JP6916661B2 - Manufacturing method of carrier tape for electronic component storage tape, electronic component storage tape, and electronic component storage tape - Google Patents

Description

The present invention relates to a carrier tape for an electronic component storage tape, an electronic component storage tape using the carrier tape, and a method for manufacturing the electronic component storage tape.

In the conventional carrier tape for electronic component storage tape, a large number of substantially rectangular parallelepiped storage recesses are provided at equal intervals in the length direction in a strip-shaped tape body, and a large number of substantially circular feed holes are provided in the length direction. Has a structure provided at equal intervals (see, for example, Patent Documents 1 to 3 described later).

Further, in the insertion of the electronic components into the respective storage recesses of the carrier tape, generally, the substantially rectangular electronic components arranged by the bowl feeder are sequentially supplied to the insertion machine via the linear feeder, and the carrier tape is inserted. This is done by intermittently moving the electronic component on the lower side of the machine, moving the electronic component supplied to the insertion machine downward at the timing when the carrier tape stops, and inserting the electronic component into the storage recess.

By the way, in order to insert the electronic component into the storage recess of the carrier tape from above as in the above method, the two-dimensional position of the electronic component before insertion and the two-dimensional position of the storage recess into which the electronic component is inserted are set above. It is necessary to match from the viewpoint. Therefore, recently, in order to simplify the management of mutual positions at the time of insertion, a method of inserting an electronic component into a storage recess of a carrier tape from the side has been studied.

However, since the conventional carrier tape described above has a structure premised on inserting the electronic component into the storage recess of the carrier tape from above, the method of inserting the electronic component from the side into the storage recess of the carrier tape is adopted. It is hard to say that it is suitable.

Japanese Unexamined Patent Publication No. 2012-081997 Japanese Unexamined Patent Publication No. 2006-160369 JP-A-2002-240851

The problem to be solved by the present invention is a carrier tape for an electronic component storage tape suitable for a method of inserting an electronic component into a storage recess of a carrier tape from the side, an electronic component storage tape using the carrier tape, and the electronic component storage tape. The purpose is to provide a method for manufacturing an electronic component storage tape.

In order to solve the above problems, in the carrier tape for the electronic component storage tape according to the present invention, the longitudinal direction of the carrier tape is the length direction, the lateral direction is the width direction, and the direction orthogonal to these directions is the height method. When the dimension along the length direction is the length, the dimension along the width direction is the width, and the dimension along the height direction is the height or depth, the carrier tape is a strip-shaped tape body and an electronic component. It has a length, width and depth that can be stored, and has storage recesses provided in the tape body at equal intervals in the length direction, and is provided on one side of the storage recesses in the tape body in the width direction. Is provided with a guide recess that increases in depth from the upper surface of the tape body toward one side surface of the storage recess in the width direction and is continuous with the storage recess, and the guide recess is stored from the upper surface of the tape body. It has a form in which the length decreases toward one side surface in the width direction of the recess . Further, in the carrier tape for other electronic component storage tapes according to the present invention, the longitudinal direction of the carrier tape is the length direction, the lateral direction is the width direction, and the direction orthogonal to these directions is the height method. When the dimension along the length direction is the length, the dimension along the width direction is the width, and the dimension along the height direction is the height or depth, the carrier tape can store the strip-shaped tape body and electronic parts. It has various lengths, widths and depths, and has storage recesses provided in the tape body at equal intervals in the length direction, and the tape is provided on one side of the storage recesses in the tape body in the width direction. The depth increases from the upper surface of the main body toward one side surface in the width direction of the plurality of side surfaces of the storage recess, and a guide recess is provided in a form continuous with the storage recess, and among the plurality of side surfaces of the storage recess. The remaining side surfaces other than one side surface in the width direction are connected to the upper surface of the tape body.

Further, the electronic component storage tape according to the present invention includes the above-mentioned carrier tape, electronic components stored in the storage recess of the carrier tape, and the upper surface of the carrier tape so as to close the upper end opening of the storage recess in which the electronic components are stored. It is equipped with a cover tape that covers a part.

Further, the method for manufacturing the electronic component storage tape according to the present invention includes a step of preparing the carrier tape described above, a step of storing the electronic component in the storage recess of the carrier tape, and an opening at the upper end of the storage recess in which the electronic component is stored. It is provided with a step of covering a part of the upper surface of the carrier tape with a cover tape so as to close the carrier tape.

