JP2010080854A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment having a shielding case for effectively shielding electronic components. <P>SOLUTION: A portable telephone includes a packaging-type shielding case 31 covering a first electronic components group 30A implemented on a main substrate 23. The packaging-type shielding case 31 includes a shield frame 41 implemented onto the main substrate 23 and a shield cover 43 attached to the shield frame 41. The shield frame 41 includes a suction pad 41c extending from the crowning of a sidewall 41a surrounding the first electronic components group 30A. The suction pad 41c adjoins an electronic component 29 that generates relatively much electromagnetic wave noises in the first electronic components group 30A. The top board 43a of the shield cover 43 includes a finger section 43c whose circumference is subjected to shear except a part thereof at a part piled up on the suction pad 41c to be bent toward the main substrate 23 side to abut on the suction pad 41c. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device such as a mobile phone, a PDA, and a game machine.

  A shield case having a shield frame attached to a circuit board so as to surround an electronic component mounted on the circuit board and a shield cover that covers the shield frame so as to close an opening on the top surface of the shield frame is known. (For example, patent document 1).

  Specifically, the shield frame is erected on the circuit board and has a side wall portion surrounding the electronic component. The shield frame is connected to the ground of the circuit board by fixing the side wall portion to the ground pattern layer of the circuit board with solder. The shield cover has a top plate portion that closes the opening of the top surface of the side wall portion of the shield frame, and a hanging portion that is orthogonal to the top plate portion and surrounds the outer periphery of the side wall portion of the shield frame. The shield cover is connected to the ground of the circuit board by the drooping portion coming into contact with the side wall portion of the shield frame.

Such a two-piece shield case (separate type shield case) is, for example, compared with a one-piece shield case or the like, after the shield frame is soldered to the circuit board, and then the top opening of the shield frame is opened. The electronic component is mounted on the circuit board with an underfill material such as resin through the, the electronic component mounted on the circuit board is imaged through the opening on the top surface, and the mounting state is inspected. Accordingly, there is a merit that a defect in mounting electronic components can be corrected (reworked) through the opening on the top surface.
JP 2008-131442 A

  In the two-piece shield case, there is a risk that the contact between the side wall portion of the shield frame and the hanging portion of the shield cover is not sufficient. In a state where the contact is not sufficiently made, if the radiation noise from the mounted components in the shield gets on the shield cover, the loop that returns from the shield cover to the ground of the circuit board through the shield frame does not function, Noise is re-radiated from the shield cover. That is, the shielding effect is reduced. As a result, malfunction of the electronic device occurs or reception sensitivity of the electronic device that performs communication deteriorates.

  The objective of this invention is providing the electronic device which has a shield case which can shield an electronic component effectively.

  The electronic apparatus according to the present invention includes a circuit board, a first electronic component group mounted on the circuit board, and a first shield case that covers the first electronic component group. The shield case has a shield frame mounted on the circuit board and connected to the ground of the circuit board, and a shield cover attached to the shield frame, and the shield frame is erected on the circuit board In the first electronic component group, a side wall portion surrounding the first electronic component group and a portion extending from the top of the side wall portion are bent toward the inner peripheral side of the side wall portion. A first conductive portion adjacent to an electronic component that generates a relatively large amount of electromagnetic noise, and the shield cover includes a top plate portion that closes an opening on the top surface side of the shield frame, and Parts are in the portion overlapping with the first conductive portion, the periphery is sheared leaving a part, having a second conductive portion that contacts bent to the circuit board side to the first conductive portion.

  Preferably, in the plan view of the top plate portion, an opening formed by shearing the second conductive portion is accommodated in the first conductive portion.

  Preferably, a second electronic component group mounted in a region outside the first shield case of the circuit board, the first shield case, and the second electronic component group covering the second electronic component group. And the second conductive part is in contact with the first conductive part while being elastically deformed by being sandwiched between the second shield case and the first conductive part.

  Preferably, the side wall portion has a plurality of engaged portions arranged along a circumferential direction, and the shield cover has a plurality of engaging portions that engage with the plurality of engaged portions. The plurality of engaged portions, the plurality of engaging portions, the first conductive portion, and the second conductive portion are less than electromagnetic components having relatively less electromagnetic noise in the first electronic component group. However, they are arranged so that the distance between them is relatively narrow at a position close to an electronic component with relatively much electromagnetic noise.

