CN219430146U - Copper-clad plate, copper-clad circuit board and circuit board module - Google Patents

Abstract

The utility model discloses a copper-clad plate, a copper-clad circuit board and a circuit board module, which comprise the following components: the copper layer is positioned on one surface of the insulating film layer, or the copper layer is two layers and is respectively positioned on two surfaces of the insulating film layer; and a conductive adhesive layer is arranged between the copper layer and the insulating film layer, and the copper layer is combined on the insulating film layer through the conductive adhesive layer. The utility model has simple structure, easy implementation, good binding force between the copper layer and the insulating film layer and low cost.

Description

Copper-clad plate, copper-clad circuit board and circuit board module

Technical Field

The utility model relates to the field of circuit boards, in particular to a copper-clad plate, a copper-clad circuit board and a circuit board module.

Background

With the development of technology and the prosperity of the electronic industry, the requirements of circuit boards are ubiquitous. Copper is generally adopted as a circuit layer, a few metals such as aluminum can be used as the circuit layer, the circuit board is generally manufactured by a copper-clad plate, the manufacturing modes comprise etching, die cutting, laser photoetching and the like, unnecessary copper is removed, the necessary copper is reserved for forming a circuit, wherein the etching method is the most popular mode of application, the copper-clad plate is removed in an etching machine by utilizing chemical reaction, and the reserved copper forms a circuit with a curve change.

Regarding the manufacturing process of the copper-clad plate, the prior art mainly comprises the following steps:

(1) the copper foil is obtained by an electrolytic method, namely, the copper foil produced by the electrolytic method is used as a main raw material, and then the electrolytic copper foil is adhered to a polyamide film (PI) or a polyester film (PET) through an insulating adhesive; the product is not beneficial to obtain advantages in strong market competition;

(2) directly manufacturing a layer of PI film on the surface of the copper foil to prepare a copper-clad plate, wherein the method is called a glue-free base material method, however, the PI film is a modified PI material, so that the production and manufacturing cost is high;

(3) sputtering a layer of copper on the PI film to make the PI film conductive, then plating copper on the sputtered layer by using an electrolytic method to manufacture a copper-clad plate, wherein the method is called a sputtering direct method, however, the method has two defects, namely, the copper layer and the PI film layer have poor binding force, so that the circuit layer is easy to displace or loose in the use process of the circuit board, and the circuit is invalid; secondly, when copper is sputtered, the sputtering efficiency is very low, so that the manufacturing efficiency of the copper-clad plate is difficult to improve, and the manufacturing cost of the copper-clad plate is difficult to reduce.

Therefore, the existing copper-clad plate and other structures need to be explored and optimized.

Disclosure of Invention

In order to overcome the defects in the prior art, the utility model provides the copper-clad plate, the copper-clad circuit board and the circuit board module, which have the advantages of simple structure, easy implementation, good binding force between a copper layer and an insulating film layer and low cost.

In a first aspect, the present utility model provides a method for manufacturing a copper-clad plate, including:

s1: preparing an insulating resin film and a conductive adhesive;

s2: coating one or both sides of the insulating resin film with a conductive paste, which is soluble in an alkali solution, using a coater;

s3: and (3) placing the insulating resin film coated with the conductive adhesive into an electrolytic tank, wherein the electrolytic tank is provided with electrolyte, and electrifying to ensure that copper in the electrolyte is deposited on the surface of the conductive adhesive, so as to prepare the copper-clad plate.

Further, in step S2, the thickness of the single layer of the conductive adhesive is controlled to be 1 μm-100 μm.

Further, in step S2, the conductive adhesive is an epoxy resin adhesive-containing conductive adhesive, or/and the conductive adhesive is an acrylic resin adhesive-containing conductive adhesive.

Further, the conductive adhesive contains a curing agent, and after the conductive adhesive is heated and cured, the conductive adhesive can resist high temperature of 265 ℃ for 15 minutes.

Further, in step S3, the electrolyte is a copper sulfate+sulfuric acid solution.

Further, in step S3, the thickness of the copper layer formed by depositing copper in the electrolyte on the surface of the conductive paste is controlled to be 1 μm to 120 μm.

Further, in step S1, the insulating resin film is a PET film or a PI film.

Further, in step S1, a via hole is further formed in the insulating resin film, in step S2, conductive glue is coated on both sides of the insulating resin film, wherein conductive glue is also coated on the side wall of the via hole, and in step S3, a copper layer is also coated on the conductive glue on the side wall of the via hole, so that the front copper layer and the back copper layer are connected into an integral conduction; alternatively, in step S1, the insulating resin film is not provided with a via hole, and in step S2, after the conductive paste is coated on both sides of the insulating resin film, a via hole is formed by a punching step, the via hole penetrating the insulating resin film and the conductive paste on both sides.

In a second aspect, the present utility model provides a method for manufacturing a copper-clad circuit board, including the method for manufacturing a copper-clad plate according to any one of the first aspect, further including:

s4: manufacturing an etching resistant layer on the surface of the copper layer of the copper-clad plate, wherein the etching resistant layer covers the copper layer needing to form a circuit;

s5: etching the copper-clad plate with the etching-resistant layer in etching solution, etching and removing the copper layer uncovered by the etching-resistant layer, and reserving the copper layer covered by the etching-resistant layer to form a circuit layer;

s6: removing the etching-resistant layer and the conductive adhesive between the circuits by using alkali solution to prepare a bare circuit board;

s7: heating the bare circuit board in a heater to solidify the conductive adhesive between the circuit layer and the insulating resin film so as to increase the bonding force between the circuit layer and the insulating resin film;

s8: and manufacturing a solder mask layer on the surface of the circuit layer.

Further, in step S7, the heating conditions of the heater are: 150℃for 60 min.

Further, in step S7, the bare circuit board is placed on a hot press to be pressed, and then placed in a heater to be heated.

