JP2989772B2 - Embossed carrier tape for chip-shaped electronic components and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed carrier tape used for obtaining a taping package of a chip-shaped electronic component such as a raster, a capacitor, an IC and an LSI.

[0002]

2. Description of the Related Art In order to automatically produce various electronic components, chip-type electronic components have been automatically mounted on circuit boards. In order to facilitate the handling of the electronic components in the automatic mounting process of the chip-shaped electronic components, a taping package in which the chip-shaped electronic components are packaged in a tape-shaped carrier is used. In order to increase the production efficiency, the chip-like electronic components sequentially sent out in the above are automatically mounted on a predetermined circuit board.

[0003] A taping package used in such an automatic device for chip-like electronic components is provided with a plastic carrier tape having recesses for loading chip-like electronic components formed at regular intervals and a perforation for loading chip-like electronic components. Is formed by applying a bottom film to a carrier tape paper formed at intervals of 1 and loading a predetermined chip-shaped electronic component, and then covering the chip-shaped electronic component with a surface film.

[0004] The taping package loaded with the chip-shaped electronic components is conveyed in a reel or traverse form, and in a process of using the electronic components, the surface film is continuously peeled off by an automated machine to remove the electronic components. It is automatically mounted at a predetermined location. As described above, there are two types of chip-shaped electronic component carrier tapes: plastic tapes and paper tapes. However, there are cost issues, easy handling, easy disposal after use, and antistatic properties. In this regard, the carrier tape made of paper is superior.

[0005] However, the carrier tape made of paper is formed by forming perforations for mounting chip-shaped electronic components on a tape-shaped paperboard, and loading chip-shaped electronic components into the perforated holes. Bulky electronic components could not be loaded.

Therefore, even if it is attempted to increase the thickness of the paper so that bulky electronic components can be loaded, such thick paper may cause separation between the paper layers during the bobbin finishing step or the punching step. For example, it was difficult to obtain a carrier tape using a paperboard having a thickness of 0.95 to 1 mm.

On the other hand, in the case of a carrier tape made of plastic, in addition to the problems of generation of static electricity and the problem of disposal as described above, embossing is performed when the depth of the concave portion for mounting chip-shaped electronic components is set to 1 mm or more. There is a problem that the concave portion may be crushed when the bottom portion becomes thin and is wound up.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to provide a carrier tape made of paper, in which chip-shaped electronic components having a thickness greater than or less than the thickness of the paper can be loaded and efficiently produced. An object of the present invention is to provide a carrier tape for a chip-shaped electronic component and a method for manufacturing the same.

[0009]

According to the present invention, the above object is achieved by the means described in the appended claims. That is, claim 1 is that the paper layer contains 0.5% to 30%.
Embossed by processing without heating between a mold having a convex punch and a mold having a concave portion into which a paper or paperboard into which rayon and / or other synthetic fibers are incorporated An embossed carrier tape for a chip-shaped electronic component, characterized in that the paper or paperboard is heated between a mold having a convex punch and a mold having a concave portion into which the punch is inserted. A method for producing an embossed carrier tape for embossing without embossing, wherein a bumper is provided in the recess to buffer the pressure of the convex punch and embossing is performed.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION

[0011]

FIG. 1 is a plan view of a part of an embossed carrier tape according to an embodiment of the present invention, and FIG.
Is embossed carrier tape, 2 is paper layer, 3 is embossed,
4 is a sprocket hole. In this example, 0.52 mm thick rayon mixed paper is used, and the emboss 3 is 4 mm long and 2 mm wide.
Is formed using a mold to a depth of 0.76 mm using a mold to form a tape having a width of 8 mm. The electronic component is stored in the embossed portion,
A cover tape is stuck on the upper surface and transported. The emboss 3 for accommodating this electronic component is not formed by punching paper as in a conventional paper carrier tape, but is formed by compressing paper to form a concave portion. There is no generation of powder and no contamination of electronic components.

Further, the emboss 3 is formed by compressing its side and bottom, so that the overall rigidity is high and
Even if pressure is applied when winding the tape, the shape is not crushed unlike the conventional embossed tape made of plastics, and the electronic component is not damaged. After the transport of the electronic components is completed, waste paper disposal or incineration disposal can be performed, which facilitates resource conservation and measures against environmental problems.

