EP1544130A1 - Packaging container for power semiconductor modules - Google Patents

Packaging container for power semiconductor modules Download PDF

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Publication number
EP1544130A1
EP1544130A1 EP04025144A EP04025144A EP1544130A1 EP 1544130 A1 EP1544130 A1 EP 1544130A1 EP 04025144 A EP04025144 A EP 04025144A EP 04025144 A EP04025144 A EP 04025144A EP 1544130 A1 EP1544130 A1 EP 1544130A1
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EP
European Patent Office
Prior art keywords
power semiconductor
packaging container
semiconductor module
support
container according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04025144A
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German (de)
French (fr)
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EP1544130B1 (en
Inventor
Marco Lederer
Rainer Popp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Elektronik GmbH and Co KG
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Semikron Elektronik GmbH and Co KG
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Publication of EP1544130A1 publication Critical patent/EP1544130A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B65D25/106—Elements projecting into a recess or through a hole in the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/025—Containers made of sheet-like material and having a shape to accommodate contents

Definitions

  • the invention describes a packaging container for power semiconductor modules their internal and / or external transport.
  • Modern power semiconductor modules especially with power transistors such as IGBT (insulated gate bipolar transistor) or MOS-FET (metal oxide semiconductor field effect transistor) are very sensitive to Touch by the human hand, because this causes electrostatic fields on the Can discharge contact elements and damage the power transistors or can destroy.
  • any type of contamination is exemplary of Contact elements or especially for base-plate-less power semiconductor modules also the Substrate base disadvantageous.
  • Substrate bases especially if they are already with before transport a pasty thermally conductive layer are also required protection against contact and / or contamination.
  • the starting point of the invention are the own patent DE 39 09 898 C2 and not previously published patent application DE 103 06 643 A1 and DE 103 20 186 A1.
  • the DE 39 09 898 C2 discloses a packaging container for power semiconductor modules the then state of the art. This was often about Power semiconductor modules constructed from thyristors. Such power semiconductor modules are exemplary insensitive to electrostatic charge. Therefore, this suggests Reference to a stackable packaging, which preferably consists of a cardboard box. Such packaging can, however, with a suitable choice of cardboard in the Protected power semiconductor module also protect against electrostatic discharges. One Protection against contact of the connection elements with the packaging itself in contrast not achievable.
  • DE 103 20 186 A1 discloses a thermal compound for a power semiconductor module, which is already provided by the manufacturer with a thermally conductive pasty layer. This is advantageous because in this way the suitable thermally conductive layer with a on the Power semiconductor module tuned layer thickness can be applied. Farther It is advantageous that as a result the assembly is simplified after transport, since here no layers of the order of 100 microns must be applied homogeneously.
  • the document provides for the protection of these layers a protective cover, which on the Power semiconductor module is placed and has knobs such that the thermally conductive layer is touched only to a small extent by this protective cover. This ensures that after removal of this protective cover, the thermally conductive layer is almost intact and remains fully functional.
  • the present invention has the object of a packaging container for the inner and / or to provide off-board transport of power semiconductor modules, the surfaces sensitive to contamination and / or other parts of the Power semiconductor module and / or sensitive to electrostatic fields Contact elements of the power semiconductor module protects and multiple use this packaging container allowed.
  • Power semiconductor modules is based on at least one molded body.
  • This shaped body has a wall and a preferably completely closed cover surface.
  • the Wall is divided into several wall sections. At least two opposite wall sections is ever a support edge or at least three Make the wall each arranged a support surface. These support edges or Support surfaces form a support for certain parts of the power semiconductor module such, that a contact of the power semiconductor module with the top surface of the shaped body is prevented.
  • the power semiconductor module is at least partially Wall sections on, or is at least closely adjacent thereto arranged, what here used synonymously.
  • the packaging container at the Covering surface of the molding at least one support. This prop extends from the top surface in the interior of the molded body, wherein it from the top surface of ins Inner tapered into and partially into a recess of the power semiconductor module extends and thereby touching the power semiconductor module with the Cover surface prevented.
  • Fig. 1 shows a first embodiment of a packaging container for a Power semiconductor module consisting of two individual moldings.
  • Fig. 2 shows a packaging container according to Fig. 1 in an orthogonal thereto Level.
  • Fig. 3 shows a second embodiment of a packaging container for a Power semiconductor module consisting of two interconnected Moldings.
  • FIG. 4 shows a packaging container according to FIG. 3 in a position orthogonal thereto Level.
  • Fig. 5 shows a third embodiment of a packaging container for a Power semiconductor module consisting of two interconnected Moldings.
  • Fig. 6 shows a packaging container according to Fig. 5 in a orthogonal thereto Level.
  • Fig. 1 shows a first embodiment of a packaging container for a Power semiconductor module (200) consisting of two individual moldings (100). Shown is a cross section through the packaging container and embedded therein Power semiconductor module (200) along the section line A-A of Fig. 2.
  • the first molded body (100a) forms the bottom part
  • the second shaped body (100b) forms the lid part.
  • Both Moldings (100) are preferably made of the same material, here one thermoformed plastic film with a thickness of 500 ⁇ m.
  • This plastic film consists of a dissipative plastic according to DIN IEC 61340 to the power semiconductor module (200) to protect against electrostatic discharge.
  • the wall of the bottom part (100a) consists of four rectangularly arranged Wall sections (110a). Here are two opposing Wall sections (110a) each have a support edge (112). Furthermore, the bottom part (100a) has a closed top surface, the bottom (120a). The opposite side is open to insert a power semiconductor module (200) in this bottom part (110a) to be able to.
  • This power semiconductor module (200) consists of a plastic housing (202) and has on the bottom (120 a) facing side (220) metallic Connection elements (222). These connection elements (222) should not be for their protection come into contact with the packaging container. That's why it lies Power semiconductor module (200) with a part of its housing (202) on the support edges (112a).
  • the housing (202) of the power semiconductor module (200) lies partially at the wall sections (110a) or only a small distance therefrom, what is considered synonymous here.
  • the supporting edges (112) must be in their Surface area consequently be formed so that by a slight horizontal position change due to the distance of the power semiconductor module (200) to the wall sections (110 a) slipping of the power semiconductor module (200) of the supporting edges (112) is not possible.