  Preferably, the first conductive part is a suction pad.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device which has a shield case which can shield an electronic component effectively can be provided.

  FIG. 1 is a perspective view showing the appearance of a mobile phone 1 according to an embodiment of the present invention in a closed state.

  The mobile phone 1 is configured as a so-called foldable mobile phone, and includes a first housing 3 and a second housing 5 that are rotatably connected to each other between an open state and a closed state. . FIG. 1 shows a closed state in which the first housing 3 and the second housing 5 are overlapped. The first housing 3 and the second housing 5 are each formed in a generally thin rectangular parallelepiped shape.

  FIG. 2 is an exploded perspective view of the first housing 3.

  The cellular phone 1 includes a front case 11 that constitutes a front side portion of the first housing 3, an inner case 13 that constitutes an inner side portion of the first housing 3, and a back side portion of the first housing 3. A rear case 15 and a lid 17.

  In addition, the mobile phone 1 includes a key sheet 19, a laminated shield case 21, a main board 23, a sub board assembly 25, and a battery 27 that are arranged in a stacked manner within the first housing 3. . Although a flexible printed wiring board (FPC) on which a plurality of switches are mounted is laminated on the surface of the laminated shield case 21 on the key sheet 19 side, the illustration is omitted.

  The front case 11, the inner case 13, the rear case 15, and the lid body 17 are each formed of, for example, a non-conductive resin. The front case 11, the inner case 13, and the rear case 15 are fixed to each other by, for example, screws or engaging portions or both. The key sheet 19, the laminated shield case 21, the main board 23 and the sub board assembly 25 are sandwiched between the front case 11 and the inner case 13. The lid 17 is fixed to the inner case 13 or the rear case 15 or both by an engaging portion or the like, and prevents the battery 27 from falling off.

  The main board 23 is constituted by, for example, a rigid circuit board based on a hard resin. The main board 23 has a first mounting surface 23a on the front case 11 side and a second mounting surface 23b on the back side thereof. A plurality of electronic components 29 are provided on the first mounting surface 23a and the second mounting surface 23b. The first mounting surface 23 a is provided with a mounting-type shield case 31 that shields some of the electronic components 29 among the plurality of electronic components 29.

  Hereinafter, a group of electronic components 29 (see FIG. 3) shielded by the mounting shield case 31 is referred to as a first electronic component group 30A, and is shielded by the multilayer shielding case 21 outside the mounting shield case 31. The group of electronic components 29 may be referred to as a second electronic component group 30B.

  On the first mounting surface 23a and the second mounting surface 23b, a ground pattern layer 33 is formed extending vertically and horizontally so as to partition each mounting surface into a plurality of regions. The second electronic component group 30 </ b> B and the mounting type shield case 31 are divided into a plurality of groups by the ground pattern layer 33. Each group is surrounded by a ground pattern layer 33.

  The laminated shield case 21 is made of, for example, metal. Alternatively, the laminated shield case 21 is configured by providing a conductive layer such as a metal layer on the surface of a non-conductive substrate such as a resin. The multilayer shield case 21 includes a facing surface portion 21a that faces the first mounting surface 23a of the main substrate 23, and a partition wall 21b that protrudes from the facing surface portion 21a toward the first mounting surface 23a.

  The partition wall 21b extends in the same shape as the ground pattern layer 33 on the first mounting surface 23a. When the mobile phone 1 is assembled, the partition wall 21 b comes into contact with the ground pattern layer 33. Thereby, the multilayer shield case 21 is electrically connected to the ground pattern layer 33. The laminated shield case 21 is mounted on the ground pattern layer 33, and a spring terminal (not shown) that contacts the laminated shield case 21 or a screw (not shown) that fastens the laminated shield case 21 and the main board 23. Thus, the ground pattern layer 33 may be electrically connected. The second electronic component group 30B and the mounting type shield case 31 are accommodated in a plurality of spaces (rooms) formed by the first mounting surface 23a, the opposing surface portion 21a, and the partition wall 21b.

