200930226 九、發明說明： •【發明所屬之技術領域】 本發月係關力種印刷電路板堆疊結構，尤其係關於 -種用於可攜式電子裝置之印刷電路板堆疊結構。 【先前技術】 電子設備中之電路板、導線及電子元件等在工作時會 =南頻之電磁波，對電子產品之正常工作造成干擾，同 ❹夕；说“ 產生危害。為了降低電磁波 干擾及輪射’習知技術中常採用屏蔽裝置將電路板、導 2及電子元件等罩設於其内，以達到屏蔽電磁波之目的。 片==品之微型化且功能越來越多，逐漸需要多 f電路板同時存在於同—電子產品之情況，即在電子產品 中出現印刷電路板堆疊結構。 =閱圖！，印刷電路板堆疊結構1〇包括一第一印刷 反2、一與該第一印刷電路板12相互堆疊之一第二 〇=路板14、一第一屏蔽罩16、一第二屏蔽㈣及： 及第Η:第一印刷電路板12包括—第-表面122 電路板：二 2相對之第二表面124。該第二印刷 包括一第一表面142及一與該第—表面M2相對 一，面144。該第一印刷電路板12之第—表面⑵與 =二:：電路板二4之第一表面142通過所述連接器Μ 14電性遠接現該第楚印刷電路板12與該第二印刷電路板 二連接。該第一印刷電路板12之第二表面以上役 有-電子元件126,且該電子元件126通過該第一屏蔽 6 200930226 罩U封閉。該第二印刷電路板14之第二表面i44上設置 •有電子元件146,且該電子元件146通過該第二屏蔽罩18 封閉。 、由於該第一印刷電路板12與該第二印刷電路板14之 j通過所述連接器19連接，而所述缚接器19具有一定之 n度，使得該印刷電路板堆疊結構1〇之整體高度增加，不 ，製造輕薄之可攜式電子裝置。同時，該印刷電路板堆 :結構10需通過二屏蔽罩分別對該第一印刷電路板。及 f —印刷電路板14進行屏蔽，減，使該㈣電路板堆疊 …構10之成本較高。 【發明内容】 、、繁於上述内容’有必要提供—種能降低高度且節省製 造成本之印刷電路板堆疊結構。 -種印刷電路板堆疊結構，其包括—第—印刷電路板 及-與該第一印刷電路板相互堆疊之第二印刷電路板，該 f一印刷電路板及該第二印刷電路板相對之表面至少 ，置有一電子元件，該第一印刷電路板還設置有一第—屏 ^架’該第二印刷電路板設置有—第二屏蔽架，該第— 蔽架與該第二屏蔽架相互卡合以屏蔽所述電子元件。 相較習知技術，本發明所述印刷電路板堆疊結構，利 用該第 一屏蔽架之設置將該第一印刷電路板盥哕筮_ 印刷電路板堆疊於-起，如此’該第—印刷電路板 —印刷電路板不需通過屏蔽架以外之連接器連接，從而 降低該印刷電路板堆疊結構之整體高度。此外，該第一、 200930226 二屏蔽架、該第一印刷雷政化 電路板及該第二印刷電路板組成- ，封閉之容室，該容室將該第一印刷電路板上之 件封閉，如此，該第一印刷電 電子兀 單獨設置-屏蔽罩來進行電磁屏“ 電子元件可不 【實施方式】㈣仃電磁屏敝’從而節省生產成本。 請參閱圖2,本發明較佳實施例之印 籌其包括一第一印刷電路板22、一第二印刷 24及一連接機構26。兮笛 2弟一印刷電路板22與該第二印刷 電路板24通過該連接機構％堆疊在一起。 該第一印刷電路& 22包括-第-表面222,該第一表 面如朝向該第二印刷電路板…該第-表面222上設置 f I電子""件（圖未示)。該第二印刷電路板24包括 一第一表面242及一與該第一表面242相對之 244。該第一/面242朝向該第一印刷電路板22。該第二 表面244上設置有一第二電子元件（圖未示），且該第二電 子元件制一屏蔽罩撕將其封閉，該屏蔽罩可為習知之 任意屏敝罩，該屏蔽罩可通過請等技術形成於該第 刷電路板24之第二表面244上。 清一併參閱圖3,該連接機構26包括一第— 及一第二屏蔽架264。該第一屏蔽架262設置於該第、一印 刷電路板22上，該第二屏蔽架綱設置於該第二印刷電路 板24上。該第—印刷電路板22與該第二印刷電路板24 通過該第-屏蔽架262與該第二屏蔽架施之卡合而堆爲 在一起。 200930226 該第一屏蔽架262由金屬材料製成，其為一框形體， 且其固定在該第一印刷電路板22之第一表面222上，以將 第一印刷電路板22上之第一電子元件收容於其中。本發明 優選實施方式之第一屏蔽架262係通過SMT技術形成在該 第一印刷電路板22上，該第一屏蔽架.262包括一第一周框 2622及由該第一周框2622頂部朝該第一屏蔽架262内延 伸之延伸部2624，該第一周框2622用以將該第一電子元 件包圍於其内。該第一周框2622上開設有複數通孔2626, ®該通孔2626可為圓形、方形，乃至不規則之任意形狀。該 延伸部2624之作用為：當該第一屏蔽架262採用SMT技 術形成於該第一印刷電路板22上時，該延伸部2624作吸 附面之用途，同時，該延伸部2624可加強該第一周框2622 之結構剛度。 該第二屏蔽架264由金屬材料製成，其形狀及大小大 致與該第一屏蔽架262相當。該第二屏蔽架264固定在該 ❹第二印刷電路板24之第一表面242上。本發明優選實施方 式之第二屏蔽架264可通過SMT技術形成在該第二印刷電 路板24上，該第二屏蔽架264包括一第二周框2642及由 該第二周框2642頂部朝該第二屏蔽架264内延伸之延伸部 2644。該第二周框2642之内周壁上凸設有與所述通孔2626 對應之複數凸起2646，且所述凸起2646之形狀及大小與 所述通孔2626之形狀及大小相當。該第二周框2642上開 設有複數切口 2648，所述切口 2648將該周框分成複數小 段2649，如此便於該第二周框2642向遠離該第二屏蔽架 200930226 264之方向擴張，從而方便該第二屏蔽架264卡合於該第 .一屏蔽架262上。該延伸部2644之作用為：當該第二屏蔽 架262採用SMT技術形成於該第二印刷電路板24上時， 該延伸部2644作吸附面之用途，同時，該延伸部2644可 加強該第二周框2642之結構剛度。. 請一併參閱圖4及圖5，該連接結構26將該第一印刷 電路板22與該第二印刷電路板24堆疊在一起之原理如 下：所述第二屏蔽架264將該第一屏蔽架262包覆，且所 ®述每一凸起2646逐一卡入所述每一通孔2626内，從而將 該第一屏蔽架262與該第二屏蔽架264卡合在一起。而由 上可知，該第一屏蔽架262係固定在該第一印刷電路板22 上，該第二屏蔽架264係固定在該第二印刷電路板24上， 如此，通過該第一屏蔽架262與該第二屏蔽架264之卡合， 從而將第一印刷電路板22與該第二印刷電路板24堆疊在 起。 ^ 可以理解，當該第二印刷電路板24上之第二電子元件 與該第一印刷電路板22上之第一電子元件之間之干擾不 足以影響該印刷電路板堆疊結構20之正常工作之情況 下，可將該第二印刷電路板24原先設置於該第二表面244 之第二電子元件設置於該第一表面242上，且該第二電子 元件為該第二屏蔽架264所包圍。如此，該第一電子元件 及該第二電子元件均可通過該連接機構26、該第一印刷電 路板22及該第二印刷電路板24組成之容室封閉，省去屏 蔽罩246，進一步地節省屏蔽成本，同時，進一步地降低 200930226 該印刷電路板堆疊結構20之整體高度。 . 所述印刷電路板堆疊結構20，利用該連接機構26不 僅可將該第一印刷電路板22與該第二印刷電路板24堆疊 於一起，同時，該連接機構26、該第一印刷電路板22及 該第二印刷電路板24組成一封閉之容室，該容室將該第一 印刷電路板22上之第一電子元件封閉，如此，該第一印刷 電路板22上之第一電子元件可不單獨設置一屏蔽罩來進 行電磁屏蔽，從而節省生產成本。 ® 另外，該連接機構26由該第一屏蔽架262及該第二屏 蔽架264組成，即該第一印刷電路板22與該第二印刷電路 板24不需通過屏蔽架以外之連接器連接，如此可降低該印 刷電路板堆疊結構20之整體高度。 