WO2023274207A1

WO2023274207A1 - Chip molding method and chip molding device

Info

Publication number: WO2023274207A1
Application number: PCT/CN2022/101813
Authority: WO
Inventors: 黄达利; 丁鲲鹏; 黄冕
Original assignee: 深圳中科四合科技有限公司
Priority date: 2021-06-29
Filing date: 2022-06-28
Publication date: 2023-01-05
Also published as: CN113257722A; CN113257722B

Abstract

Provided are a chip molding device and method. A demolding motor (6) and a material receiving motor (10) are respectively arranged at the bottoms of a demolding seat table (9) and a material receiving support table (12); a straight part of a demolding conveyor belt (7) is supported on the demolding seat table; a straight part of a wafer receiving conveyor belt (11) is supported on the material receiving support table; during demolding, a wafer loading mold (5) is attached to the front surface of a cut wafer (1) to which a cutting mold (2) is attached; the cutting mold is attached to the demolding conveyor belt, the binding force of the wafer and the cutting mold is smaller than a binding force of the cutting mold and the demolding conveyor belt, and the demolding conveyor belt drives the cutting mold, the wafer, and the wafer loading mold to move; and at a turning position of the demolding conveyor belt, the demolding conveyor belt drives the cutting mold to turn, and the wafer is hard and thus is not bent, such that the wafer is separated from the cutting mold, the bottom surface of the wafer is gradually pressed on the wafer receiving conveyor belt after being separated from the cutting mold, and the wafer receiving conveyor belt takes away the wafer after the water is separated from the cutting mold. Streamlined production can be achieved, and the device is low in cost and high in efficiency.

Description

A chip flipping method and chip flipping equipment

technical field

The invention relates to the technical field of electronic packaging, in particular to a chip flipping method and chip flipping equipment.

Background technique

With the development of miniaturization and integration of electronic products, advanced packaging technology is also continuously developed, and the demand for flip chip technology is also increasing.

technical problem

Most of the flip-chip process is inseparable from the expensive chip-mounting equipment that is limited to the flip-chip function; in addition, during the flip-chip packaging process, the cost of flipping the chip is relatively high, which pushes up the cost of the chip-mounting process as a whole .

technical solution

The technical problem to be solved by the present invention is to provide a chip flipping device and a chip flipping method with low cost and high efficiency.

A chip pouring film method, comprising:

Step A. Paste the film on the front side of the wafer with the dicing film after dicing;

Step B. Attach the dicing film to the peeling conveyor belt, the bonding force between the wafer and the dicing film is less than the bonding force between the dicing film and the peeling conveyor belt, and the peeling conveyor belt drives the dicing film, the wafer and the loading film to move;

At the corner of the peeling conveyor belt, the peeling conveyor belt drives the dicing film to turn, and the wafer is hard, so there is no bending, so the wafer is separated from the dicing film, and the loading film adheres to the front of the wafer. round.

Preferably, it also includes:

Step C. The corner of the peeling conveyor belt is equipped with a crystal bonding conveyor belt. After the bottom surface of the wafer is separated from the dicing film, it is gradually pressed on the crystal bonding conveyor belt. The crystal bonding conveyor belt will take away the wafer after the dicing film is peeled off. .

Preferably, a gap X is provided between the film peeling conveyor belt and the die bonding conveyor belt, the gap X≤1/3 of the length of the chip after dicing the wafer, and the gap X>thickness of the dicing film.

Preferably, the crystal bonding conveyor belt and the peeling conveyor belt move in the same direction at the same or close to the line speed;

The crystal bonding conveyor belt and the peeling conveyor belt are flush in the horizontal direction; or, the peeling conveyor belt is 0.1mm~3mm higher than the crystal bonding conveyor belt in the horizontal direction, and the horizontal direction of the peeling conveyor belt is the same as that of the peeling conveyor belt. The included angle θ between the tail end and the inlet end of the crystal conveyor belt is less than 45°.

