JPH1133992A - Device and method for working card - Google Patents

Device and method for working card

Info

Publication number
JPH1133992A
JPH1133992A JP19128397A JP19128397A JPH1133992A JP H1133992 A JPH1133992 A JP H1133992A JP 19128397 A JP19128397 A JP 19128397A JP 19128397 A JP19128397 A JP 19128397A JP H1133992 A JPH1133992 A JP H1133992A
Authority
JP
Japan
Prior art keywords
card
film sheet
sheet
hole
base sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19128397A
Other languages
Japanese (ja)
Inventor
Toshio Kato
利雄 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Konica Minolta Inc
Original Assignee
Konica Minolta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Inc filed Critical Konica Minolta Inc
Priority to JP19128397A priority Critical patent/JPH1133992A/en
Publication of JPH1133992A publication Critical patent/JPH1133992A/en
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Details Of Cutting Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of ruggedness and wrinkles in a surface by previously providing holes in a chip area of a card board sheet and a film sheet at the same positions so as to be passed through both the sheets, and providing an air escape groove at a position for pushing member in contact with the hole. SOLUTION: A card board sheet 11 and a film sheet 21 have a dimension for a plurality of numbers of cards, for example, 24 pieces or 50 pieces of cards, and both the sheets are stuck to each other so as to form a card area part A and a chip area part B. The chip area B is previously formed with long holes 13A, 23A and round holes 13B, 23B. A pushing mold part as a pushing member for pushing the chip area part B is provided with an air escape groove, which is arranged so as to be continued to the long holes and the round holes, and other air escape groove continued to the described air escape groove. A little air, which exists between both the sheets or in an adhesive layer, is discharged from the escape holes of the long holes and the round holes or the air escape groove and the air escape holes provided in the pushing member, and the excellent adhesion is performed without generating wrinkles.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はICカード等のカー
ドを製造するための加工装置及び加工方法に関するもの
で、カード基体上へのシート貼合わせ時の貼合わせ面の
平面性や耐久性を良くしカード加工の品質を向上させ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus and a processing method for manufacturing a card such as an IC card, and to improve the flatness and durability of a bonding surface when bonding a sheet to a card base. To improve the quality of card processing.

【0002】[0002]

【従来の技術】カード基体上への、保護シートや予め文
字や枠が印刷されたシートの貼合わせは熱や圧力をかけ
たりして行われ、その際、皺防止策として所定の張力を
与えたり真空にして空気を抜きながら貼合わせ操作が行
われている。
2. Description of the Related Art Lamination of a protective sheet or a sheet on which characters or frames have been printed on a card base is performed by applying heat or pressure, and a predetermined tension is applied as a measure to prevent wrinkles. The laminating operation is performed while evacuating the air under vacuum.

【0003】[0003]

【発明が解決しようとする課題】前述のようにカード基
体とシートの貼合わせ加工は、両者に熱や圧力をかけた
り、真空状態の中で行われている。
As described above, the laminating process of the card base and the sheet is performed by applying heat or pressure to both, or in a vacuum state.

【0004】しかし、カード基体やシートのサイズが大
きくなると中央部の空気の逃げが不十分になり、カード
基体とシートとの間に微細な空間が発生し、温度,湿度
等の環境変化により、カード内の空気が収縮したり膨張
したりして、加工されるカード表面の凹凸等の原因とな
り、良品率を低下させていた。
[0004] However, when the size of the card base or the sheet becomes large, the air escape in the center becomes insufficient, and a minute space is generated between the card base and the sheet. The air inside the card shrinks or expands, causing irregularities on the surface of the card to be processed, etc., thereby reducing the yield rate.

【0005】本発明はこのような問題点を解消して表面
に凹凸や皺の発生することの無い良質のカードが得られ
るカードの加工装置及び加工方法を提供することを課題
目的にする。
[0005] It is an object of the present invention to provide a card processing apparatus and a card processing method capable of solving such a problem and obtaining a high-quality card having no irregularities or wrinkles on the surface.

【0006】[0006]

【課題を解決するための手段】この目的は次の技術手段
(1)〜(6)の何れか1項によって達成される。
This object is achieved by any one of the following technical means (1) to (6).

