TWI770170B - Forming method of carrier tape - Google Patents
Forming method of carrier tape Download PDFInfo
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- TWI770170B TWI770170B TW107115187A TW107115187A TWI770170B TW I770170 B TWI770170 B TW I770170B TW 107115187 A TW107115187 A TW 107115187A TW 107115187 A TW107115187 A TW 107115187A TW I770170 B TWI770170 B TW I770170B
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- carrier tape
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- hot air
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/10—Forming by pressure difference, e.g. vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/42—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B47/00—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved
- B65B47/02—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved with means for heating the material prior to forming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B47/00—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved
- B65B47/08—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved by application of fluid pressure
- B65B47/10—Apparatus or devices for forming pockets or receptacles in or from sheets, blanks, or webs, comprising essentially a die into which the material is pressed or a folding die through which the material is moved by application of fluid pressure by vacuum
Abstract
本發明係一種承載帶(10)之成形方法,該承載帶(10)具有1行以上之進給孔及收納零件之收納凹部(3),且該承載帶(10)之成形方法包括:搬送步驟,其係將片材(10A)搬送至滾筒式模具(120);及成形步驟,其係將被搬送至滾筒式模具(120)之表面之片材(10A)吸引而使之真空成形;於成形步驟中,一面自熱風加熱機構(160)吹出熱風而加熱片材(10A),一面使其真空成形,並且將片材(10A)所受到的熱風之量設為0.125mL/mm2以上且3.75mL/mm2以下。藉由本發明,可提供確保了收納凹部之開口緣之矩形性之承載帶之成形方法。 The present invention relates to a forming method of a carrier tape (10), the carrier tape (10) has more than one row of feed holes and a receiving recess (3) for accommodating parts, and the forming method of the carrier tape (10) comprises: conveying a step of conveying the sheet (10A) to a drum-type mold (120); and a forming step of vacuum-forming the sheet (10A) conveyed to the surface of the drum-type mold (120) by suction; In the forming step, while blowing hot air from the hot air heating mechanism (160) to heat the sheet (10A), vacuum forming is performed, and the amount of hot air received by the sheet (10A) is set to 0.125mL/ mm2 or more And 3.75mL/ mm2 or less. According to the present invention, it is possible to provide a method of forming a carrier tape that ensures the rectangularity of the opening edge of the housing recess.
Description
本發明係關於一種具有收納零件之收納凹部之承載帶之成形方法。 The present invention relates to a method for forming a carrier tape having a accommodating recess for accommodating parts.
先前,具有收納零件之收納凹部之承載帶例如係藉由以下方法而成形,即,利用加熱滾筒使作為母材帶之片材加熱軟化後,連續地供給至滾筒式模具而使收納凹部真空成形(參照專利文獻1)。 Conventionally, carrier tapes having housing recesses for housing components are formed by, for example, a method in which a sheet as a base material tape is heated and softened by a heating roller, and then continuously supplied to a roller die to vacuum-form the housing recesses (refer to Patent Document 1).
又,亦已知有一種承載帶之成形方法,其係利用加熱滾筒直接加熱片材後,於滾筒式模具上向成形中之收納凹部壓力噴射450℃以上且550℃以下之熱風,而使收納凹部真空成形(參照專利文獻2)。 In addition, there is also known a method for forming a carrier tape, in which a heating roller is used to directly heat a sheet, and then hot air of 450° C. or higher and 550° C. or lower is pressurized on a roller-type mold to a housing recessed portion being formed, so that the housing is formed. The concave portion is vacuum formed (refer to Patent Document 2).
[專利文獻1]日本專利特開平10-272684號公報 [Patent Document 1] Japanese Patent Laid-Open No. 10-272684
[專利文獻2]日本專利特開平11-207811號公報 [Patent Document 2] Japanese Patent Laid-Open No. 11-207811
然而,如文獻2中所示,即便調整熱風之加熱溫度,收納凹部之開口緣亦會成為帶較大弧度之形狀(參照圖6),無法獲得矩形性,從而無法使收納凹部之成形精度穩定。
However, as shown in
因此,本發明係鑒於以上之問題而完成者,其目的在於提供一種確保了收納凹部之開口緣之矩形性之承載帶之成形方法。 Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a method for forming a carrier tape that ensures the rectangularity of the opening edge of the housing recess.