Preferably, the bottom of the stripping conveyor belt is provided with a stripping platform, and one side of the bottom of the stripping platform is provided with a stripping motor, and the stripping motor drives the stripping conveyor belt to rotate, and the straight part of the stripping conveyor belt is supported on Sit on the stripping table;

The bottom of the crystal receiving conveyor belt is provided with a material receiving support platform, and the bottom side of the material receiving support platform is provided with a material receiving motor, which drives the crystal receiving conveyor belt to rotate, and the straight part of the crystal receiving conveyor belt is supported on the material receiving support. on stage;

The film stripping motor and the material receiving motor are respectively arranged on the two ends far away from the film stripping seat and the material receiving support table.

Preferably, an adhesive film is also included, and the adhesive film firmly adheres the cutting film to the peeling film conveyor belt.

Preferably, it also includes a film peeling and laminating belt, a film peeling and laminating motor and a film peeling and laminating support table, the film peeling and laminating support table is arranged on the top of the film peeling table, and the film peeling and laminating motor drives the peeling and laminating belt Rotate, the film peeling and laminating motor is located on the upper part of the film peeling and laminating support table, and the straight part of the film peeling and laminating belt is supported on the bottom surface of the film peeling and laminating support table;

During the peeling process, the peeling film pressing tape is pressed on the upper part of the loading film;

Preferably, the surface of the film-peeling platform is provided with a first wedge-shaped strip, and the first wedge-shaped strip is arranged from low to high along the moving direction of the film-peeling conveyor belt;

During the moving process of the peeling conveyor belt, along the rising direction of the first wedge-shaped strip, the individual chips of the wafer are gradually pushed up. At the high end of the first wedge-shaped strip, the bottom of the individual chip undergoes gradual pressing The dynamic process of stepwise suspending on a wedge-shaped strip and being pressed onto the peeling conveyor belt can reduce the bonding force between the wafer and the dicing film.

Preferably, the surface of the peeling platform is also provided with air holes inside the first wedge-shaped strip, and pulse gas is arranged in the air holes, and an air hammer is formed by the pulse gas, and the air hammer hits the bottom of the cutting film to reduce the wafer and the cutting film. combination.

Preferably, it is characterized in that a second wedge-shaped strip is also provided on the surface of the film-peeling platform, and the second wedge-shaped strip is arranged from low to high along the moving direction of the film-peeling conveyor belt;

The low end of the second wedge-shaped strip is embedded in the inner side of the first wedge-shaped strip, and the height of the high-end of the second wedge-shaped strip is lower than the height of the high-end of the first wedge-shaped strip;

The bottom of individual chips undergoes a dynamic process of being gradually pressed on the first wedge-shaped strip, gradually suspended, pressed to the end of the second wedge-shaped strip, separated from the end of the second wedge-shaped strip, and pressed to the peeling conveyor belt. Gently achieve chip peeling.

A device for chip flipping, including a film peeling motor, a film stripping conveyor belt, a film stripping table, a material receiving motor, a crystal bonding conveyor belt, and a material receiving support table;

A stripping motor is installed on the bottom side of the film stripping table, and the film stripping motor drives the stripping conveyor belt to rotate, and the straight part of the film stripping conveyor belt is supported on the film stripping table;

A receiving support platform is set at the bottom of the crystal receiving conveyor belt, and a receiving motor is arranged on one side of the bottom of the receiving supporting platform, and the receiving motor drives the crystal receiving conveyor belt to rotate, and the straight part of the crystal receiving conveyor belt is supported on the receiving support platform ;

The film stripping motor and the material receiving motor are respectively arranged at the far ends of the film stripping seat and the material receiving support table;

When peeling the film: attach the film to the front of the cut wafer with the dicing film; attach the dicing film to the peeling conveyor belt, the bonding force between the wafer and the dicing film is less than that of the dicing film and the peeling conveyor belt The bonding force of the stripping conveyor belt drives the cutting film, wafer and loading film to move; at the corner of the stripping conveyor belt, the stripping conveyor belt drives the cutting film to turn, and the wafer does not bend because it is hard. Therefore, the wafer is separated from the dicing film, and the bottom surface of the wafer is separated from the dicing film, and then gradually pressed on the die-bonding conveyor belt, and the wafer-bonding conveyor belt takes away the wafer after the dicing film has been peeled off.

Therefore, in order to meet the demand trend of the flip-chip packaging process and be compatible with the existing traditional chip-mounting equipment to reduce processing costs, this invention provides a chip flip-film method. After the chip is cut, the chip pad is first inverted and transferred to the On the chip loading film, and then use the existing traditional chip loading equipment to carry out the chip loading process technology to complete the key steps of the so-called flip chip process.