  An unillustrated FPC is laminated on the laminated shield case 21. In the FPC, a plurality of switches (not shown) that are pressed by a plurality of keys 35 exposed in the front case 11 are mounted. The key sheet 19 covers a plurality of switches and functions to transmit the pressing force applied to the key 35 to the switches, and closes the opening of the inner case 13 on the front case 11 side, thereby fulfilling a waterproof function. The sub board assembly 25 includes a circuit board connected to the main board and a holder for holding the circuit board.

  FIG. 3 is an exploded perspective view of the mounting type shield case 31.

  The mounting type shield case 31 is configured by a two-piece separate shield case, and includes a shield frame 41 attached to the main board 23 and a shield cover 43 attached to the shield frame 41. Each of the shield frame 41 and the shield cover 43 is formed, for example, by performing a pressing process such as a punching process, a drawing process, or a bending process on a single sheet metal.

  The shield frame 41 includes a side wall portion 41a surrounding the first electronic component group 30A, an extension portion 41b extending from the top of the side wall portion 41a to the inner peripheral side of the side wall portion 41a, and a suction pad 41c. An opening 41 h is formed on the top surface side of the shield frame 41.

  For example, the side wall 41 a is erected so as to be orthogonal to the main board 23. The planar shape of the side wall portion 41a (the shape seen in the direction orthogonal to the main substrate 23) is a shape in which one corner of a rectangle is cut out. Note that the side wall portion 41a may be erected with respect to the main substrate 23, or may be formed in an appropriate shape such as a trapezoid in a plan view. For example, the side wall 41a is formed such that the height of the main board 23 from the first mounting surface 23a is constant over the entire circumference. Note that the height of the side wall 41a may vary.

  For example, the extending portion 41b is bent inward of the side wall portion 41a so as to extend in parallel to the main substrate 23. The extending part 41b has a constant width and extends over the entire circumference of the side wall part 41a, for example. The extending part 41b contributes to improving the strength of the shield frame 41 and the like.

  The suction pad 41 c is a portion that is sucked by a suction-type robot hand when the shield frame 41 is mounted on the main board 23. For example, the suction pads 41c are provided at two locations across the approximate center of the opening 41h. More specifically, they are provided at both ends of one rectangular diagonal line. Note that an appropriate number of suction pads 41c may be provided at appropriate positions.

  The suction pad 41c is configured, for example, as if the extending portion 41b is extended to the inner peripheral side of the side wall portion 41a, and is bent to the inside of the side wall portion 41a so as to extend in parallel to the main substrate 23. . The suction pad 41c is formed in a rectangular shape, for example. The suction pad 41c may be formed in an appropriate shape such as a semicircle. Further, the area of the suction pad 41c may be set as appropriate as long as the area is sufficient for holding the shield frame 41 by suction.

  The shield cover 43 includes a top plate portion 43 a that closes the opening 41 h of the shield frame 41 and a hanging portion 43 b that surrounds the side wall portion 41 a of the shield frame 41.

  For example, the top plate portion 43a is formed in a flat plate shape having the same planar shape as that of the side wall portion 41a. Therefore, the top plate portion 43a overlaps the extending portion 41b of the shield frame 41 and the suction pad 41c.

  The hanging portion 43b extends from the edge of the top plate portion 43a and is bent toward the main substrate 23 side. The hanging portion 43b extends, for example, over the entire circumference of the top plate portion 43a with a certain width. In addition, the height of the hanging part 43b is smaller than the height of the side wall part 41a.

  The electronic component 29 of the first electronic component group 30A is an electronic component with more radiation noise than the electronic component 29 of the second electronic component group 30B. The electronic components 29 in the first electronic component group 30A are, for example, an image processing IC, a sound source IC, and a serial-parallel conversion IC.

  FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3 in a state where the first housing 3 is assembled.

  The shield cover 43 covers the shield frame 41 and closes the opening 41 h of the shield frame 41. As a result, the first electronic component group 30 </ b> A is accommodated in the space formed by the mounting-type shield case 31 and the main substrate 23.