(1)本發明之一態樣係一種承載帶之成形方法,該承載帶具有1行以上之收納零件之收納凹部,且該承載帶之成形方法包括:搬送步驟,其係將片材搬送至滾筒式模具;及成形步驟,其係將被搬送至上述滾筒式模具之表面之上述片材吸引而使之真空成形;於上述成形步驟中,一面自熱風加熱機構吹出熱風而加熱上述片材,一面使其真空成形,並且將上述片材所受到的上述熱風之量設為0.125mL/mm2以上且3.75mL/mm2以下。 (1) An aspect of the present invention is a method for forming a carrier tape, the carrier tape having one or more rows of storage recesses for accommodating parts, and the method for forming the carrier tape includes a conveying step of conveying a sheet to a A roller type mold; and a forming step of sucking the above-mentioned sheet conveyed to the surface of the above-mentioned roller type mold to vacuum-form it; in the above-mentioned forming step, while blowing hot air from a hot air heating mechanism to heat the above-mentioned sheet material, While being vacuum-formed, the amount of the hot air to which the sheet is subjected is set to 0.125 mL/mm 2 or more and 3.75 mL/mm 2 or less.
(2)於上述(1)之承載帶之成形方法中,可將上述熱風之吹出溫度設為300℃以上且700℃以下。 (2) In the molding method of the carrier tape of the above (1), the blowing temperature of the hot air may be set to 300°C or higher and 700°C or lower.
(3)於上述(1)或(2)之承載帶之成形方法中,可將上述熱風之吹出流量設為每一行寬8mm,10L/min以上且60L/min以下。 (3) In the forming method of the carrier tape according to the above (1) or (2), the blowing flow rate of the hot air can be set to be 8 mm in width per row, 10 L/min or more and 60 L/min or less.
(4)於上述(1)至(3)中任一項之承載帶之成形方法中,可將上述片材之搬送速度設為2m/min以上且10m/min以下。 (4) In the forming method of the carrier tape according to any one of the above (1) to (3), the conveying speed of the sheet may be set to 2 m/min or more and 10 m/min or less.
(5)於上述(1)至(4)中任一項之承載帶之成形方法中,可將上述滾筒式模具維持為20℃以上且100℃以下之溫度。 (5) In the forming method of the carrier tape according to any one of the above (1) to (4), the above-mentioned roller die can be maintained at a temperature of 20°C or higher and 100°C or lower.
根據本發明,可提供一種確保了收納凹部之開口緣之矩形性之承載帶之成形方法。 According to the present invention, it is possible to provide a method of forming a carrier tape that ensures the rectangularity of the opening edge of the housing recess.
1:承載帶 1: carrier tape
1A:承載帶 1A: carrier tape
2:進給孔 2: Feed hole
3:收納凹部 3: Storage recess
3A:收納凹部 3A: Storage recess
4:底孔 4: Bottom hole
10:承載帶 10: Carrier belt
10A:片材 10A: Sheet
100:成形裝置 100: Forming device
110:預加熱輥 110: Preheating roller
120:滾筒式模具 120: Roller mold
130:蓄積部 130: Accumulation Department
140:壓模 140: Stamping
150:搬送機構 150: Conveying Mechanism
160:熱風加熱機構 160: Hot air heating mechanism
310:開口緣 310: Open edge
310A:開口緣 310A: Open edge
MD:搬送方向(長度方向) MD: conveying direction (longitudinal direction)
P:零件 P: Parts
S1:搬送步驟 S1: Conveying step
S2:成形步驟 S2: Forming step
圖1係承載帶之立體圖。 FIG. 1 is a perspective view of the carrier tape.
圖2係表示複數行承載帶之俯視圖。 Figure 2 is a top view showing a plurality of rows of carrier tapes.
