CN106304622A - A kind of FPC plate - Google Patents
A kind of FPC plate Download PDFInfo
- Publication number
- CN106304622A CN106304622A CN201611001644.8A CN201611001644A CN106304622A CN 106304622 A CN106304622 A CN 106304622A CN 201611001644 A CN201611001644 A CN 201611001644A CN 106304622 A CN106304622 A CN 106304622A
- Authority
- CN
- China
- Prior art keywords
- fpc plate
- plate
- fpc
- stiffening
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 21
- 239000011469 building brick Substances 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 229920001721 polyimide Polymers 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000000047 product Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 description 1
- 229910052683 pyrite Inorganic materials 0.000 description 1
- 239000011028 pyrite Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The application relates to a kind of FPC plate, and including Part I and Part II, Part I includes a FPC plate, the 2nd FPC plate and stiffening plate, and stiffening plate is fixed between a FPC plate and the 2nd FPC plate；Part II is the 3rd FPC plate, and a FPC plate and the 3rd FPC plate connect and be positioned in approximately the same plane.The application uses the mode that FPC plate folds and is combined with stiffening plate, it is possible to substitute the hardboard part in Rigid Flex in prior art, reduces cost and the production cycle of overall FPC plate.And electronic component only needs a paster, reduce SMT production cost.
Description
Technical field
The application relates to wiring board techniques field, specifically, relating to a kind of FPC plate.
Background technology
Rigid Flex, is by flexible PCB (Flexible Printed Circuit, FPC) and rigid printed circuit
Plate (Printed Circuit Board, PCB) is combined by process for pressing, is formed and has FPC characteristic and PCB simultaneously
The circuit board of characteristic.Its existing certain flexure region, also has certain rigid region.The use of Rigid Flex can cover
Whole applications of FPC Yu PCB, such as, in the mobile terminals such as smart mobile phone, panel computer, liquid crystal display, be conducive to
Save interiors of products space, reduce finished-product volume, enhance product performance.But, existing Rigid Flex production process is various,
Production difficulty is big, and yields is relatively low, and thrown material, manpower are more, and therefore, its price comparison is expensive, and the production cycle is long.Cause
This, it is desirable to provide a kind of new FPC plate is to replace existing Rigid Flex.
In consideration of it, special, the application is proposed.
Summary of the invention
The purpose of the application is to propose a kind of FPC plate.
In order to complete the purpose of the application, the technical scheme of employing is:
The application relates to a kind of FPC plate, and it includes that Part I and Part II, described Part I include a FPC
Plate, the 2nd FPC plate and stiffening plate, described stiffening plate is fixed between a described FPC plate and described 2nd FPC plate；Described
Two parts are the 3rd FPC plate, and a described FPC plate is connected with described 3rd FPC plate and is positioned in approximately the same plane.
Preferably, a described FPC plate, described 2nd FPC plate be identical with described stiffening plate shape and coincident.
Preferably, described stiffening plate material is polyimides, steel or FR4 grade material.
Preferably, also include that electronic building brick, described electronic building brick are mounted on a described FPC plate and described 2nd FPC plate
Outer surface.
Preferably, also including connecting portion, a described FPC plate is connected with described 2nd FPC plate by described connecting portion, with
Realize a described FPC plate and the folding of described 2nd FPC plate.
Preferably, described connecting portion has the first side not being connected with a described FPC plate, described 2nd FPC plate
With the second side, described first side is relative with described second side, and described first side and described second side are recessed
The face of falling into, the depression direction of described concave face is the relatively close direction in described first side and described second side.
Preferably, a described FPC plate, described connecting portion and described 2nd FPC plate are integrated.
Preferably, also include that USB element, described USB element are positioned on described 3rd FPC plate.
The application further relates to the preparation method of described FPC plate, including:
[1] described 2nd FPC plate is made, and an interconnective described FPC plate and described 3rd FPC plate；
[2] described stiffening plate is fixed between a described FPC plate and described 2nd FPC plate.
Preferably, described method includes:
1) on same FPC plate, make FPC plate front body, described FPC plate front body include a described FPC plate, described the
Two FPC plates, described connecting portion and described 3rd FPC plate；
2) by described connecting portion fold described 2nd FPC plate, and described stiffening plate is fixed on a described FPC plate and
Between described 2nd FPC plate；
3) laminating electronic building brick on a described FPC plate and described 2nd FPC plate.
Preferably, step 2) in, first described stiffening plate is fixed with a described FPC plate, then rolled over by described connecting portion
Folded described 2nd FPC plate, then fixes described stiffening plate with described 2nd FPC plate.
