CN113225899A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN113225899A CN113225899A CN202110466682.5A CN202110466682A CN113225899A CN 113225899 A CN113225899 A CN 113225899A CN 202110466682 A CN202110466682 A CN 202110466682A CN 113225899 A CN113225899 A CN 113225899A
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- CN
- China
- Prior art keywords
- substrate
- reinforcing plate
- electronic device
- end edge
- edge area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
An electronic device with good assembly yield is provided. The electronic device comprises a first substrate, a second substrate and a first reinforcing plate. The first reinforcing plate is positioned between the first substrate and the second substrate. The first reinforcing plate is provided with a side face, a first surface and a second surface, the first surface faces the first substrate, the second surface faces the second substrate, the side face is connected with the first surface and the second surface, and the first reinforcing plate is provided with an R-shaped chamfer part in an end edge area where the first surface and the side face are connected or an end edge area where the second surface and the side face are connected.
Description
Technical Field
The present invention relates to electronic devices, and particularly to an electronic device with a stiffener.
Background
Generally, in electronic products, a Flexible Printed Circuit Board (FPC Board) is commonly used as a Circuit carrier, which is a Printed Circuit made of a Flexible substrate, and the Flexible Printed Circuit Board can be freely bent and randomly arranged according to a spatial layout, so that the volume of the electronic product can be reduced during an assembly process, and the electronic product can meet the configuration requirement of high-density electronic components.
However, the flexible printed circuit board needs to be matched with a reinforced steel sheet to improve the structural strength of the electronic product. However, the reinforcing steel sheet of the conventional flexible substrate is usually formed by etching or general stamping, and has a sharp corner after forming, so that the flexible substrate is easily scratched during assembly, thereby affecting the assembly yield of electronic products.
Disclosure of Invention
The invention provides an electronic device with good assembly yield.
The electronic device comprises a first substrate, a second substrate and a first reinforcing plate. The first reinforcing plate is positioned between the first substrate and the second substrate. The first reinforcing plate is provided with a side face, a first surface and a second surface, the first surface faces the first substrate, the second surface faces the second substrate, the side face is connected with the first surface and the second surface, and the first reinforcing plate is provided with an R-shaped chamfer part in an end edge area where the first surface and the side face are connected or an end edge area where the second surface and the side face are connected.
In an embodiment of the invention, the first surface of the first reinforcing plate contacts the first substrate, and an end edge region where the first surface and the side surface meet has an R-shaped chamfered portion.
In an embodiment of the invention, the second surface of the first reinforcing plate contacts the second substrate, and an end edge region where the second surface and the side surface meet has an R-shaped chamfered portion.
In an embodiment of the invention, the side surface is a curved surface.
In an embodiment of the invention, the first reinforcing plate has a rectangular structure in a plan view, and four corners of the rectangular structure are formed as R-shaped chamfers.
In an embodiment of the invention, the first substrate has a first plate edge area, the second substrate has a second plate edge area, and the first reinforcing plate is located in the first plate edge area of the first substrate.
In an embodiment of the invention, the electronic device further includes a second stiffener. The second reinforcing plate is located in a second plate area of the second substrate.
Based on the above, through the structure of the R-shaped chamfered portion of the end edge region of the first reinforcing plate, the risk that the first reinforcing plate scratches the first substrate or the second substrate of the electronic device during the assembly of the electronic device can be avoided, and the assembly yield of the electronic device can be improved.
Drawings
Fig. 1 is an isolated schematic view of a partial structure of the interior of an electronic device according to an embodiment of the invention;
FIG. 2A is a schematic top view of a first stiffener plate of the electronic device of FIG. 1;
FIG. 2B is a schematic cross-sectional view of the first reinforcing plate of FIG. 2A;
FIG. 3A is a schematic view of a stamping process of the first reinforcing plate of FIG. 2A;
fig. 3B is a side view schematically illustrating a process of punching the R-shaped chamfered portion of the first reinforcing plate of fig. 3A.
