JPH09290891A - Carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrier tape which can hold and store electrical parts such as a semi-conductor package in a proper attitude and furthermore, can be produced inexpensively. SOLUTION: This carrier tape 1 is provided with many U shaped cavities 10 having a square opening at a fixed interval in its lengthwise direction. In each of the cavity 10, a semi-conductor package P having a lead Pb and a mold part Pa is kept and stored. In this case, at the bottom face of each cavity 10, a pedestal 11 is formed by tube swelling, and around the pedestal 11 a protruding rib 13 is provided. On the upper face of the pedestal 10, apart from the rib 13, a plurality of convex parts 17 are provided positioned symmetrically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for supplying or transporting electronic parts to a mounting device, and more particularly,
QFP (Quad Flat Packag)
e) Carrier tape suitable for semiconductor devices such as

[0002]

2. Description of the Related Art As a conventional carrier tape, for example, Japanese Patent Publication No. 4-42260 or Japanese Patent Publication No. 7-2
The one described in Japanese Patent No. 3172 is known. In the former Japanese Patent Publication No. 4-42260, as shown in FIG. 6, a strip-shaped elongated body in which a plurality of concave engaging portions 2 are formed,
The engaging portion 2 is described as a carrier tape 1 formed so as to be based on a convex portion 4 having a plurality of protruding portions 3 formed on the upper peripheral edge thereof, and the mold portion Pa and the lead Pb are provided in the engaging portion 2. A semiconductor package (electronic component) P having

The latter Japanese Patent Publication No. 7-23172 discloses a carrier tape in which a large number of cavities are provided at regular intervals, and the cavities consist of a pedestal and a groove-shaped lead accommodating portion, and the upper side edge of the pedestal A carrier tape having a ridge and a groove formed between the ridge and the side edge of the base is described.

[0004]

However, in the carrier tape described in Japanese Patent Publication No. 4-42260, the former, the base end (the rising portion) of the protrusion 3 and the protrusion 4 are provided.
Of the upper surface of the semiconductor package P is continuous in an arc surface, that is, the protrusion 3 rises in a gentle arc surface, so that when the semiconductor package P is mounted on the convex portion 4, the edge of the bottom surface of the mold portion Pa of the semiconductor package P is There is a problem that the semiconductor package P rises up on the arc surface and is lifted up to be accommodated obliquely (see FIG. 6).

That is, in general, the carrier tape 1 is formed by pressing, compressed air or vacuum forming, but the corner portion which is the boundary between the upper surface of the convex portion 4 and the base end of the protruding portion 3 should be a complete edge. It is difficult to avoid that the semiconductor package P has an arc surface, and the semiconductor package P has a mold portion Pa on the arc surface.
There is a problem (first problem) that the edge of the vehicle rides up and is housed in an inclined state. In particular, the edge of the mold portion Pa of the semiconductor package P has various shapes depending on the manufacturing companies, and the corner portions of the carrier tape 1 also have various shapes, so it is difficult to unify them, and the above-mentioned first problem is also remarkable. Met.

Further, in the latter carrier tape disclosed in Japanese Patent Publication No. 7-23172, since the groove portion is formed inwardly adjacent to the protrusion, the above-mentioned Japanese Patent Publication No. 4-422.
Although it is possible to solve the problem of Japanese Patent Laid-Open No. 60, the microfabrication of protrusions for groove formation is indispensable in the mold for molding the carrier tape, which increases the manufacturing cost of the mold, and in molding the carrier tape. There is a problem (second problem) that the durability of the mold is also reduced.

Further, in any of the above-mentioned carrier tapes, a cover tape is laminated on the surface of the opening side of the cavity after accommodating the electronic parts in the cavity, and in this state, it is wound around a reel or the like for transportation. For convenience of loading, etc., the size of the cavity is larger than the size of electronic parts,
There is a problem (third problem) that the electronic parts rattle in the cavity during transportation. The invention described in claims 1 and 2 is made in view of the first and second problems, and it is possible to store and hold electronic components such as a semiconductor package in an appropriate posture, and to manufacture at low cost. The present invention is made in view of the third problem described above, and an object of the present invention is to provide a carrier tape capable of suppressing rattling of an electronic component housed therein.

