EP1544130A1 - Conteneur d'emballage pour modules semiconducteurs de puissance - Google Patents

Conteneur d'emballage pour modules semiconducteurs de puissance Download PDF

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Publication number
EP1544130A1
EP1544130A1 EP04025144A EP04025144A EP1544130A1 EP 1544130 A1 EP1544130 A1 EP 1544130A1 EP 04025144 A EP04025144 A EP 04025144A EP 04025144 A EP04025144 A EP 04025144A EP 1544130 A1 EP1544130 A1 EP 1544130A1
Authority
EP
European Patent Office
Prior art keywords
power semiconductor
packaging container
semiconductor module
support
container according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04025144A
Other languages
German (de)
English (en)
Other versions
EP1544130B1 (fr
Inventor
Marco Lederer
Rainer Popp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Elektronik GmbH and Co KG filed Critical Semikron Elektronik GmbH and Co KG
Publication of EP1544130A1 publication Critical patent/EP1544130A1/fr
Application granted granted Critical
Publication of EP1544130B1 publication Critical patent/EP1544130B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/02—Internal fittings
    • B65D25/10—Devices to locate articles in containers
    • B65D25/106—Elements projecting into a recess or through a hole in the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/025—Containers made of sheet-like material and having a shape to accommodate contents

Definitions

  • the invention describes a packaging container for power semiconductor modules their internal and / or external transport.
  • Modern power semiconductor modules especially with power transistors such as IGBT (insulated gate bipolar transistor) or MOS-FET (metal oxide semiconductor field effect transistor) are very sensitive to Touch by the human hand, because this causes electrostatic fields on the Can discharge contact elements and damage the power transistors or can destroy.
  • any type of contamination is exemplary of Contact elements or especially for base-plate-less power semiconductor modules also the Substrate base disadvantageous.
  • Substrate bases especially if they are already with before transport a pasty thermally conductive layer are also required protection against contact and / or contamination.
  • the starting point of the invention are the own patent DE 39 09 898 C2 and not previously published patent application DE 103 06 643 A1 and DE 103 20 186 A1.
  • the DE 39 09 898 C2 discloses a packaging container for power semiconductor modules the then state of the art. This was often about Power semiconductor modules constructed from thyristors. Such power semiconductor modules are exemplary insensitive to electrostatic charge. Therefore, this suggests Reference to a stackable packaging, which preferably consists of a cardboard box. Such packaging can, however, with a suitable choice of cardboard in the Protected power semiconductor module also protect against electrostatic discharges. One Protection against contact of the connection elements with the packaging itself in contrast not achievable.
  • DE 103 20 186 A1 discloses a thermal compound for a power semiconductor module, which is already provided by the manufacturer with a thermally conductive pasty layer. This is advantageous because in this way the suitable thermally conductive layer with a on the Power semiconductor module tuned layer thickness can be applied. Farther It is advantageous that as a result the assembly is simplified after transport, since here no layers of the order of 100 microns must be applied homogeneously.
  • the document provides for the protection of these layers a protective cover, which on the Power semiconductor module is placed and has knobs such that the thermally conductive layer is touched only to a small extent by this protective cover. This ensures that after removal of this protective cover, the thermally conductive layer is almost intact and remains fully functional.
  • the present invention has the object of a packaging container for the inner and / or to provide off-board transport of power semiconductor modules, the surfaces sensitive to contamination and / or other parts of the Power semiconductor module and / or sensitive to electrostatic fields Contact elements of the power semiconductor module protects and multiple use this packaging container allowed.
  • Power semiconductor modules is based on at least one molded body.
  • This shaped body has a wall and a preferably completely closed cover surface.
  • the Wall is divided into several wall sections. At least two opposite wall sections is ever a support edge or at least three Make the wall each arranged a support surface. These support edges or Support surfaces form a support for certain parts of the power semiconductor module such, that a contact of the power semiconductor module with the top surface of the shaped body is prevented.
  • the power semiconductor module is at least partially Wall sections on, or is at least closely adjacent thereto arranged, what here used synonymously.
  • the packaging container at the Covering surface of the molding at least one support. This prop extends from the top surface in the interior of the molded body, wherein it from the top surface of ins Inner tapered into and partially into a recess of the power semiconductor module extends and thereby touching the power semiconductor module with the Cover surface prevented.