[ description of reference numerals ]
100: an electronic device;
110: a first substrate;
110R: a first board edge region;
120: a second substrate;
120R: a second panel edge region;
130: a first reinforcing plate;
140: a second reinforcing plate;
CR: an R-shaped chamfered portion;
c: a corner portion;
r1: a first region;
r2: a second region;
r3: a third region;
s1: a first surface;
s2: a second surface;
and SS: a side surface.
Detailed Description
Fig. 1 is a separated schematic view of a partial structure of the inside of an electronic device according to an embodiment of the invention. Fig. 2A is a schematic top view of a first reinforcing plate of the electronic device of fig. 1. Fig. 2B is a schematic cross-sectional view of the first reinforcing plate of fig. 2A. Referring to fig. 1, an electronic device 100 of the present embodiment includes a first substrate 110, a second substrate 120, a first reinforcing plate 130, and a second reinforcing plate 140. For example, in the embodiment, the first substrate 110 and the second substrate 120 are made of flexible base materials, and the first reinforcing plate 130 and the second reinforcing plate 140 are made of steel sheets, so as to reinforce the structural strength of the electronic device 100. In addition, in the embodiment, the thickness of the first reinforcing plate 130 is, for example, between 0.1 and 0.3 mm, but the invention is not limited thereto.
Specifically, as shown in fig. 1, in the present embodiment, the first reinforcing plate 130 is located between the first substrate 110 and the second substrate 120, and the second reinforcing plate 140 is located on the second substrate 120. As shown in fig. 1, the first substrate 110 has a first plate edge region 110R, and the second substrate 120 has a second plate edge region 120R, wherein the first reinforcing plate 130 is located in the first plate edge region 110R of the first substrate 110, and the second reinforcing plate 140 is located in the second plate edge region 120R of the second substrate 120. It is noted that, for convenience of understanding, fig. 1 is drawn in a manner that the first substrate 110 and the second substrate 120 are separated from each other, however, in practice, after the electronic device 100 is assembled, the first substrate 110 and the second substrate 120 are stacked on each other, and the first surface S1 of the first reinforcing plate 130 located between the first substrate 110 and the second substrate 120 is in contact with the first substrate 110, and the second surface S2 of the first reinforcing plate 130 is in contact with the second substrate 120.
Further, as shown in fig. 1 to 2B, the first reinforcing plate 130 has a side SS, a first surface S1 and a second surface S2, the first surface S1 faces the first substrate 110, the second surface S2 faces the second substrate 120, the side SS connects the first surface S1 and the second surface S2, and the side SS is a curved surface. Further, as shown in fig. 2A, in the present embodiment, the first reinforcing plate 130 has a rectangular structure in a plan view, and four corners C of the rectangular structure are formed as R-shaped chamfers. On the other hand, in the present embodiment, the first reinforcing plate 130 has the R-shaped chamfered portion CR in the edge region where the first surface S1 meets the side surface SS or in the edge region where the second surface S2 meets the side surface SS. As shown in fig. 2B, the edge region where the first surface S1 meets the side surface SS has an R-shaped chamfered portion CR, and the edge region where the second surface S2 meets the side surface SS also has an R-shaped chamfered portion CR.
Thus, after the electronic device 100 is assembled, the risk that the first reinforcing plate 130 scratches the first substrate 110 or the second substrate 120 during assembly can be avoided by the structure of the R-shaped chamfered portion CR of the end edge region of the first reinforcing plate 130, so as to improve the assembly yield of the electronic device 100.
The process of forming the R-shaped chamfered portion CR in the edge region of the first reinforcing plate 130 will be further described below with reference to fig. 3A and 3B.