【0007】(1) カード基体シートにフィルムシー
トを重ね一対の押圧部材で挟んで貼合わせる貼合手段及
び該フィルムシートが貼合わされたカード基体シートを
所定のカード寸法形状に切り出す手段を有するカード加
工装置であって、前記カード基体シート及びフィルムシ
ートの切り屑領域に、該両シートを略同一位置で貫く穴
を予め設けると共に該穴に接する前記押圧部材の位置に
空気の逃げ溝を設けたことを特徴とするカード加工装
置。
(1) Card processing having a laminating means for laminating a film sheet on a card base sheet and sandwiching the film sheet with a pair of pressing members, and a means for cutting out the card base sheet on which the film sheet is bonded into a predetermined card size shape In the apparatus, in the chip area of the card base sheet and the film sheet, a hole which penetrates the two sheets at substantially the same position is provided in advance, and an air escape groove is provided at a position of the pressing member in contact with the hole. A card processing device.

【0008】(2) カード基体シートにフィルムシー
トを重ね一対の押圧部材で挟んで貼合わせる貼合手段及
び該フィルムシートが貼合わされたカード基体シートを
所定のカード寸法形状に切り出す手段を有するカード加
工装置であって、前記カード基体シート及びフィルムシ
ートの切り屑領域に、該両シートを略同一位置で貫く穴
を予め設けると共に該穴に接する前記押圧部材の位置に
空気の逃げ溝とそれに続く逃げ穴を設け該穴に吸引手段
が接続されることを特徴とするカード加工装置。
(2) A card processing having a laminating means for laminating a film sheet on a card substrate sheet and sandwiching the film sheet with a pair of pressing members, and a means for cutting out the card substrate sheet on which the film sheet is laminated into a predetermined card size and shape. An apparatus, wherein in the chip area of the card base sheet and the film sheet, a hole is provided in advance at substantially the same position through the two sheets, and an air escape groove and a subsequent escape groove are provided at a position of the pressing member in contact with the hole. A card processing apparatus, wherein a hole is provided and a suction means is connected to the hole.

【0009】(3) 前記カード基体シート及び/又は
フィルムシートの貼合わせ面は粗らし加工又は筋加工が
施されていることを特徴とする(1)項又は(2)項に
記載のカード加工装置。
(3) The card processing according to the above (1) or (2), wherein the bonding surface of the card base sheet and / or the film sheet is subjected to roughening processing or streaking processing. apparatus.

【0010】(4) カード基体シートにフィルムシー
トを重ね両者を一対の押圧部材で均一に挟んで押圧して
貼合わせると共に該フィルムシートが貼合わされたカー
ド基体シートを所定のカード寸法形状に切り出すカード
加工方法であって、前記カード基体シート及びフィルム
シートの切り屑領域に、該両シートを略同一位置で貫く
穴を予め設けると共に該穴に接する前記押圧部材の位置
には空気の逃げ溝を設けて空気を逃がしながら貼合わせ
ることを特徴とするカード加工方法。
(4) A card in which a film sheet is superimposed on a card base sheet, the two are evenly sandwiched by a pair of pressing members, pressed and bonded, and the card base sheet on which the film sheet is bonded is cut into a predetermined card size shape. In a processing method, a hole is formed in the chip area of the card base sheet and the film sheet in advance at a position substantially penetrating the two sheets at substantially the same position, and an air escape groove is provided at a position of the pressing member in contact with the hole. A card processing method characterized in that lamination is performed while allowing air to escape.

【0011】(5) カード基体シートにフィルムシー
トを重ね両者を一対の押圧部材で均一に挟んで押圧して
貼合わせると共に該フィルムシートが貼合わされたカー
ド基体シートを所定のカード寸法形状に切り出すカード
加工方法であって、前記カード基体シート及びフィルム
シートの切り屑領域に、該両シートを略同一位置で貫く
穴を予め設けると共に該穴に接する前記押圧部材の位置
には空気の逃げ溝とそれに続く逃げ穴を設けて該逃げ穴
から吸引して強制的に貼合わせ面内の空気を抜きながら
両シートを貼合わせることを特徴とするカード加工方
法。
(5) A card in which a film sheet is superimposed on a card base sheet and both are evenly sandwiched and pressed by a pair of pressing members to be pressed and bonded, and the card base sheet on which the film sheet is bonded is cut into a predetermined card size shape. In the processing method, in the chip area of the card base sheet and the film sheet, a hole is formed in advance at substantially the same position to penetrate both sheets, and an air escape groove and an air escape groove are provided at the position of the pressing member that contacts the hole. A card processing method comprising: providing a continuous relief hole; and adhering the two sheets while sucking air from the clearance hole to forcibly remove air in a bonding surface.