Preferably, step 2) in, by double faced adhesive tape or conducting resinl by described stiffening plate and a described FPC plate and described the
Two FPC plate pressings.
The technical scheme of the application at least has a following beneficial effect:
Existing Rigid Flex not only production process is various, difficulty is big, yield is low, and thrown material, manpower are more, valency
Lattice are expensive, and the production cycle is long, bring impact to end product competitiveness.The application uses FPC plate fold and be combined with stiffening plate
Mode, can substitute the hardboard part in Rigid Flex in prior art, reduces cost and the production cycle of overall FPC plate.
Additionally, the electronic component on the Rigid Flex two sides of routine needs just can be completed, in the application by twice paster
Preferably in technical scheme, only carry out a paster, then carry out folding the device paster that just can realize FPC plate two sides, reduce
Electronic circuit surface installation technique (SMT) production cost.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of the application FPC plate；
Fig. 2 is the structure schematic diagram of the application FPC plate；
Fig. 3 is the side structure schematic diagram of the application FPC plate；
Fig. 4 is the Facad structure schematic diagram before the laminating of the application FPC plate；
Fig. 5 is the structure schematic diagram before the laminating of the application FPC plate.
Wherein:
1-Part I；
11-the oneth FPC plate；12-the 2nd FPC plate；13-stiffening plate；
2-Part II (the 3rd FPC plate)；
3-electronic building brick；
4-connecting portion；
41-the first side；42-the second side；
5-USB element；
Detailed description of the invention
Below by specific embodiment and combine accompanying drawing the application is described in further detail.Described in literary composition
"front", "rear", "left", "right", " on ", D score is all with the laying state of the FPC plate in accompanying drawing and FPC plate as reference.Should be understood that
These embodiments are merely to illustrate the application rather than limit scope of the present application.
The application relates to a kind of FPC plate, can be used in the electronic products such as mobile phone, computer, display.The present embodiment is with mobile phone
Its structure is described, as shown in Figures 1 to 3 as a example by FPC plate.This FPC plate includes Part I 1 and Part II 2.Wherein, first
Dividing 1 to include FPC plate the 11, the 2nd FPC plate 12 and a stiffening plate 13, stiffening plate 13 is fixed on FPC plate 11 and a 2nd FPC plate
Between 12.Use stiffening plate 13 can add strong hardness, strengthen using the thickness in this region of stiffening plate 13, to carry patch simultaneously
The electronic building brick 3 of dress and be easy in electronic product install, thus realize the partial function of hardboard in Rigid Flex.Second
Dividing 2 is the 3rd FPC plate 2, and for the soft board region in conventional Rigid Flex, a FPC plate 11 is connected with the 3rd FPC plate 2 and position
In approximately the same plane, maintain the overall structure of this FPC plate.
As a kind of improvement of the application FPC plate, FPC plate the 11, a 2nd FPC plate 12 identical with stiffening plate 13 shape and
Coincident.So design makes this FPC plate be difficult to from the faying face of Part I 1 to split, it is ensured that integrally-built stable.
As a kind of improvement of the application FPC plate, stiffening plate 13 material is polyimides, steel or FR4 grade material.Wherein
Polyimides is one of optimal high-molecular organic material of combination property, high temperature resistant reaches more than 400 DEG C, is widely used in microelectronics neck
Territory, price is higher than FR4 grade material but firing resistance is good.FR4 is the code name of a kind of flame resistant material grade, and the representative meaning is
Resin material allows for a kind of material specification of self-extinguish through fired state, and it is not a kind of title material, but one
Planting material rate, therefore current FR4 grade material used by general circuit plate just has very many kinds.It is typically used as reinforcing material
The FR4 grade material of material is the composite made plus filler and glass fibre with epoxy resin, its water absorption rate is low,
Durability intensity good, curved is good.
In above-mentioned three kinds of stiffening plate materials, the flatness of steel disc and good heat dispersion performance, it is possible to reduce because of FPC plate flatness
The imageing sensor image quality caused is poor (surrounding definition is different), and the problem that electronic device is the most overheated.But
It is that different electronic devices are different to the thickness requirement of FPC plate.The device relatively thin for thickness requirement is preferably used steel disc, works as device
When part thickness is thicker, owing to the thickness of a FPC plate 11 and the 2nd FPC plate 12 is basically unchanged, need to increase accordingly reinforcement
The thickness of plate 13, blocked up steel disc causes FPC plate overall weight excessive, it is therefore desirable to use the less polyimides of density or
FR4 grade material.
The method preparing above-mentioned FPC plate includes: make the 2nd FPC plate 12, and an interconnective FPC plate 11 and the
Three FPC plates 2, are then fixed on stiffening plate 13 between a FPC plate 11 and the 2nd FPC plate 12.
