JPS60259400A - Method of cutting tape carrier - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Technical Field) The present invention relates to a tape carrier for mounting circuit elements in thermal heads, optical sensors, IC cards, etc., and a method for punching out the tape carrier to which the circuit elements are bonded. This relates to a cutting method.

(Conventional technology) Circuit elements such as drive circuits for thermal heads, etc.

There is a tape carrier method in which the circuit elements are bonded to a tape carrier and then the tape carrier is bonded to a thermal head or the like. Recently, as devices such as thermal heads have become smaller, tape carriers themselves have also become smaller.

In the tape carrier type bonding method, for example, a tape carrier as shown in FIG. 2 is used. For example, an inner lead hole 4 for inner bonding a circuit element to a base 2 made of polyimide or the like;
Outer lead holes 6 and 8 are opened so that the leads protrude when cut and are used for outer bonding to a device such as a thermal head, and leads 10 and 12 are patterned and formed. Position the circuit element in the inner lead hole 4 of this tape carrier, and
The part (inner lead) protruding into the hole 4 is bonded to the circuit element. 14 and 16 are signal check pads for testing bonded circuit elements, and 18 is a sprocket hole for tape feeding.

The tape carrier with the circuit elements bonded in this way is wound up into a roll, then punched out one by one and transported onto a device such as a thermal head. ) and its thermal head or other device.In this case, the tape carrier is punched out by cutting as shown in the dashed line in Figure 2. with the a - d parts of base 2,
These are the leads inside the outer lead holes 6 and 8.

However, since the -a-d parts of base 2 are long,
A large force is required for punching with a punching press as shown in FIG. Therefore, the impact during punching is applied to the entire tape carrier 1, and when it is cut, the punched tape carrier 20 may shift as shown in FIG. 4, or sometimes the tape carrier 20 may fly out of the upper die. A problem arises in that positioning becomes difficult during outer bonding later. This problem becomes more pronounced as the punched tape carrier 20 becomes smaller. In FIGS. 3 and 4, 22 is a lower die of the punching press, 24 is an upper die, and 26 is a circuit element such as an IC bonded to the tape carrier 1.

In order to solve such problems, various improvements have been made to presses or outer bonding devices as described below.

(1) Since the removed tape may shift, align it with the bonding part after conveying it.

This requires a vacuum chuck to be provided with fine adjustment mechanisms for x, y, z, and θ, which complicates the structure of the device.

Generally, the tape carrier 20 after being punched is 3.
It is approximately 8rnm x 20mm in size, and must be aligned to the bonding part while viewing it with a microscope, so x, y, z,
It is difficult to make a chuck that can move in θ.

(2) As shown in FIGS. 5 and 6, lift the lower mold 22 while holding it with the vacuum chuck 28.

This method prevents the tape carrier 20 from being scratched by the vacuum chuck 28, or the thickness e' of the upper mold 24, and the spring mechanism to prevent scratches. One dimension of is required, so
e within the focus of the microscope.

In order to keep one dimension down, the structure was extremely complicated.

(3) As shown in FIG. 7, the lower die 32 is provided with a suction port, and the lower die 32 is sucked while cutting.Then, the suction of the lower die 32 is turned off and conveyed by a vacuum chuck. This method is very effective, but when the size of the tape carrier is about 3°8 mm x 20 mm, the diameter of the suction port is at most 1 mm or 2 m.
Only about m could be obtained, and some deviation still occurred.

(4) Also, if both the lower die and the upper die are new, the blades will be sharp, so even if you do not do the steps in (1), (2), and (3) above, the tape carrier will not shift, so it will last for several weeks. The molds are polished periodically after each use, but the disadvantages are that it is difficult to remove the molds, production efficiency is not improved, and polishing costs are high.

(Purpose) The present invention shortens the length of the part where the base of the tape carrier is cut, and also makes it possible to cut the tape carrier base with a small force on the lower die and upper die of the punching press. It is an object of the present invention to provide a cutting method that reduces the impact force when cutting a tape carrier so that the punched tape carrier is difficult to shift.

(Structure) In the present invention, holes are pre-drilled in the tape carrier at the positions where the circuit elements are bonded, the positions where the leads protrude when cut, and a part of the part to be cut. , or a cutting method in which the tape carrier is punched out using a punching press in which at least a portion of the edges of both the lower die and the upper die are sloped.

Hereinafter, the present invention will be explained in detail with reference to Examples.

Note that in all the figures, the same or equivalent parts are denoted by the same symbols and detailed explanations are omitted.

FIG. 1 shows a tape carrier to be cut according to the present invention, and shows the state before circuit elements are bonded. Compared to the conventional one shown in FIG. 2, the base 2 is the same in that it has an inner lead hole 4 and outer lead holes 6 and 8, but it also has cutting holes 40,
The difference is that 42, 41 and 46 are opened. These holes are provided so as to include a portion of the cutting location indicated by the dashed line.

