CN218336607U - Solder resist film for circuit board, circuit board and electronic product - Google Patents
Solder resist film for circuit board, circuit board and electronic product Download PDFInfo
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- CN218336607U CN218336607U CN202222023378.6U CN202222023378U CN218336607U CN 218336607 U CN218336607 U CN 218336607U CN 202222023378 U CN202222023378 U CN 202222023378U CN 218336607 U CN218336607 U CN 218336607U
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Abstract
The utility model discloses a solder resist film, circuit board and electronic product for circuit board, wherein the circuit board includes the circuit layer, be provided with the solder resist film on the circuit layer, the solder resist film is single-layer structure, comprises the adhesive layer, perhaps the solder resist film is double-layer structure, comprises adhesive layer and the printing ink layer that is located on the adhesive layer; the solder resist film is positioned on the front side of the circuit board, or the solder resist film is positioned on the back side of the circuit board, or the solder resist film is positioned on the front side and the back side of the circuit board simultaneously. The utility model discloses cancel the substrate on the solder mask, reduced the cost of manufacture of circuit board.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to hinder and weld glued membrane, circuit board and electronic product for circuit board.
Background
The circuit board comprises a circuit layer and a solder mask layer on the surface of the circuit layer, wherein the solder mask layer is used for preventing the circuit layer from being soldered at an unset position.
In the prior art, a cover film is used for manufacturing the solder mask, the cover film is provided with a base material layer, a polyimide (p i) film or a Polyester (PET) film is generally used as a base material, one surface of the base material is coated with glue to manufacture the cover film, and the cover film is pressed and bonded on a bare circuit board to form the solder mask of the circuit board when the circuit board is used. The cover film needs to use a PI film or a PET film as a base material, so that the manufacturing cost of the cover film is high, particularly, if the PI film is used for coating glue to make the cover film, the PI material is expensive, and the PI is a yellow material and is generally not easy to be accepted by consumers; when the cover film is made of the PET film, although the cost of the PET film is lower than that of the PI film, the temperature resistance level of the PET film is low, the soldering temperature cannot exceed 200 ℃ when the circuit board is used, and when lead-free solder paste is used, the soldering temperature is up to more than 250 ℃, and the cover film made of the PET film is damaged. For a circuit board, the requirement for using a solder mask on the circuit board is very huge, and the enterprise burden is heavy.
And the other is to use the ink layer as a solder mask layer to prepare solder mask ink, and specifically, the solder mask ink is directly screen-printed on a bare circuit board to form the solder mask layer. Firstly, a pad window formed by printing with the ink is poor in consistency and easy to generate oil seepage and paste, so that the pad window is reduced and even completely covered, the yield of the manufactured circuit board is influenced, the reliability of subsequent welding of electronic elements and circuit connection is also influenced, and the defective rate is high; secondly, when the thickness of the line layer is too thick, the line gap and the side wall cannot be printed with ink, so that the solder resistance effect is greatly reduced; thirdly, the ink is in a powder structure after being cured, so that the circuit protection of the flexible circuit board is insufficient, and the circuit is easy to break when being bent.
Therefore, it is necessary to improve and optimize the existing solder mask for circuit board and related structure.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a hinder and weld glued membrane, circuit board and electronic product for circuit board has cancelled the substrate on the solder mask, has reduced the cost of manufacture of circuit board.
In a first aspect, an embodiment of the present invention provides a solder resist film for a circuit board, where the solder resist film is a single-layer structure and is composed of an adhesive layer; or the solder resist film is of a double-layer structure and consists of an adhesive layer and an ink layer positioned on the adhesive layer; and a release medium is pasted on the solder resist film and is a carrier of the solder resist film.
Optionally, the ink layer is white or black or green.
Optionally, the adhesive layer is a thermoplastic resin adhesive or a thermosetting resin adhesive.
