DK1544130T3 - Packaging container containing a power semiconductor module - Google Patents
Packaging container containing a power semiconductor moduleInfo
- Publication number
- DK1544130T3 DK1544130T3 DK04025144.9T DK04025144T DK1544130T3 DK 1544130 T3 DK1544130 T3 DK 1544130T3 DK 04025144 T DK04025144 T DK 04025144T DK 1544130 T3 DK1544130 T3 DK 1544130T3
- Authority
- DK
- Denmark
- Prior art keywords
- power semiconductor
- semiconductor module
- packaging container
- container containing
- module
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
- B65D25/106—Elements projecting into a recess or through a hole in the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/025—Containers made of sheet-like material and having a shape to accommodate contents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Inverter Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The device has at least one molded body (100a,100b) with a wall and a preferably fully closed cover surface (120a,b), supporting edges (112) or surfaces, whereby the module rests on wall sections and contact with the cover surface is prevented by the supporting edges or surfaces. The cover surface has at least one support (122) that narrows as it extends into the molded body and into an opening in the module (200) to prevent contact between the module and covering surface.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10358843A DE10358843B3 (en) | 2003-12-16 | 2003-12-16 | Packaging container for power semiconducting modules has cover surface with support(s) that narrows as it extends into molded body and into opening in module to prevent contact between module and covering surface |
Publications (1)
Publication Number | Publication Date |
---|---|
DK1544130T3 true DK1544130T3 (en) | 2010-07-12 |
Family
ID=34202467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK04025144.9T DK1544130T3 (en) | 2003-12-16 | 2004-10-22 | Packaging container containing a power semiconductor module |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1544130B1 (en) |
AT (1) | ATE464247T1 (en) |
DE (2) | DE10358843B3 (en) |
DK (1) | DK1544130T3 (en) |
ES (1) | ES2341106T3 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005052798B4 (en) * | 2005-11-05 | 2007-12-13 | Semikron Elektronik Gmbh & Co. Kg | Arrangement with power semiconductor modules and with a device for their positioning and method for surface treatment of the power semiconductor modules |
DE102006020636B4 (en) * | 2006-05-04 | 2012-01-12 | Semikron Elektronik Gmbh & Co. Kg | Transport / packaging container for a plurality of electronic components |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3909898A1 (en) * | 1989-03-25 | 1990-09-27 | Semikron Elektronik Gmbh | PACKAGING CONTAINERS AND CUTS FOR THE PRODUCTION OF SUCH A CONTAINER |
CH689554A5 (en) * | 1994-02-15 | 1999-06-15 | Schrack Components Ag | Packaging for several successively arranged piece goods. |
US5518120A (en) * | 1994-12-20 | 1996-05-21 | Conductive Containers Inc. | Anti-static package for protecting sensitive electronic components from electrostatic charges |
JPH09290891A (en) | 1996-04-22 | 1997-11-11 | Shin Etsu Polymer Co Ltd | Carrier tape |
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
CA2372480C (en) | 2002-02-15 | 2009-10-13 | Forrest Smith | Protective packaging enclosure for shock sensitive products |
DE10306643B4 (en) * | 2003-02-18 | 2005-08-25 | Semikron Elektronik Gmbh | Arrangement in pressure contact with a power semiconductor module |
DE10320186B4 (en) * | 2003-05-07 | 2008-02-14 | Semikron Elektronik Gmbh & Co. Kg | Thermal compound and process for its application and protection |
-
2003
- 2003-12-16 DE DE10358843A patent/DE10358843B3/en not_active Expired - Lifetime
-
2004
- 2004-10-22 AT AT04025144T patent/ATE464247T1/en not_active IP Right Cessation
- 2004-10-22 DE DE502004011027T patent/DE502004011027D1/en not_active Expired - Lifetime
- 2004-10-22 ES ES04025144T patent/ES2341106T3/en not_active Expired - Lifetime
- 2004-10-22 EP EP04025144A patent/EP1544130B1/en not_active Expired - Lifetime
- 2004-10-22 DK DK04025144.9T patent/DK1544130T3/en active
Also Published As
Publication number | Publication date |
---|---|
ES2341106T3 (en) | 2010-06-15 |
EP1544130B1 (en) | 2010-04-14 |
EP1544130A1 (en) | 2005-06-22 |
ATE464247T1 (en) | 2010-04-15 |
DE10358843B3 (en) | 2005-03-24 |
DE502004011027D1 (en) | 2010-05-27 |
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