According to the present invention, a carrier tape for an electronic component storage tape suitable for a method of inserting an electronic component into a storage recess of a carrier tape from the side, an electronic component storage tape using the carrier tape, and the electronic component storage tape. Manufacturing method can be provided.

FIG. 1 is a partial top view of the carrier tape according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line S1-S1 of FIG. 3 (A) to 3 (C) are views showing an example of a method of inserting an electronic component from the side into the storage recess of the carrier tape shown in FIGS. 1 and 2. FIG. 4 is a partial top view of the electronic component storage tape using the carrier tape shown in FIGS. 1 and 2. FIG. 5 is a diagram corresponding to FIG. 2 of the carrier tape according to the second embodiment of the present invention. FIG. 6 is a diagram showing an example of a method of inserting an electronic component from the side into the storage recess of the carrier tape shown in FIG. FIG. 7 is a diagram corresponding to FIG. 2 of the carrier tape according to the third embodiment of the present invention.

In the following description, for convenience, the longitudinal direction (horizontal direction in FIG. 1) of the carrier tape 10 described later is referred to as the longitudinal direction, and the lateral direction (vertical direction in FIG. 1) is referred to as the width direction, which are orthogonal to these directions. The direction (vertical direction in FIG. 2) is described as the height direction, the dimension along the length direction is described as the length, the dimension along the width direction is described as the width, and the dimension along the height direction is described as the height. Or it is written as depth.

<< First Embodiment >>
1 and 2 show the carrier tape 10 according to the first embodiment of the present invention.

The carrier tape 10 shown in FIGS. 1 and 2 is an embossed type, and the material thereof is, for example, polystyrene, polycarbonate, polyethylene terephthalate, polypropylene or the like. The embossing method is not particularly limited, and for example, compressed air molding, press molding, vacuum rotary molding (vacuum drum molding), and the like can be appropriately adopted.

A large number of carrier tapes 10 are provided at (1) a strip-shaped tape body 11 having a width W and (2) at positions close to one end edge 11a in the width direction of the tape body 11 at equal intervals (pitch P1) in the length direction. , And (3) a large number of substantially circular feed holes 13 provided at equal intervals (pitch P2) in the length direction at positions close to the other end edge 11b in the width direction of the tape body 11. have. The height H of the carrier tape 10 corresponds to the value obtained by adding the thickness t of the tape body 11 to the depth D1 of the storage recess 12a described later. Incidentally, the width W and the thickness t of the tape main body 11 are not particularly limited, but for example, when the width W is 8 mm, the thickness t is generally in the range of 0.15 to 0.4 mm.

Further, a margin portion having a width of Wm (reference numeral omitted) is provided between the widthwise one end edge (lower end edge of FIG. 1) of each component storage portion 12 of the carrier tape 10 and the widthwise one end edge 11a of the tape body 11. Exists. This margin portion is an area used when the cover tape 20 (see FIG. 4) is attached to the upper surface of the tape main body 11.

Each component storage portion 12 is composed of a storage recess 12a and a guide recess 12b provided on one side of the storage recess 12a in the width direction.

The storage recess 12a has a substantially rectangular parallelepiped shape having a length L1, a width W1 and a depth D1 capable of storing the electronic component EC (see FIGS. 3 and 4). The storage recess 12a is composed of a bottom surface 12a1 and four side surfaces 12a2 (two side surfaces facing each other in the width direction and two side surfaces facing each other in the length direction). Although not shown in FIGS. 1 and 2, each of the four actual side surfaces 12a2 has an inclination of about 0.2 to 10 degrees, which corresponds to a punching taper during embossing. By the way, the electronic component EC has a substantially rectangular parallelepiped shape, and has a first dimension (reference numeral omitted) corresponding to the length L1 of the storage recess 12a and a second dimension (reference numeral omitted) corresponding to the width W1 of the storage recess 12a. It has a third dimension (reference numeral omitted) corresponding to the depth D1 of the storage recess.

The width W1 of the storage recess 12a is slightly larger than the first dimension of the electronic component EC, the length L1 of the storage recess 12a is slightly larger than the second dimension of the electronic component EC, and the depth D1 of the storage recess 12a is electronic. It is slightly larger than the third dimension of the component EC. Further, the height of one side surface in the width direction (left side surface in FIG. 2) on the guide recess 12b side of the four side surfaces 12a2 of the storage recess 12a is obtained by subtracting the maximum value of the depth D2 of the guide recess 12b from the depth D1. Corresponds to the value.

