CN100415610C - Method of making paper carrier strip - Google Patents
Method of making paper carrier strip Download PDFInfo
- Publication number
- CN100415610C CN100415610C CNB021201757A CN02120175A CN100415610C CN 100415610 C CN100415610 C CN 100415610C CN B021201757 A CNB021201757 A CN B021201757A CN 02120175 A CN02120175 A CN 02120175A CN 100415610 C CN100415610 C CN 100415610C
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- carrier strip
- chip
- hole
- paper carrier
- recess
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Abstract
The present invention relates to a method for making paper carrier strips. In the first process step, a through hole (2) is formed on a paper carrier strip base material (1a); then, in the second process step, by pressing a punch (5) on the through hole (2), a chip storage concave part (3) is formed on the through hole (2) of the paper carrier strip base material (1a), and one part of the paper carrier strip base material (1a) is used for closing the through hole (2). In this way, a paper carrier strip (1) can be made. Because the paper carrier strip (1) is made through the first process step and the second process step, the chip storage concave part (3) is formed with high precision, the bottom of the chip storage concave part (3) has no holes, and a hole can be simply formed.
Description
Technical field
The present invention relates to supply with the manufacture method of the paper carrier strip of electronic chip component electronic chip component being installed on the connecting element of printed substrate etc.
Background technology
Before, for electronic chip component being installed on the connecting element of printed substrate etc., supply with the carrier band of electronic chip component, known have plastic product and paper products.
Fig. 5 A, Fig. 5 B are the manufacture method figure that the spy opens the disclosed plastics system carrier of flat 1-314150 band.In Fig. 5 A, Fig. 5 B institute example, at first shown in Fig. 5 A, on plastics system carrier ribbon matrix material 11a, opened the through hole 2 in the mouth territory narrower than the mouth territory of chip storage recess 3.Shown in Fig. 5 B, push punching on through hole 2 for another example, the chip that forms the degree of depth T1 that requires by plastic working on through hole is stored recess 3, makes plastics system carrier band 11.
At this moment, store a part of pushing through hole 2 sidewalls when recess 3 is shaped at chip, plastics corresponding to this plastics volume that is pressed, the peristome of storing recess 3 bottom sides at the chip of through hole 2 forms outstanding forward bottom, when plastics have been closed incompressible bottom, recess can not reach the degree of depth T1 that requires, and keeps aperture 14 usually, the decision degree of depth T1 that requires.
The shaping of paper carrier strip forms shown in Fig. 6 A, Fig. 6 B, Fig. 6 C like that.
In Fig. 6 A institute example, open through hole 2 at the thickness direction of paper carrier strip basis material 1a, paste sticking bottom in the bottom of paper carrier strip basis material 1a and be with 12, close the opening of through hole 2 bottom sides again, form recess.Then, this recess is stored recess 3 as chip, storage chip shape electronic component as lid, is made paper carrier strip 1 with top band (not shown).
In Fig. 6 B institute example, on paper carrier strip basis material 1a, recess is set by plastic working, make the paper carrier strip 1 of this recess being stored recess 3 as chip.
In Fig. 6 C institute example, on paper carrier strip basis material 1a, recess is set by plastic working, this recess is stored recess 3 as chip.In the bottom that chip is stored recess 3, for the bottom side of storing recess 3 from chip extrudes electronic chip component to opening direction, be provided with to make extrusion pin 13 insert logical extrusion pin with perforate 14, make paper carrier strip 1.
Recently, promote the chip of miniaturization chip to store the carrier band of recess 3 for having energy storage, following condition is necessary.That is:
(i) electronic chip component is stored the storage of recess 3 internal fixation at chip,
The part that (ii) has weak strength in the bottom of chip storage recess 3,
(iii) store the bottom atresia of recess 3 at chip,
For example, when transporting electronic chip component, as if the electronic chip component that when chip storage recess 3 internal fixation storage chip shape electronic components are mobile, then can not correctly not capture in the chip storage recess 3 that is transported with connecting element by the carrier band.If can not correctly capture electronic chip component, then can not electronic chip component correctly be installed on the printing base with connecting element with connecting element.Therefore, bring for the carrier that forms chip storage recess 3, above-mentioned condition (i) is important.
