TWI630155B - Sheet for producing carrier tape, method of producing sheet for producing carrier tape and package - Google Patents

Sheet for producing carrier tape, method of producing sheet for producing carrier tape and package Download PDF

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Publication number
TWI630155B
TWI630155B TW103116892A TW103116892A TWI630155B TW I630155 B TWI630155 B TW I630155B TW 103116892 A TW103116892 A TW 103116892A TW 103116892 A TW103116892 A TW 103116892A TW I630155 B TWI630155 B TW I630155B
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TW
Taiwan
Prior art keywords
sheet
carrier tape
recessed portion
manufacturing
punching
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TW103116892A
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Chinese (zh)
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TW201505944A (en
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大河內英二
田尻一雄
中越健一
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信越聚合物股份有限公司
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Publication of TW201505944A publication Critical patent/TW201505944A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/22Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length
    • B29C43/222Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of indefinite length characterised by the shape of the surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/09Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels
    • B29C48/11Articles with cross-sections having partially or fully enclosed cavities, e.g. pipes or channels comprising two or more partially or fully enclosed cavities, e.g. honeycomb-shaped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/13Articles with a cross-section varying in the longitudinal direction, e.g. corrugated pipes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B15/00Attaching articles to cards, sheets, strings, webs, or other carriers
    • B65B15/04Attaching a series of articles, e.g. small electrical components, to a continuous web
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00Shaping techniques involving a cutting or machining operation
    • B29C2793/0009Cutting out
    • B29C2793/0018Cutting out for making a hole
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00Shaping techniques involving a cutting or machining operation
    • B29C2793/0045Perforating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • B29C48/0011Combinations of extrusion moulding with other shaping operations combined with compression moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/001Combinations of extrusion moulding with other shaping operations
    • B29C48/0022Combinations of extrusion moulding with other shaping operations combined with cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/88Thermal treatment of the stream of extruded material, e.g. cooling
    • B29C48/911Cooling
    • B29C48/9135Cooling of flat articles, e.g. using specially adapted supporting means
    • B29C48/914Cooling of flat articles, e.g. using specially adapted supporting means cooling drums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/02Articles partially enclosed in folded or wound strips or sheets, e.g. wrapped newspapers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Abstract

本發明之製作載送帶用片材155,係由帶狀片材所構成,為樹脂製。在該製作載送帶用片材155的第1面15上,形成有沿著其長邊方向配置的複數個第1凹部12,以及與第1凹部12平行配置的複數個第2凹部16。另外,製作載送帶用片材155,具有可沿著其長邊方向切斷除去的部分,於該可除去之部分形成有複數個第2凹部16。 The sheet 155 for producing a carrier tape of the present invention is made of a tape-like sheet and is made of resin. A plurality of first recessed portions 12 and a plurality of second recessed portions 16 arranged in parallel to the first recessed portion 12 are formed on the first surface 15 of the carrier tape sheet 155. In addition, a sheet 155 for a carrier tape is produced, and has a portion that can be cut and removed along its longitudinal direction, and a plurality of second recessed portions 16 are formed in the removable portion.

Description

製作載送帶用片材、製作載送帶用片材的製造方法、及 包裝體 Manufacturing sheet for carrier tape, manufacturing method for manufacturing sheet for carrier tape, and Package

本發明係關於一種製作載送帶用片材、製作載送帶用片材的製造方法以及包裝體。 The present invention relates to a sheet for a carrier tape, a manufacturing method for a sheet for a carrier tape, and a package.

一般而言,收納電子零件(特別是晶片電阻、晶片LED、晶片電容等非常小的晶片零件)等的包裝體,會使用電子零件收納用載送帶(以下亦簡稱為「載送帶」)被上覆蓋帶(以下亦簡稱為「覆蓋帶」)封裝所構成的包裝體。 In general, a packaging body for storing electronic parts (especially very small chip parts such as chip resistors, chip LEDs, and chip capacitors) uses a carrier tape for storing electronic parts (hereinafter also referred to as "carrier tape") A packaging body which is packaged with a cover tape (hereinafter also referred to simply as "cover tape").

關於載送帶,可使用:在對帶狀片材的一部分利用沖孔加工形成貫通孔之後,於片材的底面貼合底膠帶,以形成凹狀的零件收納部(口袋)的沖孔載送帶(參照例如專利文獻1);對帶狀片材的一部分利用壓縮加工形成口袋的壓製載送帶(參照例如專利文獻2);以及對帶狀片材的一部分利用成形加工(加壓 成形、真空筒成形、壓製成形等)形成口袋的壓印載送帶(參照例如專利文獻3)等。 As for the carrier tape, after forming a through-hole by punching a part of the band-shaped sheet, a bottom tape is attached to the bottom surface of the sheet to form a punched carrier for the concave part storage portion (pocket). Tape feeding (refer to, for example, Patent Document 1); a compression carrier tape (refer to, for example, Patent Document 2) to form a pocket by compression processing on a part of the belt-shaped sheet; and forming processing (pressing on a part of the belt-shaped sheet) Forming, vacuum cylinder forming, press forming, etc.) forming an embossed carrier tape (see, for example, Patent Document 3) and the like.

【先行技術文獻】 [Advanced technical literature] 【專利文獻】 [Patent Literature]

【專利文獻1】日本特開平10-218281號公報 [Patent Document 1] Japanese Patent Laid-Open No. 10-218281

【專利文獻2】日本專利第3751414號公報 [Patent Document 2] Japanese Patent No. 3751414

【專利文獻3】日本特開2011-225257號公報 [Patent Document 3] Japanese Patent Laid-Open No. 2011-225257

圖23、圖24、圖25所示的沖孔載送帶以及壓製載送帶,使用作為片材基材者,以紙製者為主流。該等紙製載送帶,在將電子零件餵料到表面安裝機時,會從片材本身產生紙粉。該紙粉會造成電子零件的焊料接合不良或電子零件吸附嘴的堵塞這樣的問題。另外,口袋內的起毛、吸濕所導致的口袋尺寸變化、在安裝時於剝離覆蓋帶之際產生的靜電所導致的帶電等,容易造成電子零件吸附嘴的拾取失誤這樣的問題。 The punched carrier tape and the pressurized carrier tape shown in Figs. 23, 24, and 25 are used as sheet substrates, and paper-made ones are the mainstream. These paper carrier tapes generate paper dust from the sheet itself when feeding electronic parts to a surface mount machine. This paper powder causes problems such as poor solder joints of electronic parts or clogging of the suction nozzles of electronic parts. In addition, changes in the size of the pocket due to fluff and moisture absorption in the pocket, and electrification caused by static electricity generated when the cover tape is peeled off during installation, etc., may easily cause problems such as picking errors of the suction nozzles of electronic parts.

另外,在上述的沖孔載送帶中,因應所收納之電子零件的高度設定片材的厚度(與口袋的深度相同)係一般情況。因此,為了收納高度較低的電子零件,在沖孔載送帶中,有必要使片材的厚度較薄。此時,由於片材的強度不足,在 收納電子零件並以覆蓋帶封裝的貼帶步驟(以下亦簡稱為「貼帶」)或是電子零件的安裝步驟中,當以鏈輪運送沖孔載送帶之際,沖孔載送帶的饋送孔會變形。該等變形會造成運送情況不良、貼帶時的收納穩定性降低或安裝時的拾取失誤這樣的問題。再者,由於必須在片材的底面貼合底膠帶,故會造成資材購入費或加工費等的費用增加,進而導致載送帶的成本增加這樣的問題。 In the punching carrier tape described above, the thickness of the sheet (the same as the depth of the pocket) is generally set in accordance with the height of the electronic components to be stored. Therefore, in order to store electronic components having a low height, it is necessary to make the sheet thinner in the punching carrier tape. At this time, due to the insufficient strength of the sheet, In the step of attaching an electronic component and packaging it with a cover tape (hereinafter also referred to as "adhesive tape") or the installation step of an electronic component, when the punching carrier tape is transported by a sprocket, The feed holes are deformed. Such deformation may cause problems such as poor transportation conditions, reduced storage stability during tape application, or pick-up errors during installation. In addition, since the bottom tape must be attached to the bottom surface of the sheet, there is a problem that costs such as material purchase costs or processing costs increase, and the cost of the carrier tape increases.

另一方面,圖26、圖27、圖28所示的壓印載送帶,其片材的口袋的裏側形成突起狀。因此,在前述的沖孔載送帶或前述的壓製載送帶併用的情況下,貼帶機以及表面安裝機的裝置改造或零件交換變得有其必要,需要較高的成本。另外,在將壓印載送帶捲繞於捲軸並進行輸送時,會對片材的裏側的突起施加負載。因此,會發生零件收納部變形、捲繞脫落或捲繞鬆弛這樣的問題。再者,於貼帶後將壓印載送帶捲繞於捲軸時,捲繞於外側層的片材的裏側的突起,會對捲繞於內側層的口袋部分的覆蓋帶施與壓力。結果,會造成覆蓋帶受到損傷或電子零件破損這樣的問題。 On the other hand, in the embossed carrier tape shown in FIGS. 26, 27, and 28, the back side of the pocket of the sheet is formed in a protruding shape. Therefore, in the case where the aforementioned punching carrier tape or the aforementioned pressing carrier tape are used in combination, it is necessary to renovate the device of the tape applicator and the surface mounting machine or to exchange parts, which requires higher costs. When the embossed carrier tape is wound around a reel and conveyed, a load is applied to the protrusion on the back side of the sheet. For this reason, problems such as deformation of the component storage portion, falling off of the winding, or loosening of the winding may occur. Furthermore, when the imprint carrier tape is wound on a reel after the tape is applied, the protrusion on the back side of the sheet wound on the outer layer applies pressure to the cover tape wound on the pocket portion of the inner layer. As a result, problems such as damage to the cover tape or breakage of the electronic components are caused.

吾人期望一種可解決該等問題點,亦即,可提高貼帶以及表面安裝的穩定性,並對應清潔化處理的載送帶。關於該等載送帶,根據本發明人的檢討,提出一種形成有複數個凹部(電子零件收納用凹部)以及饋送孔的樹脂製載送帶。 We expect a kind of carrier tape that can solve these problems, that is, improve the stability of the tape and the surface mounting, and correspond to the cleaning process. Regarding such a carrier tape, based on a review by the present inventors, a resin carrier tape having a plurality of recessed portions (recessed portions for accommodating electronic parts) and a feeding hole has been proposed.

在使用該等載送帶,將凹部所收納之電子零件餵料到表面安裝機時,為了以優良的精度實施電子零件的安裝,要求以優良的位置精度餵送電子零件。為此,要求在載送帶中該饋送孔相對於該凹部以優良的位置精度形成。 When using such carrier tapes to feed the electronic components stored in the recesses to the surface mounting machine, in order to mount the electronic components with excellent accuracy, it is required to feed the electronic components with excellent positional accuracy. For this reason, it is required that the feeding hole is formed with excellent positional accuracy with respect to the recess in the carrier tape.

因此,本發明之目的在於提供一種可製作出相對於可收納電子零件的凹部以優良的位置精度形成饋送孔的載送帶的製作載送帶用片材、可製造出該等製作載送帶用片材的製作載送帶用片材的製造方法以及具備從該等製作載送帶用片材所製作出的載體片材的包裝體。 Therefore, an object of the present invention is to provide a carrier tape manufacturing sheet that can form a carrier tape that can form a feed hole with excellent positional accuracy with respect to a recessed portion that can accommodate an electronic component, and can produce such a carrier tape. Method for producing sheet for carrier tape by using sheet material, and packaging body including carrier sheet produced from the sheet for carrier tape.

該等目的,利用下述(1)~(29)的本發明達成。 These objects are achieved by the present invention described in (1) to (29) below.

(1)一種由帶狀片材所構成的樹脂製的製作載送帶用片材,其特徵為:具有第1面以及位於該第1面的相反側的第2面;在該第1面上形成有沿著該片材之長邊方向配置的複數個第1凹部,以及與該第1凹部平行配置的複數個第2凹部;該製作載送帶用片材,具有可沿著其長邊方向切斷除去的部分,且該複數個第2凹部形成在該可除去的部分上。 (1) A resin-made carrier tape sheet made of a band-shaped sheet, comprising a first surface and a second surface located on the opposite side of the first surface; and on the first surface A plurality of first recessed portions arranged along the longitudinal direction of the sheet and a plurality of second recessed portions arranged in parallel with the first recessed portion are formed on the sheet. The removed portion is cut in the side direction, and the plurality of second recessed portions are formed on the removable portion.

(2)如上述(1)所記載的製作載送帶用片材,其中,在該第1面之中的除了該可除去之部分以外的區域,更形成有與該第1凹部平行配置的複數個饋送孔。 (2) The sheet for producing a carrier tape according to the above (1), wherein a region other than the removable portion of the first surface is further formed with a parallel arrangement with the first recessed portion. A plurality of feed holes.

(3)如上述(1)或是(2)所記載的製作載送帶用片材,其中,該第2面幾近平坦。 (3) The sheet for producing a carrier tape according to the above (1) or (2), wherein the second surface is almost flat.

(4)如上述(3)所記載的製作載送帶用片材,其中,若令該第2凹部的深度為J(mm),令該製作載送帶用片材的該第2凹部的底部的厚度為K(mm),且令該製作載送帶用片材的該第1凹部以及該第2凹部以外的部分的厚度為C(mm),則J+K=C大致成立。 (4) The sheet for the carrier tape as described in the above (3), wherein if the depth of the second recess is J (mm), the thickness of the second recess for the sheet for the carrier tape is made. The thickness of the bottom portion is K (mm), and the thickness of the portion other than the first recessed portion and the second recessed portion of the sheet for the carrier tape is C (mm), and J + K = C is approximately established.

(5)如上述(3)或是(4)所記載的製作載送帶用片材,其中,若令該第2凹部的深度為J(mm),令該製作載送帶用片材的該第2凹部的底部的厚度為K(mm),且令該製作載送帶用片材的該第1凹部以及該第2凹部以外的部分的厚度為C(mm)時,則-0.1<C-(J+K)<0.1成立。 (5) The sheet for producing a carrier tape as described in the above (3) or (4), wherein if the depth of the second recessed portion is J (mm), When the thickness of the bottom portion of the second recessed portion is K (mm), and the thickness of the first recessed portion and the portion other than the second recessed portion of the carrier tape sheet is set to C (mm), -0.1 < C- (J + K) <0.1 holds.

(6)如上述(3)至(5)中任一項所記載的製作載送帶用片材,其中,若令該第2凹部的深度為J(mm),且令該製作載送帶用片材的該第1凹部以及該第2凹部以外的部分的厚度為C(mm),則C-0.15≦J≦C-0.05成立。 (6) The sheet for producing a carrier tape according to any one of the above (3) to (5), wherein if the depth of the second recess is J (mm), and the carrier tape is made If the thickness of the sheet other than the first recessed portion and the second recessed portion is C (mm), then C-0.15 ≦ J ≦ C-0.05 is established.

(7)如上述(1)至(6)中任一項所記載的製作載送帶用片材,其中,該第2凹部的內側的緣部以曲率半徑在0.2mm以下的方式彎曲。 (7) The sheet for producing a carrier tape according to any one of the above (1) to (6), wherein an inner edge portion of the second recessed portion is bent so that a curvature radius is 0.2 mm or less.

(8)如上述(1)至(7)中任一項所記載的製作載送帶用片材,其中,將該第1面或是該第2面當作芯材側進行捲繞,該芯材的直徑為5~300mm。 (8) The sheet for producing a carrier tape according to any one of (1) to (7) above, wherein the first surface or the second surface is wound as a core material side, and the The diameter of the core material is 5 ~ 300mm.

(9)一種上述(1)至(8)中任一項所記載的製作載送帶用片材的製造方法,其特徵為包含:將該帶狀片材以壓出成形法成膜的成膜步驟;以及在該帶狀片材的第1面上形成該第1凹部以及該第2凹部的成形步驟。 (9) A method for producing a sheet for a carrier tape according to any one of the above (1) to (8), which comprises forming the sheet-like sheet into a film by an extrusion molding method. A film step; and a forming step of forming the first concave portion and the second concave portion on the first surface of the band-shaped sheet.

(10)如上述(9)所記載的製作載送帶用片材的製造方法,其中,於該成形步驟中,使用具有分別用來形成該第1凹部以及該第2凹部的第1突起物以及第2突起物的成形模具。 (10) The method for producing a sheet for a carrier tape as described in the above (9), wherein in the forming step, first protrusions each having the first recessed portion and the second recessed portion are used. And a mold for forming the second protrusion.

(11)如上述(10)所記載的製作載送帶用片材的製造方法,其中,該成形模具具備在外周具有1個以上的該第1突起物的輥子狀的第1模具部。 (11) The method for producing a sheet for a carrier tape according to the above (10), wherein the forming mold includes a roller-shaped first mold portion having one or more first projections on the outer periphery.

(12)如上述(10)或是(11)所記載的製作載送帶用片材的製造方法,其中,該成形模具具備在外周具有1個以上的該第2突起物的輥子狀的第2模具部。 (12) The manufacturing method for producing a sheet for a carrier tape according to the above (10) or (11), wherein the forming die includes a roller-shaped first piece having one or more second protrusions on the outer periphery. 2 mold section.

(13)如上述(9)至(12)中任一項所記載的製作載送帶用片材的製造方法,其中,於該成形步驟中使該帶狀片材的第2面平坦化。 (13) The method for producing a sheet for a carrier tape according to any one of (9) to (12), wherein the second surface of the tape-shaped sheet is flattened in the forming step.

(14)如上述(13)所記載的製作載送帶用片材的製造方法,其中,於該成形步驟中使用令該帶狀片材的第2面平坦化的接觸輥子。 (14) The method for producing a sheet for a carrier tape according to the above (13), wherein in the forming step, a contact roller for flattening the second surface of the belt-shaped sheet is used.

(15)如上述(9)至(14)中任一項所記載的製作載送帶用片材的製造方法,其中,於該成形步驟之後更具有將該帶狀片材冷卻的冷卻步驟。 (15) The method for producing a sheet for a carrier tape according to any one of (9) to (14) above, further comprising a cooling step of cooling the tape-shaped sheet after the forming step.

(16)如上述(15)所記載的製作載送帶用片材的製造方法,其中,於該冷卻步驟中使用冷卻輥子。 (16) The method for producing a sheet for a carrier tape according to the above (15), wherein a cooling roller is used in the cooling step.

(17)如上述(15)或是(16)所記載的製作載送帶用片材的製造方法,其中,於該冷卻步驟之後,更具有在該帶狀片材上加工製出與該第1凹部平行配置的複數個饋送孔的沖孔步驟。 (17) The method for producing a sheet for a carrier tape as described in (15) or (16) above, further comprising processing the sheet-like sheet and the first sheet after the cooling step. Punching step of a plurality of feeding holes arranged in parallel with one recess.

(18)如上述(17)所記載的製作載送帶用片材的製造方法,其中,於該沖孔步驟中,使用具備用來加工製出該饋送孔的沖孔工具的沖孔模具。 (18) The method for producing a sheet for a carrier tape according to the above (17), wherein, in the punching step, a punching die provided with a punching tool for processing the feeding hole is used.

(19)如上述(18)所記載的製作載送帶用片材的製造方法,其中,該沖孔模具具有用來確保該第1凹部與該饋送孔的位置精度的位置修正機構。 (19) The method for producing a sheet for a carrier tape according to the above (18), wherein the punching die has a position correction mechanism for ensuring positional accuracy of the first recessed portion and the feeding hole.

(20)如上述(19)所記載的製作載送帶用片材的製造方法,其中,該位置修正機構具有:用來控制與該第1凹部平行配置的該第2凹部的位置之位置修正用導件和位置控制用導件;以及用來控制該饋送孔的位置之導件銷。 (20) The method for manufacturing a sheet for a carrier tape according to the above (19), wherein the position correction mechanism includes a position correction for controlling a position of the second recessed portion arranged in parallel with the first recessed portion. A guide and a position control guide; and a guide pin for controlling the position of the feed hole.

(21)如上述(20)所記載的製作載送帶用片材的製造方法,其中,該沖孔模具,在沖出該饋送孔的該沖孔工具的該片材的行進方向入口側與出口側的各外側具有該位置修正用導件。 (21) The method for manufacturing a sheet for a carrier tape according to the above (20), wherein the punching die is formed on the entrance side of the sheet in the direction of travel of the punching tool of the punching tool that punches out the feed hole and The position correction guide is provided on each outer side of the exit side.

(22)如上述(20)或是(21)所記載的製作載送帶用片材的製造方法,其中,該沖孔模具,在沖出該饋送孔的該沖孔工具的該片材的行進方向入口側與出口側的各外側具有該位置控制用導件。 (22) The method for producing a sheet for a carrier tape as described in the above (20) or (21), wherein the punching die is used to punch the sheet of the punching tool of the punching tool out of the feeding hole. The position control guide is provided on each of the outer side of the entrance side and the exit side in the traveling direction.

(23)如上述(20)至(22)中任一項所記載的製作載送帶用片材的製造方法,其中,該沖孔模具,在沖出該饋送孔的該沖孔工具的該帶狀片材的行進方向出口側具有該導件銷。 (23) The method for producing a sheet for a carrier tape according to any one of the above (20) to (22), wherein the punching die is formed by The guide pin is provided on the exit side of the belt-shaped sheet in the traveling direction.

(24)如上述(20)至(23)中任一項所記載的製作載送帶用片材的製造方法,其中,於該沖孔步驟中,在用擋板壓住該帶狀片材的該第1面之前,先以該位置修正用導件控制住該第2凹部的位置。 (24) The method for producing a sheet for a carrier tape according to any one of the above (20) to (23), wherein in the punching step, the band-shaped sheet is pressed by a baffle Prior to the first surface, the position of the second recessed portion is controlled by the position correction guide.

(25)如上述(24)所記載的製作載送帶用片材的製造方法,其中,於該沖孔步驟的用該沖孔工具施壓於該帶狀片材的最初第1發中,在以該位置修正用導件控制住該第2凹部的位置之前,先以位置控制用導件控制住該第2凹部的位置。 (25) The method for producing a sheet for a carrier tape according to the above (24), wherein in the punching step, the punching tool is used to press the first round of the belt-shaped sheet with the punching tool, Before the position of the second recessed portion is controlled by the position correction guide, the position of the second recessed portion is controlled by the position control guide.

(26)如上述(25)所記載的製作載送帶用片材的製造方法,其中,若令以該位置修正用導件控制該第2凹部的位置之最大量為U(mm),且令第2凹部的中心軸與該位置控制用導件的中心軸之位置偏差的最大量為V(mm),則V≦U成立。 (26) The method for manufacturing a sheet for a carrier tape as described in (25) above, wherein the maximum amount of controlling the position of the second recessed portion with the position correction guide is U (mm), and Let the maximum amount of positional deviation between the central axis of the second recessed portion and the central axis of the position control guide be V (mm), then V ≦ U is established.

(27)如上述(25)或是(26)所記載的製作載送帶用片材的製造方法,其中,於該沖孔步驟的用該沖孔工具施壓於該帶狀片材的第2發以後,在以該位置修正用導件控制該第2凹部的位置之前,先以該導件銷控制該饋送孔的位置。 (27) The method for producing a sheet for a carrier tape as described in the above (25) or (26), wherein, in the punching step, the first step of pressing the belt-shaped sheet with the punching tool is used for pressing. After 2 rounds, before controlling the position of the second recessed portion with the position correction guide, first control the position of the feed hole with the guide pin.

(28)如上述(27)所記載的製作載送帶用片材的製造方法,其中,若令以該位置修正用導件控制該第2凹部的位置之最大量為U(mm),且令該饋送孔的中心軸與該導件銷的中心軸之位置偏差的最大量為W(mm),則W<U成立。 (28) The method for manufacturing a sheet for a carrier tape as described in (27) above, wherein the maximum amount of controlling the position of the second recessed portion with the position correction guide is U (mm), and Let the maximum amount of positional deviation between the central axis of the feed hole and the central axis of the guide pin be W (mm), then W <U holds.

(29)一種包裝體,包含:將上述(1)至(8)中任一項所記載的製作載送帶用片材以包含該第1凹部在內的方式按既定的寬度裁切所製得的電子零件收納用載送帶;以及在該第1凹部內收納有電子零件的狀態下封裝該第1凹部的開口的上覆蓋帶。 (29) A package comprising: a sheet for producing a carrier tape according to any one of (1) to (8), which is produced by cutting a predetermined width to include the first recessed portion; A carrier tape for accommodating an electronic component; and an upper cover tape that seals an opening of the first recessed portion in a state where electronic components are stored in the first recessed portion.

根據本發明,便可提供一種可製作出相對於可收納電子零件的凹部(第1凹部)以優良的位置精度形成饋送孔的載送帶的製作載送帶用片材、其製造方法以及具備該載送帶的包裝體。 According to the present invention, it is possible to provide a carrier tape sheet that can produce a carrier tape that can form a feed hole with excellent positional accuracy with respect to a recessed portion (first recessed portion) that can accommodate an electronic component, a manufacturing method thereof, and A package of the carrier tape.

1‧‧‧載送帶 1‧‧‧ transport belt

10‧‧‧片材 10‧‧‧ Sheet

11‧‧‧饋送孔 11‧‧‧Feed hole

12‧‧‧第1凹部 12‧‧‧ 1st recess

13‧‧‧第2面 13‧‧‧ second side

14‧‧‧緣部 14‧‧‧ Margin

15‧‧‧第1面 15‧‧‧Part 1

16‧‧‧第2凹部 16‧‧‧ 2nd recess

17‧‧‧沖孔物 17‧‧‧ punch

18‧‧‧緣部 18‧‧‧ margin

20‧‧‧覆蓋帶 20‧‧‧ Cover tape

40‧‧‧電子零件 40‧‧‧Electronic parts

100‧‧‧包裝體 100‧‧‧ package

110‧‧‧接觸輥子 110‧‧‧contact roller

120‧‧‧冷卻輥子 120‧‧‧cooling roller

130‧‧‧後段冷卻輥子 130‧‧‧ rear cooling roller

140‧‧‧後段冷卻輥子 140‧‧‧ rear cooling roller

150‧‧‧熔融片材 150‧‧‧ molten sheet

151‧‧‧片材 151‧‧‧sheet

155‧‧‧製作載送帶用片材 155‧‧‧ making sheet for carrier tape

156‧‧‧滾筒 156‧‧‧Roller

170‧‧‧接觸輥子 170‧‧‧contact roller

180‧‧‧接觸輥子 180‧‧‧ contact roller

190‧‧‧張力輥子 190‧‧‧tension roller

200‧‧‧第1模具部 200‧‧‧The first mold department

201‧‧‧突起物 201‧‧‧ protrusion

210‧‧‧第2模具部 210‧‧‧The second mold department

211‧‧‧突起物 211‧‧‧ protrusion

220‧‧‧成形模具 220‧‧‧Forming mold

300‧‧‧無接縫輸送帶 300‧‧‧Seamless Conveyor Belt

310‧‧‧無接縫輸送帶 310‧‧‧Seamless Conveyor Belt

500‧‧‧製作載送帶用片材製造裝置 500‧‧‧ Sheet manufacturing device for making carrier tape

600‧‧‧T型模頭 600‧‧‧T-type die

601‧‧‧開口部 601‧‧‧ opening

700‧‧‧噴頭 700‧‧‧ Nozzle

701‧‧‧開口部 701‧‧‧ opening

800‧‧‧成形部 800‧‧‧forming department

900‧‧‧沖孔模具 900‧‧‧ Punching Die

910‧‧‧沖孔頭 910‧‧‧punching head

920‧‧‧第1基體 920‧‧‧The first substrate

921‧‧‧沖孔工具 921‧‧‧Punching tools

922‧‧‧突起物 922‧‧‧ protrusion

923‧‧‧位置控制用導件 923‧‧‧Position control guide

930‧‧‧第2基體 930‧‧‧ 2nd substrate

931‧‧‧導件銷 931‧‧‧Guide Pin

932‧‧‧位置修正用導件 932‧‧‧Position correction guide

933‧‧‧彈簧材料 933‧‧‧Spring material

935‧‧‧圓 935‧‧‧circle

936‧‧‧圓 936‧‧‧circle

940‧‧‧壓制板 940‧‧‧Pressed plate

950‧‧‧支持台 950‧‧‧Support Desk

951‧‧‧第3基體 951‧‧‧3rd substrate

952‧‧‧承受板 952‧‧‧bearing board

A-A‧‧‧剖面線 A-A‧‧‧ hatching

C‧‧‧厚度 C‧‧‧thickness

E-E‧‧‧剖面線 E-E‧‧‧ hatching

F1‧‧‧尺寸 F1‧‧‧ size

F2‧‧‧尺寸 F2‧‧‧ size

F3‧‧‧尺寸 F3‧‧‧ size

F4‧‧‧尺寸 F4‧‧‧ size

G‧‧‧尺寸 G‧‧‧ size

J‧‧‧深度 J‧‧‧ Depth

K‧‧‧厚度 K‧‧‧ thickness

L‧‧‧寬度 L‧‧‧Width

M‧‧‧長度 M‧‧‧ length

N‧‧‧寬度 N‧‧‧Width

P‧‧‧長度 P‧‧‧length

PC1‧‧‧中心 PC1‧‧‧ Center

pk1‧‧‧圓 pk1‧‧‧circle

PK1‧‧‧中心點 PK1‧‧‧center

PK11‧‧‧座標 PK11‧‧‧Coordinates

PK12‧‧‧座標 Coordinates PK12‧‧‧

pk2‧‧‧圓 pk2‧‧‧circle

PK2‧‧‧中心點 PK2‧‧‧center

PK21‧‧‧座標 PK21‧‧‧Coordinates

PK22‧‧‧座標 Coordinates PK22‧‧‧

pk3‧‧‧圓 pk3‧‧‧circle

PK3‧‧‧中心點 PK3‧‧‧center

PK31‧‧‧座標 PK31‧‧‧Coordinates

PK32‧‧‧座標 Coordinates PK32‧‧‧

pk4‧‧‧圓 pk4‧‧‧circle

PK4‧‧‧中心點 PK4‧‧‧center

PK41‧‧‧座標 PK41‧‧‧Coordinates

PK42‧‧‧座標 PK42‧‧‧Coordinates

PP1‧‧‧座標 Coordinates of PP1‧‧‧

PP2‧‧‧座標 Coordinates of PP2‧‧‧

PP3‧‧‧座標 Coordinates PP3‧‧‧

PP4‧‧‧座標 Coordinates of PP4‧‧‧

PP41‧‧‧交點 PP41‧‧‧Intersection

PP42‧‧‧交點 PP42‧‧‧Intersection

PQ1‧‧‧座標 PQ1‧‧‧ Coordinates

PQ2‧‧‧座標 PQ2‧‧‧ Coordinates

PQ3‧‧‧座標 PQ3‧‧‧ Coordinates

PQ4‧‧‧座標 PQ4‧‧‧ Coordinates

PR11‧‧‧座標 PR11‧‧‧Coordinates

pr11‧‧‧圓 pr11‧‧‧circle

PR12‧‧‧座標 Coordinates of PR12‧‧‧

pr12‧‧‧圓 pr12‧‧‧circle

pr13‧‧‧圓 pr13‧‧‧circle

PR13‧‧‧座標 Coordinates of PR13‧‧‧

pr14‧‧‧圓 pr14‧‧‧circle

PR14‧‧‧座標 Coordinates of PR14‧‧‧

PR2‧‧‧座標 Coordinates of PR2‧‧‧

PR3‧‧‧座標 Coordinates of PR3‧‧‧

PR4‧‧‧座標 Coordinates of PR4‧‧‧

PS1‧‧‧座標 PS1‧‧‧ Coordinates

PS2‧‧‧座標 PS2‧‧‧ Coordinates

PS3‧‧‧座標 PS3‧‧‧ Coordinates

PS4‧‧‧座標 PS4‧‧‧ Coordinates

Q‧‧‧寬度 Q‧‧‧Width

R‧‧‧內徑 R‧‧‧ inside diameter

S‧‧‧外徑 S‧‧‧ outer diameter

T‧‧‧外徑 T‧‧‧ outer diameter

U‧‧‧最大量 U‧‧‧Max

V‧‧‧位置偏差 V‧‧‧Position deviation

W‧‧‧位置偏差 W‧‧‧Position deviation

X‧‧‧軸 X‧‧‧axis

Y‧‧‧軸 Y‧‧‧axis

A‧‧‧角度 A‧‧‧ angle

B‧‧‧角度 B‧‧‧ angle

Γ‧‧‧深度 Γ‧‧‧ depth

△‧‧‧深度 △ ‧‧‧ Depth

E‧‧‧位置控制最大量 E‧‧‧Maximum amount of position control

Θ‧‧‧角度 Θ‧‧‧ angle

Λ‧‧‧角度 Λ‧‧‧ angle

ψk1‧‧‧角度 ψk1‧‧‧angle

ψk2‧‧‧角度 ψk2‧‧‧angle

ψk3‧‧‧角度 ψk3‧‧‧ angle

ψk4‧‧‧角度 ψk4‧‧‧ angle

ψp‧‧‧角度 ψp‧‧‧angle

ψr11‧‧‧角度 ψr11‧‧‧angle

ψr12‧‧‧角度 ψr12‧‧‧angle

ψr13‧‧‧角度 ψr13‧‧‧angle

ψr14‧‧‧角度 ψr14‧‧‧angle

Ωp‧‧‧旋轉角度 Ωp‧‧‧rotation angle

ωr11‧‧‧角度 ωr11‧‧‧angle

ωr12‧‧‧角度 ωr12‧‧‧angle

ωr13‧‧‧角度 ωr13‧‧‧angle

ωr14‧‧‧角度 ωr14‧‧‧angle

[圖1]係表示本發明之包裝體的第1構造例的部分立體圖。 Fig. 1 is a partial perspective view showing a first structural example of a package of the present invention.

