CN217825478U - Circuit board and LED circuit board module - Google Patents

Abstract

The utility model provides a circuit board and LED circuit board module, include: a circuit layer; the covering film is combined on the circuit layer, a pad hole is formed in the covering film, the pad hole penetrates through the covering film, and the circuit layer at the position of the pad hole is exposed to form a pad; the circuit layer is combined on the insulating base material layer; the cover film comprises a metal decoration layer, an insulation layer arranged between the metal decoration layer and the circuit layer, and an insulation blocking layer combined on the metal decoration layer, wherein the insulation blocking layer covers the hole wall of the pad hole or the metal decoration layer at the hole wall and the hole edge. The prepared product has good aesthetic property and heat dissipation, and the metal color is not easy to fall off.

Description

Circuit board and LED circuit board module

Technical Field

The utility model relates to a circuit board field, concretely relates to circuit board and LED circuit board module.

Background

The circuit boards are classified into flexible circuit boards and rigid circuit boards, and rigid-flexible circuit boards, and with the development of technologies, circuit boards have become indispensable in industrial production. The circuit board generally includes the circuit layer and sets up the solder mask on the circuit layer, and the solder mask is used for protecting the circuit layer, avoids the circuit layer to fall grey and wets etc. the solder mask mainly used of circuit board especially flexible line way board is the film of taking the glue, for example the PET membrane of taking the glue, the PI membrane of taking the glue, the circuit board is green board or white board, aesthetic fatigue has been formed gradually in the consumer market, the product homogenization is serious, the consumer has provided higher demand to the aesthetic property of product.

The LED circuit board module is formed by welding an LED or an LED and a control element on a circuit board. For example, if the LED flexible circuit board module is directly manufactured into the lamp strip, if the LED flexible circuit board module is manufactured into the silver lamp strip, the silver lamp strip has good appearance due to the silver on the surface, and meanwhile, the silver has good light reflection rate, so that the LED flexible circuit board module is expected by the market. However, how to manufacture the silver lamp strip is a technical problem to be solved urgently in the industry. However, the silver-colored surface of the LED lamp strip manufactured by the process has poor glossiness, high roughness and poor appearance, poor light reflectivity to light rays emitted by LED lamp beads or LED chips, poor heat dissipation of the circuit board and influence on the service life of the lamp strip.

In addition, after components are welded on the circuit board, especially after LED components are welded to form an LED circuit board module, when the module is used and operated, the components, especially the LED components, can generate heat, and whether the heat dissipation is good or not can directly influence the service life of the circuit board and the LED circuit board module, and the heat dissipation problem in the prior art is not well solved.

Therefore, it is necessary to improve and optimize the structure of the existing circuit board and the like.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a circuit board and LED circuit board module, metallic luster is strong, the aesthetic property is good, the reflection of light rate is high, good heat dissipation.

An embodiment of the utility model provides a circuit board, include:

a circuit layer;

the covering film is combined on the circuit layer, a pad hole is formed in the covering film, the pad hole penetrates through the covering film, and the circuit layer at the position of the pad hole is exposed to form a pad;

the circuit layer is combined on the insulating base material layer;

the covering film comprises a metal decoration layer, an insulation layer arranged between the metal decoration layer and the circuit layer, and an insulation blocking layer combined on the metal decoration layer, wherein the insulation blocking layer covers the hole wall of the pad hole or the metal decoration layer on the hole wall and the hole edge.

According to the utility model discloses a circuit board has following beneficial effect at least: the circuit board is a circuit board with metal color, so that the traditional circuit board which is resin color and lacks metal highlight color is abandoned, the metal highlight color is fully utilized, the attractiveness of the circuit board is obviously improved, and homogenization with the existing product is avoided; meanwhile, the existence of the metal decorative layer can effectively improve the heat dissipation performance of the circuit board, reduce the working temperature of components on the circuit board and prolong the service life of the product; compared with the traditional method for coating color ink to form the decorative layer, the manufacturing process is simple, the cost is lower, and the metal decorative layer on the circuit board is not easy to fall off.

According to some embodiments of the present invention, the circuit board is a single-layer circuit board; or the circuit board is a circuit board with double-layer circuits, and the insulating substrate layer is combined with another circuit layer.

According to some embodiments of the present invention, the insulating substrate layer is provided with a via hole for making the line layer and the other line layer conduct.

According to some embodiments of the present invention, the back cover film is provided with a metal decoration layer, and the back cover film is bonded to the other circuit layer.

According to some embodiments of the present invention, the insulating substrate layer is an insulating base film, and the circuit board is a flexible circuit board; or the insulating substrate layer is an insulating substrate, and the circuit board is a rigid circuit board.

According to some embodiments of the present invention, the insulating barrier layer is disposed on the hole edge and the hole wall of the pad hole, and the metal decoration layer not covered by the insulating barrier layer is exposed outside; or the insulating barrier layer comprises light-transmitting resin for fully covering the surface of the metal decorative layer and insulating resin arranged on the hole wall of the pad hole.

According to some embodiments of the invention, the light transmissive resin is a light transmissive glue, a light transmissive ink or a light transmissive film.

According to some embodiments of the invention, the insulating barrier layer covers a hole wall portion of the pad hole; or the insulating barrier layer covers the hole wall of the pad hole completely.

According to some embodiments of the present invention, the insulating layer is a glue layer; or the insulating layer is formed by combining an insulating film with an adhesive layer; or the insulating layer consists of an insulating film, an adhesive layer and a metal coating positioned between the insulating film and the adhesive layer, and the metal coating positioned on the hole wall of the pad hole is covered by the insulating barrier layer.

According to some embodiments of the invention, the metal decoration layer is a nano metal layer, the metal thickness is 10nm-600nm; or the metal decorative layer is a metal foil layer, and the thickness of the metal is 5-100 mu m.

According to some embodiments of the invention, the metal decorative layer is aluminum, aluminum alloy, copper alloy, zinc or zinc alloy.

According to some embodiments of the invention, the metal decorative layer comprises a metal and a colored oxide film layer formed after oxidation of the metal.