Connecting element is by sorption electronic chip components such as vacuum adsorption devices, in general this sorptive force a little less than, when storing recess 3 taking-up electronic chip components from chip, must extrude by the opening direction that extrusion pin 13 is stored recess 3 from the bottom side of chip storage recess 3 to chip with electronic chip component.At this moment, chip is stored the bottom of recess 3 must be firm and to extrude pin 13 also be strong, crosses when strong but sell 13 extrusion pressure when extrusion, will damage electronic chip component.When the bottom of chip storage recess 3 is firm, the extrusion pressure that extrudes pin 13 is compared a little less than with extrusion pressure more by force, because pulverize the bottom of following the chip of extrusion to store recess 3, its crushing piece is dispersed, then with taking-up electronic chip components such as the vacuum adsorption devices that is installed in connecting element the time, often will stop up vacuum adsorption device etc.Therefore, wish with the more weak electronic chip component of defeating out.For this reason, the bottom of storing recess 3 at chip is provided with the more weak part of intensity, must extrude pin 13 from the more weak part of intensity.Therefore, bring for the carrier that forms chip storage recess 3, above-mentioned condition (ii) is important.
When there is the hole in the bottom of storing recess 3 at chip, will invade dust from this hole, this dust is stored on the electronic chip component that recess 3 stores attached to chip, hinders electronic chip component with the installation of connecting element to printing base etc.Therefore, the viewpoint of the dust prevention of adhering to from the dust that prevents electronic chip component is stored the carrier of recess 3 and is brought for forming chip, and condition (iii) also is important.
Particularly along with the miniaturization of electronic chip component, above-mentioned condition (i) is (ii) (iii) even more important.
Manufacture method for before plastics system carrier band 11, for example adopt the manufacture method of the plastics system carrier band 11 shown in Fig. 5 A, Fig. 5 B, by using the plastic working of drift device, the chip that can form the shape that requires is accurately stored recess 3, satisfies above-mentioned condition (i).In addition, if obtain the degree of depth T1 that requires the open volume of through hole 2 that chip is stored recess 3 and the plastics volume pushed with plastic working and chip are stored the bottom side of recess 3 equate that then chip storage recess 3 bottoms do not have the hole.Yet, if consider the incompressibility of working accuracy and plastics, because the hole that plastic working makes the chip of through hole 2 store recess 3 bottoms dwindles even during atresia, be difficult to form the chip storage recess 3 with the degree of depth T1 that requires.Therefore, in order to obtain having the chip storage recess 3 of the degree of depth T1 that requires, after forming chip storage recess 3, the bottom of storing recess 3 at chip is inevitable porose.Like this, do not satisfy above-mentioned condition (iii).In addition,, make that the bottom of entire chip storage recess 3 is firm, be difficult to satisfy above-mentioned condition (ii) because the plastic working when chip is stored recess 3 shapings has melted plastics.
On the other hand, for paper carrier strip 1 before, for example in the paper carrier strip shown in Fig. 6 A 1, must paste sticking bottom in the bottom of through hole 2 and be with 12, at the sticking top of cap subsides of through hole 2 band.Therefore, must use new materials such as bottom carrying material and top carrying material, manufacturing procedure is complicated.
Paper carrier strip shown in Fig. 6 B even chip is stored the bottom of recess 3 when thin, is stored the plastic working of recess 3 by being used to form chip, will be contracted and firm in the bottom of chip-stored recess 3.Therefore, be difficult to satisfy above-mentioned condition (ii).In addition, when on paper carrier strip basis material 1a, directly carrying out plastic working manufacturing carrier band 1 in order to form chip storage recess 3, as shown in Figure 7, store recess 3 each other under narrow situation at chip, when working pressure processing perforate chip is stored recess 3, because the chip of pushing previous perforate is stored the sidewall of recess 3, then the sidewall shape of the chip of previous perforate storage recess 3 will be out of shape, and be difficult to satisfy above-mentioned condition (i).
In addition, paper carrier strip 1 shown in Fig. 6 C, since porose in the bottom of chip storage recess 3, then be difficult to satisfy above-mentioned condition (iii).
Summary of the invention
The present invention considers that above situation develops, its objective is provides a kind of manufacture method of making the paper carrier strip of carrier band, can under the situation of not damaging electronic chip component, extrude electronic chip component by extruding pin, and can prevent to invade dust from through hole.