[圖2]係沿著圖1的A-A線段的剖面圖。 [FIG. 2] A sectional view taken along line A-A in FIG. 1. [FIG.

[圖3]係沿著圖1的B-B線段的剖面圖。 3 is a cross-sectional view taken along a line B-B in FIG. 1.

[圖4](a)~(c)係表示圖1的包裝體所具備之電子零件收納用載送帶的俯視圖。 [Fig. 4] (a) to (c) are plan views showing a carrier tape for electronic component storage provided in the package of Fig. 1. [Fig.

[圖5]係表示製作載送帶用片材的部分立體圖。 Fig. 5 is a partial perspective view showing the production of a sheet for a carrier tape.

[圖6]係沿著圖5的A-A線段的剖面圖。 6 is a cross-sectional view taken along a line A-A in FIG. 5.

[圖7]係沿著圖5的B-B線段的剖面圖。 7 is a cross-sectional view taken along a line B-B in FIG. 5.

[圖8]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第1實施態樣的立體圖。 [Fig. 8] Fig. 8 is a perspective view showing a first embodiment of a device for manufacturing a carrier tape sheet used in a method for manufacturing a sheet for a carrier tape according to the present invention.

[圖9]係圖8的C方向端視圖。 9 is an end view in the direction of C in FIG. 8.

[圖10](a)~(b)係表示圖8所示之製作載送帶用片材製造裝置所具備的各構件與片材的位置關係的俯視圖。 [Fig. 10] (a) to (b) are plan views showing the positional relationship between each member and the sheet provided in the sheet manufacturing apparatus for producing a carrier tape shown in Fig. 8. [Fig.

[圖11](a)~(c)係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的俯視圖。 [Fig. 11] (a) to (c) are plan views illustrating a method for producing a sheet for a carrier tape using the sheet producing device for producing a carrier tape shown in Fig. 8.

[圖12](a)~(d)係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的剖面圖。 [Fig. 12] (a) to (d) are cross-sectional views illustrating a method for manufacturing a sheet for a carrier tape using the sheet manufacturing apparatus for making a carrier tape shown in Fig. 8.

[圖13](a)~(c)係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的剖面圖。 [Fig. 13] (a) to (c) are cross-sectional views illustrating a method for producing a sheet for a carrier tape using the sheet producing apparatus for producing a carrier tape shown in Fig. 8.

[圖14](a)~(d)係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的剖面圖。 [Fig. 14] (a) to (d) are cross-sectional views illustrating a method for producing a sheet for a carrier tape using the sheet producing device for producing a carrier tape shown in Fig. 8.

[圖15](a)~(b)係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的剖面圖。 [Fig. 15] (a) to (b) are cross-sectional views illustrating a method for producing a sheet for a carrier tape using the sheet producing device for producing a carrier tape shown in Fig. 8.

[圖16](A1)~(A3),(B1)~(B3)係表示位置控制用導件與第2凹部的位置關係的剖面圖。 [FIG. 16] (A1) to (A3), (B1) to (B3) are cross-sectional views showing a positional relationship between a position control guide and a second recessed portion.

[圖17](A1)~(A3),(B1)~(B3)係表示位置修正用導件與第2凹部的位置關係的剖面圖。 [FIG. 17] (A1) to (A3), (B1) to (B3) are cross-sectional views showing a positional relationship between a position correction guide and a second recessed portion.

[圖18](A1)~(A2),(B1)~(B2)係表示導件銷與饋送孔的位置關係的剖面圖。 [FIG. 18] (A1) to (A2), (B1) to (B2) are cross-sectional views showing a positional relationship between a guide pin and a feed hole.

[圖19]係表示圖8所示之製作載送帶用片材製造裝置所具備的各構件與片材的位置關係的俯視圖。 19 is a plan view showing a positional relationship between each member and a sheet included in the sheet manufacturing apparatus for producing a carrier tape shown in FIG. 8.

[圖20]係表示導件銷與饋送孔的位置關係的俯視圖。 20 is a plan view showing a positional relationship between a guide pin and a feed hole.

[圖21](a)~(d)係表示饋送孔與第1凹部的位置關係的俯視圖。 21 (a) to (d) are plan views showing the positional relationship between the feed hole and the first recessed portion.

[圖22]係表示位置修正用導件與第2凹部的位置關係的俯視圖。 22 is a plan view showing a positional relationship between a position correction guide and a second recessed portion.

[圖23]係以往的沖孔載送帶的一實施態樣的部分立體圖。 23 is a partial perspective view of an embodiment of a conventional punching carrier tape.

[圖24]係沿著圖23的D-D線段的剖面圖。 24 is a cross-sectional view taken along a line D-D in FIG. 23.

[圖25]係沿著圖23的E-E線段的剖面圖。 25 is a cross-sectional view taken along a line E-E in FIG. 23.

[圖26]係以往的壓印載送帶的一實施態樣的部分立體圖。 FIG. 26 is a partial perspective view of an embodiment of a conventional imprint carrier tape.

[圖27]係沿著圖26的F-F線段的剖面圖。 [FIG. 27] A sectional view along line F-F in FIG. 26. [FIG.

[圖28]係沿著圖26的G-G線段的剖面圖。 [FIG. 28] A sectional view taken along the line G-G in FIG. 26. [FIG.

[圖29]係表示本發明之包裝體的第2構造例的部分立體圖。 FIG. 29 is a partial perspective view showing a second structural example of the package of the present invention.

[圖30]係沿著圖29的H-H線段的剖面圖。 30 is a cross-sectional view taken along a line H-H in FIG. 29.

[圖31]係沿著圖29的J-J線段的剖面圖。 [FIG. 31] A sectional view taken along the line J-J in FIG. 29. [FIG.

[圖32]係表示本發明之包裝體的第3構造例的部分立體圖。 32 is a partial perspective view showing a third structural example of the package of the present invention.

[圖33]係沿著圖32的K-K線段的剖面圖。 [Fig. 33] A sectional view taken along the line K-K in Fig. 32. [Fig.

[圖34]係沿著圖32的L-L線段的剖面圖。 [FIG. 34] A sectional view along line L-L in FIG. 32. [FIG.

[圖35]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第2實施態樣的縱剖面圖。 [Fig. 35] Fig. 35 is a longitudinal sectional view showing a second embodiment of a sheet manufacturing apparatus for a carrier tape used in a method for manufacturing a sheet for a carrier tape of the present invention.

[圖36]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第3實施態樣的縱剖面圖。 [Fig. 36] Fig. 36 is a longitudinal sectional view showing a third embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

[圖37]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第4實施態樣的縱剖面圖。 [Fig. 37] Fig. 37 is a longitudinal sectional view showing a fourth embodiment of the apparatus for manufacturing a carrier tape sheet used in the method for manufacturing a carrier tape sheet according to the present invention.

[圖38]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第5實施態樣的縱剖面圖。 [Fig. 38] Fig. 38 is a longitudinal cross-sectional view showing a fifth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

[圖39]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第6實施態樣縱剖面圖。 [Fig. 39] Fig. 39 is a longitudinal sectional view showing a sixth embodiment of a device for producing a sheet for a carrier tape used in a method for producing a sheet for a carrier tape of the present invention.

[圖40]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第7實施態樣縱剖面圖。 [Fig. 40] Fig. 40 is a longitudinal sectional view showing a seventh embodiment of a sheet manufacturing apparatus for a carrier tape used in a method for manufacturing a sheet for a carrier tape of the present invention.

[圖41]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第8實施態樣縱剖面圖。 [Fig. 41] Fig. 41 is a longitudinal sectional view showing an eighth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

[圖42]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第9實施態樣縱剖面圖。 42 is a longitudinal sectional view showing a ninth embodiment of the apparatus for manufacturing a sheet for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

[圖43]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第10實施態樣縱剖面圖。 [Fig. 43] Fig. 43 is a longitudinal sectional view showing a tenth embodiment of the apparatus for manufacturing a sheet for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

[圖44]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第11實施態樣縱剖面圖。 [Fig. 44] A longitudinal sectional view showing an eleventh embodiment of a manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

[圖45]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第12實施態樣縱剖面圖。 [FIG. 45] A longitudinal sectional view showing a twelfth embodiment of the apparatus for manufacturing a sheet for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

[圖46]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第13實施態樣縱剖面圖。 [Fig. 46] Fig. 46 is a longitudinal sectional view showing a thirteenth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

[圖47]係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第14實施態樣縱剖面圖。 [Fig. 47] Fig. 47 is a longitudinal sectional view showing a fourteenth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

以下,根據附圖所示之較佳實施態樣詳細說明本發明之製作載送帶用片材、製作載送帶用片材的製造方法以及包裝體。 Hereinafter, a sheet for a carrier tape, a method for producing a sheet for a carrier tape, and a packaging body according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.

首先,在說明本發明之製作載送帶用片材、製作載送帶用片材的製造方法之前,先針對本發明的包裝體(使用本發明的製作載送帶用片材所得到的包裝體)進行說明。 First, before describing the sheet for the carrier tape and the method for producing the sheet for the carrier tape of the present invention, first, a package of the present invention (a package obtained by using the sheet for the carrier tape of the present invention) Body).

<包裝體> <Package body>

<<第1構造例>> << First Structure Example >>

圖1係表示本發明之包裝體的第1構造例的部分立體圖。圖2係沿著圖1的A-A線段的剖面圖。圖3係沿著圖1的B-B線段的剖面圖。圖4係表示圖1的包裝體所具備之電子零件收納用載送帶的俯視圖。另外,在以下的說明中,將圖1~3中的上側稱為「上」,將下側稱為「下」,將圖4中的紙面前側稱為「上」,將紙面後側稱為「下」。另外,在圖1中,為了顯示出收納於包裝體所具備之載送帶的第1凹部內的電子零件,將包裝體所具備之上覆蓋帶的任意一部分除去。另外,為了更清楚顯示出第1凹部的內部,將電子零件從前頭的口袋內省略。 FIG. 1 is a partial perspective view showing a first structural example of a package of the present invention. Fig. 2 is a sectional view taken along the line A-A in Fig. 1. Fig. 3 is a sectional view taken along the line B-B in Fig. 1. FIG. 4 is a plan view showing an electronic component storage carrier tape included in the package of FIG. 1. In the following description, the upper side in FIGS. 1 to 3 is referred to as “upper”, the lower side is referred to as “down”, the front side of the paper in FIG. 4 is referred to as “upper”, and the rear side of the paper surface is referred to as "under". In addition, in FIG. 1, in order to show the electronic component accommodated in the 1st recessed part of the carrier tape provided in the package body, any part of the upper cover tape provided in the package body is removed. In addition, in order to show the inside of the first recess more clearly, the electronic component is omitted from the front pocket.

包裝體100包含:具備收納電子零件40的第1凹部(電子零件收納用凹部;口袋)12的電子零件收納用載送帶(以下亦簡稱為「載送帶」)1;以及封裝載送帶1的第1凹部12的開口的上覆蓋帶(以下亦簡稱為「覆蓋帶」)20。 The package 100 includes an electronic component storage carrier tape (hereinafter also simply referred to as a “carrier tape”) 1 including a first recessed portion (recession for electronic component storage; pocket) 12 that stores the electronic component 40; and a packaged carrier tape. The upper cover tape (hereinafter also simply referred to as the “cover tape”) 20 of the opening of the first recessed portion 12 of 1.

圖1~3所示之載送帶1,係由帶狀的片材10所構成,為樹脂製。該載送帶1的上側的第1面15具有:沿著其長邊方向配置成1列的複數個第1凹部12;以及以與複數個第1凹部12形成平行的方式配置成1列的複數個饋送孔11。 The carrier tape 1 shown in FIGS. 1 to 3 is made of a resin sheet, and is made of a belt-shaped sheet 10. The first surface 15 on the upper side of the carrier tape 1 includes a plurality of first recessed portions 12 arranged in a row along the longitudinal direction thereof, and a plurality of first recessed portions 12 arranged in parallel to the plurality of first recessed portions 12. The plurality of feeding holes 11.

另外,在本實施態樣中,載送帶1的第1面15的相反側(下側)的第2面13形成幾近平坦。 In addition, in this embodiment, the second surface 13 on the opposite side (lower side) of the first surface 15 of the carrier tape 1 is formed to be almost flat.

換言之,在本實施態樣中,載送帶1具有:向第1面15側開放的有底的第1凹部12;以及貫通第1面15以及第2面13的饋送孔11。第2面13,係由相對於第1凹部12的底部以及其外周部位附近而言實質上並無高低差的平面所構成。 In other words, in this embodiment, the carrier tape 1 includes a bottomed first recessed portion 12 that is open to the first surface 15 side, and a feed hole 11 penetrating the first surface 15 and the second surface 13. The second surface 13 is a flat surface having substantially no height difference with respect to the bottom of the first concave portion 12 and the vicinity of the outer peripheral portion thereof.

如圖1所示的,複數個第1凹部12,沿著帶狀的片材10的長邊方向,以在第1面15上並排成1列的方式等間隔設置。該等第1凹部12,構成可各自收納電子零件40的構造。 As shown in FIG. 1, a plurality of first recesses 12 are provided at regular intervals along the long side direction of the band-shaped sheet 10 so as to be aligned in a row on the first surface 15. The first recessed portions 12 have a structure capable of accommodating each of the electronic components 40.

另外,在本實施態樣中,如圖1、2所示的,電子零件40其整體形狀呈長方體狀。收納電子零件40的第1凹部12的形狀也對應電子零件40的整體形狀而呈長方體狀。因此,第1凹部12的俯視形狀呈長方形,惟亦可對應所欲收納之電子零件40的形狀,而呈三角形、五角形、六角形等多角形或圓形等形狀。 In addition, in this embodiment, as shown in FIGS. 1 and 2, the overall shape of the electronic component 40 is a rectangular parallelepiped. The shape of the first recessed portion 12 accommodating the electronic component 40 also has a rectangular parallelepiped shape corresponding to the overall shape of the electronic component 40. Therefore, the first recessed portion 12 has a rectangular shape in plan view, but may have a polygonal shape such as a triangle, a pentagon, or a hexagon, or a circular shape according to the shape of the electronic component 40 to be stored.

另外,為了提高電子零件吸附嘴的拾取效率等特性,亦可於第1凹部12的內周圍面沿著載送帶1的厚度方向形成凸條或是凹條。 In addition, in order to improve the pick-up efficiency and the like of the electronic component suction nozzle, a convex strip or a concave strip may be formed on the inner peripheral surface of the first concave portion 12 along the thickness direction of the carrier tape 1.

再者,亦可於第1凹部12的底面設置高低差。藉此,例如,當在電子零件40的底面形成有端子等構件時,便可防止該端子與第1凹部12的底面接觸。因此,便可在載送帶1進行輸送時等情況下,確實地防止端子等構件發生破損。 Furthermore, a step may be provided on the bottom surface of the first recessed portion 12. Accordingly, for example, when a member such as a terminal is formed on the bottom surface of the electronic component 40, the terminal can be prevented from contacting the bottom surface of the first recessed portion 12. Therefore, it is possible to reliably prevent members such as terminals from being damaged when the carrier tape 1 is being conveyed.

如圖1、2所示的,複數個饋送孔11,以與複數個第1凹部12形成平行列的方式,並排成1列且等間隔設置。該等饋送孔11,係在將收納於第1凹部12的電子零件40餵料給表面安裝機時使用。 As shown in FIGS. 1 and 2, the plurality of feeding holes 11 are arranged side by side at a regular interval so as to form a parallel row with the plurality of first concave portions 12. These feeding holes 11 are used when feeding the electronic components 40 stored in the first recessed portion 12 to the surface mounting machine.

另外,饋送孔11的尺寸,在載送帶1的短邊方向的寬度為8mm的情況下,其平均內徑宜設定在Φ1.5~1.6mm左右,更宜設定在Φ1.5~1.55mm左右。在載送帶1的短邊方向的寬度為4mm的情況下,饋送孔11的尺寸,其平均內徑宜設定在Φ0.76~0.84mm左右,更宜設定在Φ0.78~0.82mm左右。藉此,便可確實地實施使用了饋送孔11的包裝體100對表面安裝機的餵料。 In addition, when the width of the feeding hole 11 in the short-side direction of the carrier tape 1 is 8 mm, the average inner diameter thereof should be set to about Φ 1.5 to 1.6 mm, and more preferably set to Φ 1.5 to 1.55 mm. about. In the case where the width of the short-side direction of the carrier tape 1 is 4 mm, the average inner diameter of the size of the feed hole 11 should be set to about 0.76 to 0.84 mm, and more preferably set to about 0.78 to 0.82 mm. Thereby, the feeding of the package 100 using the feed hole 11 to a surface mounter can be performed reliably.

另外,複數個第1凹部12與複數個饋送孔11均以沿著片材10的長邊方向並排成1列的方式設置,惟第1凹部12以及饋送孔11的配置間隔並無特別限定,例如,可如圖4(a)、(b)所示的,在該長邊方向上,於2個饋送孔11之間配置2個以上的第1凹部12,亦可如圖4(c)所示的,於2個饋送孔11之間配置1個第1凹部12。 In addition, the plurality of first recessed portions 12 and the plurality of feed holes 11 are arranged side by side along the longitudinal direction of the sheet 10, but the arrangement intervals of the first recessed portions 12 and the feed holes 11 are not particularly limited. For example, as shown in FIGS. 4 (a) and (b), two or more first recesses 12 may be arranged between the two feeding holes 11 in the long direction, or as shown in FIG. 4 (c). As shown in FIG. 1), a first concave portion 12 is arranged between the two feeding holes 11.

另外,當設置為圖4(a)的構造時,可使用:載送帶1的短邊方向的寬度為8mm,各饋送孔11的長邊方向的間隔為4mm,第1凹部12的間隔為2mm的構造(a1);載送帶1的短邊方向的寬度為8mm,各饋送孔11的長邊方向的間隔為2mm,第1凹部12的間隔為1mm的構造(a2);以及載送帶1的短邊方向的寬度為4mm,各饋送孔11的長邊方向的間隔為2mm,第1凹部12的間隔為1mm的構造(a3)。各構造(a1)、(a2)以及(a3)中的F1,宜設定為0±0.05mm,更宜設定為0±0.03mm。各構造(a1)、(a2)以及(a3)中的F2,宜分別設定為2±0.05mm、1±0.05mm以及1±0.05mm,更宜分別設定為2±0.03mm、1±0.03mm以及1±0.03mm。各構造(a1)、(a2)以及(a3)中的G,宜分別設定為3.5±0.05mm、 3.5±0.05mm以及1.8±0.05mm,更宜分別設定為3.5±0.03mm、3.5±0.03mm以及1.8±0.03mm。 In addition, when the structure shown in FIG. 4 (a) is provided, the width of the short-side direction of the carrier tape 1 is 8 mm, the interval of the long-side direction of each feed hole 11 is 4 mm, and the interval of the first recesses 12 is Structure (a1) of 2 mm; structure (a2) in which the width of the short-side direction of the carrier tape 1 is 8 mm, the interval in the long-side direction of each feed hole 11 is 2 mm, and the interval between the first recesses 12 is 1 mm; A structure in which the width in the short-side direction of the belt 1 is 4 mm, the interval in the long-side direction of each feed hole 11 is 2 mm, and the interval between the first recesses 12 is 1 mm (a3). F1 in each of the structures (a1), (a2), and (a3) should be set to 0 ± 0.05mm, and more preferably 0 ± 0.03mm. F2 in each structure (a1), (a2), and (a3) should be set to 2 ± 0.05mm, 1 ± 0.05mm, and 1 ± 0.05mm, and more preferably 2 ± 0.03mm and 1 ± 0.03mm, respectively. And 1 ± 0.03mm. G in each structure (a1), (a2), and (a3) should be set to 3.5 ± 0.05mm, 3.5 ± 0.05mm and 1.8 ± 0.05mm, more preferably set to 3.5 ± 0.03mm, 3.5 ± 0.03mm and 1.8 ± 0.03mm respectively.

另外,當設置為圖4(b)的構造時,可使用:載送帶1的短邊方向的寬度為8mm,各饋送孔11的長邊方向的間隔為4mm,第1凹部12的間隔為1mm的構造(b)。該構造(b)中的F1,宜設定為0±0.05mm,更宜設定為0±0.03mm。構造(b)中的F2,宜設定為1±0.05mm,更宜設定為1±0.03mm。構造(b)中的F3,宜設定為2±0.05mm,更宜設定為2±0.03mm。構造(b)中的F4,宜設定為3±0.05mm,更宜設定為3±0.03mm。構造(b)中的G,宜設定為3.5±0.05mm,更宜設定為3.5±0.03mm。 In addition, when the structure shown in FIG. 4 (b) is provided, the width of the short-side direction of the carrier tape 1 is 8 mm, the interval of the long-side direction of each feed hole 11 is 4 mm, and the interval of the first recesses 12 is 1mm construction (b). F1 in the structure (b) should be set to 0 ± 0.05mm, and more preferably set to 0 ± 0.03mm. F2 in structure (b) should be set to 1 ± 0.05mm, more preferably 1 ± 0.03mm. F3 in structure (b) should be set to 2 ± 0.05mm, more preferably 2 ± 0.03mm. F4 in structure (b) should be set to 3 ± 0.05mm, more preferably 3 ± 0.03mm. G in the structure (b) should be set to 3.5 ± 0.05mm, and more preferably set to 3.5 ± 0.03mm.

再者,當設置為圖4(c)的構造時,可使用:載送帶1的短邊方向的寬度為8mm,各饋送孔11的長邊方向的間隔為4mm,第1凹部12的間隔為4mm的構造(c)。該構造(c)中的F2,宜設定為2±0.05mm,更宜設定為2±0.03mm。構造(c)中的G,宜設定為3.5±0.05mm,更宜設定為3.5±0.03mm。 When the structure shown in FIG. 4 (c) is used, the width of the short-side direction of the carrier tape 1 is 8 mm, the interval between the long-side directions of the feed holes 11 is 4 mm, and the interval between the first recesses 12 can be used. It is a 4mm structure (c). F2 in the structure (c) should preferably be set to 2 ± 0.05mm, and more preferably set to 2 ± 0.03mm. G in the structure (c) should be set to 3.5 ± 0.05mm, and more preferably set to 3.5 ± 0.03mm.

另外,在該等構造之中,設置為構造(a1)或是構造(a3)為較佳。藉此,便可更確實地實施使用了饋送孔11的包裝體100對表面安裝機的餵料。 Among these structures, it is preferable to provide the structure (a1) or the structure (a3). This makes it possible to more surely feed the package 100 to the surface mounter using the feed hole 11.

另外,本發明之包裝體100所具備的載送帶1為樹脂製。藉由使載送帶1為樹脂製,在將電子零件40餵料到表面安裝機時,便不會從載送帶1的本體產生像紙粉那樣的細微粉末。因此,可防止電子零件40的焊料接合不良或電子零件吸附 嘴堵塞的情況發生。再者,可防止因為第1凹部12內的起毛或吸濕而導致第1凹部12的尺寸發生變化。除此之外,更可防止在安裝時於剝離覆蓋帶20之際發生靜電所導致的帶電,進而使電子零件吸附嘴的拾取效率提高。藉此,便可充分對應清潔化處理,同時可提高貼帶以及表面安裝的穩定性,並提高生產效率。 The carrier tape 1 included in the packaging body 100 of the present invention is made of resin. By making the carrier tape 1 made of resin, when the electronic components 40 are fed to the surface mounting machine, fine powder such as paper powder is not generated from the body of the carrier tape 1. Therefore, it is possible to prevent poor solder joints of the electronic component 40 or adsorption of the electronic component. Mouth clogging occurs. Furthermore, it is possible to prevent a change in the size of the first recessed portion 12 due to fluff or moisture absorption in the first recessed portion 12. In addition, it is possible to prevent the charging caused by static electricity from occurring when the cover tape 20 is peeled off during mounting, thereby improving the pickup efficiency of the suction nozzle for electronic parts. Thereby, it can fully respond to cleaning treatment, and at the same time, it can improve the stability of the tape and the surface mounting, and improve the production efficiency.

另外,藉由使載送帶1為樹脂製,比起為紙製等的情況而言,片材10的強度會上升。藉此,即使在為了收納高度很低的電子零件40而使片材10的厚度較薄的情況下,也可防止在貼帶時或安裝時於輸送載送帶1之際,載送帶1的饋送孔11變形或載送帶1斷裂等情況的發生。藉此,便可充分防止輸送發生不良情況,進而使貼帶時的收納穩定性或安裝時的拾取效率提高,如是,便可提高貼帶以及表面安裝的穩定性,並提高生產效率。 In addition, when the carrier tape 1 is made of resin, the strength of the sheet 10 is increased compared to the case where it is made of paper or the like. This makes it possible to prevent the carrier tape 1 from being transported to the carrier tape 1 at the time of attaching or mounting the sheet 10 even when the thickness of the sheet 10 is thin in order to accommodate the electronic components 40 having a very low height. Deformation of the feeding hole 11 or breakage of the carrier tape 1 occurs. Thereby, it is possible to fully prevent the occurrence of a defect in the conveyance, and further improve the storage stability at the time of tape application or the pick-up efficiency at the time of installation.

另外,構成載送帶1的樹脂,雖無特別限定,惟可舉例如聚苯乙烯、聚乙烯、聚丙烯、聚酯(聚對苯二甲酸乙二酯等)、聚碳酸酯、聚氯乙烯、聚醯胺、聚縮醛等的各種樹脂(各種熱可塑性樹脂),並組合使用該等樹脂之中的1種或是2種以上。另外,可因應需要,於該等樹脂中混合碳黑、石墨、碳纖維等的導電性填料。藉此,便可對載送帶1賦與導電性,防止帶電,故可防止靜電破壞電子零件40。另外,亦可因應需要,添加發泡劑或潤滑劑等的各種添加劑。再者,亦可在載送帶1的表面上形成由矽氧系樹脂、氟系樹脂等樹脂所構成的剝離劑,或具有導電性的覆膜等。另外,載送帶1的片材10的膜層構造,可為滿足該等要件的單層或是多層構造。 The resin constituting the carrier tape 1 is not particularly limited, but examples thereof include polystyrene, polyethylene, polypropylene, polyester (polyethylene terephthalate), polycarbonate, and polyvinyl chloride. And various resins (such as various thermoplastic resins) such as polyamide, polyacetal, and polyacetal, and one or more of these resins are used in combination. In addition, conductive fillers such as carbon black, graphite, and carbon fiber may be mixed with these resins as needed. This makes it possible to impart conductivity to the carrier tape 1 and prevent electrification, so that static electricity can be prevented from damaging the electronic component 40. In addition, various additives such as a foaming agent and a lubricant may be added as required. Further, a release agent composed of a resin such as a silicone resin, a fluorine resin, or a conductive film may be formed on the surface of the carrier tape 1. The film structure of the sheet 10 of the carrier tape 1 may be a single-layer or multi-layer structure that satisfies these requirements.