The embodiment of the utility model provides a still provide a LED circuit board module, including any one of the above-mentioned embodiments the circuit board, and weld LED on the circuit board, or LED and control element, LED or LED and control element with the circuit board electricity is connected, and with the metal decorative layer is insulating.

According to the utility model discloses LED circuit board module has following beneficial effect at least: the traditional circuit board is abandoned, the resin color and luster of the traditional circuit board lack the metal highlight color and luster, the metal highlight color and luster are fully utilized, the attractiveness of the product is obviously improved, and the homogenization with the existing product is avoided; meanwhile, the existence of the metal decorative layer can effectively improve the heat dissipation performance of the circuit board, reduce the working temperature of components on the circuit board and prolong the service life of the product; compared with the traditional method for coating color ink to form the decorative layer, the manufacturing process is simple, the cost is lower, and the metal decorative layer on the circuit board is not easy to fall off.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1-1 is a schematic plan view of a cover film according to an embodiment of the present invention;

fig. 1-2 are schematic plan views of bare circuit boards with cover films attached thereon according to embodiments of the present invention;

fig. 2-1 to fig. 7-2 are schematic enlarged partial cross-sectional views of the circuit board of fig. 1-2 at the position of the pad hole, specifically:

FIG. 2-1 is a schematic structural view of an insulating barrier layer according to an embodiment of the present invention disposed on the entire surface of the metal decoration layer and the wall of the pad hole;

fig. 2-2 is a schematic structural view of the insulating barrier layer according to the embodiment of the present invention, which is only disposed on the edge of the pad hole and the hole wall;

fig. 2-3 are schematic views illustrating the structure of the insulating barrier layer according to the embodiment of the present invention when the insulating barrier layer includes a light transmissive film and is disposed on the wall of the pad hole;

fig. 3 is a schematic structural diagram illustrating the insulating adhesive layer of the embodiment of the present invention penetrating into the pad hole during the lamination process;

fig. 4-1 to 4-3 are schematic structural diagrams obtained by first pressing and bonding and then printing an insulating material, specifically:

fig. 4-1 is a schematic structural view illustrating the metal decoration layer of the embodiment of the present invention disposed on the upper surface of the insulating film, and the insulating barrier layer disposed on the entire surface of the metal decoration layer and the wall of the pad hole;

fig. 4-2 is a schematic structural view illustrating the metal decoration layer of the embodiment of the present invention is located on the upper surface of the insulating film, and the insulating barrier layer is disposed on the hole edge and the hole wall of the pad;

fig. 4-3 are schematic structural diagrams illustrating the metal decorative layer sandwiched between the insulating film and the insulating adhesive layer, wherein the insulating barrier layer includes a transparent film and insulating ink on the hole edge and the hole wall of the pad;

fig. 5-1 to 5-3 are schematic structural diagrams when the metal foil is used to form the metal decoration layer according to the embodiment of the present invention, specifically:

FIG. 5-1 is a schematic view of the insulating barrier layer according to the embodiment of the present invention disposed on the entire surface of the metal decoration layer and the wall of the pad hole;

fig. 5-2 is a schematic structural view of an insulating barrier layer according to an embodiment of the present invention disposed on the edge of a pad hole and the hole wall;

fig. 5-3 are schematic structural views illustrating the insulating barrier layer according to the embodiment of the present invention disposed on the edge of the pad hole, the hole wall, and both sides of the pad hole;

fig. 6-1 to fig. 6-4 are schematic structural diagrams obtained by simultaneously evaporating metal on two sides of the insulating film according to the embodiment of the present invention, specifically:

FIG. 6-1 is a schematic view of the insulating barrier layer according to the embodiment of the present invention disposed on the entire surface of the metal decoration layer and the wall of the pad hole;

fig. 6-2 is a schematic structural view of an insulating barrier layer according to an embodiment of the present invention disposed on the wall and the edge of a hole of a pad hole;

fig. 6-3 are schematic structural diagrams obtained by bonding by pressing and then printing the insulating material according to the embodiment of the present invention, wherein the insulating barrier layer is disposed on the entire surface of the metal decoration layer and the wall of the pad hole;

fig. 6-4 are schematic structural diagrams obtained by bonding by pressing and then printing the insulating material according to the embodiment of the present invention, wherein the insulating barrier layer is disposed on the wall and the edge of the pad hole;

fig. 7-1 is a schematic structural view of a circuit board with a double-layer circuit according to an embodiment of the present invention, wherein an insulating barrier layer is disposed on the entire surface of the metal decoration layer and the wall of the pad hole;

fig. 7-2 is a schematic structural diagram of a circuit board with a double-layer circuit according to an embodiment of the present invention, in which an insulating barrier layer is disposed on the wall and the edge of a pad hole;

fig. 8-1 is a schematic plane structure diagram after the LED is attached to the circuit board according to the embodiment of the present invention;

fig. 8-2 is a schematic plan view of the cut LED strip of fig. 8-1;

fig. 8-3 is an enlarged schematic view of the cross-sectional structure at the LED position in fig. 8-1 (circuit board of single-layer circuit in which the insulating barrier layer is disposed on the entire surface of the metal decoration layer and the pad via wall);

fig. 8-4 is an enlarged schematic view of another cross-sectional structure at the LED site in fig. 8-1 (wiring board with double-layer wiring in which an insulating barrier layer is provided on the pad via wall and the via edge).

Reference numerals are as follows:

a cover film 100, an insulating film 101, a metal decoration layer 102, an insulating adhesive layer 103, a pad hole 104, and an insulating barrier layer 105;

a wiring layer 200; a first circuit layer 201, a second circuit layer 202 and a solder mask layer 203;

an insulating base material layer 300, via holes 301;

a back cover film 400;

an insulating layer 500, a metal plating layer 501;

LED600, tin 601;

in the drawing, "(105)" indicates that the site belongs to a part of the insulating barrier layer 105.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship referred to the orientation description, such as the upper, lower, front, rear, left, right, inner, outer, etc., is the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of meanings are one or more, a plurality of meanings are two or more, and the terms greater than, smaller than, exceeding, etc. are understood as excluding the number, and the terms greater than, lower than, within, etc. are understood as including the number. If there is a description of first and second for the purpose of distinguishing technical features only, this is not to be understood as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of technical features indicated.