The guide recess 12b has a substantially pentahedral shape, and is a portion that guides the electronic component EC to the storage recess 12a. The guide recess 12b is composed of a bottom surface 12b1 and two side surfaces 12b2 (two side surfaces facing each other in the length direction). Although not shown in FIGS. 1 and 2, each of the two actual side surfaces 12b2 has an inclination of about 0.2 to 10 degrees, which corresponds to a punching taper during embossing.

As can be seen from FIGS. 1 and 2, the guide recess 12b has a depth D2 from the upper surface of the tape body 11 toward one side surface in the width direction (the left side surface of FIG. 2) of the four side surfaces 12a2 of the storage recess 12a. It has a form of increasing and continuous with the storage recess 12a, and has a form in which the length L2 decreases from the upper surface of the tape main body 11 toward one side surface in the width direction (left side surface of FIG. 2) of the storage recess 12a. ing.

The width W2 of the guide recess 12b is not particularly limited, but the width W2 is set so that the inclination angle of the bottom surface 12b1 is within the range of 15 to 30 degrees in consideration of the maximum value of the depth D2 of the storage recess 12a. It is preferable to set it. Further, the minimum value of the length L2 of the guide recess 12b coincides with the length L1 of the storage recess 12a. The maximum value of the length L2 may be larger than the second dimension of the electronic component EC, but it is preferably set within the range of 1.1 times to 1.5 times the second dimension of the electronic component EC. Further, the maximum value of the depth D2 of the guide recess 12b may be smaller than the depth D1 of the storage recess 12a, but it can be set within the range of 1/4 to 3/4 of the third dimension of the electronic component EC. preferable.

FIG. 3 shows an example of a method of inserting the electronic component EC from the side into the storage recess 12a of the carrier tape 10 shown in FIGS. 1 and 2. This insertion method is merely an example, and does not limit the method of inserting the electronic component EC into the storage recess 12a of the carrier tape 10 from the side.

In FIG. 3, TG is a tape guide, TGa is a guide groove, IG is a component guide, and IGa is a component passage. The upper surface of the tape guide TG supports the lower surface of the portion of the carrier tape 10 excluding the storage recess 12a and the guide recess 12b, and the inner surface of the guide groove TGa supports the lower surfaces of the storage recess 12a and the guide recess 12b. On the other hand, the lower surface of the component guide IG faces the upper surface of the carrier tape 10 through a clearance that does not hinder the intermittent movement of the carrier tape 10 in the length direction and can suppress the vertical displacement of the carrier tape 10. ing. Further, the cross-sectional shape of the component passage IGa is a rectangle slightly larger than the second and third dimensions of the electronic component EC, and has an inclination commensurate with the inclination angle of the bottom surface 12b1 of the guide recess 12b.

As shown in FIG. 3A, when the electronic component EC is inserted into the storage recess 12a of the carrier tape 10 from the side, the electronic component EC aligned by the bowl feeder (not shown) is used as a linear feeder (not shown). It is sent to the component passage IGa via. The electronic component EC sent into the component passage IGa slides according to the inclination of the component passage IGa and is fed into the guide recess 12b. Then, as shown in FIG. 3B, the electronic component EC fed into the guide recess 12b slides according to the inclination of the bottom surface 12b1 and is fed into the storage recess 12a.

As described above, the guide recess 12b has a form in which the length L2 decreases from the upper surface of the tape main body 11 toward one side surface in the width direction (the left side surface of FIG. 3B) of the storage recess 12a. Even if there is a disorder in the posture of the electronic component EC immediately after being sent into the guide recess 12b, this disorder in the posture is corrected in the process of moving the guide recess 12b. Further, since the minimum value of the length L2 of the guide recess 12b coincides with the length L1 of the storage recess 12a, the electronic component EC after the posture correction is smoothly sent from the guide recess 12b to the storage recess 12a.