As a kind of improvement of the application FPC plate, also include electronic building brick 3.Specifically, this electronic building brick 3 can be many
Individual, such as resistance, electric capacity, electronic chip, diode etc..Above-mentioned multiple electronic building brick 3, according to certain regular array, welds or pastes
It is loaded on FPC plate 11 and an outer surface for the 2nd FPC plate 12, to realize the function of FPC plate further.
As a kind of improvement of the application FPC plate, also include connecting portion 4.As shown in Figures 4 and 5, a FPC plate 11 passes through
Connecting portion 4 is connected with the 2nd FPC plate 12, to realize FPC plate 11 and a folding for the 2nd FPC plate 12.In the present embodiment,
One FPC plate 11 is connected with each other with the 3rd FPC plate 2, and the 2nd FPC plate 12 is connected with a FPC plate 11 by connecting portion 4.This feelings
Under condition, an interconnective FPC plate 11, connecting portion the 4, the 2nd FPC plate 12 and the 3rd FPC can be made on one block of FPC plate
Plate 2, before laminating, four are integrated, and are then folded the 2nd FPC plate 12 by connecting portion 4 and are completed the patch of stiffening plate 13
Close, save procedure of processing.
As a kind of design of connecting portion 4, as shown in Figures 4 and 5, connecting portion 4 has not with a FPC plate
11, the first side 41 and the second side 42 that the 2nd FPC plate 12 is connected, the first side 41 is relative with the second side 42 and is recessed
The face of falling into, the depression direction of concave face is the relatively close direction in the first side 41 and the second side 42.It can be seen that connecting portion
The length of 4 in the vertical directions is less than FPC plate 11 and a length for the 2nd FPC plate 12 in the vertical direction, so can make
Folded edge is more neat, and reduces FPC plate 11 and an electrical connection area for the 2nd FPC plate 12, prevents FPC plate entirety from leading
Logical.Certainly, connecting portion 4 may also take on alternate manner design.
As a kind of improvement of the application FPC plate, also including USB element 5, it is positioned on the 3rd FPC plate 2.This USB element
5 can be described as golden finger in a broad sense, are made up of the conductive contact blade of numerous surface gold-plating or pyrite, are used for transmitting signal.Concrete real
Example is memory bank, card slot etc..
When FPC plate includes connecting portion 4, its preparation method includes:
1) on same FPC plate make FPC plate front body, FPC plate front body include FPC plate the 11, a 2nd FPC plate 12,
Connecting portion 4 and the 3rd FPC plate 2；
2) fold the 2nd FPC plate 12 by connecting portion 4, and stiffening plate 13 is fixed on FPC plate 11 and a 2nd FPC plate
Between 12；
3) laminating electronic building brick 3 on a FPC plate 11 and the 2nd FPC plate 12.
As a kind of improvement of the method, step 2) in, due to after folding a FPC plate 11 with the 3rd FPC plate 2 same
In plane, first the one side of stiffening plate 13 can be fixed with a FPC plate 11, then fold the 2nd FPC plate 12 by connecting portion 4,
Then another side and the 2nd FPC plate 12 of stiffening plate 13 are fixed.Although can also be first by the one side of stiffening plate 13 and the 2nd FPC
Plate 12 is fixed, and then folds the 2nd FPC plate 12 and another side and a FPC plate 11 of stiffening plate 13 is fixed, but substantially using
The first folding mode stiffening plate 13 difficult drop-off.
In actual production, needs are according to the thickness of the internal structure design FPC plate of different electronic products.Hardboard part
Thickness can increase supporting material between which realize by after folding a FPC plate 11 and the 2nd FPC plate 12.Full
Foot thickness requirement.The FPC plate finally obtained is the finished product after FPC plate 11+ stiffening plate 13+ the 2nd FPC plate 12 pressing.Enter one
Step ground, step 2) in, by double faced adhesive tape or conducting resinl by stiffening plate 13 and FPC plate 11 and the 2nd FPC plate 12 pressing.
Specifically, different glue is selected to bond according to the difference of stiffening plate material.When stiffening plate 13 is steel disc, for
Meet ground connection needs, use conductive adhesive.When stiffening plate 13 is PI or FR4, double faced adhesive tape is used to carry out bonding, the most two-sided
The cost conducting resinl to be less than of glue.It is exemplified below:
As being 0.4mm to the thickness requirement of final products FPC plate, FPC plate 11 and a minimum thickness for the 2nd FPC plate 12
Be 0.1mm, then, after a FPC plate 11 and the 2nd FPC plate 12 doubling, stiffening plate 13 thickness should be 0.2mm, now stiffening plate 13
Steel disc can only be selected, use conductive adhesive.