另外,在本實施態樣中,第1凹部12形成於載送帶1的第1面15,載送帶1的第1面15的相反側的第2面13為幾近平坦。亦即,第2面13,係由相對於第1凹部12的底部以及其外周部位附近而言實質上無高低差的平面所構成。因此,載送帶1,即使在使用沖孔載送帶或壓製載送帶用的貼帶機以及安裝機的情況下,亦可與沖孔載送帶或壓製載送帶同樣地使用。藉此,便無須投資新的設備等,可提高價格競爭力。另外,在將載送帶1捲繞於捲軸進行輸送時,由於第2面13幾近平坦,故可防止捲繞脫落或捲繞鬆弛的情況發生。藉此便可防止第1凹部12的變形或覆蓋帶20受到損傷。 In this embodiment, the first recessed portion 12 is formed on the first surface 15 of the carrier tape 1, and the second surface 13 on the opposite side of the first surface 15 of the carrier tape 1 is almost flat. That is, the second surface 13 is a flat surface having substantially no height difference with respect to the bottom of the first concave portion 12 and the vicinity of the outer peripheral portion thereof. Therefore, the carrier tape 1 can be used in the same manner as the punched carrier tape or the pressurized carrier tape even in the case of using an applicator or a mounting machine for the punched carrier tape or the pressurized carrier tape. By doing so, there is no need to invest in new equipment, etc., and price competitiveness can be improved. In addition, when the carrier tape 1 is wound around a reel for conveyance, the second surface 13 is almost flat, so that it is possible to prevent the winding from falling off or being loosened. This prevents deformation of the first recessed portion 12 and damage to the cover tape 20.

另外,藉由該等構造,便可提供一種與更加薄型化之電子零件對應的載送帶。第1凹部12的深度,係因應所包裝之電子零件40的大小,而適當設定者。亦即,電子零件40,由於係收納在載送帶1與覆蓋帶20之間所形成的內部空間中,故為了保護電子零件40不會受到保管時或輸送時的衝撃、污染等,宜以相對於電子零件40的高度設置些許餘隙(例如0~0.3mm)的方式設計第1凹部12。如是,伴隨今時今日的電子零件的薄型化,片材本體亦有薄型化之必要,故因此會有沖孔載送帶的強度不夠充分而發生斷裂等問題的可能性存在。另一方面,載送帶1,由於即使配合所包裝之電子零件40使第1凹部12的深度縮淺,也無使片材10自體的厚度薄型化之必要,故可在具有充分強度的情況下,與薄型化之電子零件對應。 In addition, with these structures, it is possible to provide a carrier tape corresponding to a thinner electronic component. The depth of the first recessed portion 12 is appropriately set in accordance with the size of the electronic component 40 to be packaged. That is, since the electronic component 40 is housed in the internal space formed between the carrier tape 1 and the cover tape 20, in order to protect the electronic component 40 from being washed away or contaminated during storage or transportation, it is preferable to The first recessed portion 12 is designed so as to provide a slight clearance (for example, 0 to 0.3 mm) with respect to the height of the electronic component 40. If so, with the thinning of today's electronic parts, the sheet body also needs to be thinned. Therefore, there may be problems such as insufficient strength of the punched carrier tape and breakage. On the other hand, the carrier tape 1 does not need to reduce the thickness of the sheet 10 itself even if the depth of the first recessed portion 12 is reduced in accordance with the packaged electronic components 40. Therefore, the carrier tape 1 can be used with sufficient strength. In the case, it corresponds to a thin electronic part.

另外,當第1凹部12的深度為A(mm),載送帶1的第1凹部12的底部的厚度為B(mm),載送帶1的該凹部以外的部分的厚度為C(mm)時,第1凹部12以 及載送帶1,宜以幾近滿足A+B=C的方式形成。所謂幾近滿足A+B=C,例如,滿足-0.1<C-(A+B)<0.1,更宜滿足-0.05<C-(A+B)<0.05。藉由以滿足該等數學式的方式形成第1凹部12以及載送帶1,便可使第2面13更平坦,並可防止將載送帶1捲繞於捲軸而進行保管或輸送時發生捲繞脫落或捲繞鬆弛的情況。 In addition, when the depth of the first recessed portion 12 is A (mm), the thickness of the bottom of the first recessed portion 12 of the carrier tape 1 is B (mm), and the thickness of the portion other than the recessed portion of the carrier tape 1 is C (mm) ), The first concave portion 12 starts with And the carrier belt 1 should be formed in a manner that almost meets A + B = C. The so-called almost satisfies A + B = C, for example, satisfies -0.1 <C- (A + B) <0.1, and more preferably satisfies -0.05 <C- (A + B) <0.05. By forming the first recessed portion 12 and the carrier tape 1 so as to satisfy these mathematical formulas, the second surface 13 can be made flatter, and it can be prevented from occurring when the carrier tape 1 is wound around a reel for storage or transportation. When the winding is loose or loose.

另外,第1凹部12的深度A係因應所包裝之電子零件40的高度而設定。當電子零件40的高度為Z(mm)時,第1凹部12的深度A宜滿足0≦A-Z≦0.3,更宜滿足0.05≦A-Z≦0.15。第1凹部12的深度A與電子零件40的高度Z的關係在該較佳範圍內,可提高貼帶時的收納穩定性或安裝時的拾取效率,並可防止電子零件40因為載送帶1的保管時或輸送時的衝撃、污染等而受到損傷。另外,載送帶1的第1凹部12以外的部分的厚度C與載送帶1的片材10的厚度幾乎不變。在此,C的厚度宜在0.1mm以上1.0mm以下,更宜在0.2mm以上0.5mm以下。厚度C在該較佳範圍內,可提高載送帶1的生產效率,而且,可防止載送帶1的饋送孔11變形或載送帶1斷裂等問題。 The depth A of the first recessed portion 12 is set in accordance with the height of the electronic component 40 to be packaged. When the height of the electronic component 40 is Z (mm), the depth A of the first concave portion 12 should satisfy 0 ≦ A-Z ≦ 0.3, and more preferably satisfy 0.05 ≦ A-Z ≦ 0.15. The relationship between the depth A of the first recessed portion 12 and the height Z of the electronic component 40 is within this preferred range, which can improve the storage stability during tape application or the pick-up efficiency during installation, and prevent the electronic component 40 from being damaged by the carrier tape 1. Damaged due to shock, contamination, etc. during storage or transportation. The thickness C of the portion other than the first recessed portion 12 of the carrier tape 1 and the thickness of the sheet 10 of the carrier tape 1 are almost unchanged. Here, the thickness of C is preferably 0.1 mm to 1.0 mm, and more preferably 0.2 mm to 0.5 mm. The thickness C is within this preferred range, which can improve the production efficiency of the carrier tape 1 and prevent problems such as deformation of the feed holes 11 of the carrier tape 1 or breakage of the carrier tape 1.

另外,第1凹部12的尺寸係因應所包裝之電子零件40的尺寸而設定。當第1凹部12的尺寸為D(mm)×E(mm),且D≦E,電子零件40的尺寸為X(mm)×Y(mm),且X≦Y時,第1凹部12的尺寸以及電子零件40的尺寸,宜滿足0<D-X≦0.3、0<E-Y≦0.3,更宜滿足0.05≦D-X≦0.15、0.05≦E-Y≦0.15。第1凹部12的尺寸以及電子零件40的尺寸在該較佳範圍內,可提高貼帶時的收納 穩定性或安裝時的拾取效率,並可防止電子零件40因為載送帶1的保管時或輸送時的衝撃、污染等而受到損傷。 The size of the first recessed portion 12 is set in accordance with the size of the electronic component 40 to be packaged. When the size of the first recessed portion 12 is D (mm) × E (mm), and D ≦ E, the size of the electronic component 40 is X (mm) × Y (mm), and X ≦ Y, the The size and the size of the electronic component 40 should satisfy 0 <DX ≦ 0.3, 0 <EY ≦ 0.3, and more preferably 0.05 ≦ DX ≦ 0.15, 0.05 ≦ EY ≦ 0.15. The size of the first recessed portion 12 and the size of the electronic component 40 are within this preferable range, which can improve the storage during tape application. Stability or pick-up efficiency during installation can prevent the electronic component 40 from being damaged due to impact, contamination, and the like during storage or transportation of the carrier tape 1.

另外,載送帶1,係以第2面13為捲軸(芯材)側,在捲繞狀態下保管、輸送。此時所使的捲軸,其直徑宜在5~300mm左右,更宜在30~250mm左右。 In addition, the carrier tape 1 has the second surface 13 as a reel (core material) side, and is stored and transported in a wound state. The diameter of the reel used at this time should be about 5 ~ 300mm, more preferably about 30 ~ 250mm.

在此,當第1凹部12所收納之電子零件40係如圖2所示的長方形構件時,電子零件40的俯視尺寸,若以前述的Y(mm)×X(mm)方式記載,通常會使用0.6mm×0.5mm、0.6mm×0.3mm、0.4mm×0.2mm的尺寸的電子零件40。然後,據說未來將會使用0.3mm×0.15mm,0.2mm×0.1mm的尺寸者。因此,第1凹部12係收納Y(mm)為0.2~0.6mm左右、X(mm)為0.1~0.5mm左右的尺寸的電子零件40。 Here, when the electronic component 40 accommodated in the first recessed portion 12 is a rectangular member as shown in FIG. 2, if the plan view size of the electronic component 40 is described in the aforementioned Y (mm) × X (mm) method, it is usually Electronic components 40 having dimensions of 0.6 mm × 0.5 mm, 0.6 mm × 0.3 mm, and 0.4 mm × 0.2 mm were used. Then, it is said that the size of 0.3mm × 0.15mm and 0.2mm × 0.1mm will be used in the future. Therefore, the first recessed portion 12 stores electronic components 40 having a size of Y (mm) of about 0.2 to 0.6 mm and X (mm) of about 0.1 to 0.5 mm.

另外,該等電子零件40的高度Z(mm)通常係設定在0.1~0.35mm左右。 In addition, the height Z (mm) of the electronic components 40 is usually set to about 0.1 to 0.35 mm.

在載送帶1所捲繞之捲軸的直徑φ為F(mm),且於捲繞之際,假定第1凹部12的開口部側(亦即覆蓋帶20側)為平坦的情況下,第1凹部12的深度A的變化量G(mm),經過本發明人檢討的結果,發現可用下述式(1)表示。此時,變化量G(mm),由於係以使第1凹部12的深度A變小的方式作用,故第1凹部12的實質上的深度為A-G(mm)。 When the diameter φ of the reel wound by the carrier tape 1 is F (mm), and at the time of winding, it is assumed that the opening portion side of the first recessed portion 12 (that is, the cover tape 20 side) is flat. The change amount G (mm) of the depth A of the recessed portion 12 was found by the present inventors to find that it can be expressed by the following formula (1). At this time, since the amount of change G (mm) acts to reduce the depth A of the first recessed portion 12, the substantial depth of the first recessed portion 12 is A-G (mm).

另外,於捲繞之際,在假定第1凹部12的底部側為平坦的情況下,第1凹部12的深度A的變化量H(mm)可用下述式(2)表示。此時,變化量H(mm),由於係以使第1凹部12的深度A變大的方式作用,故第1凹部12的實質上的深度為A+H(mm)。 When the bottom side of the first recessed portion 12 is assumed to be flat during winding, the change amount H (mm) of the depth A of the first recessed portion 12 can be expressed by the following formula (2). At this time, since the amount of change H (mm) acts to increase the depth A of the first recessed portion 12, the substantial depth of the first recessed portion 12 is A + H (mm).

於是,若使用上述式(1)以及式(2),在將上述該等尺寸的電子零件40收納於第1凹部12內的狀態下,求出載送帶1捲繞於直徑5~300mm的捲軸時的變化量G以及變化量H,則變化量G以及變化量H係分別在2.0×10-5~1.33×10-2mm以及2.0×10-5~1.46×10-2mm的範圍內。 Then, if the above-mentioned formulas (1) and (2) are used, in a state where the electronic components 40 of these sizes are housed in the first recessed portion 12, the carrier tape 1 is wound around a diameter of 5 to 300 mm. The amount of change G and the amount of change H during reeling, the amount of change G and the amount of change H are in the range of 2.0 × 10 -5 to 1.33 × 10 -2 mm and 2.0 × 10 -5 to 1.46 × 10 -2 mm .

另外,以第1凹部12的俯視大小比電子零件40的俯視大小縱横均大0.05mm,第1凹部12的底部的厚度為0.1mm,且第1凹部12的深度與電子零件40的高度的差(A-Z)為0.15mm的態樣為代表例,求出該變化量G以及變化量H。 In addition, the plan view size of the first recessed portion 12 is 0.05 mm larger than the plan view size of the electronic component 40, and the thickness of the bottom of the first recessed portion 12 is 0.1 mm. The difference between the depth of the first recessed portion 12 and the height of the electronic component 40 A case where (AZ) is 0.15 mm is a representative example, and the change amount G and the change amount H are obtained.

因此,若將第1凹部12的深度與電子零件40的高度的差(A-Z)如上所述的設定在較佳範圍0.05≦A-Z≦0.15左右,則變化量G以及變化量H便均比差(A -Z)更小。因此,即使將載送帶1捲繞於上述該等直徑的捲軸,亦可確實地抑制或是防止電子零件40突破覆蓋帶20或是使覆蓋帶20產生捲繞皺褶。再者,由於可更強而穩固地實行載送帶1相對於捲軸的捲繞,故可確實地防止捲繞脫落或捲繞鬆弛的發生。 Therefore, if the difference (AZ) between the depth of the first recessed portion 12 and the height of the electronic component 40 is set to a preferable range of 0.05 ≦ AZ ≦ 0.15 as described above, the change amount G and the change amount H are both worse than A -Z) is smaller. Therefore, even if the carrier tape 1 is wound on a reel having the diameters as described above, it is possible to reliably suppress or prevent the electronic component 40 from breaking through the cover tape 20 or causing the cover tape 20 to generate a wrinkle. Furthermore, since the winding of the carrier tape 1 with respect to the reel can be performed more strongly and stably, it is possible to reliably prevent the occurrence of the winding off or the slack.

另外,該第1凹部12的內側的緣部14,宜以曲率半徑在0.2mm以下的方式彎曲,更宜在0.1mm以下。藉由使第1凹部12以該等方式彎曲,即使在包裝薄型的電子零件40的情況下,亦可使與第1凹部12的底面正交的側壁面的直線部擴大。藉此,便可防止凹部的側壁面從底部擴展到緣部,故可提高電子零件40的收納穩定性。 The inner edge portion 14 of the first recessed portion 12 is preferably bent so that the radius of curvature is 0.2 mm or less, and more preferably 0.1 mm or less. By bending the first recessed portion 12 in such a manner, the linear portion of the side wall surface orthogonal to the bottom surface of the first recessed portion 12 can be enlarged even when the thin electronic component 40 is packaged. Thereby, the side wall surface of the recessed portion can be prevented from expanding from the bottom to the edge portion, so the storage stability of the electronic component 40 can be improved.

圖1、2所示之覆蓋帶20形成帶狀。覆蓋帶20,在第1凹部12內收納了電子零件40的狀態下貼合於載送帶1的第1面15。 The cover tape 20 shown in FIGS. 1 and 2 is formed in a band shape. The cover tape 20 is bonded to the first surface 15 of the carrier tape 1 in a state where the electronic component 40 is housed in the first recessed portion 12.

藉由設置成上述構造,第1凹部12的開口便可被覆蓋帶20所封裝。如是,使用具備載送帶1與覆蓋帶20的包裝體100,便可於第1凹部12收納電子零件40。 By providing the above structure, the opening of the first recessed portion 12 can be sealed by the cover tape 20. In this case, the electronic component 40 can be stored in the first recessed portion 12 by using the package 100 including the carrier tape 1 and the cover tape 20.

該覆蓋帶20,可與載送帶1同樣以樹脂構成。構成覆蓋帶20的樹脂,可使用與載送帶1所列舉之樹脂相同者。 This cover tape 20 can be made of resin similarly to the carrier tape 1. The resin constituting the cover tape 20 can be the same as those listed for the carrier tape 1.

該等載送帶1與覆蓋帶20,例如,可利用熱密封方式接合。熱密封,係使用密封機,沿著覆蓋帶20的長邊的各邊緣進行。另外,載送帶1與覆蓋帶20,亦可取代熱密封,而使用接合劑接合。 The carrier tape 1 and the cover tape 20 can be joined by, for example, heat sealing. Heat sealing is performed along each edge of the long side of the cover tape 20 using a sealer. In addition, the carrier tape 1 and the cover tape 20 may be bonded using an adhesive instead of heat sealing.

該等包裝體100,藉由沿著包裝體100的長邊方向拉掉覆蓋帶20,便可使覆蓋帶20從載送帶1剝離,藉此,便可取出電子零件40。 In these packages 100, the cover tape 20 can be peeled from the carrier tape 1 by pulling the cover tape 20 along the longitudinal direction of the package 100, whereby the electronic component 40 can be taken out.

另外,該包裝體100,係以第2面13為捲軸(芯材)側進行捲繞、保管以及輸送。藉此,便可節省包裝體100的保管時以及輸送時的空間。 The package 100 is wound, stored, and transported with the second surface 13 as the reel (core material) side. This can save space during storage and transportation of the package 100.

<製作載送帶用片材> <Making Sheet for Carrier Tape>

具有以上構造的包裝體100,如前所述的,可藉由將載送帶1與覆蓋帶20貼合而製得。構成該包裝體100的具備第1凹部12與饋送孔11的載送帶1,係將製作載送帶用片材155,以包含沿著其長邊方向配置的複數個第1凹部12與複數個饋送孔11在內的方式按既定的寬度裁切(切斷)所製得。 The packaging body 100 having the above structure can be produced by bonding the carrier tape 1 and the cover tape 20 as described above. The carrier tape 1 including the first recessed portion 12 and the feed hole 11 constituting the package 100 will be formed into a carrier tape sheet 155 including a plurality of first recessed portions 12 and a plurality of The feed holes 11 are made by cutting (cutting) a predetermined width.

以下,針對該製作載送帶用片材(本發明的製作載送帶用片材)155進行說明。 Hereinafter, the sheet for manufacturing a carrier tape (sheet for manufacturing a carrier tape of the present invention) 155 will be described.

圖5係表示製作載送帶用片材的部分立體圖。圖6係沿著圖5的A-A線段的剖面圖。圖7係沿著圖5的B-B線段的剖面圖。另外,在以下的說明中,將圖5~7中的上側稱為「上」,將下側稱為「下」。 Fig. 5 is a partial perspective view showing the production of a sheet for a carrier tape. Fig. 6 is a sectional view taken along the line A-A in Fig. 5. Fig. 7 is a sectional view taken along the line B-B in Fig. 5. In the following description, the upper side in FIGS. 5 to 7 is referred to as “upper”, and the lower side is referred to as “lower”.

圖5~7所示之製作載送帶用片材(以下亦簡稱為「製作用片材」)155,係由帶狀的片材151所構成,為樹脂製。該製作載送帶用片材155具有:形成於第1面15側,沿著其長邊方向配置的複數個第1凹部12;與複數個第1凹部12平行配置的複數個饋送孔11;以及與複數個第1凹部12平行配置的複數個第2凹部(位置修正用凹部)16。亦即,本發明之製作載送帶用片材的特徵為,除了沿著片材151的長邊方向配置的複數個第1凹部12、複數個饋送孔11之外,更具有複數個第2凹部(位置修正用凹部)16。 The sheet for producing a carrier tape shown in FIGS. 5 to 7 (hereinafter also simply referred to as a “sheet for production”) 155 is composed of a sheet-like sheet 151 and is made of resin. The sheet 155 for producing a carrier tape has a plurality of first recessed portions 12 formed on the first surface 15 side and arranged along the longitudinal direction thereof, and a plurality of feed holes 11 arranged in parallel with the plurality of first recessed portions 12; And a plurality of second recessed portions (position correction recessed portions) 16 arranged in parallel with the plurality of first recessed portions 12. That is, the manufacturing method of the sheet for the carrier tape of the present invention is characterized by having a plurality of second recesses 12 and a plurality of feeding holes 11 arranged along the longitudinal direction of the sheet 151, and a plurality of second holes Concave portion (concave portion for position correction) 16.

另外,在本實施態樣中,製作載送帶用片材155的第1面15的相反側的第2面13形成幾近平坦。 In addition, in this embodiment, the second surface 13 opposite to the first surface 15 of the carrier tape sheet 155 is produced to be almost flat.

如圖5所示的,複數個第1凹部12,以沿著帶狀的片材151的長邊方向在第1面15上並排成2列的方式等間隔設置。再者,複數個第1凹部12的2列,以互相平行的方式沿著該長邊方向設置。另外,如圖5所示的,複數個饋送孔11,以與複數個第1凹部12的排列平行,且在第1面15上並排成2列的方式等間隔設置。再者,2列的複數個饋送孔11,以互相平行的方式沿著該長邊方向設置。再者,如圖5所示的,複數個第2凹部16,以與複數個第1凹部12的排列平行,且在第1面15上並排成2列的方式等間隔設置。再者,2列的複數個第2凹部16,以互相平行的方式沿著該長邊方向設置。 As shown in FIG. 5, the plurality of first concave portions 12 are provided at regular intervals so as to be aligned in two rows on the first surface 15 along the long-side direction of the band-shaped sheet 151. In addition, two rows of the plurality of first concave portions 12 are provided along the longitudinal direction so as to be parallel to each other. In addition, as shown in FIG. 5, the plurality of feeding holes 11 are provided at regular intervals so as to be parallel to the arrangement of the plurality of first recessed portions 12 and arranged in two rows on the first surface 15. In addition, a plurality of feed holes 11 in two rows are provided along the long side direction in parallel to each other. Further, as shown in FIG. 5, the plurality of second recessed portions 16 are arranged at regular intervals so as to be parallel to the arrangement of the plurality of first recessed portions 12 and arranged in two rows on the first surface 15. In addition, a plurality of second recessed portions 16 in two rows are provided along the longitudinal direction so as to be parallel to each other.

再者,沿著該長邊方向並排的複數個第1凹部12的排列,與沿著該長邊方向並排的複數個饋送孔11的排列,分別以互相平行的方式,沿著製作載送帶用片材155的短邊方向交替配置。然後,沿著該長邊方向並排的複數個第2凹部16的排列,以夾著沿著該長邊方向並排的複數個第1凹部12的排列以及沿著該長邊方向並排的複數個饋送孔11的排列的方式,在製作用片材155的短邊方向的端部側,分別以與沿著該長邊方向並排的複數個第1凹部12的排列平行的方式配置。 Further, the arrangement of the plurality of first recesses 12 side by side along the long side direction and the arrangement of the plurality of feed holes 11 side by side along the long side direction are parallel to each other along the production carrier tape. The short sides of the sheets 155 are alternately arranged. Then, the arrangement of the plurality of second recesses 16 side by side along the long side direction is to sandwich the arrangement of the plurality of first recesses 12 side by side along the long side direction and the plurality of feeds side by side along the long side direction. The arrangement of the holes 11 is arranged parallel to the arrangement of the plurality of first recessed portions 12 side by side in the longitudinal direction on the end side in the short-side direction of the production sheet 155.

將上述構造的製作載送帶用片材155,以包含1列的複數個第1凹部12與1列的複數個饋送孔11為1對,且剔除複數個第2凹部16的排列的方式,沿著製作用片材155的長邊方向,按既定的寬度裁切製作用片材155。藉此,製得2條載送帶1。更具體而言,製作用片材155,在其短邊方向的兩端部側,具有可沿著製作用片材155的長邊方向切斷而除去的2個部分(被除去部),2列的複數個第2凹部16,分別形成於各被除去部(切斷部)。藉由沿著圖5中所示之3條想像線裁切(切斷)該等製作用片材155,便可製造出2條具備1列的複數個第1凹部12與1列的複數個饋送孔11為1對的載送帶1。 Forming the carrier tape sheet 155 having the above-mentioned structure so that the plurality of first recesses 12 in one row and the plurality of feed holes 11 in one row are a pair, and the arrangement of the plurality of second recesses 16 is eliminated, The production sheet 155 is cut to a predetermined width along the longitudinal direction of the production sheet 155. Thereby, two carrier tapes 1 were obtained. More specifically, the production sheet 155 has two portions (removed portions) that can be removed by cutting along the longitudinal direction of the production sheet 155 at both end portions in the short-side direction, 2 A plurality of second concave portions 16 in a row are formed in each removed portion (cut portion). By cutting (cutting) the production sheets 155 along the three imaginary lines shown in FIG. 5, two pieces of the first recesses 12 and one piece of the plurality of pieces having one line can be manufactured. The feed holes 11 are a pair of carrier tapes 1.

本發明之特徵為,該等製作載送帶用片材155具備第2凹部(位置修正用凹部)16。具體而言,該第2凹部16,在後述的製作載送帶用片材155的製造方法中,係用來使複數個饋送孔11以相對於複數個第1凹部12平行的方式設置。亦即,第2凹部16,係用來使饋送孔11相對於第1凹部12以優良的位置精度設置。 The present invention is characterized in that the sheet 155 for producing a carrier tape includes a second recessed portion (a recessed portion for position correction) 16. Specifically, the second recessed portion 16 is used to provide a plurality of feed holes 11 in parallel to the plurality of first recessed portions 12 in a manufacturing method of a carrier tape sheet 155 described later. That is, the second recessed portion 16 is used to provide the feeding hole 11 with excellent position accuracy with respect to the first recessed portion 12.

當該第2凹部16的深度為J(mm),製作載送帶用片材155的第2凹部16的底部的厚度為K(mm),製作用片材155的該第1凹部以及第2凹部以外的部分的厚度為C(mm)時,第2凹部16宜以幾近滿足J+K=C的方式形成。所謂幾近滿足J+K=C,例如,滿足-0.1<C-(J+K)<0.1,更宜滿足-0.05<C-(J+K)<0.05。藉由滿足該式,便可使第2面13更平坦,並可防止將製作用片材155捲繞於捲軸而進行保管或輸送時發生捲繞脫落或捲繞鬆弛的情況。 When the depth of the second recessed portion 16 is J (mm), the thickness of the bottom of the second recessed portion 16 of the carrier sheet 155 is K (mm), and the first recessed portion and the second of the manufacturing sheet 155 are formed. When the thickness of the portion other than the recessed portion is C (mm), the second recessed portion 16 is preferably formed so as to almost satisfy J + K = C. The so-called almost satisfies J + K = C, for example, satisfies -0.1 <C- (J + K) <0.1, and more preferably satisfies -0.05 <C- (J + K) <0.05. By satisfying this formula, the second surface 13 can be made flatter, and it is possible to prevent the roll-off or slack from occurring when the production sheet 155 is wound on a reel for storage or transportation.

另外,第2凹部16的深度J,會因為製作載送帶用片材155的該第1凹部12以及第2凹部16以外的部分的厚度C而變化。第2凹部16的深度J,宜滿足C-0.15≦J≦C-0.05,更宜滿足C-0.13≦J≦C-0.07。藉由使第2凹部16的深度J在該較佳範圍內,便可在製作用片材155的製造方法中,將位置修正用導件以及位置控制用導件收納於第2凹部16,同時可確實地防止在收納該等構件時第2凹部16破損斷裂。 The depth J of the second recessed portion 16 is changed by the thickness C of the portion other than the first recessed portion 12 and the second recessed portion 16 in which the sheet 155 for a carrier tape is produced. The depth J of the second concave portion 16 should satisfy C-0.15 ≦ J ≦ C-0.05, and more preferably satisfy C-0.13 ≦ J ≦ C-0.07. By setting the depth J of the second recessed portion 16 to be within this preferable range, the position correction guide and the position control guide can be stored in the second recessed portion 16 in the manufacturing method of the manufacturing sheet 155, and It is possible to reliably prevent the second recessed portion 16 from being broken and broken when the members are stored.

另外,該第2凹部16的內側的緣部18,宜以曲率半徑在0.2mm以下的方式彎曲,更宜在0.1mm以下。第2凹部16設置成該等構造,可使與第2凹部16的底面正交的側壁面的直線部擴大。藉此,可防止第2凹部16的側壁面從底部擴展到緣部,故可確實地將位置修正用導件以及位置控制用導件收納於第2凹部16內。 The inner edge portion 18 of the second recessed portion 16 is preferably bent so that the radius of curvature is 0.2 mm or less, and more preferably 0.1 mm or less. The second recessed portion 16 is provided with such a structure, and the linear portion of the side wall surface orthogonal to the bottom surface of the second recessed portion 16 can be enlarged. Thereby, since the side wall surface of the second recessed portion 16 can be prevented from expanding from the bottom to the edge portion, the position correction guide and the position control guide can be reliably housed in the second recessed portion 16.

另外,使該製作載送帶用片材155,以第1面15或是第2面13為捲軸(芯材)側捲繞、保管以及輸送,藉此便可節省製作用片材155在保管時以及輸送時的空間。另外,此時所使用的捲軸,其直徑宜為5~300mm左右,更宜為30~250mm 左右。藉此,便可節省製作用片材155在保管時以及輸送時的空間,並可利用該捲繞,確實地抑制或是防止第1凹部12、第2凹部16以及饋送孔11意外變形。 In addition, by making the sheet 155 for the carrier tape to be wound, stored, and conveyed with the first surface 15 or the second surface 13 as the reel (core material) side, the production sheet 155 can be saved during storage. Time and space during transportation. In addition, the diameter of the reel used at this time should be about 5 ~ 300mm, more preferably 30 ~ 250mm about. Thereby, the space for the production sheet 155 during storage and transportation can be saved, and the winding can be used to reliably suppress or prevent the first recessed portion 12, the second recessed portion 16, and the feeding hole 11 from being deformed accidentally.