As shown in FIG. 3C, the electronic component EC sent into the storage recess 12a has its tip in contact with the other side surface in the width direction of the storage recess 12a (the right side surface in FIG. 3C). The lower surface is tilted so as to be in contact with the bottom surface 12a1 of the storage recess 12a, whereby the electronic component EC is inserted into the storage recess 12a. Since the maximum value of the depth D2 of the guide recess 12b is smaller than the depth D1 of the storage recess 12a, even if the electronic component EC after being stored in the storage recess 12a vibrates due to an external force, a part of the electronic component EC remains. There is no problem that the storage posture is greatly disturbed by entering the guide recess 12b.

Due to the small mass and small size of the electronic component EC, the electronic component EC does not slide in the guide recess 12b and the electronic component EC is not smoothly fed from the guide recess 12b to the storage recess 12a. Occasionally, through a clearance between the lower surface of the portion of the component guide IG where the component passage IGa does not exist (the right portion of FIG. 3A) and the upper surface of the carrier tape 10, or through a suction passage separately provided in the portion of the component guide IG. It is preferable to apply a negative pressure to the component passage IGa so that the electronic component EC in the component passage IGa is drawn into the guide recess 12b and the storage recess 12a by this negative pressure.

As described above, the depth D2 increases on one side of the storage recess 12a in the width direction from the upper surface of the tape body 11 toward one side surface of the storage recess 12a in the width direction, and the guide recess is continuous with the storage recess 12a. Since the 12b is provided, the method of inserting the electronic component EC from the side into the storage recess 12a of the carrier tape 10 can be appropriately performed by using the guide recess 12b.

Further, since the maximum value of the depth D2 of the guide recess 12b is smaller than the depth D1 of the storage recess 12a, even if the electronic component EC after being stored in the storage recess 12a vibrates due to an external force, the electronic component EC There is no problem that a part of the guide recess 12b gets into the guide recess 12b and the storage posture is greatly disturbed.

Further, since the guide recess 12b has a form in which the length L2 decreases from the upper surface of the tape main body 11 toward one side surface in the width direction of the storage recess 12a, the electronic component EC immediately after being sent into the guide recess 12b. Even if there is a disorder in the posture of, the disorder in the posture can be corrected in the process of moving the guide recess 12b. Moreover, since the minimum value of the length L2 of the guide recess 12b matches the length L1 of the storage recess 12a, the electronic component EC after the posture correction can be smoothly sent from the guide recess 12b to the storage recess 12a.

FIG. 4 shows an electronic component storage tape 30 using the carrier tape 10 shown in FIGS. 1 and 2.

In the electronic component storage tape 30 shown in FIG. 4, the electronic component EC is stored in each storage recess 12a of the carrier tape 10, and the carrier tape closes the upper end opening of each storage recess 12a in which the electronic component EC is stored. A part of the upper surface of 11 is covered with a band-shaped cover tape 20. That is, the electronic component storage tape 30 stores the electronic component EC in each storage recess 12a of the carrier tape 10, and then closes the upper end opening of each storage recess 12a in which the electronic component EC is stored on the upper surface of the carrier tape 11. It is manufactured by covering a part with a band-shaped cover tape 20.

The cover tape 20 is preferably transparent or translucent so that the stored state can be confirmed from the outside. Further, the cover tape 20 may be either a heat-sensitive type or a pressure-sensitive type, and at least both sides in the width direction are attached to the upper surface of the tape main body 11. That is, if the carrier tape 10 shown in FIGS. 1 and 2 is used, the electronic component storage tape 30 shown in FIG. 4 can be accurately manufactured.

<< Second Embodiment >>
FIG. 5 shows the carrier tape 10-1 according to the second embodiment of the present invention.

The carrier tape 10-1 shown in FIG. 5 differs from the carrier tape 10 shown in FIGS. 1 and 2 in that the width W2 of the guide recess 12b is reduced and the inclination angle of the bottom surface 12b1 is increased. The point is that the width Wm of the margin portion (reference numeral omitted) is increased as the width W2 of the recess 12b is reduced. Since other configurations are the same as those of the carrier tape 10 shown in FIGS. 1 and 2, the description thereof will be omitted.

Even with this carrier tape 10-1, the method of inserting the electronic component EC from the side into the storage recess 12a can be appropriately performed as in the carrier tape 10 shown in FIGS. 1 and 2, and FIG. 4 It is possible to accurately manufacture an electronic component storage tape similar to the electronic component storage tape 30 shown in 1.