  The mounting shield case 31 is covered with the laminated shield case 21. The facing surface portion 21 a of the multilayer shield case 21 is close to the top plate portion 43 a of the shield cover 43. As shown in FIGS. 3 and 4, the electronic components 29 of the first electronic component group 30 </ b> A have different heights from the main board 23. The top plate portion 43 a of the shield cover 43 has a step that protrudes toward the inner side of the mounting shield case 31 in order to bring the inner surface of the top plate portion 43 a closer to the top surface of the electronic component 29 having a low height. A portion 43i is formed. Further, in order to bring the outer surface of the stepped portion 43i close to the inner surface of the facing surface portion 21a, the facing surface portion 21a of the mounting type shield case 31 is convex toward the stepped portion 43i at a position overlapping the stepped portion 43i. Projections 21i are formed.

  5 is a cross-sectional view taken along line VV in FIG. 3 in a state where the first housing 3 is assembled.

  The shield frame 41 is placed on the ground pattern layer 33 of the main substrate 23 formed in the same shape as the side wall 41 a in a plan view (as viewed in a direction orthogonal to the main substrate 23), and is grounded by the solder 45. 33 is fixed. Thereby, the shield frame 41 is fixed to the main board 23 and electrically connected to the ground of the main board 23.

  The shield cover 43 is fixed to the shield frame 41 (main board 23) by engaging with the shield frame 41 and is electrically connected to the ground of the main board 23. For example, as shown in FIGS. 3 and 5, the side wall 41a of the shield frame 41 is formed with a plurality of protrusions 41g arranged along the circumferential direction of the side wall 41a and protruding toward the outer periphery of the side wall 41a. Has been. On the other hand, a hole 43g is formed in the hanging portion 43b of the shield cover 43 at a position corresponding to the position of the protrusion 41g. The shield cover 43 is engaged with the shield frame 41 by the protrusion 41g entering the hole 43g.

  FIG. 6A is a cross-sectional view taken along line VI-VI in FIG. 3 in a state in which the mounting shield case 31 is assembled and the laminated shield case 21 is not laminated. 6B is a cross-sectional view taken along the line VI-VI in FIG. 3 in a state in which the laminated shield case 21 is further laminated from the state in FIG. 6A (a state in which the first housing 3 is assembled). is there.

  As shown in FIGS. 3 and 6, the top plate portion 43 a of the shield cover 43 is formed with finger portions 43 c that come into contact with the suction pads 41 c in portions overlapping the suction pads 41 c. The finger part 43c is configured to be sheared leaving a part of the periphery and bent toward the main board 23 side or the laminated shield case 21 side or both. The finger part 43c is formed, for example, by performing a punching process (cutting process) for forming slits 43s (see FIG. 7) around the finger part 43c and performing a bending process after the punching process. In addition, the finger part 43c may be formed by other processing methods, such as a cutting and bending process which performs a shearing process and a bending process simultaneously. Specifically, for example, the finger portion 43c is sheared with the short side of one rectangle being left, and the laminated shield case 21 side, the main board 23 side, and the laminated layer are sequentially laminated from the root side to the tip side. It is formed by being bent toward the mold shield case 21 side.

  And as shown in FIG. 6, the finger part 43c has the outer side contact part 43d and the inner side contact part 43e which are supported so that rocking | fluctuation is possible in the direction which adjoins and separates at the front-end | tip pad 41c. The outer contact portion 43d is located closer to the laminated shield case 21 than the portion (main body portion) other than the finger portion 43c of the top plate portion 43a. More specifically, the outer contact portion 43d is protruded from the main body portion of the top plate portion 43a with an amount of protrusion larger than the distance between the laminated shield case 21 covered on the mounting type shield case 31 and the main body portion of the top plate portion 43a. It protrudes. The inner contact portion 43e is located closer to the suction pad 41c than the outer contact portion 43d. More specifically, the inner contact portion 43e is positioned on the suction pad 41c side with respect to the outer contact portion 43d at a distance slightly larger than the distance between the stacked shield case 21 and the suction pad 41c that is placed on the mounting shield case 31. is doing.

