CN215222595U

CN215222595U - Circuit board made of copper-aluminum composite material

Info

Publication number: CN215222595U
Application number: CN202120684083.6U
Authority: CN
Inventors: 王晟齐
Original assignee: Tongling Ruichang Circuit Technology Co ltd
Current assignee: Tongling Ruichang Circuit Technology Co ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-12-17
Anticipated expiration: 2031-03-29

Abstract

The utility model relates to a circuit board with copper aluminium combined material preparation, particularly, a circuit board with copper aluminium combined material preparation, roll through rolling the rod many times and press the messenger copper and form the alloy and fuse between the aluminium interface with aluminium and copper after overlapping together, make copper layer and aluminium lamination combine together, form copper aluminium composite foil, glue on resin material after the rubber coating on the aluminium face, the metal that outwards exposes is the copper layer, according to circuit design, get rid of the metal that does not need with etching method or cross cutting method, form the circuit, make the solder mask with covering membrane or printing ink, the circuit board of a copper aluminium combined material preparation has been made.

Description

Circuit board made of copper-aluminum composite material

Technical Field

The utility model relates to a circuit board field, concretely relates to circuit board with copper aluminium combined material preparation.

Background

The circuit board of the prior art:

1. the copper foil is directly used for manufacturing the circuit, and the copper cost is high.

2. The circuit board is directly made of aluminum, although the cost is low, the poor aluminum soldering property causes the infirm soldering of elements, and the circuit board cannot be used all the time.

How to use low-cost aluminum for manufacturing the circuit of the circuit board and solve the problem of soldering tin?

The circuit board made of the copper-aluminum composite material is manufactured by the following practical novel method, the problems are solved, the defects of the prior art are overcome, and the specific method is as follows:

the method comprises the steps of overlapping aluminum and copper, rolling and pressing for multiple times through a rolling rod to form alloy fusion between the copper interface and the aluminum interface, combining a copper layer and an aluminum layer together to form a copper-aluminum composite foil, gluing the aluminum surface, then adhering the aluminum surface on a resin film, removing unnecessary metal through an etching method or a die cutting method according to circuit design to form a circuit, and manufacturing a solder mask layer through a cover film or ink to manufacture the circuit board made of the copper-aluminum composite material.

The circuit board solves the problem that the cost is high when pure copper is used for manufacturing the circuit, and also solves the problem that an aluminum welding element is not firmly welded when pure aluminum is used for manufacturing a circuit bonding pad.

SUMMERY OF THE UTILITY MODEL

According to the utility model provides a circuit board with copper aluminium combined material preparation, include: a resin film base material layer; an adhesive layer; a copper aluminum composite foil circuit layer; a surface solder mask layer; the copper-aluminum composite circuit layer is characterized in that the aluminum surface of the copper-aluminum composite circuit layer is combined with the resin film base material layer through the adhesive layer, all circuits of the copper-aluminum composite circuit layer are formed by combining copper and aluminum, the upper layer and the lower layer of the circuit are copper layers, the other layer is an aluminum layer, the thickness of the aluminum layer is larger than that of the copper layer, the surface solder mask layer covers the surface of the copper layer, the exposed pad on the surface of the circuit board is a copper pad, and the surface solder mask layer is an ink solder mask layer or a cover film solder mask layer.

According to the utility model discloses a preferred embodiment, a circuit board with copper aluminium combined material preparation, its characterized in that can flexible line's pad department is used after punching, and the hole department after punching is used for welding direct component or clearing hole welding to switch on the back and uses.

According to the utility model discloses a preferred embodiment, a circuit board with copper aluminium combined material preparation, its characterized in that, the thickness of copper be A, 2um is less than or equal to A and is less than or equal to 15 um.

According to the utility model discloses a preferred embodiment, a circuit board with copper aluminium combined material preparation, its characterized in that, the thickness of aluminium be B, 10um is less than or equal to B and is less than or equal to 400 um.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.

Drawings

The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.