圖3係表示用於本發明之實施形態之承載帶之成形方法的承載帶之成形裝置之概略圖。 Fig. 3 is a schematic view showing a carrier tape forming apparatus used in the carrier tape forming method according to the embodiment of the present invention.
圖4係表示本發明之實施形態之承載帶之成形方法之流程圖。 Fig. 4 is a flow chart showing a method for forming a carrier tape according to an embodiment of the present invention.
圖5係利用本發明之實施形態之承載帶之成形方法所形成之承載帶之圖,(a)係俯視圖,(b)係A-A剖視圖,(c)係B-B剖視圖。 5 is a view of a carrier tape formed by the method of forming the carrier tape according to the embodiment of the present invention, (a) is a plan view, (b) is a cross-sectional view A-A, and (c) is a cross-sectional view B-B.
圖6係成形性較差之承載帶之圖,(a)係俯視圖,(b)係C-C剖視圖,(c)係D-D剖視圖。 6 is a view of a carrier tape with poor formability, (a) is a plan view, (b) is a C-C cross-sectional view, and (c) is a D-D cross-sectional view.
以下,參照圖式對本發明之實施形態進行詳細說明。再者,於本說明書之實施形態中,貫穿全文地對相同構件標附相同符號。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in the embodiment of this specification, the same code|symbol is attached|subjected to the same member throughout the whole.
首先,在說明本發明之實施形態之承載帶1之成形方法之前,對承載帶1進行說明。圖1係承載帶1之立體圖,圖2係表示複數行承載帶10之俯視圖。
First, before explaining the forming method of the
圖1所示之承載帶1係收納複數個零件P,進行保管,或進行搬送,或
將零件P順利地供給至在基板安裝零件P之安裝機者。作為零件P,可列舉例如電子零件或精密零件等。
The
於該承載帶1,沿著帶之搬送方向MD(長度方向),分別以特定之間隔形成有複數個進給孔2及收納零件P之收納凹部3。再者,於本實施形態中,進給孔2在俯視下呈圓形狀,但進給孔2之尺寸、形狀及間隔宜對照安裝機等進給機構而貫穿設置。又,進給孔2亦存在沿著帶之長度方向MD之兩邊而貫穿設置於收納凹部3之兩側的情況。
In the
收納凹部3係對照所要收納之零件P之尺寸及形狀而形成,於本實施形態中,在俯視下形成為大致矩形狀。再者,收納凹部3亦存在於底面形成用於檢查用等之底孔4、或進而於底面形成台座之情況。再者,收納凹部3之尺寸通常為0.1mm見方至16mm見方之範圍內,承載帶1之帶寬為4mm至24mm之範圍內。
The accommodating
並且,該承載帶1以熱塑性樹脂為材料而形成。作為熱塑性樹脂,例如可列舉:聚碳酸酯、聚苯乙烯、聚氯乙烯、非晶形聚對苯二甲酸乙二酯、聚丙烯等合成樹脂;將碳混練於該等樹脂中而賦予導電性而成者;於表面實施導電塗覆而成者等。
In addition, the
然,該承載帶1係利用下述承載帶10之成形裝置100而形成,成形時,形成為例如4行、8行等複數行承載帶10,其後,藉由開縫刀等切斷機構而切斷、分離成每1行承載帶1,從而製造而成。再者,亦存在於複數
行承載帶10之行間或兩端部設有形成進給孔2等時所使用之定位用凹部的情況。
However, the
繼而,對承載帶10之成形裝置100及成形方法進行說明。圖3係表示用於本發明之實施形態之承載帶10之成形方法的承載帶10之成形裝置100之概略圖,圖4係表示本發明之實施形態之承載帶10之成形方法之流程圖。
Next, the forming
圖3所示之承載帶10之成形裝置100至少具備:預加熱輥110、滾筒式模具120、蓄積部130、壓模140、搬送機構150、及熱風加熱機構160。
The forming
預加熱輥110係一面藉由旋轉將自未圖示之供給機構供給之片材10A搬送至設置於搬送方向MD下游之滾筒式模具120,一面使該片材10A加熱軟化,且該預加熱輥110以能夠於100℃左右之溫度下加熱片材10A之方式構成。藉由利用預加熱輥110預加熱片材10A,可在某種程度上矯正片材10A之捲繞習性及波狀起伏。
The preheating
滾筒式模具120於外周具有複數個與所要成形之收納凹部3之尺寸、形狀及間隔相對應之模穴(未圖示),一面藉由旋轉將搬送來之片材10A進行搬送,一面於片材10A真空形成收納凹部3。再者,各模穴連接於真空產生機等。又,滾筒式模具120例如藉由水等冷熱調節介質而於大致20℃至100℃之範圍內維持為固定之溫度。