[0008]

In order to achieve the above object, the invention according to claim 1 is a carrier tape in which a plurality of concave cavities capable of accommodating electronic components with leads are formed at predetermined intervals, A pedestal was bulged on the bottom surface of the cavity, ribs were continuously or intermittently provided on the periphery of the pedestal, and convex portions were provided on the upper surface of the pedestal, spaced apart from the ribs.

According to a second aspect of the present invention, in a carrier tape in which a plurality of concave cavities capable of accommodating leaded electronic components are formed at predetermined intervals, a pedestal is bulged at the center of the bottom surface of the cavities. At the same time, the ribs are formed on the bottom surface of the cavity so as to surround the pedestal continuously or intermittently around the pedestal.

The carrier tape according to the second aspect of the present invention can be configured such that the pedestal is formed in line or point symmetry with respect to the bottom surface of the cavity (third aspect).

Further, in a fourth aspect of the present invention, in a carrier tape having a plurality of concave cavities capable of accommodating electronic components with leads formed at predetermined intervals, a pedestal is bulged on the bottom surface of the cavities. A rib is provided so as to protrude from the peripheral edge of the pedestal, and a concave portion is bulged in the cavity bottom direction on the upper surface of the pedestal so that the bottom portion projects from the cavity bottom portion.

The electronic component has leads extending from the mold portion, and is represented by the semiconductor device such as QFP described above. In the carrier tape, a large number of cavities are formed at regular intervals and, if necessary, a large number of feed holes are formed at one side or both sides at regular intervals. This carrier tape is made of polystyrene, polyvinyl chloride resin,
It is manufactured by molding a thermoplastic resin sheet such as polyethylene terephthalate or polypropylene by the above-mentioned vacuum forming or the like. The cavity is composed of, for example, a recess having a shape corresponding to that of the electronic component, such as a rectangular parallelepiped or a cubic recess having an opening on one surface (surface).

And, as a desirable mode, claim 1
In the carrier tape according to the described invention, the pedestal has an upper surface having a planar shape corresponding to the molded portion of the electronic component, for example, a shape such as a square, and the ribs at the periphery of the pedestal are continuous or intermittently over the entire circumference. They are formed, or they are provided at intervals. The ribs may be formed in such a shape that the distance between the parts located on the opposite sides of the pedestal corresponds to the size of the mold part of the electronic component, and the tip or the inside thereof abuts the side wall rising from the bottom surface of the mold part. desirable. By adopting this shape, it is possible to prevent the lead from interfering with the rib. One or more convex portions are formed so that electronic components can be stably placed on the upper surface of the pedestal. In the case of one, the convex portion is formed in a plane shape that is point-symmetrical or line-symmetrical with respect to the upper surface of the pedestal and has a sufficient area for mounting electronic components. Are arranged point-symmetrically or line-symmetrically.

In the carrier tape according to the second aspect of the invention, the rib is formed in a frame shape corresponding to the mold part of the electronic component, for example, a frame shape such as a square, and the upper surface of the pedestal is the rib. On the other hand, it is formed in a plane shape that is point-symmetrical or line-symmetrical, and the mold part of the electronic component is placed on the inner part of the rib, that is, the inner part of the rib is the pedestal part. As an example, the pedestal is formed in a plane shape (an irregular shape) different from the bottom surface of the cavity, preferably line or point symmetric with respect to the bottom surface of the cavity (claim 3).

Further, in the carrier tape according to the fourth aspect of the present invention, a concave portion concave toward the back side is provided on the upper surface of the pedestal with a considerable gap between the rib and the rib, in other words, electronic components are stably mounted. A space that can be placed is formed at a distance, and the bottom surface of this recess is projected from the back surface of the cavity. The protruding height and the planar shape of the recess from the back surface can be appropriately selected.
The shape of the bottom surface portion (projection portion from the back surface) of the recess is not limited to a flat surface shape, but it is also possible to form a sphere or a pyramid, and it is also possible to form irregularities on the bottom surface portion of the recess. The invention according to claim 4 is combined with the invention according to claims 1 and 2, that is, a convex portion is formed on the upper surface of the pedestal (a flat surface portion between the peripheral edge of the concave portion and the rib). It is also possible to form ribs around the pedestal and away from the pedestal.