Since the carrier tape 10-1 shown in FIG. 5 has a larger inclination angle of the bottom surface 12b1 of the guide recess 12b than the carrier tape 10 shown in FIGS. 1 and 2, as shown in FIG. 6, the component passage is formed. When the inclination of the IGa is the same as the inclination of the part passage IGa shown in FIG. 3, the inclination of the bottom surface 12b1 of the guide recess 12b is larger than the inclination of the part passage IGa, and the cross-sectional shape on the entrance side of the part passage IGa The cross-sectional shape on the exit side (where the bottom surface 12b1 of the guide recess 12b exists) is larger than that. Therefore, the electronic component EC can be smoothly sent from the component passage IGa to the guide recess 12b, and the electronic component EC can be smoothly sent from the guide recess 12b to the storage recess 12a.

Also in the case of the carrier tape 10-1 shown in FIG. 5, due to the small mass and small size of the electronic component EC, the electronic component EC slides in the guide recess 12b and the electronic component EC slides from the guide recess 12b to the storage recess. When the electronic component EC is not smoothly fed to the 12a, the clearance between the lower surface of the portion of the component guide IG where the component passage IGa does not exist (the right portion in FIG. 6) and the upper surface of the carrier tape 10 or the component guide It is preferable to apply a negative pressure to the component passage IGa through a suction passage separately provided in the portion of the IG, and to draw the electronic component EC in the component passage IGa into the guide recess 12b and the storage recess 12a by this negative pressure.

<< Third Embodiment >>
FIG. 7 shows the carrier tape 10-2 according to the third embodiment of the present invention.

The carrier tape 10-2 shown in FIG. 7 differs from the carrier tape 10 shown in FIGS. 1 and 2 in that the carrier tape 10-2 itself is a compression processing type. The material of the carrier tape 10-2 is, for example, paper, synthetic paper, etc., and since the storage recess 12a and the guide recess 12b are formed by compression processing, the height H of the carrier tape 10-2 is substantially constant in the width direction. be. Since other configurations are the same as those of the carrier tape 10 shown in FIGS. 1 and 2, the description thereof will be omitted.

Even with this carrier tape 10-2, similarly to the carrier tape 10 shown in FIGS. 1 and 2, the method of inserting the electronic component EC from the side into the storage recess 12a can be appropriately performed, and FIG. 4 It is possible to accurately manufacture an electronic component storage tape similar to the electronic component storage tape 30 shown in 1.

<< Other Embodiments >>

(M1) In each of the above-described embodiments, the storage recess 12a of the component storage unit 12 is shown to correspond to a substantially rectangular electronic component EC having a relationship of 1st dimension> 2nd dimension = 3rd dimension. By changing the depth D1 of the recess 12a, a substantially rectangular electronic component having a relationship of 1st dimension> 2nd dimension> 3rd dimension, or an abbreviation having a relationship of 1st dimension> 3rd dimension> 2nd dimension. A rectangular electronic component can be inserted (stored). Even if the depth D1 of the storage recess 12a is changed, the method of inserting the electronic component EC from the side into the storage recess 12a can be appropriately performed, and the same electronic component as the electronic component storage tape 30 shown in FIG. 4 can be appropriately performed. The storage tape can be manufactured accurately.

(M2) In each of the above-described embodiments, the arrangement interval of the component storage portions 12 (pitch P1, see FIG. 1) is set to 1/2 of the arrangement interval of the feed holes 13 (pitch P2, see FIG. 1). As shown, the pitches P1 and P2 may be changed according to the size of the electronic component to be inserted (stored). Even if the pitches P1 and P2 are changed, the method of inserting the electronic component EC from the side into the storage recess 12a can be appropriately performed, and the electronic component storage tape similar to the electronic component storage tape 30 shown in FIG. 4 can be appropriately performed. Can be manufactured accurately.

(M3) In each of the above-described embodiments, the bottom surface 12b1 is formed of a flat surface as the guide recess 12b of the component storage portion 12, but the bottom surface 12b1 is a gentle curved surface having the same inclination (convex curved surface, concave curved surface, etc.). However, the method of inserting the electronic component EC into the storage recess 12a from the side can be appropriately performed, and the electronic component storage tape similar to the electronic component storage tape 30 shown in FIG. 4 can be accurately manufactured. ..