The roller die 120 has a plurality of cavities (not shown) on the outer periphery corresponding to the size, shape and interval of the storage recesses 3 to be formed. The
蓄積部130係使形成有收納凹部3之片材10A滯留而將其一次冷卻,去除真空成形時之熱應力。
The accumulating
壓模140係於片材10A沖壓出進給孔2,視需要於收納凹部3之底面亦沖壓出底孔4。
The die 140 punches out the
搬送機構150將片材10A自蓄積部130間歇地搬送至壓模140。
The
熱風加熱機構160係用於對片材10A吹出熱風並吹至其上者,且具有複數個未圖示之熱風吹出口。該熱風加熱機構160係以熱風吹出口與片材10A相隔大致1mm至10mm左右之方式設置。
The hot
熱風吹出口係沿片材10A之寬度方向,以與形成各行收納凹部3之位置對應之方式設置,其開口形狀可為矩形狀,亦可為圓形狀或橢圓形狀,且以特定之吹出流量向形成各行收納凹部3之位置均勻地吹出熱風。通常,片材10A所受到的熱風之量為0.125mL/mm2以上且3.75mL/mm2以下之範圍、或者熱風之吹出流量為每一行寬(8mm)10L/min以上且60L/min以下之範圍。
The hot air outlet is arranged along the width direction of the
又,熱風之吹出溫度於熱風吹出口之附近,通常為大致300℃以上且700℃以下之範圍,較佳為600℃以下。再者,熱風之吹出溫度亦可根據片材10A之材料熔點而設定。
In addition, the blowing temperature of the hot air is generally in the range of approximately 300°C or higher and 700°C or lower, preferably 600°C or lower, in the vicinity of the hot air outlet. Furthermore, the blowing temperature of the hot air can also be set according to the melting point of the material of the
並且,成形裝置100除上述之各類機構以外,還具備如下等機構:切斷機構,其將成形為複數行之承載帶10切斷、分離成1行承載帶1;及捲取機構,其將零件P收納至各承載帶1之收納凹部3後捲取至捲盤。
Further, the forming
繼而,對承載帶10之成形方法進行說明,該成形方法至少包括:搬送步驟S1,其係將片材10A搬送至滾筒式模具120;及成形步驟S2,其係將被搬送至滾筒式模具120之表面之片材10A吸引而使之真空成形(參照圖4)。
Next, the forming method of the
於搬送步驟S1中,將片材10A以固定之搬送速度搬送至滾筒式模具120。此時,搬送速度為大致1m/min至15m/min,較佳為2m/min至10m/min。再者,於搬送步驟S1之前步驟中,可藉由預加熱輥110預加熱片材10A。
In the conveyance step S1, the
於後續之成形步驟S2中,將片材10A真空吸附於滾筒式模具120之外周,並且一面自熱風加熱機構160吹出熱風而加熱片材10A,一面使其真空成形。此時,滾筒式模具120以至少能夠在片材10A之加熱過程中抽真空之方式而構成。
In the subsequent forming step S2, the
其後,形成有收納凹部3之承載帶10於蓄積部130進行冷卻,藉由搬送機構150之間歇性搬送,而利用壓模140貫穿設置進給孔2等。然後,形成有進給孔2及收納凹部3之承載帶10藉由切斷機構而被切斷分離。以此方式,單行之承載帶1成形。
After that, the
此處,藉由實施例1及實施例2,詳細說明利用本發明之實施形態之承載帶10之成形方法所取得之效果。
Here, the effects obtained by the molding method of the
圖5係利用本發明之實施形態之承載帶1之成形方法形成之承載帶1之圖,(a)係俯視圖,(b)係A-A剖視圖,(c)係B-B剖視圖,圖6係成形性較差之承載帶1A之圖,(a)係俯視圖,(b)係C-C剖視圖,(c)係D-D剖視圖。再者,圖5及圖6中之影線係為了容易地確認開口緣310、310A之區域差而附加者。
Fig. 5 is a view of the
於本實施例中,自聚碳酸酯製(熔點約250℃)之片材10A中形成包含4行承載帶1之承載帶10,該承載帶1為8mm寬。再者,收納凹部3之設計尺寸為:開口緣310為1.0mm×2.5mm之矩形狀,深度為0.8mm,搬送方向MD之間隔為2mm。
In this embodiment, a
成形裝置100之成形條件係將預加熱輥110之溫度設為100℃。又,將熱風加熱機構160之熱風吹出口設置為與片材10A相隔1.5mm,將熱風溫度設為600℃。將滾筒式模具120之溫度設為60℃。
The forming conditions of the forming