【0012】(6) 前記カード基体シート及び/又は
フィルムシートの貼合わせ面は粗らし加工又は筋加工が
施されていることを特徴とする(4)項又は(5)項に
記載のカード加工方法。
(6) The card processing as described in (4) or (5), wherein the bonding surface of the card base sheet and / or the film sheet is subjected to roughening processing or streaking processing. Method.

【0013】[0013]

【発明の実施の形態】ICカード作成用として出荷供給
されるデータ書き込み前のカードはカード基体シート
に、書き込み層が塗工されたフィルムシートを接着層を
介して貼合わせたものであり、ICカードはこのカード
上に必要事項を写しこんだり書き込んだりして正式に発
行される。
BEST MODE FOR CARRYING OUT THE INVENTION A card before data writing, which is shipped and supplied for making an IC card, is formed by laminating a film sheet coated with a writing layer on a card base sheet via an adhesive layer. The card is officially issued by copying or writing the necessary information on this card.

【0014】本発明はデータ書き込み前のカード(以下
単にカードという)を大量に高品質で作成するためのカ
ード加工装置及びカード加工方法であり、その実施の形
態について図1(a),(b)の全体概要図の平面図及
び正面図並びに、そのX−X視図でありカード基体シー
トとフィルムシートとその押圧型を示す平面図である図
4及びその側断面図である図5を用いて説明する。
The present invention relates to a card processing apparatus and a card processing method for producing a large amount of high-quality cards (hereinafter simply referred to as cards) before data writing, and an embodiment thereof is shown in FIGS. 1 (a) and 1 (b). 4), which is a plan view and a front view of the entire schematic diagram of FIG. 4A, and a plan view showing the card base sheet, the film sheet, and the pressing mold thereof as viewed from the line XX, and FIG. Will be explained.

【0015】広幅のカード基体シート11及びそれとほ
ぼ同じ大きさのフィルムシート21がそれぞれ各供給部
11B,21Bから貼合わせ手段としての貼合わせ部4
0に送り込まれ、両シートの何れかに接着層22が施さ
れている場合は接着層22を介して、両シートの何れに
も接着層22が施されて無い場合には両シートを直接
に、上下の押圧部材としての押圧型31,41間に重ね
られて挟まれ押圧されて貼合わされる。
A wide card base sheet 11 and a film sheet 21 having substantially the same size as the card base sheet 11 are supplied from respective supply sections 11B, 21B to a bonding section 4 as bonding means.
0, and the adhesive layer 22 is applied to either of the two sheets. If the adhesive layer 22 is not applied to any of the two sheets, the two sheets are directly connected to each other. The upper and lower pressing members 31 and 41 serving as pressing members are overlapped, sandwiched, pressed and bonded.

【0016】カード基体シート11及びフィルムシート
21は24枚採り、50枚採り等複数個採りの大きさを
持ち、両者が貼合わされるとカード領域部分Aと切り屑
領域部分Bが構成され、切り屑領域部分Bには長孔13
A,23Aや丸孔13B,23B等が予めあけられてお
り、更に該切り屑領域部分Bの押圧部材としての押圧型
31,41の部分には前記長孔や丸孔に続くように配置
された空気逃げ溝33,43或いはそれに続く空気逃げ
孔34,44が設けられている。
The card base sheet 11 and the film sheet 21 have a size of a plurality of pieces such as 24 pieces and 50 pieces, and when they are pasted together, a card area portion A and a chip area portion B are formed. Slot 13 in the waste area portion B
A, 23A, round holes 13B, 23B, and the like are formed in advance, and the pressing dies 31, 41 as pressing members for the chip area portion B are arranged so as to follow the long holes and the round holes. Air escape grooves 33, 43 or subsequent air escape holes 34, 44 are provided.