Fig. 1 is a partial schematic view of a whole roll of copper aluminum composite foil.

FIG. 2 is a partial schematic view of a whole-roll single-side copper-aluminum composite substrate with copper leaking from one side.

Fig. 3 is a schematic plan view of a circuit board semi-finished product with a circuit pattern.

Fig. 4 is a schematic plan view of a semi-finished circuit board with a portion exposed with copper in the front side insulating layer.

FIG. 5 is a schematic plan view of a circuit board made of copper-aluminum composite material with pre-breaking connection points.

FIG. 6 is a schematic cross-sectional view of a circuit board made of copper-aluminum composite.

Detailed Description

The present invention will be described in detail below by taking preferred embodiments as examples.

It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.

Examples

1, preparation of copper-aluminum composite foil

The copper strip 1.1a and the aluminum strip 1.1B are overlapped together, and rolled by cold pressing for multiple times by using a roller, wherein the thickness of the copper is A, and the thickness of the aluminum is B, so that the whole roll of copper-aluminum composite foil (shown in figure 1) is manufactured.

2, substrate preparation

Coating 1.2 of the aluminum surface 1.1b of the copper-aluminum composite foil with glue by a coating machine, drying the solvent, and then adhering the solvent and the PET film 1.3 together to prepare the whole roll of single-sided copper-aluminum composite substrate with copper leaking on one side (shown in figure 2).

Description of the drawings: (PI film is also possible, but this example is described as PET film).

3, circuit fabrication

Firstly, the whole roll of single-sided copper-aluminum composite base material with copper leaking on one side is cut into single pieces, and then the unnecessary copper of the circuit is completely removed by using an etching process or a die cutting process, so as to manufacture a circuit board semi-finished product with a circuit pattern (shown in figure 3).

4, solder mask layer fabrication

Applying an insulating layer 3.1 on the circuit board semi-finished product with the circuit pattern, manufacturing a screen printing screen, printing solder resist ink on the semi-finished product of the circuit board, or punching a PET film with glue and attaching the PET film on the semi-finished product of the circuit board to manufacture the circuit board semi-finished product with the partial copper exposed in the insulating layer on the front surface (shown in figure 4).

5, OSP preparation

The semi-finished circuit board with partially exposed copper in the front insulating layer is coated with an oxidation-preventing film 4.1 (shown in fig. 5) at the position where copper is exposed by OSP.

6, forming

The circuit board with the anti-oxidation film is cut into a circuit board with pre-breaking connection points made of copper-aluminum composite materials by a cutting die (shown in figures 5 and 6).

The present invention has been described in detail with reference to the accompanying drawings, in which the present invention is illustrated in detail with reference to specific embodiments of a circuit board made of copper-aluminum composite material. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.

Claims

1. A circuit board made of copper-aluminum composite material comprises:

a resin film base material layer;

an adhesive layer;

a copper aluminum composite foil circuit layer;

a surface solder mask layer;

the copper-aluminum composite circuit layer is characterized in that the aluminum surface of the copper-aluminum composite circuit layer is combined with the resin film base material layer through the adhesive layer, all circuits of the copper-aluminum composite circuit layer are formed by combining copper and aluminum, the upper layer and the lower layer of the circuit are copper layers, the other layer is an aluminum layer, the thickness of the aluminum layer is larger than that of the copper layer, the surface solder mask layer covers the surface of the copper layer, the exposed pad on the surface of the circuit board is a copper pad, and the surface solder mask layer is an ink solder mask layer or a cover film solder mask layer.

2. The circuit board of claim 1, wherein holes are drilled in the bonding pads of the circuit board, and the holes are used for soldering direct-insertion components or soldering through the holes to the back surface.

3. The circuit board of claim 1, wherein the thickness of copper is A, 2um A15 um.

4. The circuit board made of copper-aluminum composite material according to claim 1, wherein the thickness of aluminum is B, and B is greater than or equal to 10um and less than or equal to 400 um.