In the punching process after circuit elements are mounted on this tape carrier, the tape carrier base 2 is cut at the g-
n, which means that the cutting length is shorter by the length of the cutting holes 40, 42, 44, and 46 compared to a to d in Figure 2, and therefore the impact force during punching with a press is also smaller. As a result, the cut tape carrier is less likely to shift or pop out, and the subsequent outer bonding process can be carried out efficiently.

In this way, the punched tape carrier 20 has a shape as shown in FIG. 26 is a circuit element such as an IC.

In the present invention, in order to perform the punching process more efficiently, the die of the punching press is also devised.

FIG. 9 shows a lower mold 50 of a punching press according to an embodiment of the present invention, and a pair of opposing edges 52 and 54 are inclined so as to be concave toward the center.

When this lower die 50 is combined with the upper die and a tape carrier is punched out, the edges 52 and 54 of the lower die 50 obliquely hit the tape carrier 56, as shown in FIGS. 10 and 11, and the tape carrier 56 is gradually cut. As the cutting process continues, the impact force at the time of cutting becomes weaker, and the cut tape carrier 20
Misalignment is less likely to occur.

Note that during punching, the tape carrier 20 is slightly deformed due to the inclination of the edges 52 and 54 of the lower die 50, but since the base 2 of the tape carrier 56 is made of a resin such as polyyside and has elasticity, it is similar to that of a general metal plate. Unlike punching, plastic deformation does not occur, and the sheet returns to its original flat state after punching is completed.

In the present invention, various shapes can be adopted for the edge portion of the lower die. For example, as shown in FIG.
The lower die 59 has an inclined edge, or the lower die 61 has an edge 60 inclined to one side as shown in FIG. It may be any material whose edges are inclined as it cuts.

FIG. 14 shows still another example of the press lower mold, in which a lower mold 62 with an inclined edge is provided with an exhaust port 64 for sucking the tape carrier 56.

If the tape carrier 56 is cut while being sucked by the lower die 62, the cut tape carrier is less likely to shift.

FIG. 15 shows an embodiment in which a press upper die 68 having an inclined edge 66 is used. In this case as well, the tape carrier 56 is gradually cut by the inclined edge 66 of the upper die, so that the punching process is performed. □-t.

The impact force at the time of impact becomes weaker.

The punching press of the present invention may also be configured such that the edges of both the lower die and the upper die are inclined, and in this case, the impact force at the time of punching is further weakened.

(Effects) According to the present invention, since the impact force when punching the tape carrier is weakened, the tape carrier after being punched out is less likely to shift from its predetermined position, and the tape carrier during the subsequent outer bonding process is This has the effect of making positioning easier.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a part of an embodiment of a tape carrier used in the present invention, FIG. 2 is a plan view showing a part of a tape carrier used in a conventional method, and FIGS. Figure 4 is a cross-sectional view illustrating the process of punching out a tape carrier using a conventional press, Figures 5 and 6 are also cross-sectional views explaining the process of punching a tape carrier using a conventional press, and Figure 7 is a cross-sectional view illustrating the process of punching a tape carrier using a conventional press. 8 is a perspective view showing a tape carrier punched out from the tape carrier shown in FIG. 1 according to the present invention; FIG. 9 is a perspective view showing an example of the lower pressing mold according to the present invention; FIG. 10 and Figure 11 is Figure 9.
Cross-sectional view showing the punching process performed using the lower mold in the figure, 1st
2 and 13 are respectively perspective views showing other embodiments of the press lower mold according to the present invention, and FIG. 14 is a sectional view showing a punching process using still another embodiment of the press lower weight.
FIG. 5 is a sectional view showing a punching process using an embodiment of the upper die according to the present invention. 2... Tape carrier base, 4...
Inner lead holes to which circuit elements are bonded, 6
．． 8... Outer lead hole from which the lead protrudes when cut, 10, 12... Lead, 26
・・・・・・Circuit element, 40, 42, 44.46...
...cutting holes, 50, 59, 61, 62...
...Lower mold, 68...Top mold, 52, 54, 58
．． 60... Slanted edge. Patent applicant Ricoh Co., Ltd. 8:, ii 2:, '-; Figure 5 Figure 6 +/-1

Claims (1)

[Claims] (1) The position where circuit elements are bonded on the tape carrier, the position where the leads protrude when cut,
and a part of the part to be cut, with holes made in advance, and the tape carrier is cut using a punching press in which at least part of the edges of the lower die, the upper die, or both the lower die and the upper die are sloped. A cutting method characterized by punching out.