Optionally, the adhesive layer is a polyurethane resin adhesive, or an acrylic resin adhesive, or an epoxy resin adhesive.
Optionally, the release medium is release paper or release film.
In a second aspect, an embodiment of the present invention provides a circuit board, including a circuit layer, wherein a solder resist film is disposed on the circuit layer, the solder resist film is of a single-layer structure and is formed by an adhesive layer, or the solder resist film is of a double-layer structure and is formed by an adhesive layer and an ink layer on the adhesive layer; the solder resist film is positioned on the front side of the circuit board, or the solder resist film is positioned on the back side of the circuit board, or the solder resist film is positioned on the front side and the back side of the circuit board simultaneously.
Optionally, the circuit board is a single-layer circuit board and includes a front solder mask layer and a back carrier layer, the front solder mask layer is the solder mask film, and the back carrier layer is a cover film or an insulating film; or the front solder mask layer is a cover film, and the back bearing layer is a solder mask film.
Optionally, the circuit board is a double-layer or multi-layer circuit board, and includes a front solder mask layer and a back solder mask layer, the front solder mask layer is a solder mask film, and the back solder mask layer is solder mask ink or a cover film or an insulating film; or the back solder mask layer is a solder mask film, and the front solder mask layer is solder mask ink or a cover film; or the front solder mask layer and the back solder mask layer are both solder mask films.
Optionally, a pad window is arranged on the solder resist film, the pad window penetrates through the solder resist film, and the circuit layer is exposed from the pad window to form a pad; or the solder resist film is not provided with a pad window.
Optionally, the solder resist film is composed of an adhesive layer and an ink layer, and the adhesive layer and the ink layer on the side wall of the pad window are on the same cutting surface.
In a third aspect, an embodiment of the present invention provides an electronic product, including the circuit board according to any embodiment of the second aspect, on which an electronic component is soldered.
Optionally, the electronic product is an LED lighting fixture.
In a fourth aspect, an embodiment of the present invention provides a method for manufacturing a circuit board, including: preparing a release medium; coating an adhesive on a release medium, or coating ink firstly and then coating the adhesive on an ink layer; coating an adhesive and then drying to obtain a solder resist film with a release medium; pressing and bonding a solder resist film with a release medium on a circuit layer of the bare circuit board; and tearing off the release medium to obtain the circuit board with the solder resist film.
Optionally, before the pressing and bonding, punching on the solder resist film by using a punching machine to manufacture a pad window, wherein the pad window penetrates through the release medium and the solder resist film; and pressing and bonding the solder resist film with the pad window and the release medium on the circuit layer of the bare circuit board, and tearing off the release medium.
Optionally, after the solder resist film is pressed and bonded on the circuit layer of the bare circuit board, heating is performed to cure the adhesive, and then the release medium is torn off.
The utility model has the advantages that: the utility model cancels the base materials such as PI film and PET film, changes the parting medium as the carrier for forming the solder resist film, and tears the parting paper after the solder resist film is pressed and bonded on the circuit layer, thereby abandoning the use of expensive base materials such as PI film and PET film in the prior art, obviously reducing the manufacturing cost of the circuit board and being beneficial to reducing the use cost of circuit board manufacturers and consumers; in addition, as base materials such as PI films and PET films are omitted on the manufactured circuit board, the pollution of the circuit board to the environment after being discarded is reduced.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention may be realized and attained by the methods and structures particularly pointed out in the written description and drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the technical aspects of the present invention, are incorporated in and constitute a part of this specification, illustrate embodiments of the present invention, and together with the description serve to explain the principles of the invention.