Further, when the via hole is manufactured in the step S2, in the step S4, a conductive medium is further manufactured in the via hole, and the conductive medium conducts the front copper layer and the back copper layer; alternatively, in the case where no via hole is formed in steps S1 and S2, and conductive paste is coated on both sides of the insulating resin film in step S2, in step S4, a via hole is further formed, and then a conductive medium is formed in the via hole, the conductive medium electrically connecting the front copper layer and the back copper layer.

In a second aspect, the present utility model further provides a method for manufacturing a copper-clad circuit board, including:

s1: preparing an insulating resin film and conductive adhesive, wherein the insulating resin film is provided with or without a via hole;

s2: coating conductive adhesive on both sides of the insulating resin film with the through holes by using a coater, or coating conductive adhesive on one side of the insulating resin film without the through holes by using a coater; the conductive adhesive can be dissolved in an alkali solution;

s3: printing anti-electrolysis ink on the conductive adhesive, wherein the anti-electrolysis ink covers the position where the circuit is not required to be formed, and the position where the circuit is required to be formed is reserved to expose the conductive adhesive; for the insulating resin film with the via hole, the conductive adhesive in the via hole is reserved and exposed;

s4: placing an insulating resin film with conductive adhesive and anti-electrolysis ink into an electrolytic tank, wherein the electrolytic tank is provided with electrolyte, and electrifying to ensure that copper in the electrolyte is deposited at the position where the conductive adhesive is exposed, so as to form a copper circuit layer;

s5: removing the anti-electrolysis ink and the conductive adhesive between the circuits by using alkali solution to prepare a bare circuit board;

s6: heating the bare circuit board in a heater to solidify the conductive adhesive between the circuit layer and the insulating resin film so as to increase the bonding force between the circuit layer and the insulating resin film;

s7: and manufacturing a solder mask layer on the surface of the circuit layer.

In a third aspect, the present utility model provides a copper-clad plate, comprising: the copper layer is positioned on one surface of the insulating film layer, or the copper layer is two layers and is respectively positioned on two surfaces of the insulating film layer; and a conductive adhesive layer is arranged between the copper layer and the insulating film layer, and the copper layer is combined on the insulating film layer through the conductive adhesive layer.

Further, the thickness of the single layer of the conductive adhesive layer is 1um-100 um, the thickness of the insulating film layer is 3um-100 um, and the thickness of the single layer of the copper layer is 1 um-120 um.

Further, the copper layers are two layers, including a front copper layer and a back copper layer, and the thickness of the front copper layer is the same as that of the back copper layer, or the thickness of the front copper layer is different from that of the back copper layer.

The conductive adhesive layer is arranged at the side wall of the hole of the through hole, the front copper layer, the insulating film layer, the back copper layer and the conductive adhesive layer are connected with each other, the side wall of the hole of the through hole is the copper layer, and the front copper layer and the back copper layer are connected into a whole for conducting; or the conductive adhesive at the side wall of the through hole is disconnected at the position of the insulating film layer, and the front copper layer and the back copper layer do not form an integrated conducting structure at the position of the through hole.

Further, the insulating film layer is a PET layer or a PI layer.

In a fourth aspect, the present utility model provides a copper clad circuit board comprising: the circuit board comprises an insulating film layer and a copper circuit layer, wherein the copper circuit layer is one layer and is positioned on one side of the insulating film layer to form a single-sided circuit board, or the copper circuit layer is two layers and is respectively positioned on two sides of the insulating film layer to form a double-sided circuit board; the copper wire layer is combined on the insulating film layer through the conductive adhesive layer, a solder resist layer is arranged on the copper wire layer, a wire gap is formed between wires of the copper wire layer, no conductive adhesive is arranged at the wire gap, or conductive adhesive is arranged at the wire gap, and wires at two sides of the wire gap are not communicated by the conductive adhesive.

Further, the thickness of the single layer of the conductive adhesive layer is 1um-100 um, the thickness of the insulating film layer is 3um-100 um, and the thickness of the single layer of the copper circuit layer is 1 um-120 um.

Further, the solder resist layer is bonded to the insulating film layer at all or part of the line gap.

Further, the copper-clad circuit board is a double-sided circuit board, and comprises a front copper circuit layer, a back copper circuit layer and a conducting hole, wherein the conducting hole penetrates through the front copper circuit layer, the insulating film layer, the back copper circuit layer and the conducting adhesive layer, a conducting medium is arranged in the conducting hole, and the conducting medium conducts the front copper circuit layer and the back copper circuit layer.

Further, the conductive medium is copper, conductive adhesive or conductive ink.

In a fifth aspect, the present utility model provides a circuit board module, which is characterized in that: comprising the copper-clad circuit board of any one of the fourth aspects, on which an electronic component is soldered.

Further, the circuit board module is an automobile, a computer or a lamp.

The beneficial effects of the utility model are as follows: according to the utility model, the conductive adhesive layer is manufactured on the insulating film layer, then the metal copper layer is manufactured on the conductive adhesive layer, and copper is directly electrodeposited on the insulating film through the electrolytic copper foil process, so that the processes of an indirect production method, a glue-free base material method and a sputtering direct method in the prior art are abandoned, the manufacturing efficiency of the conductive adhesive layer is obviously higher than that of the sputtering method, the production efficiency of the copper-clad plate is improved, and meanwhile, the conductive adhesive has better binding force relative to the sputtering layer, so that the adhesive force of the metal copper layer on the insulating film layer is better, and the manufactured copper-clad plate, copper-clad circuit board and other structures are more reliable; compared with the prior art, the conductive adhesive is favorable for simplifying production equipment, avoiding using modified PI films and the like, reducing the manufacturing cost of copper-clad plates and the like, and being favorable for improving the market competitiveness of products.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description

As will become apparent from the following description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the present utility model will be apparent from the following description of the embodiments taken in conjunction with the accompanying drawings

Will become apparent and readily appreciated from the description of the (c):