此外，該第一屏蔽架262與該第二屏蔽架264之卡合 係通過所述每一凸起2646逐一卡入所述每一通孔2626内 實現，因此，僅需將所述凸起2646脫出所述通孔2626即 ❹可解除該第一屏蔽架262與該第二屏蔽架264之卡合，如 此，當需要對該第一印刷電路板22或該第二印刷電路板 24進行維護時，可方便地將該第一印刷電路板22與該第 二印刷電路板24分離。 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，本發明之 範圍並不以上述實施例為限，舉凡熟悉本案技藝之人士援依 本發明之精神所作之等效修飾或變化，皆應涵蓋於以下申請 專利範圍内。 11 200930226 .【圖式簡單說明】 圖1係習知之印刷電路板堆疊結構之示意圖； 圖2係本發明印刷電路板堆豐結構之不意圖； 圖3係本發明連接機構之分解示.意圖； 圖4係本發明連接機構之組合示意圖； 圖5係圖4連接機構之局部剖視圖。 【主要元件符號說明】 ® (習知） 印刷電路板堆疊結構 10 第二印刷電路板14 第一印刷電路板 12 第一屏蔽罩 16 第一表面 122、 142第二屏蔽罩 18 第二表面 124 ' 144連接器 19 電子元件 126、 146 (本發明） 印刷電路板堆疊結構 20 第一周框 2622 第一印刷電路板 22 延伸部 2624 > 2644 第一表面 222 、242通孑L 2626 第二表面 224 、244第二屏蔽架 264 第二印刷電路板 24 第二周框 2642 屏蔽罩 246 凸起 2646 連接機構 26 切口 2648 第一屏蔽架 262 小段 2649 12200930226 IX. Description of the invention: • [Technical field to which the invention pertains] The present invention relates to a printed circuit board stack structure, in particular to a printed circuit board stack structure for a portable electronic device. [Prior Art] Circuit boards, wires, and electronic components in electronic equipment will work as electromagnetic waves of the south frequency when working, causing interference to the normal operation of electronic products, and saying "caused by harm. In order to reduce electromagnetic interference and wheels In the conventional technology, the shielding device is often used to shield the circuit board, the guide 2 and the electronic components in order to shield the electromagnetic wave. The film == miniaturization of the product and more and more functions, gradually requiring more f The circuit board exists at the same time in the same electronic product, that is, the printed circuit board stack structure appears in the electronic product. = Reading! The printed circuit board stack structure 1 includes a first printing reverse 2, a first printing The circuit board 12 is stacked on one another with a second 〇 = way board 14, a first shield hood 16, a second shield (four) and: and a second: the first printed circuit board 12 includes - a surface 122: 2 In contrast to the second surface 124. The second printing includes a first surface 142 and a surface 144 opposite the first surface M2. The first surface (2) and the second:: circuit board of the first printed circuit board 12 The first surface of the second 4 2 electrically connected to the second printed circuit board 2 via the connector Μ 14 electrically connected to the second printed circuit board 12. The second surface of the first printed circuit board 12 has an electronic component 126 thereon, and The electronic component 126 is closed by the first shield 6 200930226 cover U. The second surface i44 of the second printed circuit board 14 is provided with an electronic component 146, and the electronic component 146 is closed by the second shield 18 . Since the first printed circuit board 12 and the second printed circuit board 14 are connected by the connector 19, the connector 19 has a certain degree of n, so that the printed circuit board stack structure is monolithic The height is increased, no, the thin and portable electronic device is manufactured. At the same time, the printed circuit board stack: the structure 10 needs to shield the first printed circuit board and the f-printed circuit board 14 respectively by the two shielding covers, minus, The cost of stacking the (4) circuit board is