In the description of the present invention, unless otherwise explicitly defined, words such as setting, installation, connection, assembly, and coordination should be understood in a broad sense, and those skilled in the art can reasonably determine the meaning of the above words in the present invention by combining the specific contents of the technical solution.

The following provides many different embodiments or examples for implementing different features of the invention.

An embodiment of the first aspect of the present invention provides a method for manufacturing a circuit board, including:

preparing an adhesive film with metal color: preparing an insulating film 101, forming a metal decorative layer 102 on at least one surface of the insulating film 101 by a vapor deposition method, and forming an insulating adhesive layer 103 on the other surface of the insulating film 101 or on the metal decorative layer 102; or preparing metal foil, forming metal decoration layer 102 on the metal foil, and preparing insulating adhesive layer 103 on one side of the metal foil;

manufacturing a pad hole 104: the pad hole 104 penetrates through the adhesive film to reserve a position for subsequent element welding;

spraying or printing an insulating material: spraying or printing an insulating material on the adhesive film, and covering the wall of the pad hole 104 or the wall and the edge of the pad hole 104 with metal;

pressing and bonding: and pressing by using a pressing machine, wherein the adhesive film is bonded on the bare circuit board through the insulating adhesive layer 103.

It should be understood that the above manufacturing method is only used to indicate the processes or steps required in the process of manufacturing the circuit board, and the sequence relationship between the processes or steps is not limited, for example, after the insulating material is sprayed or printed, the adhesive film may be bonded on the bare circuit board by pressing; or the adhesive film is pressed and bonded on the bare circuit board, and then the insulating material is sprayed or printed. This will become apparent in the examples below.

It is understood that a bare circuit board refers to a circuit board that has not yet been bonded with a solder resist layer, i.e., the circuit layer is bare; when the laminating machine is used for laminating, the circuit layer of the bare circuit board is etched, or the circuit layer is manufactured by a die cutting method, or the circuit layer is manufactured by other methods which are not mentioned herein; the bare circuit board may be a single-layer circuit board or a double-layer circuit board.

In the following embodiments, "S" is an abbreviation for "STEP," S1 "denotes STEP 1," S2 "denotes STEP 2, and so on; shenli company refers to Shenli group, shenli company refers to Shenzhen Weili automated equipment, inc., shenzhen Huada Xin science and technology, inc., and Biang company refers to Shenzhen Biang electronic equipment, inc.

Example 1-1: see fig. 2-2.

S1: plating aluminum on one surface of a PET film with the width of 520mm and the thickness of 50um on a roll-to-roll evaporation plating machine, wherein the plated aluminum layer forms a metal decoration layer 102, and the thickness of the aluminum layer is controlled to be 50 +/-5 nm;

s2: coating the other side of the PET film with glue on a roll-to-roll coater of Shenli corporation to form an insulating adhesive layer 103, and obtaining a glue film with metal color after coating the glue, wherein the material of the glue is well known to those skilled in the art, for example, the glue can be acrylic glue, and the details are not repeated herein;

s3: placing the prepared adhesive film on a roll-to-roll automatic punching machine, punching a plurality of pad holes 104 by using a die roll-to-roll, wherein the pad holes 104 penetrate through the PET film, the metal decoration layer 102 and the insulating adhesive layer 103;

s4: manufacturing a screen printing plate into a screen printing plate for local printing, installing the screen printing plate on a roll-to-roll automatic screen printing machine of Welt corporation, using a CCD (charge coupled device) to carry out counterpoint printing, printing transparent insulating ink of the Huadaxin corporation, printing the transparent insulating ink on the hole wall and the hole edge of the pad hole 104 to form an insulating barrier layer 105, and drying the aluminum surface at the position other than the hole edge to remove a solvent on a roll-to-roll drying machine, solidifying the ink, wherein the drying and solidifying temperature is 100 ℃, and baking for 60 minutes. The hole edge refers to an edge of the pad hole 104 extending in the transverse direction, and the region a shown in fig. 2-3 is the hole edge, and the width of the hole edge is not particularly limited, and the width of the hole edge only needs to be sufficient for the insulating barrier layer 105 to insulate and separate tin from the metal decoration layer 102 when soldering components.

S5: the adhesive film is pressed and bonded on the single-layer bare circuit board by a roll-to-roll pressing machine of Bion company, and the operating conditions are as follows: pressing at 130 ℃ and 120 kg for 2 minutes. After being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s6: and (3) processing on an Organic Solderability Preservative (OSP) line, forming an OSP soldering-assistant antioxidant film on the bonding pad, and finishing the manufacture of a single-layer circuit board to obtain a silver circuit board, wherein the OSP process is the conventional process and is not repeated here.

Examples 1 to 2: as shown in fig. 2-1.

This embodiment differs from embodiment 1-1 in step S4, which is: the screen printing plate is arranged on a Wilford roll-to-roll automatic screen printing machine, transparent insulating ink of the company Huadaxin is printed by using CCD (charge coupled device) counterpoint printing, the transparent insulating ink is printed on the surface of the whole metal decoration layer 102 and the hole walls of the pad holes 104 to form an insulating barrier layer 105, then a roll-to-roll dryer is used for drying to remove a solvent, the ink is solidified, the drying solidification temperature is 100 ℃, and the drying is carried out for 60 minutes.

Examples 1 to 3: see fig. 2-1.

This embodiment differs from embodiment 1-1 in step S4, which is that step S4 of this embodiment is: on the roll-to-roll automatic flowing water glue spraying line, the surface of the metal decoration layer 102 is automatically sprayed with silica gel, the whole surface of the metal decoration layer 102 and the hole wall of the pad hole 104 are covered with a layer of silica gel to form an insulating barrier layer 105, the drying temperature is 60 ℃, and the metal decoration layer is wound after being dried.