FIG. 1 is a schematic plane structure diagram (with a pad window) of a solder resist film in an embodiment of the present invention;
fig. 2 is a schematic plan view of a circuit layer in an embodiment of the present invention;
FIG. 3 is a schematic plan view of the circuit board after the solder resist film shown in FIG. 1 is bonded to the circuit layer shown in FIG. 2;
FIG. 4 is a schematic cross-sectional view of a single-layer circuit board at a pad window position (a front surface is a solder resist film of a single-layer structure, and a back surface is an insulating film);
FIG. 5 is a schematic cross-sectional view of a single-layer circuit board at a pad window position (a front surface is a solder resist film of a double-layer structure, and a back surface is an insulating film);
FIG. 6 is a schematic cross-sectional view of a single-layer circuit board at a pad window position (a front side is a cover film with a white oil layer, and a back side is a single-layer structure solder resist film);
FIG. 7 is a schematic cross-sectional view of a single-layer circuit board at a pad window position (the front side is a covering film with a white oil layer, and the back side is a solder resist film with a double-layer structure);
FIG. 8 is a schematic cross-sectional view of a single-layer circuit board at a pad window position (the front side is a solder resist film with a single-layer structure, and the back side is a cover film with a white oil layer);
FIG. 9 is a schematic cross-sectional view of a single-layer circuit board at a pad window position (the front side is a solder resist film with a double-layer structure, and the back side is a cover film with a white oil layer);
FIG. 9-1 is an enlarged view of a portion of FIG. 9;
FIG. 10 is a schematic cross-sectional view of a dual-layer circuit board at a pad window position (the front side is a solder resist film with a single-layer structure, and the back side is solder resist ink);
FIG. 11 is a schematic cross-sectional view of a double-layer circuit board at a pad window position (the front side is solder resist film with a double-layer structure, and the back side is solder resist ink);
FIG. 12 is a schematic cross-sectional view of a dual layer circuit board at a pad window location (solder resist ink on the front side and single layer structure solder resist film on the back side);
FIG. 13 is a schematic cross-sectional view of a dual-layer circuit board at a pad window location (solder resist ink on the front side and solder resist film of a dual-layer structure on the back side);
FIG. 14 is a schematic cross-sectional view of a dual-layer circuit board at a pad window position (a front side is a cover film with a white oil layer, and a back side is a single-layer structure solder resist film);
FIG. 15 is a schematic cross-sectional view of a double-layer circuit board at a pad window position (the front side is a cover film with a white oil layer, and the back side is a solder resist film with a double-layer structure);
FIG. 16 is a schematic cross-sectional view of a double-layer circuit board at a pad window position (the front side is a single-layer structure solder resist film, and the back side is a white oil layer-containing cover film);
FIG. 17 is a schematic cross-sectional view of a double-layer circuit board at a pad window position (the front side is a solder resist film with a double-layer structure, and the back side is a cover film with a white oil layer);
FIG. 17-1 is a partial enlarged view of B in FIG. 17;
fig. 18 is a schematic plane structure diagram of the electronic product (LED strip) after the electronic component (LED lamp bead) is attached to fig. 3;
description of reference numerals: a solder resist film 10, an adhesive layer 11, an ink layer 12 and a pad window 13; the circuit comprises a circuit layer 20, a front circuit layer 21, a back circuit layer 22, an intermediate insulating layer 23 and a circuit glue layer 24; solder resist ink 31, cover film 32, insulating film 33; and an electronic component 40.
Detailed Description
To make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the features of the embodiments and examples described below may be arbitrarily combined with each other without conflict.
The following provides many different embodiments or examples for implementing the methods, structures, and techniques of the present invention.
The embodiment of the first aspect of the present invention provides a solder mask film for a circuit board, wherein the solder mask film 10 is a single-layer structure and is composed of an adhesive layer 11; or the solder resist film 10 is of a double-layer structure and consists of an adhesive layer 11 and an ink layer 12 positioned on the adhesive layer 11; the substrate of materials such as PI membrane, PET membrane among the prior art has been cancelled, for the feasible hinder the glued membrane and can be shaped, when making hinder the glued membrane, with adhesive layer 11 coating on from type paper, perhaps earlier with printing ink layer 12 coating on from type paper, then with adhesive layer 11 coating on printing ink layer 12, utilize from type paper as hindering the carrier of glued membrane, promptly hinder and stick to on the glued membrane 10 and leave type medium, leave type medium is the carrier of hindering the glued membrane, when the in-service use, will hinder the glued membrane 10 pressfitting bond back on the circuit layer, will be torn the abandonment from type paper.