Paper carrier strip manufacture method of the present invention is characterized in that, comprising: on the paper carrier strip basis material, open the 1st operation of through hole along the thickness direction of paper carrier strip basis material; Push drift by on through hole, covering through hole, and bear between the platform and on the through hole of paper carrier strip basis material, to form chip and store recess, simultaneously, store concave depth T1 corresponding to area S2 and chip behind the aspect area of removing through hole from the aspect area of chip storage recess, close the 2nd operation that through hole forms paper carrier strip by the part of paper carrier strip basis material.
Paper carrier strip manufacture method of the present invention is characterized in that: in the 1st operation, when forming through hole, open the carrier band along the thickness direction of paper carrier strip basis material and send to and use the hole; In the 2nd operation, sending to the hole with the carrier band is benchmark, forms chip and stores recess.
Paper carrier strip manufacture method of the present invention is characterized in that: the drift that uses in the 2nd operation is bar-shaped and has the plane at right angle on the top with respect to the rod axle.
Paper carrier strip manufacture method of the present invention is characterized in that: in the 2nd operation, use the paper carrier strip basis material that extends with drift, close through hole fully.
Paper carrier strip manufacture method of the present invention is characterized in that: the aspect of storing recess at the chip of the 2nd operation formation is polygonal.
Paper carrier strip manufacture method of the present invention is characterized in that: the aspect of the through hole that forms in the 1st operation is a quadrangle.
Paper carrier strip manufacture method of the present invention, it is characterized in that: the degree of depth of establishing the paper carrier strip basis material thickness direction of the chip storage recess that forms in the 2nd operation is T1, be located in the thickness of paper carrier strip basis material and do not form chip in the 2nd operation to store the thickness of the part of recess be T2, a mouth territory area that is located at the chip storage recess that forms in the 2nd operation is S1, being located at the area of removing among the S1 outside the mouth territory area of the through hole that the 1st operation forms is S2, if V1 is V1=S2 (T1+T2), if V2 is V2=S1T2, when if ρ is ρ=V1/V2,3＜ρ＜6.5.
As adopt the present invention, in the 1st operation, on the paper carrier strip basis material, open through hole.In the 2nd operation,, store recess then, close through hole with the part of paper carrier strip basis material simultaneously thereby on the through hole of paper carrier strip basis material, form chip by on through hole, pushing drift.Therefore, can form chip accurately and store recess, and form the more weak part of intensity, store the bottom atresia of recess simultaneously at chip in the bottom of chip storage recess.
Description of drawings
Figure 1A, Figure 1B are the 1st process charts of the embodiment of paper carrier strip manufacture method of the present invention.
Fig. 2 A, Fig. 2 B are the 2nd process charts of the embodiment of paper carrier strip manufacture method of the present invention.
Fig. 3 is in the embodiment of paper carrier strip manufacture method of the present invention, extrudes the condition diagram that chip is stored the bottom of recess with extruding pin.
Fig. 4 is the drift figure among the embodiment of paper carrier strip manufacture method of the present invention.
Fig. 5 A, Fig. 5 B are the manufacture method figure of existing plastics system carrier band.
Fig. 6 A, Fig. 6 B, Fig. 6 C are the manufacture method figure of existing paper carrier strip.
Fig. 7 is existing paper carrier strip figure.
The specific embodiment
Below, with reference to the description of drawings embodiments of the invention.
Fig. 1 and Fig. 2 are embodiments of the invention figure.Fig. 1 is the 1st process chart of paper carrier strip manufacture method.Fig. 2 is its 2nd process chart.Figure 1A is the paper carrier strip figure that watches the 1st operation from the top, and Figure 1B is the A-A fragmentary cross-sectional view of Figure 1A.Fig. 2 A is the paper carrier strip figure that watches the 2nd operation from the top, and Fig. 2 B is the B-B fragmentary cross-sectional view of Fig. 2 A.
At first, shown in Figure 1A, Figure 1B, the thickness of paper carrier strip basis material 1a is standardized 0.31mm, 0.43mm, 0.61mm, 0.75mm, 0.95mm etc., has for example prepared the paper carrier strip basis material 1a of the thick 0.61mm of one of standard.This paper carrier strip basis material 1a in the 1st operation, shown in Figure 1A, Figure 1B, in its thickness direction perforate, forms through hole 2.At this moment, the aspect of through hole 2 is a square shape.When forming through hole 2,, open the carrier band along the thickness direction of paper carrier strip basis material 1a and send to hole 4 in the position that requires of paper carrier strip basis material 1a.Through hole 2 and carrier band are sent to hole 4, are formed by plastic working by each drift 5a, 5b, but also can form with other job operations.