並且,使熱風之吹出流量自每一行寬(8mm)5L/min變化至65L/min,並且使搬送速度自1.0m/min變化至11m/min。 Then, the blowing flow rate of the hot air was changed from 5 L/min per line width (8 mm) to 65 L/min, and the conveying speed was changed from 1.0 m/min to 11 m/min.
承載帶1之成形評價係藉由如下方式進行:針對收納凹部3,沿著搬
送方向MD利用顯微鏡觀察於寬度方向中央切斷之剖面中之開口緣310,測定半徑R(mm)。評價基準為:於半徑R為0.3mm以下之情形時,視為良好(○);於半徑R大於0.3mm之情形時,或承載帶1斷裂之情形時,視為不良(×)。於表1中表示該等結果。
The forming evaluation of the
如表1所示,於吹出流量超過60L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。同樣,於搬送速度未達2m/min之情形時,亦係片材10A斷裂而無法連續地成形。
As shown in Table 1, when the blowing flow rate exceeds 60 L/min, the
又,於吹出流量未達10L/min之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開
口緣310A之半徑R變大(參照圖6)。同樣,於搬送速度超過10m/min之情形時,亦由於片材10A無法以進行追隨之方式延伸,故而開口緣310A之半徑R變大。
In addition, when the blowing flow rate is less than 10 L/min, since the
另一方面,於吹出流量為10L/min至60L/min,搬送速度為2m/min以上且10m/min以下之範圍(若換算成每單位面積1mm2片材10A所受到的熱風之量,則為0.125mL/mm2以上且3.75mL/mm2以下),開口緣310之半徑R未變大(參照圖5),獲得較多良好評價(○)。
On the other hand, when the blowing flow rate is 10 L/min to 60 L/min, and the conveying speed is in the range of 2 m/min or more and 10 m/min or less (if converted into the amount of hot air per
由此,由該表1可知,若不論搬送速度,熱風加熱機構160之吹出流量未達10L/min或超過60L/min,則無法獲得良好評價(○)。相反可知,若不論吹出流量,搬送速度未達2m/min或超過10m/min,則無法獲得良好評價(○)。又,可知,若搬送速度超過6m/min,則會產生於低吹出流量下無法獲得良好評價(○)之情形。
Therefore, from this Table 1, it can be seen that a favorable evaluation (○) cannot be obtained unless the blowing flow rate of the hot
繼而,將搬送速度設為6.0m/min,使熱風之吹出流量自5L/min變化至65L/min,使滾筒式模具120之溫度自10℃變化至110℃,測定開口緣310之半徑R(mm),且與上述同樣地進行評價。於表2表示該等結果。
Then, the conveying speed was set to 6.0 m/min, the blowing flow rate of the hot air was changed from 5 L/min to 65 L/min, the temperature of the roller die 120 was changed from 10° C. to 110° C., and the radius R of the
如表2所示,於吹出流量超過60L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。於吹出流量未達10L/min之時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。
As shown in Table 2, when the blowing flow rate exceeds 60 L/min, the
又,於滾筒式模具120之加熱溫度超過100℃之情形時,片材10A處於高溫狀態,存在熔融之情況,於自滾筒式模具120脫模時,收納凹部3A大幅度變形而成形。因此,產生捲取不良,而無法連續地成形。又,於滾筒式模具120之加熱溫度未達20℃之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開
口緣310A之半徑R變大。
In addition, when the heating temperature of the
另一方面,於吹出流量10L/min至60L/min(若換算成每單位面積1mm2片材10A所受到的熱風之量,則為0.2mL/mm2以上且1.25mL/mm2以下),且滾筒式模具120之加熱溫度為20℃以上且100℃以下之範圍,開口緣310之半徑R未變大,而獲得較多良好評價(○)。
On the other hand, at a blowing flow rate of 10 L/min to 60 L/min (when converted into the amount of hot air received by the