FIG. 1-1 is a schematic plan view of a front side copper wiring layer in accordance with an embodiment of the present utility model;

FIGS. 1-2 are schematic plan view of a backside copper wiring layer in accordance with an embodiment of the present utility model;

FIGS. 1-3 are cross-sectional views of insulating film layers in embodiments of the present utility model;

FIGS. 1-4 are schematic plan view of a front side solder mask layer according to an embodiment of the present utility model;

FIGS. 1-5 are schematic plan view of a circuit board for a light bar according to an embodiment of the present utility model, which is manufactured using the structure shown in FIGS. 1-4;

FIG. 2-1 is a cross-sectional view of an insulating film layer for making a single-layer copper-clad laminate in an embodiment of the utility model;

FIG. 2-2 is a cross-sectional view of FIG. 2-1 after application of a conductive paste;

FIG. 2-3 is a cross-sectional view of the electrolytic copper layer of FIG. 2-2;

FIGS. 2-4 are cross-sectional views of the copper layer of FIGS. 2-3 after etching to form a circuit;

FIGS. 2-5 are cross-sectional views of the solder mask layer of FIGS. 2-4;

FIGS. 2-6 are cross-sectional views of FIGS. 2-5 after soldering electronic components;

FIG. 3-1 is a cross-sectional view of an insulating film layer with vias preformed thereon in accordance with an embodiment of the present utility model;

FIG. 3-2 is a cross-sectional view of FIG. 3-1 after application of a conductive paste;

FIG. 3-2-1 is a cross-sectional view of the electrolytic copper layer of FIG. 3-2;

FIG. 3-3 is a cross-sectional view of the copper layer of FIG. 3-2-1 after etching to form a circuit;

fig. 3-4 are cross-sectional views of the solder mask of fig. 3-3 after fabrication (the solder mask is bonded to the insulating film layer at the line gaps);

fig. 3-5 are cross-sectional views of fig. 3-4 after soldering electronic components;

FIG. 4-1 is a cross-sectional view of an unpredicted via in an insulating film layer in an embodiment of the utility model;

FIG. 4-2 is a cross-sectional view of FIG. 4-1 after application of a conductive paste;

FIG. 4-3 is a cross-sectional view of the via hole of FIG. 4-2 after fabrication;

FIG. 4-4 is a cross-sectional view of the electrolytic copper layer of FIG. 4-3;

fig. 4-4-1 is a cross-sectional view of fig. 4-4 after a conductive medium has been fabricated in the via;

fig. 4-5 are cross-sectional views of the copper layer of fig. 4-4-1 after etching to form a circuit;

FIGS. 4-6 are cross-sectional views of the solder mask layer of FIGS. 4-5;

fig. 4-7 are cross-sectional views of fig. 4-6 after soldering electronic components;

FIG. 5-1 is a cross-sectional view of an unpredicted via in an insulating film layer in an embodiment of the utility model;

FIG. 5-2 is a cross-sectional view of FIG. 5-1 after application of a conductive paste;

FIG. 5-3 is a cross-sectional view of the electrolytic copper layer of FIG. 5-2;

FIG. 5-4 is a cross-sectional view of the via hole of FIG. 5-3 after fabrication;

fig. 5-5 are cross-sectional views of fig. 5-4 after a conductive medium is fabricated in the via;

FIGS. 5-6 are cross-sectional views of the copper layer of FIGS. 5-5 after etching to form a circuit;

FIGS. 5-7 are cross-sectional views of the solder mask layer of FIGS. 5-6;

fig. 5-8 are cross-sectional views of fig. 5-7 after soldering electronic components;

FIG. 6-1 is a cross-sectional view of an insulating film layer used to fabricate a single copper wiring layer in an embodiment of the present utility model;

FIG. 6-2 is a cross-sectional view of FIG. 6-1 after application of a conductive paste;

FIG. 6-3 is a cross-sectional view of FIG. 6-2 after the surface of the conductive paste has been coated with an anti-electrolyte ink;

FIG. 6-4 is a cross-sectional view of the electrolytic copper layer of FIG. 6-3;

FIG. 6-5 is a cross-sectional view of FIG. 6-4 after removal of the conductive paste and the anti-electrolytic ink using an alkaline solution;

FIG. 6-6 is a cross-sectional view of the solder mask layer of FIG. 6-5;

fig. 6-7 are cross-sectional views of fig. 6-6 after soldering electronic components;

FIG. 7-1 is a cross-sectional view of an insulating film layer (with via holes) used to fabricate a bilayer copper wiring layer in accordance with an embodiment of the present utility model;

FIG. 7-2 is a cross-sectional view of FIG. 7-1 after application of a conductive paste;

FIG. 7-3 is a cross-sectional view of FIG. 7-2 after the surface of the conductive paste has been coated with an anti-electrolyte ink;

FIG. 7-4 is a cross-sectional view of the electrolytic copper layer of FIG. 7-3;

FIG. 7-5 is a cross-sectional view of FIG. 7-4 after removal of the conductive paste and the anti-electrolyte ink using an alkaline solution;

FIG. 7-6 is a cross-sectional view of the solder mask layer of FIG. 7-5;

fig. 7-7 are cross-sectional views of fig. 7-6 after soldering the electronic components;

description of the reference numerals:

1-an insulating film layer;

2-copper layer;

3-a conductive adhesive layer;

4-via holes;

5-copper wiring layer, 51-wiring gap, 52-front copper wiring layer, 53-back copper wiring layer;

6-solder mask, 61-pad window;

7-a conductive medium;

8-electronic component, 81-tin;

9-anti-electrolytic ink.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

The following provides many different embodiments, or examples, for implementing different methods, structures of the utility model.