For embodiments 1-1 to 1-2, steps S4 and S5 in each embodiment can be interchanged to realize that the adhesive film is bonded on the bare circuit board by pressing and then the insulating material is printed, so as to obtain embodiments 1-4 to 1-5, when the adhesive film is bonded by pressing and then the insulating material is printed, since the bottom of the pad hole is a certain distance from the mesh, the ink or glue will diffuse during printing, and the insulating material may appropriately accumulate or extend on the circuit layer at the bottom of the pad hole 104, as shown in fig. 4-1 and 4-2, taking embodiments 1-4 as examples, as follows:

examples 1 to 4: see fig. 4-2.

S1: using a 520mm wide and 50um thick PET film to perform single-side aluminum plating on a roll-to-roll evaporation plating machine, forming a metal decoration layer 102 by the plated aluminum layer, and controlling the thickness of the aluminum layer to be 50 +/-5 nm;

s2: coating the non-aluminum surface of the PET film on a roll-to-roll coating machine of Shenli company to form an insulating adhesive layer 103 to obtain a film with metal color;

s3: the prepared adhesive film is placed on a roll-to-roll automatic punching machine, a plurality of pad holes 104 are punched in a roll-to-roll mode through a die, and the pad holes 104 penetrate through the PET film, the metal decoration layer 102 and the insulating adhesive layer 103;

s4: the adhesive film is pressed and bonded on the single-layer bare circuit board by a roll-to-roll pressing machine of Biang company, and the operating conditions are as follows: pressing at 130 ℃ and 120 kg for 2 minutes. After being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s5: manufacturing a screen printing plate into a screen printing plate for local printing, installing the screen printing plate on a roll-to-roll automatic screen printing machine of Welt corporation, using a CCD (charge coupled device) to carry out counterpoint printing, printing insulating ink of the Huadaxin corporation, printing transparent insulating ink on the hole wall and the hole edge of a pad hole 104 to form an insulating barrier layer 105, and drying the aluminum surface at the position other than the hole edge to remove a solvent and solidify the ink, wherein the drying and solidifying temperature is 100 ℃, and baking is carried out for 60 minutes;

s6: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assistant antioxidant film on the bonding pad, thereby completing the manufacture of the single-layer circuit board.

Example 2-1: see fig. 6-2.

This example differs from example 1-1 in that: s1: plating aluminum on both surfaces of a PET film with the width of 520mm and the thickness of 50um on a roll-to-roll evaporator, wherein a metal decorative layer 102 is formed on one surface of the plated aluminum layer, and the thickness of the aluminum layer is controlled to be 15 +/-5 nm;

s2: one of the aluminum layers was coated with glue on a roll-to-roll coater from shenli corporation to form an insulating adhesive layer 103, and the coated glue was then applied to obtain a glue film with metallic color.

Example 2-1 the other steps are the same as steps S3-S6 of example 1-1, and the steps of example 2-1 are as follows:

s1: plating aluminum on both surfaces of a PET film with the width of 520mm and the thickness of 50um on a roll-to-roll evaporator, wherein the thickness of the aluminum layer is controlled to be 15 +/-5 nm;

s2: coating glue on one of the aluminum surfaces on a roll-to-roll coater of Shenli company to form an insulating adhesive layer 103, and obtaining a glue film with metal color after coating the glue;

s3: the prepared adhesive film is placed on a roll-to-roll automatic punching machine, a plurality of pad holes 104 are punched in a roll-to-roll mode through a die, and the pad holes 104 penetrate through the PET film, the metal decoration layer 102 and the insulating adhesive layer 103;

s4: manufacturing a screen printing plate into a partially printed screen printing plate, installing the screen printing plate on a roll-to-roll automatic screen printing machine of Welt corporation, using a CCD (charge coupled device) to carry out counterpoint printing, printing transparent insulating ink of the Huadaxin corporation on an aluminum surface, printing the transparent insulating ink on the hole wall and the hole edge of a pad hole 104 to form an insulating barrier layer 105, not printing the transparent insulating ink on the aluminum surface of the hole edge part, drying the transparent insulating ink on a roll-to-roll drying machine to remove a solvent, solidifying the ink, and baking for 60 minutes at the drying and solidifying temperature of 100 ℃;

s5: the adhesive film is pressed and bonded on the single-layer bare circuit board by a roll-to-roll pressing machine of Biang company, and the operating conditions are as follows: pressing at 130 ℃ and 120 kg for 2 minutes. After being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s6: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assisting antioxidant film on the bonding pad, thereby completing the manufacture of the single-layer circuit board.

Example 2-2: as shown in fig. 6-1.

This example differs from examples 1-2 in that: s1: plating aluminum on both surfaces of a PET film with the width of 520mm and the thickness of 50um on a roll-to-roll evaporator, wherein a metal decorative layer 102 is formed on one surface of the plated aluminum layer, and the thickness of the aluminum layer is controlled to be 50 +/-5 nm;

s2: one of the aluminum layers was coated with glue on a roll-to-roll coater from shenli corporation to form an insulating adhesive layer 103, and the coated film was obtained with a metallic color.

The other steps of example 2-2 are the same as steps S3-S6 of example 1-2.

Examples 2 to 3: as shown in fig. 6-1.

This example differs from examples 1-3 in that: s1: plating aluminum on both surfaces of a PET film with the width of 520mm and the thickness of 50um on a roll-to-roll evaporator, wherein a metal decorative layer 102 is formed on one surface of the plated aluminum layer, and the thickness of the aluminum layer is controlled to be 50 +/-5 nm;

s2: one of the aluminum layers was coated with glue on a roll-to-roll coater from shenli corporation to form an insulating adhesive layer 103, and the coated film was obtained with a metallic color.

Examples 2-3 the other steps are the same as steps S3-S6 of examples 1-3.

For embodiments 2-1 to 2-2, steps S4 and S5 in each embodiment may be interchanged to realize pressing the adhesive film to bond on the bare circuit board, and then printing the insulating material, so as to obtain embodiments 2-4 to 2-5, as shown in fig. 6-3 to 6-4, since the bottom of the pad hole is a certain distance from the mesh, the ink or adhesive may diffuse during printing, and the insulating material may be properly stacked or extended on the circuit layer at the bottom of the pad hole 104.

Example 3-1: as shown in fig. 2-3.