higher. [Summary of the Invention] It is necessary to provide a printed circuit board stack structure capable of reducing the height and saving the manufacturing cost. structure The method includes a first printed circuit board and a second printed circuit board stacked on the first printed circuit board, and at least an electronic component is disposed on the opposite surface of the printed circuit board and the second printed circuit board. The first printed circuit board is further provided with a first screen. The second printed circuit board is provided with a second shield frame, and the first shield frame and the second shield frame are engaged with each other to shield the electronic component. Compared with the prior art, the printed circuit board stack structure of the present invention uses the first shield frame to stack the first printed circuit board 盥哕筮 _ printed circuit board, so that the first printed circuit The board-printed circuit board does not need to be connected by connectors other than the shield frame, thereby reducing the overall height of the printed circuit board stack structure. In addition, the first, 200930226 second shield frame, the first printed Leizheng circuit board and the second printed circuit board comprise - a closed chamber, the chamber closes the piece on the first printed circuit board, In this way, the first printed electronic device is separately provided with a shield to perform the electromagnetic screen. The electronic component may not be used in the fourth embodiment to save the production cost. Referring to FIG. 2, the printed image of the preferred embodiment of the present invention is printed. It includes a first printed circuit board 22, a second print 24, and a connection mechanism 26. The printed circuit board 22 and the second printed circuit board 24 are stacked by the connection mechanism %. A printed circuit & 22 includes a - surface 222, such as facing the second printed circuit board ... the first surface 222 is provided with a "I" "" (not shown). The printed circuit board 24 includes a first surface 242 and a 244 opposite the first surface 242. The first/face 242 faces the first printed circuit board 22. The second surface 244 is provided with a second electronic component ( Figure not shown, and the second electronic component The shield can be closed by a shield cover. The shield can be any conventional screen cover. The shield can be formed on the second surface 244 of the second circuit board 24 by a technique, etc. The connecting mechanism 26 includes a first and a second shielding frame 264. The first shielding frame 262 is disposed on the first printed circuit board 22, and the second shielding frame is disposed on the second printed circuit board 24. The first printed circuit board 22 and the second printed circuit board 24 are stacked by the first shield frame 262 and the second shield frame. 