Beneficial effect

The invention relates to a device and a method for film inversion of a chip. A film stripping motor and a material receiving motor are arranged at the bottom of the film stripping seat and the material receiving support table respectively, and the straight part of the film stripping conveyor belt is supported on the film stripping seat; The straight part of the crystal conveyor belt is supported on the receiving support table; when peeling the film: attach the film to the front of the cut wafer with the dicing film; attach the dicing film to the peeling conveyor belt, and the wafer The bonding force between the circle and the cutting film is smaller than the bonding force between the cutting film and the peeling conveyor belt, and the peeling conveyor belt drives the cutting film, wafer and loading film to move; at the corner of the peeling conveyor belt, the peeling conveyor belt drives the cutting film Turning, because the wafer is hard, so there is no bending, so the wafer is separated from the dicing film. After the bottom surface of the wafer is separated from the dicing film, it is gradually pressed on the die-bonding conveyor belt, and the die-bonding conveyor belt will peel off the dicing film. The final wafer is taken away; streamlined operation can be realized, with low equipment cost and high efficiency.

Description of drawings

FIG. 1 is a schematic structural view of a chip flipping method of the present invention after wafer cutting and before flipping.

Fig. 2 is a structural schematic diagram of a chip flipping method according to the present invention after the wafer is cut and the mounting film is pasted before the flipping.

FIG. 3 is a schematic structural view of a chip flipping method of the present invention after wafer cutting and flipping.

FIG. 4( a ) is a structural schematic diagram of Embodiment 1 of a film pouring equipment of a chip film pouring method according to the present invention.

FIG. 4( b ) is a schematic structural view of the initial flipping step of Embodiment 1 of a chip flipping method of the present invention.

FIG. 4( c ) is a structural schematic diagram during the flipping process of Embodiment 1 of a chip flipping method of the present invention.

Fig. 5 is a schematic structural view of Embodiment 2 of an inversion equipment of the present invention.

Fig. 6 is a partial enlarged structural schematic diagram at A of Embodiment 2 of an inversion equipment of the present invention.

Fig. 7 is a partial enlarged structural schematic diagram at B of Embodiment 2 of an inversion equipment of the present invention.

Fig. 8 is a partially enlarged structural schematic diagram at C of Embodiment 2 of an inversion device of the present invention.

FIG. 9( a ) is a schematic structural view of Embodiment 2 of a chip flipping device of a chip flipping method according to the present invention.

FIG. 9( b ) is a schematic structural view of the initial flipping step of Embodiment 2 of a chip flipping method of the present invention.

FIG. 9( c ) is a schematic structural view during the flipping process of Embodiment 2 of a chip flipping method of the present invention.

In the picture:

1-wafer; 2-cutting film; 3-cutting support ring; 4-loading ring; 5-loading film; 6-peeling film motor; 7-peeling film conveyor belt; -Motor for film peeling and pressing; 82-supporting platform for film peeling and pressing; 9-film peeling seat; 91-first wedge-shaped strip; 911-air hole; 92-second wedge-shaped strip; 10-receiving motor; Crystal conveyor belt; 12-receiving support platform; 13-adhesive film.

BEST MODE FOR CARRYING OUT THE INVENTION

A chip pouring film method, comprising:

Step A. Remove the cutting support ring 3 on the peripheral side of the dicing mold 2, attach the mounting film 5 to the front of the wafer 1 with the dicing film 2 after cutting, and the peripheral side of the mounting film 5 is provided with a supporting ring 4 (loading sheet support ring);

Step B. Attach the dicing film 2 to the peeling conveyor belt 7, the bonding force between the wafer 1 and the dicing film 2 is smaller than the bonding force between the dicing film 2 and the peeling conveyor belt 7, and the peeling conveyor belt 7 drives the dicing film 2 , wafer 1 and loading film 5 move;

The cutting die 2 can be bonded on the conveyer belt 7 by using an adhesive film 13, and the adhesive film 13 can be blue film, UV film, common adhesive or adhesive glue.