Fig. 3A is a schematic view of a stamping process of the first reinforcing plate 130 of fig. 2A. Fig. 3B is a side view schematically illustrating a process of punching the R-shaped chamfered portion CR of the first reinforcing plate 130 of fig. 3A. As shown in fig. 3A, in performing the stamping process of the first reinforcing plate 130, punched holes may be formed on both sides of the steel sheet material used to form the first reinforcing plate 130 (as shown in a first region R1 of fig. 3A). Next, the first reinforcing plate 130 is punched out by a punch in a structure of four corners C of the rectangular structure in a plan view (as shown in a second region R2 in fig. 3A). Next, the structure of the R-shaped chamfered portion CR in the end edge region of the first reinforcing plate 130 is punched out by another punch (as shown in a third region R3 in fig. 3A). Finally, as shown in fig. 3A and 3B, the first reinforcing plate 130 is trimmed once again to obtain the overall structure of the first reinforcing plate 130.
In summary, the R-shaped chamfered portion of the end edge region of the first reinforcing plate can prevent the first reinforcing plate from scratching the first substrate or the second substrate of the electronic device during the assembly of the electronic device, thereby improving the assembly yield of the electronic device.
Claims (7)
1. An electronic device, comprising:
a first substrate;
a second substrate; and
the first reinforcing plate is positioned between the first substrate and the second substrate, the first reinforcing plate is provided with a side surface, a first surface and a second surface, the first surface faces the first substrate, the second surface faces the second substrate, the side surface is connected with the first surface and the second surface, and the first reinforcing plate is provided with an R-shaped chamfer part in an end edge area where the first surface and the side surface are connected or an end edge area where the second surface and the side surface are connected.
2. The electronic device according to claim 1, wherein the first surface of the first reinforcing plate is in contact with the first substrate, and an end edge region where the first surface meets the side surface has the R-shaped chamfered portion.
3. The electronic device according to claim 1, wherein the second surface of the first reinforcing plate is in contact with the second substrate, and an end edge region where the second surface meets the side surface has the R-shaped chamfered portion.
4. The electronic device of claim 1, wherein the side surface is a curved surface.
5. The electronic device according to claim 1, wherein the first reinforcing plate has a rectangular structure in a plan view, and four corners of the rectangular structure are formed as R-shaped chamfers.
6. The electronic device of claim 1, wherein the first substrate has a first board edge area and the second substrate has a second board edge area, wherein the first stiffener is located in the first board edge area of the first substrate.
7. The electronic device of claim 6, further comprising:
a second reinforcing plate located in the second plate region of the second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110466682.5A CN113225899A (en) | 2021-04-28 | 2021-04-28 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110466682.5A CN113225899A (en) | 2021-04-28 | 2021-04-28 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113225899A true CN113225899A (en) | 2021-08-06 |
Family
ID=77089621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110466682.5A Pending CN113225899A (en) | 2021-04-28 | 2021-04-28 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113225899A (en) |
Citations (17)