  As shown in FIG. 6A, the finger portion 43 c is lifted from the main body portion of the top plate portion 43 a in a state where the shield cover 43 is only attached to the shield frame 41, and does not contact the shield frame 41. Not touching.

  As shown in FIG. 6B, when the multilayer shield case 21 is attached, first, the outer contact portion 43 d of the finger portion 43 c comes into contact with the multilayer shield case 21. Furthermore, the inner contact portion 43 e comes into contact with the suction pad 41 c of the shield frame 41 as the finger portion 43 c is elastically deformed by the pressing force from the laminated shield case 21. Therefore, the finger portion 43c is elastically deformed by being sandwiched between the laminated shield case 21 and the suction pad 41c, and is in contact with the suction pad 41c by a restoring force accompanying the elastic deformation.

  FIG. 7 is a plan view of the finger portion 43c and the suction pad 41c. However, the finger portion 43c is shown in a state where slits 43s are provided by punching (a state where bending is not performed).

  As shown in this figure, the area of the finger portion 43c and the slit 43s is smaller than the area of the suction pad 41c and fits in the suction pad 41c. In other words, the opening formed by shearing the finger portion 43c is accommodated in the suction pad 41c in plan view.

  FIG. 8 is a plan view for explaining the arrangement of each part of the mounting type shield case 31. In FIG. 8, for convenience of explanation, additional symbols A to D are attached to the electronic components 29 of the first electronic component group 30 </ b> A.

  Among the plurality of electronic components 29 in the first electronic component group 30A, there are those that generate a relatively large amount of electromagnetic noise. For example, the electronic components 29A, 29B, and 29D generate more electromagnetic noise than the electronic component 29B. Further, each electronic component 29 has a portion that generates a relatively large amount of electromagnetic noise. For example, in the electronic component 29A, the left part of the paper surface generates a lot of electromagnetic noise, and in the electronic component 29C, the upper part of the paper surface generates a lot of electromagnetic noise. Therefore, in the arrangement region of the first electronic component group 30A, the first region 47A and the second region 47B are regions where a lot of electromagnetic noise is generated.

  The suction pad 41c (and the finger part 43c) is disposed adjacent to the electronic components 29A and 29C having relatively much electromagnetic noise in the first electronic component group 30A. Further, the suction pad 41c (and the finger portion 43c) is disposed adjacent to the first region 47A and the second region 47B that have a relatively high electromagnetic noise.

  The suction pad 41c (and the finger part 43c) and the protrusion 41g (and the hole part 43g) have an electronic component 29A having a relatively higher electromagnetic wave noise than the electronic component 29B having a relatively lower electromagnetic wave noise in the first electronic component group 30A. , 29C and 29D are arranged so that the distance between them is relatively narrow at positions (or adjacent positions). In addition, the suction pad 41c (and the finger portion 43c) and the protrusion 41g (and the hole 43g) are located in the first region 47A and the second region 47B where the electromagnetic wave noise is relatively larger than the region where the electromagnetic wave noise is relatively small. At close positions (or adjacent positions), the mutual distance is relatively narrow.

  Specifically, at a position adjacent to the first region 47A (electronic component 29A), the suction pad 41c and the protrusion 41g are adjacent to each other, and the interval is smaller than the length of one side of the electronic component 29A. In addition, at a position adjacent to the second region 47B (the electronic component 29C and the electronic component 29D), a total of three suction pads 41c and protrusions 41g are provided, and the distance between them is equal to the length of one side of the electronic component 29C. It is about the same. On the other hand, in the area on the lower side of the drawing, only two protrusions 41g are provided, and the distance between them is the same as the length of one side of the electronic components 29A and 29B.

  FIG. 9 is a block diagram showing an example of the configuration of the signal processing system of the mobile phone 1.

  The mobile phone 1 includes a CPU 71, a memory 73, a communication processing unit 75, an acoustic processing unit 77, and an image processing unit 79. Each of these parts includes an electronic component 29 provided on the main board 23.

  The CPU 71 and the memory 73 function as a control unit that performs predetermined calculations based on signals from various units such as the operation unit 91 including the key 35 and controls various units such as the image processing unit 79.