  • Fig. 1 shows a first embodiment of a packaging container for a Power semiconductor module consisting of two individual moldings.
  • Fig. 2 shows a packaging container according to Fig. 1 in an orthogonal thereto Level.
  • Fig. 3 shows a second embodiment of a packaging container for a Power semiconductor module consisting of two interconnected Moldings.
  • FIG. 4 shows a packaging container according to FIG. 3 in a position orthogonal thereto Level.
  • Fig. 5 shows a third embodiment of a packaging container for a Power semiconductor module consisting of two interconnected Moldings.
  • Fig. 6 shows a packaging container according to Fig. 5 in a orthogonal thereto Level.
  • Fig. 1 shows a first embodiment of a packaging container for a Power semiconductor module (200) consisting of two individual moldings (100). Shown is a cross section through the packaging container and embedded therein Power semiconductor module (200) along the section line A-A of Fig. 2.
  • the first molded body (100a) forms the bottom part
  • the second shaped body (100b) forms the lid part.
  • Both Moldings (100) are preferably made of the same material, here one thermoformed plastic film with a thickness of 500 ⁇ m.
  • This plastic film consists of a dissipative plastic according to DIN IEC 61340 to the power semiconductor module (200) to protect against electrostatic discharge.
  • the wall of the bottom part (100a) consists of four rectangularly arranged Wall sections (110a). Here are two opposing Wall sections (110a) each have a support edge (112). Furthermore, the bottom part (100a) has a closed top surface, the bottom (120a). The opposite side is open to insert a power semiconductor module (200) in this bottom part (110a) to be able to.
  • This power semiconductor module (200) consists of a plastic housing (202) and has on the bottom (120 a) facing side (220) metallic Connection elements (222). These connection elements (222) should not be for their protection come into contact with the packaging container. That's why it lies Power semiconductor module (200) with a part of its housing (202) on the support edges (112a).
  • the housing (202) of the power semiconductor module (200) lies partially at the wall sections (110a) or only a small distance therefrom, what is considered synonymous here.
  • the supporting edges (112) must be in their Surface area consequently be formed so that by a slight horizontal position change due to the distance of the power semiconductor module (200) to the wall sections (110 a) slipping of the power semiconductor module (200) of the supporting edges (112) is not possible.
  • a packaging container as previously described is in most cases for the internal transport sufficient.
  • the packaging container preferably a second molded part (100b), the lid part, on.
  • This cover part is also of four rectangularly arranged wall sections (110b).
  • the Cover part (100b) a closed top surface, the cover (120b), on.
  • This one described power semiconductor module (200) has a centrally located recess (214) has a mounting hole (see Fig. 2), the lid (110b) of the Lid part (100b) therefore has a support (122).
  • These preferably cone or Truncated pyramid-shaped support (122) extends from the lid (120b) in the direction the interior of the lid part (100b). By its conical or truncated pyramidal shape it tapers towards the power semiconductor module (200).
  • the support (122) extends into the recess (214) of the power semiconductor module (200). In order to Only an extremely small contact surface with the power semiconductor module results (200).
  • the illustrated power semiconductor module (200) has on its cover (110b) facing side, ie on the substrate (210) has a thermally conductive pasty layer, a thermal grease (212) of the prior art. This must be before touching and Pollution protected. This is also done with the cover part presented here (100b) reached.
  • the lid part (100b) lies only with the small area of it in it formed support (122) on the power semiconductor module (200) and thus only there on the thermal grease (212).
  • the cover part (100b) protects in conjunction with the Floor part (100 a), the connecting elements (222) and the thermal paste (212) and thus the entire power semiconductor module (200) for internal and external transport sufficient.
  • Fig. 2 shows a packaging container according to Fig. 1 but in a section in a this orthogonal plane along the section line B-B of Fig. 1. Shown are the Wall sections (110b) of the rectangular wall of the cover part (100b), and the power semiconductor module (200) with its disposed on the substrate Thermal grease (212). Furthermore, the central recess (214) of the Power semiconductor module, in which the support (122) (see Fig. 1) into it extends.
  • Fig. 3 shows a second embodiment of a packaging container for a Power semiconductor module (200) consisting of two interconnected moldings (100). Shown is a cross section through the packaging container and a therein embedded power semiconductor module (200) along the section line A-A of Fig. 4.