An embodiment of a first aspect of the present utility model provides a method for manufacturing a copper-clad plate, including:

s1: preparing an insulating resin film and a conductive adhesive;

s2: coating one or both sides of the insulating resin film with a conductive paste, which is soluble in an alkali solution, using a coater;

s3: and (3) placing the insulating resin film coated with the conductive adhesive into an electrolytic tank, wherein the electrolytic tank is provided with electrolyte, and electrifying to ensure that copper in the electrolyte is deposited on the surface of the conductive adhesive, so as to prepare the copper-clad plate.

In some embodiments of the present utility model, in step S2, the thickness of the single layer of the conductive paste is controlled to be 1 μm to 100 μm. The thickness of the conductive adhesive is too thin, the conductivity is low, copper is not favorable for being quickly deposited and combined on the surface of the conductive adhesive in the electrolysis stage, the conductive adhesive is too thick, the conductive adhesive is not favorable for being dissolved and removed by alkaline solution in the circuit manufacturing stage, and the cost is increased.

In some embodiments of the present utility model, the conductive adhesive is a conductive adhesive that is soluble in an alkaline solution, and specifically may be: the conductive adhesive is conductive adhesive containing epoxy resin adhesive, or/and the conductive adhesive is conductive adhesive containing acrylic resin adhesive; therefore, when the copper-clad plate is used for manufacturing the circuit board, the conductive adhesive can be removed through the alkali solution, so that the short circuit connection of the conductive adhesive at the gap of the circuit board is avoided.

In some embodiments of the present utility model, the conductive paste contains a curing agent, and after the conductive paste is heated and cured, the conductive paste can resist a high temperature of 265 ℃ for 15 minutes, so that the conductive paste can resist a soldering temperature when the circuit board is used for soldering electronic components.

In some embodiments of the present utility model, in step S3, the electrolyte is a copper sulfate+sulfuric acid solution, although other conventional electrolytes may be used.

In some embodiments of the present utility model, in step S3, the thickness of the copper layer formed by depositing copper in the electrolyte on the surface of the conductive paste is controlled to be 1 μm to 120 μm, and the thickness of the copper layer can be controlled by controlling the electrolysis time.

In some embodiments of the present utility model, in step S1, the insulating resin film is a PET film or a PI film, and the insulating properties of the PET film and the PI film are good, and the PET film and the PI film are easy to purchase and have relatively low cost.

In some embodiments of the present utility model, in step S1, a via hole is further formed on the insulating resin film, in step S2, conductive glue is coated on both sides of the insulating resin film, wherein conductive glue is also coated on a sidewall of the via hole, and in step S3, a copper layer is also coated on the conductive glue on the sidewall of the via hole, so that the front copper layer and the back copper layer are connected as a whole for conduction; alternatively, in step S1, the insulating resin film is not provided with a via hole, and in step S2, after the conductive paste is coated on both sides of the insulating resin film, a via hole is formed by a punching step, the via hole penetrating the insulating resin film and the conductive paste on both sides. The double-sided circuit board is used for adapting to the requirement of the double-sided circuit board, and the double-sided circuit board is used for conducting the upper layer of circuit and the lower layer of circuit; it is understood that the connection of the upper and lower layers of circuits is not limited to the above connection method, but may be implemented by other connection techniques in the prior art, such as soldering the upper and lower layers of circuits at the end of the circuit board. The via holes do not have to be fabricated in the copper-clad plate fabrication stage either, but may be fabricated in the circuit board fabrication stage, which will become apparent in the following description.

Example 1:

s1: preparing a PI film, and preparing conductive adhesive (containing methylimidazole curing agent, epoxy resin adhesive, carboxyl-COOH, graphite powder and acetone as solvents) on the PI film by using a puncher, wherein the conductive adhesive is shown in the figure 3-1;

s2: the conductive adhesive coated on both sides of the PI film is coated by using a dip coating production line, the conductive adhesive is also coated in the conductive holes, the thickness of the conductive adhesive is controlled to be 25 mu m, then the solvent is dried for 10 minutes at 100 ℃, and a conductive adhesive film is formed after drying, as shown in the figure 3-2;

s3: and placing the PI film coated with the conductive adhesive into an electrolytic tank, filling a copper sulfate+sulfuric acid solution (the specific concentration and the proportion are in the prior art), electrifying for 60 minutes, and depositing copper in the electrolyte on the surface of the conductive adhesive to prepare the copper-clad plate, wherein the copper layer in the through hole and the copper layers on the two sides of the PI film are connected into a whole, and the single-layer thickness of the copper layer is 30-35 mu m and the copper layer thicknesses of different positions are slightly different after measurement, as shown in the figure 3-2-1.

Example 2:

s1: preparing a PET film, wherein conductive adhesive (acrylic resin adhesive is contained, the resin adhesive contains carboxyl-COOH, conductive graphite and water as solvent), and the PET film is free of through holes, as shown in fig. 2-1;

s2: coating conductive adhesive on one side of the PET film by using a knife coater, controlling the thickness of the conductive adhesive to be 100 mu m, and drying the solvent at 120 ℃ for 10 minutes, as shown in fig. 2-2;

s3: the PET film coated with the conductive adhesive is placed into an electrolytic tank, a copper sulfate+sulfuric acid solution (the specific concentration and the proportion are the prior art) is filled into the electrolytic tank, the power is on for 180 minutes, so that copper in the electrolyte is deposited on the surface of the conductive adhesive, a copper-clad plate is prepared, and the single-layer thickness of the copper layer is 100-120 mu m after measurement, as shown in figures 2-3.

