JPH0360999A - Carrier film blanking molding device - Google Patents

Abstract

PURPOSE:To perform cutting of a lead and a film and molding of the lead through one process by means of a single mold by providing a back punch having a staged part to blank a wiring lead in co-operation of a punch and mold a wiring lead for a hole part and a die to blank a carrier film in co-operation with the punch. CONSTITUTION:A punch 9 is lowered and a lead is cut by means of a blade 14 of a lead cutting part 12 and a blade 18 of a back punch 10. The punch 9 is further lowered, and a lead is molded by means of a lead molding part 15 of the punch 9 and a lead molding part 19 of the back punch 10. Simultaneously, by using a blade 20 of a lead molding and blanking part 13 of the punch 9 and a blade 17 of a die 11, a carrier film 1 is blanked. Thereafter, when the punch 9 is lowered to a bottom dead center, molding of a lead is completed by means of the punch 9 and the back punch 10.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a carrier film (hereinafter referred to as a film) having a hole, a wiring lead (hereinafter referred to as a lead), and an IC chip held by the lead in the hole. The present invention relates to an apparatus for punching out the leads and the film and bending the leads in the holes.

[Conventional technology]

As described in Japanese Patent Application Laid-Open No. 57-39563, a conventional device punches out leads from a film using a punch and die, punches out the film using a punch and a back punch, and forms leads in holes.

(Problems to be Solved by the Invention) In the conventional apparatus described above, the lead is cut using a punch and die, and the film is cut while forming the lead using the punch and back punch. Since it is a punch, the lead is bent in the punching direction, and the lead bending direction is not considered, and the lead bending direction is restricted.

An object of the present invention is to provide a film punching and forming apparatus in which the lead bending direction is not restricted.

Another object of the present invention is to provide a film punching and forming apparatus capable of punching out an adhesive anisotropic conductive film for lead connection together with a carrier film.

[Means to solve the problem]

In order to solve the above problems, the apparatus of the present invention includes: a punch; a back punch having a step for acting with the punch to punch out the wiring lead and forming the wiring lead in the hole; The present invention is characterized by comprising a die that acts with the punch to punch out the carrier film.

Further, the present invention is characterized in that the punch is provided with a blade for punching out the anisotropic conductive film provided on the film.

[Effect]

In the device of the present invention, the punch descends and the blade is set up between the punch and the back punch to first cut the reed. moreover,
The punch descends, and the lead follows the lead bending section due to the action of the punch and the lead bending section of the back punch, forming the lead. At the same time, a punch and a die are used to punch out the carrier film. Thereafter, when the punch reaches the bottom dead center, the lead forming is completed by the punch and back punch.

〔Example〕

FIG. 3(A) is a plan view showing an example of the specifications of the film. 1 is a film, and 2 is a sprocket hole that is equally spaced in the film 1 and is used for feeding and positioning the carrier film. 3 is a hole drilled in the film 1 for molding, 4 is a hole drilled in the film 1 for holding an IC chip, 5 is an IC chip, 6 is an output side lead, 7
is the input side lead. Input side leads 7 and output side leads 6 wired on the film l protrude into the hole 4 for holding an IC chip, and an IC chip 5 is bonded to these lead portions. The input side lead 7 is also provided in the hole 3 portion.

FIG. 3(B) is a plan view showing the shape of a film punched from the film of FIG. 3(A), and FIG. 3(C) is a sectional view of FIG. 3(B). 8 shows a state in which the input side lead 7 is molded.

1A to 1D are cross-sectional views showing a film punching and forming apparatus according to an embodiment of the present invention. 9 is a punch, 12 is a lead cutting portion of the punch 9, and 14 is a lead cutting portion 12. 13 is the lead forming and punching part of the punch 9, 20 is the blade of the upper part 3 of the lead forming and punching part, 15 is the lead forming part, 16 is the film presser, 11 is the die, 17 is the blade of the die 11, 10 is a back punch provided in the die 11, and is pressed against the die 11 by a force F2 (not shown).18 is a blade of the back punch 10;
9 is a lead forming part of the back punch 1o, and 21 is a positioning claw.