  • the bottom part (100a) also has a rectangular wall with four Wall sections (110 a).
  • the floor (120a) has four frusto-conical supports (122). These supports (122) protrude into four mounting holes (214) of the Power semiconductor module (200) into it.
  • On the bottom (110 a) side facing the Power semiconductor module (200) this in turn has a substrate (210) with an outer metallic layer which is covered with a thermal grease (212).
  • the four supports (122) now space the power semiconductor module (200) or its substrate (210) the thermal grease (212) from the bottom (120a) such that the thermal grease (212) and the bottom (110a) only at the contact surfaces between the supports (122) and the Touch the power semiconductor module (200). This ensures that during a transport the skilletleitpaste (212) changed neither in their layer thickness nor in their homogeneity becomes. Protection against contamination is also given.
  • the packaging container has a cover part (100b), which with the bottom part (100 a) via a further molded part (300) is integrally connected. It results Thus, a packaging container by the other as a hinge, with a Rotary axis in the direction of the drawing plane, acting molding (300) is easy to use.
  • An advantage of this embodiment of the packaging container is that it by a circumferential seal can be sealed gas-tight and thus an ideal Protection for the external transport of a power semiconductor module (200) represents.
  • the cover part (100b) is designed with a rectangular wall, all here four wall sections (110b) have support edges (112) and the Power semiconductor module (200) in the region between the support edges (112) and the Opening of the lid part (100b) abuts the Wandungsabnecken (110b).
  • the Abstützkanten (112) ensure that the lid (110 b) no contact points with the Connection elements (222) of the power semiconductor module (200).
  • Fig. 4 shows a packaging container according to Fig. 3, however, in a section in one this orthogonal plane along the section line B-B of Fig. 3. Shown are the Wall sections (110a) of the rectangular wall of the bottom part (100a), and the power semiconductor module (200) with its disposed on the substrate (210) Thermal grease (212). Furthermore, the four mounting holes (214) of the Power semiconductor module (200) shown, in which the four supports (122) (see Fig. 3) extend into it.
  • Fig. 5 shows a third embodiment of a packaging container for a Power semiconductor module (200) consisting of two interconnected moldings (100). Shown is a cross section through the packaging container and a therein embedded power semiconductor module (200) along the section line A-A of Fig. 6.
  • Das Power semiconductor module (200) shown here consists of a housing (202) and a Base plate (230), according to the prior art, a copper plate with a thickness of 10mm.
  • the bottom part (100a) in turn has a rectangular wall, here in the corners between two wall sections (110a) supporting surfaces (114) (see Fig. 6) are arranged.
  • the power semiconductor module (200) lies with its corners on this Support surfaces (114) and is located with a part of its base plate (230) to the Wall sections (110a) of the base (100a) on.
  • a horizontal Slipping during transport only as far as possible, as the power semiconductor module (200) always rests on all support surfaces (114) and thus a contact between the Floor (110a) and the connection elements (222) of the power semiconductor module (200) is effectively prevented.
  • the cover part (100b) of the packaging container is again as in FIG. 3 integrally connected to the bottom part (100a). It in turn has supports (122) which are in protrude the four mounting holes (214) of the power semiconductor module (200).
  • An unillustrated packaging container designed as a disk cell Power semiconductor module (200) has at least three preferably in an equilateral one Triangle on a circular wall (110 a) arranged spacing surfaces (114), on which the housing of the disc cell rests.
  • Fig. 6 shows a packaging container according to Fig. 5 but in a section in a this orthogonal plane along the section line B-B of Fig. 5. Shown are the Wall sections (110a) of the rectangular wall of the bottom part (100a) and the power semiconductor module (200) with its on the base plate (230) arranged Thermal grease (212). Hatched here are one of the four identical in the corners the supporting walls (114) arranged in the respective wall sections (110a). On this Support surfaces (114) is the base plate (230) of the power semiconductor module (200). Furthermore, the four fastening bores (214) of the power semiconductor module (200) are in which the four supports (122) (see Fig. 5) of the cover part (100b) into which extend.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Inverter Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
EP04025144A 2003-12-16 2004-10-22 Conteneur d'emballage contenant un module semiconducteur de puissance Expired - Lifetime EP1544130B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10358843 2003-12-16
DE10358843A DE10358843B3 (de) 2003-12-16 2003-12-16 Verpackungsbehältnis für Leistungshalbleitermodule