  • a packaging container as previously described is in most cases for the internal transport sufficient.
  • the packaging container preferably a second molded part (100b), the lid part, on.
  • This cover part is also of four rectangularly arranged wall sections (110b).
  • the Cover part (100b) a closed top surface, the cover (120b), on.
  • This one described power semiconductor module (200) has a centrally located recess (214) has a mounting hole (see Fig. 2), the lid (110b) of the Lid part (100b) therefore has a support (122).
  • These preferably cone or Truncated pyramid-shaped support (122) extends from the lid (120b) in the direction the interior of the lid part (100b). By its conical or truncated pyramidal shape it tapers towards the power semiconductor module (200).
  • the support (122) extends into the recess (214) of the power semiconductor module (200). In order to Only an extremely small contact surface with the power semiconductor module results (200).
  • the illustrated power semiconductor module (200) has on its cover (110b) facing side, ie on the substrate (210) has a thermally conductive pasty layer, a thermal grease (212) of the prior art. This must be before touching and Pollution protected. This is also done with the cover part presented here (100b) reached.
  • the lid part (100b) lies only with the small area of it in it formed support (122) on the power semiconductor module (200) and thus only there on the thermal grease (212).
  • the cover part (100b) protects in conjunction with the Floor part (100 a), the connecting elements (222) and the thermal paste (212) and thus the entire power semiconductor module (200) for internal and external transport sufficient.
  • Fig. 2 shows a packaging container according to Fig. 1 but in a section in a this orthogonal plane along the section line B-B of Fig. 1. Shown are the Wall sections (110b) of the rectangular wall of the cover part (100b), and the power semiconductor module (200) with its disposed on the substrate Thermal grease (212). Furthermore, the central recess (214) of the Power semiconductor module, in which the support (122) (see Fig. 1) into it extends.
  • Fig. 3 shows a second embodiment of a packaging container for a Power semiconductor module (200) consisting of two interconnected moldings (100). Shown is a cross section through the packaging container and a therein embedded power semiconductor module (200) along the section line A-A of Fig. 4.
  • the bottom part (100a) also has a rectangular wall with four Wall sections (110 a).
  • the floor (120a) has four frusto-conical supports (122). These supports (122) protrude into four mounting holes (214) of the Power semiconductor module (200) into it.
  • On the bottom (110 a) side facing the Power semiconductor module (200) this in turn has a substrate (210) with an outer metallic layer which is covered with a thermal grease (212).
  • the four supports (122) now space the power semiconductor module (200) or its substrate (210) the thermal grease (212) from the bottom (120a) such that the thermal grease (212) and the bottom (110a) only at the contact surfaces between the supports (122) and the Touch the power semiconductor module (200). This ensures that during a transport the skilletleitpaste (212) changed neither in their layer thickness nor in their homogeneity becomes. Protection against contamination is also given.
  • the packaging container has a cover part (100b), which with the bottom part (100 a) via a further molded part (300) is integrally connected. It results Thus, a packaging container by the other as a hinge, with a Rotary axis in the direction of the drawing plane, acting molding (300) is easy to use.
  • An advantage of this embodiment of the packaging container is that it by a circumferential seal can be sealed gas-tight and thus an ideal Protection for the external transport of a power semiconductor module (200) represents.
  • the cover part (100b) is designed with a rectangular wall, all here four wall sections (110b) have support edges (112) and the Power semiconductor module (200) in the region between the support edges (112) and the Opening of the lid part (100b) abuts the Wandungsabnecken (110b).
  • the Abstützkanten (112) ensure that the lid (110 b) no contact points with the Connection elements (222) of the power semiconductor module (200).
  • Fig. 4 shows a packaging container according to Fig. 3, however, in a section in one this orthogonal plane along the section line B-B of Fig. 3. Shown are the Wall sections (110a) of the rectangular wall of the bottom part (100a), and the power semiconductor module (200) with its disposed on the substrate (210) Thermal grease (212). Furthermore, the four mounting holes (214) of the Power semiconductor module (200) shown, in which the four supports (122) (see Fig. 3) extend into it.
  • Fig. 5 shows a third embodiment of a packaging container for a Power semiconductor module (200) consisting of two interconnected moldings (100). Shown is a cross section through the packaging container and a therein embedded power semiconductor module (200) along the section line A-A of Fig. 6.
  • Das Power semiconductor module (200) shown here consists of a housing (202) and a Base plate (230), according to the prior art, a copper plate with a thickness of 10mm.
  • the bottom part (100a) in turn has a rectangular wall, here in the corners between two wall sections (110a) supporting surfaces (114) (see Fig. 6) are arranged.
  • the power semiconductor module (200) lies with its corners on this Support surfaces (114) and is located with a part of its base plate (230) to the Wall sections (110a) of the base (100a) on.
  • a horizontal Slipping during transport only as far as possible, as the power semiconductor module (200) always rests on all support surfaces (114) and thus a contact between the Floor (110a) and the connection elements (222) of the power semiconductor module (200) is effectively prevented.
  • the cover part (100b) of the packaging container is again as in FIG. 3 integrally connected to the bottom part (100a). It in turn has supports (122) which are in protrude the four mounting holes (214) of the power semiconductor module (200).
  • An unillustrated packaging container designed as a disk cell Power semiconductor module (200) has at least three preferably in an equilateral one Triangle on a circular wall (110 a) arranged spacing surfaces (114), on which the housing of the disc cell rests.
  • Fig. 6 shows a packaging container according to Fig. 5 but in a section in a this orthogonal plane along the section line B-B of Fig. 5. Shown are the Wall sections (110a) of the rectangular wall of the bottom part (100a) and the power semiconductor module (200) with its on the base plate (230) arranged Thermal grease (212). Hatched here are one of the four identical in the corners the supporting walls (114) arranged in the respective wall sections (110a). On this Support surfaces (114) is the base plate (230) of the power semiconductor module (200). Furthermore, the four fastening bores (214) of the power semiconductor module (200) are in which the four supports (122) (see Fig. 5) of the cover part (100b) into which extend.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Inverter Devices (AREA)
  • Packages (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The device has at least one molded body (100a,100b) with a wall and a preferably fully closed cover surface (120a,b), supporting edges (112) or surfaces, whereby the module rests on wall sections and contact with the cover surface is prevented by the supporting edges or surfaces. The cover surface has at least one support (122) that narrows as it extends into the molded body and into an opening in the module (200) to prevent contact between the module and covering surface.