S1: using a light-transmitting PET film with the width of 520mm and the thickness of 25um to perform single-side aluminum evaporation on a roll-to-roll evaporator to form the metal decorative layer 102, wherein the thickness of the aluminum layer is controlled to be 595 nm and 5nm;

s2: coating the aluminum layer on a magic reel-to-reel coater to form an insulating adhesive layer 103, controlling the drying temperature to be 150 ℃, and quickly drying to remove the solvent, wherein the adhesive layer is in a semi-cured state; sticking release paper on the insulating adhesive layer 103, and rolling for later use;

s3: punching a plurality of pad holes 104 on a roll-to-roll automatic punching machine by using a die, wherein the pad holes 104 penetrate through a PET (polyethylene terephthalate) film, an insulating adhesive layer 103, a metal decoration layer 102 and release paper;

s4: on the roll-to-roll automatic flow-line glue spraying line, automatically spraying silica gel on a release paper surface, covering a layer of silica gel on the whole release paper surface and the wall of the pad hole 104, drying at 60 ℃, then rolling, and forming an insulating barrier layer 105 by the light-transmitting PET film and the silica gel on the wall of the pad hole 104;

s5: tear and leave type paper, paste to the copper circuit layer of the naked circuit board of the individual layer of having made in advance and accomplish to the counterpoint, with than the volume to the volume pressfitting machine compaction of high, operating condition is: pressing at 130 deg.C under 120 kg for 2 min; after being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s6: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assisting antioxidant film on the bonding pad, thereby completing the manufacture of the single-layer circuit board.

Example 3-2: see fig. 4-3.

S1: using a light-transmitting PET film with the width of 520mm and the thickness of 25um to perform single-side aluminum evaporation on a roll-to-roll evaporation machine to form a metal decoration layer 102, wherein the thickness of the aluminum layer is controlled to be 100 cm and 5nm;

s2: coating the aluminum layer on a magic roll-to-roll coater to form an insulating adhesive layer 103, controlling the drying temperature to be 150 ℃, quickly drying to remove the solvent, wherein the adhesive layer is in a semi-cured state, and bonding release paper on the insulating adhesive layer 103;

s3: punching a plurality of pad holes 104 in a roll-to-roll manner by using a die on a roll-to-roll automatic punching machine, wherein the pad holes 104 penetrate through the PET film, the insulating adhesive layer 103, the metal decoration layer 102 and release paper;

s4: tear and leave type paper, paste in advance to the copper circuit layer of the naked circuit board of individual layer of completion of preparation on, roll to roll pressfitting machine compaction with than a, operating condition is: pressing for 2 minutes at 130 ℃ and under the pressure of 120 kg; after being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s5: manufacturing a screen printing plate into a partially printed screen printing plate, installing the screen printing plate on a roll-to-roll automatic screen printing machine of Welt corporation, performing counterpoint printing by using a CCD (charge coupled device), printing insulating ink of the Huadaxin corporation, printing the insulating ink on the hole wall and the hole edge of a pad hole 104, but not printing the insulating ink on the aluminum surface of the hole edge part, drying the insulating ink on a roll-to-roll drying machine to remove a solvent, curing the ink, and baking for 60 minutes at the drying and curing temperature of 100 ℃; the transparent PET film and the insulating ink on the wall and the edge of the pad hole 104 form an insulating barrier layer 105;

s6: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assisting antioxidant film on the bonding pad, thereby completing the manufacture of the single-layer circuit board.

Example 4: see fig. 2-1, fig. 7-1.

S1: plating aluminum on one surface of a PET film with the width of 520mm and the thickness of 50um on a roll-to-roll evaporation plating machine, forming a metal decorative layer 102 by the plated aluminum layer, and controlling the thickness of the aluminum layer to be 50 +/-5 nm to obtain the PET film with the metal decorative layer 102 on one surface;

s2: coating glue on the PET surface of the PET film on a roll-to-roll coating machine of Shenli company to form an insulating adhesive layer 103, and preparing a glue film;

s3: placing the glue film on a roll-to-roll automatic punching machine, punching a plurality of pad holes 104 by using a mould roll-to-roll, wherein the pad holes 104 penetrate through the metal decoration layer 102, the PET film and the insulating adhesive layer 103;

s4: installing a screen printing plate on a William roll-to-roll automatic screen printing machine, performing counterpoint printing by using a CCD (charge coupled device), printing transparent insulating ink of the Huadaxin company, printing the transparent insulating ink on the whole aluminum surface and the hole wall of the pad hole 104 to form an insulating barrier layer 105, drying on a roll-to-roll dryer to remove a solvent, and curing the ink at the drying curing temperature of 100 ℃ for 60 minutes;

s5: the adhesive film with the insulating barrier layer 105 is divided into two parts, one part is used for manufacturing a circuit board of a single-layer circuit, and the other part is used for manufacturing a circuit board of a double-layer circuit. The single-layer circuit board and the double-layer circuit board are respectively attached to a single-layer bare circuit board and a double-layer bare circuit board which are manufactured in advance, and the specific method is as follows: the two adhesive films are respectively pasted on a single-layer bare circuit board and a double-layer bare circuit board (a copper circuit layer on the front component surface), then a commercially available common PET film is pasted on the back circuit layer of the double-layer bare circuit board, the adhesive films are bonded on the single-layer bare circuit board in a laminating way by a roll-to-roll laminating machine of Biang company, the adhesive films and the common PET film are laminated on the double-layer bare circuit board, and the operation conditions are as follows: pressing at 130 ℃ and 120 kg for 2 minutes. After being wound, the obtained product enters an oven to be heated to completely cure the insulating adhesive layer 103, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s6: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assisting antioxidant film on the bonding pad, so as to finish the manufacture of single-layer and double-layer circuit boards and obtain two types of silver circuit boards.

Example 5: as shown in fig. 3.