Publications (2)

Publication Number Publication Date
EP1544130A1 true EP1544130A1 (fr) 2005-06-22
EP1544130B1 EP1544130B1 (fr) 2010-04-14

Family

ID=34202467

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04025144A Expired - Lifetime EP1544130B1 (fr) 2003-12-16 2004-10-22 Conteneur d'emballage contenant un module semiconducteur de puissance

Country Status (5)

Country Link
EP (1) EP1544130B1 (fr)
AT (1) ATE464247T1 (fr)
DE (2) DE10358843B3 (fr)
DK (1) DK1544130T3 (fr)
ES (1) ES2341106T3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1783831A3 (fr) * 2005-11-05 2008-06-11 Semikron Elektronik GmbH & Co. KG Patentabteilung Dispositif de positionnement et méthode de traitement de surface de modules semiconducteur de puissance

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006020636B4 (de) * 2006-05-04 2012-01-12 Semikron Elektronik Gmbh & Co. Kg Transport-/Verpackungsbehältnis für eine Mehrzahl elektronischer Bauelemente

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3909898C2 (fr) 1989-03-25 1991-11-14 Semikron Elektronik Gmbh, 8500 Nuernberg, De
US5518120A (en) * 1994-12-20 1996-05-21 Conductive Containers Inc. Anti-static package for protecting sensitive electronic components from electrostatic charges
JPH09290891A (ja) 1996-04-22 1997-11-11 Shin Etsu Polymer Co Ltd キャリアテープ
CA2372480A1 (fr) 2002-02-15 2003-08-15 Forrest Smith Contenant d'emballage protecteur pour produits sensibles aux chocs
DE10306643A1 (de) 2003-02-18 2004-08-26 Semikron Elektronik Gmbh Druckkontaktierung für ein Leistungshalbleitermodul
DE10320186A1 (de) 2003-05-07 2004-12-02 Semikron Elektronik Gmbh Wärmeleitpaste und Verfahren zu deren Auftrag und Schutz

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH689554A5 (de) * 1994-02-15 1999-06-15 Schrack Components Ag Verpackung für mehrere hintereinander angeordnete Stückgüter.
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3909898C2 (fr) 1989-03-25 1991-11-14 Semikron Elektronik Gmbh, 8500 Nuernberg, De
US5518120A (en) * 1994-12-20 1996-05-21 Conductive Containers Inc. Anti-static package for protecting sensitive electronic components from electrostatic charges
JPH09290891A (ja) 1996-04-22 1997-11-11 Shin Etsu Polymer Co Ltd キャリアテープ
CA2372480A1 (fr) 2002-02-15 2003-08-15 Forrest Smith Contenant d'emballage protecteur pour produits sensibles aux chocs
DE10306643A1 (de) 2003-02-18 2004-08-26 Semikron Elektronik Gmbh Druckkontaktierung für ein Leistungshalbleitermodul
DE10320186A1 (de) 2003-05-07 2004-12-02 Semikron Elektronik Gmbh Wärmeleitpaste und Verfahren zu deren Auftrag und Schutz

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 03 27 February 1998 (1998-02-27) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1783831A3 (fr) * 2005-11-05 2008-06-11 Semikron Elektronik GmbH & Co. KG Patentabteilung Dispositif de positionnement et méthode de traitement de surface de modules semiconducteur de puissance

Also Published As

Publication number Publication date
ATE464247T1 (de) 2010-04-15
ES2341106T3 (es) 2010-06-15
DE10358843B3 (de) 2005-03-24
EP1544130B1 (fr) 2010-04-14
DK1544130T3 (da) 2010-07-12
DE502004011027D1 (de) 2010-05-27

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