At the corner of the film-peeling conveyor belt 7, the end of the film-peeling seat 9 and the end of the film-peeling seat 9 are arranged in an arc shape, so that the film-peeling conveyor belt 7 can smoothly transition from a straight line moving state to a bending state, The peeling conveyor belt 7 drives the cutting film 2 to turn, and the wafer 1 is hard, so no bending occurs, so the chips of the wafer 1 are separated from the cutting film 2 one by one along the forward direction, and the loading film 5 is placed on the wafer 1. The front side of the wafer 1 is adhered to ensure that the chips of the wafer 1 will not be scattered.

Embodiments of the present invention

A chip flipping method and chip flipping equipment of the present invention will be further described below in conjunction with accompanying drawings 1 to 9.

Embodiment one

A chip pouring film method, comprising:

The above-mentioned operation process is realized through streamlined operation, and the efficiency is high; the requirements for the accuracy of the equipment are low, and the requirements for the performance of the equipment are also low, which reduces the cost of the equipment as a whole and has strong economic value.

In this embodiment, also include:

Step C. The corner of the peeling conveyor belt 7 is provided with a crystal bonding conveyor belt 11. After the bottom surface of the wafer 1 is separated from the dicing film 2, it is gradually pressed on the crystal bonding conveyor belt 11. The crystal bonding conveyor belt 11 will peel off the dicing film. 2 after wafer 1 is taken away.

In this embodiment, a gap X is provided between the peeling conveyor belt 7 and the crystal bonding conveyor belt 11, the gap X≤1/3 of the length of the chip after cutting the wafer 1, and the gap X>the thickness of the dicing film 2 .

In this embodiment, the crystal bonding conveyor belt 11 and the peeling conveyor belt 7 move in the same direction at the same or close linear speed;

The crystal-connecting conveyor belt 11 and the stripping film conveyor belt 7 are flush in the horizontal direction; or, the stripping film conveyor belt 7 is 0.1 mm to 3 mm higher than the crystal-bonding conveyor belt 11 in the horizontal direction, and the horizontal direction of the stripping film conveyor belt 7 is the same as The included angle θ between the tail end of the peeling conveyor belt 7 and the inlet end of the crystal bonding conveyor belt 11 is less than 45°.

In the present embodiment, the bottom of the stripping conveyor belt 7 is provided with a stripping platform 9, and one side of the bottom of the stripping platform 9 is provided with a stripping motor 6, and the stripping motor 6 drives the stripping conveyor belt 7 to rotate. The straight part of the conveyor belt 7 is supported on the film stripping platform 9;

The bottom of the receiving crystal conveyor belt 11 is provided with a material receiving support platform 12, and one side of the bottom of the receiving material supporting platform 12 is provided with a material receiving motor 10, and the material receiving motor 10 drives the receiving crystal conveyor belt 11 to rotate, and the flat surface of the crystal receiving conveyor belt 11 The straight part is supported on the material receiving support platform 12;

The film peeling motor 6 and the material receiving motor 10 are arranged on the two ends away from the film peeling seat 9 and the material receiving support table 12 respectively.

In this embodiment, an adhesive film 13 is also included, and the adhesive film 13 firmly adheres the cutting film 2 to the film peeling conveyor belt 7 .

In the present invention, the die-loading film 5 is defined as the adhesive film attached to the chip front pad after the cutting of the wafer 1. The adhesive film can be a blue film or a general adhesive film in other industries; In a chip with a surface pad, any side can be defined as the front side, and the opposite side can be defined as the back side.

During the operation, the cutting ring 3 is removed at first, and then the cutting film 2 is fixed and attached to the peeling conveyor belt 7 to ensure that the cutting film 2 moves with the peeling conveyor belt 7.

Finally, by starting the two motors (6 and 10), the motor 6 and the motor 10 rotate clockwise to peel off the dicing film 2 from the back of the chip of the wafer 1, and peel off the chip of the wafer 1 and the mounting film 5 Send to the surface of the release film 11 row by row with the loading ring 4, and complete the film pouring process.

It can effectively and regularly attach the chip pad to the mounting film from the cut film, so that the traditional chip loading machine can be used for the flip chip process.

This flip-film method is compatible with most chip-mounting equipment and can complete advanced chip flip-chip packaging processes, thereby reducing overall process costs and maintaining chip production efficiency.