  The communication processing unit 75 performs acoustic communication and image data processed by the CPU 71 in order to communicate with other portable terminal devices and servers via a communication system (telephone network or the Internet) by wireless communication using radio waves. And the like, and the modulated signal is transmitted via the antenna 81. The communication processing unit 75 demodulates the signal received via the antenna 81 and outputs the demodulated data to the CPU 71.

  The acoustic processing unit 77 includes a sound source IC included in the first electronic component group 30A. The acoustic processing unit 77 converts the acoustic data from the CPU 71 into an electrical signal, and outputs the signal to the speaker 83 for call or the speaker 85 that outputs a notification sound or the like. The speaker 83 and the speaker 85 convert the electric signal from the sound processing unit 77 into sound and output the sound. On the other hand, the microphone 87 converts the input sound into an electrical signal and outputs the signal to the sound processing unit 77. The acoustic processing unit 77 converts the electrical signal from the microphone 87 into acoustic data, and outputs the acoustic data to the CPU 71.

  The image processing unit 79 includes an image processing IC included in the first electronic component group 30A. The image processing unit 79 converts the image data from the CPU 71 into an image signal and outputs the signal to the display unit 93. In addition, the image processing unit 79 converts the imaging signal (image data) output from the imaging unit 89 into image data of a predetermined format, and outputs the image data to the CPU 71.

  According to the embodiment described above, the mobile phone 1 includes the main board 23, the first electronic component group 30A mounted on the main board 23, and the mounting-type shield case 31 that covers the first electronic component group 30A. The mounting-type shield case 31 includes a shield frame 41 that is mounted on the main substrate 23 and connected to the ground of the main substrate 23, and a shield cover 43 that is attached to the shield frame 41. The shield frame 41 is erected on the main substrate 23, and includes a side wall 41a surrounding the first electronic component group 30A, and a suction pad 41c extending from the top of the side wall 41a to the inner peripheral side of the side wall 41a. The suction pad 41c is provided at a position adjacent to the electronic components 29A and 29C that generate a relatively large amount of electromagnetic noise in the first electronic component group 30A. The shield cover 43 has a top plate portion 43 a that closes the opening 41 h on the top surface side of the shield frame 41. The top plate portion 43a has a finger portion 43c that is overlapped with the suction pad 41c, is sheared leaving a part of the periphery, is bent toward the main substrate 23 side, and comes into contact with the suction pad 41c. Therefore, the shield frame 41 and the shield cover 43 can be reliably conducted by conduction in the top plate portion 43a. In addition, since the suction pads 41c and the finger portions 43c are provided adjacent to the electronic components 29A and 29C that have a relatively large amount of electromagnetic noise, the electromagnetic noise can be flowed to the ground more reliably. Furthermore, since the suction pad 41c and the finger part 43c are formed by pressing the sheet metal constituting the shield frame 41 and the shield cover 43, the number of parts does not increase.

  In plan view of the top plate portion, the opening formed by the finger portion 43c being sheared is accommodated in the suction pad 41c. Accordingly, noise generated in the first electronic component group 30A is prevented from leaking from the opening of the top plate portion to the outside.

  The mobile phone 1 includes a second electronic component group 30B mounted outside the mounting shield case 31 on the main board 23, a stacked shield case 21 that covers the mounting shield case 31 and the second electronic component group 30B. The finger portion 43c is elastically deformed by being sandwiched between the laminated shield case 21 and the suction pad 41c. Therefore, the shield cover 43 is conducted not only to the shield frame 41 but also to the laminated shield case 21. As a result, the shield cover 43 is more reliably connected to the ground. Furthermore, while the contact pressure between the finger portion 43c and the suction pad 41c is obtained by the pressing force of the laminated shield case 21, the occurrence of excessive contact pressure is suppressed by elastic deformation of the finger portion 43c. As a result, it is easy to reliably obtain a predetermined contact pressure even when the restoring force of the finger portion 43c is small.

  The side wall 41a has a plurality of protrusions 41g arranged along the circumferential direction, and the shield cover 43 has a plurality of holes 43g that engage with the plurality of protrusions 41g. The plurality of protrusions 41g and the plurality of holes 43g, and the suction pads 41c and the finger portions 43c are relatively free of electromagnetic noise than the electronic component 29B having relatively little electromagnetic noise in the first electronic component group 30A. At a position close to many electronic components 29A, the distance between them is relatively narrow. Therefore, electromagnetic wave noise can be efficiently and reliably passed to the ground with respect to the number of protrusions 41g and the like.