[0016]

The carrier tape according to the inventions of claims 1 and 2 accommodates electronic components in each cavity.
The electronic part in the cavity has the mold part placed on the pedestal with its lateral movement restricted by the rib, and the lead is located in the space defined by the rib and the cavity side wall.

Here, in the carrier tape according to the first aspect of the present invention, a plurality of convex portions are formed on the upper surface of the pedestal, and the mold portion of the electronic component is placed on the convex portions. Further, in the carrier tape according to the second aspect of the present invention, the pedestal and the rib stand up from the bottom surface of the cavity with a corresponding gap, and the mold part of the electronic component is placed on the pedestal. For this reason, even if the base end portion of the rib, that is, the rising portion of the rib from the upper surface of the pedestal is arcuate, it is possible to prevent inconvenience such as the electronic components being obliquely accommodated.

Further, in the carrier tape according to the invention described in claim 4, a cover tape or the like is stuck after the electronic parts are housed in the cavity and the opening of the cavity is closed. It is rotated and transported.
Then, in the state of being wound on this reel, since the bottom part of the recess of the carrier tape located on the upper side presses the electronic part in the cavity of the carrier tape located on the lower side from above the cover tape, the electronic part in the cavity is It can suppress the rattling.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. 1A and 1B show a carrier tape according to an embodiment of the invention described in claim 1, FIG. 1A is a plan view, FIG. 1B is a sectional view taken along the line AA of FIG. 1A, and FIG. 1C is B- of FIG. 1A. FIG. Note that FIG.
The same numbers are given to the same parts as, and some explanations are omitted.

In the figure, reference numeral 1 denotes a carrier tape, and a large number of concave-shaped cavities 10 opening on one surface (front surface) are formed in the carrier tape 1 at regular intervals in the longitudinal direction, and a large number on one side in the width direction. Feed holes 20 are formed at regular intervals in the longitudinal direction. Although illustration and detailed description are omitted, in the carrier tape 1, a well-known cover tape is attached to the surface in a state where the electronic components are housed in the cavity 10, and the opening of the cavity 10 is closed.

The cavity 10 is composed of a concave portion that opens in a square shape on the surface of the tape 1, and a pedestal 11 having a square shape in plan view, which protrudes from a peripheral side surface with a predetermined distance, is bulged and formed on the bottom portion of the pedestal 11. The lead receiving groove 12 is formed around the lead receiving groove 12. The lead accommodating groove 12 has a substantially square frame shape in plan view, and accommodates the lead Pb of the semiconductor package P whose mold part is placed on the pedestal 11.

The pedestal 11 has a trapezoidal cross section in which the side walls are inclined in a direction in which they approach each other, and the upper surface thereof has a plan view shape (rectangle in this embodiment) which is substantially the same as the mold portion Pa. The pedestal 11 is integrally provided with a rib 13 that continuously extends along the entire periphery of the upper surface of the pedestal 11, and a detection hole 19 for detecting an electronic component is formed through the center of the upper surface.

Further, a plurality (4 in the present embodiment) of convex portions 17 are symmetrically provided on the upper surface of the pedestal 11 so as to be separated from the base end (the rising portion) of the rib 13. These convex parts 1
7 is a predetermined height lower than the height of the rib 13,
For example, the height difference from the rib 13 is about ⅔ of the thickness of the lower surface of the lead of the mold portion Pa.

The projections 17 may have any shape and number as long as electronic components can be stably placed, but as an example, the projections 17 may be provided in the number and arrangement shown in FIG. That is, as shown in FIG. 2, a large convex portion 17a is formed in the central portion, and the detection hole 1 is formed at the center of the convex portion 17a.
It is also possible to form 9 and to provide eight small convex portions 17b around the convex portion 17a in point symmetry. Also,
It is also possible to form only one convex portion 17 having a planar shape as shown in FIG.