The same model can be used for the loading film and the cutting film, which reduces the selectivity of special film materials.

Increased the yield and stability of the inverted film.

Embodiment two

In this embodiment, the surface of the stripping seat 9 is provided with a first wedge-shaped strip 91, and the first wedge-shaped strip 91 is arranged from low to high along the moving direction of the stripping film conveyor belt 7;

During the movement of the peeling conveyor belt 7, along the rising direction of the first wedge-shaped strip 91, the individual chips of the wafer 1 are gradually pushed up. The dynamic process of pressing on the first wedge-shaped strip 91 , gradually hanging in the air, and pressing on the peeling conveyor belt 7 can reduce the bonding force between the wafer 1 and the dicing film 2 .

In this embodiment, the surface of the film stripping table 9 is also provided with a first wedge-shaped strip 91, and an air hole 911 is arranged inside the air hole 911. Pulse gas is arranged in the air hole 911, and the air hammer is formed by the pulse gas, and the air hammer hits the bottom of the cutting film 2 , to reduce the bonding force between the wafer 1 and the dicing film 2 .

In this embodiment, it is characterized in that a second wedge-shaped strip 92 is arranged on the surface of the film-peeling seat 9, and the second wedge-shaped strip 92 is arranged from low to high along the moving direction of the film-peeling conveyor belt 7;

The low end of the second wedge-shaped strip 92 is embedded in the inner side of the first wedge-shaped strip 91, and the height of the high end of the second wedge-shaped strip 92 is lower than the height of the high end of the first wedge-shaped strip 91;

The bottom of the individual chips is pressed and covered on the first wedge-shaped strip 91 step by step, suspended gradually, pressed to the end of the second wedge-shaped strip 92, leaving the end of the second wedge-shaped strip 92, pressed and covered to the peeling film conveyor belt 7 The dynamic process can realize the stripping of the chip smoothly.

The number of the first wedge-shaped strips 91 can be multiple, and the multiple first wedge-shaped strips 91 are distributed in an array on the peeling platform 9 .

The number of the second wedge-shaped strips 92 can be multiple, and the multiple first wedge-shaped strips 91 are distributed in an array on the film peeling platform 9 .

Embodiment Three

In addition to the settings in the first embodiment, some settings are added in this embodiment. In this embodiment, the loading ring 4 is removed.

In this embodiment, it also includes a film peeling and laminating belt 8, a film peeling and laminating motor 81, and a film peeling and laminating support table 82. The motor 81 drives the film peeling and laminating belt 8 to rotate, the film peeling and laminating motor 81 is located on the top of the film peeling and laminating support table 82, and the straight part of the film peeling and laminating belt 8 is supported on the bottom surface of the film peeling and laminating support table 82 ;

During the peeling process, the peeling film pressing tape 8 is pressed on the top of the loading film 5;

The invention also provides a chip flipping device.

A chip flipping device, comprising a film peeling motor 6, a film stripping conveyor belt 7, a film stripping seat 9, a material receiving motor 10, a crystal receiving conveyor belt 11 and a material receiving support table 12;

The film stripping motor 6 is arranged on one side of the bottom of the film stripping platform 9, and the film stripping motor 6 drives the film stripping conveyor belt 7 to rotate, and the straight part of the film stripping conveyor belt 7 is supported on the film stripping platform 9;

The bottom of the receiving crystal conveyor belt 11 is provided with a material receiving support platform 12, and the bottom side of the receiving material supporting platform 12 is provided with a material receiving motor 10, and the receiving motor 10 drives the crystal receiving conveyor belt 11 to rotate, and the straight part of the crystal receiving conveyor belt 11 Supported on the receiving support platform 12;

The film stripping motor 6 and the material receiving motor 10 are respectively arranged on the two ends away from the film stripping seat 9 and the material receiving support platform 12;

When peeling off the film: the front side of the wafer 1 with the cutting film 2 after cutting is pasted with the sheet film 5; The bonding force between the cutting film 2 and the peeling conveyor belt 7, the peeling conveyor belt 7 drives the cutting film 2, the wafer 1 and the loading film 5 to move; at the corner of the peeling conveyor belt 7, the peeling conveyor belt 7 drives the cutting film 2 Turning, because the wafer 1 is hard, so there is no bending, so the wafer is separated from the dicing film 2, and the bottom surface of the wafer 1 is separated from the dicing film 2. The conveyor belt 11 takes away the wafer 1 after the dicing film 2 has been peeled off.

