CN113843371B - Electronic element pin flattening process and equipment thereof - Google Patents
Electronic element pin flattening process and equipment thereof Download PDFInfo
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- CN113843371B CN113843371B CN202111151490.1A CN202111151490A CN113843371B CN 113843371 B CN113843371 B CN 113843371B CN 202111151490 A CN202111151490 A CN 202111151490A CN 113843371 B CN113843371 B CN 113843371B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/02—Straightening
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F5/00—Upsetting wire or pressing operations affecting the wire cross-section
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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Abstract
The invention relates to the technical field of electronic element pin processing, in particular to an electronic element pin flattening process and equipment thereof, which comprises the steps of flattening an electronic element pin at a proper position, cutting off one end of the electronic element pin, and finally automatically collecting the processed electronic element pin.
Description
Technical Field
The invention relates to the technical field of electronic element pin processing, in particular to an electronic element pin flattening process and equipment thereof.
Background
The pins of the electronic element are led out from the internal circuit of the integrated circuit (chip) and are connected with the peripheral circuit, and all the pins of the electronic element form the interface of the chip. A section of the end of the lead is soldered to a pad on the printed board. The electronic component pins may be divided into heel, toe, foot side, etc.
When the whole diameter of the electronic element is smaller than the aperture of the plug-in unit, the surface of the electronic element pin is required to be coated with an insulating cover or a sleeve is additionally arranged to limit the depth of the electronic element pin inserted into the hole of the circuit board, so that the material cost of the insulating cover and the sleeve on the element can be greatly increased.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides an electronic element pin flattening process and equipment thereof, which solve the problems that the processing cost of the electronic element pin is increased and the processing efficiency of the electronic element pin is reduced by adopting an insulating cover and a sleeve for limiting the electronic element pin in the prior art.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: an electronic component pin flattening process comprises the following steps:
firstly, straightening coiled electronic element pins, and then sending the straightened electronic element pins into a wire guide cylinder;
secondly, the pins of the electronic element pass through the wire guide cylinder and are sent into a processing groove in the workbench, the screw is driven to rotate by the servo motor, the movable block slides left and right in the mounting frame, and the relative positions of the pressing block and the pins of the electronic element are adjusted according to the depth of inserting the movable block into the hole of the circuit board as required;
thirdly, driving the whole mounting frame to slide downwards by the servo electric cylinder, enabling the bottom of the pressing block to be in contact with the bottom of the inner wall of the processing groove, flattening the surface of the pin of the electronic element by the bump at the bottom of the pressing block, and then driving the mounting frame to reset by the servo electric cylinder to finish flattening the pin of the electronic element;
fourthly, when the bottom of the pressing block is contacted with the bottom of the inner wall of the processing groove, the servo electric cylinder II drives the whole mounting block to slide downwards, the pressing plate on the right side of the cutting tool limits pins of electronic elements in the processing groove, then the mounting block continues to move downwards, the position between the pressing plate and the pins of the electronic elements is kept limited, the cutting tool cuts off one end of the pins of the electronic elements, and the servo electric cylinder II drives the mounting block to reset to finish cutting off the pins of the electronic elements;
and fifthly, pushing the electronic element pins in the processing groove into the blanking groove through the pushing plate, conveying the processed electronic element pins into the collecting frame through the material receiving pipe, conveying the electronic element pins into the processing groove through the wire guide barrel, and processing the electronic element pins by using the flattening mechanism and the cutting mechanism.
Preferably, the electronic element pin flattening equipment comprises a rack, wherein a wire guide cylinder is arranged on the left side of the front face of the rack, a workbench is arranged on the right side of the wire guide cylinder, a flattening mechanism is arranged above the workbench, and a material receiving box is arranged below the workbench;
the utility model provides a flat mechanism, including the installation frame, and the inside one side rotation of installation frame is provided with the screw rod, the surface threaded connection of screw rod has the movable block, and the bottom of movable block is provided with the connecting block, the bottom of connecting block is provided with the material pressing block through the bolt, the recess is seted up to the bottom of material pressing block, and the inside of recess is provided with the lug, the movable groove with movable block matched with is all seted up to the inside both sides of installation frame, and the both sides of movable block respectively with the inside sliding connection of two movable grooves, one side of installation frame inner wall is provided with servo motor, and the one end of servo motor output shaft passes through shaft coupling and the one end fixed connection of screw rod, utilizes the material pressing block to move down, and electronic component pin of electronic component is located the inside of recess, and the lug is flattened to electronic component pin after flattening all sets up the arc wall simultaneously, and electronic component pin after flattening is flat, utilizes servo motor output shaft to drive the screw rod to rotate, and pivoted screw rod drives the movable block and slides about the inside the installation frame, adjusts the position of material pressing block inside the installation frame, realizes that the electronic component pin is flattened to different positions on the workstation.