Carrier tape 1 according to this embodiment
In this case, the semiconductor package P is housed in each cavity 10 and a cover tape for closing the opening of each cavity 10 is attached to the surface. Then, in the semiconductor package P housed in the cavity 10, the mold portion Pa is placed on the pedestal 11, and the lead Pb is located in the lead housing groove 12.

Here, in the carrier tape 1, it is unavoidable that the base end portion of the rib 13 is an arcuate surface and is continuous with the upper surface of the pedestal 11, that is, the rising portion of the rib 13 is an arcuate surface. As for P, the mold portion Pa is placed on the tip surface (upper surface) of the convex portion 17. For this reason, in the semiconductor package P, the mold portion Pa does not interfere with the arcuate surface of the base end of the rib 13, and inconvenience such as inclination due to the lifting of the semiconductor package P does not occur.

The carrier tape 1 according to this embodiment is formed by press forming as described above, but it is not necessary to form fine grooves on the pedestal 11. Therefore, the mold for molding the carrier tape 1 does not require ultrafine processing, and the manufacturing cost of the mold can be reduced.
When molding the carrier tape 1, the durability of the mold is also improved.

FIG. 3 shows a carrier tape according to an embodiment of the invention described in claim 2, FIG. 3a is a partially enlarged plan view, FIG. 3b is a sectional view taken along the line CC of FIG. 3a, Figure 3
FIG. 3c is a sectional view taken along the line DD of FIG. 3a. In this embodiment and the embodiments described later, the same parts as those in the embodiment of FIG. 1 described above are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, the cavity 1
A pedestal 18 having a substantially petal shape whose upper surface is a flat surface is bulged at the center of the bottom surface of 0, and ribs 13 are formed on the bottom surface of the cavity 10 so as to surround the pedestal 18 at intervals. To project. The pedestal 18 has four portions extending in a diagonal direction and is symmetrically positioned on the bottom surface of the cavity 10. It is desirable that the pedestal 18 has a height such that the height difference between the pedestal 18 and the rib 13 is about ⅔ of the thickness of the lower surface of the lead of the mold portion Pa.
Is preferably equal to or larger than the thickness of the mold portion Pa, and the height difference between the pedestal 18 and the rib 13 is the height between the pedestal 18 and the opening surface of the cavity 10 and the mold portion Pa. It is desirable that it is smaller than the difference in thickness.

The pedestal 18 is not limited to the shape shown in FIG. 3, and as shown in FIG. 4, a pedestal 18 having a circular shape in plan view can be provided.

In this embodiment, the semiconductor package P is placed in the cavity 10 and the mold part Pa is mounted on the pedestal 18.
The lead Pb is placed on the upper side and is housed so that the lead Pb is located in the lead housing groove 12. Then, as described above, the rib 1
Although the rising portion of the cavity 3 from the bottom surface of the cavity 10 forms a circular arc surface, the pedestal 18 is separated from the rising portion of the rib 13, so that the accommodated semiconductor package P does not tilt obliquely. Further, since the carrier tape 1 does not require fine processing, a molding die can be manufactured at low cost,
The life of the mold is extended.

5a and 5b show a carrier tape according to an embodiment of the invention described in claim 4, FIG. 5a is a partially enlarged plan view, and FIG. 5b is a sectional view taken along the line EE of FIG. 5a. is there. In this embodiment, similarly to the above-described embodiment of FIG. 1, a pedestal 11 having a planar shape (substantially square) similar to the bottom surface of the cavity 10 is formed on the bottom surface of the cavity 10 so as to bulge to the surface side. A rib 13 is provided so as to be continuous along the entire periphery of the upper surface of the base 11.