As being 0.8mm to the thickness requirement of final products FPC plate, FPC plate 11 and a minimum thickness for the 2nd FPC plate 12
For 0.1mm, then, after a FPC plate 11 and the 2nd FPC plate 12 doubling, stiffening plate 13 thickness should be 0.8mm, and now stiffening plate 13 can
Select PI or FR4, use double faced adhesive tape bonding.
The application uses the mode that FPC plate folds and is combined with stiffening plate, it is possible to substitute Rigid Flex in prior art
In hardboard part, reduce cost and the production cycle of overall FPC plate.And electronic component only needs a paster, reduce SMT raw
Produce cost.
Although the application is open as above with preferred embodiment, but is not for limiting claim.Any this area skill
Art personnel, on the premise of conceiving without departing from the application, can make some possible variations and amendment, therefore the application
Protection domain should be defined in the range of standard with claim.
Claims (10)
1. a FPC plate, it is characterised in that it includes Part I and Part II,
Described Part I includes that a FPC plate, the 2nd FPC plate and stiffening plate, described stiffening plate are fixed on a described FPC plate
And between described 2nd FPC plate；
Described Part II is the 3rd FPC plate, and a described FPC plate is connected with described 3rd FPC plate and is positioned at approximately the same plane
On.
FPC plate the most according to claim 1, it is characterised in that a described FPC plate, described 2nd FPC plate and described benefit
Strong plate shape is identical and coincident.
FPC plate the most according to claim 1, it is characterised in that described stiffening plate material is polyimides, steel or FR4 etc.
Level material.
FPC plate the most according to claim 1, it is characterised in that also include that electronic building brick, described electronic building brick are mounted on institute
State a FPC plate and the outer surface of described 2nd FPC plate.
FPC plate the most according to claim 4, it is characterised in that also include connecting portion, a described FPC plate is by described
Connecting portion is connected with described 2nd FPC plate, to realize a described FPC plate and the folding of described 2nd FPC plate.
FPC plate the most according to claim 5, it is characterised in that have on described connecting portion not with a described FPC plate,
The first side that described 2nd FPC plate is connected and the second side, described first side is relative with described second side, and described the
One side and described second side are concave face, and the depression direction of described concave face is described first side and described second side
The direction that face is relatively close.
FPC plate the most according to claim 5, it is characterised in that a described FPC plate, described connecting portion and described second
FPC plate is integrated.
8. the preparation method of FPC plate as claimed any one in claims 1 to 3, it is characterised in that including:
[1] described 2nd FPC plate is made, and an interconnective described FPC plate and described 3rd FPC plate；
[2] described stiffening plate is fixed between a described FPC plate and described 2nd FPC plate.
9. the preparation method of FPC plate as according to any one of claim 5 to 7, it is characterised in that including:
1) making FPC plate front body on same FPC plate, described FPC plate front body includes a described FPC plate, described 2nd FPC
Plate, described connecting portion and described 3rd FPC plate；
2) fold described 2nd FPC plate by described connecting portion, and described stiffening plate is fixed on a described FPC plate and described
Between 2nd FPC plate；
3) laminating electronic building brick on a described FPC plate and described 2nd FPC plate.
Method the most according to claim 9, it is characterised in that step 2) in, first by described stiffening plate and described first
FPC plate is fixed, then folds described 2nd FPC plate by described connecting portion, then that described stiffening plate is solid with described 2nd FPC plate
Fixed, preferably pass through double faced adhesive tape or conducting resinl by described stiffening plate and a described FPC plate and described 2nd FPC plate pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611001644.8A CN106304622A (en) | 2016-11-11 | 2016-11-11 | A kind of FPC plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611001644.8A CN106304622A (en) | 2016-11-11 | 2016-11-11 | A kind of FPC plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304622A true CN106304622A (en) | 2017-01-04 |
Family
ID=57721325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611001644.8A Pending CN106304622A (en) | 2016-11-11 | 2016-11-11 | A kind of FPC plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304622A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110875544A (en) * | 2018-08-31 | 2020-03-10 | 努比亚技术有限公司 | Folding connector and terminal |
| CN113225899A (en) * | 2021-04-28 | 2021-08-06 | 广州立景创新科技有限公司 | Electronic device |
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| CN201114998Y (en) * | 2007-09-27 | 2008-09-10 | 惠州市蓝微电子有限公司 | A soft and hard combination board structure |
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| CN113225899A (en) * | 2021-04-28 | 2021-08-06 | 广州立景创新科技有限公司 | Electronic device |
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