Preferably, the top of installing frame is provided with movable post, and the top of installing frame is provided with limit sleeve, the surface of movable post and limit sleeve's inside sliding connection, the back of frame is provided with slider one, and one side of slider one and one side fixed connection of movable post, the inside of frame is seted up with slider one matched with spout one, slider one's below is provided with servo electric cylinder one, and servo electric cylinder one end of drive shaft and slider one's bottom fixed connection.
Preferably, the left side of flattening mechanism is provided with shutdown mechanism, shutdown mechanism includes the installation piece, and the bottom of installation piece is provided with the cutting tool, the right side of installation piece is provided with the fixed block, and the below activity of fixed block is provided with the pressure flitch, the both sides at pressure flitch top all are provided with the movable rod, and the inside of fixed block is all run through on the top of two movable rods.
Preferably, the mounting groove has all been seted up to the inside both sides of fixed block, and the inside slip of mounting groove is provided with the slide, the inside of slide and movable rod's fixed surface are connected, the surface cover of movable rod is equipped with the spring, and the bottom of spring and the top fixed connection of slide, when utilizing cutting tool to cut off the electronic component pin, carry out spacingly to the electronic component pin through the pressure plate on cutting tool right side, the rethread cutting tool cuts off the processing, can effectively avoid taking place the perk at the in-process that cuts off the electronic component pin, guarantees the cutting accuracy of electronic component pin.
Preferably, the back of frame is provided with servo electric jar two, and servo electric jar one end of two drive shafts is provided with slider two, one side of slider two and one side fixed connection of installation piece, and the inside of frame is offered with slider two matched with spout two, utilizes servo electric jar two to drive slider two and slide about the inside of spout two, realizes that the installation piece slides from top to bottom in the front of frame, and then cuts off the processing to electronic component pin of electronic component through the cutting tool of installation piece bottom.
Preferably, the guide chute is arranged on the left side of the top of the workbench, the processing chute is arranged on the right side of the guide chute, the cutting-off chute is arranged between the processing chute and the guide chute and under the cutting-off cutter, the material blocking block is arranged on the right side of the inside of the processing chute, and the through chute is arranged on one side of the material blocking block.
Preferably, the front of the inner wall of the processing groove is movably provided with a pushing plate, the back of the pushing plate is provided with an electric push rod, and one end of the electric push rod driving shaft is fixedly connected with the back of the pushing plate.
Preferably, both sides at the back of the pushing plate are provided with limiting rods, both sides at the top of the workbench are provided with limiting grooves matched with the limiting rods, and the rear of the bottom of the processing groove is provided with a blanking groove.
Preferably, the top of receiving box is provided with the receiving pipe, and the top of receiving pipe and blanking groove's bottom intercommunication, the inside slip of receiving box is provided with the collection frame, after flattening the processing to the electronic component pin through the swage piece, pushes the inside of blanking groove with the inside electronic component pin of processing groove through the pushing plate, then continues to send into the inside of processing groove with the electronic component pin through the wire section of thick bamboo, realizes the continuous processing to the electronic component pin, effectively improves the machining efficiency to the electronic component pin.
(III) beneficial effects
The invention provides a flattening process and equipment for pins of electronic elements. Compared with the prior art, the method has the following beneficial effects:
(1) Through setting up flattening mechanism in the front of frame, utilize the material pressing piece in the flattening mechanism to process the inside electronic component pin of processing groove, material pressing piece downward movement, electronic component pin of electronic component is located the inside of recess, the lug carries out flattening to electronic component pin of electronic component simultaneously, the arc wall has all been seted up to the both sides that are located the lug simultaneously, make the electronic component pin of lug bottom be flat, the depth of limiting element inserted in the circuit board hole that can be convenient through flat electronic component pin, realize controlling sliding through movable block in the installation frame inside in addition, can adjust the position of material pressing piece in the installation frame inside, and then according to the degree of depth of inserting in the circuit board hole of actual need, carry out flattening processing in the suitable position of electronic component pin, replace adopting insulating skin or sheathed tube spacing mode through carrying out flattening processing with the electronic component pin, and then effectual saving the material cost of insulating skin or sheathed tube on the electronic component pin, and then improve the machining efficiency to the electronic component pin.