Then, in the 2nd operation, shown in Fig. 2 A, Fig. 2 B, on through hole 2, push drift 5, and bear between the platform 6 paper carrier strip basis material 1a carried out plastic working, then on the through hole 2 of paper carrier strip basis material 1a, form chip and store recess 3, close through hole 2 by the part of the paper carrier strip basis material 1a that extends by drift 5 simultaneously.Just, paper carrier strip basis material 1a is owing to be made of the compressible material different with incompressibility material such as plastic material, then when carrying out plastic working between the drift 5 that bears platform 6 and on through hole 2, push, compress easily, simultaneously, the periphery along the aspect of through hole 2 from through hole 2 extends to the center.At this moment, through hole 2 forms the plane square shape, and paper carrier strip basis material 1a extends and butt joint mutually to the center from 4 directions of through hole 2, forms the conjugate foramen 20 of plane X word shape and closes through hole 2.
Like this, store recess 3 bottom surfaces, can form the conjugate foramen 20 of plane X word shape at chip.This conjugate foramen 20 can easily separate with less power as described later.
It is that benchmark forms that chip storage recess 3 is sent to hole 4 with the carrier band.As shown in Figure 4, be used to form drift 5 that chip stores recess 3,, then can process paper carrier ribbon matrix material 1a accurately because this shape is arranged for bar-shaped and have right-angle plane with respect to the rod axle on the top.And chip is stored the aspect of recess 3 for cooperating four jiaos or rectangular shape of chip.
To store the degree of depth of the paper carrier strip basis material 1a thickness direction of recess 3 be T1 when establishing chip, establish in the thickness of paper carrier strip basis material 1a do not form chip to store the thickness of the part of recess 3 be T2, be located in the 2nd operation mouth territory area (aspect area) that the chip that forms in the 2nd operation stores recess 3 for S1, to establish among the S1 area except the mouth territory area of the through hole 2 that forms in the 1st operation be S2, establish V1 is V1=S2 (T1+T2), establish V2 is V2=S1T2, establish ρ when being ρ=V1/V2, process according to 3＜ρ＜6.5.
Like this, promptly can be made into the paper carrier strip 1 of storing and transporting electronic chip component W.
Shown in Figure 1A, Figure 1B, Fig. 2 A, Fig. 2 B, in the 1st operation, after opening through hole 2 on the paper carrier strip basis material 1a with the narrower mouthful of territory, mouth territory of storing recess 3 than chip, in the 2nd operation, on through hole 2, form chip by plastic working and store recess 3 with the configured openings that requires, then can make the plastic working followed when chip is stored recess 3 and formed and, discharge to through hole 2 sides to the pressing force of paper carrier strip 1a.Therefore, when forming chip storage recess 3 with plastic working, the chip that can not oppress first open front as Fig. 7 explanation is stored the sidewall of recess 3, and the chip of first open front is stored the sidewall shape of recess 3 and also can be out of shape.
The shape of through hole 2 can form conjugate foramen in the bottom that chip is stored recess 3 by whether and decide.For example, aspect at through hole 2 is under the situation of circle, can close the peristome that chip is stored recess 3 bottom side through holes 2 during plastic working when forming chip and store recess 3, but be easy to firm owing to not forming conjugate foramen 20, be difficult to break through the bottom that chip is stored recess 3, therefore preferably have quadrangle, plane polygon shape with extruding pin 13.
In the 1st operation,, then can accurately determine through hole 2 and carrier band to send relative position to hole 4 because opening carrier band is sent to hole 4 when forming through hole 2.Therefore, in the 2nd operation, sending to hole 4 with the carrier band is benchmark, can form chip and store recess 3 on through hole 2, also can accurately determine chip to store the relative position of recess 3 and through hole 2.