Description

Die Erfindung beschreibt ein Verpackungsbehältnis für Leistungshalbleitermodule zu deren inner- und / oder außerbetrieblichen Transport. Moderne Leistungshalbleitermodule, speziell mit Leistungstransistoren wie IGBT (insulated gate bipolar transistor) oder MOS-FET (metal oxid semiconductor field effect transistor) sind sehr empfindliche gegenüber Berührungen durch die menschliche Hand, weil sich hierdurch elektrostatische Felder auf die Kontaktelemente entladen können und die Leistungstransistoren vorschädigen oder zerstören können. Weiterhin sind jegliche Art von Verschmutzungen beispielhaft der Kontaktelemente oder speziell bei grundplattenlosen Leistungshalbleitermodulen auch der Substratunterseite nachteilig. Hierbei wird die elektrische Kontaktsicherheit im späteren Betrieb beeinträchtigt. Substratunterseiten, speziell wenn sie bereits vor dem Transport mit einer pastösen wärmeleitfähigen Schicht versehen sind, bedürfen ebenfalls eines Schutzes vor Berührung und / oder Verunreinigung.The invention describes a packaging container for power semiconductor modules their internal and / or external transport. Modern power semiconductor modules, especially with power transistors such as IGBT (insulated gate bipolar transistor) or MOS-FET (metal oxide semiconductor field effect transistor) are very sensitive to Touch by the human hand, because this causes electrostatic fields on the Can discharge contact elements and damage the power transistors or can destroy. Furthermore, any type of contamination is exemplary of Contact elements or especially for base-plate-less power semiconductor modules also the Substrate base disadvantageous. Here, the electrical contact safety in the later Operation impaired. Substrate bases, especially if they are already with before transport a pasty thermally conductive layer are also required protection against contact and / or contamination.

Ausgangspunkt der Erfindung sind das eigene Patent DE 39 09 898 C2 sowie die nicht vorveröffentlichten eigenen Patentanmeldung DE 103 06 643 A1 und DE 103 20 186 A1. Die DE 39 09 898 C2 offenbart ein Verpackungsbehältnis für Leistungshalbleitermodule nach dem damaligen Stand der Technik. Hierbei handelte es sich häufig um Leistungshalbleitermodule aufgebaut aus Thyristoren. Derartige Leistungshalbleitermodule sind beispielhaft gegen elektrostatische Aufladung unempfindlich. Daher schlägt diese Druckschrift eine stapelbare Verpackung vor, die vorzugsweise aus einer Kartonage besteht. Derartige Verpackungen können allerdings bei geeigneter Wahl der Kartonage das darin befindliche Leistungshalbleitermodul auch gegen elektrostatische Entladungen schützen. Ein Schutz gegen Kontakt der Anschlusselemente mit der Verpackung selbst demgegenüber nicht erzielbar.The starting point of the invention are the own patent DE 39 09 898 C2 and not previously published patent application DE 103 06 643 A1 and DE 103 20 186 A1. The DE 39 09 898 C2 discloses a packaging container for power semiconductor modules the then state of the art. This was often about Power semiconductor modules constructed from thyristors. Such power semiconductor modules are exemplary insensitive to electrostatic charge. Therefore, this suggests Reference to a stackable packaging, which preferably consists of a cardboard box. Such packaging can, however, with a suitable choice of cardboard in the Protected power semiconductor module also protect against electrostatic discharges. One Protection against contact of the connection elements with the packaging itself in contrast not achievable.

Die DE 103 06 643 A1 stellt ein modernes Leistungshalbleitermodul vor, welches auf einer Oberfläche eine Mehrzahl von Anschlusselementen aufweist. Da derartige Leistungshalbleitermodule nach dem Stand der Technik meist mit Leistungstransistoren und Leistungsdioden bestückt sind, sind zumindest einige der Anschlusselemente empfindlich gegen elektrostatische Entladung. Die den Anschlusselementen gegenüberliegende Oberfläche des Leistungshalbleitermodul weist hier eine außen liegende metallische Schicht als Teil des Substrats auf. Auch derartige Oberflächen bedürfen eines Schutzes gegen Verschmutzung, speziell auch durch Kontakt mit der menschlichen Hand. Durch jegliche Art von Verschmutzung wird die Haftfähigkeit einer wärmeleitfähigen Schicht, also ihre Funktion als Zwischenschicht zwischen dem Leistungshalbleitermodul und einem zu dessen Betrieb notwendigen Kühlkörper, beeinträchtigt. Hierdurch kann die im Leistungshalbleitermodul entstehende Wärme nicht in vorgesehener Weise abgeführt werden, wodurch ein Betrieb bei voller Leistungsfähigkeit des Leistungshalbleitermoduls nicht möglich ist.DE 103 06 643 A1 presents a modern power semiconductor module, which is based on a surface having a plurality of connection elements. Because such Power semiconductor modules according to the prior art usually with power transistors and Power diodes are equipped, at least some of the connection elements are sensitive against electrostatic discharge. The opposite of the connection elements Surface of the power semiconductor module here has an outer metallic layer as part of the substrate. Even such surfaces require protection against Pollution, especially through contact with the human hand. By any kind Pollution becomes the adhesiveness of a thermally conductive layer, so its function as an intermediate layer between the power semiconductor module and one for its operation necessary heatsink, impaired. As a result, in the power semiconductor module resulting heat can not be dissipated in the intended manner, whereby an operation at Full performance of the power semiconductor module is not possible.