(2) Through setting up the pressure flitch in one side of shutdown mechanism, when utilizing the cutter to cut off the electronic component pin, the installation piece slides downwards, carries out spacingly to the inside electronic component pin of processing groove through the pressure flitch on cutter right side, and the installation piece continues to move down afterwards, and the pressure flitch wholly upwards slides, and the rethread cutter cuts off the processing, can effectively avoid taking place the perk at the in-process that cuts off the electronic component pin, guarantees the cutting accuracy of electronic component pin, improves the machining precision to the electronic component pin.
(3) Through being provided with the flitch at the top of workstation, accomplish flattening processing the back to the electronic component pin by utilizing flattening mechanism, cooperation shutdown mechanism simultaneously cuts off the processing to the one end of electronic component pin, push the inside of blanking groove with the electronic component pin of processing inslot through the flitch this moment, continue to send into the inside of processing groove with the electronic component pin through the wire section of thick bamboo, realize the continuous processing to the electronic component pin, effectively improve the machining efficiency to the electronic component pin, utilize the receiving pipe to send into the collection frame with the electronic component pin after the processing in addition, realize the automatic collection to the electronic component pin and handle.
Drawings
FIG. 1 is a flow chart of a pin flattening process of an electronic component according to the present invention;
FIG. 2 is a schematic diagram of a pin flattening apparatus for electronic components according to the present invention;
FIG. 3 is a cross-sectional view of the structure of the flattening mechanism of the present invention;
FIG. 4 is a schematic view of the structure of the briquette according to the present invention;
FIG. 5 is a rear view of a partial structure of the frame of the present invention;
FIG. 6 is a cross-sectional view of the structure of the cutoff mechanism of the present invention;
FIG. 7 is a top view of a table structure of the present invention;
FIG. 8 is a top view of the material receiving box and material receiving pipe structure of the present invention.
In the figure, 10, a rack; 20. a wire guide tube; 30. a work table; 40. a material receiving box; 50. a material receiving pipe; 60. a collection frame; 101. a mounting frame; 102. a screw; 103. a movable block; 104. a connecting block; 105. pressing a material block; 106. a groove; 107. a bump; 108. a movable groove; 109. a servo motor; 110. a movable column; 111. a limit sleeve; 112. a first sliding block; 113. a first chute; 114. a servo electric cylinder I; 201. a mounting block; 202. cutting off the cutter; 203. a fixed block; 204. a pressing plate; 205. a movable rod; 206. a mounting groove; 207. a slide plate; 208. a spring; 209. a servo electric cylinder II; 210. a second slide block; 211. a second chute; 301. a guide groove; 302. a processing groove; 303. cutting off the groove; 304. a material blocking block; 305. a pushing plate; 306. an electric push rod; 307. a limit rod; 308. a limit groove; 309. and a material dropping groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1:
referring to fig. 1-8, a flattening process for pins of an electronic component includes the following steps:
firstly, straightening the coiled electronic component pins, and then feeding the straightened electronic component pins into the wire barrel 20;
secondly, the pins of the electronic component pass through the wire guide cylinder 20 and are sent into a processing groove 302 in the workbench 30, the screw 102 is driven to rotate by the servo motor 109, the movable block 103 slides left and right in the mounting frame 101, and the relative positions of the pressing block 105 and the pins of the electronic component are adjusted according to the depth of inserting the movable block into a circuit board hole as required;
thirdly, driving the whole mounting frame 101 to slide downwards by the first servo cylinder 114, enabling the bottom of the pressing block 105 to be in contact with the bottom of the inner wall of the processing groove 302, flattening the surface of the electronic element pins by the convex blocks 107 at the bottom of the pressing block 105, and then driving the mounting frame 101 to reset by the first servo cylinder 114 to finish flattening the electronic element pins;
fourthly, when the bottom of the pressing block 105 is contacted with the bottom of the inner wall of the processing groove 302, the second servo cylinder 209 drives the whole mounting block 201 to slide downwards, the pressing plate 204 on the right side of the cutting tool 202 limits the pins of the electronic components in the processing groove 302, then the mounting block 201 continues to move downwards, the pressing plate 204 and the pins of the electronic components keep limiting, the cutting tool 202 cuts off one end of the pins of the electronic components, the second servo cylinder 209 drives the mounting block 201 to reset, and the cutting of the pins of the electronic components is completed;
fifth, the electronic component pins in the processing tank 302 are pushed into the blanking tank 309 by the pushing plate 305, the receiving tube 50 sends the processed electronic component pins into the collecting frame 60, and then the electronic component pins are sent into the processing tank 302 by the wire barrel 20, and the electronic component pins are processed by the flattening mechanism and the cutting mechanism.