由此,由該表2可知:若不論滾筒式模具120之溫度,熱風加熱機構160之吹出流量未達10L/min(若換算成每單位面積1mm2片材10A所受到的熱風之量,則為0.2mL/mm2)或超過60L/min(若換算成每單位面積1mm2片材10A所受到的熱風之量,則為1.25mL/mm2),則無法獲得良好評價(○)。相反可知,若不論吹出流量,滾筒式模具120之溫度未達20℃或超過100℃,則無法獲得良好評價(○)。又,可知,若滾筒式模具120之溫度未達60℃,則會產生於低吹出流量下無法獲得良好評價(○)之情形。
Therefore, it can be seen from this table 2: if regardless of the temperature of the
於本實施例中,除使用聚苯乙烯製(熔點約240℃)之片材10A代替碳酸酯製之片材10A以外之成形條件設為與實施例1相同。於表3及表4中表示該等結果。
In this example, the molding conditions were the same as those of Example 1 except that the
如表3所示,於吹出流量超過60L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。同樣,於搬送速度未達2m/min之情形時,亦係片材10A斷裂而無法連續地成形。
As shown in Table 3, when the blowing flow rate exceeds 60 L/min, the
又,於吹出流量未達10L/min之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。同樣,於搬送速度超過10m/min之情形時,亦由於片材10A無法以進行追隨之方式延伸,故而開口緣310A之半徑R變大。
Furthermore, when the blowing flow rate is less than 10 L/min, since the
另一方面,於吹出流量為10L/min至60L/min且搬送速度為2m/min以上且10m/min以下之範圍,開口緣310之半徑R未變大,而獲得良好評價(○)。
On the other hand, the radius R of the
由此,由該表3可知:若不論搬送速度,熱風加熱機構160之吹出流量未達10L/min或超過60L/min,則無法獲得良好評價(○)。相反可知,若不論吹出流量,搬送速度未達2m/min或超過10m/min,則無法獲得良好評價(○)。
Therefore, from this Table 3, it turns out that a favorable evaluation (○) cannot be obtained unless the blowing flow rate of the hot-
又,由表1及表3之對比可知,聚苯乙烯製之片材10A即便於低流量、高速度之區域、或低流量、溫度之區域中,開口緣310之半徑R亦不會變大,相較於聚碳酸酯製之片材10A,成形性良好。
In addition, it can be seen from the comparison between Table 1 and Table 3 that the radius R of the
如表4所示,於吹出流量超過60L/min之情形時,片材10A處於高溫狀態,存在熔融之情況,結果導致片材10A斷裂而無法連續地成形。於吹出流量未達10L/min之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。
As shown in Table 4, when the blowing flow rate exceeds 60 L/min, the
又,於滾筒式模具120之加熱溫度超過100℃之情形時,片材10A處於高溫狀態,存在熔融之情況,於自滾筒式模具120脫模時,收納凹部3A大幅度變形而成形。因此,產生捲取不良,而無法連續地成形。又,於滾筒式模具120之加熱溫度未達20℃之情形時,由於片材10A未被充分地加熱,無法以追隨滾筒式模具120之模穴之方式延伸,故而收納凹部3A之開口緣310A之半徑R變大。
In addition, when the heating temperature of the
此外,於吹出流量為10L/min至60L/min,且滾筒式模具120之加熱溫度為20℃以上且100℃以下之範圍,開口緣310之半徑R未變大,而獲得較多良好評價(○)。
In addition, when the blowing flow rate is 10L/min to 60L/min, and the heating temperature of the
由此,由該表4可知:若不論滾筒式模具120之溫度,熱風加熱機構160之吹出流量未達10L/min(若換算成每單位面積1mm2片材10A所受到的熱風之量,則為0.2mL/mm2)或超過60L/min(若換算成每單位面積1mm2片材10A所受到的熱風之量,則為1.25mL/mm2),則無法獲得良好評價(○)。相反可知,若不論吹出流量,滾筒式模具120之溫度未達20℃或
超過100℃,則無法獲得良好評價(○)。又,可知若滾筒式模具120之溫度未達60℃,則會產生於低吹出流量下無法獲得良好評價(○)之情形。