Example 3:

s1: preparing PI film, conductive adhesive (epoxy resin adhesive and acrylic resin adhesive are contained, the resin contains carboxyl-COOH, conductive graphite and solvent is acetone), and the conductive adhesive also contains methylimidazole and phenolic curing agent, as shown in figure 4-1;

s2: spraying conductive adhesive on two sides of the PI film by using a spraying coater, controlling the thickness of the conductive adhesive to be 1 mu m, and drying the solvent at 100 ℃ for 5 minutes; then penetrating the conductive adhesive and the PI film by using a perforating machine to prepare a via hole, as shown in figures 4-2 and 4-3;

s3: and placing the PI film coated with the conductive adhesive into an electrolytic tank, filling a copper sulfate and sulfuric acid solution into the electrolytic tank, electrifying for 10 minutes, so that copper in the electrolyte is deposited on the surface of the conductive adhesive, and obtaining the copper-clad plate, wherein the single-layer thickness of the copper layer is 1 m after measurement, as shown in fig. 4-4.

Example 4:

s1: preparing a PI film, and conducting resin (containing methylimidazole curing agent, epoxy resin glue, carboxyl-COOH and graphite powder contained in the resin glue, and acetone as solvent) as shown in figure 5-1;

s2: using a dip coating production line to coat conductive adhesive on both sides of the PI film, controlling the thickness of the conductive adhesive to be 25 mu m, drying the solvent at 100 ℃ for 10 minutes, and forming a conductive adhesive film after drying, as shown in fig. 5-2;

s3: the PI film coated with the conductive adhesive is placed into an electrolytic tank, a copper sulfate+sulfuric acid solution (the specific concentration and the proportion are the prior art) is filled into the electrolytic tank, the power is on for 60 minutes, copper in the electrolyte is deposited on the surface of the conductive adhesive, a copper-clad plate is prepared, and the single-layer thickness of the copper layer is 30-35 mu m after measurement, as shown in fig. 5-3.

An embodiment of the second aspect of the present utility model provides a method for manufacturing a copper-clad circuit board, which specifically includes:

example 1-1:

after the copper-clad plate is manufactured in embodiment 1, the method further comprises:

s4: coating etching-resistant ink (conventional material) on the surface of the copper layer of the copper-clad plate, wherein the etching-resistant ink covers the copper layer needing to form a circuit;

s5: placing the copper-clad plate coated with the etching-resistant ink into an etching machine for etching, etching and removing the copper layer uncovered by the etching-resistant ink, and reserving the copper layer covered by the etching-resistant ink to form a circuit layer;

s6: removing the conductive adhesive between the etching-resistant ink and the circuit by using an alkali solution (5% NaOH solution), and reacting carboxyl-COOH contained in the conductive adhesive with the alkali solution to generate-COONa, so that the conductive adhesive is dissolved, and a bare circuit board is manufactured, as shown in figures 3-3;

s7: heating the bare circuit board in a heater under the following heating conditions: curing the conductive adhesive between the circuit layer and the insulating resin film at 150 ℃ for 60 minutes to increase the bonding force between the circuit layer and the insulating resin film;

s8: and a solder mask layer is manufactured on the surface of the circuit layer, as shown in figures 3-4.

Example 2-1:

after the copper-clad plate is manufactured in the embodiment 2, the method further comprises:

s4: pasting a dry etching resistant film on the surface of the copper layer of the copper-clad plate, wherein the dry etching resistant film covers the copper layer needing to form a circuit;

s5: exposing and developing the copper-clad plate coated with the etching-resistant dry film to form a part needing to be reserved with the etching-resistant dry film, etching and removing copper, developing and removing the etching-resistant dry film, putting the copper-clad plate into an etching machine for etching, etching and removing the copper layer uncovered by the etching-resistant dry film, and reserving the copper layer covered by the etching-resistant dry film to form a circuit layer;

s6: removing the etching-resistant ink and the conductive adhesive between the circuits by using an alkali solution (5% NaOH solution) to prepare a bare circuit board, as shown in figures 2-4;

s7: the bare circuit board is put into a press for hot pressing, the hot pressing temperature is 130 ℃, the pressure is 120KG, and after hot pressing, the bare circuit board is put into an oven for heating under the following heating conditions: curing the conductive adhesive between the circuit layer and the insulating resin film at 150 ℃ for 60 minutes to increase the bonding force between the circuit layer and the insulating resin film;

s8: and manufacturing a solder mask layer on the surface of the circuit layer, as shown in figures 2-5.

Example 3-1:

after the copper-clad plate is manufactured in embodiment 3, the method further comprises:

s4: manufacturing a conductive medium in the via hole, wherein the conductive medium is conductive ink, so that the front copper layer and the back copper layer are conducted, as shown in fig. 4-4-1; coating etching-resistant ink on the surface of the copper layer of the copper-clad plate, wherein the etching-resistant ink covers the copper layer needing to form a circuit;

s5: etching the copper-clad plate coated with the etching-resistant ink in an etching machine, etching and removing the copper layer uncovered by the etching-resistant ink, and reserving the copper layer covered by the etching-resistant ink to form a circuit layer;

s6: removing the etching-resistant ink and the conductive adhesive between the circuits by using an alkali solution (5% NaOH solution) to prepare a bare circuit board, as shown in figures 4-5;

s7: heating the bare circuit board in a heater under the following heating conditions: curing the conductive adhesive between the circuit layer and the insulating resin film at 150 ℃ for 60 minutes to increase the bonding force between the circuit layer and the insulating resin film;

s8: a solder mask is formed on the surface of the circuit layer as shown in fig. 4-6.

Example 4-1:

after the copper-clad plate is manufactured in the embodiment 4, the method further comprises:

s4: manufacturing a via hole 4 on the copper-clad plate, wherein the via hole penetrates through the copper layer 2, the conductive adhesive layer 3 and the insulating film layer 1 as shown in fig. 5-4, and then manufacturing a conductive medium in the via hole 4, wherein the conductive medium adopts conductive ink to enable the front copper layer and the back copper layer to be conducted as shown in fig. 5-5; coating etching-resistant ink on the surface of the copper layer of the copper-clad plate, wherein the etching-resistant ink covers the copper layer needing to form a circuit;

s5: etching the copper-clad plate coated with the etching-resistant ink in an etching machine, etching and removing the copper layer uncovered by the etching-resistant ink, and reserving the copper layer covered by the etching-resistant ink to form a circuit layer;

s6: removing the etching-resistant ink and the conductive adhesive between the lines by using an alkali solution (5% NaOH solution) to prepare a bare circuit board, as shown in figures 5-6;

s7: heating the bare circuit board in a heater under the following heating conditions: curing the conductive adhesive between the circuit layer and the insulating resin film at 150 ℃ for 60 minutes to increase the bonding force between the circuit layer and the insulating resin film;

s8: a solder mask is formed on the surface of the circuit layer as shown in fig. 5-7.