The type of paper used for the carrier tape of the present invention is not limited. However, a material in which 0.5 to 30% rayon or other synthetic fiber is formed in a layer and an embossed portion is formed is embossed. It is preferable because the moldability is good and the rigidity of the emboss is high. There is no problem with waste paper disposal or incineration disposal.

[0014]

Embodiment 2 FIGS. 3 and 4 are views showing a mold for producing the embossed carrier tape of the present invention. FIG. 3 is a sectional side view of the mold, and FIG. 4 is a plan view showing dimensions of the mold relating to the embossed portion. It is. In the figure, 11 is an upper die, 12 is a lower die, 13 is a die set, 14 is a punch holder, 15 is a first punch, 16 is a stripper plate, 17 is a spring, and 18 is a second
Punch, 19 is a die plate, 20 is a bumper, 21
Is a spring, 22 is a first recess, 23 is a second recess,
24 is a tape paper.

Using this mold, length 4 mm, width 2 mm, depth 0.
An example in which 76 mm embossing is performed will be described. In FIG. 3, when the paper 24 is placed between the upper mold and the lower mold and the upper mold is pressed against the lower mold, the punches 15 and 18 project from the stripper plate 16 and are inserted into the recesses 22 and 23 to form the emboss on the paper 24. I do.

In this example, the tip of the upper punch 15 is slightly recessed from the lower surface of the stripper plate 16, and the tip of the second punch 18 is flush with the lower surface of the stripper plate 16. Also, the first concave portion 2 of the lower mold
2 is formed shallower than the second concave portion 23, and the bumper 22 is supported by the spring 21 so as to buffer the pressure of the punches 15 and 16.

The dimensional relationship between the punches 15 and 18 and the recesses 22 and 23 is shown in Table 1 with respect to the gap between AB and CD shown in FIG.
As shown in the figure, the gap between AB provides an embossment usable in the range of 90 to 180% of the paper thickness, and the corner CD
As shown in Table 2, a usable emboss was obtained at 60 to 65% of the paper thickness, and in other ranges,
Good emboss cannot be obtained due to breakage or poor molding. In the table, double circles indicate good, circles indicate good, triangles indicate acceptable, and x indicates unacceptable.

[Table 1]

[Table 2]

In this example, when the upper mold 11 is pressed against the lower mold 12, the paper 24 is lightly pressed by the stripper plate 16, and then the punch 15 is inserted into the recess while the paper 24 is being wound, and the bumper 20 is pressed by the punch 15. The upper mold is separated from the lower mold by forming a shallow emboss of about 30 to 40% of a predetermined depth without tearing the paper.

Next, the paper is fed to the right side of FIG. 3, and the embossed portion formed by the first punch 15
When the upper die is pressed against the lower die again, the second punch 18 processes the shallow emboss further deeply to form an emboss of a predetermined depth. Thus 2
When embossing is performed in the step, the shape of the embossed portion formed on the paper tape is stable, the dimensions are accurate, there is no breakage of the processed portion, and there is an advantage that the curvature of the tape due to the formation of the emboss can be prevented as much as possible. .

[0020]

Embodiment 3 FIG. 5 is a side sectional view of a mold for manufacturing an embossed carrier tape according to another embodiment of the present invention. 3 in the figure
1 is an upper mold, 32 is a lower mold, 33 is a die set, 34 is a punch holder, 35 is a punch, 36 is a stripper plate, 37 is a spring, 39 is a die plate, 40 is a bumper, 41 is a spring, and 42 is a recess 44. Is tape paper.

Using this mold, length 4 mm, width 2 mm, depth 0.
61 mm embossing was performed. When the paper 44 is placed between the upper die and the lower die, and the upper die is pressed against the lower die, the punch 35 projects from the stripper plate 36 and is inserted into the concave portion 32 to form an emboss on the paper 24. In this example, the upper punch 3
The tip of 5 is flush with the lower surface of the stripper plate 36. Further, a bumper 40 is supported by a spring 41 in the lower mold recess so as to buffer the pressure of the punch 35.

The dimensional relationship between the punch 35 and the recess 32 is the same as that described with reference to FIG.

In this example, when the upper mold 31 is pressed against the lower mold 32, the paper 44 is lightly pressed by the stripper plate 36, and then the punch 35 is inserted into the recess while the paper 44 is being wound, and the bumper 40 is pressed by the punch 35. Can be buffered and received, so that even when embossing is performed in a single step as in this example, an emboss of a predetermined depth can be formed without tearing the paper.