另外,在本實施態樣中,在製作載送帶用片材155中,2列的複數個第1凹部12,係以互相平行的方式沿著該長邊方向設置。然後,2列的複數個饋送孔11,係以互相平行的方式沿著該長邊方向設置。在此係以從該製作用片材155可製造出2條載送帶1的製作用片材155為一例進行說明,然而製作用片材155並非僅限於該等構造。例如,亦可複數個第1凹部12的排列設置2列,然後,複數個饋送孔11的排列設置1列,並從該製作用片材155製造出1條載送帶1。再者,亦可複數個第1凹部12的排列以互相平行的方式沿著該長邊方向設置3列以上,然後,複數個饋送孔11的排列以互相平行的方式沿著該長邊方向設置3列以上,並從該製作用片材155製造出3條以上的載送帶1。 In addition, in the present embodiment, in the production of the carrier tape sheet 155, the plurality of first recesses 12 in two rows are provided along the longitudinal direction so as to be parallel to each other. Then, a plurality of feeding holes 11 in two rows are provided along the longitudinal direction in a parallel manner. Here, the manufacturing sheet 155 which can manufacture two carrier tapes 1 from this manufacturing sheet 155 is demonstrated as an example, However, the manufacturing sheet 155 is not limited to these structures. For example, two rows of the first recessed portions 12 may be arranged, and then one row of the plurality of feed holes 11 may be arranged, and one carrier tape 1 may be manufactured from the production sheet 155. Furthermore, the arrangement of the plurality of first recesses 12 may be arranged in parallel with each other in three or more rows along the longitudinal direction, and then the arrangement of the plurality of feed holes 11 may be arranged in parallel with each other along the longitudinal direction. Three or more rows, and three or more carrier tapes 1 are manufactured from the production sheet 155.

<製作載送帶用片材製造裝置> <A sheet manufacturing apparatus for producing a carrier tape>

<<第1實施態樣>> << First Implementation Aspect >>

如以上所述之構造的製作載送帶用片材155,可藉由應用本發明之製作載送帶用片材的製造方法製得。以下,首先,針對該製作載送帶用片材155的製造方法所使用之製作載送帶用片材製造裝置進行說明。 The carrier tape sheet 155 structured as described above can be produced by applying the manufacturing method for producing a carrier tape sheet of the present invention. Hereinafter, a sheet manufacturing apparatus for manufacturing a carrier tape used in the manufacturing method of manufacturing the carrier tape sheet 155 will be described first.

以下,針對該製作載送帶用片材製造裝置的第1實施態樣進行說明。圖8係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第1實施態樣的立體圖。圖9係圖8的C方向端視圖。另外,在以下的說明中, 將圖8中的上側稱為「上」,將下側稱為「下」。再者,在圖9中,為了方便說明,將製作載送帶用片材製造裝置所具備之沖孔模具以圖8中的D-D線段的剖面圖表示。 Hereinafter, a first embodiment of the sheet manufacturing apparatus for manufacturing a carrier tape will be described. FIG. 8 is a perspective view showing a first embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention. FIG. 9 is an end view in the C direction of FIG. 8. In the following description, The upper side in FIG. 8 is called "upper", and the lower side is called "lower". In addition, in FIG. 9, for convenience of explanation, a punching die included in the sheet manufacturing apparatus for producing a carrier tape is shown as a cross-sectional view taken along a line D-D in FIG. 8.

圖8、9所示之製作載送帶用片材製造裝置500具有:片材供給部(T型模頭)600;成形部800;以及具備沖孔模具900的沖孔部。 The sheet manufacturing apparatus 500 for manufacturing a carrier tape shown in FIGS. 8 and 9 includes a sheet supply section (T-die) 600, a forming section 800, and a punching section including a punching die 900.

片材供給部,在本實施態樣中,係由與圖中未顯示的壓出機以及壓出機的熔融樹脂吐出部連接的T型模頭600所構成。利用該T型模頭600,便可對成形部800供給熔融狀態或是軟化狀態的帶狀熔融片材(片材)。 The sheet supply unit in this embodiment is formed of a T-die 600 connected to an extruder (not shown) and a molten resin ejection unit of the extruder. With this T-die 600, a molten sheet or sheet-shaped molten sheet (sheet) can be supplied to the forming section 800.

T型模頭600,係用壓出成形法(壓出機)將熔融狀態或是軟化狀態的熔融片材150以形成帶狀片材的狀態壓出的壓出成形部(送出成形部)。於T型模頭600,裝填了構成前述載送帶1(製作載送帶用片材155)的樹脂處於熔融狀態的熔融樹脂,藉由將該熔融樹脂從T型模頭600所具有的開口部601壓出,形成帶狀片材的熔融狀態或是軟化狀態的熔融片材150便連續地送出。藉由像這樣利用壓出成形法製得熔融片材150的構造,可使所形成之載送帶1的片材的厚度趨於穩定。 The T-die 600 is an extrusion-molded part (feed-out forming part) that extrudes the molten sheet 150 in a molten state or a softened state by a press-forming method (extruder) to form a band-shaped sheet. The T-die 600 is filled with a molten resin in which the resin constituting the carrier tape 1 (making the carrier tape sheet 155) is in a molten state, and the molten resin is removed from the opening provided in the T-die 600. The portion 601 is extruded, and the molten sheet 150 in a molten state or a softened state that forms a band-shaped sheet is continuously fed out. With the structure in which the molten sheet 150 is produced by the extrusion molding method as described above, the thickness of the sheet of the carrier tape 1 formed can be stabilized.

成形部800具有:接觸輥子110;冷卻輥子120;以及後段冷卻輥子130、140。該等輥子,構成分別藉由圖中未顯示的馬達(驅動機構)而各自單獨旋轉的構造。藉由令該等輥子旋轉,將片材151連續地送出。藉由將熔融片材150連續地 送入該成形部800,便可在熔融片材150的第1面15側形成第1凹部12以及第2凹部16,同時使熔融片材150的第2面13平坦化。 The forming section 800 includes a contact roller 110, a cooling roller 120, and rear-stage cooling rollers 130 and 140. These rollers are each configured to be individually rotated by a motor (drive mechanism) not shown in the figure. By rotating the rollers, the sheet 151 is continuously fed out. By continuously melting the sheet 150 After being fed into the forming portion 800, the first recessed portion 12 and the second recessed portion 16 can be formed on the first surface 15 side of the molten sheet 150, and the second surface 13 of the molten sheet 150 can be planarized.

冷卻輥子(第1輥子)120具有:冷卻機構,其將T型模頭600所供給之處於熔融狀態的熔融片材150冷卻;以及成形模具220,其在外周面具備:第1模具部200,其具有用來形成第1凹部12的突起物201;以及第2模具部210,其具有用來形成第2凹部16的突起物211。 The cooling roller (first roller) 120 includes a cooling mechanism that cools the molten sheet 150 supplied from the T-die 600 in a molten state, and a forming die 220 that includes a first die portion 200 on the outer peripheral surface, It has a protrusion 201 for forming the first recessed portion 12, and a second mold part 210 with a protrusion 211 for forming the second recessed portion 16.

在本實施態樣中,成形模具220所具備之第1模具部200,具有在冷卻輥子120的外周面的周圍方向等間隔設置的複數個突起物201。另外,成形模具220所具備之第2模具部210,具有在冷卻輥子120的外周面的周圍方向等間隔設置的複數個突起物211。該等構造的第1模具部200以及第2模具部210,分別在冷卻輥子120的外周面成對地設置。另外,第1模具部200以及第2模具部210,配置成2個第1模具部200在中心部位側,2個的第2模具部210在邊緣部位側,以2個第2模具部210夾住2個第1模具部200。令熔融片材150抵壓於該等冷卻輥子120,便可在該第1面15形成第1凹部12以及第2凹部16,同時將熔融片材150冷卻。 In this embodiment, the first mold part 200 included in the molding die 220 has a plurality of protrusions 201 provided at regular intervals in the peripheral direction of the outer peripheral surface of the cooling roller 120. The second mold portion 210 included in the molding die 220 includes a plurality of protrusions 211 provided at regular intervals in the peripheral direction of the outer peripheral surface of the cooling roller 120. The first mold part 200 and the second mold part 210 having such structures are provided in pairs on the outer peripheral surface of the cooling roller 120, respectively. In addition, the first mold portion 200 and the second mold portion 210 are arranged such that two first mold portions 200 are on the center portion side, and two second mold portions 210 are on the edge portion side and sandwiched by two second mold portions 210. The two first mold sections 200 are held. When the molten sheet 150 is pressed against the cooling rollers 120, the first recessed portion 12 and the second recessed portion 16 can be formed on the first surface 15, and the molten sheet 150 can be cooled at the same time.

接觸輥子(第2輥子)110,為外周面具有平滑性的輥子,與冷卻輥子(第1輥子)120對向配置。藉由對該等接觸輥子110與冷卻輥子120之間供給熔融片材150,便可使熔融片材150的第2面13平坦化。另外,藉由使接觸輥子110與冷卻輥子120之間的間隙寬度平均一致,便可使熔融片材150的厚度平均一致,並可提高在第1面15上的第1凹部12以及第2凹部16的成形度。 The contact roller (second roller) 110 is a roller having a smooth outer peripheral surface, and is opposed to the cooling roller (first roller) 120. By supplying the molten sheet 150 between the contact rollers 110 and the cooling rollers 120, the second surface 13 of the molten sheet 150 can be flattened. In addition, by uniformizing the gap width between the contact roller 110 and the cooling roller 120, the thickness of the molten sheet 150 can be uniformed, and the first concave portion 12 and the second concave portion on the first surface 15 can be increased. Formability of 16.

後段冷卻輥子130、140,均具備使熔融片材150冷卻的冷卻機構,並配置在接觸輥子110以及冷卻輥子120的後段。另外,在本實施態樣中,後段冷卻輥子140比後段冷卻輥子130配置在更後段。更詳細而言,後段冷卻輥子130與冷卻輥子120對向配置,然後,後段冷卻輥子140與後段冷卻輥子130對向配置。藉由對該等後段冷卻輥子130、140供給熔融片材150,便可更確實地使熔融片材150冷卻。 Each of the rear-stage cooling rollers 130 and 140 is provided with a cooling mechanism for cooling the molten sheet 150 and is disposed at the rear stage of the contact roller 110 and the cooling roller 120. In addition, in this embodiment, the rear-stage cooling roller 140 is disposed at a later stage than the rear-stage cooling roller 130. More specifically, the rear-stage cooling roller 130 and the cooling-roll 120 are arranged to face each other, and then the rear-stage cooling roller 140 and the rear-stage cooling roll 130 are arranged to face each other. By supplying the molten sheet 150 to the subsequent-stage cooling rollers 130 and 140, the molten sheet 150 can be cooled more reliably.

另外,在本實施態樣中,接觸輥子110、冷卻輥子120以及後段冷卻輥子130,140,以該等輥子的中心位在一直線上的方式配置。藉由像這樣配置輥子,便可使冷卻輥子120與熔融片材150的第1面15抵接直到冷卻輥子120旋轉180°為止,並使後段冷卻輥子130與熔融片材150的第2面13抵接直到後段冷卻輥子130旋轉180°為止,然後使後段冷卻輥子140與熔融片材150的第1面15抵接直到後段冷卻輥子140旋轉90°為止。藉此,由於係在各冷卻輥子120、130、140與熔融片材150的第1面15以及第2面13交替抵接的狀態下,使熔融片材150受到冷卻,故可確實地防止在第1面15或是第2面13側產生了翹曲的狀態下使熔融片材150被冷卻。 In addition, in this embodiment, the contact roller 110, the cooling roller 120, and the rear-stage cooling rollers 130 and 140 are arranged such that the centers of the rollers are positioned on a straight line. By arranging the rollers in this manner, the cooling roller 120 can be brought into contact with the first surface 15 of the molten sheet 150 until the cooling roller 120 rotates 180 °, and the rear cooling roller 130 and the second surface 13 of the molten sheet 150 can be made to abut. The abutment is performed until the rear-stage cooling roller 130 rotates 180 °, and then the rear-stage cooling roller 140 abuts against the first surface 15 of the molten sheet 150 until the rear-stage cooling roller 140 rotates 90 °. Thereby, since the cooling sheet 120, 130, 140 and the first surface 15 and the second surface 13 of the molten sheet 150 are alternately abutted, the molten sheet 150 is cooled, so that it can be reliably prevented The molten sheet 150 is cooled in a state where warpage occurs on the first surface 15 or the second surface 13 side.

藉由對該等成形部800中的冷卻輥子120與接觸輥子110之間供給熔融片材150,便可在第1面15側形成第1凹部12以及第2凹部16,並使第2面13平坦化。 By supplying the molten sheet 150 between the cooling roller 120 and the contact roller 110 in the forming portion 800, the first concave portion 12 and the second concave portion 16 can be formed on the first surface 15 side, and the second surface 13 can be formed. flattened.

另外,藉由將通過冷卻輥子120與接觸輥子110之間的熔融片材150供給到冷卻輥子120與後段冷卻輥子130之間,然後再供給到後段冷卻輥子130與後段冷卻輥子140之間,便可使熔融片材150冷卻。 In addition, by supplying the molten sheet 150 passing between the cooling roller 120 and the contact roller 110 between the cooling roller 120 and the rear cooling roller 130, and then between the rear cooling roller 130 and the rear cooling roller 140, The molten sheet 150 may be cooled.

另外,在本實施態樣中,係針對冷卻輥子120具有冷卻機構,而接觸輥子110不具有冷卻機構的情況進行說明,惟並不限於該等情況,只要冷卻輥子120以及接觸輥子110的至少其中一方具有冷卻機構即可,亦可接觸輥子110具有冷卻機構,而冷卻輥子120不具有冷卻機構,或是冷卻輥子120與接觸輥子110雙方均具有冷卻機構。 In addition, in this embodiment, the case where the cooling roller 120 has a cooling mechanism and the contact roller 110 does not have a cooling mechanism is described, but it is not limited to these cases, as long as at least one of the cooling roller 120 and the contact roller 110 is provided. One side may have a cooling mechanism, and the contact roller 110 may have a cooling mechanism, while the cooling roller 120 does not have a cooling mechanism, or both the cooling roller 120 and the contact roller 110 may have a cooling mechanism.

沖孔部係由圖中未顯示的沖壓機、圖中未顯示的片材搬運裝置以及沖孔模具900所構成。該沖孔模具900具有:支持台950,其支持(載置)從成形部800所供給的片材151;以及沖孔頭910,其藉由打穿片材151以在片材151上形成饋送孔11。將片材151送進該沖孔模具900,藉此以優良的位置精度形成貫通片材151的第1面15與第2面13的饋送孔11。 The punching section is composed of a punch (not shown), a sheet conveying device (not shown), and a punching die 900. This punching die 900 has a support table 950 that supports (places) the sheet 151 supplied from the forming section 800, and a punching head 910 that penetrates the sheet 151 to form a feed on the sheet 151 Hole 11. The sheet material 151 is fed into the punching die 900, whereby the feed holes 11 penetrating the first surface 15 and the second surface 13 of the sheet material 151 are formed with excellent positional accuracy.

沖孔頭910具有:第1基體920;配置在第1基體920的上側的第2基體930;配置在第1基體920的下側的壓制板(擋板)940;將前端部插入片材151所具備之第2凹部16的位置控制用導件923以及位置修正用導件932;以前端部控制片材151所形成之饋送孔11的位置之導件銷931;以及在片材151上形成饋送孔11的沖孔工具921。 The punching head 910 includes: a first base body 920; a second base body 930 arranged on the upper side of the first base body 920; a pressing plate (baffle plate) 940 arranged on the lower side of the first base body 920; The position control guide 923 and the position correction guide 932 of the second recessed portion 16 are provided; the guide pin 931 that controls the position of the feed hole 11 formed by the sheet 151 with the front end portion; and is formed on the sheet 151 The punching tool 921 of the feed hole 11.

第1基體920,其整體形狀為長方體狀。在其中央部位設置了貫通上下方向(厚度方向)的貫通孔,然後,在其長邊方向的兩端部分別設置了貫通上下方向的貫通孔。該第1基體920,配置成其長邊方向與片材151的搬運方向(行進方向)一致。然後,在複數個貫通孔之中,於中央部位的貫通孔配置了沖孔工具921,並於兩端部的貫通孔分別插通有位置控制用導件923。 The first base body 920 has a rectangular parallelepiped shape as a whole. A through hole penetrating in the vertical direction (thickness direction) is provided at a central portion thereof, and a through hole penetrating in the vertical direction is provided at both ends in the longitudinal direction. The first substrate 920 is arranged such that the longitudinal direction of the first substrate 920 coincides with the conveyance direction (traveling direction) of the sheet 151. Then, among the plurality of through holes, a punching tool 921 is arranged in the through hole in the central portion, and a position control guide 923 is inserted into each of the through holes at both ends.

第2基體930,配置在第1基體920的上側,其整體形狀為長方體狀。另外,於第2基體930的底面,設置了形成開口的複數個孔部。導件銷931以及位置修正用導件932分別以其前端部突出的方式插通該等孔部。另外,導件銷931以及位置修正用導件932分別在其基端部受到彈簧材料933推壓的狀態下插通到該等孔部內。 The second base body 930 is disposed above the first base body 920 and has a rectangular parallelepiped shape as a whole. In addition, a plurality of holes are formed in the bottom surface of the second base 930 to form openings. The guide pin 931 and the position correction guide 932 are inserted through the hole portions so that their tip portions protrude. In addition, the guide pin 931 and the position correction guide 932 are inserted into the hole portions in a state where the base end portion is pressed by the spring material 933, respectively.

沖孔工具921具有複數個突起物922以及貫通上下方向的複數個貫通孔。複數個突起物922,以從沖孔工具921的底面突出的方式設置成格子狀(在本實施態樣中為每次縱向2個、横向6個)。另外,位置修正用導件932以及導件銷931的前端側分別插通複數個貫通孔。該等沖孔工具921,以突起物922打穿片材151,藉此形成貫通該第1面15與第2面13的饋送孔11。 The punching tool 921 has a plurality of protrusions 922 and a plurality of through holes penetrating in the up-down direction. The plurality of protrusions 922 are arranged in a grid shape so as to protrude from the bottom surface of the punching tool 921 (in this embodiment, two in the vertical direction and six in the horizontal direction). The front ends of the position correction guide 932 and the guide pin 931 are respectively inserted into a plurality of through holes. The punching tools 921 penetrate the sheet 151 with the protrusions 922 to form the feed holes 11 penetrating the first surface 15 and the second surface 13.

壓制板940,配置在第1基體920的下側,由整體形狀為帶狀的板材所構成。另外,壓制板940具有貫通上下方向的複數個貫通孔。位置修正用導件932、導件銷931以及突起物922,分別以其前端部可突出的方式插通該等貫通孔。藉由 以該等壓制板940壓住供給到支持台950上的片材151,便可在以沖孔工具921打穿片材151時,確實地防止片材151發生位置偏差。 The pressing plate 940 is disposed on the lower side of the first base body 920 and is composed of a plate-like plate material as a whole. Further, the pressing plate 940 has a plurality of through holes penetrating in the vertical direction. The position correction guide 932, the guide pin 931, and the protrusion 922 are respectively inserted into the through holes so that the front end portions thereof can protrude. By By pressing the sheet 151 supplied to the support table 950 with the pressing plates 940, it is possible to reliably prevent the positional deviation of the sheet 151 when the sheet 151 is penetrated by the punching tool 921.

位置控制用導件923,係由整體形狀為四角柱狀的棒狀體所構成。另外,位置控制用導件923,插通設置在第1基體920的兩端部的貫通孔,其前端部從第1基體920的底面突出。藉由使用該等位置控制用導件923,將其前端部插入供給(搬運)到支持台950上的片材151所具備的第2凹部16,便可在以位置修正用導件932控制片材151所具備的第2凹部16的位置之前,先控制住片材151的位置,進而確實地提高設置於片材151的饋送孔11的位置精度。 The position control guide 923 is composed of a rod-shaped body having a quadrangular columnar shape as a whole. In addition, the position control guide 923 penetrates through holes provided at both end portions of the first base body 920, and a front end portion thereof protrudes from a bottom surface of the first base body 920. By using the position control guide 923 and inserting the front end of the position control guide 923 into the second recess 16 of the sheet 151 supplied to the support table 950, the position correction guide 932 can be used to control the sheet. Before the position of the second recessed portion 16 included in the material 151, the position of the sheet 151 is controlled, and the position accuracy of the feed hole 11 provided in the sheet 151 is surely improved.

導件銷931,係由半徑從基端側向前端側縮小的棒狀體所構成。另外,導件銷931,在其基端部受到彈簧材料933推壓的狀態下,插通第2基體930的孔部、沖孔工具921的貫通孔以及壓制板940的貫通孔。該導件銷931的前端部,從壓制板940的底面突出。藉由使用該等導件銷931,以其前端部,插通供給到支持台950上的片材151所形成的饋送孔11,便可控制片材151的位置,進而確實地提高設置於片材151的饋送孔11的位置精度。 The guide pin 931 is composed of a rod-shaped body having a radius reduced from the base end side to the front end side. In addition, the guide pin 931 is inserted into the hole portion of the second base body 930, the through hole of the punching tool 921, and the through hole of the pressing plate 940 in a state where the base end portion is pressed by the spring material 933. A front end portion of the guide pin 931 protrudes from a bottom surface of the pressing plate 940. By using the guide pin 931 and the front end portion thereof, the feed hole 11 formed by the sheet 151 supplied to the support table 950 can be inserted to control the position of the sheet 151, and the setting on the sheet can be reliably increased. Position accuracy of the feed hole 11 of the material 151.

位置修正用導件932,係由半徑從基端側向前端側縮小的棒狀體所構成。另外,位置修正用導件932,在其基端部受到彈簧材料933推壓的狀態下,插通第2基體930的孔部、沖孔工具921的貫通孔以及壓制板940的貫通孔。位置修正用導件932的前端部,從壓制板940的底面突出。藉由使用該等位置修正用導件932,將其前端部插入供給到支持台950上的片材151所具備的第2凹部16,便可在以壓 制板940壓住片材151的第1面15之前,先控制住片材151的位置,進而確實地提高設置於片材151的饋送孔11的位置精度。 The position correction guide 932 is formed of a rod-shaped body having a radius reduced from the base end side to the front end side. In addition, the position correction guide 932 is inserted into the hole portion of the second base body 930, the through hole of the punching tool 921, and the through hole of the pressing plate 940 in a state where the base end portion is pressed by the spring material 933. The front end portion of the position correction guide 932 protrudes from the bottom surface of the pressing plate 940. By using the position correction guide 932, the front end portion is inserted into the second recessed portion 16 provided in the sheet 151 supplied to the support table 950, and the Before the plate 940 presses the first surface 15 of the sheet 151, the position of the sheet 151 is controlled, and the position accuracy of the feed hole 11 provided in the sheet 151 is surely improved.

在該等位置控制用導件923、導件銷931以及位置修正用導件932之中,導件銷931,相對於沖孔工具921所具有之突起物922位於片材151的搬運方向(行進方向)的下游側(出口側)。在本實施態樣中,以2個導件銷931分別插通在片材151的短邊方向上互相對向的饋送孔11的方式設置了2組(亦即合計共4個)導件銷931。 Among the position control guide 923, the guide pin 931, and the position correction guide 932, the guide pin 931 is located in the conveying direction of the sheet 151 with respect to the protrusion 922 of the punching tool 921 (traveling) Direction) (downstream side). In this embodiment, two sets of guide pins (that is, a total of four guide pins) are provided in such a manner that the two guide pins 931 are respectively inserted into the feeding holes 11 facing each other in the short-side direction of the sheet 151. 931.

另外,位置修正用導件932,相對於沖孔工具921所具有之突起物922位於片材151的搬運方向的下游側以及上游側的雙方的外側。在本實施態樣中,在該上游側,2個位置修正用導件932,以分別插入在片材151的短邊方向上互相對向的第2凹部16的方式設置,在該下游側,2個位置修正用導件932,以分別插入在片材151的短邊方向上互相對向的第2凹部16的方式設置。 In addition, the position correction guide 932 is located on the outside of both the downstream side and the upstream side of the conveyance direction of the sheet 151 with respect to the projection 922 included in the punching tool 921. In this embodiment, on the upstream side, two position correction guides 932 are provided so as to be inserted into the second recessed portions 16 facing each other in the short-side direction of the sheet 151, and on the downstream side, The two position correction guides 932 are provided so as to be respectively inserted into the second recessed portions 16 facing each other in the short-side direction of the sheet 151.

再者,位置控制用導件923,相對於導件銷931以及位置修正用導件932位於片材151的搬運方向的下游側以及上游側的雙方的外側,亦即相對於沖孔工具921所具有之突起物922位於片材151的搬運方向的下游側以及上游側的雙方的外側。在本實施態樣中,在該上游側,2個位置控制用導件923以分別插入在片材151的短邊方向上互相對向的第2凹部16的方式設置,在該下游側,2個位置控制用導件923以分別插入在片材151的短邊方向上互相對向的第2凹部16的方式設置。 In addition, the position control guide 923 is located outside both the downstream side and the upstream side of the sheet 151 in the conveying direction with respect to the guide pin 931 and the position correction guide 932, that is, relative to the punching tool 921. The protrusions 922 are located outside both the downstream side and the upstream side in the conveyance direction of the sheet 151. In this embodiment, on the upstream side, two position control guides 923 are provided so as to be respectively inserted into the second recessed portions 16 facing each other in the short-side direction of the sheet 151, and on the downstream side, 2 The position control guides 923 are provided so as to be respectively inserted into the second recessed portions 16 facing each other in the short-side direction of the sheet 151.

另外,在本實施態樣中,利用該等位置控制用導件923、導件銷931以及位置修正用導件932,構成用以保持製作載送帶用片材155所具有之第1凹部12與饋送孔11的位置精度的位置修正機構。 In this embodiment, the position control guide 923, the guide pin 931, and the position correction guide 932 are used to form the first recess 12 for holding the carrier tape sheet 155. Position correction mechanism with position accuracy of the feeding hole 11.

支持台950具有:具備凹部的第3基體951;以及配置在該凹部內的承受板952。 The support base 950 includes a third base body 951 including a recessed portion, and a receiving plate 952 disposed in the recessed portion.

第3基體951,其整體形狀為長方體狀。在第3基體951的中央部位設置了與貫通上下方向(厚度方向)的貫通孔連通的凹部。在該凹部內配置了承受板952。 The third base 951 has a rectangular parallelepiped shape as a whole. A concave portion communicating with a through hole penetrating in the up-down direction (thickness direction) is provided in the center portion of the third base 951. A receiving plate 952 is arranged in the recess.

承受板952具有貫通上下方向的複數個貫通孔。複數個貫通孔,分別設置在對應位於其上側的沖孔工具921所具有之突起物922以及導件銷931的位置,當打穿片材151時,該等突起物922以及導件銷931可插入該等複數個貫通孔。 The receiving plate 952 has a plurality of through holes penetrating in the vertical direction. A plurality of through holes are respectively provided at positions corresponding to the protrusions 922 and the guide pin 931 of the punching tool 921 located on the upper side. When the sheet 151 is penetrated, the protrusions 922 and the guide pin 931 may be Insert the plurality of through holes.

另外,在本實施態樣中,係說明從沖孔工具921的底面以格子狀突出的突起物922設置成縱向2個、横向6個的一個實施例,惟該突起物的數目並非僅限於該等態樣。突起物的數目,可對應製作載送帶用片材155所設置之複數個饋送孔11的列數等設定為任意的數目。 In addition, in this embodiment, an embodiment in which protrusions 922 protruding in a grid shape from the bottom surface of the punching tool 921 are provided in two vertical and six horizontal directions is described. However, the number of the protrusions is not limited to this. Isomorphism. The number of the protrusions can be set to an arbitrary number in accordance with the number of rows of the plurality of feeding holes 11 provided for forming the carrier tape sheet 155 and the like.

<製作載送帶用片材的製造方法> <Manufacturing method for manufacturing sheet for carrier tape>

利用使用了以上所述的製作載送帶用片材製造裝置500的製作載送帶用片材的製造方法(本發明之製作載送帶用片材的製造方法),便可製得前述的製作載送帶用片材155。 The aforementioned method for manufacturing a carrier tape sheet (the manufacturing method for manufacturing a carrier tape sheet according to the present invention) using the sheet manufacturing apparatus 500 for manufacturing a carrier tape described above can be used to produce the aforementioned A sheet 155 for a carrier tape is produced.