In above-mentioned the 2nd operation, the plastic working when storing recess 3 formation by chip, the part of the paper carrier strip basis material 1a that is pressed is closed the peristome of through hole 2 fully, then can be not porose in the bottom of chip storage recess 3.At this moment, chip is stored the bottom gamut of recess 3, owing to being compressed at the plastic working that bears between platform 6 and the drift 5, can storing supporting chip shape electronic component W, but excessive intensity is arranged.Yet because the raw material of paper carrier strip basis material 1a is a fiber, even because of plastic working is pressed, pressing part can not melt as plastics system carrier band 11 yet.
Just, store the bottom of recess 3 at chip, plastic working when storing recess 3 formation by chip, paper carrier strip basis material 1a extends and closes the part of through hole 2 in through hole 2 directions, form by the extension of paper, the bottom of storing recess 3 with other chip relatively intensity a little less than, the paper carrier strip basis material 1a that then closes through hole 2 forms X word shape conjugate foramen 20.
Therefore, as shown in Figure 3, when storing recess 3 bottoms when opening direction extrudes electronic chip component from chip with extruding pin 13, extrude pin 13 and can easily make conjugate foramen 20 fractures, (for example 0.1～0.2N) when extruding, and chip is stored recess 3 bottom surfaces and also can not pulverized for the available more weak power of not damaging electronic chip component W.
Because carrier ribbon matrix material 1a has constrictive paper products,, also can form chip exactly and store recess 3 with requirement degree of depth T1 even then forming the through hole 2 of closing chip storage recess 3 bottoms when chip is stored recess 3 fully.
When the aspect of chip storage recess 3 is circle, consider that the electronic chip component W that is stored will move the storage that can not be fixed, but when chip storage recess 3 is square shape, the distance of storing the periphery of recess 3 to chip owing to the center of gravity of the aspect of storing recess 3 from chip is not certain, then electronic chip component W can be fixed on chip and store in the recess 3, and can store recess 3 bottoms at chip and set up face of joint.
Consider that extruding pin 13 can break through the bottom strength that chip is stored the chip storage recess 3 of recess 3 bottoms smoothly, ρ is 3＜ρ＜6.5 preferably.
As mentioned above, in the present embodiment, the 1st operation of through hole 2 is opened in employing on paper carrier strip basis material 1a, and on through hole 2, push drift 5 and form the 2nd operation that chips are stored recesses 3 and closed through hole 2 by the part of paper carrier strip basis material 1a, paper carrier strip 1 is processed, can be formed the fixedly chip storage recess 3 of the desired shape of storage chip shape electronic component W accurately.And, chip is stored the peristome of the through hole 2 of recess 3 bottoms, by a part with constrictive paper carrier strip basis material 1a, form the more weak part of intensity and closed fully in the bottom of chip storage recess 3, then the bottom of chip storage recess 3 can atresia.
As mentioned above, among the present invention, according to opening the 1st operation of through hole at the thickness direction of paper carrier strip basis material, and on through hole, push drift and form chip and store recess and close the 2nd operation of through hole, processing paper carrier strip by the part of paper carrier strip basis material.Therefore, can form the fixedly chip storage recess of the desired shape of storage chip shape electronic component accurately, can correctly capture electronic chip component by connecting element.And, the chip of through hole is stored the bottom side peristome of recess, fully close by a part with constrictive paper carrier strip basis material, the more weak part of intensity is formed on the bottom of storing recess at chip, then can extrude electronic chip component by extruding pin under the situation of not damaging electronic chip component.Also have, because chip is stored the bottom atresia of recess, then when transporting electronic chip component, dust can be attached on the electronic chip component.
Claims (7)
1. the manufacture method of a paper carrier strip is characterized in that, comprising:
On the paper carrier strip basis material, open the 1st operation of through hole along the thickness direction of paper carrier strip basis material;
Push drift by on through hole, covering through hole, and bear between the platform and on the through hole of paper carrier strip basis material, to form chip and store recess, simultaneously, store concave depth T1 corresponding to area S2 and chip behind the aspect area of removing through hole from the aspect area of chip storage recess, close the 2nd operation that through hole forms paper carrier strip by the part of paper carrier strip basis material.
2. as the manufacture method of the paper carrier strip of claim 1 record, it is characterized in that:, when forming through hole, open the carrier band along the thickness direction of paper carrier strip basis material and send to and use the hole in the 1st operation, in the 2nd operation, sending to the hole with the carrier band is that benchmark forms chip storage recess.