[0024]

According to the present invention, the embossed carrier tape of the chip-shaped electronic component can be loaded with a thick chip-shaped electronic component which cannot be loaded with a carrier tape formed by punching a conventional paperboard. The thickness of the paper can be reduced, so the amount of paper used is much smaller and the economic efficiency is dramatically improved.In addition, since thin paper is used, there is no separation between paperboard layers, and the tape adhesion is improved. It will not fall off.

In the case of a paperboard carrier tape, paper dust and fiber spattering paper pieces are generated in the punching step for loading chip-shaped electronic components. In the case of the embossed carrier tape of the present invention, the paper powder and fiber spatter during punching. Paper pieces are eliminated, production can be performed efficiently, and paper dust and the like can be prevented from being mixed into electronic components.

Since it is not necessary to attach a back film for loading chip-shaped electronic components in the process of preparing the carrier tape, the process can be simplified and the cost can be significantly reduced.

The embossed carrier tape of the chip-shaped electronic component of the present invention does not require heat processing, so that no fusion between paper layers is performed, so that the used tape can be used as recycled paper.

In the embossing step, a conventional taping speed can be obtained without the need for a heat treatment, and by replacing the entire blade portion of the conventional drilling taping machine with the entire embossing mold, the taping machine can be obtained. Can be used together.

Even when the carrier tape of the present invention is wound in a reel or traverse shape, the concave portion is not crushed due to the winding, and in particular, the traverse shape has irregularities in the elasticity and embossed portion of the paper itself. The elasticity due to the overlapping is obtained, and one of the drawbacks of the conventional carrier mount is the loosening due to de-drying, the end deformation due to moisture absorption,
Distortion and the like can be avoided.

The strength of the paper, especially the delamination strength, ironing strength, the use of expensive pulp for measures to prevent paper dust generation, and the thick paper thickness for maintaining the bulkiness, etc., which are required in the conventional carrier mount, are considered. Since it is unnecessary, significant cost reduction can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view of an embossed carrier tape according to an embodiment of the present invention.

FIG. 2 is a sectional view of an embossed carrier tape according to an embodiment of the present invention.

FIG. 3 is a sectional view of a mold used in the manufacturing method according to the embodiment of the present invention.

FIG. 4 is a partial cross-sectional view of a mold used in the manufacturing method according to the embodiment of the present invention.

FIG. 5 is a sectional view of a mold used in the manufacturing method according to the embodiment of the present invention.

[Explanation of symbols]

 1, embossed carrier tape, 2, paper layer, 3, embossed, 4, sprocket hole 11, upper die, 12, lower die, 13, die set, 14, punch holder, 15, first punch, 16, stripper plate , 17, spring, 18, second punch, 19, die plate, 20, bumper, 21, spring, 22, first concave portion, 23, second concave portion, 24, tape paper, 31, upper die, 32 , Lower die, 33, die set, 34, punch holder, 35, punch, 36, stripper plate, 37, spring, 39, die plate, 40, bumper, 41, spring, 42, recess, 44, tape paper

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazushi Sakuragi 700-113, Oishihigashicho, Otsu City, Shiga Prefecture (72) Inventor Iwao Hirano 1-1-1, Iriyamase, Fuji City, Shizuoka Prefecture Shin-Fuji Paper Manufacturing Co., Ltd. (56) References JP-A-63-176130 (JP, A) JP-A-2-66466 (JP, A) JP-A-60-244369 (JP, A) JP-A-62-135151 (JP, A) JP-A-4-292935 (JP, A) JP-A-47-39709 (JP, A) JP-B-44-3839 (JP, B1) Jiko-sho 49-17611 (JP, Y1)

Claims (2)

(57) [Claims] 1. A mold having a convex punch and a mold having a concave portion into which a paper or paperboard in which 0.5% to 30% of rayon and / or other synthetic fibers are incorporated in a paper layer. An embossed carrier tape for a chip-shaped electronic component, characterized by having an emboss obtained by being processed without being sandwiched between them. 2. A method for producing an embossed carrier tape in which paper or paperboard is sandwiched between a mold having a convex punch and a mold having a concave portion into which the punch is inserted, without embossing without heating. And embossing by damping the pressure of the convex punch.