(M4) In each of the above-described embodiments, the guide recess 12b of the component storage portion 12 has a form in which the length L2 decreases from the upper surface of the tape main body 11 toward one side surface of the storage recess 12a in the width direction. The length L2 of the guide recess 12b may be fixed, and the length L2 may be made to match the length L1 of the storage recess 12a. In this case, although it is difficult to obtain the posture correction action by the guide recess 12b, the method of inserting the electronic component EC from the side into the storage recess 12a can be appropriately performed, and the electronic component storage tape 30 shown in FIG. 4 can be used. A similar electronic component storage tape can be accurately manufactured.

10, 10-1, 10-2 ... Carrier tape, 11 ... Tape body, 11a ... One end edge in the width direction, 11b ... The other end edge in the width direction, 12 ... Parts storage part, 12a ... Storage recess, 12a1 ... Bottom surface, 12a2 ... Side surface, W1 ... width of storage recess, L1 ... length of storage recess, D1 ... depth of storage recess, 12b ... guide recess, 12b1 ... bottom surface, 12b2 ... side surface, W2 ... width of guide recess, L2 ... guide recess Length, D2 ... Depth of guide recess, 20 ... Cover sheet, 30 ... Electronic component storage tape.

Claims (8)

Carrier tape for electronic component storage tape
The longitudinal direction of the carrier tape is the length direction, the lateral direction is the width direction, the direction orthogonal to these directions is the height method, the dimension along the length direction is the length, and the dimension along the width direction is When the width is defined as the height or depth when the dimension along the height direction is defined as the height or depth.
The carrier tape has a strip-shaped tape main body and storage recesses provided in the tape main body at equal intervals in the length direction and having a length, width and depth capable of storing electronic components. And
On one side of the tape body in the width direction of the storage recess, the depth increases from the upper surface of the tape body toward one side surface of the storage recess in the width direction, and the guide recess is continuous with the storage recess. Is provided ,
The guide recess has a form in which the length decreases from the upper surface of the tape body toward one side surface of the storage recess in the width direction.
Carrier tape for electronic component storage tape. The electronic component has a first dimension corresponding to the width of the storage recess, a second dimension corresponding to the length of the storage recess, and a third dimension corresponding to the depth of the storage recess.
The maximum length of the guide recess is set within the range of 1.1 times to 1.5 times the second dimension of the electronic component.
The carrier tape for the electronic component storage tape according to claim 1. The minimum length of the guide recess coincides with the length of the storage recess.
The carrier tape for the electronic component storage tape according to claim 1 or 2. Carrier tape for electronic component storage tape
The longitudinal direction of the carrier tape is the length direction, the lateral direction is the width direction, the direction orthogonal to these directions is the height method, the dimension along the length direction is the length, and the dimension along the width direction is When the width is defined as the height or depth when the dimension along the height direction is defined as the height or depth.
The carrier tape has a strip-shaped tape main body and storage recesses provided in the tape main body at equal intervals in the length direction and having a length, width and depth capable of storing electronic components. And
On one side of the tape body in the width direction of the storage recess, the depth increases from the upper surface of the tape body toward one side surface of the storage recess in the width direction, and the storage recess and the storage recess. A continuous guide recess is provided ,
The remaining side surfaces of the storage recesses other than the one side surface in the width direction of the plurality of side surfaces are connected to the upper surface of the tape body .
Carrier tape for electronic component storage tape. The maximum depth of the guide recess is smaller than the depth of the storage recess.
The carrier tape for the electronic component storage tape according to any one of claims 1 to 4. The electronic component has a first dimension corresponding to the width of the storage recess, a second dimension corresponding to the length of the storage recess, and a third dimension corresponding to the depth of the storage recess.
The maximum depth of the guide recess is set within the range of 1/4 to 3/4 of the third dimension of the electronic component.
The carrier tape for the electronic component storage tape according to any one of claims 1 to 5. Electronic component storage tape
The carrier tape according to any one of claims 1 to 6, and the carrier tape.
The electronic component stored in the storage recess of the carrier tape and
A cover tape that covers a part of the upper surface of the carrier tape so as to close the upper end opening of the storage recess in which the electronic component is stored is provided.
Electronic component storage tape. It is a manufacturing method of electronic component storage tape.
The step of preparing the carrier tape according to any one of claims 1 to 6 and
A step of storing the electronic component in the storage recess of the carrier tape,
A step of covering a part of the upper surface of the carrier tape with a cover tape so as to close the upper end opening of the storage recess in which the electronic component is stored is provided.
Manufacturing method of electronic component storage tape.

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