Example 2:
referring to fig. 2-4, an electronic component pin flattening device includes a frame 10, a wire guiding barrel 20 is disposed on the left side of the front of the frame 10, a workbench 30 is disposed on the right side of the wire guiding barrel 20, a flattening mechanism is disposed above the workbench 30, and a material receiving box 40 is disposed below the workbench 30;
the flattening mechanism comprises a mounting frame 101, one side of the inside of the mounting frame 101 is rotatably provided with a screw rod 102, the surface of the screw rod 102 is in threaded connection with a movable block 103, the bottom of the movable block 103 is provided with a connecting block 104, the bottom of the connecting block 104 is provided with a pressing block 105 through a bolt, the pressing block 105 with different specifications and dimensions can be conveniently replaced by the aid of the bolt, further, electronic element pins with different diameters are flattened, grooves 106 are formed in the bottom of the pressing block 105, bumps 107 are arranged in the grooves 106, the electronic element pins of the electronic element move downwards by the aid of the pressing block 105, meanwhile, the bumps 107 flatten the electronic element pins of the electronic element, arc grooves are formed in two sides of the bumps 107, movable grooves 108 matched with the movable block 103 are formed in two sides of the inside of the mounting frame 101, two sides of the movable block 103 are respectively connected with the interiors of the two movable grooves 108 in a sliding mode, one side of the inner wall of the mounting frame 101 is provided with a servo motor 109, one end of an output shaft 109 of the servo motor is fixedly connected with the screw rod 102 through the motor 103, the servo motor output shaft 103 is driven by the aid of the servo motor 102 to rotate on the left end of the screw rod 102, and the screw rod 101 is driven to rotate at the same position, and the electronic element is adjusted to be different from the right end of the screw rod 101.
Example 3:
referring to fig. 2-5, in the present invention, a movable column 110 is disposed at the top of a mounting frame 101, a limit sleeve 111 is disposed above the mounting frame 101, the surface of the movable column 110 is slidably connected with the inside of the limit sleeve 111, a first slider 112 is disposed at the back of a frame 10, one side of the first slider 112 is fixedly connected with one side of the movable column 110, a first chute 113 matched with the first slider 112 is disposed inside the frame 10, a first servo cylinder 114 is disposed below the first slider 112, one end of a driving shaft of the first servo cylinder 114 is fixedly connected with the bottom of the first slider 112, the driving shaft of the first servo cylinder 114 is utilized to drive the first slider 112 to slide up and down in the first chute 113, so as to drive the whole mounting frame 101 to slide on the front of the frame 10, and further realize continuous flattening of pins of electronic components on a workbench 30.
Example 4:
referring to fig. 2-6, a cutting mechanism is disposed on the left side of a flattening mechanism, the cutting mechanism includes a mounting block 201, a cutting tool 202 is disposed at the bottom of the mounting block 201, a fixing block 203 is disposed on the right side of the mounting block 201, a pressing plate 204 is movably disposed below the fixing block 203, movable rods 205 are disposed on two sides of the top of the pressing plate 204, the top ends of the two movable rods 205 penetrate through the inside of the fixing block 203, mounting grooves 206 are disposed on two sides of the inside of the fixing block 203, a sliding plate 207 is slidably disposed in the mounting grooves 206, the inside of the sliding plate 207 is fixedly connected with the surface of the movable rods 205, a spring 208 is sleeved on the surface of the movable rods 205, and the bottom end of the spring 208 is fixedly connected with the top of the sliding plate 207.
Example 5:
referring to fig. 2-6, in the present invention, a second servo cylinder 209 is disposed on the back of the frame 10, a second slider 210 is disposed at one end of a driving shaft of the second servo cylinder 209, one side of the second slider 210 is fixedly connected with one side of the mounting block 201, a second sliding slot 211 matched with the second slider 210 is disposed inside the frame 10, the second servo cylinder 209 drives the second slider 210 to slide up and down in the second sliding slot 211, so as to realize that the mounting block 201 slides up and down on the front of the frame 10, and further, the cutting tool 202 at the bottom of the mounting block 201 cuts off pins of electronic components of the electronic components.