The pedestal 11 has a concave portion 11c formed on the upper surface toward the rear surface (opened on the front surface side), and the bottom portion of the concave portion 11c projects a predetermined height δ from the rear surface of the cavity. The opening edge of the recess 11c has a square shape similar to the upper surface of the pedestal 11, that is, the rib 13, and forms a mounting surface 11a of the semiconductor package P with the rib 13 at a predetermined interval.

In the carrier tape of this embodiment, after the semiconductor package P is housed in the cavity 10 with the mold portion Pa mounted on the mounting surface 11a, a cover tape (not shown) is mounted on the surface. It is attached and wound and held in this state on a reel or the like. Then, in the state of being wound on the reel, the carrier tape is such that the semiconductor package P in the cavity 10 in the portion in which the concave portion 11c of the cavity 10 in the upper portion is located in the lower portion is covered with the cover tape at the opening of the cavity 10. Hold down. Therefore, it is possible to prevent the semiconductor package P from rattling in the cavity 10 even when the carrier tape wound around the reel is transported.

In the embodiment shown in FIG. 5,
The plan-view shape of the recess 11c is formed to be similar to the upper surface of the pedestal 11, but it may be formed in an irregular shape such as the pedestal 18 of FIG. 3 described above. It is also possible to attach.

[0036]

As described above, according to the carrier tapes of the first and second aspects of the invention,
It is possible to prevent the electronic parts from being obliquely housed due to the lifting of the electronic parts, etc. Further, it is possible to manufacture the molding die at a low cost and further improve the durability of the die. .

According to the carrier tape of the fourth aspect of the present invention, since the electronic component can be held while being wound and held on the reel or the like, there is rattling of the electronic component during transportation or the like. The effect that it can be prevented is obtained.

[Brief description of drawings]

1 shows a carrier tape according to an embodiment of the invention as set forth in claim 1, a is a partially enlarged plan view, b is a sectional view taken along the line AA of a, and c is a line BB of a. FIG.

FIG. 2 is a partially enlarged plan view showing another aspect of the carrier tape.

FIG. 3 shows a carrier tape according to an embodiment of the invention as set forth in claim 2, where a is a partially enlarged plan view, b is a sectional view taken along the line C-C of a, and c is a D-D of a. FIG.

FIG. 4 is a partially enlarged plan view showing another aspect of the carrier tape.

5 shows a carrier tape according to an embodiment of the invention as set forth in claim 4, a is a partially enlarged plan view, and b is a sectional view taken along the line EE of a.

FIG. 6 is a cross-sectional view of a conventional carrier tape.

[Explanation of symbols]

 1 Carrier Tape 10 Cavity 11 Pedestal 11c Recess 12 Lead Receiving Groove 13 Rib 17 Convex 18 Pedestal P Semiconductor Package (Electronic Component) Pa Mold Pb Lead

Claims (4)

[Claims] 1. A carrier tape in which a plurality of concave cavities capable of accommodating leaded electronic components are formed at predetermined intervals, and a pedestal is bulged on the bottom surface of the cavities and ribs are formed on the periphery of the pedestal. A carrier tape characterized in that it is provided continuously or intermittently with projections, and projections are provided on the upper surface of the pedestal, spaced apart from the ribs. 2. A carrier tape in which a plurality of concave cavities capable of accommodating leaded electronic parts are formed at predetermined intervals, and a pedestal is formed to bulge at the center of the bottom surface of the cavity and the bottom surface of the cavity is formed. A carrier tape characterized in that a rib surrounding the pedestal is continuously or intermittently provided around the pedestal. 3. The carrier tape according to claim 2, wherein the pedestal is formed in a plane shape that is line-symmetrical or point-symmetrical with respect to the bottom surface of the cavity. 4. A carrier tape in which a plurality of concave cavities capable of accommodating leaded electronic components are formed at predetermined intervals, and a pedestal is bulged on the bottom surface of the cavities and ribs are formed on the periphery of the pedestal. A carrier tape, wherein the carrier tape is formed so as to project, and a recess is bulged toward the bottom of the cavity on the upper surface of the pedestal so that the bottom of the recess protrudes from the bottom of the cavity.