S1: using a transparent PET film with the width of 520mm and the thickness of 50um, and performing single-side aluminum evaporation on a roll-to-roll evaporator to form a metal decoration layer 102, wherein the thickness of the aluminum layer is controlled to be 50nm and 5nm;

s2: coating glue on a magic roll-to-roll coater, only coating an aluminum surface to form an insulating adhesive layer 103, drying at 150 ℃, quickly drying to remove a solvent, wherein the adhesive layer is in a semi-cured state, the aluminum layer is clamped between the adhesive layer and a PET (polyethylene terephthalate) film, and winding for later use after coating release paper;

s3: punching a plurality of pad holes 104 in a roll-to-roll manner by using a die on a roll-to-roll automatic punching machine, wherein the pad holes 104 penetrate through the transparent PET film, the metal decoration layer 102, the insulating adhesive layer 103 and the release paper;

s4: and tearing off and removing the release paper, aligning and attaching the release paper to a copper circuit layer of a prefabricated single-layer bare circuit board, and exposing the metal copper bonding pad at the bonding pad hole.

S5: compacting with a Bion roll press, operating conditions were: pressing at 130 ℃ and 150 kg for 3 minutes; after the plate is pressed, glue overflows 0.1-0.2 mm from the edge of the pad hole 104, and covers aluminum exposed from the wall of the pad hole with the thickness of only 50nm, so that the aluminum on the wall of the pad hole is insulated and covered, and the transparent PET film and the glue on the wall of the pad hole form an insulating barrier layer 105; after being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s6: and processing on the OSP line to form an OSP soldering-assisting oxidation-resistant film on the bonding pad, thereby finishing the manufacture of the single-layer circuit board.

Example 6-1: see fig. 5-2.

S1: coating glue on an aluminum foil with the width of 520mm and the thickness of 50um on a magic reel-to-reel coater, forming an insulating adhesive layer 103 on one surface only, drying at the temperature of 150 ℃, and drying to remove a solvent, wherein the glue layer is in a semi-cured state to obtain a glue film;

s2: placing the prepared adhesive film on a roll-to-roll automatic punching machine, and punching a plurality of pad holes 104 roll-to-roll by using a die, wherein the pad holes 104 penetrate through an aluminum foil and an insulating adhesive layer 103;

s3: manufacturing a screen printing plate into a screen printing plate for local printing, installing the screen printing plate on a roll-to-roll automatic screen printing machine of Welt corporation, using a CCD (charge coupled device) to carry out counterpoint printing, printing insulating ink of the Huadaxin corporation, printing insulating ink on the hole wall and the hole edge of a pad hole 104 to form an insulating barrier layer 105, and drying the aluminum surface of the non-hole edge part without printing transparent insulating ink on a roll-to-roll dryer to remove a solvent and solidify the ink, wherein the drying and solidifying temperature is 100 ℃, and baking for 60 minutes;

s4: the adhesive film is pressed and bonded on the single-layer bare circuit board by a roll-to-roll pressing machine of Biang company, and the operating conditions are as follows: pressing at 130 ℃ and 120 kg for 2 minutes. After being rolled, the insulating adhesive layer 103 is heated in an oven to be completely cured, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s5: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assisting antioxidant film on the bonding pad, thereby completing the manufacture of the single-layer circuit board.

Example 6-2: see fig. 5-1.

This embodiment differs from embodiment 6-1 in step S3, which is: the screen printing plate is arranged on a Wilford roll-to-roll automatic screen printing machine, transparent insulating ink of the company Huadaxin is printed by using CCD (charge coupled device) contraposition printing, the transparent insulating ink is printed on the whole aluminum surface (the metal decoration layer 102) and the hole walls of the pad holes 104 to form an insulating barrier layer 105, then the insulating barrier layer is dried on a roll-to-roll drying machine to remove a solvent, the ink is solidified, the drying solidification temperature is 100 ℃, and the drying is carried out for 60 minutes.

Examples 6 to 3: see fig. 5-1.

This embodiment differs from embodiment 6-1 in step S3, which is: and (3) automatically spraying silica gel on the aluminum surface (the surface of the metal decoration layer 102) in a roll-to-roll automatic assembly line glue spraying manner, covering a layer of silica gel on the whole aluminum surface and the hole wall of the pad hole 104 to form an insulating barrier layer 105, drying at the temperature of 60 ℃, and rolling after drying.

Examples 6 to 4: see fig. 5-3.

S1: coating glue on an aluminum foil with the width of 520mm and the thickness of 50um on a magic roll-to-roll coater, coating one surface of the aluminum foil to form an insulating adhesive layer 103, drying at 150 ℃, and drying to remove a solvent, wherein the adhesive layer is in a semi-cured state to obtain an adhesive film;

s2: placing the prepared adhesive film on a roll-to-roll automatic punching machine, punching a plurality of pad holes 104 by using a die roll-to-roll, wherein the pad holes 104 penetrate through the aluminum foil and the insulating adhesive layer 103;

s3: manufacturing a screen printing plate into a screen printing plate for local printing, installing the screen printing plate on a roll-to-roll automatic screen printing machine of Welt corporation, using a CCD (charge coupled device) to carry out counterpoint printing, printing transparent insulating ink of the Huadaxin corporation, printing the transparent insulating ink on the hole wall and the hole edge of a pad hole 104 to form an insulating barrier layer 105, and drying the aluminum surface of the non-hole edge part without printing the transparent insulating ink on a roll-to-roll drying machine to remove a solvent, and solidifying the ink, wherein the drying and solidifying temperature is 100 ℃, and baking for 60 minutes;

s4: the adhesive film with the pad holes obtained in the step S2 is attached to the copper circuit layer on the front surface (element surface) of the double-layer bare circuit board, and the adhesive film without the pad holes obtained in the step S1 is attached to the back surface circuit layer of the double-layer bare circuit board, and the adhesive is bonded to the double-layer bare circuit board by a roll-to-roll bonding machine of yoon corporation, wherein the operation conditions are as follows: pressing at 130 deg.C and 120 kg for 2 min. After being wound, the obtained product enters an oven to be heated to completely cure the insulating adhesive layer 103, wherein the curing temperature is 150 ℃, and the curing time is 120 minutes;

s5: and (3) processing on an Organic Solderability Preservative (OSP) wire to form an OSP soldering-assistant antioxidant film on the bonding pad, thereby completing the manufacture of the circuit board with double-layer circuits and obtaining the double-sided silver circuit board.