In some embodiments of the present invention, the ink layer 12 is white, black or green, and these colors are common colors for circuit boards and are easily accepted by general consumers, and the ink layer 12 is used as a coloring layer, so that the circuit board after being covered with the solder resist film presents a desired color; it will be appreciated that when ink layer 12 is absent, a desired color of the solder resist film may be obtained by adding a colorant, which in some embodiments may be titanium dioxide, to adhesive layer 11, resulting in a white solder resist film.
In some embodiments of the present invention, the adhesive layer is a thermoplastic resin adhesive, such as polyurethane adhesive; in other embodiments, the adhesive layer 11 may also be a thermosetting resin adhesive, such as an epoxy resin adhesive.
More specifically, in some embodiments of the present invention, the adhesive layer is a polyurethane resin adhesive, or an acrylic resin adhesive, or an epoxy resin adhesive.
In some embodiments of the present invention, the release medium is release paper, and in other embodiments, the release medium is release film.
An embodiment of the second aspect of the present invention provides a circuit board, including a circuit layer 20, a solder resist film 10 is disposed on the circuit layer 20, the solder resist film 10 is a single-layer structure and is composed of an adhesive layer 11, or the solder resist film 10 is a double-layer structure and is composed of an adhesive layer 11 and an ink layer 12 on the adhesive layer; the solder resist film 10 is located on the front side of the circuit board, or the solder resist film 10 is located on the back side of the circuit board, or the solder resist film 10 is located on both the front side and the back side of the circuit board. The circuit layer 20 is provided with solder resist layers, and the number of the solder resist layers is different according to whether the circuit board is a single-layer circuit board, a double-layer circuit board or a multi-layer circuit board (the circuit board with more than three circuit layers is called a multi-layer circuit board in the field habitually, and the circuit board with two circuit layers is called a double-layer circuit board in the field), the solder resist layers can be positioned on the single side of the circuit board, such as a single-layer circuit board, and the solder resist layers can also be positioned on the double sides of the circuit board, such as a double-layer circuit board or a multi-layer circuit board, and the solder resist film can be used as the solder resist layer or not, such as a bearing layer, and the detailed conditions will become clearer in the following description.
As shown in fig. 2 to 9, in some embodiments of the second aspect of the present invention, the circuit board is a single-layer circuit board, and has only one circuit layer 20, the single-layer circuit board includes a front solder mask layer and a back carrier layer, the front solder mask layer is the solder mask film 10, and the back carrier layer can be a cover film 32 or an insulating film 33; or the front solder mask layer is the cover film 32, and the back carrier layer is the solder mask film 10. Specifically, referring to fig. 4, the front solder mask layer of the single-layer circuit board is a single-layer solder mask film, that is, the front solder mask layer is the adhesive layer 11, and the back carrier layer is the insulating film 33; referring to fig. 5, the front solder mask layer of the single-layer circuit board is a solder mask film with a double-layer structure, and includes an adhesive layer 11 and an ink layer 12, and the back carrier layer is an insulating film 33; referring to fig. 6, the front solder mask layer of the single-layer circuit board is a cover film 32, and the back carrier layer is a single-layer solder resist film, i.e., an adhesive layer 11. Considering that the expansion and contraction of the solder resist film are large, when the circuit layer 20 is etched by using an etching method, the solder resist film is generally not suitable for the back bearing layer, and when the solder resist film is used for the back bearing layer, the circuit layer can be manufactured by a die cutting method; referring to fig. 7, the front solder mask layer of the single-layer circuit board is a cover film 32, and the back carrier layer is a solder mask film with a double-layer structure, including an adhesive layer 11 and an ink layer 12; referring to fig. 8, the front solder mask layer of the single-layer circuit board is a single-layer solder mask film, i.e., an adhesive layer 11, and the back carrier layer is a cover film 32; referring to fig. 9, the front solder mask layer of the single-layer circuit board is a solder mask film with a double-layer structure, and includes an adhesive layer 11 and an ink layer 12, and the back carrier layer is a cover film 32.