【0017】このような状態でカード基体シート11及
びフィルムシート21が重ねられ前記押圧部材としての
押圧型31,41がそれを両側から押圧すると、両シー
トの何れかに設けられた接着層22によって、あるいは
接着層の無くても良い場合には、直接両シートが貼合わ
されるとき、両シート間や接着層に介在する僅かの細か
い空気は前記長孔、丸孔等の逃げ孔や押圧部材31,4
1に設けた空気逃げ溝や空気逃げ孔から抜け、しわのな
い良好な貼合わせができる。
In such a state, when the card base sheet 11 and the film sheet 21 are overlapped and the pressing dies 31, 41 as the pressing members press them from both sides, the adhesive layers 22 provided on either of the two sheets are used. Alternatively, in the case where the adhesive layer is not required, when the two sheets are directly bonded to each other, a small amount of fine air interposed between the two sheets or in the adhesive layer is formed by the escape holes such as the long holes and the round holes and the pressing member 31. , 4
1 can be removed from the air escape groove or the air escape hole provided in 1 and a good bonding without wrinkles can be performed.

【0018】また両シートの何れか一方又は両方の貼合
わせ面に細かい粗らし加工や筋加工を施すと上述の両シ
ートの孔加工と同じような効果が得られる。
Further, when fine roughening or streaking is performed on one or both of the bonding surfaces of the two sheets, the same effect as the above-described hole processing of the two sheets can be obtained.

【0019】更に、両シートに対する孔加工と前記粗ら
し加工又は筋加工が併用されると良好な貼合わせが得ら
れて望ましい。
Further, it is desirable to use both hole processing and roughening processing or streaking processing for both sheets to obtain good bonding.

【0020】尚、両シートに対する孔加工並びに粗し加
工や筋加工は前工程において予めあけられたものを使用
するか、貼合わせ工程の上流位置で加工することが望ま
しい。
It is desirable that the holes, roughening, and streaks for both sheets are formed in advance in the previous step, or processed at a position upstream of the bonding step.

【0021】以上の実施の形態においては、何れも両側
の押圧部材としての押圧型31,41にはサクション機
構は設けていないが、この実施の形態に加えて空気逃げ
孔34,44にサクションブロワーを接続することによ
り、空気の逃げは更に安定化し、良質な貼合わせが可能
になる。
In the above embodiments, the suction dies 31 and 41 as the pressing members on both sides are not provided with a suction mechanism, but in addition to this embodiment, suction blowers are provided in the air escape holes 34 and 44. Is connected, the escape of air is further stabilized, and high-quality lamination becomes possible.

【0022】このような貼合わされたカード基体シート
11及びフィルムシート21は図1に示すように次の打
抜き工程に移され下型51、上型61よりなるカード切
り出し手段としての打抜きカッター部50によりカード
領域部分Aはすべて切り落とされて製品カードとして回
収ボックス55に回収され、切り屑領域部分Bはつなげ
られたまま打抜きカッターから引き出されて屑回収部2
9に排除される。
The bonded card base sheet 11 and film sheet 21 are transferred to the next punching step as shown in FIG. 1 and are punched by a punching cutter unit 50 comprising a lower die 51 and an upper die 61 as card cutting means. The card area portion A is all cut off and collected as a product card in the collection box 55, and the chip area portion B is pulled out from the punching cutter while being connected, and the chip collection portion 2
9 to be excluded.

【0023】別の実施の形態として図2の全体概要図で
示すようにカード基体シートやフィルムシートは、長尺
広幅のロール11A,21Aとして取り扱うこともでき
る。
As another embodiment, as shown in the overall schematic diagram of FIG. 2, a card base sheet and a film sheet can be handled as long and wide rolls 11A and 21A.