The present invention is not limited to the above-mentioned embodiments. The technical solutions of the above-mentioned embodiments of the present invention can be cross-combined with each other to form new technical solutions. In addition, all technical solutions formed by equivalent replacements fall within the scope of protection required by the present invention. .

Industrial Applicability

The invention relates to a chip inversion equipment and method, in which the crystal bonding conveyor belt takes away the wafer after the dicing film is peeled off, realizes chip inversion, can realize streamlined operation, has low equipment cost, high efficiency, and meets the requirements of industrial practicability .

Sequence Listing Free Content

Type the sequence listing free content description paragraph here.

Claims

A chip flip-film method, characterized in that, comprising:

Step A. Paste the mounting film (5) on the front side of the diced wafer (1) with the dicing film (2);

Step B. Attach the dicing film (2) on the peeling conveyor belt (7), the bonding force between the wafer (1) and the dicing film (2) is smaller than that of the dicing film (2) and the The bonding force of the stripping conveyor belt (7), the stripping conveyor belt (7) drives the cutting film (2), wafer (1) and loading film (5) to move;

At the corner of the peeling conveyor belt (7), the peeling conveyor belt (7) drives the cutting film (2) to turn, and the wafer (1) does not bend because it is hard , so the wafer is separated from the dicing film (2), and the wafer loading film (5) adheres to the wafer (1) on the front side of the wafer (1).
The chip flip-film method according to claim 1, further comprising:

Step C. The corner of the film peeling conveyor belt (7) is provided with a crystal bonding conveyor belt (11), and the bottom surface of the wafer (1) is separated from the cutting film (2) and gradually pressed on the on the crystal bonding conveyor belt (11), and the crystal bonding conveyor belt (11) takes away the wafer (1) after peeling off the dicing film (2).
The chip flipping method according to claim 2, characterized in that there is a gap X between the peeling conveyor belt (7) and the die bonding conveyor belt (11), and the gap X≤the crystal 1/3 of the length of the cut chip of the circle (1), the gap X>thickness of the cut film (2).
The chip flipping method according to claim 2, characterized in that, the die bonding conveyor belt (11) and the stripping conveyor belt (7) move in the same direction at the same or close to the line speed;

The crystal bonding conveyor belt (11) is flush with the film peeling conveyor belt (7) in the horizontal direction; or, the film peeling conveyor belt (7) is lower than the crystal bonding conveyor belt (11) in the horizontal direction ) height of 0.1mm~3mm, the angle θ between the horizontal direction of the stripping conveyor belt (7) and the line connecting the tail end of the stripping conveyor belt (7) and the entrance end of the crystal bonding conveyor belt (11) is less than 45°.
The chip pouring method according to claim 2, characterized in that, the bottom of the stripping conveyor belt (7) is provided with a stripping seat (9), and the bottom side of the stripping seat (9) is set There is a peeling motor (6), and the peeling motor (6) drives the peeling conveyor belt (7) to rotate, and the straight part of the peeling conveyor belt (7) is supported on the peeling seat ( 9) on;

The bottom of the crystal receiving conveyor belt (11) is provided with a material receiving support platform (12), and the bottom side of the material receiving support platform (12) is provided with a material receiving motor (10), and the material receiving motor (10) ) driving the crystal receiving conveyor belt (11) to rotate, and the straight part of the crystal receiving conveyor belt (11) is supported on the receiving support platform (12);

The film stripping motor (6) and the material receiving motor (10) are respectively arranged at the far ends of the film peeling seat (9) and the material receiving support table (12).
The chip flipping method according to claim 5, characterized in that it also includes a peeling and laminating belt (8), a peeling and laminating motor (81) and a peeling and laminating support table (04), the peeling and laminating The covering support table (04) is set on the upper part of the film peeling seat (9), the film peeling and laminating motor (81) drives the peeling and laminating belt (8) to rotate, and the film peeling and laminating motor (81) is located on the upper part of the film peeling and lamination support table (04), and the straight part of the film peeling lamination belt (8) is supported on the bottom surface of the film peeling and lamination support table (04);