Therefore, it can be seen from this table 4: if regardless of the temperature of the
又,由表2及表4之對比可知,聚苯乙烯製之片材10A即便於低流量、高速度之區域、或低流量、溫度之區域中,開口緣310之半徑R亦不會變大,相較於聚碳酸酯製之片材10A,成形性良好。
In addition, it can be seen from the comparison between Table 2 and Table 4 that the radius R of the
根據以上之實施例1及實施例2,可謂較佳為將自熱風加熱機構160吹出之熱風之吹出流量設為每一行寬(8mm)10L/min以上且60L/min以下。換言之,較佳為將片材10A所受到的熱風之量設為0.125mL/mm2以上且3.75mL/mm2以下。
According to
又,較佳為將片材10A之搬送速度設為2m/min以上且10m/min以下。進而可謂,較佳為將滾筒式模具120之加熱溫度維持為20℃以上且100℃以下之溫度。
Moreover, it is preferable to set the conveyance speed of 10 A of sheets to 2 m/min or more and 10 m/min or less. Furthermore, it can be said that it is preferable to maintain the heating temperature of the
如以上所說明,實施形態之承載帶10之成形方法係成形具有1行以上之進給孔2及收納零件P之收納凹部3之承載帶10之方法,該承載帶10之成形方法包括:搬送步驟S1,其係將片材10A搬送至滾筒式模具120;及成形步驟S2,其係將被搬送至滾筒式模具120之表面之片材10A吸引而使之真空成形;於成形步驟S2中,一面自熱風加熱機構160吹出熱風而加熱片材10A,一面使其真空成形,並且將片材10A所受到的熱風之量設為0.125mL/mm2以上且3.75mL/mm2以下。藉此,藉由向利用滾筒式模具120成
形中之片材10A(或收納凹部3)壓力噴射熱風,可加熱片材10A而使其軟化以適應模穴,因此可確保收納凹部3之開口緣310之矩形性。換言之,可將收納凹部3之開口緣310抑制為較小之半徑R。
As described above, the method of forming the
於實施形態中,將熱風之吹出溫度設為300℃以上且700℃以下。藉此,藉由向利用滾筒式模具120成形中之片材10A(或收納凹部3)壓力噴射熱風,可加熱片材10A而使其軟化。
In the embodiment, the blowing temperature of the hot air is set to 300°C or higher and 700°C or lower. Thereby, the
於實施形態中,將熱風之吹出流量設為每一行寬8mm,10L/min以上且60L/min以下。藉此,可以適當之吹出流量加熱軟化片材10A。
In the embodiment, the blowing flow rate of the hot air is set to be 8 mm in width per line, 10 L/min or more and 60 L/min or less. Thereby, the
於實施形態中,將片材10A之搬送速度設為2m/min以上且10m/min以下。藉此,可以適當之吹出流量(加熱熱量)加熱軟化片材10A。
In the embodiment, the conveyance speed of the
於實施形態中,將滾筒式模具120維持為20℃以上且100℃以下之溫度。藉此,可以適當之加熱熱量加熱軟化片材10A。
In the embodiment, the temperature of the drum-
於上述實施形態中,熱風加熱機構160之熱風吹出口係以對應於各行之方式設置有複數個,但亦可僅設置1個對應於4行寬度之寬幅之狹縫開口。
In the above-mentioned embodiment, the hot air outlet of the hot
於上述實施形態中,滾筒式模具120以能夠至少在片材10A之加熱中
抽真空之方式構成,但亦可以在即將加熱之前進行抽真空或加熱結束後進行抽真空之方式構成。
In the above-described embodiment, the roller die 120 is capable of at least heating the
以上詳細地敍述了本發明之較佳實施形態,但本發明並不限定於上述實施形態,可於申請專利範圍所記載之本發明之主旨之範圍內進行各種變化、變更。 The preferred embodiments of the present invention have been described above in detail, but the present invention is not limited to the above-described embodiments, and various changes and modifications can be made within the scope of the gist of the present invention described in the scope of the claims.
