JPH0425058A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH0425058A JPH0425058A JP12617190A JP12617190A JPH0425058A JP H0425058 A JPH0425058 A JP H0425058A JP 12617190 A JP12617190 A JP 12617190A JP 12617190 A JP12617190 A JP 12617190A JP H0425058 A JPH0425058 A JP H0425058A
- Authority
- JP
- Japan
- Prior art keywords
- tie bar
- lead frame
- cutting
- die
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は樹脂封止型半導体装置用リードフレームに関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for a resin-sealed semiconductor device.
従来の樹脂封止型半導体装置用リードフレームのタイバ
ー形状は、第４図に示すように、タイバー３の切断位置
の板厚はリードフレームそのものの板厚と同じ板厚であ
る。そして、第５図（ａ＞（ｂ）に示す様に、パイロッ
トピン８を有するダイアとストリッパー５の間に、リー
ドフレームの位置決め穴４をパイロットピン８に挿入し
て、リードフレーム全体をはさみ、クリアランスＣ２を
有するポンチ６を下降しタイバー３の切断を行っていた
。In the tie bar shape of a conventional lead frame for a resin-sealed semiconductor device, as shown in FIG. 4, the thickness of the tie bar 3 at the cutting position is the same as the thickness of the lead frame itself. Then, as shown in FIG. 5 (a>(b)), the positioning hole 4 of the lead frame is inserted into the pilot pin 8 between the diamond having the pilot pin 8 and the stripper 5, and the entire lead frame is sandwiched. A punch 6 having a clearance C2 was lowered to cut the tie bar 3.
しかしながら、上述した従来のリードフレームでは、ク
リアランスＣ２が小さいために、パイロットピン８が磨
耗し、リードフレームの位置ずれが発生すると、第３図
に示すように、パンチが外部リード２にくい込み、又、
タイバーの切り残し量ρが大きくなり規格から外れて不
良が発生ずるという欠点がある。However, in the conventional lead frame described above, since the clearance C2 is small, when the pilot pin 8 is worn and the lead frame is misaligned, the punch may become wedged into the external lead 2, as shown in FIG. ,
There is a drawback that the uncut amount ρ of the tie bar becomes large, which deviates from the standard and causes defects.
本発明のリードフレームは、外部リードと、外部リード
相互間を接続するタイバーと、外部リードとタイバーと
の間に設けて外部リード又はタイバーよりも厚さを薄く
した切断部とを備えている。The lead frame of the present invention includes an external lead, a tie bar that connects the external leads to each other, and a cut portion that is provided between the external lead and the tie bar and is thinner than the external lead or the tie bar.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ＞、（ｂ）は本発明の一実施例を説明するた
めのリードフレームの部分平面図及びＡ、−Ａ’線断面
図である。FIGS. 1A and 1B are a partial plan view and a cross-sectional view taken along lines A and -A' of a lead frame for explaining an embodiment of the present invention.
第１図（ａ）、（ｂ）に示すように、タイバー３に隣接
して設けた溝状の切断部９の板厚は、リードフレームの
タイバー３又は外部リード２の板厚より薄くする。この
様なリードフレーム構造とすることにより、後の製造工
程であるタイバー３の切断工程において、第２図に示す
様に、リードフレームを位置決めするに必要なパイロッ
トピン８を有するダイアとストリッパー５とポンチ６で
構成したタイバー切断金型は、ポンチ６の先端形状を７
字形にし、ダイアも外部リード２の下面内に設け、クリ
アランスＣ１はＣ２より大きくする。この様な金型で、
タイバー３にポンチ６で押圧力を加え、引き抜き方式て
加工することが可能となる。As shown in FIGS. 1(a) and 1(b), the thickness of the groove-shaped cut portion 9 provided adjacent to the tie bar 3 is made thinner than the thickness of the tie bar 3 or the external lead 2 of the lead frame. By adopting such a lead frame structure, in the later manufacturing process of cutting the tie bar 3, as shown in FIG. The tie bar cutting mold composed of punch 6 has a tip shape of 7.