Example 5-1:

in the embodiment, after the conductive adhesive is coated, the anti-electrolysis ink is printed on the conductive adhesive, the anti-electrolysis ink covers the position where the circuit is not required to be formed, and the position where the circuit is required to be formed is reserved to expose the conductive adhesive.

The method comprises the following steps:

s1: preparing a PET film, wherein the conductive adhesive (acrylic resin adhesive is contained, the resin adhesive contains carboxyl-COOH, conductive graphite is contained in the resin adhesive, the solvent is water, phenolic curing agent is contained in the conductive adhesive), and the PET film is free of through holes, as shown in fig. 6-1;

s2: coating conductive adhesive on one side of the PET film by using a roll coater, controlling the thickness of the conductive adhesive to be 25-30 mu m, and drying the solvent at 120 ℃ for 10 minutes, as shown in fig. 6-2;

s3: printing an anti-electrolysis ink (produced by Shenzhen Huadarxin technology Co., ltd.) on the conductive adhesive, wherein the anti-electrolysis ink covers the positions where the circuit is not required to be formed, and the positions where the circuit is required to be formed are reserved to expose the conductive adhesive, as shown in fig. 6-3;

s4: placing the PET film coated with the conductive adhesive into an electrolytic tank, filling a copper sulfate+sulfuric acid solution (the specific concentration and the proportion are in the prior art), electrifying for 60 minutes, so that copper in the electrolyte is deposited on the surface of the conductive adhesive to prepare a copper circuit layer, and measuring to obtain a single-layer thickness of the copper layer of 30-35 mu m, wherein the single-layer thickness is shown in fig. 6-4;

s5: removing the anti-electrolysis ink and the conductive adhesive between the circuits by using an alkali solution (5% NaOH solution), and reacting carboxyl-COOH contained in the anti-electrolysis ink, the conductive adhesive and the alkali solution to generate-COONa, so that the conductive adhesive and the anti-electrolysis ink are dissolved, and a bare circuit board is manufactured, as shown in figures 6-5;

s6: the bare circuit board is put into a press for hot pressing, the hot pressing temperature is 130 ℃, the pressure is 120KG, and after hot pressing, the bare circuit board is put into an oven for heating under the following heating conditions: curing the conductive adhesive between the circuit layer and the insulating resin film at 150 ℃ for 60 minutes to increase the bonding force between the circuit layer and the insulating resin film;

s7: a solder mask is formed on the surface of the circuit layer as shown in fig. 6-6.

Example 5-2:

s1: preparing a PI film, wherein conductive adhesive (containing methylimidazole curing agent, epoxy resin adhesive, and carboxyl-COOH and graphite powder are contained in the resin adhesive, and acetone is used as a solvent), and a via hole is prefabricated on the PI film, as shown in fig. 7-1;

s2: coating conductive adhesive on both sides of the PI film by using a dip coating production line, wherein the conductive adhesive is also coated in the conductive holes, the thickness of the conductive adhesive is controlled to be 35-40 mu m, and then drying the solvent at 100 ℃ for 10 minutes to form a conductive adhesive film after drying, as shown in fig. 7-2;

s3: printing anti-electrolysis ink (produced by Shenzhen Huadarxin technology Co., ltd.) on the conductive adhesive, wherein the anti-electrolysis ink covers the positions where the circuit is not required to be formed, and the positions of the positions where the circuit is required to be formed and the positions of the through holes are reserved to expose the conductive adhesive, as shown in figures 7-3;

s4: putting the PI film coated with the conductive adhesive into an electrolytic tank, filling copper sulfate+sulfuric acid solution (the specific concentration and proportion are the prior art), electrifying for 60 minutes, so that copper in the electrolyte is deposited on the surface of the conductive adhesive to prepare a copper circuit layer, wherein the copper layer in a through hole and the copper layers on two sides of the PI film are connected into a whole, and the single-layer thickness of the copper layer is 30-35 mu m after measurement, and the copper layer thicknesses of different positions are slightly different, as shown in figures 7-4;

s5: removing the anti-electrolysis ink and the conductive adhesive between the circuits by using an alkali solution (5% NaOH solution), and reacting carboxyl-COOH contained in the anti-electrolysis ink, the conductive adhesive and the alkali solution to generate-COONa, so that the conductive adhesive and the anti-electrolysis ink are dissolved, and a bare circuit board is manufactured, as shown in figures 7-5;

s6: the bare circuit board is put into a press for hot pressing, the hot pressing temperature is 130 ℃, the pressure is 120KG, and after hot pressing, the bare circuit board is put into an oven for heating under the following heating conditions: curing the conductive adhesive between the circuit layer and the insulating resin film at 150 ℃ for 60 minutes to increase the bonding force between the circuit layer and the insulating resin film;

s7: a solder mask is formed on the surface of the circuit layer as shown in fig. 7-6.

An embodiment of a third aspect of the present utility model provides a copper-clad plate, specifically referring to fig. 1-1 to fig. 7-7, including: the insulation film layer 1 and the copper layer 2, wherein the insulation film layer 1 can be a PI film or a PET film, the copper layer 2 is one layer, the copper layer 2 is positioned on one side of the insulation film layer 1, or the copper layer 2 is two layers, and the copper layer 2 is respectively positioned on two sides of the insulation film layer 1; a conductive adhesive layer 3 is arranged between the copper layer 2 and the insulating film layer 1, and the copper layer 2 is combined on the insulating film layer 1 through the conductive adhesive layer 3.