Die DE 103 20 186 A1 offenbart eine Wärmeleitpaste für ein Leistungshalbleitermodul, welches bereits beim Hersteller mit einer wärmeleitfähigen pastösen Schicht versehen wird. Dies ist vorteilhaft, weil hierdurch die geeignete wärmeleitfähige Schicht mit einer auf das Leistungshalbleitermodul abgestimmten Schichtdicke aufgetragen werden kann. Weiterhin vorteilhaft ist, dass hierdurch die Montage nach dem Transport vereinfacht wird, da hier keine Schichten in der Größenordnung von 100µm homogen aufgebracht werden müssen. Die Druckschrift stellt zum Schutz dieser Schichten eine Schutzhülle vor, die auf das Leistungshalbleitermodul aufgesetzt wird und Noppen derart aufweist, dass die wärmeleitfähige Schicht nur zu einem geringen Teil von dieser Schutzhülle berührt wird. Somit ist gewährleistet, dass nach Entfernen dieser Schutzhülle die wärmeleitfähige Schicht annährend unversehrt ist und vollständig funktionsfähig bliebt. Somit können derartige mit einer Wärmeleitpaste versehene Leistungshalbleitermodul mit einer Schutzhülle beispielhaft in oben genanntem Verpackungsbehältnis transportiert werden. Nachteilig ist hierbei allerdings, dass die Schutzhülle vorteilhafterweise nur einmal aufgesetzt und nach dem Transport abgenommen wird. Mehrmaliges Verwenden, wie es beispielhaft beim innerbetrieblichen Transport notwendig ist, kann diese Schutzhülle nicht geeignet leisten. DE 103 20 186 A1 discloses a thermal compound for a power semiconductor module, which is already provided by the manufacturer with a thermally conductive pasty layer. This is advantageous because in this way the suitable thermally conductive layer with a on the Power semiconductor module tuned layer thickness can be applied. Farther It is advantageous that as a result the assembly is simplified after transport, since here no layers of the order of 100 microns must be applied homogeneously. The document provides for the protection of these layers a protective cover, which on the Power semiconductor module is placed and has knobs such that the thermally conductive layer is touched only to a small extent by this protective cover. This ensures that after removal of this protective cover, the thermally conductive layer is almost intact and remains fully functional. Thus, such with a thermal compound provided power semiconductor module with a protective case by way of example be transported in the above-mentioned packaging container. The disadvantage here However, that the protective cover advantageously only once and after the Transport is removed. Repeated use, as exemplified by the internal transport is necessary, this protective cover can not make suitable.

Die vorliegende Erfindung hat die Aufgabe ein Verpackungsbehältnis für den innerund / oder außerbetrieblichen Transport von Leistungshalbleitermodulen zu schaffen, das gegen Verunreinigungen empfindliche Oberflächen und / oder sonstige Teile des Leistungshalbleitermoduls und / oder gegen elektrostatische Felder empfindliche Kontaktelemente des Leistungshalbleitermoduls schützt sowie eine mehrfache Nutzung dieses Verpackungsbehältnisses erlaubt.The present invention has the object of a packaging container for the inner and / or to provide off-board transport of power semiconductor modules, the surfaces sensitive to contamination and / or other parts of the Power semiconductor module and / or sensitive to electrostatic fields Contact elements of the power semiconductor module protects and multiple use this packaging container allowed.

Die Aufgabe wird gelöst durch ein Verpackungsbehältnis mit den Merkmalen des Anspruchs 1. Bevorzugte Weiterbildungen finden sich in den Unteransprüchen.The object is achieved by a packaging container with the features of Claim 1. Preferred developments can be found in the dependent claims.

Der Grundgedanke des erfindungsgemäßen Verpackungsbehältnisses für Leistungshalbleitermodule geht aus von mindestens einem Formkörper. Dieser Formkörper weist eine Wandung sowie eine vorzugsweise vollständig geschlossene Deckfläche auf. Die Wandung ist in mehrere Wandungsabschnitte unterteilt. An mindestens zwei gegenüberliegenden Wandungsabschnitten ist je eine Abstützkante oder an mindestens drei Stellen der Wandung je eine Abstützfläche angeordnet. Diese Abstützkanten oder Abstützflächen bilden eine Auflage für bestimmte Teile des Leistungshalbleitermoduls derart, dass eine Berührung des Leistungshalbleitermoduls mit der Deckfläche des Formkörpers verhindert ist. Weiterhin liegt das Leistungshalbleitermodul zumindest teilweise an Wandungsabschnitten an, oder ist zumindest eng benachbart hierzu angeordnet, was hier synonym verwendet wird. Alternativ oder zusätzlich weist das Verpackungsbehältnis an der Deckfläche des Formkörpers mindestens eine Stütze auf. Diese Stütze erstreckt sich von der Deckfläche in das Innere des Formkörpers, wobei es sich von der Deckfläche aus ins Innere hinein verjüngt und sich teilweise in eine Aussparung des Leistungshalbleitermoduls hinein erstreckt und hierdurch eine Berührung des Leistungshalbleitermoduls mit der Deckfläche verhindert.The basic idea of the packaging container according to the invention Power semiconductor modules is based on at least one molded body. This shaped body has a wall and a preferably completely closed cover surface. The Wall is divided into several wall sections. At least two opposite wall sections is ever a support edge or at least three Make the wall each arranged a support surface. These support edges or Support surfaces form a support for certain parts of the power semiconductor module such, that a contact of the power semiconductor module with the top surface of the shaped body is prevented. Furthermore, the power semiconductor module is at least partially Wall sections on, or is at least closely adjacent thereto arranged, what here used synonymously. Alternatively or additionally, the packaging container at the Covering surface of the molding at least one support. This prop extends from the top surface in the interior of the molded body, wherein it from the top surface of ins Inner tapered into and partially into a recess of the power semiconductor module extends and thereby touching the power semiconductor module with the Cover surface prevented.

Nachfolgend werden die Merkmale und Ausgestaltungen der Erfindung anhand der Fig. 1 bis 6 beispielhaft erläutert.Hereinafter, the features and embodiments of the invention with reference to the Fig. 1 to 6 exemplified.

Fig. 1 zeigt eine erste Ausgestaltung eines Verpackungsbehältnisses für ein Leistungshalbleitermodul bestehend aus zwei einzelnen Formkörpern.Fig. 1 shows a first embodiment of a packaging container for a Power semiconductor module consisting of two individual moldings.

Fig. 2 zeigt ein Verpackungsbehältnis nach Fig. 1 in einer hierzu orthogonalen Ebene. Fig. 2 shows a packaging container according to Fig. 1 in an orthogonal thereto Level.

Fig. 3 zeigt eine zweite Ausgestaltung eines Verpackungsbehältnisses für ein Leistungshalbleitermodul bestehend aus zwei miteinander verbundenen Formkörpern.Fig. 3 shows a second embodiment of a packaging container for a Power semiconductor module consisting of two interconnected Moldings.

Fig. 4 zeigt ein Verpackungsbehältnis nach Fig. 3 in einer hierzu orthogonalen Ebene.4 shows a packaging container according to FIG. 3 in a position orthogonal thereto Level.