Example 6:
referring to fig. 2-7, in the present invention, a guide groove 301 is formed on the left side of the top of a workbench 30, a processing groove 302 is formed on the right side of the guide groove 301, a cutting groove 303 is formed right below the cutting tool 202 between the processing groove 302 and the guide groove 301, a baffle block 304 is formed on the right side of the inside of the processing groove 302, a through groove is formed on one side of the baffle block 304, a pushing plate 305 is movably disposed on the front side of the inner wall of the processing groove 302, an electric push rod 306 is disposed on the back side of the pushing plate 305, one end of a driving shaft of the electric push rod 306 is fixedly connected with the back side of the pushing plate 305, limit rods 307 are disposed on both sides of the back side of the pushing plate 305, a limit groove 308 matched with the limit rods 307 is formed on both sides of the top of the workbench 30, a blanking groove 309 is formed on the back side of the bottom of the processing groove 302, after the electronic component pins are flattened by the pressing block 105, the electronic component pins inside the processing groove 302 are pushed into the inside of the blanking groove 309 by the pushing plate 305, and then the electronic component pins are fed into the processing groove 302 by the wire barrel 20, thus realizing continuous processing of the electronic component pins, and further processing efficiency of the electronic component pins is improved.
Example 7:
referring to fig. 2-8, in the present invention, a receiving tube 50 is disposed at the top of a receiving box 40, and the top of the receiving tube 50 is communicated with the bottom of a blanking slot 309, a collecting frame 60 is slidably disposed in the receiving box 40, and the receiving tube 50 is used to send processed pins of electronic components into the collecting frame 60, so as to implement automatic collection processing of the pins of the electronic components.
And all that is not described in detail in this specification is well known to those skilled in the art.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An electronic component pin flattening device, characterized in that: the wire guide device comprises a frame (10), wherein a wire guide tube (20) is arranged on the left side of the front face of the frame (10), a workbench (30) is arranged on the right side of the wire guide tube (20), a flattening mechanism is arranged above the workbench (30), and a material receiving box (40) is arranged below the workbench (30);
the flattening mechanism comprises a mounting frame (101), a movable column (110) is arranged at the top of the mounting frame (101), a screw (102) is rotatably arranged at one side of the inside of the mounting frame (101), a movable block (103) is connected to the surface of the screw (102) in a threaded manner, a connecting block (104) is arranged at the bottom of the movable block (103), a pressing block (105) is arranged at the bottom of the connecting block (104) through a bolt, a groove (106) is arranged at the bottom of the pressing block (105), a lug (107) is arranged in the groove (106), a guide groove (301) is arranged at the left side of the top of the workbench (30), a processing groove (302) is arranged at the right side of the guide groove (301), the bottom surface of the pressing block (105) is contacted with the processing groove (302), arc grooves are arranged at two sides of the bottom surface of the pressing block (105) and are respectively arranged at the inner sides of the groove (106), the electronic element pins are contacted with the electronic element pins (107), the electronic element pins are pressed into the inner parts of the electronic element pins (103, the two sides of the electronic element pins are respectively matched with the two sides of the movable block (103), and the two sides of the electronic element (103) are slidably arranged in the inner part (103), one side of the inner wall of the mounting frame (101) is provided with a servo motor (109), and one end of an output shaft of the servo motor (109) is fixedly connected with one end of a screw rod (102) through a coupler;
the back of the frame (10) is provided with a first sliding block (112), one side of the first sliding block (112) is fixedly connected with one side of a movable column (110), a first sliding groove (113) matched with the first sliding block (112) is formed in the frame (10), a first servo electric cylinder (114) is arranged below the first sliding block (112), one end of a driving shaft of the first servo electric cylinder (114) is fixedly connected with the bottom of the first sliding block (112), the left side of the flattening mechanism is provided with a cutting mechanism, the cutting mechanism comprises a mounting block (201), the bottom of the mounting block (201) is provided with a cutting tool (202), the right side of the mounting block (201) is provided with a fixed block (203), the lower part of the fixed block (203) is movably provided with a pressing plate (204), two sides of the top of the pressing plate (204) are respectively provided with a movable rod (205), the top ends of the two movable rods (205) respectively penetrate through the inside of the fixed block (203), the back of the frame (10) is provided with a second servo electric cylinder (209), the second servo electric cylinder (210) is arranged at the bottom of the flattening mechanism, the bottom of the mounting block (201) is provided with a cutting tool (202), one side of the second sliding block (210) is fixedly connected with the sliding block (210) and one side of the second sliding block (210), the front activity of processing groove (302) inner wall is provided with blevile of push (305), blanking groove (309) have been seted up at the rear of processing groove (302) bottom, the top of receiving box (40) is provided with receiving pipe (50), and the top of receiving pipe (50) communicates with the bottom of blanking groove (309), the inside slip of receiving box (40) is provided with collection frame (60).