圖10係表示圖8所示之製作載送帶用片材製造裝置所具備的各構件與片材的位置關係的俯視圖。圖11係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的俯視圖。圖12~15係用圖8所示之製作載送帶用片材製造裝置說明製作載送帶用片材的製造方法的剖面圖。圖16係表示位置控制用導件與第2凹部的位置關係的剖面圖。圖17係表示位置修正用導件與第2凹部的位置關係的剖面圖。圖18係表示導件銷與饋送孔的位置關係的剖面圖。圖19係表示圖8所示之製作載送帶用片材製造裝置所具備的各構件與片材的位置關係的俯視圖。圖20係表示導件銷與饋送孔的位置關係的俯視圖。圖21係表示饋送孔與第1凹部的位置關係的俯視圖。圖22係表示位置修正用導件與第2凹部的位置關係的俯視圖。另外,在以下的說明中,將圖12~15中的上側稱為「上」,將下側稱為「下」。再者,圖12~15的剖面圖,係表示圖10中的A-A線段的剖面圖,圖12(b)將位置控制用導件923的前端部位附近放大表示,除此以外的圖式,將沖孔工具921所具備之突起物922的前端部位附近放大表示。 FIG. 10 is a plan view showing a positional relationship between each member and a sheet included in the sheet manufacturing apparatus for producing a carrier tape shown in FIG. 8. FIG. 11 is a plan view illustrating a method for manufacturing a sheet for a carrier tape using the sheet manufacturing device for a carrier tape shown in FIG. 8. 12 to 15 are cross-sectional views illustrating a method for manufacturing a sheet for a carrier tape using the sheet manufacturing apparatus for a carrier tape shown in FIG. 8. 16 is a cross-sectional view showing a positional relationship between a position control guide and a second recessed portion. 17 is a cross-sectional view showing a positional relationship between a position correction guide and a second recessed portion. 18 is a cross-sectional view showing a positional relationship between a guide pin and a feed hole. FIG. 19 is a plan view showing a positional relationship between each member and a sheet included in the sheet manufacturing apparatus for producing a carrier tape shown in FIG. 8. 20 is a plan view showing a positional relationship between a guide pin and a feed hole. FIG. 21 is a plan view showing a positional relationship between the feed hole and the first recessed portion. 22 is a plan view showing a positional relationship between a position correction guide and a second recessed portion. In the following description, the upper side in FIGS. 12 to 15 is referred to as "upper", and the lower side is referred to as "lower". 12 to 15 are cross-sectional views taken along the line AA in FIG. 10, and FIG. 12 (b) shows the vicinity of the front end portion of the position control guide 923 in an enlarged manner. The vicinity of the front end portion of the protrusion 922 included in the punching tool 921 is enlarged.

在本實施態樣中,電子零件收納用載送帶的製造方法具有:壓出步驟,其將形成帶狀片材的熔融狀態或是軟化狀態的熔融片材150壓出;成形步驟,其在片材151的第1面15上形成第1凹部12以及第2凹部16;冷卻步驟,其將片材151冷卻;以及沖孔步驟,其在片材151上加工製出饋送孔11。 In this aspect, the manufacturing method of the carrier tape for storage of electronic parts includes: an extrusion step, which extrudes the molten sheet 150 in a molten state or a softened state forming a band-shaped sheet, and a forming step, which is performed in A first recessed portion 12 and a second recessed portion 16 are formed on the first surface 15 of the sheet 151; a cooling step that cools the sheet 151; and a punching step that processes the feed hole 11 on the sheet 151.

以下,針對各步驟進行詳述。 Hereinafter, each step will be described in detail.

〔A〕首先,將形成帶狀片材的熔融狀態或是軟化狀態的熔融片材150壓出(壓出步驟)。 [A] First, the molten sheet 150 in a molten state or a softened state forming a band-shaped sheet is extruded (extrusion step).

在該壓出步驟中,將構成前述載送帶1(製作載送帶用片材155)的樹脂處於熔融狀態的熔融樹脂,從與圖中未顯示的壓出機的熔融樹脂吐出部連接的T型模頭600所具有的開口部601壓出,藉此連續地送出形成帶狀片材的熔融狀態或是軟化狀態的熔融片材150。 In this extrusion step, the molten resin in which the resin constituting the carrier tape 1 (making the carrier sheet 155) is in a molten state is connected from a molten resin ejection portion of an extruder (not shown). The opening portion 601 included in the T-die 600 is extruded, thereby continuously feeding the molten sheet 150 in a molten state or a softened state forming a band-shaped sheet.

換言之,將熔融狀態或是軟化狀態的熔融片材150從開口部601壓出,以壓出成形法形成膜層。 In other words, the molten sheet 150 in a molten state or a softened state is extruded from the opening 601, and a film layer is formed by an extrusion molding method.

〔B〕接著,在片材151的第1面15上形成第1凹部12以及第2凹部16(成形步驟)。 [B] Next, the first recessed portion 12 and the second recessed portion 16 are formed on the first surface 15 of the sheet 151 (forming step).

該成形步驟,係藉由對接觸輥子110與冷卻輥子120之間供給熔融片材150而進行。 This forming step is performed by supplying the molten sheet 150 between the contact roller 110 and the cooling roller 120.

冷卻輥子120的外周面(外周),具備成形模具220,其具有:第1模具部200,其形成具有複數個突起物201的輥子狀;第2模具部210,其形成具有複數個突起物211的輥子狀。複數個突起物201,配置成沿著冷卻輥子120的周圍方向等間隔 並排,然後,複數個突起物211,以在片材151的短邊方向上相對於複數個突起物201平行的方式,配置成沿著冷卻輥子120的周圍方向等間隔並排。因此,在熔融片材150的第1面15上,與突起物201的形狀對應的第1凹部12沿著片材151的供給方向(亦即片材151的長邊方向)複數、等間隔形成,然後,以在片材151的短邊方向上相對於複數個第1凹部12平行的方式,與突起物211的形狀對應的第2凹部16沿著片材151的長邊方向複數、等間隔形成。 An outer peripheral surface (outer periphery) of the cooling roller 120 is provided with a forming die 220 having a first die portion 200 formed in a roller shape having a plurality of protrusions 201 and a second die portion 210 formed having a plurality of protrusions 211 Roller-shaped. A plurality of protrusions 201 are arranged at regular intervals along the peripheral direction of the cooling roller 120 Then, the plurality of protrusions 211 are arranged side by side so as to be parallel to the plurality of protrusions 201 in the short-side direction of the sheet 151 so as to be parallel to each other along the peripheral direction of the cooling roller 120. Therefore, on the first surface 15 of the molten sheet 150, the first recessed portions 12 corresponding to the shape of the protrusion 201 are formed plurally at regular intervals along the feeding direction of the sheet 151 (that is, the long side direction of the sheet 151). Then, the second recessed portions 16 corresponding to the shape of the protrusion 211 are parallel to the plurality of first recessed portions 12 in the short-side direction of the sheet 151, and are plurally spaced at regular intervals along the long-side direction of the sheet 151. form.

像這樣,在本步驟〔B〕中,冷卻輥子120所具備之具有突起物201的第1模具部200,係用來形成第1凹部12;具有突起物211的第2模具部210,係用來形成第2凹部16。 As described above, in this step [B], the first mold portion 200 having the protrusion 201 provided in the cooling roller 120 is used to form the first recessed portion 12; and the second mold portion 210 having the protrusion 211 is used to To form a second recessed portion 16.

再者,由於接觸輥子110的外周面形成具有平滑性的輥子狀,故熔融片材150的第2面13因為抵壓於具有平滑性的外周面而平坦化。 Furthermore, since the outer peripheral surface of the contact roller 110 is formed into a roller shape having smoothness, the second surface 13 of the molten sheet 150 is flattened by pressing against the outer peripheral surface having smoothness.

像這樣,在本步驟〔B〕中,接觸輥子110係用來使第2面13平坦化。 In this manner, in this step [B], the contact roller 110 is used to flatten the second surface 13.

〔C〕接著,將片材151冷卻(冷卻步驟)。該冷卻步驟,係藉由將熔融片材150供給到冷卻輥子120與後段冷卻輥子130之間,之後供給到後段冷卻輥子130與後段冷卻輥子140之間而進行。 [C] Next, the sheet 151 is cooled (cooling step). This cooling step is performed by supplying the molten sheet 150 between the cooling roller 120 and the rear cooling roller 130 and then supplying the molten sheet 150 between the rear cooling roller 130 and the rear cooling roller 140.

藉此,在熔融片材150中,熔融片材150的第1面15抵接冷卻輥子120,直到冷卻輥子120旋轉180°為止,熔融片材150的第2面13抵接於後段冷卻輥子130,直 到後段冷卻輥子130旋轉180°為止,熔融片材150的第1面15抵接於後段冷卻輥子140,直到後段冷卻輥子140旋轉90°為止。 Thereby, in the molten sheet 150, the first surface 15 of the molten sheet 150 abuts on the cooling roller 120 until the cooling roller 120 rotates 180 °, and the second surface 13 of the molten sheet 150 abuts on the subsequent cooling roller 130. ,straight Until the rear-stage cooling roller 130 rotates 180 °, the first surface 15 of the molten sheet 150 abuts on the rear-stage cooling roller 140 until the rear-stage cooling roller 140 rotates 90 °.

在此,在本實施態樣中,由於冷卻輥子120、後段冷卻輥子130以及後段冷卻輥子140均具備冷卻機構,故如上所述的,藉由熔融片材150與各輥子120、130、140的抵接(接觸),在第1面15上形成有第1凹部12以及第2凹部16的熔融片材150受到冷卻。結果,便可製得在第1面15上形成有第1凹部12以及第2凹部16的片材151。 Here, in this embodiment, since the cooling roller 120, the rear cooling roller 130, and the rear cooling roller 140 are all provided with a cooling mechanism, as described above, the molten sheet 150 and each of the rollers 120, 130, and 140 The molten sheet 150 in contact (contact) with the first recessed portion 12 and the second recessed portion 16 formed on the first surface 15 is cooled. As a result, a sheet 151 in which the first concave portion 12 and the second concave portion 16 are formed on the first surface 15 can be obtained.

另外,在本實施態樣中,係在熔融片材150的第1面15以及第2面13交替抵接各冷卻輥子120、130、140的狀態下,使熔融片材150受到冷卻。因此,可確實地防止在第1面15或是第2面13側產生了翹曲的狀態下使熔融片材150被冷卻。 In addition, in this embodiment, the molten sheet 150 is cooled in a state where the first surface 15 and the second surface 13 of the molten sheet 150 alternately abut each of the cooling rollers 120, 130, and 140. Therefore, the molten sheet 150 can be reliably prevented from being cooled in a state where warpage occurs on the first surface 15 or the second surface 13 side.

如以上所述的,在本步驟〔C〕中,具備冷卻機構的各冷卻輥子120、130、140,係用來將熔融片材150冷卻。 As described above, in this step [C], each of the cooling rollers 120, 130, and 140 provided with a cooling mechanism is used to cool the molten sheet 150.

〔D〕接著,對形成有第1凹部12以及第2凹部16的片材151,加工製出饋送孔11(沖孔步驟)。 [D] Next, the sheet 151 on which the first recessed portion 12 and the second recessed portion 16 are formed is processed to form a feed hole 11 (punching step).

對片材151加工(沖孔)製出該饋送孔11,係使用製作載送帶用片材製造裝置500所具有的沖孔模具900。 The sheet 151 is processed (punched) to produce the feeding hole 11 by using a punching die 900 included in the sheet manufacturing apparatus 500 for producing a carrier tape.

此時,在沖孔模具900對片材151的饋送孔11的第1次沖孔與第2次以後的沖孔中,沖孔模具900所具備之各部的用途不同。因此,以下,首先,針對沖孔模具900的第1次沖孔進行說明,接著,針對第2次沖孔進行說明。 At this time, in the first punching and the second punching of the feed hole 11 of the sheet 151 by the punching die 900, the parts of the punching die 900 have different uses. Therefore, hereinafter, the first punching of the punching die 900 will be described first, and then the second punching will be described.

<<第1次沖孔>> << The first punching >>

首先,進行沖孔模具900對片材151的饋送孔11的第1次沖孔,亦即用沖孔工具921施壓於片材151的最初的第1發。在第1次沖孔中,沖孔模具900所具備之各部,對應形成有第1凹部12以及第2凹部16的片材151的各部,以下述的方式配置。 First, the first punching of the feeding hole 11 of the sheet 151 by the punching die 900 is performed, that is, the first first shot of the sheet 151 is pressed with the punching tool 921. In the first punching, each part provided in the punching die 900 is arranged in the following manner corresponding to each part of the sheet 151 in which the first recessed part 12 and the second recessed part 16 are formed.

亦即,如圖10(a)所示的,當從上側觀察片材151時,位置修正用導件932,以在沖孔工具921所具有之突起物922的片材151的行進方向入口側與出口側的各外側,與第2凹部16對應的方式,將其前端部插入第2凹部16內。 That is, as shown in FIG. 10 (a), when the sheet 151 is viewed from the upper side, the position correction guide 932 is positioned on the entrance side of the sheet 151 in the traveling direction of the projection 922 included in the punching tool 921. In a manner corresponding to each outer side on the exit side, the front end portion is inserted into the second recessed portion 16 so as to correspond to the second recessed portion 16.

另外,位置控制用導件923,以在位置修正用導件932的片材151的行進方向入口側與出口側的各外側,亦即,沖孔工具921所具有之突起物922的片材151的行進方向入口側與出口側的各外側,與第2凹部16對應的方式,將其前端部插入第2凹部16內。 In addition, the position control guide 923 is the outer side of the inlet side and the exit side of the sheet 151 of the position correction guide 932 in the traveling direction, that is, the sheet 151 of the protrusion 922 included in the punching tool 921. Each of the outer sides of the inlet side and the outlet side of the traveling direction is inserted into the second concave portion 16 in a manner corresponding to the second concave portion 16.

再者,導件銷931,以在沖孔工具921所具有之突起物922的片材151的行進方向出口側,與片材151的第2次以後的沖孔所形成之饋送孔11的位置對應的方式,使其前端部與片材151抵接。 In addition, the guide pin 931 is positioned at the exit side of the sheet 151 in the traveling direction of the projection 922 included in the punching tool 921 and the position of the feed hole 11 formed by the second and subsequent punching of the sheet 151. In a corresponding manner, the front end portion thereof is brought into contact with the sheet 151.

以下,針對使用如是配置各部之沖孔模具900形成饋送孔11的方法依序進行說明。 Hereinafter, a method of forming the feed holes 11 using the punching die 900 in which the parts are arranged will be described in order.

〔D-1a〕首先,將如圖11(a)所示之形成有第1凹部12以及第2凹部16的片材151,從片材151的行進方向(搬運方向)的入口側(上游側)向出口側(下游側)搬運,進而將片材151搬運(供給)到支持台950上,亦即,支持台950與沖孔頭910之間[參照圖12(a)]。 [D-1a] First, as shown in FIG. 11 (a), the sheet 151 having the first recessed portion 12 and the second recessed portion 16 is formed from the entrance side (upstream side) of the sheet 151 in the traveling direction (conveying direction). ) Is conveyed to the exit side (downstream side), and the sheet 151 is further conveyed (supplied) to the support table 950, that is, between the support table 950 and the punching head 910 [see FIG. 12 (a)].

〔D-2a〕接著,使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,使位置控制用導件923相對於片材151的厚度方向往下側移動,藉此將位置控制用導件923的前端部插入第2凹部16內[參照圖12(b)]。藉此,第2凹部16被位置控制用導件923控制住位置。 [D-2a] Next, the punching head 910 is moved downward with respect to the thickness direction of the sheet 151, that is, the position control guide 923 is moved downward with respect to the thickness direction of the sheet 151, whereby The tip portion of the position control guide 923 is inserted into the second recessed portion 16 [see FIG. 12 (b)]. Thereby, the position of the second recessed portion 16 is controlled by the position control guide 923.

在此,於本步驟中,位置控制用導件923的前端部插入第2凹部16,位置控制用導件923的前端部的形狀與第2凹部16的形狀,例如,存在以下的關係。 Here, in this step, the front end portion of the position control guide 923 is inserted into the second recessed portion 16, and the shape of the front end portion of the position control guide 923 and the shape of the second recessed portion 16 have the following relationship, for example.

亦即,首先,例如圖16(A1)所示的,當位置控制用導件923的前端部的長度為P(mm),前端部的寬度為Q(mm)時,前端部形成前端部的寬度Q從基端向前端為一定的形狀,以對應該形狀的方式,當第2凹部16的深度為J(mm),底部的厚度為K(mm),寬度為L(mm),第1凹部以及第2凹部以外的部分的厚度為C(mm)時,第2凹部16形成第2凹部16的寬度L在深度(厚度)方向上為一定的形狀。 That is, first, for example, as shown in FIG. 16 (A1), when the length of the front end portion of the position control guide 923 is P (mm) and the width of the front end portion is Q (mm), the front end portion forms the front end portion. The width Q is a certain shape from the base end to the front end. In accordance with the shape, when the depth of the second recess 16 is J (mm), the thickness at the bottom is K (mm), and the width is L (mm). When the thickness of the recessed portion and portions other than the second recessed portion is C (mm), the width L of the second recessed portion 16 forming the second recessed portion 16 is constant in the depth (thickness) direction.

此時,位置控制用導件923的前端部的形狀與第2凹部16的形狀,宜以滿足J<P、0<L-Q≦0.06的方式形成,更宜以滿足0<L-Q≦0.03的方式形成。 At this time, the shape of the front end portion of the position control guide 923 and the shape of the second recessed portion 16 should be formed to satisfy J <P, 0 <LQ ≦ 0.06, and more preferably to satisfy 0 <LQ ≦ 0.03. .

然後,當V=(L-Q)/2、如後所述的以位置修正用導件932控制第2凹部16的位置之最大量為U(mm)、位置修正用導件932的前端部的寬度為N(mm)、U=(L-N)/2時,宜以滿足V<U,且滿足(L-Q)/2<(L-N)/2,然後,滿足Q>N的方式形成。 Then, when V = (LQ) / 2, as described later, the maximum amount of the position of the second recessed portion 16 controlled by the position correction guide 932 is U (mm), and the width of the front end portion of the position correction guide 932 When N (mm) and U = (LN) / 2, it should be formed by satisfying V <U and (LQ) / 2 <(LN) / 2, and then satisfying Q> N.

藉由使位置控制用導件923的前端部的形狀與第2凹部16的形狀以滿足該等關係的方式形成,便可如圖16(A2)、(A3)所示的,藉由於第2凹部16內插入與其形狀對應的位置控制用導件923的前端部,而如後所述的於第2凹部16內以更優良的精度收納與其形狀對應的位置修正用導件932的前端部,而不會發生位置偏差。 By forming the shape of the front end portion of the position control guide 923 and the shape of the second recessed portion 16 so as to satisfy the relationship, as shown in FIGS. 16 (A2) and (A3), the The front end portion of the position control guide 923 corresponding to its shape is inserted into the recessed portion 16, and the front end portion of the position correction guide 932 corresponding to its shape is housed in the second recessed portion 16 with better accuracy as described later. No position deviation occurs.

另外,例如圖16(B1)所示的,當位置控制用導件923的前端部的長度為P(mm),前端部的寬度為Q(mm)時,前端部形成前端部的寬度Q從基端向前端變短(變小)的形狀,以與該形狀對應的方式,當第2凹部16的深度為J(mm),底部的厚度為K(mm),寬度為L(mm),第1凹部以及第2凹部以外的部分的厚度為C(mm)時,第2凹部16形成第2凹部16的寬度L在深度(厚度)方向上向底部側變短的形狀。 In addition, for example, as shown in FIG. 16 (B1), when the length of the front end portion of the position control guide 923 is P (mm) and the width of the front end portion is Q (mm), the width of the front end portion forming the front end portion Q is from A shape in which the base end becomes shorter (smaller) toward the front end. In a manner corresponding to the shape, when the depth of the second recess 16 is J (mm), the thickness of the bottom is K (mm), and the width is L (mm), When the thickness of the portion other than the first recessed portion and the second recessed portion is C (mm), the second recessed portion 16 has a shape in which the width L of the second recessed portion 16 becomes shorter toward the bottom side in the depth (thickness) direction.

此時,當前端部的中心軸與前端部的側面所形成之角度為β(°),片材151的厚度方向與第2凹部16的內周圍面所形成之角度為θ(°)時,宜使位置控制用導件923的前端部的形狀與第2凹部16的形狀,以滿足β=θ、10°≦θ≦30°,且滿足L≦Q的方式形成。 At this time, when the angle formed by the central axis of the front end portion and the side surface of the front end portion is β (°), and the angle formed by the thickness direction of the sheet 151 and the inner peripheral surface of the second concave portion 16 is θ (°), The shape of the front end portion of the position control guide 923 and the shape of the second recessed portion 16 are preferably formed so as to satisfy β = θ, 10 ° ≦ θ ≦ 30 °, and satisfy L ≦ Q.

另外,如圖16(B2)所示的,當在片材151的厚度方向上,位置控制用導件923的前端部與片材151的第1面15一致時的前端部的中心軸與第2凹部16的前端部之位置偏差的大小為V(mm)時,V可用V=L/2+J×Tanθ-Q/2=J×Tanθ-(Q-L)/2表示之。此時,宜使位置控制用導件923的前端部的形狀與第2凹部16的形狀,以滿足0.03<V<0.5的方式形成。 In addition, as shown in FIG. 16 (B2), when the front end portion of the position control guide 923 coincides with the first surface 15 of the sheet 151 in the thickness direction of the sheet 151, the center axis of the front end portion and the first When the positional deviation of the front end portion of the two recessed portions 16 is V (mm), V can be expressed by V = L / 2 + J × Tanθ-Q / 2 = J × Tanθ- (QL) / 2. At this time, the shape of the front end portion of the position control guide 923 and the shape of the second recessed portion 16 should preferably be formed so as to satisfy 0.03 <V <0.5.

再者,如圖16(B3)所示的,當位置控制用導件923的前端部對應地插入第2凹部16,而插入第2凹部16內的前端部的深度(大小)為δ(mm)時,δ可用δ=J-(Q-L)/(2×Tanθ)表示之。此時,宜使位置控制用導件923的前端部的形狀與第2凹部16的形狀,以滿足δ≧0.15的方式形成。另外,於此之際,當第2凹部16的中心軸與位置控制用導件923的中心軸之位置偏差的大小為V(mm)時,V可用V=0表示之。 Furthermore, as shown in FIG. 16 (B3), when the front end portion of the position control guide 923 is inserted into the second recessed portion 16 correspondingly, the depth (size) of the front end portion inserted into the second recessed portion 16 is δ (mm ), Δ can be expressed by δ = J- (QL) / (2 × Tanθ). At this time, the shape of the front end portion of the position control guide 923 and the shape of the second recessed portion 16 should preferably be formed so as to satisfy δ ≧ 0.15. In this case, when the magnitude of the positional deviation between the central axis of the second recessed portion 16 and the central axis of the position control guide 923 is V (mm), V can be expressed by V = 0.

藉由滿足該等關係,便可如圖16(B2)、(B3)所示的,藉由於第2凹部16內插入與其形狀對應的位置控制用導件923的前端部,而如後所述的於第2凹部16內以更優良的精度收納與其形狀對應的位置修正用導件932的前端部,而不會發生位置偏差。 By satisfying these relationships, as shown in FIGS. 16 (B2) and (B3), the front end portion of the position control guide 923 corresponding to the shape is inserted into the second recessed portion 16 as described later. The front end portion of the position correction guide 932 corresponding to its shape is accommodated in the second recessed portion 16 with better accuracy without positional deviation.

〔D-3a〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,使導件銷931相對於片材151的厚度方向往下側移動,藉此使導件銷931的前端部與片材151的第1面15抵接[參照圖12(c)]。 [D-3a] Next, the punching head 910 is moved further downward with respect to the thickness direction of the sheet 151, that is, the guide pin 931 is moved downward with respect to the thickness direction of the sheet 151, thereby The front end portion of the guide pin 931 is brought into contact with the first surface 15 of the sheet 151 [see FIG. 12 (c)].

此時,導件銷931,由於其基端側部推壓彈簧材料933,故可防止其突破片材151的第1面15。 At this time, since the guide pin 931 pushes the spring material 933 at the base end side portion, the guide pin 931 can be prevented from breaking through the first surface 15 of the sheet 151.

〔D-4a〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,使位置修正用導件932相對於片材151的厚度方向往下側移動,藉此將位置修正用導件932的前端部插入第2凹部16內[參照圖12(d)]。如是,第2凹部16被位置修正用導件932控制住位置。 [D-4a] Next, the punching head 910 is further moved downward with respect to the thickness direction of the sheet 151, that is, the position correction guide 932 is moved downward with respect to the thickness direction of the sheet 151, Thereby, the front-end | tip part of the position correction guide 932 is inserted in the 2nd recessed part 16 [refer FIG. 12 (d)]. If so, the position of the second recessed portion 16 is controlled by the position correction guide 932.

另外,在以該等順序實施之位置控制用導件923以及位置修正用導件932的位置控制中,當以位置修正用導件932控制第2凹部16的位置之最大量,亦即,在片材151的厚度方向上,位置修正用導件932的前端部與片材151的第1面15一致時的前端部的中心軸與第2凹部16的前端部之位置偏差的大小為U(mm),且第2凹部16的中心軸與位置控制用導件923的中心軸之位置偏差的最大量為V(mm)時,宜滿足V≦U,並滿足0≦U-V≦0.5。藉由滿足該等關係,並藉由在位置控制用導件923的位置控制之後實施位置修正用導件932的位置控制的構造,便可在後步驟〔D-6a〕中以更優良的位置精度在片材151上形成饋送孔11。 In addition, in the position control of the position control guide 923 and the position correction guide 932 carried out in this order, the maximum amount of the position of the second recessed portion 16 is controlled by the position correction guide 932, that is, in In the thickness direction of the sheet 151, the positional deviation between the central axis of the front end portion and the front end portion of the second recessed portion 16 when the front end portion of the position correction guide 932 coincides with the first surface 15 of the sheet 151 is U ( mm), and when the maximum positional deviation between the central axis of the second recessed portion 16 and the central axis of the position control guide 923 is V (mm), V ≦ U and 0 ≦ UV ≦ 0.5 should be satisfied. By satisfying these relationships, and by implementing the position control of the position correction guide 932 after the position control of the position control guide 923, a better position can be achieved in the subsequent step [D-6a]. The feeding hole 11 is formed in the sheet 151 with accuracy.

在此,於本步驟中,位置修正用導件932的前端部插入第2凹部16,位置修正用導件932的前端部的形狀與第2凹部16的形狀,例如,存在以下的關係。 Here, in this step, the front end portion of the position correction guide 932 is inserted into the second recessed portion 16, and the shape of the front end portion of the position correction guide 932 and the shape of the second recessed portion 16 have the following relationship, for example.

亦即,首先,例如圖17(A1)所示的,當位置修正用導件932的前端部的長度為M(mm),前端部的前端側的寬度為N(mm)時,前端部形成前端部的寬度N從基端向前端變短(變小)的形狀,相對於此,當第2凹部16的深度為J(mm),底部的厚度為K(mm),寬度為L(mm),第1凹部以及第2凹部以外的部分的厚度為C(mm)時,第2凹部16形成第2凹部16的寬度L在深度(厚度)方向上為一定的形狀。此時,宜使位置修正用導件932的前端部的形狀與第2凹部16的形狀,以滿足M=J並滿足N<L的方式形成。 That is, first, for example, as shown in FIG. 17 (A1), when the length of the front end portion of the position correction guide 932 is M (mm) and the width of the front end side of the front end portion is N (mm), the front end portion is formed. A shape in which the width N of the front end portion becomes shorter (smaller) from the base end to the front end. In contrast, when the depth of the second recessed portion 16 is J (mm), the thickness of the bottom portion is K (mm), and the width is L (mm ), When the thickness of the portion other than the first recessed portion and the second recessed portion is C (mm), the width L of the second recessed portion 16 forming the second recessed portion 16 is constant in the depth (thickness) direction. At this time, the shape of the front end portion of the position correction guide 932 and the shape of the second recessed portion 16 should be formed such that M = J and N <L are satisfied.

另外,當U=(L-N)/2、如後所述的導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小為W(mm)、饋送孔11的內徑為R(mm)、導件銷931的基端部側的外徑為S(mm)、W=(R-S)/2時,宜使位置修正用導件932的前端部的形狀與第2凹部16的形狀,以滿足U>W、(L-N)/2>(R-S)/2以及L-N>R-S的方式形成。 In addition, when U = (LN) / 2, the magnitude of the positional deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 as described later is W (mm), and the inner diameter of the feed hole 11 is R ( mm) and the outer diameter of the proximal end portion side of the guide pin 931 is S (mm), W = (RS) / 2, the shape of the front end portion of the position correction guide 932 and the shape of the second recessed portion 16 should be adjusted. To satisfy U> W, (LN) / 2> (RS) / 2, and LN> RS.

再者,當前端部的中心軸與前端部的側面所形成之角度為α(°)時,前端部的基端側的寬度可用N+2×M×Tanα表示之。此時,宜使位置修正用導件932的前端部的形狀與第2凹部16的形狀,以滿足L+0.04≦N+2×M×Tanα≦L+0.1的方式形成。 When the angle formed by the central axis of the front end portion and the side surface of the front end portion is α (°), the width at the base end side of the front end portion can be expressed by N + 2 × M × Tanα. At this time, the shape of the front end portion of the position correction guide 932 and the shape of the second recessed portion 16 are preferably formed so as to satisfy L + 0.04 ≦ N + 2 × M × Tanα ≦ L + 0.1.

藉由滿足該等關係,便可如圖17(A2)、(A3)所示的,於第2凹部16內以更優良的精度收納與其對應之位置修正用導件932的前端部,而不會發生位置偏差。 By satisfying these relationships, as shown in FIGS. 17 (A2) and (A3), the front end portion of the corresponding position correction guide 932 can be accommodated in the second recessed portion 16 with better accuracy, without Position deviation will occur.

另外,例如圖17(B1)所示的,當位置修正用導件932的前端部的長度為M(mm),前端部的寬度為N(mm)時,前端部形成前端部的寬度N從基端向前端變短(變小)的形狀,以對應該形狀的方式,當第2凹部16的深度為J(mm),底部的厚度為K(mm),寬度為L(mm),第1凹部以及第2凹部以外的部分的厚度為C(mm)時,第2凹部16形成第2凹部16的寬度L在深度(厚度)方向上向底部側變短的形狀。 In addition, for example, as shown in FIG. 17 (B1), when the length of the front end portion of the position correction guide 932 is M (mm) and the width of the front end portion is N (mm), the width N of the front end portion forming the front end portion is from A shape in which the base end becomes shorter (smaller) toward the front end, corresponding to the shape. When the depth of the second recess 16 is J (mm), the thickness at the bottom is K (mm), and the width is L (mm). When the thickness of the portion other than the first recessed portion and the second recessed portion is C (mm), the second recessed portion 16 has a shape in which the width L of the second recessed portion 16 becomes shorter toward the bottom side in the depth (thickness) direction.