Fig. 5 zeigt eine dritte Ausgestaltung eines Verpackungsbehältnisses für ein Leistungshalbleitermodul bestehend aus zwei miteinander verbundenen Formkörpern.Fig. 5 shows a third embodiment of a packaging container for a Power semiconductor module consisting of two interconnected Moldings.

Fig. 6 zeigt ein Verpackungsbehältnis nach Fig. 5 in einer hierzu orthogonalen Ebene.Fig. 6 shows a packaging container according to Fig. 5 in a orthogonal thereto Level.

Fig. 1 zeigt eine erste Ausgestaltung eines Verpackungsbehältnisses für ein Leistungshalbleitermodul (200) bestehend aus zwei einzelnen Formkörpern (100). Gezeigt ist ein Querschnitt durch das Verpackungsbehältnis und eine darin eingebettetes Leistungshalbleitermodul (200) entlang der Schnittlinie A-A der Fig. 2. Der erste Formkörper (100a) bildet hierbei das Bodenteil, der zweite Formkörper (100b) das Deckelteil. Beide Formkörper (100) bestehen vorzugsweise aus dem gleichen Material, hier einer tiefgezogenen Kunststofffolie mit einer Stärke von 500µm. Diese Kunststofffolie besteht aus einem ableitfähigen Kunststoff gemäß DIN IEC 61340 um das Leistungshalbleitermodul (200) gegen elektrostatische Entladungen zu schützen.Fig. 1 shows a first embodiment of a packaging container for a Power semiconductor module (200) consisting of two individual moldings (100). Shown is a cross section through the packaging container and embedded therein Power semiconductor module (200) along the section line A-A of Fig. 2. The first molded body (100a) forms the bottom part, the second shaped body (100b) forms the lid part. Both Moldings (100) are preferably made of the same material, here one thermoformed plastic film with a thickness of 500μm. This plastic film consists of a dissipative plastic according to DIN IEC 61340 to the power semiconductor module (200) to protect against electrostatic discharge.

Die Wandung des Bodenteils (100a) besteht aus vier rechteckig angeordneten Wandungsabschnitten (110a). Hierbei weisen zwei einander gegenüberliegende Wandungsabschnitte (110a) je eine Abstützkante (112) auf. Weiterhin weist das Bodenteil (100a) eine geschlossene Deckfläche, den Boden (120a), auf. Die gegenüberliegende Seite ist offen gestaltet um ein Leistungshalbleitermodul (200) in dieses Bodenteil (110a) einlegen zu können. Dieses Leistungshalbleitermodul (200) besteht aus einem Kunststoffgehäuse (202) und weist auf der dem Boden (120a) zugewandten Seite (220) metallische Anschlusselemente (222) auf. Diese Anschlusselemente (222) sollen zu ihrem Schutz nicht mit dem Verpackungsbehältnis in Berührung kommen. Daher liegt das Leistungshalbleitermodul (200) mit einem Teil seines Gehäuses (202) auf den Abstützkanten (112a) auf. Weiterhin liegt das Gehäuse (202) des Leistungshalbleitermoduls (200) teilweise an den Wandungsabschnitten (110a) an oder weist nur einen geringen Abstand hiervon auf, was hier als synonym betrachtet wird. Die Abstützkanten (112) müssen in ihrer Flächenausdehnung folglich derart ausgebildet sein, dass durch eine geringfügige horizontale Lageänderung auf Grund des Abstandes des Leistungshalbleitermodul (200) zu den Wandungsabschnitten (110a) ein Abrutschen des Leistungshalbleitermoduls (200) von den Abstützkanten (112) nicht möglich ist. Somit ist ein Kontakt der Anschlusselemente (222) des Leistungshalbleitermodul (200) mit dem Verpackungsbehältnis wirksam verhindert. Ein Verpackungsbehältnis wie bisher beschrieben ist in den meisten Fällen für den innerbetrieblichen Transport ausreichend.The wall of the bottom part (100a) consists of four rectangularly arranged Wall sections (110a). Here are two opposing Wall sections (110a) each have a support edge (112). Furthermore, the bottom part (100a) has a closed top surface, the bottom (120a). The opposite side is open to insert a power semiconductor module (200) in this bottom part (110a) to be able to. This power semiconductor module (200) consists of a plastic housing (202) and has on the bottom (120 a) facing side (220) metallic Connection elements (222). These connection elements (222) should not be for their protection come into contact with the packaging container. That's why it lies Power semiconductor module (200) with a part of its housing (202) on the support edges (112a). Furthermore, the housing (202) of the power semiconductor module (200) lies partially at the wall sections (110a) or only a small distance therefrom, what is considered synonymous here. The supporting edges (112) must be in their Surface area consequently be formed so that by a slight horizontal position change due to the distance of the power semiconductor module (200) to the wall sections (110 a) slipping of the power semiconductor module (200) of the supporting edges (112) is not possible. Thus, a contact of the connection elements (222) of the power semiconductor module (200) with the packaging container prevented. A packaging container as previously described is in most cases for the internal transport sufficient.

Für den außerbetrieblichen Transport weist das Verpackungsbehältnis vorzugsweise noch ein zweites Formteil (100b), das Deckelteil, auf. Dieses Deckelteil besteht ebenfalls aus vier rechteckig angeordneten Wandungsabschnitten (110b). Weiterhin weist das Deckelteil (100b) eine geschlossene Deckfläche, den Deckel (120b), auf. Das hier beschriebene Leistungshalbleitermodul (200) weist eine zentral gelegene Ausnehmung (214), eine Befestigungbohrung (vgl. Fig. 2) aufweist, weist der Deckel (110b) des Deckelteils (100b) weist daher eine Stütze (122) auf. Diese vorzugsweise kegel- oder pyramidenstumpfartig geformte Stütze (122) erstreckt sich vom Deckel (120b) in Richtung des Inneren des Deckelteils (100b). Durch seine kegel- oder pyramidenstumpfartige Form verjüngt es sich in Richtung auf das Leistungshalbleitermodul (200) hin. Die Stütze (122) erstreckt sich bis in die Aussparung (214) des Leistungshalbleitermoduls (200) hinein. Damit ergibt sich nur eine äußerst geringe Berührungsfläche mit dem Leistungshalbleitermodul (200).For the external transport, the packaging container preferably a second molded part (100b), the lid part, on. This cover part is also of four rectangularly arranged wall sections (110b). Furthermore, the Cover part (100b) a closed top surface, the cover (120b), on. This one described power semiconductor module (200) has a centrally located recess (214) has a mounting hole (see Fig. 2), the lid (110b) of the Lid part (100b) therefore has a support (122). These preferably cone or Truncated pyramid-shaped support (122) extends from the lid (120b) in the direction the interior of the lid part (100b). By its conical or truncated pyramidal shape it tapers towards the power semiconductor module (200). The support (122) extends into the recess (214) of the power semiconductor module (200). In order to Only an extremely small contact surface with the power semiconductor module results (200).