2. An electronic component pin flattening apparatus according to claim 1, wherein: and a limit sleeve (111) is arranged above the mounting frame (101), and the surface of the movable column (110) is in sliding connection with the inside of the limit sleeve (111).
3. An electronic component pin flattening apparatus according to claim 1, wherein: the mounting grooves (206) are formed in two sides of the inside of the fixed block (203), the sliding plates (207) are arranged in the mounting grooves (206) in a sliding mode, the inside of the sliding plates (207) is fixedly connected with the surface of the movable rod (205), the springs (208) are sleeved on the surface of the movable rod (205), and the bottoms of the springs (208) are fixedly connected with the tops of the sliding plates (207).
4. An electronic component pin flattening apparatus according to claim 1, wherein: a cutting groove (303) is formed between the processing groove (302) and the guide groove (301) and under the cutting tool (202), a baffle block (304) is arranged on the right side inside the processing groove (302), and a through groove is formed in one side of the baffle block (304).
5. An electronic component pin flattening apparatus according to claim 1, wherein: and the back of the pushing plate (305) is provided with an electric push rod (306), and one end of a driving shaft of the electric push rod (306) is fixedly connected with the back of the pushing plate (305).
6. An electronic component pin flattening apparatus according to claim 1, wherein: limiting rods (307) are arranged on two sides of the back surface of the pushing plate (305), and limiting grooves (308) matched with the limiting rods (307) are formed on two sides of the top of the workbench (30).
7. A pin flattening process for an electronic component, which is adapted to an electronic component pin flattening apparatus according to claim 1, comprising the steps of:
firstly, straightening the coiled electronic element pins, and then feeding the straightened electronic element pins into a wire guide cylinder (20);
secondly, the pins of the electronic element pass through the wire guide cylinder (20) and are sent into a processing groove (302) in the workbench (30), the screw (102) is driven to rotate by the servo motor (109), the movable block (103) slides left and right in the mounting frame (101), and the relative positions of the pressing block (105) and the pins of the electronic element are adjusted according to the depth of the insertion of the movable block into the hole of the circuit board as required;
thirdly, driving the whole mounting frame (101) to slide downwards by the first servo electric cylinder (114), enabling the bottom of the pressing block (105) to be in contact with the bottom of the inner wall of the processing groove (302), flattening the surface of the electronic element pin by a lug (107) at the bottom of the pressing block (105), and then driving the mounting frame (101) to reset by the first servo electric cylinder (114) to finish flattening the electronic element pin;
fourthly, when the bottom of the pressing block (105) is contacted with the bottom of the inner wall of the processing groove (302), the servo electric cylinder II (209) drives the whole mounting block (201) to slide downwards, the pressing plate (204) on the right side of the cutting tool (202) limits pins of electronic elements in the processing groove (302), then the mounting block (201) continues to move downwards, the position between the pressing plate (204) and the pins of the electronic elements is kept limited, the cutting tool (202) cuts off one end of the pins of the electronic elements, and the servo electric cylinder II (209) drives the mounting block (201) to reset, so that the cutting of the pins of the electronic elements is completed;
fifth, pushing the electronic component pins in the processing groove (302) into the blanking groove (309) through the pushing plate (305), conveying the processed electronic component pins into the collecting frame (60) through the receiving pipe (50), conveying the electronic component pins into the processing groove (302) through the wire guide cylinder (20), and processing the electronic component pins through the flattening mechanism and the cutting mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111151490.1A CN113843371B (en) | 2021-09-29 | 2021-09-29 | Electronic element pin flattening process and equipment thereof |
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| Application Number | Priority Date | Filing Date | Title |
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