The punch 9 is lowered by a force F□ (not shown), the film presser 16 presses the film 1 against the die 11, the positioning pawl 21 is inserted into the sprocket hole 2, and the film 1 is positioned. Furthermore, the punch 9 descends, and as shown in FIG.
), the lead is cut by the crab 4 of the lead cutting section 12 and the blade 18 of the back punch 11. At this time,
The downward force F1 of the punch 9 is the force F acting on the back punch 10.
Since the punch 9 is larger than 2, the punch 9 continues to descend and reaches the position shown in Fig. 1 (C
), the film 1 is cut by the blades 20 and 17 while the lead is formed by the lead forming section 15 and the tool 9. Further, the punch 9 is lowered to complete the lead forming. In this way, punching and molding can be simultaneously performed using one mold without being restricted in the punching direction.

FIG. 4(A) is a plan view showing an example of a film with an anisotropic conductive film for connecting leads, and FIG. 4(B) is a diagram of a film punched from the film of FIG. 4(A). FIG. 3 is a plan view showing the shape. 23 is an anisotropic conductive film.

FIG. 2 is a sectional view showing a second embodiment of the device of the invention. In this embodiment, since the punch 9 is provided with a blade 22,
The adhesive film with an anisotropic conductive film shown in FIG. 4 can be punched out. Also, as shown in Figure 4,
0 from the edge of the film where the anisotropic conductive film 23 is to be cut out
．． By temporarily pressing and punching with 2 to 0.3 nn+li, the part of the anisotropic conductive film 23 to be cut can be made smaller, so the life of the blade 22 can be extended, and even when the conductive particle diameter is large, It is possible to prevent short circuits between connection terminals due to disconnection operations.

It should be noted that the above embodiments are merely illustrative, and various shapes and configurations of the mold can be used within the scope of the claims of the present invention.

〔Effect of the invention〕

As explained above, according to the present invention, cutting of the lead and film and molding of the lead can be performed in one process using one mold, so that the process can be shortened and one working time can be shortened. Further, the lead can be formed without being restricted in the punching direction. Furthermore, traditionally, sticky
In addition, it is possible to cut an anisotropic conductive film, which was difficult to cut simultaneously with the film because short circuits occur between terminals when the conductive particles have a large diameter.

[Brief explanation of drawings]

1A to 1D are cross-sectional views showing a film punching and forming apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing a second embodiment of the apparatus according to the present invention. 3(A) is a plan view showing an example of the specifications of the film, FIG. 3(B) is a plan view showing the shape of the film punched from the film of FIG. 3(A), and FIG. ) is a cross-sectional view of FIG. 3(B), FIG. 4(A) is a plan view showing an example of a film with an anisotropic conductive film for connecting leads, and FIG. 4(B) is
FIG. 4 is a plan view showing the shape of a film punched from the film of FIG. 4(A). 9...Punch 10...Back punch 11...Die 12...Lead cutting section 13...Lead forming and punching section 14...Blade 15...Lead forming section 6...Film holder 7...Blade 8...Blade 9...Lead forming part 0...Blade 1...Positioning claw 2...Blade

Claims (1)

[Claims] 1. Punching out the wiring lead and the carrier film from a carrier film having a hole, a wiring lead, and an IC chip held in the wiring lead in the hole, and bending the wiring lead in the hole. The forming device includes a punch, a back punch that acts with the punch to punch out the wiring lead and has a step for forming the wiring lead in the hole, and acts with the punch to punch out the carrier film. A carrier film punching and forming device characterized by comprising a punching die. 2. A carrier film punching and forming apparatus, characterized in that the punch is provided with a blade for punching out the anisotropic conductive film for lead connection provided on the carrier film.