As shown in fig. 10 to 17, in some embodiments of the second aspect of the present invention, the circuit board is a double-layer circuit board, including a front solder mask layer and a back solder mask layer, the front solder mask layer is a solder resist film 10, and the back solder mask layer is a solder resist ink 31 or a cover film 32 or an insulating film 33; or the back solder mask layer is a solder mask film 10, and the front solder mask layer is solder mask ink 31 or a cover film 32; or the front solder mask layer and the back solder mask layer are both solder mask films 10. The circuit layer 20 of the double-layer circuit board comprises a front circuit layer 21, a back circuit layer 22 and an intermediate insulating layer 23 positioned between the front circuit layer 21 and the back circuit layer 22, wherein the front circuit layer 21 and the back circuit layer 22 are fixedly bonded on the intermediate insulating layer 23 through a circuit glue layer 24. Specifically, as shown in fig. 10, the front solder mask layer is a solder mask film of a single-layer structure, i.e., an adhesive layer 11, and the back solder mask layer is solder mask ink 31; referring to fig. 11, the front solder mask layer is a solder mask film with a double-layer structure, and includes an adhesive layer 11 and an ink layer 12, and the back solder mask layer is solder mask ink 31; referring to fig. 12, the front solder mask layer is solder resist ink 31, and the back solder mask layer is a single-layer solder resist film, i.e., an adhesive layer 11; referring to fig. 13, the front solder mask layer is solder resist ink 31, and the back solder mask layer is a solder resist film with a double-layer structure, including an adhesive layer 11 and an ink layer 12; referring to fig. 14, the front solder mask layer is a cover film 32, and the back solder mask layer is a single-layer solder mask film; referring to fig. 15, the front solder mask layer is a cover film 32, and the back solder mask layer is a solder mask film with a double-layer structure, and includes an adhesive layer 11 and an ink layer 12; referring to fig. 16, the front solder mask layer is a single-layer solder mask film, and the back solder mask layer is a cover film 32; referring to fig. 17, the front solder mask layer is a solder mask film with a two-layer structure, and includes an adhesive layer 11 and an ink layer 12, and the back solder mask layer is a cover film 32. It is understood that the cover film 32 of the back solder resist shown in fig. 17 is replaced by a single-layer structure solder resist film or a two-layer structure solder resist film, that is, a two-layer circuit board in which both solder resist films are formed is formed.
It should be noted that, for the cover film 32 in the prior art, due to the different base materials adopted, the structure of the cover film 32 is slightly different, when the PI film is adopted as the base material, since the PI film is yellow, the color is not easy to be accepted by consumers, especially when the lighting product is manufactured, the cover film using the PI film as the base material generally needs to be white, so the cover film using the PI film as the base material has a three-layer structure, specifically, the base material layer 321 formed by the PI film, the cover film glue layer 322 located on one side of the base material layer, and the white oil layer 323 located on the other side of the base material layer, so that the cover film 32 appears white, and it can be understood that the white oil layer can also be replaced by another color oil layer, such as a black oil layer; when the PET film is used as a base material, the color of the PET film can be accepted by general consumers, so that the cover film can only have a two-layer structure, specifically, the base material layer 321 formed by the PET film and the cover film glue layer 322 positioned on one side of the base material layer, a white oil layer is omitted, but the cover film made of PET can only be used for soldering tin under the condition of being lower than 200 ℃; of course, even if a PET film is used as the base material, a white oil layer or an oil layer of another color may be provided on the other surface of the PET film so that the cover film exhibits a desired color. The insulating film 33 is not provided with a glue layer relative to the cover film 32, that is, the insulating film 33 is directly laminated on the wiring layer, and the cover film 32 is required to be bonded on the wiring layer through the cover film glue layer 322.