In some embodiments of the present utility model, the thickness of the single layer of the conductive adhesive layer 3 is 1um to 100um, the thickness of the insulating film layer 1 is 3um to 100um, and the thickness of the single layer of the copper layer 2 is 1um to 120um.

In some embodiments of the present utility model, the copper layer 2 is two layers, including a front copper layer and a back copper layer, and the thicknesses of the front copper layer and the back copper layer may be the same or different.

Referring to fig. 3-1 to fig. 4-7 and fig. 7-1 to fig. 7-7, in some embodiments of the present utility model, the conductive via 4 is further included, the conductive via 4 penetrates through the front copper layer, the insulating film layer 1, the back copper layer and the conductive adhesive layer 3, according to different manufacturing methods, referring specifically to fig. 3-1 to fig. 3-5, when the insulating film layer 1 pre-coats the conductive via 4 and then coats the conductive adhesive layer 3, the conductive adhesive is coated in the conductive via 4, so that the hole side wall of the conductive via 4 has conductive adhesive, thereby connecting the front conductive adhesive layer and the back conductive adhesive layer, that is, the conductive adhesive on the surface of the conductive via side wall is coated with a copper layer, and when copper is electrolyzed, the hole side wall of the conductive via 4 is a copper layer, and the front copper layer and the back copper layer are connected into a whole; in other embodiments of the present utility model, as shown in fig. 4-1 to 4-7, when the copper-clad plate is manufactured, no conductive via is pre-formed on the insulating film layer 1, after the conductive adhesive layers 3 are coated on both sides of the insulating film layer 1, a punching machine is used to make the conductive via 4 penetrate through the insulating film layer 1 and the conductive adhesive layers 3 on both sides thereof, and then the copper layer is electrolyzed, because the insulating film layer 1 does not have conductive adhesive on the side wall of the conductive via, the position is not electrolyzed with copper layer when copper is electrolyzed, so that the conductive adhesive on the side wall of the via 4 is disconnected on the insulating film layer, and the front copper layer and the back copper layer do not form an integrated conductive structure at the position of the conductive via.

An embodiment of a fourth aspect of the present utility model provides a copper clad circuit board comprising: the circuit board comprises an insulating film layer 1 and a copper circuit layer 5, wherein the copper circuit layer 5 is one layer and is positioned on one side of the insulating film layer 1 to form a single-sided circuit board, or the copper circuit layer 5 is two layers and is respectively positioned on two sides of the insulating film layer 1 to form a double-sided circuit board, and the double-sided circuit board can meet more complex circuit design; the copper wire layer 5 and the insulating film layer 1 are provided with the conductive adhesive layer 3, the copper wire layer 5 is combined on the insulating film layer 1 through the conductive adhesive layer 3, the copper wire layer 5 is provided with the solder mask layer 6, and the solder mask layer 6 can be solder mask ink or a solder mask covering film. A pad window 61 may be provided on the solder mask layer 6 on the component side such that the copper wiring layer 5 under the solder mask layer 6 is exposed at the pad window 61 for soldering electronic components, as shown in fig. 1-4, fig. 1-5, fig. 2-5, fig. 3-4, fig. 4-6, fig. 5-7, fig. 6-7, fig. 7-7. The copper wiring layer 5 has a wiring gap 51 between the wirings, and when the wiring layer is formed by etching the copper layer, the wiring gap 51 is formed by etching away a part of the copper layer; the gap 51 of the circuit is free of conductive adhesive, and in the circuit board manufacturing process, the conductive adhesive is completely corroded by alkali solution, so that short circuit between the circuits due to the existence of the conductive adhesive is avoided; or the line gap 51 is provided with conductive adhesive, and the conductive adhesive does not connect the lines at two sides of the line gap, i.e. although the conductive adhesive in the line gap is not completely corroded by the alkali solution, the remained conductive adhesive cannot connect the lines at two sides of the line gap, so that the problem of short circuit is caused.

In some embodiments of the utility model, the conductive glue layer has a monolayer thickness of 1um to 100um, the insulating film layer has a thickness of 3um to 100um, and the copper circuit layer has a monolayer thickness of 1um to 100um.

In some embodiments of the present utility model, the solder mask layer 6 is bonded to the insulating film layer 1 at all or part of the line gap 51. The structure enables better insulation separation between the lines of the line layers, as shown in fig. 2-5, fig. 2-6, fig. 3-4 and fig. 3-5, the solder mask layer 6 is combined on the insulating film layer 1, and as shown in fig. 4-6, fig. 4-7, fig. 5-7 and fig. 5-8, the solder mask layer 6 is not combined on the insulating film layer 1.

In some embodiments of the present utility model, the copper-clad circuit board is a double-sided circuit board, and includes a front copper circuit layer 52 and a back copper circuit layer 53, and further includes a via 4, where the via 4 penetrates through the front copper circuit layer 52, the insulating film layer 1, the back copper circuit layer 53, and the conductive adhesive layer 3, and a conductive medium 7 is disposed in the via 4, and the conductive medium 7 conducts the front copper circuit layer 52 and the back copper circuit layer 53. For the double-sided circuit board, the front copper circuit layer 52 is generally a main circuit, as shown in fig. 1-1, the back copper circuit layer 53 is generally a power circuit, that is, is used for externally connecting the positive and negative electrodes of the power supply, as shown in fig. 1-2, so that the upper and lower conduction of the two copper circuit layers can be realized by arranging the via holes 4 and arranging the conductive medium 7 in the via holes 4. According to different manufacturing methods, the conductive medium 7 may be different, specifically, as shown in fig. 3-1-3-5 and fig. 7-1-7, when the copper-clad plate is manufactured, since the through holes are prefabricated on the insulating film layer 1, when the copper layer is electrolyzed, the copper layer is electrolyzed in the through holes, and the copper layer is used as the conductive medium to connect the front copper circuit layer 52 and the back copper circuit layer 53 into a whole for conduction, so that in the subsequent manufacturing process of the circuit board, the conductive medium is not required to be manufactured in the through holes; specifically, as shown in fig. 4-1 to fig. 4-7, when the copper-clad plate is manufactured, since the through hole is not prefabricated on the insulating film layer 1, when the copper layer is electrolyzed, the copper layer cannot be electrolyzed in the position of the insulating film layer 1 in the through hole, so that in the subsequent manufacturing process of the circuit board, a conductive medium is required to be manufactured in the through hole, and the conductive medium can be conductive adhesive or conductive ink; as shown in fig. 5-1 to 5-8, no via hole is formed in the copper-clad plate manufacturing process, and after the copper layer 2 is formed on the insulating film layer 1 in the circuit board manufacturing process, the via hole 4 is punched, and then the conductive medium 7, which may be conductive adhesive, conductive ink, or the like, is formed in the via hole 4.