During the peeling process, the peeling film pressing tape (8) is pressed on the upper part of the film loading film (5);

Step C. The corner of the film peeling conveyor belt (7) is provided with a crystal bonding conveyor belt (11), and the bottom surface of the wafer (1) is separated from the cutting film (2) and gradually pressed on the on the crystal bonding conveyor belt (11), and the crystal bonding conveyor belt (11) takes away the wafer (1) after peeling off the dicing film (2).
The chip flipping method according to claim 2, characterized in that a first wedge-shaped strip (91) is provided on the surface of the stripping platform (9), and the first wedge-shaped strip (91) is arranged along the The moving direction of the conveyor belt (7) is set from low to high;

During the movement of the peeling conveyor belt (7), individual chips of the wafer (1) are gradually pushed up along the rising direction of the first wedge-shaped strip (91). (91), the bottom of the individual chip undergoes a dynamic process of gradually being pressed on the first wedge-shaped strip (91), gradually suspended, and pressed onto the peeling conveyor belt (7), which can reduce the The binding force between the wafer (1) and the dicing film (2).
The chip flipping method according to claim 2, characterized in that, the surface of the peeling seat (9) is also provided with air holes (911) inside the first wedge-shaped bar (91), and the air holes (911 ) is provided with a pulsed gas, the pulsed gas forms an air hammer, and the air hammer hits the bottom of the cutting film (2) to reduce the bonding force between the wafer (1) and the cutting film (2).
The chip flipping method according to claim 2, characterized in that, the surface of the peeling seat (9) is provided with a first wedge-shaped strip (91), and the surface of the peeling seat (9) is also provided with The second wedge-shaped strip (92), the second wedge-shaped strip (92) is arranged from low to high along the moving direction of the peeling conveyor belt (7);

The low end of the second wedge-shaped strip (92) is embedded in the inner side of the first wedge-shaped strip (91), and the height of the high end of the second wedge-shaped strip (92) is lower than that of the first wedge-shaped strip (91) high end height

The bottoms of the individual chips are gradually pressed on the first wedge-shaped strip (91), gradually suspended, pressed to the end of the second wedge-shaped strip (92), separated from the end of the second wedge-shaped strip (92), pressed Covering the dynamic process of the peeling conveyor belt (7), the peeling of the chip can be realized smoothly.
A chip flipping device, characterized in that it includes a film peeling motor (6), a film peeling conveyor belt (7), a film peeling table (9), a material receiving motor (10), a crystal bonding conveyor belt (11) and receiving support table (12);

The film stripping motor (6) is arranged on the bottom side of the film stripping platform (9), and the film stripping motor (6) drives the film stripping conveyor belt (7) to rotate, and the film stripping conveyor belt ( 7) The straight part is supported on the stripping seat (9);

The receiving support platform (12) is provided at the bottom of the crystal receiving conveyor belt (11), and the receiving motor (10) is provided on the bottom side of the receiving supporting platform (12), and the receiving motor (10) driving the crystal receiving conveyor belt (11) to rotate, and the straight part of the crystal receiving conveyor belt (11) is supported on the receiving support platform (12);

The film peeling motor (6) and the material receiving motor (10) are respectively arranged at the far ends of the film peeling seat (9) and the material receiving support table (12);

When peeling the film: attach the film (5) to the front of the cut wafer (1) with the cutting film (2); attach the cutting film (2) to the peeling conveyor belt (7) , the bonding force between the wafer (1) and the dicing film (2) is smaller than the bonding force between the dicing film (2) and the peeling conveyor belt (7), and the peeling conveyor belt (7) drives the The cutting film (2), wafer (1) and loading film (5) move; at the corner of the stripping conveyor belt (7), the stripping conveyor belt (7) drives the cutting film (2 ) turns, the wafer (1) does not bend because it is hard, so the wafer is separated from the cutting film (2), and the bottom surface of the wafer (1) is separated from the cutting film (2) Gradually press and cover the wafer on the wafer conveyor belt (11) after separation, and the wafer conveyor belt (11) takes away the wafer (1) after peeling off the dicing film (2).