In other embodiments of the second aspect of the present invention, the circuit board is a multilayer circuit board, and may be a three-layer circuit board.
In some embodiments of the second aspect of the present invention, a pad window 13 is disposed on the solder resist film 10, the pad window 13 penetrates through the solder resist film 10, the circuit layer is exposed from the pad window 13 to form a pad, for a single-layer circuit board, the solder resist film 10 with the pad window 13 can be used as a front solder resist layer, for a double-layer or multi-layer circuit board, the solder resist film 10 with the pad window 13 can be used as both a front solder resist layer and a back solder resist layer, and electronic components can be soldered on the front and back surfaces of part of the double-layer or multi-layer circuit board, not only limited to front soldering of electronic components; in other embodiments, the solder resist film 10 does not have pad windows thereon, and the solder resist film can be used as a solder resist layer for non-soldered components or as a back carrier layer for a single-layer circuit board.
Hinder and weld glued membrane 10 and hinder and glue membrane 10 by what adhesive layer 11 and printing ink layer 12 constitute, when hindering and seting up the pad window on glued membrane 10, generally block the glued membrane excision with the part through the circular knife and form the pad window, so the adhesive layer 11 and the printing ink layer 12 of pad window lateral wall are on same sword tangent plane, and the at least three defect that printing ink exists as the solder mask among the prior art has been solved completely to the solder mask layer so made, the embodiment of the utility model discloses although include printing ink layer 12 on hindering gluey 10, the pad window uniformity that nevertheless obtains is good, is difficult for producing oil seepage, paste oil, ensures that the circuit board has very high yield, hinders and welds effectually, and is good to the line protection of flexible line board, can not take place the easy cracked problem of taking place of circuit when buckling.
An embodiment of the third aspect of the present invention provides an electronic product, including the circuit board according to any one of the embodiments of the second aspect, wherein the circuit board is welded with an electronic component 40. In some specific embodiments, the electronic product is an LED lighting fixture, and more specifically, may be an LED strip.
An embodiment of the fourth aspect of the present invention provides a method for manufacturing a circuit board.
Example 1:
preparing release paper; coating an adhesive on release paper, wherein the adhesive is an epoxy resin adhesive, the thickness of the adhesive is controlled to be 25 micrometers +/-2 micrometers, drying the adhesive in a dryer after coating the adhesive, the drying temperature is controlled to be 120 ℃, the time is controlled to be 8 minutes, so as to obtain a solder resist film with the release paper, punching a hole on the solder resist film by using a punching machine (in the prior art) to form a pad window, and the pad window penetrates through the release paper and the solder resist film; bonding a solder resist film with release paper on a circuit layer of a bare circuit board by a pressing machine (prior art) in a pressing manner, wherein the circuit layer has only one layer, and removing the release paper to obtain a single-layer circuit board with the solder resist film, wherein in the embodiment, the circuit layer is manufactured by etching a copper foil by an etching method, so that a cover film is covered on the back of the circuit layer before pressing; in other real-time exchange rates, the circuit layer is manufactured by die cutting, so that the bonding covering film is pressed on the back of the circuit layer simultaneously during pressing.