【0024】この場合、カード基体シート11やフィル
ムシート21は長尺のままシートに切断されることなく
つなげられたまま前記所定単位のカード数の長さずつ、
まとめて間欠的に送られ、上下の押圧部材31,41か
らなる貼合手段としての貼合わせ部40に入り前述のよ
うに貼合わせが終了した後はそのまま次の打抜カッター
部50に移り、下型51,上型61によりカードが打抜
かれる。
In this case, the card base sheet 11 and the film sheet 21 are long and connected without being cut into sheets, each of the predetermined unit of card length,
The sheet is sent intermittently in a lump, enters the laminating section 40 as laminating means composed of the upper and lower pressing members 31 and 41, and after the lamination is completed as described above, moves to the next punching cutter section 50 as it is. The card is punched by the lower die 51 and the upper die 61.

【0025】そして、これ等のカードは回収ボックス5
5に回収され図示はしないがカートリッジに入れられて
ICカード作成部門に出荷される。そして切り屑領域部
分Bは屑巻き28として巻き取られる。
These cards are stored in the collection box 5
5 and stored in a cartridge (not shown) and shipped to an IC card production department. Then, the chip area B is taken up as a chip winding 28.

【0026】尚、以上は押圧部材として平盤タイプの押
圧型31,41を用いたが、これに限られるものでなく
押圧部材としては図3に示すように搬送ドラムを兼ねた
押圧ドラム131、及びそのニップドラム141を設け
て、長尺広幅のロール11A及び21Aから連続して繰
出されるカード基体シート11の部分及びフィルムシー
ト21の部分を切断しないでつなげられたまま前記押圧
ドラム131に巻回して抱かせながらニップドラム14
1で押圧して搬送しつつ貼合わせを行い、下流側にアキ
ュームレータ71を介して設けた下型51と上型61と
からなる前述と同様の打抜カッター部50により順次製
品カードを打ち抜いて行くようにすることもできる。
Although the pressing members 31 and 41 of the flat plate type have been used as the pressing members in the above, the pressing members are not limited to these, and as the pressing members, as shown in FIG. The nip drum 141 is provided, and the portion of the card base sheet 11 and the portion of the film sheet 21 continuously fed from the long and wide rolls 11A and 21A are wound around the pressing drum 131 while being connected without being cut. Hold the nip drum 14
The bonding is carried out by pressing at 1, and the bonding is performed. The product cards are sequentially punched by the same punching cutter unit 50 as described above, which includes a lower die 51 and an upper die 61 provided on the downstream side via an accumulator 71. You can also do so.

【0027】カード基体シート11、フィルムシート2
1には長孔13A,23A又は丸孔13B,23Bがあ
けられ、押圧ドラム131には空気の逃げ溝33や空気
逃げ孔34が平盤タイプの押圧型31と同様に設けられ
ている。
Card base sheet 11, film sheet 2
1 is provided with long holes 13A and 23A or round holes 13B and 23B, and a pressing drum 131 is provided with an air escape groove 33 and an air escape hole 34 in the same manner as the flat plate type pressing die 31.

【0028】そして空気逃げ孔34はサクションブロワ
ーに接続させ、空気抜き効果を更に高めることが可能で
ある。
The air escape hole 34 can be connected to a suction blower to further enhance the air venting effect.

【0029】[0029]

【発明の効果】本発明によりICカード等の作成に用い
るカードは空気が貼合わせ面に残されて泡や皺を生ずる
ことなく平滑に安定して高品質に効率良く作成されるよ
うになった。
According to the present invention, a card used for producing an IC card or the like can be produced smoothly, stably and efficiently with high quality without air or air bubbles left on the surface to be bonded. .

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態が含まれる全体概要図で
(a)はその平面図、(b)はその正面図である。
FIG. 1 is an overall schematic diagram including an embodiment of the present invention, in which (a) is a plan view and (b) is a front view.

【図2】本発明の別の実施の形態が含まれる全体概要
図。
FIG. 2 is an overall schematic diagram including another embodiment of the present invention.

【図3】本発明の他の実施の形態が含まれる全体概要
図。
FIG. 3 is an overall schematic diagram including another embodiment of the present invention.