The diameter is also provided within the lower surface of the external lead 2, and the clearance C1 is made larger than C2. With a mold like this,
It becomes possible to apply pressing force to the tie bar 3 with the punch 6 and perform processing by pulling it out.
〔発明の効果〕
以上説明したように、本発明はパイ四ツ１〜ピンが磨耗
し、リードフレームの位置ずれが発生した状態でタイバ
ーを切断してもダイ切断不良の発生を防止できる効果が
ある。又、タイバー切断金型は、切断方式から引き抜き
方式に変更でき、精度を必要としないため保守が容易に
なる。[Effects of the Invention] As explained above, the present invention has the effect of preventing die cutting defects even if the tie bar is cut when the piezo pins 1 to 1 are worn and the lead frame is misaligned. be. In addition, the tie bar cutting mold can be changed from a cutting method to a drawing method, and maintenance is easy because precision is not required.
第１図（ａ）、（ｂ）は本発明の一実施例を説明するた
めのリードフレームの部分平面図及びＡＡ′線断面図、
第２図（ａ）、（ｂ）は本発明のリードフレームを用い
た樹脂封止済みリードフレームのタイバーを引き抜いた
状態の部分平面図及び断面図、第３図は従来のリードフ
レームを用いた樹脂封止済みリードフレームのタイバー
切断不良を示す部分平面図、第４図は従来のリードフレ
ームを用いた樹脂封止済みリードフレームの部分平面図
、第５図（ａ＞、（ｂ）は従来のリードフレームを用い
た樹脂封止済みリードフレームのタイバーを切断した状
態の部分平面図及び断面図である。
１・・・樹脂体、２・・・外部リード、３・・・タイバ
ー４・・・位置決め穴、５・・・ストリッパー、６・・
・ポンチ、７・・・ダイ、８・・・パイロットピン、９
・・・切断部。FIGS. 1(a) and 1(b) are a partial plan view and a sectional view taken along line AA' of a lead frame for explaining one embodiment of the present invention;
Figures 2 (a) and (b) are a partial plan view and a sectional view of a resin-sealed lead frame using the lead frame of the present invention with the tie bar pulled out, and Figure 3 is a partial plan view and a cross-sectional view of a resin-sealed lead frame using the lead frame of the present invention. FIG. 4 is a partial plan view of a resin-sealed lead frame using a conventional lead frame. FIGS. 1 is a partial plan view and a sectional view of a resin-sealed lead frame using a lead frame with the tie bars cut away. 1... Resin body, 2... External lead, 3... Tie bar 4...・Positioning hole, 5... Stripper, 6...
・Punch, 7...Die, 8...Pilot pin, 9
...cut section.
Claims (1)
部リードの相互間を接続するタイバーを有するリードフ
レームにおいて、前記外部リードとタイバーとの間の切
断部の板厚を薄くしたことを特徴とするリードフレーム
。A lead frame having external leads leading out of the resin-sealed area and a tie bar connecting the external leads to each other, characterized in that the thickness of the cut portion between the external lead and the tie bar is reduced. lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12617190A JPH0425058A (en) | 1990-05-16 | 1990-05-16 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12617190A JPH0425058A (en) | 1990-05-16 | 1990-05-16 | Lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425058A true JPH0425058A (en) | 1992-01-28 |
Family
ID=14928442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12617190A Pending JPH0425058A (en) | 1990-05-16 | 1990-05-16 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425058A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5821610A (en) * | 1995-01-18 | 1998-10-13 | Nec Corporation | Leadframe allowing easy removal of tie bars in a resin-sealed semiconductor device |
| CN106041537A (en) * | 2016-07-08 | 2016-10-26 | 福建省台彩机械科技有限公司 | Tile press for color sheet |
-
1990
- 1990-05-16 JP JP12617190A patent/JPH0425058A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5821610A (en) * | 1995-01-18 | 1998-10-13 | Nec Corporation | Leadframe allowing easy removal of tie bars in a resin-sealed semiconductor device |
| CN106041537A (en) * | 2016-07-08 | 2016-10-26 | 福建省台彩机械科技有限公司 | Tile press for color sheet |
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