Example 2:
preparing a release film; coating white ink (common ink in the field of circuit boards) on a release film, drying, then coating an adhesive on the ink, wherein the adhesive is polyacrylate adhesive, the thickness of the adhesive is controlled to be 25 micrometers +/-2 micrometers, drying in a dryer after coating the adhesive, the drying temperature is controlled to be 120 ℃, and the drying time is controlled to be 10 minutes, so as to obtain a solder resist film with the release film and the ink; punching a hole on part of the solder resist film by using a punching machine to form a pad window, wherein the pad window penetrates through the release film, the ink layer and the adhesive layer; the solder resist film with the pad window is bonded on the front circuit layer of the bare circuit board through a pressing machine (in the prior art) in a pressing way, the solder resist film without the pad window is bonded on the back circuit layer of the bare circuit board through the pressing machine in a pressing way, and after the pressing is finished, the heating is carried out to cure the adhesive and tear off the release film, so as to prepare the double-layer circuit board with the solder resist film.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (12)
1. A hinder welding glued membrane for circuit board which characterized in that: the solder resist film is of a single-layer structure and consists of an adhesive layer; or the solder resist film is of a double-layer structure and consists of an adhesive layer and an ink layer positioned on the adhesive layer; and a release medium is pasted on the solder resist film and is a carrier of the solder resist film.
2. The solder resist film for a circuit board according to claim 1, characterized in that: the ink layer is white or black or green.
3. The solder resist film for a circuit board according to claim 1, characterized in that: the adhesive layer is thermoplastic resin adhesive or thermosetting resin adhesive.
4. The solder resist film for a circuit board according to claim 1, characterized in that: the adhesive layer is polyurethane resin adhesive, or acrylic resin adhesive, or epoxy resin adhesive.
5. The solder resist film for a wiring board according to any one of claims 1 to 4, wherein: the release medium is release paper or a release film.
6. A circuit board, characterized by: the circuit comprises a circuit layer, wherein a solder resist film is arranged on the circuit layer, the solder resist film is of a single-layer structure and is composed of an adhesive layer, or the solder resist film is of a double-layer structure and is composed of an adhesive layer and an ink layer positioned on the adhesive layer; the solder resist film is positioned on the front side of the circuit board, or the solder resist film is positioned on the back side of the circuit board, or the solder resist film is positioned on the front side and the back side of the circuit board simultaneously.
7. A circuit board according to claim 6, wherein: the circuit board is a single-layer circuit board and comprises a front solder mask layer and a back bearing layer, wherein the front solder mask layer is the solder mask film, and the back bearing layer is a cover film or an insulating film; or the front solder mask layer is a cover film, and the back bearing layer is a solder mask film.
8. A circuit board according to claim 6, wherein: the circuit board is a double-layer or multi-layer circuit board and comprises a front solder mask layer and a back solder mask layer, wherein the front solder mask layer is a solder mask film, and the back solder mask layer is solder mask ink or a cover film or an insulating film; or the back solder mask layer is a solder mask film, and the front solder mask layer is solder mask ink or a cover film; or the front solder mask layer and the back solder mask layer are both solder mask films.
9. A wiring board according to claim 7 or 8, wherein: a bonding pad window is arranged on the solder resist film, penetrates through the solder resist film, and is exposed from the bonding pad window to form a bonding pad; or the solder resist film is not provided with a pad window.
10. A circuit board according to claim 9, wherein: the solder resist film is composed of an adhesive layer and an ink layer, and the adhesive layer and the ink layer on the side wall of the bonding pad window are on the same cutting surface.
11. An electronic product, characterized in that: comprising a wiring board according to any of claims 6-10, on which electronic components are soldered.
12. An electronic product according to claim 11, wherein: the electronic product is an LED lighting lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222023378.6U CN218336607U (en) | 2022-07-27 | 2022-07-27 | Solder resist film for circuit board, circuit board and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222023378.6U CN218336607U (en) | 2022-07-27 | 2022-07-27 | Solder resist film for circuit board, circuit board and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336607U true CN218336607U (en) | 2023-01-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222023378.6U Active CN218336607U (en) | 2022-07-27 | 2022-07-27 | Solder resist film for circuit board, circuit board and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336607U (en) |
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2022
- 2022-07-27 CN CN202222023378.6U patent/CN218336607U/en active Active
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