此時,當前端部的中心軸與前端部的側面所形成之角度為α(°),片材151的厚度方向與第2凹部16的內周圍面所形成之角度為θ(°)時,宜使位置修正用導件932的前端部的形狀與第2凹部16的形狀,以滿足α=θ、10°≦θ≦30°,並滿足L≦N的方式形成。 At this time, when the angle formed by the central axis of the front end portion and the side surface of the front end portion is α (°), and the angle formed by the thickness direction of the sheet 151 and the inner peripheral surface of the second concave portion 16 is θ (°), The shape of the front end portion of the position correction guide 932 and the shape of the second recessed portion 16 are preferably formed so as to satisfy α = θ, 10 ° ≦ θ ≦ 30 °, and satisfy L ≦ N.

另外,如圖17(B2)所示的,當在片材151的厚度方向上,位置修正用導件932的前端部與片材151的第1面15一致之際,前端部的中心軸與第2凹部16的前端部之位置偏差的大小,亦即,以位置修正用導件932控制第2凹部16的位置之最大量為U(mm)時,U可用U=L/2+J×Tanθ-N/2=J×Tanθ-(N-L)/2表示之。此時,宜使位置修正用導件932的前端部的形狀與第2凹部16的形狀,以滿足0.03<U<0.5的方式形成。 In addition, as shown in FIG. 17 (B2), when the front end portion of the position correction guide 932 matches the first surface 15 of the sheet 151 in the thickness direction of the sheet 151, the central axis of the front end portion and The magnitude of the positional deviation of the front end portion of the second recessed portion 16, that is, when the maximum amount of the position of the second recessed portion 16 controlled by the position correction guide 932 is U (mm), U can be U = L / 2 + J × Tanθ-N / 2 = J × Tanθ- (NL) / 2. At this time, the shape of the tip portion of the position correction guide 932 and the shape of the second recessed portion 16 should preferably be formed so as to satisfy 0.03 <U <0.5.

再者,如圖17(B3)所示的,當位置修正用導件932的前端部對應地插入第2凹部16,而插入第2凹部16內的前端部的深度(大小)為γ(mm)時,γ可用γ=J-(N-L)/(2×Tanθ)表示之。此時,宜使位置修正用導件932的前端部的形狀與第2凹部16的形狀,以滿足γ≧0.15的方式形成。另外,於此之際,當第2凹部16的中心軸與位置修正用導件932的中心軸之位置偏差的大小為U(mm)時,U可用U=0表示之。 Furthermore, as shown in FIG. 17 (B3), when the front end portion of the position correction guide 932 is inserted into the second recessed portion 16 correspondingly, the depth (size) of the front end portion inserted into the second recessed portion 16 is γ (mm ), Γ can be expressed by γ = J- (NL) / (2 × Tanθ). At this time, the shape of the tip portion of the position correction guide 932 and the shape of the second recessed portion 16 should preferably be formed so that γ ≧ 0.15. In this case, when the magnitude of the positional deviation between the central axis of the second recessed portion 16 and the central axis of the position correction guide 932 is U (mm), U can be expressed by U = 0.

藉由滿足該等關係,便可如圖17(B2)、(B3)所示的,於第2凹部16內以更優良的精度收納與其形狀對應的位置修正用導件932的前端部,而不會發生位置偏差。 By satisfying these relationships, as shown in FIGS. 17 (B2) and (B3), the front end portion of the position correction guide 932 corresponding to its shape can be accommodated in the second recessed portion 16 with better accuracy, and No position deviation occurs.

〔D-5a〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,在維持著位置控制用導件923以及位置修正用導件932的位置控制的狀態下,使壓制板(擋板)940相對於片材151的厚度方向往下側移動,藉此使壓制板940的底面與片材151的第1面15抵接[參照圖13(a)]。 [D-5a] Next, the punching head 910 is further moved downward with respect to the thickness direction of the sheet 151, that is, the position control of the position control guide 923 and the position correction guide 932 is continued. In the state, the pressing plate (baffle plate) 940 is moved downward with respect to the thickness direction of the sheet 151, thereby bringing the bottom surface of the pressing plate 940 into contact with the first surface 15 of the sheet 151 [see FIG. 13 (a). ].

藉此,片材151的第1面15被壓制板940的底面壓住,結果,片材151被壓制板940控制住位置。 Thereby, the first surface 15 of the sheet 151 is pressed by the bottom surface of the pressing plate 940, and as a result, the position of the sheet 151 is controlled by the pressing plate 940.

〔D-6a〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,在維持著位置控制用導件923、位置修正用導件932以及壓制板940的 位置控制的狀態下,使沖孔工具921相對於片材151的厚度方向往下側移動,直到其突起物922到達承受板952所具備之貫通孔內為止[參照圖13(b)]。 [D-6a] Next, the punching head 910 is moved further downward with respect to the thickness direction of the sheet 151, that is, the position control guide 923, the position correction guide 932, and the pressing plate 940 are maintained. of In the position-controlled state, the punching tool 921 is moved downward with respect to the thickness direction of the sheet 151 until the protrusion 922 reaches the through hole provided in the receiving plate 952 [see FIG. 13 (b)].

藉此,片材151中的與突起物922抵接位置對應的部分被打穿成為沖孔物17,結果,便可如圖11(b)所示的,在片材151上形成饋送孔11。 Thereby, the portion corresponding to the abutment position of the protrusion 922 in the sheet 151 is punched into the punched object 17, and as a result, the feed hole 11 can be formed in the sheet 151 as shown in FIG. 11 (b). .

由於在像這樣用沖孔工具921打穿片材151時,以位置控制用導件923、位置修正用導件932以及壓制板940控制住片材151的位置,故可確實地防止片材151產生位置偏差。因此,便可相對於第1凹部12以優良的位置精度形成饋送孔11。 Since the position of the sheet 151 is controlled by the position control guide 923, the position correction guide 932, and the pressing plate 940 when the sheet 151 is penetrated by the punching tool 921 like this, the sheet 151 can be reliably prevented Position deviation occurs. Therefore, the feeding hole 11 can be formed with respect to the first recessed portion 12 with excellent positional accuracy.

〔D-7a〕接著,使沖孔頭910相對於片材151的厚度方向往上側移動,亦即,使位置控制用導件923、導件銷931、位置修正用導件932以及壓制板940相對於片材151的厚度方向往上側移動,藉此解除該等構件對片材151的位置控制[參照圖13(c)]。 [D-7a] Next, the punching head 910 is moved upward with respect to the thickness direction of the sheet 151, that is, the position control guide 923, the guide pin 931, the position correction guide 932, and the pressing plate 940 are moved. Moving upward with respect to the thickness direction of the sheet 151, the position control of the sheet 151 by these members is released [see FIG. 13 (c)].

然後,將該片材151,從片材151的行進方向的入口側向出口側搬運,藉此將片材151供至第2次的饋送孔11的沖孔。藉由以上該等步驟,便可實施饋送孔11的第1次的沖孔。 Then, the sheet 151 is conveyed from the entrance side to the exit side of the sheet 151 in the traveling direction, thereby supplying the sheet 151 to the punching of the second feeding hole 11. With these steps, the first punching of the feed hole 11 can be performed.

<<第2次沖孔>> << Second punching >>

接著,進行沖孔模具900對片材151的饋送孔11的第2次沖孔,亦即,用沖孔工具921施壓於片材151的第2發。在第2次沖孔中,沖孔模具900所具備之各部, 對應形成有第1凹部12、第2凹部16以及第1發的饋送孔11的片材151的各部,以下述的方式配置。 Next, the second punching of the feed hole 11 of the sheet 151 by the punching die 900 is performed, that is, the second shot of the sheet 151 is pressed with the punching tool 921. In the second punching, each part included in the punching die 900, Each portion of the sheet 151 corresponding to the first recessed portion 12, the second recessed portion 16, and the feed hole 11 of the first hair is formed in the following manner.

亦即,如圖10(b)所示的,當從上側觀察片材151時,位置修正用導件932,在沖孔工具921所具有之突起物922的片材151的行進方向入口側與出口側的各外側,以對應第2凹部16的方式,將其前端部插入第2凹部16內。 That is, as shown in FIG. 10 (b), when the sheet 151 is viewed from the upper side, the position correction guide 932 is positioned at the entrance side of the sheet 151 in the traveling direction of the projection 922 included in the punching tool 921 and Each outer side of the exit side is inserted into the second recessed portion 16 so as to correspond to the second recessed portion 16.

另外,導件銷931,在沖孔工具921所具有之突起物922的片材151的行進方向出口側,以對應第1次沖孔所形成之饋送孔11的方式,將其前端部插通饋送孔11。 In addition, the guide pin 931 is inserted into the leading end of the sheet 151 of the protrusion 922 of the punching tool 921 in the direction of travel of the punching tool so as to correspond to the feed hole 11 formed by the first punching. Feed hole 11.

以下,針對使用像這樣配置各部的沖孔模具900形成饋送孔11的方法依序說明。 Hereinafter, a method of forming the feed holes 11 using the punching die 900 in which the parts are arranged in this manner will be described in order.

〔D-1b〕首先,將圖11(b)所示的形成有第1凹部12、第2凹部16以及第1次沖孔的饋送孔11的片材151,從片材151的行進方向的入口側向出口側搬運,藉此將片材151搬運到支持台950上[參照圖14(a)]。 [D-1b] First, the sheet 151 formed with the first recessed portion 12, the second recessed portion 16, and the first punched feed hole 11 shown in FIG. 11 (b) is moved from the direction of travel of the sheet 151. The inlet side is conveyed toward the outlet side, whereby the sheet 151 is carried on the support table 950 [see FIG. 14 (a)].

〔D-2b〕接著,使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,使導件銷931相對於片材151的厚度方向往下側移動,藉此將導件銷931的前端部插通到第1次沖孔所形成的饋送孔11內[參照圖14(b)]。 [D-2b] Next, the punching head 910 is moved downward with respect to the thickness direction of the sheet 151, that is, the guide pin 931 is moved downward with respect to the thickness direction of the sheet 151, thereby moving the guide The tip end of the pin 931 is inserted into the feed hole 11 formed by the first punching [see FIG. 14 (b)].

藉此,第1次沖孔所形成的饋送孔11被導件銷931控制住位置。 Thereby, the feed hole 11 formed by the first punching is controlled by the guide pin 931.

在此,於本步驟中,導件銷931的前端部插通饋送孔11,導件銷931的前端部的形狀,例如,存在如以下所述的構造。 Here, in this step, the front end portion of the guide pin 931 is inserted into the feed hole 11, and the shape of the front end portion of the guide pin 931 has, for example, a structure as described below.

亦即,首先,例如圖18(A1)所示的,當導件銷931的基端部側的外徑為S(mm),前端側的外徑為T(mm),饋送孔11的內徑為R(mm)時,導件銷931形成半徑在從其基端向前端的途中縮小且其前端部構成平坦面的形狀。 That is, first, for example, as shown in FIG. 18 (A1), when the outer diameter of the base end portion side of the guide pin 931 is S (mm), and the outer diameter of the front end side is T (mm), When the diameter is R (mm), the guide pin 931 has a shape in which the radius is reduced halfway from the base end to the front end and the front end portion forms a flat surface.

此時,如圖18(A1)所示的,當在片材151的厚度方向上,在導件銷931的前端的平坦面與片材151的第1面15一致之際,導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小,亦即,以導件銷931控制饋送孔11的位置之最大量為ε(mm)時,ε可用ε=(R-T)/2表示之。此時,宜使導件銷931的前端部的形狀,以滿足ε≧0.2的方式形成。 At this time, as shown in FIG. 18 (A1), when the flat surface of the front end of the guide pin 931 coincides with the first surface 15 of the sheet 151 in the thickness direction of the sheet 151, the guide pin 931 The magnitude of the positional deviation between the central axis of the feed hole 11 and the central axis of the feed hole 11, that is, when the maximum amount of the position of the feed hole 11 controlled by the guide pin 931 is ε (mm), ε can be expressed by ε = (RT) / 2 Of it. At this time, the shape of the tip portion of the guide pin 931 is preferably formed so as to satisfy ε ≧ 0.2.

另外,如圖18(A2)所示的,當在片材151的厚度方向上,在以導件銷931的前端的半徑縮小的部分從片材151的第2面13突出的方式使導件銷931插通片材151之際,導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小為W(mm)時,W可用W=(R-S)/2表示之。此時,宜使導件銷931的前端部的形狀滿足0<W≦0.015。 In addition, as shown in FIG. 18 (A2), in the thickness direction of the sheet 151, the guide is made to protrude from the second surface 13 of the sheet 151 so that the radius of the tip of the guide pin 931 decreases. When the pin 931 is inserted through the sheet 151, when the positional deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 is W (mm), W can be expressed by W = (RS) / 2. At this time, the shape of the front end portion of the guide pin 931 should satisfy 0 <W ≦ 0.015.

像這樣,如圖18(A1)、(A2)所示的,導件銷931插通饋送孔11,此時,當導件銷931的中心軸與導件銷931的前端部(縮徑部)的側面所形成之角度為λ(°)時,宜使導件銷931的前端部的形狀以滿足0<R-S≦0.03、0≦T≦S-0.4並滿足10°≦λ≦30°的方式形成。 In this way, as shown in FIGS. 18 (A1) and (A2), the guide pin 931 is inserted into the feed hole 11. At this time, when the central axis of the guide pin 931 and the front end portion (reduced diameter portion) of the guide pin 931 When the angle formed by the side of) is λ (°), the shape of the front end portion of the guide pin 931 should satisfy 0 <RS ≦ 0.03, 0 ≦ T ≦ S-0.4 and 10 ° ≦ λ ≦ 30 °. Way to form.

藉由滿足該等關係,便可如圖18(A1)、(A2)所示的,藉由於饋送孔11內插通與其對應的導件銷931,而如後所述的於第2凹部16內以更優良的精度收納與其形狀對應的位置修正用導件932的前端部,而不會發生位置偏差。 By satisfying these relationships, as shown in FIGS. 18 (A1) and (A2), as the corresponding guide pin 931 is inserted into the feed hole 11, the second recess 16 is formed as described later. The front end portion of the position correction guide 932 corresponding to its shape is housed in the inside with a higher accuracy without positional deviation.

另外,例如圖18(B1)所示的,當導件銷931的基端部側的外徑為S(mm),饋送孔11的內徑為R(mm)時,導件銷931,構成半徑在從其基端向前端的途中開始縮小,而其前端部形成針狀的構造。 In addition, for example, as shown in FIG. 18 (B1), when the outer diameter of the proximal end portion side of the guide pin 931 is S (mm) and the inner diameter of the feed hole 11 is R (mm), the guide pin 931 is constituted, The radius starts to decrease from the base end to the front end, and the front end portion has a needle-like structure.

此時,如圖18(B1)所示的,當在片材151的厚度方向上,在形成針狀的導件銷931的前端與片材151的第1面15一致之際,導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小,亦即,以導件銷931控制饋送孔11的位置之最大量為ε(mm)時,ε可用ε=R/2表示之。 At this time, as shown in FIG. 18 (B1), when the tip of the needle-shaped guide pin 931 coincides with the first surface 15 of the sheet 151 in the thickness direction of the sheet 151, the guide pin The magnitude of the positional deviation between the central axis of 931 and the central axis of the feed hole 11, that is, when the maximum amount of the position of the feed hole 11 controlled by the guide pin 931 is ε (mm), ε can be expressed by ε = R / 2 .

另外,如圖18(B2)所示的,當在片材151的厚度方向上,在導件銷931插通片材151而使導件銷931的前端的半徑縮小的部分從片材151的第2面13突出之際,導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小為W(mm)時, W可用W=(R-S)/2表示之。此時,宜使導件銷931的前端部的形狀,以滿足0<W≦0.015的方式形成。 In addition, as shown in FIG. 18 (B2), when the sheet 151 is inserted in the guide pin 931 in the thickness direction of the sheet 151, the radius of the leading end of the guide pin 931 is reduced from that of the sheet 151. When the second surface 13 protrudes, when the positional deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 is W (mm), W can be expressed as W = (R-S) / 2. At this time, the shape of the front end portion of the guide pin 931 should be formed so as to satisfy 0 <W ≦ 0.015.

像這樣,如圖18(B1)、(B2)所示的,導件銷931插通饋送孔11,此時,宜使導件銷931的前端部的形狀,以滿足0<R-S≦0.03的方式形成。 In this way, as shown in FIGS. 18 (B1) and (B2), the guide pin 931 is inserted into the feed hole 11. At this time, the shape of the front end portion of the guide pin 931 should be 0 <RS ≦ 0.03. Way to form.

藉由滿足該等關係,便可如圖18(B1)、(B2)所示的,藉由於饋送孔11內插通與其對應的導件銷931,而如後所述的於第2凹部16內以更優良的精度收納與其形狀對應的位置修正用導件932的前端部,而不會發生位置偏差。 By satisfying these relationships, as shown in FIGS. 18 (B1) and (B2), as the corresponding guide pin 931 is inserted into the feed hole 11, the second recess 16 is formed as described later. The front end portion of the position correction guide 932 corresponding to its shape is housed in the inside with a higher accuracy without positional deviation.

〔D-3b〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,使位置修正用導件932相對於片材151的厚度方向往下側移動,藉此將位置修正用導件932的前端部插入第2凹部16內[參照圖14(c)]。藉此,第2凹部16被位置修正用導件932控制住位置。 [D-3b] Next, the punching head 910 is moved further downward with respect to the thickness direction of the sheet 151, that is, the position correction guide 932 is moved downward with respect to the thickness direction of the sheet 151. Thereby, the front-end | tip part of the position correction guide 932 is inserted in the 2nd recessed part 16 [refer FIG. 14 (c)]. Thereby, the position of the second recessed portion 16 is controlled by the position correction guide 932.

在此,於本步驟中,係使用位置修正用導件932,控制第2凹部16的位置,惟欲以優良的位置精度實施該位置控制,則要求在該步驟〔D-2b〕中的使用導件銷931的在第1次沖孔所形成的饋送孔11中的位置控制,同時如以下所示的,實施該等位置控制。 Here, in this step, the position correction guide 932 is used to control the position of the second recessed portion 16. To implement the position control with excellent position accuracy, the use in this step [D-2b] is required. The position control of the guide pin 931 in the feed hole 11 formed by the first punching is performed at the same time as described below.

首先,如圖19所示的,當從上側觀察片材151時,4個位置修正用導件932,在沖孔工具921所具有之突起物922的片材151的行進方向入口側與出口側的各 外側,以對應4個第2凹部16的方式,將其前端部插入第2凹部16內。此時,若4個位置修正用導件932分別為PR1、PR2、PR3、PR4,則各自的X、Y方向的中心座標可用(Xr1,Yr1)、(Xr2,Yr2)、(Xr3,Yr3)、(Xr4,Yr4)表示之。 First, as shown in FIG. 19, when the sheet material 151 is viewed from the upper side, the four position correction guides 932 move the entry side and the exit side of the sheet material 151 of the projection 922 of the punching tool 921 in the traveling direction. Each The front end portion is inserted into the second recessed portion 16 so as to correspond to the four second recessed portions 16. At this time, if the four position correction guides 932 are PR1, PR2, PR3, and PR4, respectively, the center coordinates in the X and Y directions are available (Xr1, Yr1), (Xr2, Yr2), (Xr3, Yr3) (Xr4, Yr4) represents it.

另外,4個導件銷931,在沖孔工具921所具有之突起物922的片材151的行進方向出口側,以對應第1次沖孔所形成之4個饋送孔11的方式,將其前端部插通饋送孔11。此時,若4個導件銷931分別為PP1、PP2、PP3、PP4,則各自的X、Y方向的中心座標可用(Xp1,Yp1)、(Xp2,Yp2)、(Xp3,Yp3)、(Xp4,Yp4)表示之。 In addition, the four guide pins 931 are provided on the exit side of the sheet 151 of the protrusion 922 included in the punching tool 921 so as to correspond to the four feed holes 11 formed by the first punching. The front end portion is inserted through the feed hole 11. At this time, if the four guide pin 931 are respectively PP1, PP2, PP3, and PP4, the center coordinates of the respective X and Y directions are available (Xp1, Yp1), (Xp2, Yp2), (Xp3, Yp3), ( Xp4, Yp4).

再者,第2次沖孔係利用沖孔工具921所具有之配置成格子狀的突起物922將饋送孔11打穿成與其對應的格子狀(在本實施態樣中為每次縱向2個、横向6個)。此時,若形成格子狀的饋送孔11之中的4個角落的饋送孔11分別為PS1、PS2、PS3、PS4,則各自的X、Y方向的中心座標可用(Xs1,Ys1)、(Xs2,Ys2)、(Xs3,Ys3)、(Xs4,Ys4)表示之。 In addition, the second punching is performed by using the punching tool 921 provided with the grid-like protrusions 922 to punch the feeding hole 11 into a corresponding grid-like shape (in this embodiment, two vertical holes at a time). , Horizontal 6). At this time, if the feed holes 11 in the four corners of the grid-shaped feed holes 11 are PS1, PS2, PS3, and PS4, respectively, the center coordinates of the respective X and Y directions are available (Xs1, Ys1), (Xs2 , Ys2), (Xs3, Ys3), (Xs4, Ys4) represent them.

另外,4個位置控制用導件923,在沖孔工具921所具有之突起物922的片材151的行進方向入口側與出口側的各外側,以對應4個第2凹部16的方式,將其前端部插入第2凹部16內。此時,若4個位置控制用導件923分別為PQ1、PQ2、PQ3、PQ4,則各自的X、Y方向的中心座標可用(Xq1,Yq1)、(Xq2,Yq2)、(Xq3,Yq3)、(Xq4,Yq4)表示之。 In addition, the four position control guides 923 correspond to the four second recesses 16 on the outside of the entrance side and the exit side of the sheet 151 of the protrusion 922 included in the punching tool 921 in the traveling direction. The front end portion is inserted into the second recessed portion 16. At this time, if the four position control guides 923 are PQ1, PQ2, PQ3, and PQ4, respectively, the center coordinates of the respective X and Y directions are available (Xq1, Yq1), (Xq2, Yq2), (Xq3, Yq3) (Xq4, Yq4).

當以上述方式定義時,首先,若中心為PC1並通過4個導件銷931(PP1、PP2、PP3、PP4)的圓為圓935,且中心PC1的座標為(Xc1,Yc1),則圓935的半徑R1可用下述式(3)表示之,且連結中心PC1與PP4的線段相對於X方向所形成的角度ψp可用下述式(4)表示之。 When defined in the above manner, first, if the center is PC1 and the circle passing the four guide pin 931 (PP1, PP2, PP3, PP4) is circle 935, and the coordinates of center PC1 are (Xc1, Yc1), then the circle The radius R1 of 935 can be expressed by the following formula (3), and the angle ψp formed by the line segment connecting the center PC1 and PP4 with respect to the X direction can be expressed by the following formula (4).

然後,如圖20所示的,當中心為導件銷931的中心軸,且將導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小當作半徑R2的圓為圓936時,半徑R2可用R2=W=(R-S)/2表示之。此時,假設片材151以中心PC1為中心進行旋轉,則饋送孔11的旋轉角度ωp可用下述式(5-1)、(5-2)表示之。另外,當圓935與圓936的交點分別為PP41、PP42,且其交點座標分別為(Xp41,Yp41)、(Xp42,Yp42)時,該等交點座標可分別用下述式(6)、(7)表示之。 Then, as shown in FIG. 20, when the center is the central axis of the guide pin 931, and the magnitude of the positional deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 is taken as a circle with a radius R2 as a circle 936 In this case, the radius R2 can be expressed by R2 = W = (RS) / 2. At this time, assuming that the sheet 151 is rotated around the center PC1, the rotation angle ωp of the feed hole 11 can be expressed by the following formulas (5-1) and (5-2). In addition, when the intersections of circles 935 and 936 are PP41 and PP42, and the coordinates of their intersections are (Xp41, Yp41), (Xp42, Yp42), the coordinates of these intersections can be expressed by the following formulas (6), ( 7) Show it.

【數學式3】 [Mathematical formula 3]

另外,在所欲形成之載送帶1為圖4(a)所示之構造的情況下,如圖21(a)所示的,當以點PC1為中心時的通過第1凹部12的中心點PK1的圓為圓pk1,圓pk1的中心PC1的座標為(Xc1,Yc1),第1凹部12的中心PK1的座標為(Xk1,Yk1)時,圓pk1的半徑Rk1可用下述式(8)表示之,中心PK1的相對於X方向的角度ψk1可用下述式(9)表示之。 In addition, when the carrier tape 1 to be formed has the structure shown in FIG. 4 (a), as shown in FIG. 21 (a), when the point PC1 is centered, it passes through the center of the first recessed portion 12 The circle of point PK1 is circle pk1, the coordinates of center PC1 of circle pk1 is (Xc1, Yc1), and the coordinates of center PK1 of first recessed portion 12 is (Xk1, Yk1). The radius Rk1 of circle pk1 can be expressed as follows (8 ), The angle ψk1 of the center PK1 with respect to the X direction can be expressed by the following formula (9).

然後,此時,若假設片材151以點PC1為中心旋轉ωp°,則第1凹部12的中心座標,會偏移到座標PK11(Xk11,Yk11)或是座標PK12(Xk12,Yk12),該等座標分別可用下述式(10)、(11)表示之。 Then, at this time, if it is assumed that the sheet 151 rotates ωp ° around the point PC1, the center coordinate of the first concave portion 12 will be shifted to the coordinates PK11 (Xk11, Yk11) or PK12 (Xk12, Yk12). The iso-coordinates can be expressed by the following formulas (10) and (11), respectively.

因此,第1凹部12之位置偏差的大小(Xt11,Yt11,Xt12,Yt12)可用下述式(12)表示之。 Therefore, the magnitude of the positional deviation (Xt11, Yt11, Xt12, Yt12) of the first concave portion 12 can be expressed by the following formula (12).

該等第1凹部12之位置偏差的大小(Xt11,Yt11,Xt12,Yt12),宜各自滿足-0.05~0.05mm,更宜為-0.03~0.03mm。此時,藉由使R1增大,使R2縮小,亦即,使4個導件銷931的對角線的距離擴大,使導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小W縮小,便可將第1凹部12之位置偏差的大小設定在該較佳的範圍。 The magnitudes of the positional deviations of the first recesses 12 (Xt11, Yt11, Xt12, Yt12) should preferably satisfy -0.05 ~ 0.05mm, more preferably -0.03 ~ 0.03mm. At this time, by increasing R1 and reducing R2, that is, increasing the distance between the diagonals of the four guide pin 931, the position deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 is caused. By reducing the size W, the magnitude of the positional deviation of the first recessed portion 12 can be set within the preferred range.

再者,在所欲形成之載送帶1為圖4(a)所示之構造的情況下,如圖21(b)所示的,當以點PC1為中心時的通過第1凹部12的中心點PK2的圓為圓pk2,圓pk2的中心PC1的座標為(Xc1,Yc1),第1凹部12的中心PK2的座標為(Xk2,Yk2) 時,圓pk2的半徑Rk2可用下述式(13)表示之,中心PK2的相對於X方向的角度ψk2可用下述式(14)表示之。 In addition, in the case where the carrier tape 1 to be formed has the structure shown in FIG. 4 (a), as shown in FIG. 21 (b), when the center of the point PC1 passes through the first concave portion 12, the The circle of the center point PK2 is the circle pk2, the coordinates of the center PC1 of the circle pk2 are (Xc1, Yc1), and the coordinates of the center PK2 of the first recess 12 are (Xk2, Yk2). In this case, the radius Rk2 of the circle pk2 can be expressed by the following formula (13), and the angle ψk2 of the center PK2 with respect to the X direction can be expressed by the following formula (14).

然後,此時,若假設片材151以點PC1為中心旋轉ωp°,則第1凹部12的中心座標會偏移到座標PK21(Xk21,Yk21)或是座標PK22(Xk22,Yk22),該等座標可分別用下述式(15)、(16)表示之。 Then, at this time, if it is assumed that the sheet 151 rotates ωp ° around the point PC1, the center coordinate of the first concave portion 12 will be shifted to the coordinates PK21 (Xk21, Yk21) or PK22 (Xk22, Yk22), etc. The coordinates can be expressed by the following formulas (15) and (16), respectively.

因此,第1凹部12之位置偏差的大小(Xt21,Yt21,Xt22,Yt22)可用下述式(17)表示之。 Therefore, the magnitude of the positional deviation (Xt21, Yt21, Xt22, Yt22) of the first recessed portion 12 can be expressed by the following formula (17).

該等第1凹部12之位置偏差的大小(Xt21,Yt21,Xt22,Yt22),宜各自滿足-0.05~0.05mm,更宜為-0.03~0.03mm。此時,藉由使R1增大,使R2縮小,亦即,使4個導件銷931的對角線的距離擴大,使導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小W縮小,便可將第1凹部12的位置偏差設定在該較佳的範圍內。 The magnitudes of the positional deviations of the first recesses 12 (Xt21, Yt21, Xt22, Yt22) should preferably satisfy -0.05 ~ 0.05mm, more preferably -0.03 ~ 0.03mm. At this time, by increasing R1 and reducing R2, that is, increasing the distance between the diagonals of the four guide pin 931, the position deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 is caused. By reducing the size W, the positional deviation of the first recessed portion 12 can be set within the preferred range.

另外,在所欲形成之載送帶1為圖4(a)所示之構造的情況下,如圖21(c)所示的,當以點PC1為中心時的通過第1凹部12的中心點PK3的圓為圓pk3,圓pk3的中心PC1的座標為(Xc1,Yc1),第1凹部12的中心PK3的座標為(Xk3,Yk3)時,圓pk3的半徑Rk3可用下述式(18)表示之,中心PK3的相對於X方向的角度ψk3可用下述式(19)表示之。 In addition, in the case where the carrier tape 1 to be formed has the structure shown in FIG. 4 (a), as shown in FIG. 21 (c), when the point PC1 is centered, it passes through the center of the first recessed portion 12 The circle of point PK3 is circle pk3, the coordinates of center PC1 of circle pk3 is (Xc1, Yc1), and the coordinates of center PK3 of first recessed portion 12 is (Xk3, Yk3). The radius Rk3 of circle pk3 can be expressed by the following formula (18 ), The angle ψk3 of the center PK3 with respect to the X direction can be expressed by the following formula (19).