  Since the conductive part that conducts with the finger part 43c is the suction pad 41c, the part required in the manufacturing process can be effectively used even after assembly, and there is no waste.

  In the above embodiment, the main board 23 is an example of the circuit board of the present invention, the mounting shield case 31 is an example of the first shield case of the present invention, and the suction pad 41c is the first of the present invention. The finger part 43c is an example of the second conductive part of the present invention, the laminated shield case 21 is an example of the second shield case of the present invention, and the protrusion 41g is the covered part of the present invention. It is an example of an engaging part, and the hole part 43g is an example of the engaging part of this invention.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The mobile electronic device is not limited to a mobile phone. For example, the portable electronic device may be a notebook computer, a PDA, a game machine, or a camera. Further, the casing of the portable electronic device is not limited to a folding type. The case may be an integrated structure (only one case), or two or more cases are connected to each other so as to be relatively movable by a method other than the folding type (sliding type, etc.). It may be a thing.

  The first conductive portion (suction pad 41c) is not limited to that disposed at a position adjacent to the side wall portion of the shield frame. Further, the second conductive part (finger part 43c) is bent toward the circuit board (main board 23) by attaching the second shield cover (laminated shield case 21), and the top plate part of the shield frame. It is not limited to what contacts. In other words, the bending of the second conductive portion toward the circuit board may be performed at the time of assembly as in the embodiment, or may be performed by bending before assembly.

  FIG. 10 is a perspective view showing a mounting shield case 131 of a modification for explaining that the first conductive portion and the second conductive portion are not limited as described above.

  The shield frame 141 has a suction pad 141c substantially at the center of the region surrounded by the side wall 141a. The shield cover 143 has a finger portion 143c at the center of the top surface portion 143a.

  Fig.11 (a) is sectional drawing of the shield cover 143 in the XI-XI line of FIG. FIG. 11B is a cross-sectional view taken along the line XI-XI in FIG. 10 in a state where the shield cover 143 is attached to the shield frame 141. In addition, the dotted line L1 of Fig.11 (a) has shown the root position of the finger part 143c.

  Similarly to the embodiment, the finger portion 143c is formed by shearing the periphery and bending the finger portion 143c. Specifically, as shown in FIG. 11A, the finger portion 143c is sheared leaving one short side of the rectangle, and in order from the middle of the rectangle to the tip side, the main board 23 side and vice versa. It is formed by bending to the side. And the finger part 143c has the inner side contact part 143e which protruded inward rather than the top | upper surface part 143a in the front end side.

  Therefore, when the shield cover 143 is attached to the shield frame 141, the finger portion 143c comes into contact with the suction pad 141c of the shield frame 141. Further, the contact pressure becomes an appropriate magnitude as the finger portion 143c is elastically deformed to the side opposite to the shield frame 141.

  In the modification shown in FIGS. 10 and 11, it is not necessary to press the finger portion 143 c toward the shield frame 141 by the laminated shield case 21. However, the finger part 143c may be brought into contact with the laminated shield case 21 as in the embodiment.

  The planar shape of the first conductive portion (suction pad) is not limited to a rectangle or a circle, and may be set to an appropriate shape. The shape of the second conductive portion (finger portion) before bending is not limited to a rectangular shape, and may be set to an appropriate shape such as a triangle.

  In what order and how many times the second conductive portion is bent to the circuit board side and the opposite side may be set as appropriate. For example, in the embodiment and the modification of FIG. 11, bending of the inner contact portions 43e and 143e to the side opposite to the main substrate 23 may be omitted. Further, for example, in the modification shown in FIG. 11, the finger portion 143c may be further bent toward the main board 23 at the root, or may be slightly bent toward the opposite side.