In a fifth aspect, an embodiment of the present utility model provides a circuit board module, including the copper-clad circuit board of any one of the fourth aspects, on which an electronic component 8 is soldered, the electronic component 8 being soldered on the copper-clad circuit board by tin 81; the electronic component 8 may be a resistor, a capacitor, an LED lamp bead, or the like. The circuit board module is an automobile, a computer or a lamp, and is a lamp strip circuit board, as shown in fig. 1-5, and after LED lamp beads are welded on the lamp strip circuit board, a lamp strip can be formed; it will be appreciated that other products, such as printers, using the copper clad circuit board according to the fourth aspect of the present utility model may be used.

According to the utility model, the conductive adhesive layer is manufactured on the insulating film layer, then the metal copper layer is manufactured on the conductive adhesive layer, and copper is directly electrodeposited on the insulating film through the electrolytic copper foil process, so that the processes of an indirect production method, a glue-free base material method and a sputtering direct method in the prior art are abandoned, the manufacturing efficiency of the conductive adhesive layer is obviously higher than that of the sputtering method, the production efficiency of the copper-clad plate is improved, and meanwhile, the conductive adhesive has better binding force relative to the sputtering layer, so that the adhesive force of the metal copper layer on the insulating film layer is better, and the manufactured copper-clad plate, copper-clad circuit board and other structures are more reliable; compared with the prior art, the conductive adhesive is favorable for simplifying production equipment, avoiding using modified PI films and the like, reducing the manufacturing cost of copper-clad plates and the like, and being favorable for improving the market competitiveness of products.

While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (12)

1. The utility model provides a copper-clad plate which characterized in that includes: the copper layer is positioned on one surface of the insulating film layer, or the copper layer is two layers and is respectively positioned on two surfaces of the insulating film layer; and a conductive adhesive layer is arranged between the copper layer and the insulating film layer, and the copper layer is combined on the insulating film layer through the conductive adhesive layer.

2. The copper-clad plate according to claim 1, wherein: the thickness of the single layer of the conductive adhesive layer is 1um-100 um, the thickness of the insulating film layer is 3um-100 um, and the thickness of the single layer of the copper layer is 1 um-120 um.

3. The copper-clad plate according to claim 1, wherein; the copper layer is two layers, including front copper layer and back copper layer, and the thickness of front copper layer is the same with back copper layer, perhaps the thickness of front copper layer and back copper layer is different.

4. A copper clad laminate according to claim 3, wherein: the conductive adhesive layer is arranged at the side wall of the hole of the through hole, the front copper layer and the back copper layer are connected with each other, the side wall of the hole of the through hole is a copper layer, and the front copper layer and the back copper layer are connected into a whole for conduction; or the conductive adhesive at the side wall of the through hole is disconnected at the position of the insulating film layer, and the front copper layer and the back copper layer do not form an integrated conducting structure at the position of the through hole.

5. The copper-clad plate according to claim 1, wherein: the insulating film layer is a PET layer or a PI layer.

6. A copper clad circuit board comprising: the circuit board comprises an insulating film layer and a copper circuit layer, wherein the copper circuit layer is one layer and is positioned on one side of the insulating film layer to form a single-sided circuit board, or the copper circuit layer is two layers and is respectively positioned on two sides of the insulating film layer to form a double-sided circuit board; the copper wire layer is combined on the insulating film layer through the conductive adhesive layer, a solder resist layer is arranged on the copper wire layer, a wire gap is formed between wires of the copper wire layer, no conductive adhesive is arranged at the wire gap, or conductive adhesive is arranged at the wire gap, and wires at two sides of the wire gap are not communicated by the conductive adhesive.

7. The copper clad circuit board of claim 6 wherein: the thickness of the single layer of the conductive adhesive layer is 1um-100 um, the thickness of the insulating film layer is 3um-100 um, and the thickness of the single layer of the copper circuit layer is 1 um-120 um.

8. The copper clad circuit board of claim 6 wherein: the solder resist layer is bonded to the insulating film layer at all or part of the line gap.

9. A copper clad circuit board according to any one of claims 6 to 8, wherein: the copper-clad circuit board is a double-sided circuit board and comprises a front copper circuit layer, a back copper circuit layer and a conducting hole, wherein the conducting hole penetrates through the front copper circuit layer, the insulating film layer, the back copper circuit layer and the conducting adhesive layer, a conducting medium is arranged in the conducting hole, and the conducting medium conducts the front copper circuit layer and the back copper circuit layer.

10. A copper clad circuit board according to claim 9, wherein: the conductive medium is copper, conductive adhesive or conductive ink.

11. A circuit board module is characterized in that: a copper-clad circuit board comprising any one of claims 6 to 10, on which electronic components are soldered.

12. The circuit board module of claim 11, wherein: the circuit board module is an automobile, a computer or a lamp.