3. as the manufacture method of the paper carrier strip of claim 1 record, it is characterized in that: the drift that uses in the 2nd operation is bar-shaped and has right-angle plane with respect to the rod axle on the top.
4. as the manufacture method of the paper carrier strip of claim 1 record, it is characterized in that:, use the paper carrier strip basis material that extends by drift to close through hole fully in the 2nd operation.
5. as the manufacture method of the paper carrier strip of claim 1 record, it is characterized in that: the aspect that the chip that forms in the 2nd operation is stored recess is a polygon.
6. as the manufacture method of the paper carrier strip of claim 1 record, it is characterized in that: the aspect of the through hole that forms in the 1st operation is a quadrangle.
7. as the manufacture method of the paper carrier strip of claim 1 record, it is characterized in that:
To store the degree of depth of thickness direction of the paper carrier strip basis material of recess be T1 when being located at chip that the 2nd operation forms;
Be located in the thickness of paper carrier strip basis material, not forming chip in the 2nd operation, to store the thickness of the part of recess be T2;
A mouth territory area that is located at the chip storage recess of the 2nd operation formation is S1;
Being located at the area of removing among the S1 outside the mouth territory area of the through hole that the 1st operation forms is S2;
If V1 is V1=S2 (T1+T2);
If V2 is V2=S1T2;
When if ρ is ρ=V1/V2,
3＜ρ＜6.5。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021201757A CN100415610C (en) | 2002-04-04 | 2002-04-04 | Method of making paper carrier strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021201757A CN100415610C (en) | 2002-04-04 | 2002-04-04 | Method of making paper carrier strip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1448320A CN1448320A (en) | 2003-10-15 |
| CN100415610C true CN100415610C (en) | 2008-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021201757A Expired - Fee Related CN100415610C (en) | 2002-04-04 | 2002-04-04 | Method of making paper carrier strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100415610C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014176711A1 (en) * | 2013-05-02 | 2014-11-06 | 浙江洁美电子科技有限公司 | Punched paper carrier tape manufacturing method and punching device thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012209402A1 (en) * | 2012-06-04 | 2013-12-05 | Hilti Aktiengesellschaft | Method for producing a fastener strip |
| CN104554912A (en) * | 2014-12-18 | 2015-04-29 | 浙江洁美电子科技股份有限公司 | Manufacturing method for belt for carrying and continuously supplying electronic elements |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06127566A (en) * | 1992-10-19 | 1994-05-10 | Taiyo Yuden Co Ltd | Paper carrier tape for chip part and manufacture therefor |
| JPH1029662A (en) * | 1996-07-15 | 1998-02-03 | Santoku Shoji Kk | Embossed carrier tape for chip-like electronic component and its manufacture |
| JPH11165786A (en) * | 1997-12-05 | 1999-06-22 | Rohm Co Ltd | Structure of tape-like packaged body for electronic parts |
| JP2000327026A (en) * | 1999-05-17 | 2000-11-28 | Tokyo Ueruzu:Kk | Method and device for manufacturing carrier tape |
| JP2001315846A (en) * | 2000-05-01 | 2001-11-13 | Nippo Kk | Carrier tape |
-
2002
- 2002-04-04 CN CNB021201757A patent/CN100415610C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06127566A (en) * | 1992-10-19 | 1994-05-10 | Taiyo Yuden Co Ltd | Paper carrier tape for chip part and manufacture therefor |
| JPH1029662A (en) * | 1996-07-15 | 1998-02-03 | Santoku Shoji Kk | Embossed carrier tape for chip-like electronic component and its manufacture |
| JPH11165786A (en) * | 1997-12-05 | 1999-06-22 | Rohm Co Ltd | Structure of tape-like packaged body for electronic parts |
| JP2000327026A (en) * | 1999-05-17 | 2000-11-28 | Tokyo Ueruzu:Kk | Method and device for manufacturing carrier tape |
| JP2001315846A (en) * | 2000-05-01 | 2001-11-13 | Nippo Kk | Carrier tape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014176711A1 (en) * | 2013-05-02 | 2014-11-06 | 浙江洁美电子科技有限公司 | Punched paper carrier tape manufacturing method and punching device thereof |
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| Publication number | Publication date |
|---|---|
| CN1448320A (en) | 2003-10-15 |
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