relative to the substrate supporting platform; and a film material peripheral supporting mechanism, comprising a supporting member and a limiting member, wherein the supporting member is arranged around the substrate supporting platform; wherein the supporting member has an idle state separated from the laminating mechanism and a pressed state pushed by the laminating mechanism, wherein in the idle state, the supporting member abuts against the limiting member, at least a part of the supporting member is closer to the laminating mechanism than the substrate supporting platform, and the distance between the supporting member and the laminating mechanism is limited by the limiting member , and in the pressurized state, the support member is separated from the limit member, and the support member moves relative to the substrate carrier by the pressing of the film pressing mechanism; wherein the film pressing device further comprises: a lower chamber, wherein the substrate carrier is located in the lower chamber, the support member can be movably arranged in the lower chamber, and the limit member is fixed to the lower chamber; and an upper chamber, which is arranged corresponding to the lower chamber, the film pressing mechanism can be movably arranged in the upper chamber and is located on one side of the upper chamber facing the lower chamber, and the upper chamber can move relative to the lower chamber to be airtightly closed with the lower chamber. 如請求項1所述之壓膜裝置,其中該上腔體與該下腔體氣密閉合而形成一真空氣氛,該基板承載台、該壓膜機 構及該膜料周邊支持機構的該支持件容置於該真空氣氛內,且該限位件位於該真空氣氛之外。 The laminating device as described in claim 1, wherein the upper cavity and the lower cavity are hermetically closed to form a vacuum atmosphere, the substrate carrier, the laminating mechanism and the supporting member of the film material peripheral supporting mechanism are contained in the vacuum atmosphere, and the limiting member is located outside the vacuum atmosphere. 如請求項1所述之壓膜裝置,更包含與該支持件連接的一驅動件,其中該驅動件驅動該支持件移動靠近該限位件和該壓膜機構。 The laminating device as described in claim 1 further comprises a driving member connected to the supporting member, wherein the driving member drives the supporting member to move closer to the limiting member and the laminating mechanism. 如請求項1所述之壓膜裝置,其中於該閒置狀態的該支持件維持在高於該基板承載台之一承載面的一第一水平高度,於該受壓狀態的該支持件自該第一水平高度移動至一第二水平高度,且該第二水平高度低於該第一水平高度。 The laminating device as described in claim 1, wherein the support member in the idle state is maintained at a first level higher than a supporting surface of the substrate supporting table, and the support member in the pressurized state moves from the first level to a second level, and the second level is lower than the first level. 如請求項1所述之壓膜裝置,其中該壓膜機構包含一壓膜氣囊以及位於該壓膜氣囊周圍的一取膜部,且該支持件朝向該取膜部。 The laminating device as described in claim 1, wherein the laminating mechanism includes a laminating airbag and a film removal portion located around the laminating airbag, and the support member faces the film removal portion. 一種壓膜方法,包含:以一壓膜機構拾取一膜料;以該壓膜機構移動靠近設置於一基板承載台上的一基板;以該壓膜機構和位於一第一水平高度的一支持件共同夾持該膜料周邊;以該壓膜機構推壓該支持件移動至低於該第一水平高度的一第二水平高度,並且將該膜料壓合至該基板的表面上;移除該壓膜機構施加於該支持件的推壓,以使該支持件往該第一水平高度移動;以及 藉由該支持件與一限位件抵靠,而使該支持件維持在該第一水平高度;其中,該壓膜方法更包含在一上腔體與一下腔體共同形成的一腔室內提供容置該基板、該壓膜機構及該支持件的一真空氣氛。 A lamination method includes: picking up a film material with a lamination mechanism; moving the lamination mechanism close to a substrate disposed on a substrate carrier; clamping the periphery of the film material with the lamination mechanism and a support member at a first level; pushing the support member with the lamination mechanism to move to a second level lower than the first level, and pressing the film material onto the surface of the substrate; removing the pushing force applied by the lamination mechanism to the support member to move the support member to the first level; and maintaining the support member at the first level by abutting the support member against a stop member; wherein the lamination method further includes providing a vacuum atmosphere for accommodating the substrate, the lamination mechanism and the support member in a chamber formed by an upper cavity and a lower cavity. 如請求項6所述之壓膜方法,其中在以該壓膜機構和該支持件共同夾持該膜料周邊之後形成該真空氣氛。 The lamination method as described in claim 6, wherein the vacuum atmosphere is formed after the periphery of the film material is clamped by the lamination mechanism and the support member. 如請求項6所述之壓膜方法,更包含:於該壓膜機構和該支持件共同夾持該膜料周邊後,持續移動該壓膜機構靠近該基板以推壓該支持件,且該支持件藉由該壓膜機構的推壓而與該壓膜機構一併移動。 The lamination method as described in claim 6 further comprises: after the lamination mechanism and the support member jointly clamp the periphery of the film material, the lamination mechanism is continuously moved close to the substrate to push the support member, and the support member moves together with the lamination mechanism due to the pushing of the lamination mechanism.
TW111142436A 2022-11-07 2022-11-07 Film lamination appratus and film lamination method TWI846138B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017001229A (en) * 2015-06-08 2017-01-05 ニッコー・マテリアルズ株式会社 Vacuum lamination method
TW202130489A (en) * 2020-02-07 2021-08-16 志聖工業股份有限公司 Film laminator and film lamination method
CN114953695A (en) * 2021-02-26 2022-08-30 志圣科技(广州)有限公司 Film pressing machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017001229A (en) * 2015-06-08 2017-01-05 ニッコー・マテリアルズ株式会社 Vacuum lamination method
TW202130489A (en) * 2020-02-07 2021-08-16 志聖工業股份有限公司 Film laminator and film lamination method
CN114953695A (en) * 2021-02-26 2022-08-30 志圣科技(广州)有限公司 Film pressing machine

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