200930226 The first shield frame 262 is made of a metal material. Formed as a frame, and fixed on the first surface 222 of the first printed circuit board 22 to receive the first electronic component on the first printed circuit board 22 therein. Preferred embodiment of the present invention The first shield frame 262 is formed on the first printed circuit board 22 by SMT technology. The first shield frame 262 includes a first perimeter frame 2622 and a top portion of the first perimeter frame 2622 toward the first shield frame 262. An inner extension portion 2624, the first circumference frame 2622 is configured to An electronic component is enclosed therein. The first circumferential frame 2622 is provided with a plurality of through holes 2626, which can be circular, square, or even irregular. The function of the extension 2624 is: When the first shield frame 262 is formed on the first printed circuit board 22 by SMT technology, the extending portion 2624 serves as an adsorption surface, and the extending portion 2624 can strengthen the structural rigidity of the first peripheral frame 2622. The second shield frame 264 is made of a metal material and has a shape and a size substantially equivalent to the first shield frame 262. The second shield frame 264 is fixed to the first surface 242 of the second printed circuit board 24. The second shield frame 264 of the preferred embodiment of the present invention can be formed on the second printed circuit board 24 by SMT technology. The second shield frame 264 includes a second perimeter frame 2642 and the top of the second perimeter frame 2642 is facing the An extension 2644 extends within the second shield frame 264. A plurality of protrusions 2646 corresponding to the through holes 2626 are protruded from the inner peripheral wall of the second circumference frame 2642, and the shape and size of the protrusions 2646 are equivalent to the shape and size of the through holes 2626. The second circumference frame 2642 is provided with a plurality of slits 2648. The slits 2648 divide the circumference frame into a plurality of small segments 2649, so that the second circumference frame 2642 is expanded away from the second shield frame 200930226 264, thereby facilitating the The second shield frame 264 is engaged with the first shield frame 262. The extension portion 2644 functions to: when the second shield frame 262 is formed on the second printed circuit board 24 by SMT technology, the extension portion 2644 serves as an adsorption surface, and the extension portion 2644 can strengthen the first portion The structural rigidity of the two-week box 2642. Referring to FIG. 4 and FIG. 5 together, the connection structure 26 stacks the first printed circuit board 22 and the second printed circuit board 24 as follows: the second shield frame 264 shields the first shield The frame 262 is covered, and each of the protrusions 2646 is snapped into each of the through holes 2626 to engage the first shield frame 262 with the second shield frame 264. As can be seen from the above, the first shield frame 262 is fixed on the first printed circuit board 22, and the second shield frame 264 is fixed on the second printed circuit board 24, and thus passes through the first shield frame 262. Engagement with the second shield frame 264 to stack the first printed circuit board 22 and the second printed circuit board 24. ^ It can be understood that the interference between the second electronic component on the second printed circuit board 24 and the first electronic component on the first printed circuit board 22 is insufficient to affect the normal operation of the printed circuit board stack structure 20. In this case, the second electronic component of