Das dargestellte Leistungshalbleitermodul (200) weist auf seiner dem Deckel (110b) zugewandten Seite, also auf dem Substrat (210) eine wärmeleitfähige pastöse Schicht auf, eine Wärmeleitpaste (212) nach dem Stand der Technik. Diese muss vor Berührungen und Verschmutzung geschützt sein. Dies wird ebenfalls mit dem hier vorgestellten Deckelteil (100b) erreicht. Das Deckelteil (100b) liegt nur mit der geringen Fläche der in ihm ausgebildeten Stütze (122) am Leistungshalbleitermodul (200) an und somit auch nur dort an der Wärmeleitpaste (212) an. Das Deckelteil (100b) schützt in Verbindung mit dem Bodenteil (100a) die Anschlusselemente (222) und die Wärmeleitpaste (212) und somit das gesamte Leistungshalbleitermodul (200) für inner- und außerbetrieblichen Transport ausreichend. The illustrated power semiconductor module (200) has on its cover (110b) facing side, ie on the substrate (210) has a thermally conductive pasty layer, a thermal grease (212) of the prior art. This must be before touching and Pollution protected. This is also done with the cover part presented here (100b) reached. The lid part (100b) lies only with the small area of it in it formed support (122) on the power semiconductor module (200) and thus only there on the thermal grease (212). The cover part (100b) protects in conjunction with the Floor part (100 a), the connecting elements (222) and the thermal paste (212) and thus the entire power semiconductor module (200) for internal and external transport sufficient.

Fig. 2 zeigt ein Verpackungsbehältnis nach Fig. 1 allerdings in einem Schnitt in einer hierzu orthogonalen Ebene entlang der Schnittlinie B-B der Fig. 1. Dargestellt sind die Wandungsabschnitte (110b) der rechteckig ausgebildeten Wandung des Deckelteils (100b), sowie das Leistungshalbleitermodul (200) mit seiner auf dem Substrat angeordneten Wärmeleitpaste (212). Weiterhin ist die zentrale Ausnehmung (214) des Leistungshalbleitermoduls dargestellt, in welche sich die Stütze (122) (vgl. Fig. 1) hinein erstreckt.Fig. 2 shows a packaging container according to Fig. 1 but in a section in a this orthogonal plane along the section line B-B of Fig. 1. Shown are the Wall sections (110b) of the rectangular wall of the cover part (100b), and the power semiconductor module (200) with its disposed on the substrate Thermal grease (212). Furthermore, the central recess (214) of the Power semiconductor module, in which the support (122) (see Fig. 1) into it extends.

Fig. 3 zeigt eine zweite Ausgestaltung eines Verpackungsbehältnisses für ein Leistungshalbleitermodul (200) bestehend aus zwei miteinander verbundenen Formkörpern (100). Gezeigt ist ein Querschnitt durch das Verpackungsbehältnis und ein darin eingebettetes Leistungshalbleitermodul (200) entlang der Schnittlinie A-A der Fig. 4. Hierbei weist das Bodenteil (100a) ebenfalls eine rechteckig ausgebildete Wandung mit vier Wandungsabschnitten (110a) auf. Der Boden (120a) weist vier kegelstumpfartige Stützen (122) auf. Diese Stützen (122) ragen in vier Befestigungsbohrungen (214) des Leistungshalbleitermoduls (200) hinein. Auf der dem Boden (110a) zugewandten Seite des Leistungshalbleitermoduls (200) weist dieses wiederum ein Substrat (210) mit einer äußeren metallischen Schicht auf, die mit einer Wärmeleitpaste (212) bedeckt ist. Die vier Stützen (122) beabstanden nun das Leistungshalbleitermodul (200) bzw. dessen Substrat (210) mit der Wärmeleitpaste (212) derart vom Boden (120a), dass sich die Wärmeleitpaste (212) und der Boden (110a) nur an den Kontaktflächen zwischen den Stützen (122) und dem Leistungshalbleitermodul (200) berühren. Somit ist sichergestellt, dass bei einem Transport die Wärmeleitpaste (212) weder in ihrer Schichtdicke noch in ihrer Homogenität verändert wird. Ein Schutz gegen Verunreinigungen ist ebenfalls gegeben.Fig. 3 shows a second embodiment of a packaging container for a Power semiconductor module (200) consisting of two interconnected moldings (100). Shown is a cross section through the packaging container and a therein embedded power semiconductor module (200) along the section line A-A of Fig. 4. Herein the bottom part (100a) also has a rectangular wall with four Wall sections (110 a). The floor (120a) has four frusto-conical supports (122). These supports (122) protrude into four mounting holes (214) of the Power semiconductor module (200) into it. On the bottom (110 a) side facing the Power semiconductor module (200) this in turn has a substrate (210) with an outer metallic layer which is covered with a thermal grease (212). The four supports (122) now space the power semiconductor module (200) or its substrate (210) the thermal grease (212) from the bottom (120a) such that the thermal grease (212) and the bottom (110a) only at the contact surfaces between the supports (122) and the Touch the power semiconductor module (200). This ensures that during a transport the Wärmeleitpaste (212) changed neither in their layer thickness nor in their homogeneity becomes. Protection against contamination is also given.