  In the embodiment, the portion (inner contact portion 43e) that contacts the first conductive portion (suction pad 41c) of the shield frame can contact the second shield case (laminated shield case 21) (outer contact portion 43d). ). However, the inner contact portion may be located closer to the base than the outer contact portion. For example, the second conductive portion may be formed by being sheared leaving one short side of the rectangle and bent so that the tip side protrudes toward the second shield case in the middle from the root side to the tip side. . In this case, the tip of the second conductive portion is pressed against the second shield case, and the middle bent portion comes into contact with the first conductive portion due to elastic deformation on the base side due to the pressing.

  The bending process for forming the second conductive part (finger part) is not limited to the bending process. For example, the bending process may be performed so that a predetermined part or the whole of the second conductive part is gently curved.

  The opening formed by shearing the second conductive part (finger part) may be larger than the first conductive part (suction pad). Even in this case, there is no problem depending on the wavelength of the electromagnetic wave generated by the first electronic component group and the performance required for the first shield case (mounting type shield case 31).

  The engaged portion and the engaging portion are not limited to the protrusion and the hole. For example, the engaged portion and the engaging portion may be a protrusion and a recess, or a recess and a protrusion. The interval between the engaged portion and the engaging portion, and the first conductive portion and the second conductive portion may be equal in the circumferential direction of the side wall portion of the shield frame.

1 is an external perspective view showing a mobile phone according to an embodiment of the present invention in a closed state. The disassembled perspective view of the 1st housing | casing of the mobile telephone of FIG. The disassembled perspective view which shows the mounting type | mold shield case in the 1st housing | casing of FIG. Sectional drawing in the IV-IV line of FIG. Sectional drawing in the VV line | wire of FIG. Sectional drawing in the VI-VI line of FIG. The top view of the finger part and suction pad of the shield case of FIG. The top view explaining arrangement | positioning of the suction pad and protrusion of the shield case of FIG. The block diagram which shows the structure of the signal processing system of the mobile telephone of FIG. The disassembled perspective view which shows the shield case of the modification of this invention. Sectional drawing in the XI-XI line | wire of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mobile telephone (electronic device), 23 ... Main board (circuit board), 29 ... Electronic component, 30A ... 1st electronic component group, 31 ... Mounting type shield case, 41 ... Shield frame, 41a ... Side wall part, 41c ... Suction pad (first conductive part), 41h ... opening, 43 ... shield cover, 43a ... top plate part, 43c ... finger part (second conductive part).

Claims (5)

A circuit board;
A first electronic component group mounted on the circuit board;
A first shield case covering the first electronic component group;
Have
The first shield case is
A shield frame mounted on the circuit board and connected to the ground of the circuit board;
A shield cover attached to the shield frame;
Have
The shield frame is
A side wall portion standing on the circuit board and surrounding the first electronic component group;
A portion extending from the top of the side wall portion is formed by being bent toward the inner peripheral side of the side wall portion, and is adjacent to an electronic component that generates a relatively large amount of electromagnetic noise in the first electronic component group. A first conductive part;
Have
The shield cover has a top plate portion that closes the opening on the top surface side of the shield frame,
The top plate portion has a second conductive portion that is overlapped with the first conductive portion, is sheared leaving a part, and is bent toward the circuit board side to contact the first conductive portion. . The electronic device according to claim 1, wherein an opening formed by shearing the second conductive portion is accommodated in the first conductive portion in a plan view of the top plate portion. A second electronic component group mounted in an area outside the first shield case of the circuit board;
A second shield case covering the first shield case and the second electronic component group;
Have
The electronic device according to claim 1, wherein the second conductive part is in contact with the first conductive part in a state of being elastically deformed by being sandwiched between the second shield case and the first conductive part. The side wall portion has a plurality of engaged portions arranged along the circumferential direction,
The shield cover has a plurality of engaging portions that engage with the plurality of engaged portions,
The plurality of engaged portions, the plurality of engaging portions, and the first conductive portion and the second conductive portion are relatively relative to each other in an electronic component having relatively less electromagnetic noise in the first electronic component group. The electronic device according to any one of claims 1 to 3, wherein the electronic device is disposed so that a mutual interval is relatively narrow at a position close to an electronic component having a large amount of electromagnetic noise. The electronic device according to claim 1, wherein the first conductive portion is a suction pad.

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