然後,此時,若假設片材151以點PC1為中心旋轉ωp°,則第1凹部12的中心座標,會偏移到座標PK31(Xk31,Yk31)或是座標PK32(Xk32,Yk32),該等座標可分別用下述式(20)、(21)表示之。 Then, at this time, if it is assumed that the sheet 151 rotates ωp ° around the point PC1, the center coordinate of the first concave portion 12 will be shifted to the coordinates PK31 (Xk31, Yk31) or PK32 (Xk32, Yk32). The iso-coordinates can be expressed by the following formulas (20) and (21), respectively.

因此,第1凹部12之位置偏差的大小(Xt31,Yt31,Xt32,Yt32)可用下述式(22)表示之。 Therefore, the magnitude of the positional deviation (Xt31, Yt31, Xt32, Yt32) of the first recessed portion 12 can be expressed by the following formula (22).

【數學式6】 [Mathematical formula 6]

該等第1凹部12之位置偏差的大小(Xt31,Yt31,Xt32,Yt32),宜各自滿足-0.05~0.05mm,更宜為-0.03~0.03mm。此時,藉由使R1增大,使R2縮小,亦即,使4個導件銷931的對角線的距離擴大,使導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小W縮小,便可將第1凹部12的位置偏差設定在該較佳的範圍內。 The magnitudes of the positional deviations (Xt31, Yt31, Xt32, Yt32) of the first recesses 12 should satisfy -0.05 to 0.05 mm, and more preferably -0.03 to 0.03 mm. At this time, by increasing R1 and reducing R2, that is, increasing the distance between the diagonals of the four guide pin 931, the position deviation between the central axis of the guide pin 931 and the central axis of the feed hole 11 is caused. By reducing the size W, the positional deviation of the first recessed portion 12 can be set within the preferred range.

再者,在所欲形成之載送帶1為圖4(a)所示之構造的情況下,如圖21(d)所示的,當以點PC1為中心時的通過第1凹部12的中心點PK4的圓為圓pk4,圓pk4的中心PC1的座標為(Xc1,Yc1),第1凹部12的中心PK4的座標為(Xk4,Yk4)時,圓pk4的半徑Rk4可用下述式(23)表示之,中心PK4的相對於X方向的角度ψk4可用下述式(24)表示之。 Furthermore, in the case where the carrier tape 1 to be formed has a structure as shown in FIG. 4 (a), as shown in FIG. 21 (d), when the center of the point PC1 passes through the first concave portion 12, the The circle of the center point PK4 is the circle pk4, the coordinates of the center PC1 of the circle pk4 is (Xc1, Yc1), and the coordinates of the center PK4 of the first recess 12 is (Xk4, Yk4). The radius Rk4 of the circle pk4 can be expressed by the following formula ( 23). The angle ψk4 of the center PK4 with respect to the X direction can be expressed by the following formula (24).

然後,此時,若假設片材151以點PC1為中心旋轉ωp°,第1凹部12的中心座標,會偏移到座標PK41(Xk41,Yk41)或是座標PK42(Xk42,Yk42),該等座標可分別用下述式(25)、(26)表示之。 Then, at this time, if it is assumed that the sheet 151 rotates ωp ° around the point PC1, the center coordinate of the first concave portion 12 will be shifted to the coordinates PK41 (Xk41, Yk41) or coordinates PK42 (Xk42, Yk42), etc. The coordinates can be expressed by the following formulas (25) and (26), respectively.

因此,第1凹部12之位置偏差的大小(Xt41,Yt41,Xt42,Yt42)可用下述式(27)表示之。 Therefore, the magnitude of the positional deviation (Xt41, Yt41, Xt42, Yt42) of the first concave portion 12 can be expressed by the following formula (27).

該等第1凹部12之位置偏差的大小(Xt41,Yt41,Xt42,Yt42),宜各自滿足-0.05~0.05mm,更宜為-0.03~0.03mm。此時,藉由使R1增大,使R2縮小,亦即,使4個導件銷931的對角線的距離擴大,使導件銷931的中心軸與饋送孔11 的中心軸之位置偏差的大小W縮小,便可將第1凹部12的位置偏差設定在該較佳的範圍內。 The magnitudes of the positional deviations of the first recesses 12 (Xt41, Yt41, Xt42, Yt42) should preferably satisfy -0.05 ~ 0.05mm, more preferably -0.03 ~ 0.03mm. At this time, by increasing R1 and reducing R2, that is, the distance between the diagonals of the four guide pin 931 is enlarged, and the central axis of the guide pin 931 and the feed hole 11 are increased. By reducing the magnitude W of the positional deviation of the central axis of the central axis, the positional deviation of the first recessed portion 12 can be set within the preferable range.

再者,如圖22所示的,當以點PC1為中心時的分別通過位置修正用導件932(PR1)的角落部位(點PR11~14)的圓為圓pr11~14,圓pr11~14的中心PC1的座標為(Xc1,Yc1),位置修正用導件932的角落部位的座標PR11、PR12、PR13、PR14分別為(Xr11,Yr11)、(Xr12,Yr12)、(Xr12,Yr12)、(Xr12,Yr12)時,圓pr11~14的半徑Rr11~14可分別用下述式(28)表示之,角落部位的座標PR11~14的相對於X方向的角度ψr11~14可分別用下述式(29)表示之。 Further, as shown in FIG. 22, when the point PC1 is centered, the circles passing through the corner portions (points PR11 to 14) of the position correction guide 932 (PR1) are circles pr11 to 14, and circles pr11 to 14 The coordinates of the center PC1 are (Xc1, Yc1), and the coordinates PR11, PR12, PR13, PR14 of the corners of the position correction guide 932 are (Xr11, Yr11), (Xr12, Yr12), (Xr12, Yr12), For (Xr12, Yr12), the radius Rr11 ~ 14 of the circle pr11 ~ 14 can be expressed by the following formula (28), and the angles ψr11 ~ 14 of the coordinates PR11 ~ 14 of the corners with respect to the X direction can be used respectively Equation (29) shows this.

然後,此時,若假設片材151以點PC1為中心旋轉,則第2凹部16可旋轉到位置修正用導件932的角落部位與第2凹部16的側壁面抵接的角度ωr11~14°為止,若此時的圓pr11~14與第2凹部16的側壁面的交點座標分別為座標PR11’(Xr11’,Yr11’)、座標PR12’(Xr12’,Yr12’)、座標PR13’(Xr13’,Yr13’)、座標PR14’(Xr14’,Yr14’),則該等座標可分別用下述式(30)~(33)表示之。 Then, at this time, if the sheet 151 is rotated around the point PC1, the second recessed portion 16 can be rotated to an angle ωr11 ~ 14 ° at which the corner portion of the position correction guide 932 abuts against the side wall surface of the second recessed portion 16. So far, if the intersections of the circles pr11 to 14 and the side wall surface of the second recessed portion 16 at this time are the coordinates PR11 '(Xr11', Yr11 '), the coordinates PR12' (Xr12 ', Yr12'), and the coordinates PR13 '(Xr13 ', Yr13') and coordinates PR14 '(Xr14', Yr14 '), these coordinates can be expressed by the following formulas (30) to (33), respectively.

因此,當第2凹部16的寬度(長度)為L(mm),位置修正用導件932的前端部的前端側的寬度(長度)為N(mm)時,以位置修正用導件932控制第2凹部16的位置之最大量U(mm)可用下述式(34)~(37)表示之。 Therefore, when the width (length) of the second recessed portion 16 is L (mm) and the width (length) of the front end side of the front end portion of the position correction guide 932 is N (mm), the position correction guide 932 controls The maximum amount U (mm) of the position of the second recessed portion 16 can be expressed by the following formulas (34) to (37).

【數學式8】 [Mathematical formula 8]

因此,當滿足ωr11~14≧ωp的關係時,便可用位置修正用導件932控制第2凹部16的位置,當形成ωr11~14<ωp的關係時,便無法用位置修正用導件932控制第2凹部16的位置。 Therefore, when the relationship of ωr11 ~ 14 ≧ ωp is satisfied, the position of the second concave portion 16 can be controlled by the position correction guide 932. When the relationship of ωr11 ~ 14 <ωp is formed, the position correction guide 932 cannot be used to control The position of the second recessed portion 16.

另外,在以上述順序實施的導件銷931以及位置修正用導件932的位置控制中,當以位置修正用導件932控制第2凹部16的位置之最大量為U(mm),且在片材151的厚度方向上以導件銷931的前端的半徑縮小部分從片材151的第2面13突出的方式使導件銷931插通片材151之際的導件銷931的中心軸與饋送孔11的中心軸之位置偏差的大小為W(mm)時,宜滿足W≦U,並滿足0.015≦U-W≦0.5。藉由滿足該等關係,便可利用在導件銷931的位置控制之後實施位置修正用導件932的位置控制的構造,而在後步驟〔D-5b〕中以更優良的位置精度在片材151上形成饋送孔11。 In addition, in the position control of the guide pin 931 and the position correction guide 932 implemented in the above order, the maximum amount when the position correction guide 932 controls the position of the second recessed portion 16 is U (mm), and The central axis of the guide pin 931 when the guide pin 931 is inserted into the sheet 151 in a thickness direction of the sheet 151 such that the reduced radius of the front end of the guide pin 931 protrudes from the second surface 13 of the sheet 151 When the magnitude of the position deviation from the central axis of the feed hole 11 is W (mm), it is desirable to satisfy W ≦ U and 0.015 ≦ UW ≦ 0.5. By satisfying these relationships, it is possible to use a structure in which position control of the position correction guide 932 is performed after the position control of the guide pin 931, and in the subsequent step [D-5b], the position is corrected with better position accuracy. A feed hole 11 is formed on the material 151.

〔D-4b〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,在維持著導件銷931以及位置修正用導件932的位置控制的狀態下,使壓制板(擋板)940相對於片材151的厚度方向往下側移動,藉此使壓制板940的底面與片材151的第1面15抵接[參照圖14(d)]。 [D-4b] Next, the punching head 910 is moved further downward with respect to the thickness direction of the sheet 151, that is, while the position control of the guide pin 931 and the position correction guide 932 is maintained. The pressing plate (baffle plate) 940 is moved downward with respect to the thickness direction of the sheet 151, thereby bringing the bottom surface of the pressing plate 940 into contact with the first surface 15 of the sheet 151 [see FIG. 14 (d)].

藉此,片材151的第1面15被壓制板940的底面壓住,結果,片材151被壓制板940控制住位置。 Thereby, the first surface 15 of the sheet 151 is pressed by the bottom surface of the pressing plate 940, and as a result, the position of the sheet 151 is controlled by the pressing plate 940.

〔D-5b〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往下側移動,亦即,在維持著導件銷931、位置修正用導件932以及壓制板940的位置控制的狀態下,使沖孔工具921相對於片材151的厚度方向往下側移動,直到其突起物922到達承受板952所具備之貫通孔內為止[參照圖15(a)]。 [D-5b] Next, the punching head 910 is moved further downward with respect to the thickness direction of the sheet 151, that is, while maintaining the positions of the guide pin 931, the position correction guide 932, and the pressing plate 940 In the controlled state, the punching tool 921 is moved downward with respect to the thickness direction of the sheet 151 until the projection 922 reaches the through hole provided in the receiving plate 952 [see FIG. 15 (a)].

藉此,片材151的與突起物922抵接位置對應的部分被打穿為沖孔物17,結果,如圖11(c)所示的,便可在片材151上形成饋送孔11。 Thereby, a portion of the sheet 151 corresponding to the abutting position of the protrusion 922 is punched as the punched object 17. As a result, as shown in FIG. 11 (c), the feeding hole 11 can be formed in the sheet 151.

在像這樣以沖孔工具921打穿片材151時,由於以導件銷931、位置修正用導件932以及壓制板940控制住片材151的位置,故可確實地防止片材151產生位置偏差。因此,便可相對於第1凹部12以優良的位置精度形成饋送孔11。 When the sheet 151 is penetrated by the punching tool 921 like this, the position of the sheet 151 is controlled by the guide pin 931, the position correction guide 932, and the pressing plate 940, so that the position of the sheet 151 can be reliably prevented deviation. Therefore, the feeding hole 11 can be formed with respect to the first recessed portion 12 with excellent positional accuracy.

〔D-6b〕接著,更進一步使沖孔頭910相對於片材151的厚度方向往上側移動,亦即,使導件銷931、位置修正用導件932以及壓制板940相對於片材151的厚度方向往上側移動,藉此解除該等構件對片材151的位置控制[參照圖15(b)]。 [D-6b] Next, the punching head 910 is moved further upward with respect to the thickness direction of the sheet 151, that is, the guide pin 931, the position correction guide 932, and the pressing plate 940 are moved relative to the sheet 151. By moving the thickness direction upward, the position control of the sheet 151 by these members is released [see FIG. 15 (b)].

然後,將該片材151,從片材151的行進方向的入口側向出口側搬運,藉此將片材151供至第3次的饋送孔11的沖孔。 Then, the sheet 151 is conveyed from the entrance side to the exit side of the sheet 151 in the traveling direction, thereby supplying the sheet 151 to the punching holes of the third feeding hole 11.

利用以上的步驟,實施饋送孔11的第2次的沖孔。然後,藉由將該第2次的沖孔反覆實施,亦即,將第2次以後的沖孔依序實施,便可形成複數個饋送孔11, 結果,便可製造出在片材151上具備第1凹部12、第2凹部16以及饋送孔11的製作載送帶用片材155。 With the above steps, the second punching of the feed hole 11 is performed. Then, by repeatedly implementing the second punching, that is, sequentially performing the second and subsequent punching, a plurality of feeding holes 11 can be formed. As a result, the sheet 151 for manufacturing a carrier tape including the first recessed portion 12, the second recessed portion 16, and the feed hole 11 can be manufactured.

〔E〕接著,將所製得之製作載送帶用片材155,以第1面15或是第2面13為捲軸(芯材)側進行捲繞(捲繞步驟)。 [E] Next, the prepared sheet 155 for a carrier tape is wound with the first surface 15 or the second surface 13 as a reel (core material) side (winding step).

像這樣將製作用片材155捲繞於捲軸,有助於節省製作用片材155的保管時以及輸送時的空間。 Wrapping the production sheet 155 on the reel in this manner helps to save space during storage and transportation of the production sheet 155.

另外,保管時以及輸送時的製作用片材155的態樣,不限於捲繞在捲軸上的情況,例如,亦可將形成帶狀的製作載送帶用片材155,在其中段部位沿著寬度方向裁斷成長條狀的片材,在將長條狀的製作用片材155重疊的狀態下,進行保管以及輸送。另外,亦可在捲繞於捲軸之前,沿著製作用片材155的長邊方向,以既定的寬度裁切(切斷)製作用片材155,藉此製造出具備1對並排成1列的複數個第1凹部12與並排成1列的複數個饋送孔11的載送帶1。以上述方式,便可在捲繞於捲軸的狀態下製造出製作載送帶用片材155。 In addition, the aspect of the production sheet 155 during storage and transport is not limited to the case where it is wound on a reel, and for example, the sheet 155 for production carrier tape formed in a belt shape may be formed along the middle portion thereof. The long strip-shaped sheet is cut in the width direction, and stored and transported in a state where the long strip-shaped production sheet 155 is overlapped. In addition, the production sheet 155 may be cut (cut) with a predetermined width along the longitudinal direction of the production sheet 155 before being wound on a reel, thereby producing one pair of side-by-side The plurality of first recessed portions 12 in a row and the carrier tapes 1 of the plurality of feed holes 11 aligned in a row. As described above, the carrier sheet 155 can be manufactured in a state of being wound on the reel.

<包裝體的其他構造例> <Other structure examples of package body>

另外,包裝體100,除了上述的第1構造例之外,例如,亦可為以下的構造。 The package 100 may have the following structure in addition to the first structure example described above.

<<第2構造例>> << Second Structure Example >>

首先,針對包裝體的第2構造例進行說明。 First, a second structural example of the package will be described.

圖29係表示本發明之包裝體的第2構造例的部分立體圖。圖30係沿著圖29的H-H線段的剖面圖。圖31係沿著圖29的J-J線段的剖面圖。另外,在以下的說明中,將圖29~31中的上側稱為「上」,將下側稱為「下」。另外,在圖29中,為了顯示出載送帶的口袋內所收納的電子零件,將該覆蓋帶的任意一部分除去。為了更清楚地顯示出口袋的內部,將電子零件從前頭的口袋內省略。 Fig. 29 is a partial perspective view showing a second structural example of the package of the present invention. Fig. 30 is a sectional view taken along the line H-H in Fig. 29; Fig. 31 is a sectional view taken along the line J-J of Fig. 29; In the following description, the upper side in FIGS. 29 to 31 is referred to as “upper”, and the lower side is referred to as “lower”. In addition, in FIG. 29, in order to show the electronic components contained in the pocket of the carrier tape, any part of the cover tape is removed. In order to show the inside of the exit pocket more clearly, the electronic parts are omitted from the front pocket.

第2構造例的包裝體100所具備的載送帶1,係具有沿著帶狀片材之長邊方向配置的複數個第1凹部12的樹脂製電子零件收納用載送帶。第1凹部12形成於載送帶1的第1面15。載送帶1的第1面15的相反側的第2面13為幾近平坦,惟亦可像第2構造例那樣,在第1凹部12的底部以及其外周部位附近,第2面13稍微凹陷。 The carrier tape 1 included in the package 100 according to the second structural example is a carrier tape for resin electronic component storage having a plurality of first recesses 12 arranged along the longitudinal direction of the strip-shaped sheet. The first recessed portion 12 is formed on the first surface 15 of the carrier tape 1. The second surface 13 on the opposite side of the first surface 15 of the carrier tape 1 is almost flat. However, as in the second structural example, the second surface 13 may be slightly near the bottom of the first concave portion 12 and its outer peripheral portion. Sunken.

<<第3構造例>> << Third Structure Example >>

接著,針對載送帶的第3構造例進行說明。圖32係表示本發明之包裝體的第3構造例的部分立體圖。圖33係沿著圖32的K-K線段的剖面圖。圖34係沿著圖32的L-L線段的剖面圖。另外,在以下的說明中,將圖32~34中的上側稱為「上」,將下側稱為「下」。另外,在圖32中,為了顯示出載送帶的口袋內所收納的電子零件,將該覆蓋帶的任意一部分除去。為了更清楚地顯示出口袋的內部,將電子零件從前頭的口袋內省略。 Next, a third structural example of the carrier tape will be described. Fig. 32 is a partial perspective view showing a third structural example of the package of the present invention. Fig. 33 is a sectional view taken along the line K-K of Fig. 32; Fig. 34 is a sectional view taken along the line L-L in Fig. 32; In the following description, the upper side in FIGS. 32 to 34 will be referred to as “upper”, and the lower side will be referred to as “lower”. In addition, in FIG. 32, in order to show the electronic components contained in the pocket of the carrier tape, any part of the cover tape is removed. In order to show the inside of the exit pocket more clearly, the electronic parts are omitted from the front pocket.

第3構造例的包裝體100所具備的載送帶1,係具有沿著帶狀片材之長邊方向配置的複數個第1凹部12的樹脂製電子零件收納用載送帶。第1凹部12形成於載 送帶1的第1面15。載送帶1的第1面15的相反側的第2面13為幾近平坦,惟亦可像第3構造例那樣,在第1凹部12的底部以及其外周部位附近,第2面13稍微膨脹。 The carrier tape 1 included in the package 100 according to the third structural example is a carrier tape for resin electronic component storage having a plurality of first recesses 12 arranged along the longitudinal direction of the strip-shaped sheet. The first recessed portion 12 is formed on the carrier. 送 带 1 的 第一 面 15。 15 of the first surface. The second surface 13 on the opposite side of the first surface 15 of the carrier tape 1 is almost flat. However, as in the third structural example, the second surface 13 may be slightly near the bottom of the first recessed portion 12 and its outer peripheral portion. Swell.

<製作載送帶用片材製造裝置> <A sheet manufacturing apparatus for producing a carrier tape>

再者,本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置,不限於上述的第1實施態樣,例如,亦可為以下的構造。 The sheet manufacturing apparatus for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention is not limited to the first embodiment described above, and may have the following structure, for example.

<<第2實施態樣>> << 2nd implementation aspect >>

首先,針對第2實施態樣的製作載送帶用片材製造裝置500進行說明。圖35係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第2實施態樣的縱剖面圖。 First, a sheet manufacturing apparatus 500 for producing a carrier tape according to a second embodiment will be described. 35 is a longitudinal cross-sectional view showing a second embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

以下,說明與前述第1實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, differences from the first embodiment of the sheet manufacturing apparatus 500 for producing a carrier tape will be described, and description of the same matters will be omitted.

該第2實施態樣的製作載送帶用片材製造裝置500,在成形部800中,後段冷卻輥子130以及後段冷卻輥子140的配置省略,由接觸輥子110與冷卻輥子120構成成形部800。 In the sheet manufacturing apparatus 500 for producing a carrier tape in the second embodiment, the arrangement of the rear-stage cooling roller 130 and the rear-stage cooling roller 140 in the forming section 800 is omitted, and the forming section 800 is constituted by the contact roller 110 and the cooling roller 120.

在該等構造的製作載送帶用片材製造裝置500中,熔融片材150的第1面15抵接於冷卻輥子120,直到冷卻輥子120旋轉90°為止。 In the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure, the first surface 15 of the molten sheet 150 abuts on the cooling roller 120 until the cooling roller 120 rotates 90 °.

<<第3實施態樣>> << Third Implementation Aspect >>

接著,針對第3實施態樣的製作載送帶用片材製造裝置500進行說明。圖36係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第3實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a third embodiment will be described. FIG. 36 is a longitudinal sectional view showing a third embodiment of the sheet manufacturing apparatus for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

以下,說明與前述第1實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, differences from the first embodiment of the sheet manufacturing apparatus 500 for producing a carrier tape will be described, and description of the same matters will be omitted.

該第3實施態樣的製作載送帶用片材製造裝置500,在成形部800中,後段冷卻輥子140的配置省略,由接觸輥子110、冷卻輥子120以及後段冷卻輥子130構成成形部800。 In the sheet manufacturing apparatus 500 for producing a carrier tape according to the third embodiment, in the forming section 800, the arrangement of the rear-stage cooling roller 140 is omitted, and the forming section 800 is constituted by the contact roller 110, the cooling roller 120, and the rear-stage cooling roller 130.

在該等構造的製作載送帶用片材製造裝置500中,熔融片材150的第1面15抵接於冷卻輥子120,直到冷卻輥子120旋轉180°為止,熔融片材150的第2面13抵接於後段冷卻輥子130,直到後段冷卻輥子130旋轉90°為止。 In the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure, the first surface 15 of the molten sheet 150 abuts on the cooling roller 120 until the cooling roller 120 rotates 180 °, and the second surface of the molten sheet 150 13 abuts on the rear-stage cooling roller 130 until the rear-stage cooling roller 130 rotates 90 °.

<<第4實施態樣>> << 4th implementation aspect >>

接著,針對第4實施態樣的製作載送帶用片材製造裝置500進行說明。圖37係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第4實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a fourth embodiment will be described. Fig. 37 is a longitudinal sectional view showing a fourth embodiment of a manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

以下,說明與前述第1實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, differences from the first embodiment of the sheet manufacturing apparatus 500 for producing a carrier tape will be described, and description of the same matters will be omitted.

該第4實施態樣的製作載送帶用片材製造裝置500,在成形部800中,配置後段冷卻輥子130、140的位置不同,後段冷卻輥子130位在冷卻輥子120的下側。 In the sheet manufacturing apparatus 500 for producing a carrier tape according to the fourth embodiment, the forming section 800 has different positions where the rear-stage cooling rollers 130 and 140 are arranged, and the rear-stage cooling roller 130 is positioned below the cooling roller 120.

亦即,接觸輥子110的中心與冷卻輥子120的中心的連結線段,以及,後段冷卻輥子130的中心與後段冷卻輥子140的中心的連結線段,分別和冷卻輥子120的中心與後段冷卻輥子130的中心的連結線段正交。 That is, the connecting line segment between the center of the contact roller 110 and the center of the cooling roller 120, and the connecting line segment between the center of the rear cooling roller 130 and the center of the rear cooling roller 140 are respectively different from the center of the cooling roller 120 and the rear cooling roller 130. The connecting line segments at the center are orthogonal.

在該等構造的製作載送帶用片材製造裝置500中,熔融片材150的第1面15抵接於冷卻輥子120,直到冷卻輥子120旋轉90°為止,熔融片材150的第2面13抵接於後段冷卻輥子130,直到後段冷卻輥子130旋轉90°為止,熔融片材150的第1面15抵接於後段冷卻輥子140,直到後段冷卻輥子140旋轉90°為止。 In the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure, the first surface 15 of the molten sheet 150 abuts on the cooling roller 120 and the second surface of the molten sheet 150 is rotated until the cooling roller 120 rotates 90 °. 13 abuts on the rear-stage cooling roller 130 until the rear-stage cooling roller 130 rotates 90 °, and the first surface 15 of the molten sheet 150 abuts on the rear-stage cooling roller 140 until the rear-stage cooling roller 140 rotates 90 °.

<<第5實施態樣>> << 5th implementation aspect >>

接著,針對第5實施態樣的製作載送帶用片材製造裝置500進行說明。圖38係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第5實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a fifth embodiment will be described. FIG. 38 is a longitudinal sectional view showing a fifth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention. FIG.

以下,說明與前述第4實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, the differences from the apparatus for manufacturing a carrier sheet 500 according to the fourth embodiment will be described, and the description of the same matters will be omitted.

該第5實施態樣的製作載送帶用片材製造裝置500,在成形部800中,冷卻輥子120不具備成形模具220,後段冷卻輥子130具備成形模具220。 In the sheet manufacturing apparatus 500 for producing a carrier tape according to the fifth embodiment, in the forming section 800, the cooling roll 120 does not include the forming die 220, and the rear cooling roll 130 includes the forming die 220.

亦即,在本實施態樣中,省略設置在冷卻輥子120的成形模具220,而係在後段冷卻輥子130的外周面上以配置突起物的方式設置成形模具220。 That is, in this embodiment, the forming die 220 provided on the cooling roll 120 is omitted, and the forming die 220 is provided on the outer peripheral surface of the rear cooling roll 130 so as to arrange protrusions.

該等構造的製作載送帶用片材製造裝置500,在將熔融片材150供給到冷卻輥子120與接觸輥子110之間之後,會將熔融片材150供給到冷卻輥子120與後段冷卻輥子130之間,故在供給到接觸輥子110與冷卻輥子120之間時,第1面15與第2面13二者均變平坦,之後,在供給到冷卻輥子120與後段冷卻輥子130之間時,便會在第1面15上形成第1凹部12與第2凹部16。 The sheet manufacturing apparatus 500 for producing a carrier tape having such a structure supplies the molten sheet 150 to the cooling roller 120 and the rear cooling roller 130 after supplying the molten sheet 150 between the cooling roller 120 and the contact roller 110. Therefore, when supplied between the contact roller 110 and the cooling roller 120, both the first surface 15 and the second surface 13 become flat, and thereafter, when supplied between the cooling roller 120 and the rear cooling roller 130, The first concave portion 12 and the second concave portion 16 are formed on the first surface 15.

<<第6實施態樣>> << 6th implementation aspect >>

接著,針對第6實施態樣的製作載送帶用片材製造裝置500進行說明。圖39係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第6實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a sixth embodiment will be described. FIG. 39 is a longitudinal sectional view showing a sixth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

以下,說明與前述第1實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, differences from the first embodiment of the sheet manufacturing apparatus 500 for producing a carrier tape will be described, and description of the same matters will be omitted.

該第6實施態樣的製作載送帶用片材製造裝置500,在成形部800中,冷卻輥子120不具備成形模具220,接觸輥子110具備成形模具220。 In the sheet manufacturing apparatus 500 for producing a carrier tape according to the sixth embodiment, in the forming section 800, the cooling roller 120 does not include the forming die 220, and the contact roller 110 includes the forming die 220.

<<第7~第10實施態樣>> << Seventh to tenth implementation aspects >>

接著,針對第7~第10實施態樣的製作載送帶用片材製造裝置500進行說明。圖40~43係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第7~第10實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to the seventh to tenth embodiments will be described. Figs. 40 to 43 are longitudinal sectional views showing the seventh to tenth embodiments of the apparatus for producing a sheet for a carrier tape used in the method for producing a sheet for a carrier tape of the present invention.

該第7~第10實施態樣的製作載送帶用片材製造裝置500,在成形部800中,分別配置成對第1~第3、第6實施態樣的製作載送帶用片材製造裝置500更進一步設置接觸輥子170並使其抵接於第2面13的構造。亦即,第7~第10實施態樣的製作載送帶用片材製造裝置500,分別構成對第1~第3、第6實施態樣的製作載送帶用片材製造裝置500的成形部800更進一步設置接觸輥子170的構造。 The sheet manufacturing device 500 for producing a carrier tape according to the seventh to tenth embodiments is arranged in the forming section 800 so as to pair the sheets for producing a carrier tape according to the first to third and sixth embodiments. The manufacturing apparatus 500 further has a structure in which the contact roller 170 is brought into contact with the second surface 13. That is, the sheet manufacturing apparatus 500 for producing a carrier tape according to the seventh to tenth embodiments constitutes forming the sheet manufacturing apparatus 500 for producing a carrier tape according to the first to third and sixth embodiments. The part 800 is further provided with the structure of the contact roller 170.

該等構造的製作載送帶用片材製造裝置500,由於以接觸輥子110與接觸輥子170二者使第2面13平坦化,故可更進一步提高第2面13的平坦度。 Since the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure flattens the second surface 13 by using both the contact roller 110 and the contact roller 170, the flatness of the second surface 13 can be further improved.

<<第11實施態樣>> << 11th implementation aspect >>

接著,針對第11實施態樣的製作載送帶用片材製造裝置500進行說明。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to an eleventh embodiment will be described.