【図4】図1のX−X視図でカード基体シートとフィル
ムシートとその押圧型を示す平面図。
FIG. 4 is a plan view showing a card base sheet, a film sheet, and a pressing mold thereof in the XX view of FIG. 1;

【図5】図4の側断面図。FIG. 5 is a side sectional view of FIG. 4;

【符号の説明】[Explanation of symbols]

11 カード基体シート 13A,23A 長穴 13B,23B 丸穴 21 フィルムシート 28 屑巻き 31,41 押圧型 33,43 逃げ溝 34,44 逃げ穴 40 貼合わせ部 50 打抜きカッター部 131 押圧ドラム 11 Card base sheet 13A, 23A Slot 13B, 23B Round hole 21 Film sheet 28 Scrap winding 31, 41 Pressing type 33, 43 Relief groove 34, 44 Relief hole 40 Laminating part 50 Punching cutter part 131 Pressing drum

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 カード基体シートにフィルムシートを重
ね一対の押圧部材で挟んで貼合わせる貼合手段及び該フ
ィルムシートが貼合わされたカード基体シートを所定の
カード寸法形状に切り出す手段を有するカード加工装置
であって、前記カード基体シート及びフィルムシートの
切り屑領域に、該両シートを略同一位置で貫く穴を予め
設けると共に該穴に接する前記押圧部材の位置に空気の
逃げ溝を設けたことを特徴とするカード加工装置。
1. A card processing apparatus comprising: a laminating means for laminating a film sheet on a card base sheet and sandwiching the film sheet with a pair of pressing members, and a means for cutting out the card base sheet on which the film sheet is laminated into a predetermined card size and shape. In the chip area of the card base sheet and the film sheet, a hole is provided in advance through both the sheets at substantially the same position, and an air escape groove is provided at a position of the pressing member in contact with the hole. Characteristic card processing equipment.
【請求項2】 カード基体シートにフィルムシートを重
ね一対の押圧部材で挟んで貼合わせる貼合手段及び該フ
ィルムシートが貼合わされたカード基体シートを所定の
カード寸法形状に切り出す手段を有するカード加工装置
であって、前記カード基体シート及びフィルムシートの
切り屑領域に、該両シートを略同一位置で貫く穴を予め
設けると共に該穴に接する前記押圧部材の位置に空気の
逃げ溝とそれに続く逃げ穴を設け該穴に吸引手段が接続
されることを特徴とするカード加工装置。
2. A card processing apparatus comprising: a laminating means for laminating a film sheet on a card base sheet and laminating the film sheet between a pair of pressing members, and a means for cutting out the card base sheet on which the film sheet is laminated to a predetermined card size and shape. A hole for penetrating both sheets at substantially the same position is provided in advance in a chip area of the card base sheet and the film sheet, and an air escape groove and a subsequent escape hole are provided at a position of the pressing member in contact with the hole. And a suction means connected to the hole.
【請求項3】 前記カード基体シート及び/又はフィル
ムシートの貼合わせ面は粗らし加工又は筋加工が施され
ていることを特徴とする請求項1又は請求項2に記載の
カード加工装置。
3. The card processing apparatus according to claim 1, wherein a bonding surface of the card base sheet and / or the film sheet is subjected to roughening processing or streaking processing.
【請求項4】 カード基体シートにフィルムシートを重
ね両者を一対の押圧部材で均一に挟んで押圧して貼合わ
せると共に該フィルムシートが貼合わされたカード基体
シートを所定のカード寸法形状に切り出すカード加工方
法であって、前記カード基体シート及びフィルムシート
の切り屑領域に、該両シートを略同一位置で貫く穴を予
め設けると共に該穴に接する前記押圧部材の位置には空
気の逃げ溝を設けて空気を逃がしながら貼合わせること
を特徴とするカード加工方法。
4. A card processing in which a film sheet is superimposed on a card base sheet, the two are evenly sandwiched and pressed by a pair of pressing members, and the card base sheet on which the film sheet is bonded is cut into a predetermined card size shape. In the method, in the chip area of the card base sheet and the film sheet, a hole is formed in advance at substantially the same position to penetrate both sheets, and an air escape groove is provided at a position of the pressing member in contact with the hole. A card processing method characterized by laminating while releasing air.
【請求項5】 カード基体シートにフィルムシートを重
ね両者を一対の押圧部材で均一に挟んで押圧して貼合わ
せると共に該フィルムシートが貼合わされたカード基体
シートを所定のカード寸法形状に切り出すカード加工方
法であって、前記カード基体シート及びフィルムシート
の切り屑領域、に該両シートを略同一位置で貫く穴を予
め設けると共に該穴に接する前記押圧部材の位置には空
気の逃げ溝とそれに続く逃げ穴を設けて該逃げ穴から吸
引して強制的に貼合わせ面内の空気を抜きながら両シー
トを貼合わせることを特徴とするカード加工方法。
5. A card processing in which a film sheet is superimposed on a card base sheet, the two are uniformly sandwiched and pressed by a pair of pressing members, and the card base sheet on which the film sheet is bonded is cut into a predetermined card size shape. In the method, a hole which penetrates both the sheets at substantially the same position is provided in advance in a chip area of the card base sheet and the film sheet, and an air escape groove and an air escape groove are provided at a position of the pressing member contacting the hole. A card processing method comprising: providing an escape hole; and adhering the two sheets while sucking air from the escape hole to forcibly evacuate the air within a bonding surface.
【請求項6】 前記カード基体シート及び/又はフィル
ムシートの貼合わせ面は粗らし加工又は筋加工が施され
ていることを特徴とする請求項4又は請求項5に記載の
カード加工方法。
6. The card processing method according to claim 4, wherein a bonding surface of the card base sheet and / or the film sheet is subjected to roughening processing or streaking processing.
JP19128397A 1997-07-16 1997-07-16 Device and method for working card Pending JPH1133992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19128397A JPH1133992A (en) 1997-07-16 1997-07-16 Device and method for working card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19128397A JPH1133992A (en) 1997-07-16 1997-07-16 Device and method for working card