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| CN200966186Y (en) * | 2006-09-30 | 2007-10-24 | 比亚迪股份有限公司 | A flexible printed circuit product |
| JP2008021682A (en) * | 2006-07-10 | 2008-01-31 | Sharp Corp | Flexible printed wiring board, reinforcement board, optical pickup device, and electronic apparatus |
| JP2010028003A (en) * | 2008-07-24 | 2010-02-04 | Panasonic Corp | Wiring substrate |
| CN203233591U (en) * | 2013-03-27 | 2013-10-09 | 信利光电股份有限公司 | Reinforcing plate and circuit board |
| CN203884079U (en) * | 2014-04-25 | 2014-10-15 | 东莞新能德科技有限公司 | Battery protection circuit board |
| CN205645789U (en) * | 2016-03-25 | 2016-10-12 | 邓力 | Ic chip module |
| CN106304622A (en) * | 2016-11-11 | 2017-01-04 | 深圳天珑无线科技有限公司 | A kind of FPC plate |
| CN206136449U (en) * | 2016-11-11 | 2017-04-26 | 深圳天珑无线科技有限公司 | FPC board |
| CN206851137U (en) * | 2017-07-07 | 2018-01-05 | 信利半导体有限公司 | A kind of full duration reinforcing flexible circuit board |
| CN108494904A (en) * | 2018-02-28 | 2018-09-04 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
| CN207817356U (en) * | 2018-03-07 | 2018-09-04 | 信利光电股份有限公司 | A kind of flexible PCB and liquid crystal display die set |
| CN208434175U (en) * | 2018-08-10 | 2019-01-25 | 信利光电股份有限公司 | A kind of FPC golden finger structure |
| CN208434179U (en) * | 2018-08-09 | 2019-01-25 | 信利光电股份有限公司 | A kind of circuit board |
| CN110402016A (en) * | 2019-07-31 | 2019-11-01 | Oppo（重庆）智能科技有限公司 | Flexible circuit board component |
| CN110830639A (en) * | 2019-10-28 | 2020-02-21 | 维沃移动通信有限公司 | Electronic equipment |
| CN212463612U (en) * | 2020-06-03 | 2021-02-02 | 深圳市合力泰光电有限公司 | Circuit board structure and flexible circuit board |
| CN212786016U (en) * | 2020-08-11 | 2021-03-23 | 深圳市蓝特电路板有限公司 | FPC easy to assemble |
-
2021
- 2021-04-28 CN CN202110466682.5A patent/CN113225899A/en active Pending
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008021682A (en) * | 2006-07-10 | 2008-01-31 | Sharp Corp | Flexible printed wiring board, reinforcement board, optical pickup device, and electronic apparatus |
| CN200966186Y (en) * | 2006-09-30 | 2007-10-24 | 比亚迪股份有限公司 | A flexible printed circuit product |
| JP2010028003A (en) * | 2008-07-24 | 2010-02-04 | Panasonic Corp | Wiring substrate |
| CN203233591U (en) * | 2013-03-27 | 2013-10-09 | 信利光电股份有限公司 | Reinforcing plate and circuit board |
| CN203884079U (en) * | 2014-04-25 | 2014-10-15 | 东莞新能德科技有限公司 | Battery protection circuit board |
| CN205645789U (en) * | 2016-03-25 | 2016-10-12 | 邓力 | Ic chip module |
| CN106304622A (en) * | 2016-11-11 | 2017-01-04 | 深圳天珑无线科技有限公司 | A kind of FPC plate |
| CN206136449U (en) * | 2016-11-11 | 2017-04-26 | 深圳天珑无线科技有限公司 | FPC board |
| CN206851137U (en) * | 2017-07-07 | 2018-01-05 | 信利半导体有限公司 | A kind of full duration reinforcing flexible circuit board |
| CN108494904A (en) * | 2018-02-28 | 2018-09-04 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
| CN207817356U (en) * | 2018-03-07 | 2018-09-04 | 信利光电股份有限公司 | A kind of flexible PCB and liquid crystal display die set |
| CN208434179U (en) * | 2018-08-09 | 2019-01-25 | 信利光电股份有限公司 | A kind of circuit board |
| CN208434175U (en) * | 2018-08-10 | 2019-01-25 | 信利光电股份有限公司 | A kind of FPC golden finger structure |
| CN110402016A (en) * | 2019-07-31 | 2019-11-01 | Oppo（重庆）智能科技有限公司 | Flexible circuit board component |
| CN110830639A (en) * | 2019-10-28 | 2020-02-21 | 维沃移动通信有限公司 | Electronic equipment |
| CN212463612U (en) * | 2020-06-03 | 2021-02-02 | 深圳市合力泰光电有限公司 | Circuit board structure and flexible circuit board |
| CN212786016U (en) * | 2020-08-11 | 2021-03-23 | 深圳市蓝特电路板有限公司 | FPC easy to assemble |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210806 |
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| WD01 | Invention patent application deemed withdrawn after publication |