Der Schutz gegen Verunreinigungen des gesamten Leistungshalbleitermoduls (200) wird sichergestellt, indem das Verpackungsbehältnis ein Deckelteil (100b) aufweist, das mit dem Bodenteil (100a) über ein weiteres Formteil (300) einstückig verbunden ist. Es ergibt sich somit ein Verpackungsbehältnis das durch das weitere als Scharnier, mit einer Drehachse in Richtung der Zeichenebene, wirkende Formteil (300) einfach zu verwenden ist. Vorteilhaft an dieser Ausgestaltung des Verpackungsbehältnis ist, dass es durch eine umlaufende Versiegelung gasdicht verschlossen werden kann und somit einen idealen Schutz für den außerbetrieblichen Transport eines Leistungshalbleitermoduls (200) darstellt. Protection against contamination of the entire power semiconductor module (200) is ensured by the packaging container has a cover part (100b), which with the bottom part (100 a) via a further molded part (300) is integrally connected. It results Thus, a packaging container by the other as a hinge, with a Rotary axis in the direction of the drawing plane, acting molding (300) is easy to use. An advantage of this embodiment of the packaging container is that it by a circumferential seal can be sealed gas-tight and thus an ideal Protection for the external transport of a power semiconductor module (200) represents.

Das Deckelteil (100b) ist ausgestaltet mit einer rechteckigen Wandung, wobei hier alle vier Wandungsabschnitte (110b) Abstützkanten (112) aufweisen und das Leistungshalbleitermodul (200) im Bereich zwischen den Abstützkanten (112) und der Öffnung des Deckelteils (100b) an den Wandungsabschnitten (110b) anliegt. Die Abstützkanten (112) gewährleisten, dass der Deckel (110b) keine Kontaktstellen mit den Anschlusselementen (222) des Leistungshalbleitermoduls (200) aufweist.The cover part (100b) is designed with a rectangular wall, all here four wall sections (110b) have support edges (112) and the Power semiconductor module (200) in the region between the support edges (112) and the Opening of the lid part (100b) abuts the Wandungsabschnitten (110b). The Abstützkanten (112) ensure that the lid (110 b) no contact points with the Connection elements (222) of the power semiconductor module (200).

Fig. 4 zeigt ein Verpackungsbehältnis nach Fig. 3 allerdings in einem Schnitt in einer hierzu orthogonalen Ebene entlang der Schnittlinie B-B der Fig. 3. Dargestellt sind die Wandungsabschnitte (110a) der rechteckig ausgebildeten Wandung des Bodenteils (100a), sowie das Leistungshalbleitermodul (200) mit seiner auf dem Substrat (210) angeordneten Wärmeleitpaste (212). Weiterhin sind die vier Befestigungsbohrungen (214) des Leistungshalbleitermoduls (200) dargestellt, in welche sich die vier Stützen (122) (vgl. Fig. 3) hinein erstrecken.Fig. 4 shows a packaging container according to Fig. 3, however, in a section in one this orthogonal plane along the section line B-B of Fig. 3. Shown are the Wall sections (110a) of the rectangular wall of the bottom part (100a), and the power semiconductor module (200) with its disposed on the substrate (210) Thermal grease (212). Furthermore, the four mounting holes (214) of the Power semiconductor module (200) shown, in which the four supports (122) (see Fig. 3) extend into it.

Fig. 5 zeigt eine dritte Ausgestaltung eines Verpackungsbehältnisses für ein Leistungshalbleitermodul (200) bestehend aus zwei miteinander verbundenen Formkörpern (100). Gezeigt ist ein Querschnitt durch das Verpackungsbehältnis und eine darin eingebettetes Leistungshalbleitermodul (200) entlang der Schnittlinie A-A der Fig. 6. Das hier dargestellte Leistungshalbleitermodul (200) besteht aus einem Gehäuse (202) und einer Grundplatte (230), nach dem Stand der Technik einer Kupferplatte mit einer Stärke von 10mm. Das Bodenteil (100a) weist wiederum eine rechteckförmige Wandung auf, wobei hier in den Ecken zwischen zwei Wandungsabschnitten (110a) Abstützflächen (114) (vgl. Fig. 6) angeordnet sind. Das Leistungshalbleitermodul (200) liegt mit seinen Ecken auf diesen Stützflächen (114) auf und liegt mit einem Teil seiner Grundplatte (230) an den Wandungsabschnitten (110a) des Grundteils (100a) an. Hiermit ist ein horizontales Verrutschen während des Transports nur soweit möglich, als das Leistungshalbleitermodul (200) immer auf allen Abstützflächen (114) aufliegt und somit ein Kontakt zwischen dem Boden (110a) und den Anschlusselementen (222) des Leistungshalbleitermoduls (200) wirksam verhindert ist.Fig. 5 shows a third embodiment of a packaging container for a Power semiconductor module (200) consisting of two interconnected moldings (100). Shown is a cross section through the packaging container and a therein embedded power semiconductor module (200) along the section line A-A of Fig. 6. Das Power semiconductor module (200) shown here consists of a housing (202) and a Base plate (230), according to the prior art, a copper plate with a thickness of 10mm. The bottom part (100a) in turn has a rectangular wall, here in the corners between two wall sections (110a) supporting surfaces (114) (see Fig. 6) are arranged. The power semiconductor module (200) lies with its corners on this Support surfaces (114) and is located with a part of its base plate (230) to the Wall sections (110a) of the base (100a) on. Hereby is a horizontal Slipping during transport only as far as possible, as the power semiconductor module (200) always rests on all support surfaces (114) and thus a contact between the Floor (110a) and the connection elements (222) of the power semiconductor module (200) is effectively prevented.

Das Deckelteil (100b) des Verpackungsbehältnisses ist wiederum wie in Fig. 3 einstückig mit dem Bodenteil (100a) verbunden. Es weist wiederum Stützen (122) auf, die in die vier Befestigungsbohrungen (214) des Leistungshalbleitermoduls (200) hineinragen. The cover part (100b) of the packaging container is again as in FIG. 3 integrally connected to the bottom part (100a). It in turn has supports (122) which are in protrude the four mounting holes (214) of the power semiconductor module (200).

Ein nicht dargestelltes Verpackungsbehältnis für als Scheibenzelle ausgebildetes Leistungshalbleitermodul (200) weist mindestens drei vorzugweise in einem gleichseitigen Dreieck an einer kreisförmigen Wandung (110a) angeordnete Abstandsflächen (114) auf, auf denen das Gehäuse der Scheibenzelle aufliegt.An unillustrated packaging container designed as a disk cell Power semiconductor module (200) has at least three preferably in an equilateral one Triangle on a circular wall (110 a) arranged spacing surfaces (114), on which the housing of the disc cell rests.