For example 6-1, example 6-2, and example 6-4, steps S3 and S4 in each example can be interchanged, so that the adhesive film is bonded to the bare circuit board by pressing, and then the insulating material is printed, thereby obtaining examples 6-5 to 6-7 (not shown in the drawings); when the aluminum foil is selected, the aluminum foil with different thicknesses can be selected according to the requirements of the use environment, for example, the selected aluminum foil has the thickness of 5 micrometers in order to reduce the cost as much as possible; for example, in order to improve the overall strength of the circuit board, an aluminum foil with a thickness of 100 micrometers may be selected, and when the circuit board is manufactured with different aluminum foil thicknesses, the steps, devices, and parameter requirements shown in any one of the above embodiments 6-1 to 6-7 may be adopted, which will not be further described herein.

An embodiment of the second aspect of the present invention provides a method for manufacturing an LED circuit board module, including manufacturing a circuit board through any one of the embodiments of the first aspect, and then soldering LED lamp beads on the circuit board through reflow soldering on an SMT chip mounter, where the soldered components may further include control components as needed, and the LED lamp beads and the control components are insulated from the metal decoration layer 102, as shown in fig. 8-1 to 8-4.

An embodiment of the third aspect of the present invention provides a circuit board, including a circuit layer 200; the cover film 100 is combined on the circuit layer 200, the cover film 100 is provided with a pad hole 104, the pad hole 104 penetrates through the cover film 100, the circuit layer at the position of the pad hole 104 is exposed to form a pad, and the pad is used for welding an LED or the LED and a control element; the circuit layer 200 is combined on the insulating base material layer 300 in the prior art, and the combination mode is generally adhesive bonding; cover film 100 includes metal decorative layer 102, set up insulating layer 500 between metal decorative layer 102 and the circuit layer, and combine insulating barrier layer 105 on metal decorative layer 102, insulating barrier layer 105 covers the pore wall of pad hole 104, or the metal decorative layer 102 at pore wall and pore edge, insulating barrier layer 105's existence, make when soldering tin, tin can not direct contact to metal decorative layer 102, thereby make insulating between component leg and the metal decorative layer 102, avoid the existence of metal decorative layer 102 to lead to the circuit short circuit.

In some embodiments of the present invention, another circuit layer is bonded on the insulating substrate layer 300, in this case, the circuit layer bonded with the cover film 100 is the first circuit layer 201, the another circuit layer is the second circuit layer 202, and the solder mask layer 203 is bonded on the second circuit layer 202, so as to form a circuit board with a double-layer circuit; in other embodiments, the circuit board has a circuit layer on only one side, forming a single layer circuit board.

In some embodiments of the present invention, the insulating substrate layer 300 is provided with a via hole 301 for making the first circuit layer 201 and the second circuit layer 202 conduct, and the via hole 301 can be plated with copper to achieve conduction, or the first circuit layer 201 and the second circuit layer 202 can also be conducted through direct contact in the via hole 301 through the ultrasonic welding process. It is understood that the conduction between the first circuit layer 201 and the second circuit layer 202 may also be other prior arts not mentioned herein, and is not described herein again.

According to some embodiments of the present invention, the back cover film 400 is further included, the back cover film 400 also has a metal decoration layer (as shown in fig. 5-3, a metal foil), and the back cover film 400 is combined on the second circuit layer 202 to replace the common solder mask 203, so that a circuit board with metal color on both sides can be obtained, and the appearance of the circuit board is better.

In some embodiments of the present invention, the insulating base material layer 300 is an insulating base film, and the circuit board is a flexible circuit board, which is widely used in the LED strip; in other embodiments, the insulating substrate layer 300 is an insulating substrate, and the circuit board is a rigid circuit board, which is widely used in LED lighting products.

The insulating barrier layer 105 has different configurations according to the manufacturing method of the wiring board. In some embodiments of the present invention, the insulating barrier layer 105 is disposed on the hole edge and the hole wall of the pad hole 104, and the metal decoration layer 102 not covered by the insulating barrier layer 105 is exposed, as shown in fig. 2-2, fig. 4-2, fig. 5-3, fig. 6-2, fig. 6-4, and fig. 7-2, the insulating barrier layer 105 can be obtained by a local printing technique; in other embodiments of the present invention, the insulating barrier layer 105 is a transparent resin and an insulating resin disposed on the hole wall of the pad hole 104, the transparent resin may be a transparent ink or a transparent glue, the insulating barrier layer 105 covers the surface of the metal decoration layer 102, as shown in fig. 2-1, fig. 4-1, fig. 5-1, fig. 6-3, and fig. 7-1, the insulating barrier layer 105 may be obtained by a full-surface printing technique, or may be obtained by a spraying technique; in other embodiments of the present invention, the insulating barrier layer 105 includes a light-transmitting film that fully covers the surface of the metal decoration layer 102, and an insulating resin disposed in the pad holes 104, as shown in fig. 2-3, and 4-3, the light-transmitting film is located on the upper surface of the metal decoration layer 102, and the light-transmitting film is light-transmitting, so that the decoration effect of the metal color is not affected; the utility model discloses an in other embodiments, insulating barrier layer 105 can only be with the metal covering of the metal decorative layer 102 of pad hole 104 pore wall, can make the grow with pad hole size this moment, tin and the metal decorative layer contact at pad hole edge when avoiding welding the component, insulating barrier layer 105 accessible local printing technique or the accurate preparation of other prior art are at the pore wall in pad hole.

In some embodiments of the present invention, the insulating barrier layer 105 partially covers the hole wall of the pad hole 104, for example, when printing ink, the ink permeates into the pad hole 104, and when the pad hole 104 is deep, the ink does not permeate into the bottom of the pad hole and completely covers the entire hole wall of the pad hole 104; or as shown in fig. 3, the insulating adhesive penetrates into the pad hole 104 during pressing, and partially covers the hole wall of the pad hole 104; in other embodiments of the invention the insulating-barrier layer 105 covers the entire wall of the pad hole 104, e.g. by spraying ink, the ink particles are sprayed into the pad hole 104 at a relatively high speed and the entire wall of the pad hole 104 is sprayed with ink. It is understood that the metal of the metal decoration layer 102 has been exposed to the wall of the pad hole 104 in full coverage, regardless of whether the insulating barrier layer 105 partially or fully covers the wall of the pad hole 104.