Publications (1)

Publication Number Publication Date
JPH1133992A true JPH1133992A (en) 1999-02-09

Family

ID=16271994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19128397A Pending JPH1133992A (en) 1997-07-16 1997-07-16 Device and method for working card

Country Status (1)

Country Link
JP (1) JPH1133992A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010539583A (en) * 2007-09-14 2010-12-16 ハンミ セミコンダクター カンパニー リミテッド Memory card processing equipment
JP2014021539A (en) * 2012-07-12 2014-02-03 Toppan Printing Co Ltd Ic tag

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010539583A (en) * 2007-09-14 2010-12-16 ハンミ セミコンダクター カンパニー リミテッド Memory card processing equipment
JP2014021539A (en) * 2012-07-12 2014-02-03 Toppan Printing Co Ltd Ic tag

Similar Documents

Publication Publication Date Title
CN100380399C (en) Paper RFID tag and method of manufacturing the same
WO2005107347A1 (en) Conductive member for non-contact data carrier and manufacturing method and device thereof
EP1587029B1 (en) RFID-tag
JP2002187223A (en) Manufacturing method for ic inlet temporary adhesive strip and ic built-in display card
JP2010538379A (en) Method and apparatus for manufacturing RFID tags
JP4779556B2 (en) Method and apparatus for manufacturing conductive member for non-contact type data carrier
KR20210087283A (en) Method of manufacturing protective film for mobile device display
JPH1133992A (en) Device and method for working card
JP2005311179A (en) Process for manufacturing a conductive material for non-conductive data carriers, and equipment for manufacturing the non-conductive material
US3293996A (en) Film record cards and method for making the same
JP5063193B2 (en) Label continuum production equipment
JP2989772B2 (en) Embossed carrier tape for chip-shaped electronic components and method of manufacturing the same
JP2927215B2 (en) Method for manufacturing flexible circuit board
JPH0267124A (en) Apparatus for preparing label carrier strip
JP5050426B2 (en) Non-contact IC tag manufacturing method and apparatus
JPH06326442A (en) Manufacture of flexible circuit board
JPH07226574A (en) Manufacture of flexible flat cable and manufacture of material for flexible flat cable
US5702554A (en) Process of laminating gold foil and gold foil card
JP4559649B2 (en) Label continuum manufacturing method
JP2005346695A (en) Conductive member for contactless type data carrier, and method and device for manufacturing the same
JP3394203B2 (en) Film sticking method
JPS60134276A (en) Manufacture of label
JP3667841B2 (en) Manufacturing method of flat wiring body
JP2003053600A (en) Plate for hot press, hot press device provided with the same and sheet laminate
JPH05306382A (en) Production of pattern-like double-side tacky tape and device therefor