圖44係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第11實施態樣的縱剖面圖。 FIG. 44 is a longitudinal sectional view showing an eleventh embodiment of the apparatus for manufacturing a sheet for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

以下,說明與前述第1實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, differences from the first embodiment of the sheet manufacturing apparatus 500 for producing a carrier tape will be described, and description of the same matters will be omitted.

該第11實施態樣的製作載送帶用片材製造裝置500,在成形部800中,構成於複數個接觸輥子110、170以及張力輥子190裝設平坦的無接縫輸送帶300的構造。 In the eleventh embodiment, the sheet manufacturing apparatus 500 for producing a carrier belt has a structure in which a flat seamless conveyor belt 300 is mounted on a plurality of contact rollers 110 and 170 and a tension roller 190 in the forming section 800.

在該等構造的製作載送帶用片材製造裝置500中,由於抵接於平坦的無接縫輸送帶300的距離比抵接於接觸輥子110的距離更長,故可達到使第2面13更加平坦之目的。 In the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure, the distance to contact the flat seamless conveyor belt 300 is longer than the distance to the contact roller 110, so that the second surface can be achieved. 13 for the purpose of flatter.

<<第12實施態樣>> << 12th implementation aspect >>

接著,針對第12實施態樣的製作載送帶用片材製造裝置500進行說明。圖45係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第12實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a twelfth embodiment will be described. FIG. 45 is a longitudinal sectional view showing a twelfth embodiment of the apparatus for manufacturing a sheet for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

以下,說明與前述第6實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, the differences from the apparatus for manufacturing a carrier sheet 500 according to the sixth embodiment will be described, and the description of the same matters will be omitted.

該第12實施態樣的製作載送帶用片材製造裝置500,在成形部800中,構成於複數個接觸輥子110、170以及張力輥子190裝設形成有具備複數個突起物201的成形模具220的無接縫輸送帶310的構造。 In the twelfth embodiment, a sheet manufacturing apparatus 500 for producing a carrier tape is formed in a forming section 800 with a plurality of contact rollers 110 and 170 and a tension roller 190. A forming mold having a plurality of protrusions 201 is formed. The structure of the 220 seamless conveyor 310.

在該等構造的製作載送帶用片材製造裝置500中,由於與形成有模具的無接縫輸送帶310抵接的距離,比與具備模具的接觸輥子110抵接的距離更長,故可確實地提高第1凹部12以及第2凹部16的成形度。 In the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure, the distance to contact the seamless conveyor belt 310 having a mold formed thereon is longer than the distance to contact the contact roller 110 provided with the mold. The degree of molding of the first recessed portion 12 and the second recessed portion 16 can be reliably increased.

<<第13實施態樣>> << 13th implementation aspect >>

接著,針對第13實施態樣的製作載送帶用片材製造裝置500進行說明。圖46係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第13實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a thirteenth embodiment will be described. FIG. 46 is a longitudinal sectional view showing a thirteenth embodiment of the apparatus for manufacturing a sheet for a carrier tape used in the method for manufacturing a sheet for a carrier tape of the present invention.

該第13實施態樣的製作載送帶用片材製造裝置500,在成形部800中,構成於複數個接觸輥子110、170、180以及張力輥子190裝設平坦的無接縫輸送帶300,於不具有模具的複數個冷卻輥子120、130裝設形成有成形模具220的無接縫輸送帶310的構造。 In the sheet manufacturing apparatus 500 for producing a carrier tape according to the thirteenth aspect, in the forming section 800, a flat seamless conveyor belt 300 is mounted on a plurality of contact rollers 110, 170, 180 and tension rollers 190. A structure in which a seamless conveyor belt 310 having a forming die 220 is mounted on a plurality of cooling rollers 120 and 130 without a die.

在該等構造的製作載送帶用片材製造裝置500中,由於與各無接縫輸送帶300、310抵接的距離較長,故可達到使第2面13更加平坦之目的,同時可確實地提高第1凹部12以及第2凹部16的成形度。 In the sheet manufacturing apparatus 500 for producing a carrier tape having such a structure, since the contact distance with each of the seamless conveyor belts 300 and 310 is long, the purpose of flattening the second surface 13 can be achieved, and at the same time, the second surface 13 can be made flat. The degree of molding of the first recessed portion 12 and the second recessed portion 16 is reliably increased.

另外,各實施態樣的接觸輥子或冷卻輥子,除了相對於鄰接的接觸輥子或冷卻輥子等位於90度或是180度的位置之外,亦可設置成可動式,並相對於鄰接的接觸輥子或冷卻輥子,以各式各樣的角度配置。 In addition, in addition to the contact rollers or cooling rollers of each embodiment, in addition to being located at a position of 90 degrees or 180 degrees with respect to the adjacent contact rollers or cooling rollers, etc., they can also be set to be movable and relative to the adjacent contact rollers Or the cooling rollers are arranged at various angles.

<<第14實施態樣>> << 14th implementation aspect >>

接著,針對第14實施態樣的製作載送帶用片材製造裝置500進行說明。圖47係表示本發明之製作載送帶用片材的製造方法所使用的製作載送帶用片材製造裝置的第14實施態樣的縱剖面圖。 Next, a sheet manufacturing apparatus 500 for producing a carrier tape according to a fourteenth embodiment will be described. FIG. 47 is a longitudinal sectional view showing a fourteenth embodiment of the manufacturing apparatus for manufacturing a carrier tape sheet used in the manufacturing method for manufacturing a carrier tape sheet according to the present invention.

以下,說明與前述第1實施態樣的製作載送帶用片材製造裝置500的相異點,關於同樣的事項,其說明省略。 Hereinafter, differences from the first embodiment of the sheet manufacturing apparatus 500 for producing a carrier tape will be described, and description of the same matters will be omitted.

在該第14實施態樣的製作載送帶用片材製造裝置500中,片材供給部600,取代壓出成形部,係由將帶狀片材加熱以使該片材的至少第1面15側為熔融狀態或是軟化狀態而進行供給的加熱部所構成。 In the sheet manufacturing apparatus 500 for producing a carrier tape in the fourteenth aspect, the sheet supply section 600 replaces the press-forming section by heating the strip-shaped sheet so that at least the first side of the sheet The 15 side is configured by a heating section that supplies a molten state or a softened state.

亦即,在本實施態樣的製作載送帶用片材製造裝置500中,片材供給部600,取代T型模頭,具備滾筒156與噴頭700。 That is, in the sheet manufacturing apparatus 500 for producing a carrier tape according to this embodiment, the sheet supply unit 600 includes a roller 156 and a nozzle 700 instead of the T-die.

滾筒156係送出帶狀的片材151的送出機構。片材151捲繞於該滾筒156。滾筒156構成利用圖中未顯示的馬達(驅動機構)旋轉的構造,利用滾筒156的旋轉,片材151連續地從滾筒156送出。 The roller 156 is a feeding mechanism for feeding the sheet-like sheet 151. The sheet 151 is wound around the drum 156. The drum 156 is configured to be rotated by a motor (drive mechanism) not shown in the figure, and the sheet 151 is continuously sent out from the drum 156 by the rotation of the drum 156.

另外,噴頭700係從其開口部701吹出經過加熱之熱風的加熱機構。噴頭700構成以下構造:配置在滾筒156與冷卻輥子120之間,對從滾筒156送出的片材151的第1面15吹送經過加熱的熱風,藉此使片材151的至少第1面15側熔融或是軟化。 The shower head 700 is a heating mechanism that blows out heated hot air from its opening 701. The shower head 700 has a structure that is disposed between the drum 156 and the cooling roller 120, and blows heated hot air to the first surface 15 of the sheet 151 sent out from the drum 156, thereby causing at least the first surface 15 side of the sheet 151 Melt or soften.

另外,噴頭700並不限於如圖47的從開口部701對第1面15吹送經過加熱之熱風的構造。例如,亦可為以經過加熱的熱板抵接於第1面15的構造。亦即,加熱機構,只要是能夠將片材151加熱而至少將第1面15側熔融或是軟化的構造,無論是什麼樣的構造都可以。 The shower head 700 is not limited to a structure in which heated hot air is blown from the opening 701 to the first surface 15 as shown in FIG. 47. For example, it may have a structure in which the heated hot plate is in contact with the first surface 15. That is, the heating mechanism may be any structure as long as it can heat the sheet 151 and melt or soften at least the first surface 15 side.

另外,對片材151吹送熱風的程度,亦即片材151的加熱程度,只要在抵壓於成形模具220時,第1面15側軟化到可在片材151的第1面15上形成第1凹部12以及第2凹部16的程度即可,第1面15側並不一定非得要熔融才行。然後,亦無必要使包含第2面13側在內的全體均軟化或是熔融。 In addition, the degree to which the hot air is blown to the sheet 151, that is, the degree of heating of the sheet 151, as long as the first surface 15 side is softened when pressed against the forming die 220, can form a first The degree of the first recessed portion 12 and the second recessed portion 16 is sufficient, and the first surface 15 side does not necessarily have to be melted. Then, it is not necessary to soften or melt the whole including the second surface 13 side.

在該等本實施態樣的製作載送帶用片材製造裝置500中,係由滾筒156與噴頭700構成加熱部。利用該加熱部,構成供給至少第1面15側為熔融狀態或是軟化狀態的帶狀片材的片材供給部600。 In the sheet manufacturing apparatus 500 for producing a carrier tape according to this aspect, the heating unit is constituted by the drum 156 and the shower head 700. The heating unit constitutes a sheet feeding unit 600 that supplies a strip-shaped sheet in a molten state or a softened state on at least the first surface 15 side.

該等構造的本實施態樣的製作載送帶用片材製造裝置500,首先,利用圖中未顯示的馬達的驅動,使滾筒156旋轉,將捲繞於滾筒156的片材151,連續地送出(供給)到接觸輥子110與冷卻輥子120之間。 The sheet manufacturing apparatus 500 for producing a carrier tape according to this embodiment of the structure described above first rotates the drum 156 by driving a motor (not shown), and continuously rolls the sheet 151 wound on the drum 156 continuously. It is sent out (supplied) between the contact roller 110 and the cooling roller 120.

接著,在滾筒156與冷卻輥子120的途中,對片材151的第1面15,從噴頭700的開口部701,吹送經過加熱的熱風。藉此,片材151的至少第1面15側受到熔融或是軟化,結果,片材151成為至少第1面15側為熔融或是軟化狀態的熔融片材150,並送出到接觸輥子110與冷卻輥子120之間。 Next, the heated hot air is blown from the opening 701 of the shower head 700 to the first surface 15 of the sheet 151 in the middle of the drum 156 and the cooling roller 120. As a result, at least the first surface 15 side of the sheet 151 is melted or softened. As a result, the sheet 151 becomes a molten sheet 150 in which at least the first surface 15 side is melted or softened, and is sent to the contact roller 110 and Between the cooling rollers 120.

另外,在本實施態樣中,捲繞於滾筒156的形成帶狀(長方形形狀)的片材151,係送出到接觸輥子110與冷卻輥子120之間,惟所送出的片材151並不限於該等構造。例如,亦可將形成帶狀的片材151預先裁斷成長條狀,並將該形成長條狀的片材151送出到接觸輥子110與冷卻輥子120之間。此時,在製作載送帶用片材製造裝置500中,滾筒156的配置可省略,加熱部係由噴頭700所構成。 In addition, in this embodiment, the strip-shaped (rectangular) sheet 151 wound around the drum 156 is sent out between the contact roller 110 and the cooling roller 120, but the sent-out sheet 151 is not limited to Such structures. For example, the strip-shaped sheet 151 may be cut into a strip shape in advance, and the strip-shaped sheet 151 may be sent out between the contact roller 110 and the cooling roller 120. In this case, in the sheet manufacturing apparatus 500 for producing a carrier tape, the arrangement of the rollers 156 may be omitted, and the heating section is constituted by the shower head 700.

像這樣,取代壓出成形部,以加熱部構成片材供給部的情況,亦可獲得與該第1實施態樣所說明的同樣的效果。 In this way, the same effect as that described in the first embodiment can be obtained when the sheet feeding section is configured by the heating section instead of the press-forming section.

然而,若像該第1~13實施態樣那樣,以壓出成形部構成片材供給部,便可用一連串的動作一併實行片材151的製造與片材151上的第1凹部12的成形。因此,無須庫藏、準備預先裁切為必要之厚度、寬度、長度的帶狀片材,故可解決因為資材購入費或加工費等費用的增加導致成本提高這樣的問題。 However, as in the first to thirteenth embodiments, if the sheet feeding portion is formed by the press-forming portion, the sheet material 151 can be manufactured together with the first concave portion 12 on the sheet material 151 by a series of operations. . Therefore, there is no need to store and prepare to cut the strip-shaped sheet with necessary thickness, width, and length in advance. Therefore, it can solve the problem that the cost increases due to the increase in the cost of materials purchase or processing.

以上,係根據圖式所示之實施態樣說明本發明的製作載送帶用片材、製作載送帶用片材的製造方法以及包裝體,惟本發明並非僅限於該等態樣。 In the above, the manufacturing method of the sheet for carrying tapes, the manufacturing method of the sheet for carrying tapes, and the packaging body of the present invention have been described based on the embodiments shown in the drawings, but the present invention is not limited to these aspects.

例如,在製作載送帶用片材製造裝置中,可將其各部位的構造置換成可發揮相同功能的任意構造,或者,亦可附加任意構造。另外,亦可將該第1~第14實施態樣的構造任意組合。 For example, in the sheet manufacturing apparatus for producing a carrier tape, the structure of each part may be replaced with an arbitrary structure that can perform the same function, or an arbitrary structure may be added. The structures of the first to fourteenth embodiments may be arbitrarily combined.

再者,該實施態樣,在製作載送帶用片材製造裝置中,成形模具係具備複數個突起物,惟該突起物的數目,可因應欲於載送帶成形的第1凹部以及第2凹部的數目適當設定之,根據該等第1凹部以及第2凹部的數目,亦可為2個。亦即,成形模具只要具有2個以上的突起物即可。 Furthermore, in this embodiment, in the sheet manufacturing apparatus for producing a carrier tape, the forming die includes a plurality of protrusions, but the number of the protrusions can be determined according to the first concave portion and the first concave portion that are to be formed by the carrier tape. The number of 2 recesses is appropriately set, and may be two depending on the number of the first recesses and the second recesses. That is, the forming mold only needs to have two or more protrusions.

另外,該實施態樣,係針對電子零件收納用載送帶所具備之饋送孔為貫通其第1面與第2面的貫通孔的情況進行說明,惟饋送孔並不限於該等構造,亦可為第2面側具有底部且形成於第1面側的孔部。 In addition, this embodiment is described in the case where the feeding holes provided in the electronic component storage carrier tape are through holes penetrating the first surface and the second surface thereof, but the feeding holes are not limited to such structures, and It may be a hole portion having a bottom on the second surface side and formed on the first surface side.

【產業上的可利用性】 [Industrial availability]

根據本發明,便可提供一種可製作出相對於可收納電子零件的凹部(第1凹部)以優良的位置精度形成饋送孔的載送帶的製作載送帶用片材、其製造方法以及具備該載送帶的包裝體。因此,本發明具有產業上的可利用性。 According to the present invention, it is possible to provide a carrier tape sheet that can produce a carrier tape that can form a feed hole with excellent positional accuracy with respect to a recessed portion (first recessed portion) that can accommodate an electronic component, a manufacturing method thereof, and A package of the carrier tape. Therefore, the present invention has industrial applicability.

Claims (29)

一種製作載送帶用片材,其由帶狀片材所構成,且為樹脂製,其特徵為:具有第1面以及位於該第1面的相反側的第2面;在該第1面上,形成有沿著該片材之長邊方向配置的複數個第1凹部所構成的列,以及與該第1凹部平行配置的複數個第2凹部所構成的2列;該複數個第2凹部所構成的2列,配置成夾著該複數個第1凹部所構成的列,該製作載送帶用片材,在其短邊方向的端部側,具有可沿著其長邊方向切斷除去的2個部分,於該可除去之2個部分分別形成有該複數個第2凹部所構成的2列。A sheet for producing a carrier tape, which is composed of a strip-shaped sheet and made of resin, and has a first surface and a second surface located on the opposite side of the first surface; and on the first surface A row formed by a plurality of first recessed portions arranged along the longitudinal direction of the sheet and two rows formed by a plurality of second recessed portions arranged in parallel with the first recessed portion are formed. The two rows formed by the recessed portions are arranged so as to sandwich the plurality of first recessed portions. The sheet for the carrier tape is formed on the end side in the short side direction and can be cut along the long side direction. The two parts removed by cutting are formed in the two rows formed by the plurality of second recesses in the two parts that can be removed. 如申請專利範圍第1項之製作載送帶用片材,其中,在該第1面之中的除了該可除去之2個部分以外的區域,更形成有與該第1凹部平行配置的複數個饋送孔。For example, the sheet for producing a carrier tape in the scope of the first patent application, wherein a plurality of areas other than the two removable portions of the first surface are formed in parallel with the first recess. Feed holes. 如申請專利範圍第1項之製作載送帶用片材,其中,該第2面為幾近平坦。For example, if the sheet for the carrier tape is produced in the first patent application, the second surface is almost flat. 如申請專利範圍第3項之製作載送帶用片材,其中,若令該第2凹部的深度為J(mm),令該製作載送帶用片材的該第2凹部的底部的厚度為K(mm),且令該製作載送帶用片材的該第1凹部以及該第2凹部以外的部分的厚度為C(mm),則J+K=C大致成立。For example, if a sheet for a carrier tape is made in the scope of application for item 3, if the depth of the second recess is J (mm), the thickness of the bottom of the second recess for the sheet for carrier tape is made. Is K (mm), and the thickness of the portion other than the first recessed portion and the second recessed portion of the sheet for the carrier tape is C (mm), J + K = C is substantially established. 如申請專利範圍第3項之製作載送帶用片材,其中,若令該第2凹部的深度為J(mm),令該製作載送帶用片材的該第2凹部的底部的厚度為K(mm),且令該製作載送帶用片材的該第1凹部以及該第2凹部以外的部分的厚度為C(mm),則-0.1<C-(J+K)<0.1成立。For example, if a sheet for a carrier tape is made in the scope of application for item 3, if the depth of the second recess is J (mm), the thickness of the bottom of the second recess for the sheet for carrier tape is made. Is K (mm), and the thickness of the portion other than the first recessed portion and the second recessed portion of the sheet for the carrier tape is C (mm), then -0.1 <C- (J + K) <0.1 Established. 如申請專利範圍第3項之製作載送帶用片材,其中,若令該第2凹部的深度為J(mm),且令該製作載送帶用片材的該第1凹部以及該第2凹部以外的部分的厚度為C(mm)時,則C-0.15≦J≦C-0.05成立。For example, if a sheet for a carrier tape is made in the third scope of the patent application, if the depth of the second recessed part is J (mm), the first recessed part of the sheet for the carrier strap and the first recessed part are made. 2 When the thickness of the portion other than the recess is C (mm), C-0.15 ≦ J ≦ C-0.05 is established. 如申請專利範圍第1項之製作載送帶用片材,其中,該第2凹部的內側的緣部彎曲成曲率半徑在0.2mm以下。For example, if a sheet for a carrier tape is produced in the scope of the patent application, the inner edge of the second recessed portion is bent to have a curvature radius of 0.2 mm or less. 如申請專利範圍第1項之製作載送帶用片材,其中,將該第1面或是該第2面當作芯材側進行捲繞,該芯材的直徑為5~300mm。For example, if the sheet for the carrier tape is produced in the first patent application, the first surface or the second surface is wound as the core material side, and the diameter of the core material is 5 to 300 mm. 一種製作載送帶用片材的製造方法,其係申請專利範圍第1至8項中任一項所記載之製作載送帶用片材的製造方法,其特徵為包含:成膜步驟,其將該帶狀片材以壓出成形法成膜;以及成形步驟,其在該帶狀片材的第1面上形成該複數個第1凹部所構成的列以及該複數個第2凹部所構成的2列。A manufacturing method for manufacturing a sheet for a carrier tape is a manufacturing method for manufacturing a sheet for a carrier tape as described in any one of claims 1 to 8 of the scope of application for a patent, and is characterized by including a film forming step, Forming the strip-shaped sheet into a film by an extrusion molding method; and a forming step of forming a row of the plurality of first recesses and a plurality of second recesses on the first surface of the strip-shaped sheet 2 columns. 如申請專利範圍第9項之製作載送帶用片材的製造方法,其中,於該成形步驟中使用成形模具,該成形模具具有分別用來形成該第1凹部以及該第2凹部的第1突起物以及第2突起物。For example, in the method for manufacturing a sheet for a carrier tape according to item 9 of the patent application, a forming mold is used in the forming step, and the forming mold has first and second recesses for forming the first and second recesses, respectively. A protrusion and a second protrusion. 如申請專利範圍第10項之製作載送帶用片材的製造方法,其中,該成形模具具備輥子狀的第1模具部,於該第1模具部之外周具有1個以上的該第1突起物。For example, the manufacturing method of a sheet for a carrier tape according to item 10 of the patent application, wherein the forming mold includes a roller-shaped first mold portion, and the first mold portion has at least one first protrusion on the outer periphery. Thing. 如申請專利範圍第10項之製作載送帶用片材的製造方法,其中,該成形模具具備輥子狀的第2模具部,於該第2模具部之外周具有1個以上的該第2突起物。For example, the method for manufacturing a sheet for a carrier tape according to item 10 of the patent application, wherein the forming mold includes a roller-shaped second mold portion, and the second mold portion has one or more second protrusions on the outer periphery. Thing. 如申請專利範圍第9項之製作載送帶用片材的製造方法,其中,於該成形步驟中,使該帶狀片材的第2面平坦化。For example, in the method for manufacturing a sheet for a carrier tape according to item 9 of the patent application scope, in the forming step, the second surface of the band-shaped sheet is flattened. 如申請專利範圍第13項之製作載送帶用片材的製造方法,其中,於該成形步驟中,使用令該帶狀片材的第2面平坦化的接觸輥子。For example, in the method for manufacturing a sheet for a carrier tape according to item 13 of the patent application, in the forming step, a contact roller for flattening the second surface of the band-shaped sheet is used. 如申請專利範圍第9項之製作載送帶用片材的製造方法,其中,於該成形步驟之後,更具有將該帶狀片材冷卻的冷卻步驟。For example, the method for manufacturing a sheet for a carrier tape according to item 9 of the patent application, further comprising a cooling step of cooling the band-shaped sheet after the forming step. 如申請專利範圍第15項之製作載送帶用片材的製造方法,其中,於該冷卻步驟中,使用冷卻輥子。For example, the manufacturing method of the sheet | seat for carrier tapes of Claim 15 of a patent application range WHEREIN: In this cooling process, a cooling roller is used. 如申請專利範圍第15項之製作載送帶用片材的製造方法,其中,於該冷卻步驟之後,更具有在該帶狀片材上加工製出與該第1凹部平行配置的複數個饋送孔的沖孔步驟。For example, the method for manufacturing a sheet for a carrier tape according to item 15 of the application, wherein after the cooling step, a plurality of feeds arranged in parallel with the first recessed portion are processed on the band-shaped sheet. Hole punching step. 如申請專利範圍第17項之製作載送帶用片材的製造方法,其中,於該沖孔步驟中,使用沖孔模具,該沖孔模具具備用來加工製出該饋送孔的沖孔工具。For example, a method for manufacturing a sheet for a carrier tape according to item 17 of the application, wherein, in the punching step, a punching die is used, and the punching die is provided with a punching tool for processing the feeding hole. . 如申請專利範圍第18項之製作載送帶用片材的製造方法,其中,該沖孔模具,具有位置修正機構,用來確保該第1凹部與該饋送孔的位置精度。For example, the method for manufacturing a sheet for a carrier tape according to item 18 of the patent application, wherein the punching die has a position correction mechanism for ensuring the position accuracy of the first recess and the feeding hole. 如申請專利範圍第19項之製作載送帶用片材的製造方法,其中,該位置修正機構具有:位置修正用導件以及位置控制用導件,其用來控制與該第1凹部平行配置的該第2凹部的位置;以及導件銷,其用來控制該饋送孔的位置。For example, the method for manufacturing a sheet for a carrier tape according to item 19 of the patent application, wherein the position correction mechanism includes a position correction guide and a position control guide for controlling a parallel arrangement with the first recess. The position of the second recess; and a guide pin for controlling the position of the feeding hole. 如申請專利範圍第20項之製作載送帶用片材的製造方法,其中,該沖孔模具,在沖出該請送孔的該沖孔工具之該帶狀片材的行進方向入口側與出口側的各外側具有該位置修正用導件。For example, the manufacturing method of a sheet for a carrier tape according to the scope of application for patent No. 20, wherein the punching die is at the entrance side of the strip-shaped sheet in the direction of travel of the punching tool for punching the punching tool and The position correction guide is provided on each outer side of the exit side. 如申請專利範圍第20項之製作載送帶用片材的製造方法,其中,該沖孔模具,在沖出該饋送孔的該沖孔工具之該帶狀片材的行進方向入口側與出口側的各外側具有該位置控制用導件。For example, in the method for manufacturing a sheet for a carrier tape according to item 20 of the application, wherein the punching die has an entrance side and an exit side of the strip-shaped sheet in the direction of travel of the punching tool for punching the feed hole Each side outer side has the position control guide. 如申請專利範圍第20項之製作載送帶用片材的製造方法,其中,該沖孔模具,在沖出該饋送孔的該沖孔工具的該帶狀片材的行進方向出口側具有該導件銷。For example, the method for manufacturing a sheet for a carrier tape as claimed in claim 20, wherein the punching die has the exit side of the belt-shaped sheet of the punching tool of the punching tool that has the feeding hole. Guide pin. 如申請專利範圍第20項之製作載送帶用片材的製造方法,其中,於該沖孔步驟中,在以擋板壓住該帶狀片材的該第1面之前,先以該位置修正用導件控制住該第2凹部的位置。For example, in the method for manufacturing a sheet for a carrier tape in the scope of application for a patent, in the punching step, before pressing the first surface of the band-shaped sheet with a baffle, the position The correction guide controls the position of the second recessed portion. 如申請專利範圍第24項之製作載送帶用片材的製造方法,其中,於該沖孔步驟中之使用該沖孔工具施壓於該帶狀片材的最初第1發中,在以該位置修正用導件控制該第2凹部的位置之前,先以位置控制用導件控制住該第2凹部的位置。For example, in the method for manufacturing a sheet for a carrier tape in the scope of application for patent No. 24, in the punching step, the punching tool is used to press the first round of the tape-shaped sheet in the first round. Before the position correction guide controls the position of the second recessed portion, the position control guide controls the position of the second recessed portion. 如申請專利範圍第25項之製作載送帶用片材的製造方法,其中,若令以該位置修正用導件控制該第2凹部的位置之最大量為U(mm),且令該第2凹部的中心軸與該位置控制用導件的中心軸之位置偏差的最大量為V(mm),則V≦U成立。For example, if the method for manufacturing a sheet for a carrier tape is applied for item 25 of the scope of patent application, if the maximum amount for controlling the position of the second recessed portion by the position correction guide is U (mm), and the first The maximum amount of positional deviation between the central axis of the recessed portion and the central axis of the position control guide is V (mm), and V ≦ U is established. 如申請專利範圍第25項之製作載送帶用片材的製造方法,其中,於該沖孔步驟中之使用該沖孔工具施壓於該帶狀片材的第2發以後,在以該位置修正用導件控制該第2凹部的位置之前,先以該導件銷控制住該饋送孔的位置。For example, in the method for manufacturing a sheet for a carrier tape in the scope of application for a patent, in the punching step, the punching tool is used to press the belt-shaped sheet in the second round after the second round. Before the position correction guide controls the position of the second recess, the position of the feed hole is controlled by the guide pin. 如申請專利範圍第27項之製作載送帶用片材的製造方法,其中,若令以該位置修正用導件控制該第2凹部的位置之最大量為U(mm),且令該饋送孔的中心軸與該導件銷的中心軸之位置偏差的最大量為W(mm),則W<U成立。For example, the manufacturing method of a sheet for a carrier tape according to item 27 of the patent application, wherein if the maximum amount of the position of the second recessed portion controlled by the position correction guide is U (mm), and the feeding If the maximum amount of positional deviation between the central axis of the hole and the central axis of the guide pin is W (mm), then W <U holds. 一種包裝體,包含:電子零件收納用載送帶,其係將申請專利範圍第1至8項中任一項所記載的製作載送帶用片材以包含該第1凹部在內的方式按既定的寬度裁切所製得;以及上覆蓋帶,其在該第1凹部內收納有電子零件的狀態下封裝該第1凹部的開口。A packaging body comprising: a carrier tape for storing electronic parts, wherein the sheet for producing a carrier tape described in any one of claims 1 to 8 of the scope of patent application is made in such a manner as to include the first recess It is obtained by cutting a predetermined width; and an upper cover tape which seals the opening of the first recessed portion in a state where electronic components are stored in the first recessed portion.
TW103116892A 2013-05-14 2014-05-13 Sheet for producing carrier tape, method of producing sheet for producing carrier tape and package TWI630155B (en)

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JP2019094078A (en) * 2017-11-20 2019-06-20 信越ポリマー株式会社 Carrier tape and method for molding carrier tape
CN108515688B (en) * 2018-04-11 2020-07-28 王君豪 Preparation method of super-hydrophobic plastic film
US11452247B2 (en) * 2018-11-20 2022-09-20 Advantek, Inc. Multi-row carrier tape with alternating, staggered dummy pockets
WO2020129692A1 (en) * 2018-12-20 2020-06-25 株式会社村田製作所 Electronic component tray
CN113753291A (en) * 2021-08-20 2021-12-07 重庆荣亿精密机械有限公司 Carrier tape forming device capable of realizing nut accommodation

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JP2002308211A (en) * 2001-04-19 2002-10-23 Yayoi Kk Parts transferring member and its manufacturing method

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WO2014185155A1 (en) 2014-11-20
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