1:承載帶 1: carrier tape
2:進給孔 2: Feed hole
3:收納凹部 3: Storage recess
4:檢查孔 4: Inspection hole
310:開口緣 310: Open edge
MD:搬送方向(長度方向) MD: conveying direction (longitudinal direction)
P:零件 P: Parts
Claims (7)
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Citations (7)
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JPH11151749A (en) * | 1997-11-21 | 1999-06-08 | Shin Etsu Polymer Co Ltd | Production of carrier tape |
JPH11207811A (en) * | 1998-01-29 | 1999-08-03 | Ckd Corp | Apparatus for forming carrier tape |
CN1571746A (en) * | 2001-10-17 | 2005-01-26 | 住友电木株式会社 | System for embossing carrier tape and method for producing carrier tape |
TWM258855U (en) * | 2004-04-06 | 2005-03-11 | E & R Engineering Corp | Packaging carrier tape shaping machine with automatic detecting function |
TWI237593B (en) * | 2004-05-14 | 2005-08-11 | Tzuo-Liang Tzeng | Method for forming carrier tape and device for same |
JP2007126169A (en) * | 2005-11-02 | 2007-05-24 | Shin Etsu Polymer Co Ltd | Method for manufacturing electronic part storing member, and electronic part storing member |
TW201417991A (en) * | 2012-08-31 | 2014-05-16 | Sumitomo Bakelite Co | Apparatus of manufacturing carrier tape |
-
2017
- 2017-05-15 JP JP2017096477A patent/JP6809678B2/en active Active
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2018
- 2018-04-10 WO PCT/JP2018/015038 patent/WO2018211862A1/en active Application Filing
- 2018-05-04 TW TW107115187A patent/TWI770170B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11151749A (en) * | 1997-11-21 | 1999-06-08 | Shin Etsu Polymer Co Ltd | Production of carrier tape |
JPH11207811A (en) * | 1998-01-29 | 1999-08-03 | Ckd Corp | Apparatus for forming carrier tape |
CN1571746A (en) * | 2001-10-17 | 2005-01-26 | 住友电木株式会社 | System for embossing carrier tape and method for producing carrier tape |
TWM258855U (en) * | 2004-04-06 | 2005-03-11 | E & R Engineering Corp | Packaging carrier tape shaping machine with automatic detecting function |
TWI237593B (en) * | 2004-05-14 | 2005-08-11 | Tzuo-Liang Tzeng | Method for forming carrier tape and device for same |
JP2007126169A (en) * | 2005-11-02 | 2007-05-24 | Shin Etsu Polymer Co Ltd | Method for manufacturing electronic part storing member, and electronic part storing member |
TW201417991A (en) * | 2012-08-31 | 2014-05-16 | Sumitomo Bakelite Co | Apparatus of manufacturing carrier tape |
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JP6809678B2 (en) | 2021-01-06 |
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