the second printed circuit board 24 disposed on the second surface 244 can be disposed on the first surface 242, and the second electronic component is surrounded by the second shield frame 264. In this way, the first electronic component and the second electronic component can be closed by the connecting frame formed by the connecting mechanism 26, the first printed circuit board 22 and the second printed circuit board 24, and the shield cover 246 is omitted, further The shielding cost is saved, and at the same time, the overall height of the printed circuit board stack structure 20 of 200930226 is further reduced. The printed circuit board stack structure 20 can be used to stack not only the first printed circuit board 22 and the second printed circuit board 24, but also the connection mechanism 26 and the first printed circuit board. 22 and the second printed circuit board 24 form a closed chamber that closes the first electronic component on the first printed circuit board 22, such that the first electronic component on the first printed circuit board 22 A shield can be provided separately for electromagnetic shielding, thereby saving production costs. In addition, the connecting mechanism 26 is composed of the first shielding frame 262 and the second shielding frame 264, that is, the first printed circuit board 22 and the second printed circuit board 24 need not be connected through a connector other than the shielding frame. This reduces the overall height of the printed circuit board stack 20 . In addition, the engagement between the first shield frame 262 and the second shield frame 264 is achieved by inserting each of the protrusions 2646 into each of the through holes 2626 one by one. Therefore, only the protrusions 2646 need to be removed. The through hole 2626 can release the first shield frame 262 and the second shield frame 264, so that when the first printed circuit board 22 or the second printed circuit board 24 needs to be maintained The first printed circuit board 22 can be conveniently separated from the second printed circuit board 24. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention are It should be covered by the following patent application. 11 is a schematic diagram of a conventional printed circuit board stack structure; FIG. 2 is a schematic view of the printed circuit board stacking structure of the present invention; FIG. 3 is an exploded view of the connecting mechanism of the present invention; Figure 4 is a schematic view showing the combination of the connecting mechanism of the present invention; Figure 5 is a partial cross-sectional view of the connecting mechanism of Figure 4. [Main component symbol description] ® (conventional) printed circuit board stack structure 10 second printed circuit board 14 first printed circuit board 12 first shield 16 first surface 122, 142 second shield 18 second surface 124' 144 connector 19 electronic components 126, 146 (invention) printed circuit board stack structure 20 first perimeter frame 2622 first printed circuit board 22 extension 2624 > 2644 first surface 222, 242 through L 2626 second surface 224 244 second shield frame 264 second printed circuit board 24 second circumference frame 2642 shield 246 protrusion 2646 connection mechanism 26 slit 2648 first shield frame 262 segment 2649 12