Fig. 6 zeigt ein Verpackungsbehältnis nach Fig. 5 allerdings in einem Schnitt in einer hierzu orthogonalen Ebene entlang der Schnittlinie B-B der Fig. 5. Dargestellt sind die Wandungsabschnitte (110a) der rechteckig ausgebildeten Wandung des Bodenteils (100a) sowie das Leistungshalbleitermodul (200) mit seiner auf der Grundplatte (230) angeordneten Wärmeleitpaste (212). Schraffiert dargestellt sind hier eine der vier identischen in den Ecken der jeweiligen Wandungsabschnitte (110a) angeordneten Abstützflächen (114). Auf diesen Abstützflächen (114) liegt die Grundplatte (230) des Leistungshalbleitermoduls (200) auf. Weiterhin sind die vier Befestigungsbohrungen (214) des Leistungshalbleitermoduls (200) dargestellt, in welche sich die vier Stützen (122) (vgl. Fig. 5) des Deckelteils (100b) hinein erstrecken.Fig. 6 shows a packaging container according to Fig. 5 but in a section in a this orthogonal plane along the section line B-B of Fig. 5. Shown are the Wall sections (110a) of the rectangular wall of the bottom part (100a) and the power semiconductor module (200) with its on the base plate (230) arranged Thermal grease (212). Hatched here are one of the four identical in the corners the supporting walls (114) arranged in the respective wall sections (110a). On this Support surfaces (114) is the base plate (230) of the power semiconductor module (200). Furthermore, the four fastening bores (214) of the power semiconductor module (200) are in which the four supports (122) (see Fig. 5) of the cover part (100b) into which extend.

Claims (7)

Verpackungsbehältnis für Leistungshalbleitermodule (200), bestehend aus mindestens einem Formkörper (100), wobei der Formkörper (100) eine Wandung sowie eine vorzugsweise vollständig geschlossene (120) Deckfläche aufweist, wobei entweder an mindestens zwei gegenüberliegenden Wandungsabschnitten (110) je eine Abstützkante (112) oder an mindestens drei Stellen der Wandung je eine Abstützfläche (114) angeordnet ist und das Leistungshalbleitermodul (200) zumindest teilweise an den Wandungsabschnitten (110) anliegt und durch die Auflage an den Abstützkanten (112) bzw. den Abstützflächen (114) eine Berührung des Leistungshalbleitermoduls (200) mit der Deckfläche (120) des Formkörpers (100) verhindert ist und / oder die Deckfläche (110) des Formkörpers (100) mindestens eine Stütze (122) aufweist, die sich von der Deckfläche (120) in das Innere des Formkörpers (100) erstreckt, sich von der Deckfläche (120) aus ins Innere verjüngt und sich teilweise in eine Aussparung (214) des Leistungshalbleitermoduls (200) hinein erstreckt und hierdurch eine Berührung des Leistungshalbleitermoduls (200) mit der Deckfläche (120) verhindert. Packaging container for power semiconductor modules (200), consisting of at least a shaped body (100), wherein the shaped body (100) has a wall and a preferably completely closed (120) top surface, either at at least two opposite wall sections (110) each have a supporting edge (112) or at least three locations of the wall each have a support surface (114) is arranged and the power semiconductor module (200) at least partially to the Wandungsabschnitten (110) is applied and by the support on the supporting edges (112) or the support surfaces (114) with a touch of the power semiconductor module (200) the top surface (120) of the shaped body (100) is prevented and / or the top surface (110) of the shaped body (100) has at least one support (122), which differs from the Cover surface (120) extends into the interior of the shaped body (100) extending from the top surface (120) tapers from the inside and partially into a recess (214) of the Power semiconductor module (200) extends into and thereby touching the Power semiconductor module (200) with the top surface (120) prevented. Verpackungsbehältnis nach Anspruch 1, wobei
die Stütze (122) kegel- oder pyramidenstumpfartig geformt ist.A packaging container according to claim 1, wherein
the support (122) is cone-shaped or truncated pyramid-shaped. Verpackungsbehältnis nach Anspruch 1, wobei
das Formteil (100) aus einer tiefgezogen Kunststofffolie besteht.A packaging container according to claim 1, wherein
the molded part (100) consists of a thermoformed plastic film. Verpackungsbehältnis nach Anspruch 3, wobei
das Formteil (100) aus einer elektrostatisch ableitfähigen Kunststofffolie besteht.A packaging container according to claim 3, wherein
the molded part (100) consists of an electrostatically dissipative plastic film. Verpackungsbehältnis nach Anspruch 1, wobei
zwei Formteile (100) mit ihren offenen Seiten zueinander angeordnet sind.A packaging container according to claim 1, wherein
two moldings (100) are arranged with their open sides to each other. Verpackungsbehältnis nach Anspruch 5, wobei
die beiden Formteile (100) einstückig ausgebildet sind und mittels eines weiteren ein Scharnier bildendes Formteil (300) miteinander verbunden sind.A packaging container according to claim 5, wherein
the two mold parts (100) are integrally formed and are connected to each other by means of a further forming a hinge forming part (300). Verpackungsbehältnis nach Anspruch 6, wobei
die beiden Formteile (100) durch eine umlaufende Versiegelung gasdicht verschlossen ist.A packaging container according to claim 6, wherein
the two mold parts (100) is gas-tightly sealed by a peripheral seal.
EP04025144A 2003-12-16 2004-10-22 Packaging container containing a power semiconductor module Active EP1544130B1 (en)

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DE10358843A DE10358843B3 (en) 2003-12-16 2003-12-16 Packaging container for power semiconducting modules has cover surface with support(s) that narrows as it extends into molded body and into opening in module to prevent contact between module and covering surface

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EP1544130B1 EP1544130B1 (en) 2010-04-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1783831A3 (en) * 2005-11-05 2008-06-11 Semikron Elektronik GmbH & Co. KG Patentabteilung Device for positioning and method for surface treatment of power semiconductor modules

Also Published As

Publication number Publication date
EP1544130B1 (en) 2010-04-14
ES2341106T3 (en) 2010-06-15
DK1544130T3 (en) 2010-07-12
ATE464247T1 (en) 2010-04-15
DE502004011027D1 (en) 2010-05-27
DE10358843B3 (en) 2005-03-24

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