The insulating layer 500 has a different configuration according to a manufacturing method. In some embodiments of the present invention, the insulating layer 500 is a glue layer, as shown in fig. 2-3, fig. 4-3, fig. 5-1, fig. 5-2, fig. 5-3, fig. 7-1, and fig. 7-2; in other embodiments of the present invention, the insulating layer 500 is formed by the insulating film 101 combined with a glue layer, as shown in fig. 2-1, 2-2, 4-1, and 4-2; in other embodiments of the present invention, the insulating layer 500 is composed of the insulating film 101, the glue layer, and the metal plating layer 501 between the insulating film and the glue layer, and the metal plating layer 501 on the wall of the pad hole is covered by the insulating barrier layer 105, although the insulating layer 500 has the metal plating layer 501 therein, since the metal plating layer is sandwiched and insulated by the insulating film 101 and the glue layer, it does not perform a conductive function, as shown in fig. 6-1 to 6-4.

In some embodiments of the present invention, metal decorative layer 102 is a nano metal layer, and it is understood that, by nano metal layer, it means that the metal thickness is in nano level, the thickness is extremely thin, the required metal material is very little, and the material and cost are reduced, for example, the thickness of the metal plating layer obtained by evaporation is in nano level, the metal thickness is 10nm-600nm, in specific embodiments, the thickness of metal decorative layer 102 is 50nm; in other embodiments of the present invention, the metal decorative layer is a metal foil layer having a thickness of 5-100 μm, and in particular embodiments, 50 μm.

According to different metal colors required by design, the metal decorative layer 102 can be aluminum or aluminum alloy to obtain a circuit board with silver luster; it is understood that the metal decorative layer can be selected from copper, copper alloy, zinc or zinc alloy, and other metals or metal alloys not mentioned herein, so as to obtain a circuit board with gold color or other metal colors, which has no technical obstacle in the realization of the manufacturing process. Because passive oxidation of metal exposed to air inevitably occurs, for this reason, metal decorative layer 102 also includes a colored oxide film layer formed by oxidation of metal.

An embodiment of the fourth aspect of the present invention provides an LED circuit board module, including the circuit board described in any of the above third aspect embodiments, and LED600, or LED and control element, which are soldered on the circuit board by tin 601, the LED or LED and control element are electrically connected to the circuit board and insulated from the metal decoration layer 102, as shown in fig. 8-1 to 8-4.

The embodiment of the utility model abandons the traditional circuit board and lacks the highlight color and luster of metal for the resin color and luster, fully utilizes the highlight color and luster of metal, obviously improves the aesthetic property of the circuit board, and avoids the homogenization with the existing product; meanwhile, the existence of the metal decorative layer can effectively improve the heat dissipation performance of the circuit board, reduce the working temperature of components on the circuit board and prolong the service life of the product; compared with the traditional method for coating color ink to form the decorative layer, the manufacturing process is simple, the cost is lower, and the metal decorative layer on the circuit board is not easy to fall off.

The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (13)

1. A circuit board, comprising:

a circuit layer;

the covering film is combined on the circuit layer, a pad hole is formed in the covering film, the pad hole penetrates through the covering film, and the circuit layer at the position of the pad hole is exposed to form a pad;

the circuit layer is combined on the insulating base material layer;

the cover film comprises a metal decoration layer, an insulation layer arranged between the metal decoration layer and the circuit layer, and an insulation blocking layer combined on the metal decoration layer, wherein the insulation blocking layer covers the hole wall of the pad hole or the metal decoration layer at the hole wall and the hole edge.

2. A wiring board according to claim 1, wherein: the circuit board is a single-layer circuit board; or the circuit board is a circuit board with double-layer circuits, and the insulating substrate layer is combined with another circuit layer.

3. A wiring board according to claim 2, wherein: and the insulating base material layer is provided with a via hole for conducting the circuit layer with the other circuit layer.

4. A circuit board according to claim 2, wherein: the circuit board further comprises a back covering film, the back covering film is provided with a metal decoration layer, and the back covering film is combined on the other circuit layer.

5. A circuit board according to any one of claims 1-4, wherein: the insulating base material layer is an insulating base film, and the circuit board is a flexible circuit board; or the insulating substrate layer is an insulating substrate, and the circuit board is a rigid circuit board.

6. A wiring board according to claim 1, wherein: the insulating barrier layer is arranged on the hole edge and the hole wall of the pad hole, and the metal decoration layer which is not covered by the insulating barrier layer is exposed outside; or the insulating barrier layer comprises light-transmitting resin for fully covering the surface of the metal decorative layer and insulating resin arranged on the hole wall of the pad hole.

7. A circuit board according to claim 6, wherein: the light-transmitting resin is light-transmitting glue, light-transmitting ink or a light-transmitting film.

8. A circuit board according to claim 6, wherein: the insulating barrier layer covers the hole wall part of the pad hole; or the insulating barrier layer covers the hole wall of the pad hole completely.

9. A wiring board according to claim 1, wherein: the insulating layer is a glue layer; or the insulating layer is formed by combining an insulating film with an adhesive layer; or the insulating layer consists of an insulating film, an adhesive layer and a metal coating positioned between the insulating film and the adhesive layer, and the metal coating positioned on the hole wall of the pad hole is covered by the insulating barrier layer.

10. A wiring board according to claim 1, wherein: the metal decorative layer is a nano metal layer, and the thickness of the metal is 10nm-600nm; or the metal decorative layer is a metal foil layer, and the thickness of the metal is 5-100 mu m.

11. A circuit board according to claim 10, wherein: the metal decorative layer is aluminum, aluminum alloy, copper alloy, zinc or zinc alloy.

12. A circuit board according to claim 10, wherein: the metal decoration layer comprises metal and a colored oxide film layer formed after the metal is oxidized.

13. An LED circuit board module, comprising the circuit board of any one of claims 1 to 12, and an LED, or an LED and a control element, soldered on the circuit board, wherein the LED, or the LED and the control element, is electrically connected to the circuit board and insulated from the metal decorative layer.

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